JP2001151967A - Antistatic resin composition for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an antistatic resin composition which is excellent in antistatic properties, clarity, and water resistance, has good bleed resistance, and is suitable for a package material for electronic apparatus. SOLUTION: This composition is prepared by compounding 100 pts.wt. vinyl chloride resin with 3-10 pts.wt. ester having an aliphatic ether bond and 0.1-10 pts.wt. ammonium salt represented by formula 1 (one of R1, R2, and R3 is a 5-24C alkyl and the rest are a 1-5C alkyl; R4 is a 2-4C alkylene; n is an integer of 1-15; and X is the anion of hydrochloric, chloric, or perchloric acid).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an antistatic resin composition suitable as a package material for electronic equipment.

[0002]

2. Description of the Related Art Along with the high performance of electronic equipment, its components have been highly integrated and miniaturized. As a result, damage such as destruction of parts due to static electricity, contamination by particles, ionic impurities, etc. is great. Since the problem has become apparent, the required quality required for the packaging of precision parts has become stricter. Conventionally, as an antistatic treatment method for a resin used in a package, application or kneading of a surfactant, kneading of carbon (powder or fiber) or surface printing have been widely performed. The method according to the above includes problems such as off-gas, carbon dropout, and deterioration of antistatic performance after molding, and is a suitable material for precision parts that require cleanness and stable antistatic performance. I can't say it. Further, in recent years, it has been found that a phthalic acid-based plasticizer, particularly dibutyl phthalate (DBP), is decomposed on the surface of an IC chip and contaminates the chip, which has become a problem.

[0003]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a package for electronic equipment having excellent antistatic performance, good bleed resistance, excellent transparency, and excellent water resistance. It is an object to provide an antistatic resin composition suitable as a material.

[0004]

The antistatic resin composition for electronic equipment according to the invention of claim 1 (hereinafter referred to as invention 1) comprises 100 parts by weight of a vinyl chloride resin and an aliphatic ether bond in the molecule. 3 to 10 parts by weight of an ester, and an ammonium salt 0.1 represented by the following general formula (1)
-10 parts by weight.

Embedded image (In the formula, _one of R ₁ , R ₂ and R ₃ has 5 to 5 carbon atoms.
24 alkyl groups, the other two are alkyl groups having 1 to 5 carbon atoms, R ₄ is an alkylene group having 2 to 4 carbon atoms, and n is 1 to
An integer of 15 and X represents an anion of hydrochloric acid, chloric acid or perchloric acid)

The antistatic resin composition for electronic equipment according to the invention of claim 2 (hereinafter referred to as invention 2) comprises 100 parts by weight of a polypropylene resin, a polyethylene resin or a polyester resin, and an aliphatic ether bond in the molecule. 3 to 10 parts by weight of an ester having the formula (1), 0.1 to 10 parts by weight of an ammonium salt represented by the general formula (1), and 1 to 10 parts by weight of a polyester plasticizer. Hereinafter, the present invention will be described in detail.

[0006] The vinyl chloride resin in the invention 1 is not particularly limited, and polyvinyl chloride or other monomers copolymerizable with vinyl chloride, for example, ethylene, vinyl acetate, (meth) acrylic acid, (meth) acrylic acid. Copolymers with acid esters and the like can be mentioned.

In the invention 1, the ester having an aliphatic ether bond in the molecule is not particularly limited, and examples thereof include an ester of a polyvalent carboxylic acid and a monoalkyl ether of a glycol.

[0008] Examples of the polycarboxylic acid include aliphatic polycarboxylic acids such as adipic acid.

The monoalkyl ethers of the above glycols include, for example, propylene glycol monobutyl ether, ethylene glycol mono-2-ethylhexyl ether, ethylene glycol n-hexyl ether, diethylene glycol mono-2-ethylhexyl ether,
Examples include ethylene glycol such as diethylene glycol n-hexyl ether and triethylene glycol monomethyl ether, and monoalkyl ethers such as propylene glycol.

[0010] These esters can be easily synthesized under known esterification reaction conditions. The reaction temperature of the esterification reaction is preferably 80 to 250 ° C. to minimize the thermal decomposition of the reactants,
0 ° C. is more preferred.

In the invention 1, the content of the ester having an aliphatic ether bond in the molecule needs to be 3 to 10 parts by weight. When the content is less than 3 parts by weight, the antistatic effect is reduced. Conversely, when the content is more than 10 parts by weight, the compatibility with the vinyl chloride resin is deteriorated, causing a bleeding phenomenon. I will.

In the first aspect of the invention, the ammo represented by the formula (1)
In the formula (1), the sodium salt is represented by R₁, R _TwoAnd R_ThreeOne of
Is an alkyl group having 5 to 24 carbon atoms, and the other two are carbon groups.
Is an alkyl group of 1 to 5, R_FourIs an alk having 2 to 4 carbon atoms
A ren group, n is an integer of 1 to 15, X is hydrochloric acid, chloric acid or
It must be an anion of chloric acid. R above₁,
R_TwoAnd R_ThreeOne of the alkyl groups has 24 carbon atoms
The number of carbon atoms of the other two alkyl groups exceeds 5,
An integer in which the number of carbon atoms of the kylene group exceeds 4 or the number n is 15.
If the ratio exceeds the above, the compatibility with the vinyl chloride resin is deteriorated.
You. Further, the anion represented by X has an antistatic effect and a thermal effect.
From the standpoint of stability performance, perchloric acid is preferably used.

The content of the ammonium salt is 0.1 to
It is necessary to be 10 parts by weight, preferably 1 to 5 parts by weight. When the content is less than 0.1 part by weight, the antistatic effect cannot be exhibited. Conversely, when the content exceeds 10 parts by weight, the antistatic property is good, but at the time of molding. Coloring occurs, transparency, water resistance,
The bleeding resistance is reduced, and the appearance quality of the obtained molded product is reduced.

The antistatic resin composition for electronic equipment of the invention 1 may contain, if necessary, a filler such as calcium carbonate, magnesium carbonate, talc, clay, etc., and barium (B).
a) stabilizers such as -zinc (Zn) -based liquid stabilizers, coloring agents,
Various additives such as an ultraviolet absorber may be blended.

The method for producing the antistatic resin composition for electronic equipment of the invention 1 includes, for example, mixing uniformly with a mixing roll, a Henschel mixer, a kneader, an extruder, or the like.
The method of kneading is mentioned.

The antistatic resin composition for electronic equipment according to Invention 2 comprises 100 parts by weight of a polypropylene resin, polyethylene resin or polyester resin, 3 to 10 parts by weight of an ester having an aliphatic ether bond in the molecule, 0.1 to 10 parts by weight of an ammonium salt represented by (1),
And 1 to 10 parts by weight of a polyester plasticizer.

The polypropylene resin in Invention 2 is not particularly limited, and may be any other monomer copolymerizable with polypropylene or propylene, for example, ethylene, vinyl acetate, (meth) acrylic acid, (meth) acrylic acid ester and the like. And the like.

The polyethylene resin in Invention 2 is not particularly limited, and may be polyethylene or another monomer copolymerizable with ethylene, for example, propylene, vinyl acetate, (meth) acrylic acid, (meth) acrylate, and the like. And the like.

The polyester resin in Invention 2 is not particularly limited, and polyethylene terephthalate (P
ET), polybutylene terephthalate (PBT) and the like.

The polyester-based plasticizer in Invention 2 is not particularly limited, and includes polyester-based plasticizers such as adipic acid-based and phthalic acid-based, and having a molecular weight of 1,000.
The above-mentioned adipic acid-based polyester plasticizer is preferable.

The content of the polyester plasticizer is 1
-10 parts by weight are required. If the content is less than 1 part by weight, the antistatic effect is reduced. Conversely, if the content is more than 10 parts by weight, the compatibility with the above polypropylene-based resin, polyethylene-based resin or polyester-based resin is deteriorated. The bleed phenomenon occurs.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

(Examples 1 to 3 and Comparative Examples 1 to 3) (1) Preparation of antistatic resin composition film for electronic equipment A molecule represented by the following general formula (2) per 100 parts by weight of polyvinyl chloride An ester having an aliphatic ether bond therein and an ammonium salt represented by the following general formula (3) are added in the composition shown in Table 1, and 2 parts by weight of a Ba-Zn liquid stabilizer is further mixed as a stabilizer. After that, 180
The mixture was kneaded with a roll (6 inch diameter) heated to 6 ° C. for 6 minutes, and then pressed at 185 ° C. and a pressure of 15 MPa for 6 minutes using a tabletop press to obtain a film having a thickness of 1.0 mm.

Embedded image

[0024]

Embedded image

(2) Performance Evaluation The performance (surface resistivity, volume resistivity, bleed resistance and water resistance) of the antistatic resin composition film for electronic equipment thus obtained was evaluated by the following methods. The results were as shown in Table 1.

Surface resistivity: The surface resistivity (Ω / □) of the obtained film was measured according to JIS K6911. Volume resistivity: Volume resistivity of the obtained film (Ω · c
m) was measured according to JIS K 6911.

Bleed resistance: The obtained film was
After heating at 7 ° C. for 7 days, the film surface was visually observed. The case where no bleeding phenomenon occurred was evaluated as ○, and the case where bleeding occurred occurred was evaluated as x.

Water resistance (surface resistivity): The resulting film is rubbed once with a cloth (about 10 seconds) in running water. After removing the water droplets, the film is heated at 23 ° C x 50% R
After being left in an atmosphere of H for 6 hours, the surface resistivity was measured in the same manner as above, and the water resistance was evaluated.

[0029]

[Table 1]

(Examples 4 to 6 and Comparative Examples 4 to 6) (1) Preparation of antistatic resin composition film for electronic equipment With respect to 100 parts by weight of polypropylene, fat was contained in the molecule represented by the above formula (2). Ester having an aromatic ether bond, ammonium salt represented by the above formula (3), and PN-150 as a polyester plasticizer manufactured by Asahi Denka Kogyo KK
Was added in the composition shown in Table 2 and kneaded using a plastograph (heating temperature: 180 to 200 ° C., heating rate 5 ° C./min), and then 200 ° C. and 15 MPa pressure using a tabletop press. Press for 6 minutes under the conditions described above.
A 0 mm film was obtained.

(2) Performance Evaluation The performance (surface resistivity, volume resistivity, bleed resistance and water resistance) of the antistatic resin composition film for electronic equipment thus obtained was evaluated in the same manner as in Example 1. Was evaluated. The results were as shown in Table 2.

[0032]

[Table 2]

As is clear from Tables 1 and 2, the antistatic resin compositions for electronic devices of Examples 1 to 6 according to the present invention are:
Excellent antistatic performance, good bleed resistance, excellent transparency, and excellent water resistance.

On the other hand, the electronic device of Comparative Example 1 containing no ester represented by the formula (2) and the ammonium salt represented by the formula (3) and Comparative Example 2 not containing the ester represented by the formula (2) The antistatic resin composition is inferior in antistatic performance, and the antistatic resin composition for electronic equipment of Comparative Example 3 in which the content of the ammonium salt represented by the formula (3) is more than 10 parts by weight has a bleed resistance. And poor water resistance.

Further, Comparative Example 4 not containing the ester represented by the formula (2) and the ammonium salt represented by the formula (3)
And the antistatic resin composition for electronic devices of Comparative Example 5 which does not contain a polyester plasticizer has poor antistatic performance, does not contain the ammonium salt represented by the formula (3), and is represented by the formula (2). The antistatic resin composition for electronic devices of Comparative Example 6 in which the content of the ester exceeds 10 parts by weight is inferior in bleed resistance.

[0036]

As described above, the antistatic resin composition for electronic equipment of the present invention has excellent antistatic performance, good bleeding resistance, excellent transparency, and excellent water resistance. It is suitably used as a material for electronic equipment packages and the like.

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Claims (2)

[Claims] 1. 100 parts by weight of a vinyl chloride resin, 3 to 10 parts by weight of an ester having an aliphatic ether bond in a molecule, and 0.1 to 10 parts by weight of an ammonium salt represented by the following general formula (1): An antistatic resin composition for electronic equipment, comprising: Embedded image (In the formula, _one of R ₁ , R ₂ and R ₃ has 5 to 5 carbon atoms.
24 alkyl groups, the other two are alkyl groups having 1 to 5 carbon atoms, R ₄ is an alkylene group having 2 to 4 carbon atoms, and n is 1 to
An integer of 15 and X represents an anion of hydrochloric acid, chloric acid or perchloric acid) 2. 100 parts by weight of a polypropylene-based resin, polyethylene-based resin or polyester-based resin, 3 to 10 parts by weight of an ester having an aliphatic ether bond in a molecule, 0.1% by weight of an ammonium salt represented by the above general formula (1). 1 to 10
An antistatic resin composition for electronic equipment, comprising: 1 part by weight and 1 to 10 parts by weight of a polyester plasticizer.