JP2001147399A - Laser beam machining device and adjusting method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device, where adjustment is simplified and precise machining is realized. SOLUTION: There are installed first means 21 adjusting first and second galvanometers 9 and 11 so that laser power becomes a maximum by scanning a laser beam on a detector 15 for adjusting the offsets and the gains of the first and second galvanometers 9 and 11, a second means 22 comparing rotation command data of the first and second galvanometers 9 and 11 when the laser beam is scanned on the detector 15 and laser power is maximum with position data with the detector 15, a third means 23 obtaining the offset values of the first and second galvanometers 9 and 11 based on the comparison result obtained by the second means 22 and a fourth means 24 obtaining the correction values of the gains of the first and second galvanometers 9 and 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus and a method of adjusting the same, and more particularly, to a laser processing apparatus and a method of adjusting the laser processing apparatus which can simplify the adjustment and perform the processing with high accuracy.

[0002]

2. Description of the Related Art Conventionally, a laser processing apparatus using a galvanometer has been used for marking processing, welding and cutting processing, but has not been used for laser processing requiring high positioning accuracy and processing quality. .

[0003] Galvanometers can be expected to have high positioning accuracy in the short term, but are vulnerable to environmental changes, and require frequent adjustment of gain and offset to maintain high positioning accuracy. The output and beam waist diameter of the laser light also change due to a change in the environment. In laser processing using a galvanometer, it is difficult to stabilize positioning and laser light for a long period of time, so that there has been a problem that processing position accuracy and processing state become unstable.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to improve the above-mentioned drawbacks of the prior art, and in particular to a novel laser which simplifies the adjustment by automating the adjustment and enables high-precision machining. A processing device and an adjustment method thereof are provided.

[0005]

SUMMARY OF THE INVENTION The present invention basically employs the following technical configuration to achieve the above object.

That is, a first embodiment of the laser processing apparatus and the adjusting method according to the present invention comprises a first galvanometer that scans a laser beam in an X direction and a second galvanometer that scans a laser beam in a Y direction. In a laser processing apparatus that scans a laser beam to a predetermined position using a laser beam, a detector for adjusting the offset and gain of the first and second galvanometers is placed around a processing area where a workpiece is mounted and processed. And wherein the four detectors are provided at an equal distance from the center of the processing area, and the four detectors are provided at equal intervals, respectively. A second aspect is to adjust the offset and gain of the first and second galvanometers by scanning a laser beam on the detector so that the laser power is maximized. First means for adjusting the first and second galvanometers, and rotation command data for the first and second galvanometers when the laser power is maximized by scanning a laser beam on the detector and the detection. Second means for comparing position data with a vessel, third means for obtaining offset values of the first and second galvanometers based on the comparison result obtained by the second means, and And a fourth means for obtaining a correction value of the gain of the second galvanometer.

The laser processing apparatus and the adjusting method according to the present invention use a first galvanometer that scans a laser beam in an X direction and a second galvanometer that scans a laser beam in a Y direction. A method for adjusting a laser processing apparatus that scans a laser beam at a predetermined position, wherein the laser power is scanned by scanning the laser beam on the detector to adjust offset and gain of the first and second galvanometers. A first step of adjusting the first and second galvanometers to be maximized, and scanning the laser beam on the detector to obtain the first and second galvanometers when the laser power is at a maximum. A second step of comparing the rotation command data of the detector with the position data of the detector, and the first and second steps are performed based on the comparison result obtained in the second step. A third step of obtaining an offset value of the galvanometer and calculating a correction value thereof; a fourth step of outputting the correction value obtained in the third step to the first and second galvanometers; 1st and 2nd
A fifth step of adjusting the gains of the first and second galvanometers after correcting the galvanometer offset of
A sixth step of setting the correction values of the gains of the first and second galvanometers obtained in the fifth step to the first and second galvanometers, respectively. It is.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a laser processing apparatus according to the present invention, a laser beam 100 scanned by a galvanometer 9 and a galvanometer 11 is detected by a detector 15, and an actual position of the detector 15 and a rotation command of the galvanometer 9 and the galvanometer 11 are issued. By comparing the data with the data, the offset of the galvanometer 9 and the galvanometer 11 is adjusted, and thereafter, the galvanometer 9 and the galvanometer 11 are adjusted.
Adjust the gain of.

An image of the processing at the focal position is measured using the CCD camera 17. From this measurement result, a beam waist is calculated, and the beam diameter 102 is adjusted by the expander 4 in comparison with a preset beam size. Focusing is performed by adjusting the spread angle 104 with the expander 6 so that the image is minimized.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of a laser processing apparatus according to the present invention and an adjusting method thereof will be described in detail with reference to the drawings.

FIGS. 1 to 4 show specific examples of a laser processing apparatus according to the present invention and a method of adjusting the laser processing apparatus. FIG. 1 to FIG. 4 show a first example in which a laser beam LB is scanned in an X direction.
A laser processing apparatus that scans a laser beam at a predetermined position using a galvanometer 9 and a second galvanometer 11 that scans a laser beam LB in the Y direction.
Four detectors 15 for offset and gain adjustment of the first and second galvanometers 9 and 11 are provided around a processing area WE where a workpiece is placed and processed, and the four detectors 15a to 15d are provided. , Each of which is provided at an equal distance from the center of the processing area WO, and the four detectors 15a to 15a
Reference numeral 5d denotes a laser processing apparatus characterized in that the laser processing apparatuses are provided at equal intervals. In addition, the laser processing apparatus is provided on the detector to adjust the offset and gain of the first and second galvanometers 9 and 11. The first and second laser beams are scanned at 15 so that the laser power is maximized.
First means 21 for adjusting the galvanometers 9 and 11
And a second step of scanning a laser beam on the detector and comparing rotation command data of the first and second galvanometers 9 and 11 when the laser power is at a maximum with position data of the detector. Means 22 and the second means 2
A third means for obtaining offset values of the first and second galvanometers 9 and 11 based on the comparison result obtained in Step 2, and a correction value of a gain of the first and second galvanometers 9 and 11 The laser processing apparatus provided with the fourth means 24 is shown.

Hereinafter, this specific example will be described in more detail.

The laser processing apparatus 1 of the present invention changes the laser oscillator 2, the attenuator 3 for controlling the laser power of the laser light 100 emitted from the laser oscillator 2, and the beam diameter 102 of the laser light 100 emitted from the attenuator 3. An expander 4 that changes the spread angle 103 of the laser beam 100 emitted from the expander 4,
A total reflection mirror 8 for receiving the laser light 100 from the expander 6, a galvanometer 9 for rotating the total reflection mirror 8, and a laser light 100 reflected by the total reflection mirror 8
, A galvanometer 11 for rotating the total reflection mirror 10, and a total reflection mirror 1
Fθ lens 12 for condensing laser light 100 reflected to 0
A stage 14 for fixing the work 13 at the focal position 105 of the fθ lens 12, and a stage 4 mounted on the stage 14
And a CCD camera 17 provided on an optical axis 107 including the fθ lens 12, the total reflection mirror 10, the total reflection mirror 8, and the reflection mirror 16.

The expander 4 includes a driving unit 5
The beam diameter 102 is changed by the
Changes the spread angle 103 by the drive unit 7.

The laser oscillator 2, the attenuator 3,
The drive unit 5, the drive unit 7, the galvanometer 9, the galvanometer 11, and the CCD camera 17 are controlled by the control unit 18.

The galvanometer 9 and the galvanometer 1
1 indicates that scanning is performed by the galvanometer 11 when the rotation command to each reflection mirror is “0”, the laser beam 100 passes through the center of the fθ lens 12, and when the rotation command to the galvanometer 9 is “0”. The line is 108, and the rotation command “0” to the galvanometer 11
, The scanning line scanned by the galvanometer 9 is 109, and the scanning line is 1
08 and the scanning line 109 are perpendicular to the point WO
Is controlled to intersect.

The detectors 15 are provided at four places on the stage, and are arranged at equal distances in four directions from the scanning line 108 and the point WO on the scanning line 109. The detector 15 detects the laser power. The attenuator 3 is controlled by the detected laser power to correct the laser power to an appropriate value.

Next, the offset and gain of the galvanometer will be described with reference to FIG.

When the offset and gain between the galvanometer 9 and the galvanometer 11 are completely adjusted, the scanning of the galvanometer 9 requires the detectors 15a-15
The scanning between c and the galvanometer 11 scans between the detectors 15b and 15d, scans the area indicated by the dotted line in FIG. 4, and does not scan the area outside the dotted line.

The dotted line 110 shown in FIG. 4 is a scanning line in the case where the galvanometer 11 has an offset 、 SO. Eliminating the offset of each galvanometer and making the gains appropriate enables accurate machining. It is to be.

Next, a method of adjusting the laser processing apparatus of the present invention will be described.

The detection surface of the detector 15 is smaller than the beam waist. Therefore, the laser beam LB
Is two-dimensionally scanned on the detector 15 to detect the maximum state of the laser power, and stores the rotation command data of the galvanometers 9 and 11 in this state.

Then, this data is compared with the position of the detector currently used for detection, an offset value is calculated from the value, and each correction value obtained so as to eliminate this offset value is converted into the respective correction value. Output to the galvanometers 9 and 11.

In this state, the galvanometers 9 and 11
Scans on the solid line in FIG. 4, but because the gain is not yet appropriate, when scanning is performed at the maximum, the detector does not arrive or passes through the detector. For this reason, the gains of the galvanometers 9 and 11 are adjusted so that they are accurately positioned on the detector when scanning is performed at the maximum.

Next, the divergence angle 104 is adjusted by the expander 6 using the CCD camera 17 so that the image at the focal point is minimized, and the beam diameter is set to a predetermined size by the expander 4. To adjust and end the adjustment.

The laser oscillator 2 is applicable irrespective of the oscillation method (pulse, continuous, Q-switch), laser power, and wavelength.

If the beam waist is measured by the detector 15, the CCD camera 17 and the reflection mirror 16 can be omitted.

Further, by scanning the detector 15 with the laser power kept constant, the laser power distribution can be measured, and the beam waist may be calculated from this distribution.

Further, the beam position is fixed at the maximum laser power position when scanning on the detector 15, and the expansion angle 104 is changed by the expander 6 by the drive unit 7. When the divergence angle 104 is changed, when the laser power is the maximum, it means that the focus is on the detector 15. By correcting the spread angle 104 in this manner, the work 1
3 can be configured to perform focusing.

[0030]

The laser processing apparatus and the method of adjusting the laser processing apparatus according to the present invention are constructed as described above, so that the adjustment is simplified and the processing can be performed with high accuracy.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a laser processing apparatus according to the present invention.

FIG. 2 is a diagram showing an output of an expander 4 and an output of an expander 6;

FIG. 3 is a block diagram illustrating a configuration of a laser processing apparatus according to the present invention.

FIG. 4 is a diagram for explaining an arrangement and an adjustment state of a detector.

[Explanation of symbols]

 Reference Signs List 2 laser oscillator 3 attenuator 4, 6 expander 5, 7 drive unit 8, 10 total reflection mirror 9, 11 galvanometer 12 fθ lens 13 work 14 mounting table 15, 15a to 15d detector 16 reflection mirror 17 CCD camera 18 control unit 21 First means 22 Second means 23 Third means 24 Fourth means 100 Laser beam 105 Focus 106 Optical axis 108 Scanning line of galvanometer 11 109 Scanning line of galvanometer 9 LB Laser beam △ SO offset

Claims (3)

[Claims] 1. A laser processing apparatus that scans a laser beam at a predetermined position using a first galvanometer that scans a laser beam in an X direction and a second galvanometer that scans a laser beam in a Y direction. Four detectors for offset and gain adjustment of the first and second galvanometers are provided on the periphery of a processing area where a workpiece is placed and processed, and the four detectors are respectively located from the center of the processing area. A laser processing apparatus provided at equal distances, and wherein the four detectors are provided at equal intervals. 2. The first and second galvanometers for adjusting the offset and gain of the first and second galvanometers so that a laser beam is scanned on the detector so that laser power is maximized. Adjust the first
Means for scanning a laser beam on the detector and comparing rotation command data of the first and second galvanometers when the laser power is at a maximum with position data of the detector. Means, third means for obtaining offset values of the first and second galvanometers based on a comparison result obtained by the second means, and correction values for gains of the first and second galvanometers are obtained. The laser processing apparatus according to claim 1, further comprising a fourth means. 3. Adjustment of a laser processing apparatus that scans a laser beam at a predetermined position using a first galvanometer that scans a laser beam in an X direction and a second galvanometer that scans a laser beam in a Y direction. A method for adjusting the offset and gain of the first and second galvanometers by scanning a laser beam over the detector to maximize laser power. A first step of adjusting the rotation of the first and second galvanometers when the laser power is maximum by scanning a laser beam on the detector and the position data of the detector. A second step of comparing, and calculating an offset value of the first and second galvanometers based on the comparison result obtained in the second step, and A third step of obtaining a correction value; and correcting the correction value obtained in the third step by the first and second
A fourth step of outputting to the galvanometer, a fifth step of adjusting the gains of the first and second galvanometers after correcting the offsets of the first and second galvanometers, and the fifth step. And a sixth step of setting the obtained correction values of the gains of the first and second galvanometers in the first and second galvanometers, respectively.