JP2001135672A - Anisotropic conducting connection body, manufacturing method therefor and paste connection material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conducting connection body wherein paste connection material does not remain in the uncured state, in connection using the material, and excellent electric connection and mechanical fixing can be obtained over the whole connection region of a member to be connected. SOLUTION: When a substrate 1 having facing electrodes 2, 5 and a semiconductor element 4 are connected by using paste connection material 6, the material whose amount is 1.1-1.5 times Y shown by a formula (I) is spread on a region where the material is distributed in only the whole connection region (v) and a curable region (w) when the material is fluidized by thermo- compression bonding. As a result, an uncured part is not formed in the case of thermo-compression bonding. formula (I): Y = (height of electrode of one member to be connected + height of electrode of the other member to be connected) × (area of connection region).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive connector in which members to be connected having opposing electrodes are connected via a paste-like connecting material containing a thermosetting resin, a method of manufacturing the same, and a paste. It relates to a connection material in a shape.

[0002]

2. Description of the Related Art As a technique for mounting a semiconductor device on a circuit board, there is a method of directly connecting a semiconductor element such as a bare chip of an IC or an LSI to the board by using an anisotropic conductive connection material.
In this method, a semiconductor element and an electrode of a substrate are opposed to each other, and an anisotropic conductive connection material is interposed in a gap between the semiconductor element and the semiconductor element to be cured by thermocompression to perform connection. In LCD (Liquid Crystal Display), an ITO (Indium Tin Oxide) film on a glass substrate and an IC chip of driver IC or TCP (Tape Carrier P)
ackage) and so on. The connection between a general printed circuit board and an FPC (flexible printed circuit board) is also made in the same manner.

[0003] As a connection material for such a connected member,
Anisotropic conductive paste (hereinafter sometimes referred to as ACP), insulating paste (hereinafter sometimes referred to as NCP), anisotropic conductive film (hereinafter sometimes referred to as ACF)
and so on. NCP is a paste containing an adhesive component containing a thermosetting resin, and ACP is a paste containing an adhesive component containing a thermosetting resin and conductive particles, both of which are discharged by a dispenser or the like. Used as ACF is a system containing an adhesive component containing a thermosetting resin and conductive particles, similar to ACP, and is coated on a release film and dried to form a film. Cut out and used.

[0004] Paste-like connecting materials such as ACP and NCP and ACF are used in accordance with their respective characteristics. Generally, ACF can be cut out to a predetermined size and used, so that a necessary amount is relatively accurately distributed to a necessary place. You can connect. On the other hand, since the paste-like connection material is in a fluid state even when the required amount is discharged, it is difficult to accurately distribute the paste-like connection material to a required portion.

[0005] Generally, the connection using the paste-like connection material is performed by discharging the paste-like connection material to the central portion of the connection region of the substrate by a dispenser, stacking the members to be connected, and thermocompression bonding. In this case, since the paste-like connection material is in a fluid state, the paste-like connection material spreads in a circular shape. Since the substrate or the semiconductor element as the member to be connected is usually formed in a quadrilateral, the connection region connecting the two usually has a quadrilateral. Therefore, a part of the paste-like connection material protrudes from the side of the connection region by thermocompression bonding.

When the paste-like connection material is cured by continuing thermocompression bonding in this state, the heat is transmitted to a narrow area around the connection area, so that the paste is hardened. The material remains uncured. However, since the uncured paste-like connection material contains impurities such as chlorine ions, electric corrosion occurs, and electric corrosion of the connected member occurs. If an amount of the paste-like connecting material that does not protrude from the side is used to avoid this, there is a problem that the paste-like connecting material at the corner is insufficient and the connection at the corner is insufficient.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connection using a paste-like connecting material, in which the paste-like connecting material does not remain uncured and remains excellent in the entire connection region of the member to be connected. An object of the present invention is to provide an anisotropic conductive connection body which can provide connection and mechanical fixation. Another object of the present invention is to provide a production method capable of efficiently producing the above-described anisotropic conductive connection body and a paste-like connection material therefor.

[0008]

SUMMARY OF THE INVENTION The present invention relates to the following anisotropic conductive connector, a method for producing the same, and a paste-like connecting material. (1) In an anisotropic conductive connector in which connected members having opposing electrodes are connected by a cured product of a paste-like connecting material interposed therebetween, the paste-like connecting material is represented by the following formula (I). 1.1 to 1.5 times the amount of Y which is filled in the gaps of the connection region, and is substantially uniformly distributed and cured in the curable region around the connection region. Anisotropic conductive connectors.

Y = (height of electrode of one connected member + height of electrode of other connected member) × area of connection region (I) (2) The connected member is a circuit board and / or The anisotropic conductive connector according to the above (1), which is a semiconductor element. (3) In a method for manufacturing an anisotropic conductive connector in which connected members having opposing electrodes are connected by curing a paste-like connecting material interposed therebetween, the Y of 1 represented by the formula (I) may be used. .1 to 1.5 times the amount of paste-like connection material applied to an application area that is distributed to the entire connection area and the curable area when flowing by thermocompression, and thermocompression-bonds the connected member. A method for producing an anisotropic conductive connector, characterized in that: (4) The method according to the above (3), wherein a part of the paste-like connection material is applied to an application area in the connection area, and another part is discharged diagonally in the connection area to perform thermocompression bonding. (5) The method according to the above (4), wherein the application area for applying the paste-like connection material is an area of 70 to 95% of the connection area. (6) The method according to the above (4) or (5), wherein the discharge length for discharging the paste-like connecting material diagonally is 80 to 100% of the diagonal. (7) The method according to any one of (4) to (6) above, wherein the volume ratio of the uniform application of the paste-like connection material to the diagonal discharge is from 1: 0.4 to 1: 1.7. (8) A paste-like connecting material for producing an anisotropic conductive connection body by being interposed between connected members having opposing electrodes and cured to include an adhesive component containing a thermosetting resin. And a paste-like connecting material having an intrinsic viscosity of 1 to 1000 Pa · s. (9) The paste-like connection material according to the above (8), which contains conductive particles together with the adhesive component.

In the present invention, the connected members to be connected include all electrodes having opposing electrodes, in particular, members having many electrodes. Among them, it is suitable for connecting a semiconductor element to a circuit board such as a driver IC or TCP mounted on a glass substrate of an LCD or a semiconductor chip such as a bare chip mounted on a general substrate. As in the above connection, the present invention can be applied to the connection between substrates or between semiconductor elements. Also, the connected member has a different outer shape like a semiconductor element and a circuit board, and is suitable when one is larger than the connection region. However, as long as the connection region is formed between the two, the connected member may have the same outer shape. Good.

The paste-like connection material contains an adhesive component containing a thermosetting resin. The paste-like connection material is interposed between the connected members in the connection area, and is pressed from both sides to press the opposing electrodes to make contact. Then, the adhesive component is cured and adhered in a state where the adhesive component is gathered in a portion where no electrode is present, so that electrical connection and mechanical fixation are performed. Paste-like connection material is NCP without conductive particles
Or an ACP containing conductive particles. Therefore, the electrodes may be brought into direct contact with each other by NCP, or may be brought into contact with conductive particles by ACP. When the area of the protruding portion of the electrode is small like a stud bump (for example, when it is 1000 μm ² or less)
Can be directly contacted, but it is preferable that conductive particles be present when the electrode area is large. In order to make the conductive particles exist, the conductive particles are blended in the adhesive component.

The main resin of the thermosetting resin used for the paste-like connection material is an epoxy resin, a urethane resin, a phenol resin, a hydroxyl group-containing polyester resin, a hydroxyl group-containing acrylic resin, etc. Although a resin that cures under light irradiation can be used without limitation, an epoxy resin is particularly preferred in view of the balance among the curing temperature, time, storage stability and the like. As epoxy resin,
A bisphenol type epoxy resin, an epoxy novolak resin or an epoxy compound having two or more oxirane groups in a molecule can be used. In addition, a radical polymerization type resin may be used. Commercially available products can be used as such resins.

The main resin of the above-mentioned thermosetting resin can generally perform a curing reaction by being used in combination with a curing agent. However, when a functional group contributing to the curing reaction is bonded to the main resin, the curing agent is used. Can be omitted. As the curing agent, imidazole, amine, acid anhydride, hydrazide, dicyandiamide, isocyanate, modified products thereof, and the like which react with the base resin by heating, light irradiation, or the like to perform a curing reaction can be used, and commercially available products may be used. As such a curing agent, a latent curing agent is preferable.

The latent curing agent does not undergo a curing reaction during production and storage at room temperature and drying at a relatively low temperature (40 to 100 ° C.), and is cured by heating and pressurization (thermocompression bonding) at the curing temperature or light irradiation such as UV. It is a curing agent that performs a reaction. As such a latent curing agent, those obtained by microencapsulating the above curing agent components such as imidazole and amine are particularly preferable, and commercially available products can be used as they are. In the case of thermal activation, the curing start temperature is preferably from 80 to 150C.

[0014] The paste-like connecting material may contain a thermoplastic polymer material for imparting applicability. As such a thermoplastic polymer material, phenoxy resin, polyester resin, acrylic resin, polyurethane resin, butyral resin, NBR, SBR and the like can be used. Further, an inorganic filler can be included to adjust the viscosity of the paste-like connecting material. Silica, alumina, talc and the like can be used as the inorganic filler. In addition, the connection material of the present invention may contain additives such as a coupling agent and an antioxidant.

When the paste-like connecting material is ACP, AC
As the conductive particles used for P, metal particles such as solder and nickel, conductive coated particles obtained by coating polymer core material particles with a conductive material by plating or the like, or insulating materials obtained by coating these conductive particles with an insulating resin. It may include coated conductive particles and the like. The particle size of these conductive particles can be 1 to 10 μm, preferably 2 to 8 μm.

The mixing ratio of the above components can be as follows. The thermoplastic polymer material in the adhesive component is 0 to 40% by weight, preferably 1 to 30% by weight based on the thermosetting resin.
% By weight, and 0 to 70% by weight, preferably 0
The other additives may be 0 to 10% by weight, preferably 1 to 5% by weight, based on the total amount of the resin components. The mixing ratio of the conductive particles is 0 to 40% by volume, preferably 1 to 30% by volume based on the total of these adhesive components.
It is.

The paste-like connecting material used in the present invention has the above-mentioned components, and has an intrinsic viscosity at 25 ° C. of 1 to 1000 Pa · s, preferably 1 to 200 Pa · s.
It is said. The paste having such a viscosity preferably does not contain a solvent in order to prevent generation of bubbles. The above viscosity can be adjusted by selecting the type and blending ratio of each component, particularly by changing the blending ratio of the inorganic filler.

When the paste-like connecting material is applied to the connection region of the member to be connected and the member to be connected is thermocompression-bonded, the paste-like connecting material spreads in the peripheral direction. In this case, the paste-like connection material flows in a direction with low resistance, generally spreads in a circular shape, and when the connection region is a quadrilateral, a difference occurs between the side and the corner. In order to completely fill the gap between the connected members with the paste-like connecting material, an excessive amount of the paste-like connecting material is necessary. In the present invention, 1.1 to 1..
Use 5 volumes.

When an excessive amount of the paste-like connection material is applied to the center of the connection region and thermocompression-bonded, the paste-like connection material spreads in a substantially circular shape. When the department gets bigger,
During thermocompression bonding, heat is not transmitted, and there is a portion that remains uncured. In order to avoid this, in the present invention, when the paste-like connection material flows by thermocompression bonding, the paste-like connection material is distributed only to the entire connection region and the surrounding curable region, and does not flow out of the curable region. And the member to be connected is thermocompression-bonded.

The connection region is a region where the members to be connected are opposed to each other and a connection is made with a paste-like connection material. When a semiconductor element is connected to a substrate, the two are overlapped with each other, that is, defined by the outer shape of the semiconductor element. Area. The curable region is a region where when the thermocompression bonding head is applied to such a connection region and thermocompression bonding is performed, heat is conducted to the peripheral portion to cure the paste-like connection material. It is an area within 2 mm, preferably within 1 mm from the boundary of the connection area. If excess paste-like connection material flows into such a curable region, the curing forms a fillet around the connection region to protect the connection region. Since the paste-like connecting material does not flow out of the curable region, the uncured portion does not remain, thereby preventing a short circuit due to migration.

In the application area, when the paste-like connection material is applied in the connection area and thermocompression-bonded, the paste-like connection material flows and fills the gap between the connection areas, and when the excess flows out, the curable area is formed. The area is such that a uniform fillet can be formed outside the connection area. Such a region varies depending on the viscosity of the paste-like connection material, the fluidity, the structure of the connected member, and the like, but is generally a region receding inward from the connection region, and the receding width is larger at the side than at the corner. Shape.

As a preferred method of applying the paste-like connection material to such an application area, a part of the paste-like connection material is uniformly applied to the application area in the connection area by printing or the like, and the other part is applied to the connection area. To perform thermocompression bonding. The application region is an arbitrary region in which the connection region is reduced, and a region having a similar shape is generally preferable. The paste-like connecting material discharged in a diagonal shape is discharged in such a manner as to overlap the paste-like connecting material uniformly applied by printing or the like, and is preferably discharged further outside beyond the application region.

The application region where the paste-like connection material is uniformly applied by printing or the like is preferably a reduced region having an area of 70 to 95% of the connection region. It is preferable that the discharge length for discharging diagonally is 80 to 100% of the diagonal. Further, it is preferable that the volume ratio of the application amount of the paste-like connection material by printing and the diagonal ejection amount is 1: 0.4 to 1.7.

When the paste-like connection material is applied to the application region as described above and the member to be connected is thermocompression-bonded, the paste-like connection material flows and fills the connection region, and the excess portion is applied to the peripheral curable region. It flows out and hardens uniformly to form a fillet, and an anisotropic conductive connection is obtained. Since the excess spill is limited to the curable area, the uncured part does not remain,
No insulation failure due to electrolytic corrosion occurs. Also, the fillet is formed uniformly around the connection area to protect the connection.

In the thus obtained anisotropic conductive connector, the members to be connected are connected by the paste-like connecting material, so that the members are mechanically fixed, and electrical connection is obtained between the opposing electrodes, and insulating property is provided between the adjacent electrodes. And anisotropic conductivity is obtained.

[0026]

According to the method of manufacturing an anisotropic conductive connector of the present invention, a specific excess amount of paste-like connecting material is applied to a specific application region and thermocompression-bonded. Filling the paste-like connection material and uniformly distributing the excess to the periphery of the connection area can form a fillet, which provides excellent mechanical fixation and electrical connectivity, and prevents corrosion due to uncured material. An anisotropic conductive connector that does not occur can be efficiently manufactured.

By printing a part of the paste-like connecting material and discharging the other part diagonally and thermally compressing the paste-like connecting material, the paste-like connecting material can be easily distributed.
By changing the application area and the application amount, it becomes possible to cope with the manufacture of different types of connectors.

Since the paste-like connecting material of the present invention has a specific component and an intrinsic viscosity, the above-mentioned production can be performed efficiently. Since the anisotropic conductive connector of the present invention is manufactured by the above-described method, the gap in the connection region is filled with the paste-like connection material, and the excess is uniformly distributed to the periphery of the connection region to form a fillet. As a result, an anisotropic conductive connector excellent in mechanical fixation and electrical connectivity and free from electric corrosion by an uncured material can be obtained.

[0029]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a cross-sectional view of the anisotropic conductive connector of the embodiment before connection, FIG. 1B is a cross-sectional view after connection, and is a cross-sectional view corresponding to AA in FIG. a), (b)
FIGS. 4C and 4D are explanatory views of a comparative example, which are plan perspective views before connection.

In FIG. 1 and FIG. 2A, reference numeral 1 denotes a circuit board serving as one connected member, and a circuit pattern 3 having an electrode 2 at the tip is formed on the surface of the circuit board. 4
Is an IC chip 4 as a semiconductor element serving as the other connected member, and has an electrode 5 such as a bump. Electrode 5
Is provided at a position facing the electrode 2 in the peripheral portion of the IC chip 4. The IC chip 4 as one of the connected members has an outer shape smaller than that of the substrate 1 as the other connected member, and a portion where both of them are overlapped, that is, a region corresponding to the outer shape of the IC chip 4 is defined as a connection region v as a paste-like connection. Connected by material 6. When the paste-like connecting material is ACP, the paste-like connecting material is composed of the adhesive component 11 and the conductive particles 12, and when the paste-like connecting material is NCP, the conductive particles are not included. The electrodes 2 and 5 are provided over the entire periphery of the connection region v, and the circuit pattern 3 extends from the electrode 2 in all directions, up and down, left and right, but only a part is shown in FIG. Has been omitted.

As shown in FIG. 1A, the paste-like connecting material 6 is applied to an application area u of a gap 7 between the substrate 1 and the IC chip 4, and the substrate 1 and the IC chip 4 are superimposed and x,
The gap 7 is filled by thermocompression bonding in the y-direction, and further flows in the peripheral direction, and the curable area w outside the connection area v
To form a uniform fillet 8 outside the connection region v.

As a result, the conductive particles 12 are placed between the electrodes 2 and 5.
The adhesive component 11 is cured in a state where the electrodes 2 and 5 are in direct contact with each other, so that the substrate 1 and the IC
Along with the mechanical fixation between the chips 4, an electrical connection in the direction of the opposing electrodes is obtained, and between the adjacent electrodes 2, 2 or 5.
5, the conductive particles 12 are dispersed or absent, so that insulation is maintained and the anisotropic conductive connector 10
Is manufactured. The paste-like connection material 6 flowing out of the connection region v hardens at the time of thermocompression to uniformly flow into the curable region w, forms a fillet 8 to protect the periphery of the connection region v, and peels off due to ingress of moisture. And so on.

In the conventional manufacturing method, the paste-like connecting material 6 is used.
Is discharged by a dispenser at the center of the connection region v and subjected to thermocompression bonding, so that it spreads in a circular shape and the corner 13 is not filled with the paste-like connection material 6 or the corner 13 is filled with the paste-like connection material 6 When the paste-like connection material 6 is discharged in such a manner, the protrusion of the side portion 14 increases, an uncured portion remains, and electrolytic corrosion of the pattern 3 occurs. So Figure 2
As shown in (c), the application region u of the paste-like connection material 6 is applied.
When the paste-like connection material 6 is uniformly applied by printing or the like and then thermocompression-bonded, the outer peripheral portion s from which the paste-like connection material 6 flows out is not filled in the corner portion 13 and the conduction is poor. Is generated. On the other hand, when the paste-like connection material 6 is applied diagonally as shown in FIG. 2D, the outer peripheral portion s of the paste-like connection material 6 does not fill the side portion 14.

In the present invention, the application region u of the paste-like connection material 6 is determined so that the outer peripheral portion s from which the paste-like connection material 6 has flowed out by thermocompression corresponds to the curable region w. Although the outflow direction of the paste-like connection material 6 is basically a radial direction, it flows in a direction in which the resistance is small. For this reason, in the case of uniform application by printing or the like, as shown in FIG. 2A, an area where the center side of the side portion 14 is recessed from the corner portion 13 as an intermediate area between FIGS. 2C and 2D. Is the application area u.

Since the outer peripheral portion s changes depending on the amount of the paste-like connection material 6 applied to the application region u, as shown in FIG. Coating material 6a is uniformly applied by printing or the like,
When another paste-like connection material 6b is discharged onto the diagonal direction discharge region z of the connection region v and thermocompression bonding is performed thereon,
As in the case of (a), the outer peripheral portion s of the paste-like connection material 6
Corresponds to the curable region w. In this case, by changing the length, width, thickness or shape of the discharge region z, the outer peripheral portion s
Can be adjusted according to the shape, structure, and other conditions of the substrate 1 and the IC chip 4.

2 (a) and 2 (b), the shapes of the application region u and the discharge region z differ depending on the thickness or amount of the applied or discharged paste connection material. The shapes, lengths, and the like of the application region u and the ejection region z in (b) also change according to the relationship between the two, and the application region u may not be similar, and the ejection region z may not be linear. , A dotted line or other shapes.

[0037]

Embodiments of the present invention will be described below. Examples 1 to 9, Comparative Examples 1 to 5 Epoxy resin (bisphenol A type, epoxy equivalent 13
As an inorganic filler, silica (average particle size: 1.65 g / eq), 60% by weight, and 40% by weight of a latent curing agent (imidazole-modified type) is used as an inorganic filler.
5 .mu.m) and an intrinsic viscosity of 0.9 to 50% by weight.
When the paste-like connection material was prepared by adjusting to 状 1500 Pa · s, the paste flowed at 0.9 Pa · s and did not fill the corners, and at 150 Pa · s, it was difficult to discharge with a dispenser.・ S was found to be good. Therefore, a paste material having an intrinsic viscosity of 10 Pa · s was used for the following paste-like connection material.

As Examples 1 to 9 and Comparative Examples 1 and 2,
As shown in FIG. 2 (b), as a connection between the circuit board and the IC chip, a paste-like connecting material 6a is uniformly applied to the application region u by printing, and another paste-like connection material is applied to the discharge region z. The connection material 6b was discharged and thermocompression-bonded at 190 ° C. for 10 seconds. In Comparative Example 3, as shown in FIG. 2C, the paste-like connection material 6a is applied only to the application area by printing, and in Comparative Example 4, the paste-like connection material 6a is applied to an area wider than the connection area v. As shown in FIG. 2 (d), the paste-like connecting material 6b was discharged and thermocompression-bonded only in the discharge region z in the diagonal direction.

The following test was performed on the connection body obtained as described above. Migration test, 85 ° C, relative humidity 8
A voltage of 10 V in 5% was applied, and when the short circuit did not occur after 500 hours, ○, when it exceeded 100 and within 500 hours, and Δ when it occurred within 100 hours. PCT (Pressure Cooker Tes)
t): Maintained at 110 ° C. and a relative humidity of 85%, 導 通 indicates that conduction failure did not occur for more than 100 hours, Δ indicates that occurred for more than 50 hours and within 100 hours, and Δ indicates that it occurred within 50 hours. X. TCT (Thermal Cycle Test):-
A cycle in which the temperature was maintained at 40 ° C. and + 100 ° C. for 30 minutes each was repeated. ○: No conduction failure occurred for more than 1000 cycles, ○: 100 to 1000 cycles, Δ: 100 cycles Is indicated by x.

The results are shown in Table 1. In Table 1, Comparative Example 1 had a small amount of application and therefore had a small amount of filling at the corners, resulting in failure. In Comparative Example 2, since the amount of application was large, an uncured portion remained near the center of the side portion, and a large amount of adhered portion and insulation failure occurred. In Comparative Example 3, the filling amount at the corners was small, and an uncured portion occurred at the center of the side. In Comparative Example 4, an uncured product remained as a whole, and insulation failure occurred. In Comparative Example 5, an initial conduction defect at the side portion occurred. In contrast, Examples 1 to 9 passed all the tests.

[0041]

[Table 1] * 1: Figures in FIGS. 2 (b) to (d) * 2: Total coating amount = times the capacity of Y in formula (I) * 3: Coating area =% of area of connection area * 4: Ejection area = Connection % To the length of the diagonal line of the area * 5: The capacity ratio between the application amount of 6a and the ejection amount of 6b

[Brief description of the drawings]

1A is a cross-sectional view before connection of an anisotropic conductive connector according to an embodiment, and FIG. 1B is a cross-sectional view after connection;
It is AA equivalent sectional drawing of (a).

FIGS. 2 (a) and 2 (b) are (c) and (d) of the embodiment.
FIG. 5 is an explanatory diagram in a perspective plan view before connection in a comparative example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2, 5 electrode 3 Circuit pattern 4 IC chip 6 Paste-like connection material 7 Gap 8 Fillet 10 Anisotropic conductive connector 11 Adhesive component 12 Conductive particle 13 Corner part 14 Side part

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[Procedure amendment]

[Submission Date] November 26, 1999 (1999.11.
26)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0027

[Correction method] Change

[Correction contents]

The printed part of the paste-like connecting material, by hot press wear by discharging a part of the other diagonally, can be easily performed distribution of the paste-like connecting material,
By changing the application area and the application amount, it becomes possible to cope with the manufacture of different types of connectors.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0037

[Correction method] Change

[Correction contents]

[0037]

Embodiments of the present invention will be described below. Examples 1 to 9, Comparative Examples 1 to 5 Epoxy resin (bisphenol A type, epoxy equivalent 13
As an inorganic filler, silica (average particle size: 1.65 g / eq), 60% by weight, and 40% by weight of a latent curing agent (imidazole-modified type) is used as an inorganic filler.
5 .mu.m) and an intrinsic viscosity of 0.9 to 50% by weight.
When the paste-like connecting material was prepared by adjusting to ~ 1500 Pa · s, the paste flowed at 0.9 Pa · s and did not fill the corners, and at 1500 Pa · s, it was difficult to discharge with a dispenser. It was found that 1000 Pa · s was good. Therefore, the intrinsic viscosity is 10 Pa · s
Was used for the following paste connection material.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

[EXPLANATION OF SYMBOLS] 1 substrate 2,5 electrode 3 circuit pattern 4 IC chip 6 pasty bonding material 7 gaps 8 fillets 10 anisotropic conductive connector 11 adhesive component 12 conductive particle 13 corner portion 14 side portion

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

Claims (9)

[Claims] 1. An anisotropic conductive connector in which a member to be connected having opposing electrodes is connected by a cured product of a paste-like connection material interposed therebetween, wherein the paste-like connection material is represented by the following formula (I): 1.1 to 1.5 times the amount of Y represented by the formula, filling the gaps in the connection region, and substantially uniformly distributing and curing in the curable region around the connection region. A characteristic anisotropic conductive connector. Y = (height of the electrode of one connected member + height of the electrode of the other connected member) × area of the connection region (I) 2. The anisotropic conductive connector according to claim 1, wherein the connected member is a circuit board and / or a semiconductor element. 3. A method of manufacturing an anisotropic conductive connector in which members to be connected having opposing electrodes are connected by curing a paste-like connecting material interposed therebetween, the method comprising the steps of: 1.1 to 1.5 times the amount of the paste-like connection material is applied to an application area that is distributed to the entire connection area and the curable area when flowed by thermocompression, and the connected member is thermocompression-bonded. A method for manufacturing an anisotropic conductive connector. Y = (height of the electrode of one connected member + height of the electrode of the other connected member) × area of connection region (I) 4. The method according to claim 3, wherein a part of the paste-like connection material is applied to the application area in the connection area, and the other part is discharged diagonally of the connection area to perform thermocompression bonding. 5. The method according to claim 4, wherein the application area for applying the paste-like connection material is an area of 70 to 95% of the connection area. 6. The method according to claim 4, wherein the discharge length for discharging the paste-like connecting material diagonally is 80 to 100% of the diagonal. 7. The method according to claim 4, wherein a volume ratio of the paste-like connection material to the uniform application and the diagonal discharge is from 1: 0.4 to 1: 1.7. 8. An adhesive component containing a thermosetting resin, which is interposed between connected members having opposed electrodes and cured to produce an anisotropic conductive connector. And a paste-like connection material having an intrinsic viscosity of 1 to 1000 Pa · s. 9. The paste-like connection material according to claim 8, comprising conductive particles together with the adhesive component.