JP2001134204A - Reflection type display and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflection type display which improves the light utilization efficiency at bright display and thereby can obtain bright display characteristic, and to provide its manufacturing method. SOLUTION: The reflection type display has a transparent substrate, a microprism arranged on one surface of the transparent substrate, an active layer, which is in contact with a rugged surface of the microprism and refractive index of which selectively changes to either of a state having the same value as the refractive index of the microprism and a state having a different value corresponding to control signals from outside, and a reflection preventing layer which prevents light transmitted through the transparent substrate, the microprism and the active layer from returning to a transparent substrate side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device and a method of manufacturing the same, and more particularly, to a reflective display device which does not have a built-in light source as a light source for display and uses light from the outside and a method of manufacturing the same. .

[0002]

2. Description of the Related Art There has been a reflection type liquid crystal display as a typical reflection type display. The reflection type liquid crystal display is composed of a liquid crystal layer, a pair of substrates sandwiching the liquid crystal layer, and a light reflection plate disposed on the substrate opposite to the display surface. Ambient light is incident on the display surface side substrate, passes through the liquid crystal layer, is reflected by the reflector, is transmitted again through the liquid crystal layer, and is transmitted through the display surface side substrate and emitted.
In many reflective liquid crystal displays, a polarizing plate is placed on the display surface side substrate, and the orientation of liquid crystal molecules in the liquid crystal layer is controlled to change the polarization of incident light according to the difference in orientation. To obtain a bright or dark display. There is also a liquid crystal display without a polarizing plate, such as a PC-GH type or a PD-LC type. As a reflection type display other than the liquid crystal, there are an electrochromic display, an electrophoretic display, a twisted ball display and the like.

[0003]

In the case of a reflective liquid crystal display, the incident light always passes through the liquid crystal layer twice, at which time part of the light energy is lost. In addition, since there are many interfaces between different components such as the interface between the display side substrate and the liquid crystal layer and the interface between the reflection side substrate and the liquid crystal layer, reflection and interference occur at those interfaces, and the optical energy Lose some of. These individual losses are not so large, but when summed up, the total loss is not negligible. In a reflective liquid crystal display using a polarizing plate, half of the original light energy is lost after passing through the polarizing plate twice. Due to these light losses, the light source utilization efficiency is reduced.

A reflection type liquid crystal display using no polarizing plate has a problem that the contrast is not high. PC-
In a GH reflection type liquid crystal display, when the amount of a dichroic dye added is increased to improve the contrast, the brightness is greatly reduced. In the PD-LC reflective liquid crystal display, it is originally difficult to obtain high contrast, but there is a problem that when the cell thickness is heated to increase the contrast, the response is significantly reduced.

[0005] The electrochromic display can provide a bright and natural reflection display, but has a low contrast.
There is a problem that the life is short and the response is slow. Electrophoretic displays and twisted ball displays have the problems of low contrast and relatively high drive voltages.

[0006] Since a reflection type display needs to make effective use of a limited amount of light from the surroundings, a display is required.
Such losses are problems to be solved.

SUMMARY OF THE INVENTION An object of the present invention is to provide a reflective display and a method of manufacturing the same, which can significantly improve the light use efficiency in bright display and obtain brighter display characteristics than conventional reflective liquid crystal displays. To provide.

[0008]

According to the present invention, there is provided a reflective display comprising a transparent substrate, a microprism disposed on one surface of the transparent substrate and having an uneven surface, and an active contact with the uneven surface of the microprism. The active layer, wherein the refractive index of the active layer is selectively changed to one of a state having the same value as the refractive index of the microprism and a state having a different value according to a control signal from the outside; An anti-reflection layer is provided to prevent light transmitted through the transparent substrate, the microprisms, and the active layer from returning to the transparent substrate side.

According to the method of manufacturing a reflective display of the present invention, a transparent photosensitive resist film is coated on one surface of a transparent substrate, and a predetermined opening pattern is formed from a predetermined angle direction with respect to the surface of the photosensitive resist film. Exposing the photosensitive resist film through a photomask having: a developing process of the exposed photosensitive resist film to form an uneven surface on the remaining resist film to form a microprism; A step of superposing another substrate having a surface subjected to the prevention treatment with a predetermined clearance in opposition to the concave-convex surface of the transparent substrate, and adjusting the refractive index of the microprism in response to an external control signal. An active material that selectively changes to either a state having the same value or a state having a different value is injected into the gap and brought into contact with the uneven surface of the microprism. And a degree.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the structure and manufacturing method of a reflective display according to the present invention will be described in detail below with reference to FIGS.

FIG. 1 is a sectional view schematically showing the structure of three embodiments of a reflective display according to the present invention. The reflective display shown in FIG. 1A includes a display surface side substrate (hereinafter, referred to as an upper substrate) 1,
A microprism 2 arranged on the back surface of the upper substrate 1,
An active layer 3 in contact with the uneven surface of the microprism 2;
Substrate opposite to the display surface (hereinafter referred to as lower substrate)
4, a light absorbing layer 5 formed on the surface of the lower substrate 4, and a light scattering plate 6 formed on the surface of the upper substrate 1.

The active layer 3 is in contact with the uneven surface of the microprism 2, and its refractive index has the same value as that of the microprism 2 in response to a control signal 8 given from an external control unit 7. And a material that selectively changes to one of the states having different values. The active layer 3 will be described later in more detail. The light absorbing layer 5 has a function of absorbing light transmitted through the upper substrate 1, the microprism 2, and the active layer 3 so as not to return to the upper substrate 1.

In the case of a bright display, incident light is totally reflected at the interface by controlling the refractive index of the active layer 3 near the interface between the microprism 2 and the active layer 3 so as to be different from the refractive index of the microprism 2. To do. In the case of black display, the light transmitted through the microprism 2 is controlled by controlling the refractive index of the active layer 3 near the interface between the microprism 2 and the active layer 3 to be the same as the refractive index of the microprism 2. Enters the active layer 3 and is finally absorbed by the absorption layer 5. Therefore, in a bright display, if some loss during total reflection is neglected, almost all the energy of incident light can be used for display in principle, so that the brightness is significantly improved.

The material used for the upper substrate 1 may be any transparent material such as glass, plastic or film.
However, the thickness is desirably thin considering the resolution, preferably 1 mm or less, more preferably 0.3 m or less.
m or less is recommended. When the display of this example was actually manufactured, the glass upper substrate 1 having a thickness of 0.3 mm was manufactured.

The material used for the lower substrate 4 has a wider selection range than the material for the upper substrate 1, and an opaque substrate such as a metal or a semiconductor can be used in addition to a substrate made of a transparent material such as glass. Also, there is no particular limitation on the thickness, but if it is desired to make the entire display thin, make it as thin as possible. In the case where the display of this embodiment was actually manufactured, the lower substrate 4 having a thickness of 0.3 mm was used.
Was prepared.

The scattering plate 6 may be one generally used in a reflection type liquid crystal display, such as a fine particle dispersion type.
The micro prism 2 will be described later. Absorption layer 5
May be a material that hardly reflects light and absorbs light, such as a black pigment or carbon black used for a black matrix. In the case where the display of this example was actually manufactured, a black pigment (COLOR MOSAIK CK manufactured by Fuji Film Ohlin Co., Ltd.) used for the black matrix of the liquid crystal display was used as the absorbing layer 5. Instead of the absorbing layer 5, a light transmitting layer having a structure or properties such that light is reflected and does not return (toward the upper substrate) may be provided.

The active layer 3 contains a plurality of media having different refractive indexes or a medium having refractive index anisotropy. The active layer 3 changes its refractive index near the interface with the microprism 2 in response to a control signal 8 or radiation of at least one of electric energy, magnetism, pressure, sound wave, heat, light, and electromagnetic wave from the outside. Any value may be used as long as the value changes between two states of the same refractive index as the refractive index of the microprism 2 and a different refractive index from the value. The “same refractive index” may be a value that does not substantially form an optical interface with incident light. The “different refractive index” preferably has a refractive index difference Δn capable of causing total reflection, and preferably Δn> 0.3. Δn>
A value of 0.5 is more preferable for causing total reflection.

In FIG. 1B, a polarizing plate 9 and an anti-reflection film 10 are disposed thereon instead of the scattering plate 6 of FIG. 1A. Otherwise, it is the same as FIG. FIG. 1 (c)
Nothing is arranged on the surface of the upper substrate 1, and the rest is the same as FIG. 1A.

Next, a first embodiment of a method of manufacturing a reflective display, including a method of forming the microprism 2, will be described with reference to FIGS.

In FIG. 3A, a transparent photosensitive resist film 20 is applied to one surface of a transparent substrate 1 serving as an upper substrate. The photosensitive resist film 20 is subjected to photolithographic processing to be processed into the micro prism 2 (see FIG. 1). On the other hand, the lower substrate 4 having the surface on which the light absorbing layer 5 is formed is superposed on the substrate 1 on which the microprisms 2 are formed, with a predetermined clearance therebetween. Further, an active material to be the active layer 3 is injected into the gap between the substrates to form the micro prism 2.
A reflective display can be made by contacting the surface with irregularities.

FIG. 4 shows an example of the shape of the microprism. FIG. 4A shows a microprism 2 long in a stripe shape and having a trapezoidal cross section in the lateral direction. FIG. 4B shows a pyramid-shaped microprism 2 whose top is cut off. FIG. 4C shows the conical microprism 2 whose top is cut off. It should be noted that the flat surface at the top in these shapes exists for the ease of photolithography, and it is better not to be able to manufacture it.

Next, a method of forming the microprism 2 will be described in more detail. In the photolithographic process using a negative resist in the case of manufacturing the microprisms of FIGS. 4A and 4B, an aperture through which light for exposure (including ultraviolet rays) as shown in FIG. What is necessary is just to use a photomask in which the portion (or the light transmitting portion) 11 has a stripe shape and a photomask in which the opening portion 13 has a lattice shape as shown in FIG. 2A and 2B are shaded areas that do not transmit light for exposure. In the case of a positive resist, the light shielding part and the light transmitting part are reversed.

The line width of the openings 11 and 13 may be at least the wavelength of the ultraviolet light of the exposure light source, and is 0.5 μm to 10 μm.
Or, more preferably, a size of 1 μm to 5 μm. In the fabrication example, a mask having an opening of 3 μm line width was used. The width of the light-shielding regions 12 and 14 is selected depending on the thickness of the microprism to be formed, the angle of the lens, etc., but is preferably in the range of 0.5 μm to 100 μm, and more preferably 2 μm to 20 μm. Is preferably used. In the production example, a mask having a light-shielding area of 10 μm line width was used for producing a microprism having a thickness of 5 μm and a 45 ° inclination.

In the photolithographic process for manufacturing the micro prism shown in FIG. 4C, an opening (or a light transmitting portion) through which exposure light (including ultraviolet rays) is transmitted as shown in FIG. It is sufficient to use a photomask in which 15 is dot-shaped. In FIG. 2C, a portion 16 other than the dot 15 is a light-shielding region that does not transmit light for exposure.
The shape of the dots 15 is preferably circular, but may be triangular, quadrangular, pentagonal, or other polygonal. The diameter of the circular dot 15 may be at least the wavelength of the ultraviolet light of the exposure light source.
It is preferable to use one having a size between 5 μm and 10 μm, more preferably between 1 μm and 5 μm. In the example of manufacture, a mask having openings formed with circular dots having a diameter of 3 μm was used.

The arrangement state of the dot pattern 15 is selected depending on the thickness of the microprism to be formed, the angle of the lens, etc., but the area ratio of all the dots 15 to the whole is in the range of 1% to 50%. Well, more preferably 3
% To 20% may be used. It is preferable that the dot arrangement is uniform without any bias. However,
The light scattering properties of the microprisms formed by random arrangement are better than regular arrangement. In the production example, 5μ
A mask having a dot area ratio of 10% was used for manufacturing a microprism having an m thickness and a 45 ° inclination.

Next, the steps of manufacturing the microprism will be described in detail. FIG. 3 shows the steps of the embodiment of the method of forming the microprism 2 on the upper substrate 1 in order. In this case, the photomask having the pattern shown in FIG. 2A or 2B is used.

In FIG. 3A, a photosensitive resist film 20 is formed on the glass substrate 1. As a material of the photosensitive resist film, for example, JSR Optmer NN700,
MFR-310 or CSP made by Fuji Film Ohlin
Use a highly transparent material such as a series of photocurable resists. The photosensitive resist film 20 is formed by spin coating, roll coating, die coating, or the like. The thickness of the resist film 20 is 0.5 μm to 50 μm.
m, more preferably 1 μm to 10 μm. In the production example, JSR Optmer NN700
(Refractive index: 1.53) was formed on the transparent substrate 1 by spin coating at a thickness of 5 μm.

Next, the substrate on which the photosensitive resist film 20 has been formed is pre-baked at 90 ° C. for 20 minutes.
As shown in FIG. 2B, the resist film 20 is exposed to ultraviolet light (UV) through a photomask 30. The substrate 1 and the photomask 30 are exposed while being inclined with respect to the direction of irradiation with ultraviolet light. The angle of inclination of the substrate 1 with respect to the horizontal plane is defined as θ. FIG.
In the case of the photomask of the stripe pattern of (a),
As shown in FIG. 3B, first, the substrate 1 is exposed while tilting by θ downward to the right. Only the dotted lines are exposed. Next, as shown in FIG. 3 (c), the substrate 1 is exposed by tilting the substrate 1 to the lower left by θ. The shaded area of the resist has been exposed. When the apex angle of the microprism is set to 90 °, exposure is performed under the condition of θ ≦ ± 45 °. The same effect can be obtained by disposing the substrate 1 horizontally and inclining the light incident angle of the exposure light source with respect to the substrate surface.

After the exposure, when the substrate is subjected to a developing treatment, only the exposed portions remain. Further, when the substrate is completely solidified by post-baking, an elongated microprism 2 having a trapezoidal cross section as shown in FIG. Formed.

When the lattice-shaped photomask shown in FIG. 2B is used, the exposure steps opposite to each other in the inclination direction as shown in FIGS. 3B and 3C are performed in the x-axis direction on the plane. And the y-axis direction orthogonal thereto. And after exposure,
When the substrate is subjected to a development process, only the exposed portions remain. Further, when the substrate is completely solidified by post-baking, an inverted pyramid-shaped microprism 2 as shown in FIG.
Many are formed on the top.

When the line width of the ultraviolet transmitting portion (opening) 13 of the mask is relatively wide, or when the thickness of the photosensitive resist layer is small, θ = θ in each of the x-axis direction and the y-axis direction. It is sufficient to irradiate ultraviolet rays only twice at 45 ° and θ = −45 °. As the line width of the ultraviolet transmitting portion 13 of the mask becomes narrower, or as the thickness of the photosensitive resist layer becomes thicker, θ in the x-axis direction and the y-axis direction, θ Should be reduced. For example, θ = 0, θ = ± 15 °, θ = ±
30 ° or the like. If the thickness of the photosensitive resist layer is much larger than the line width of the ultraviolet transmitting portion of the mask, continuous exposure may be performed while scanning from θ = 45 ° to −45 °. .

If it is desired to change the apex angle of the microprism, the tilt angle θ of the substrate 1 may be adjusted as appropriate according to the desired apex angle. If the vertex angle is desired to have anisotropy (the vertex angle differs depending on the direction), the inclination angle θ depends on the irradiation direction.
And exposure.

In the actually manufactured example, the line width of the ultraviolet transmitting portion of the mask is 3 μm, the width of the light shielding region is 10 μm, the thickness of the photosensitive resist layer is 5 μm, θ = 45 °, 22.
Ultraviolet light irradiation was performed 5 times, 5 °, 0 °, −22.5 °, and −45 °, a total of 5 times. Irradiation was performed with ultraviolet light having a wavelength of 315 nm and a light intensity of 100 mJ / m ² . After the exposure, the substrate was developed, and the microprism 2 was formed by post-baking.

When the light transmittance of the resist film after development is low, the front surface may be irradiated with ultraviolet rays under strong exposure conditions. In the example actually manufactured, the exposed substrate was set to DMOAP0.5.
% Aqueous solution for 30 seconds for development, and post-baking was performed at 220 ° C. for 1 hour. As a result, height 5μ
m, a microprism having a vertical angle of 90 ° could be formed.

On the other hand, when the dot-shaped photomask shown in FIG. 2C is used, the inclination θ as shown in FIG.
Exposure is performed while the substrate is rotated in a plane (xy-axis plane) about the ultraviolet irradiation direction as an axis. After the exposure, when the substrate is subjected to a development process, only the exposed portion remains. Further, when the substrate is completely solidified by post-baking, a conical microprism 2 having a slightly flat top as shown in FIG. Many are formed on the top.

When the vertical angle of the microprism is set to 90 °, the exposure is performed while rotating the substrate under the condition of θ ≦ ± 45 °. When the interval between the ultraviolet transmitting portions 16 of the mask is relatively wide, or when the thickness of the photosensitive resist layer is small, it is possible to irradiate the ultraviolet light while rotating the substrate once while fixing at θ = 45 °. Good. UV transmitting part 1 of mask
As the interval of No. 6 becomes narrower, or as the thickness of the photosensitive resist layer becomes thicker, the value of θ under the irradiation condition of θ ≦ ± 45 ° may be reduced. For example, θ = 0
(In this case, rotation of the substrate is unnecessary), θ = 15 °, θ =
30 ° or the like. If the thickness of the photosensitive resist layer is extremely large with respect to the width of the ultraviolet transmitting portion of the mask, continuous exposure is performed while spirally scanning from θ = 45 ° to 0 °. Good.

When it is desired to change the apex angle of the microprism, the inclination angle θ of the substrate 1 may be appropriately adjusted according to a desired apex angle. When it is desired to have an anisotropy in the apex angle (the apex angle varies depending on the direction), the rotation of the substrate may be stopped at a half turn or a quarter turn.

In the actually manufactured example, the diameter of the dots 15 in the ultraviolet transmitting portion of the mask is 3 μm, the light shielding region 16 is about 90% in area ratio, the thickness of the photosensitive resist layer is 5 μm, and θ = 45 °. The substrate was irradiated with ultraviolet light twice in total at 22.5 ° while rotating the substrate, and finally irradiated without rotating the substrate from the 0 ° direction. Irradiation was performed with ultraviolet light having a wavelength of 315 nm and a light intensity of 100 mJ / m ² . After the exposure, the substrate was developed, and the microprism 2 was formed by post-baking.

Next, a second embodiment of the method of manufacturing the reflection type display will be described with reference to FIG. This embodiment is different from the embodiment described with reference to FIG. The substrate is exposed without tilting. Otherwise, Figure 3
This is basically the same as the embodiment.

In the embodiment shown in FIG. 5, the exposure light source uses coherent light such as laser light. In FIG. 5A, a transparent photosensitive resist film 20 is applied to one surface of a transparent substrate 1 serving as an upper substrate. Next, as shown in FIG. 5B, the resist film 20 is exposed to laser light via a photomask 30. The photomask 30 is shown in FIG.
Irradiation method is the same in any of (b) and (c).

The coherent light that has passed through the photomask 30 can give light intensity to the resist film in a prism shape without tilting the substrate by the interference effect. The material of the photosensitive resist film used here may be that of the above-described embodiment, or may be a holographic material such as OINDEX HRF150, HRF6 manufactured by DuPont.
00 may be used. In the latter case, the light source may be visible light instead of ultraviolet light.

Next, a description will be given of a configuration of the active layer 3 utilizing the refractive index anisotropy which can be applied to all the embodiments described above and which utilizes the liquid crystal technology. When a liquid crystal material is used for the active layer 3, a display configuration using the polarizing plate 9 shown in FIG.

As the liquid crystal alignment state of the active layer 3, a configuration was prepared in which the relative dielectric anisotropy Δε of the liquid crystal material was positive in the horizontal alignment and negative in the vertical alignment. Since the birefringence Δn of the liquid crystal material is preferably as large as possible,
A high Δn material of about 0.25 or more was selected.

As for the refractive index of the microprism 2 and the refractive index of the liquid crystal, materials which are equal to each other when the liquid crystal molecules are horizontal or vertical are selected. When no voltage is applied (horizontal orientation type)
Alternatively, when a voltage is applied (vertical alignment type), the alignment processing is performed so that the director direction of the liquid crystal molecules near the microprism interface is parallel to the transmission axis of the polarizing plate 9. The indentation amount of the fiber in the rubbing is usually several hundred μm, and it is considered that there is no problem in the orientation treatment of the microprism surface having a height of several tens μm or less. When a scattering plate having no directivity is used, the characteristic at the time of 30 ° light incidence / normal direction measurement is 0-20.
At an on-off voltage of V, the reflectance was 40% (the standard white plate was 100%) and the contrast ratio was about 10. The reflectance can be improved by giving directivity to a microprism or a scattering plate.

As another configuration of the active layer 3, a method of using a plurality of media having different refractive indexes will be described. In this case, it is not necessary to use a polarizing plate as in the structure shown in FIGS.

Examples of materials having different refractive indices include gases such as air and nitrogen, water, organic solvents, and materials in which fine particles and magnetic substances are dispersed in these solvents. At least one of the plurality of different materials is a micro prism 2
Is selected with a refractive index equal to the refractive index of The active layer 3 composed of a composite of these multiple materials has electric, magnetic,
By giving a control signal or radiation of at least one of energy forms of pressure, sound waves, heat, light, and electromagnetic waves, the refractive index near the interface with the microprism 2 is changed.

For example, in an organic solvent such as benzene, T
Fine particles such as iO ₂ can be uniformly dispersed by about 1 to 30%, and the fine particles can be collected at the interface with the microprism 2 using the electrophoresis phenomenon. By electrically controlling the active layer 3 in this way, the refractive index near the interface with the microprism can be made the same as or different from the refractive index of the microprism 2.

If the fine particles are a magnetic fluid, the magnetic fluid can be moved by applying magnetism to the active layer 3 and the refractive index near the interface with the microprism 2 can be controlled magnetically.

Further, by forming a film having a property of repelling water or the like on the surface of the microprism 2, a gas is disposed at the interface of the microprism 2, and a liquid is disposed separately at other portions. The active layer 3 is created. By applying a pressure to the active layer 3 by the piezo effect or ultrasonic waves or pen pressure to move the gas, the refractive index near the microprism interface can be controlled. When using a scattering plate having no directivity, the characteristics at the time of 30 ° light incidence and normal direction measurement are as follows: when the on-off voltage is 0-20V,
73.7% reflectance (standard white plate is defined as 100%),
Very excellent characteristics with a contrast ratio of about 11 were exhibited.
Its characteristics are almost the same as those of copy paper as shown in FIG. The reflectance can be improved by giving directivity to a microprism or a scattering plate.

In the above-mentioned reflection type display, optical characteristics such as viewing angle compensation can be improved by appropriately adjusting the shape of the microprism. Further, a microprism can be manufactured without using a plurality of photolithographic steps or a special material device. The above-mentioned reflective display is a display device for all uses such as a computer display and a video device, a toy for children,
It could be used for electronic notebooks instead of paper.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to these embodiments. For example, it will be apparent to those skilled in the art that various modifications, improvements, and combinations are possible.

[0052]

As described above, the bright display does not introduce light into the active layer and uses the total reflection condition, so that the reflective display characteristics are much superior to those of the conventional reflective display. Can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a reflective display according to three embodiments of the present invention.

FIG. 2 is a schematic plan view showing three types of photomask patterns used in a process of forming microprisms of a reflective display.

FIG. 3 is a cross-sectional view illustrating a process of manufacturing a reflective display according to an embodiment of the present invention.

FIG. 4 is a perspective view showing three types of microprisms of a reflective display according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a process of manufacturing a reflective display according to another embodiment of the present invention.

FIG. 6 is a graph showing a reflection spectrum of a reflection type display according to an example in comparison with reflection spectra of copy paper and recycled paper.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Microprism 3 Active layer 4 Substrate 5 Absorption layer 6 Scattering plate 7 Control part 8 Control signal 9 Polarization plate 10 Antireflection film 11, 13, 15 Opening (light transmission part) 12, 14, 16 Light shielding part 20 Photosensitive resist film 30 Photomask

Claims (12)

[Claims] 1. A transparent substrate, a microprism disposed on one surface of the transparent substrate and having an uneven surface, and an active layer that is in contact with the uneven surface of the microprism and is responsive to an external control signal. The active layer whose refractive index selectively changes to a state having the same value as the refractive index of the microprism and a state having a different value, the transparent substrate, the microprism, and the active layer. A reflective display having an antireflection layer for preventing light transmitted through the substrate from returning to the transparent substrate side. 2. A transparent substrate, a microprism disposed on one surface of the transparent substrate and having an uneven surface, and an active layer in contact with the uneven surface of the microprism. The light is totally reflected at the interface between the microprism and the active layer, and in the case of black display, the optical characteristics are controlled by an external control signal so that the light transmitted through the microprism is incident on the active layer. A reflective display comprising: the active layer to be changed; and an antireflection layer that prevents light transmitted through the transparent substrate, the microprisms, and the active layer from returning to the transparent substrate. 3. The active layer includes a composite of a plurality of materials having different refractive indexes, wherein at least one of the plurality of materials has the same refractive index as the refractive index of the microprism, and The electricity, magnetism, pressure, sound waves, heat,
3. The reflective display according to claim 1, wherein a refractive index near an interface with the microprism changes according to a control signal of at least one of energy forms of light and electromagnetic waves. 4. The active layer includes a material having a refractive index anisotropy, and receives electric, magnetic, pressure, sound, heat,
3. The reflective display according to claim 1, wherein a refractive index near an interface with the microprism changes according to a control signal of at least one of energy forms of light and electromagnetic waves. 5. The reflection type display according to claim 1, wherein the antireflection layer is a light absorption layer. 6. The reflective display according to claim 5, wherein the light absorbing layer contains at least one of a black or blue pigment and carbon black. 7. The reflective display according to claim 1, wherein the antireflection layer is a light transmitting layer that transmits light to a part other than the transparent substrate. 8. A step of applying a transparent photosensitive resist film on one surface of a transparent substrate, and the step of coating the photosensitive resist film via a photomask having a predetermined opening pattern from a predetermined angle direction with respect to the surface of the photosensitive resist film. Exposing the photosensitive resist film to light, developing the exposed photosensitive resist film to form an uneven surface on the remaining resist film, forming a microprism, and providing another surface having an anti-reflection surface. A step in which the substrate is opposed to the concave-convex surface of the transparent substrate and overlapped with a predetermined gap, and a state in which the refractive index has the same value as the refractive index of the microprism in response to an external control signal. Injecting an active material that selectively changes to a state having a value into the gap to make contact with the uneven surface of the microprism. Production method. 9. The method of manufacturing a reflection-type display according to claim 8, wherein, in the exposing step, an exposure process is performed one or more times by a light source in which a light incident direction to the surface of the photosensitive resist film is a predetermined angle other than a right angle. Method. 10. In the exposing step, the light exposure is performed while rotating the transparent substrate about the incident axis of the light by a light source whose incident direction of light is not a right angle with respect to the surface of the photosensitive resist film. 9. The method of manufacturing a reflective display according to claim 8, wherein the method is performed. 11. In the exposing step, when exposing from a first light source direction and exposing from a second light source direction having an azimuthal angle different from the first direction by 180 °, the first and second light sources are exposed.
11. The method of manufacturing a reflective display according to claim 9, wherein the directions have different inclination angles with respect to the transparent substrate surface. 12. In the exposure step, the light source irradiates coherent light, and the coherent light is subjected to light interference by the photomask to project a predetermined light and dark pattern on the photosensitive resist film. A method for manufacturing a reflective display according to claim 8.