JP2001127118A - Method for manufacturing tab tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make exposure registration of a double-sided wiring TAB tape accurate between double-sided wiring patterns and between them and non-resist regions. SOLUTION: A tape 10 is set in an exposure machine so that a wiring pattern 5 formed by exposing and etching one face turn downside: a registration position of its downside wiring pattern 5 is read by a photosensor 16, and the tape 10 is registered so that the read position agree with a predetermined target position for pattern exposure of the top face coated and prebaked with a photoresist 6 or 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a double-sided wiring TAB.
(Tape Automated Bonding) The present invention relates to a method for manufacturing a tape, and more particularly to a method for manufacturing a TAB tape in which exposure alignment when forming a wiring pattern corresponding to both surfaces is accurate and workability is good.

[0002]

2. Description of the Related Art The general structure of a double-sided wiring TAB tape is as follows.
This will be described with reference to FIG. 5 of the present invention.

In FIG. 5, a double-sided wiring TAB tape 10 is shown.
Is to form wiring patterns 5 and 7 on a copper foil bonded to both surfaces of the insulating film 1, respectively, from the solder ball pad 7a of the wiring pattern 7 on one side to the land 5a of the wiring pattern 5 on the other side. A blind via 4 extending to the inner surface is provided, a part of both wiring patterns are electrically connected to each other, and a solder protective layer is formed on a predetermined area of the wiring pattern 7 on the side where the blind via 4 is provided as a surface protective coating layer. It is provided with a resist 8.

In producing this double-sided wiring TAB tape, conventionally, as a means for exposing the double-sided wiring TAB tape,
Generally, an exposure machine shown in FIG. 8 is used. This exposure machine uses T
A mechanism in which the AB tape 10 is wound around sprockets 18, 18 arranged at intervals through the perforation holes 11, which are feed holes of the TAB tape 10, and is intermittently fed by the driving force of the motor 21 while being held down by the sprocket rotating gear 20. Having. The TAB tape 10 is stably supported between the sprockets 18 and 18 by a suction plate 19 in a flat state, and is illuminated from above by a lighting device 17.

In a conventional method of exposing a double-sided wiring TAB tape, generally, a TAB tape 10 is first positioned with reference to a perforation hole 11 serving as a perforation hole, one side of which is exposed and developed, and the copper foil on one side is etched. To form a copper wiring pattern. Thereafter, another surface was coated with a photoresist and precured, exposed and developed again with the perforation hole 11 as a reference, and the copper foil on the other surface was etched to form a copper wiring pattern.

[0006]

However, in general, a TAB tape having two-layered wiring has a blind via 4 which is electrically connected when a deviation of ± 20 μm occurs between upper and lower wiring patterns particularly at a wiring pitch of 80 μm or less. And the diameter of the land 5a is deviated and defective. In many cases, a photosensitive solder resist 8 is applied to the solder ball pad 7a side where the blind via 4 is present, pre-cured, and then exposed and developed again. The production yield of TAB tapes for wiring is reduced, and products cannot be produced efficiently.

[0007] The above conventional problem is that the method of aligning the exposing machine is not appropriate (positioning at a perforation hole). For this reason, the position of the upper and lower wiring patterns is displaced, and particularly at a wiring pitch of 80 μm or less, the hole of the via (Via) that is electrically connected and the land diameter are deviated and defective.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a method for manufacturing a TAB tape in which the exposure position of a wiring pattern corresponding to both sides of a double-sided wiring TAB tape is accurate and workability is good. It is in.

[0009]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

(1) According to the first aspect of the present invention, a wiring pattern is formed on each of copper foils bonded to both sides of an insulating film, and the wiring pattern extends from the wiring pattern on one side to the inner surface of the wiring pattern on the other side. In a method of manufacturing a TAB tape, a blind via is provided to connect a part of both wiring patterns, and a solder resist is provided in a predetermined region on the wiring pattern on the side where the blind via is provided. Is set on the exposure machine so that the wiring pattern formed on the lower surface side is read, and the alignment position of the wiring pattern on the lower surface side is read by an optical sensor, and the tape is positioned so that the read position matches a predetermined target position. Positioning is performed, and pattern exposure is performed on an upper surface that has been coated with a photoresist in advance and prebaked.

(2) The invention described in claim 2 is the invention according to claim 1.
In the method for manufacturing a TAB tape according to the aspect, the pattern exposure is pattern exposure for forming a wiring pattern on a side where the blind via is provided.

(3) The invention according to claim 3 is the invention according to claim 1.
Or the method of manufacturing a TAB tape according to 2, wherein the pattern exposure is pattern exposure on a solder resist provided in a predetermined region on the wiring pattern on the side where the blind via is provided.

(4) The invention described in claim 4 is the first invention.
In the method of manufacturing a TAB tape according to the aspect, the pattern exposure is pattern exposure for forming a wiring pattern on a side where the blind via is not provided.

The gist of the present invention is to solve the conventional problem by performing the positioning by reading the lower wiring pattern with an optical sensor when exposing the upper wiring pattern after forming the lower wiring pattern as described above. is there. Since the position of the double-sided wiring pattern is aligned based on the read result, the alignment accuracy is improved as compared with the method based on the perforations, thereby improving the non-defective product rate and improving the productivity.

As a tape to which the present invention can be applied, a two-layer CCL (Copper C) of an adhesive-less double-sided copper foil polyimide tape is used.
TAB (Tape Automated Bonding) in which a wiring pattern is formed using lad laminate) or a double-sided copper-bonded polyimide tape using an adhesive or a single-sided wiring adhesive
According to the present invention, in these TAB tapes, a wiring pattern (or a via (Via)) formed by exposing and etching one surface is set on an exposure machine so that the lower surface thereof is formed, and a wiring pattern ( Or vias) are read by an optical sensor and positioned, and pattern exposure is performed on the upper surface of the substrate that has been coated and prebaked with a photoresist in advance.

An adhesive-free double-sided copper-clad polyimide tape is effective when the thickness of the copper foil / polyimide tape / copper foil is 9 to 35 μm / 25 to 125 μm / 9 to 35 μm.
m. This is because these are material compositions generally available as a commercial product of an adhesive-less double-sided copper-applied polyimide tape.

Because of the reading method using an optical sensor, a wiring pattern of 20 μm on the lower surface (a wiring width of 10 μm and a space of 10 μm) is read with an accuracy of ± 2 μm, and the positional accuracy of the wiring pattern at the time of exposure on the upper surface is kept within ± 5 μm. It is possible.

In short, in the present invention, the adhesive-free double-sided copper-clad polyimide tape has a composition thickness of copper foil / polyimide tape / copper foil of 9 to 25 μm / 25 to 100 μm /
9 to 25 μm, and the wiring lead pitch is 100
２０20 μm, wiring pattern of 20 μm is read by a sensor for positioning, and the pattern wiring lead pitch on the upper surface, which is pre-coated and pre-baked with photoresist, is 1
The exposure of 00 to 20 μm can be performed with a positional deviation accuracy from the lower surface pattern of ± 5 μm or less.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the illustrated embodiment.

FIG. 1 shows an exposure apparatus used in this embodiment. This is basically the same as the conventional exposure machine already described with reference to FIG. 8, in which the TAB tape 10 is attached to the sprockets 18 and 18 spaced apart.
And has a mechanism for intermittent feeding by the driving force of the motor 21 while being wound around the perforation hole 11 serving as a feed hole and being held by the sprocket rotating gear 20. The TAB tape 10 is stably supported between the sprockets 18 and 18 by a suction plate 19 in a flat state, and is illuminated from above by a lighting device 17.

However, unlike the conventional exposing machine, an optical sensor 16 for reading the pattern of the TAB tape 10 is provided below the tape running surface.

Next, a method of manufacturing a TAB tape using the above-described exposure machine will be described with reference to FIGS.

First, an adhesive-less double-sided copper-applied polyimide casting material in which electrolytic copper foils 2 and 3 are adhered to both sides of an insulating film 1 made of a polyimide resin without an adhesive is prepared (FIG. 2A). Here, a tape having a width of 70 mm having a copper foil thickness of 18 μm / polyimide thickness of 25 μm / copper foil thickness of 18 μm / is punched, and a perforation hole 11 (see FIG. 1) as a perforation hole is punched out.

Then, from one side (copper foil 2 side), CO ₂
Hole (blind via) 4 with a diameter of 100μ by laser light
180 are opened (FIG. 2B).

Next, a pattern having a wiring pitch of 60 μm is formed on the electrolytic copper foil (thickness: 18 μm) 3 on the opposite pattern surface by a photo application, and then etched to form a wiring on the copper foil 3 by copper wiring. Pattern 5
Is created (FIG. 2C). The wiring pattern 5 includes an inner lead (not shown) having a wiring pitch of 60 μm, a land 5a corresponding to the mounting position of the solder ball 12, and a lead wiring 5b.
(See FIG. 6).

Next, a photoresist 6 having a predetermined thickness is applied and prebaked on the copper foil 2 on which the blind via 4 on the side opposite to the pattern surface is opened (FIG. 2).
(D)).

Thereafter, the alignment position of the wiring pattern 5 on the lower surface, here the position of the land 5a, is read by the optical sensor 16 for reading in the exposure apparatus of the present invention shown in FIG. 1 (FIG. 2 (e)). The sprocket 18 of FIG. 1 is driven according to the read position, that is, the deviation obtained by comparing the read current position with the target position, and the tape is moved in the direction of arrow F in FIG. By moving back and forth, the pattern to be formed on the photoresist 6 on the upper surface and thus on the copper foil 2 is positioned.

Thereafter, the photoresist 6 is exposed by an illumination device 17, developed, and post-baked (FIG. 3F). Thereafter, the wiring pattern 7 was formed on the copper foil 2 by etching using the photoresist 6 as a mask (FIG. 3G). This wiring pattern 7 includes a solder ball pad 7a.

Next, a photosensitive photo solder resist 8 is applied to the pattern surface on the copper foil 2 side where the blind via 4 is opened, so that the copper foil 2 is covered with the photoresist pattern surface having a predetermined thickness. Pre-bake (Fig. 3
(H)). Thereafter, as in the step of FIG. 2E, the alignment position of the wiring pattern 5 having a 60 μm wiring pitch on the lower surface is read by the optical sensor 16 of the exposure apparatus of the present invention, and the tape is inserted in accordance with the read position. By moving back and forth in the direction of arrow F in FIG. 2 (i), the pattern to be formed on the photosensitive photo solder resist 8 on the upper surface is positioned (FIG. 3 (i)). Then, the pattern is exposed to the photosensitive photo solder resist 8 on the upper surface which is correctly positioned, and then developed and post-baked to expose the solder ball pad 7a to the photosensitive photo solder resist 8 in a circular shape. (FIG. 3 (j)).

Next, electroless Sn plating 9 was applied to a region exposed from the solder resist 8 to a thickness of 0.4 μm to obtain a completed product (FIG. 4 (k)).

By the Sn plating 9, the insulating film 1 is formed.
A solder ball pad 7a of the wiring pattern 7 on one side of
The lands 5 a of the wiring pattern 5 on the other side are electrically connected to the lands 5 a through the blind vias 4. On the other hand, the solder ball 12 is mounted on the solder ball pad 7a as suggested in FIG. Therefore, when the land 5a of the wiring pattern 5 is provided as a ground layer, this ground layer can be grounded through the blind via 4 and the solder ball 12, thereby improving the high frequency characteristics of the semiconductor device. it can.

FIG. 6 shows a conventional exposure apparatus for forming a pattern.
6B, the blind vias 4, the solder ball pads 7a, and the lands 5a are often shifted from each other, but in the case of the TAB tape obtained by the manufacturing method of the above embodiment, FIG. As shown in (a), the solder ball pad 7a on one side and the non-resist area 8
a can be accurately and substantially concentrically aligned with the land 5a on the other side.

In the case of the above embodiment, the wiring displacement 14 between the two surfaces of the completed TAB tape is smaller than the positional displacement of the wiring by pattern formation using a conventional exposure machine.
It was confirmed that it decreased to 1/3 or less. In particular, it was proved to be very effective for the second misalignment of the photosensitive solder resist.

In particular, regarding the deviation between the via diameter and the land diameter of the photosensitive solder resist, the deviation of 70 μm in the prior art is reduced by 1 /.
5 or less, and the positional deviation accuracy is stable 2
A tape carrier for the layer wiring TAB could be supplied. For this reason, the yield and productivity have been improved, and it has become possible to supply in a stable mass production.

The TAB tape obtained by the present invention has high insulation resistance and excellent migration resistance.

In the above embodiment, the case where there is no device hole has been described. However, the present invention relates to an inner lead bonding type two-layer wiring TAB having a device hole.
It can be applied to the production of tapes.

The two-layer wiring TA obtained by the above manufacturing method
The tape for B has high insulation resistance and excellent migration resistance, and has fine wiring (pitch 50 μm or less) without device holes.
p) Beam lead type CSP (Chip Scale Package) with connection and device holes, Tape-BGA
It can be used for That is, according to the method for producing a TAB tape using the exposure apparatus of the present invention, Tape
-In the production of TAB tapes for BGA or CSP, the transport, bonding of semiconductor chips, and alignment of solder balls are facilitated, and assemblability is improved, and the assembling quality of products is improved.

The method for producing a TAB tape of the present invention is not limited to the double-sided copper-applied polyimide tape of the above embodiment, but can be applied to a single-sided copper-applied polyimide tape. FIG. 7 shows a single-sided copper-clad two-layer C using an adhesive 13.
The wiring pattern of the copper foil 2 from the insulating film 1 side (the outer leads 1 of the copper foil signal layer)
5) The blind via 4 provided so as to reach the inner surface is set on the exposure apparatus with the lower surface side set, and the blind via 4 on the lower surface is read by the optical sensor 16 as an alignment position, and the read position is a predetermined target position. Position the tape so that it matches. Then, pattern exposure is performed on a photosensitive photoresist that has been coated and pre-baked in advance to form a surface protective coating layer on the outer leads 15 on the upper surface. Thereby, the non-resist region 8a is located at the correct position corresponding to the blind via 4 (see FIG. 3 (j)).
Can be formed.

[0039]

As described above, according to the present invention, the following excellent effects can be obtained.

(1) According to the first to fourth aspects of the present invention, a wiring pattern formed by exposing and etching one surface is set on an exposure machine such that the lower surface side is formed. The alignment position is read with an optical sensor, the tape is positioned so that the read position matches the predetermined target position, and pattern exposure is performed on the upper surface that has been coated with photoresist and pre-baked. Wiring misalignment between both surfaces of the product can be reduced to 1/3 or less as compared with the wiring misalignment due to pattern formation by a conventional exposure machine.

In particular, regarding the deviation between the via diameter and the land diameter of the photosensitive solder resist, the deviation of 70 μm in the prior art is reduced by 1 /.
5 or less, and the positional deviation accuracy is stable 2
It is possible to supply a tape carrier for the layer wiring TAB. For this reason, the production yield and productivity are improved, and supply can be performed in a stable mass production.

(2) The method for producing a TAB tape of the present invention can be applied to the production of a TAB tape for Tape-BGA or CSP. Positioning can be facilitated, assemblability can be improved, and the assembling non-defective rate of the product can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a TAB exposure machine used in a manufacturing method of the present invention.

FIG. 2 is a process diagram showing one third of a manufacturing method according to one embodiment of the present invention.

FIG. 3 is a process diagram showing 2/3 of the manufacturing method according to one embodiment of the present invention.

FIG. 4 is a process chart showing 3/3 of a manufacturing method according to an embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a TAB tape to be manufactured in one embodiment of the present invention.

FIG. 6 is a plan view showing a pattern example (a) created by the manufacturing method of the present invention in comparison with a pattern example (b) created by a conventional method.

FIG. 7 is a partial cross-sectional view of a TAB tape to be manufactured in another embodiment of the present invention.

FIG. 8 is a perspective view of a conventional TAB exposure machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation film 2, 3 Copper foil 4 Blind via 5 Wiring pattern 5a Land 6 Photoresist 7 Wiring pattern 7a Solder ball pad 8 Photosensitive solder resist 8a Non-resist area 9 Sn plating 10 Double-sided wiring TAB tape 11 Perforation hole 16 Optical sensor 17 Lighting equipment

Claims (4)

[Claims] 1. A wiring pattern is formed on a copper foil bonded to both sides of an insulating film, and a blind via extending from the wiring pattern on one side to the inner surface of the wiring pattern on the other side is provided. In a method of manufacturing a TAB tape, a solder resist is provided in a predetermined area on a wiring pattern on a side where a blind via is provided, a wiring pattern formed by exposing and etching one side is on a lower side. Set it on an exposure machine, read the alignment position of the wiring pattern on the lower surface side with an optical sensor, position the tape so that the read position matches the predetermined target position, coat the photoresist in advance A method for producing a TAB tape, wherein pattern exposure is performed on a prebaked upper surface. 2. The TAB tape manufacturing method according to claim 1, wherein said pattern exposure is pattern exposure for forming a wiring pattern on a side where said blind via is provided. Manufacturing method. 3. The method for manufacturing a TAB tape according to claim 1, wherein the pattern exposure is pattern exposure on a solder resist provided in a predetermined region on a wiring pattern on a side where the blind via is provided. A method for producing a TAB tape. 4. The TAB tape manufacturing method according to claim 1, wherein said pattern exposure is pattern exposure for forming a wiring pattern on a side where said blind via is not provided. Manufacturing method.