JP2001126979A - Stage system, aligner, device manufactured thereby, and manufacturing method of the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stage system and an aligner for accurately detecting connection errors of an interferometer and the like. SOLUTION: In a water stage system 10 for a projection aligner, magnetic poles are adjusted in positions after turn-on of power, and a linear motor 12 is moved minutely by a minute thrust force. Then, connection errors of an interferometer 14X is checked, by detecting whether a change in signal corresponds to the interferometer 14X.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus, an exposure apparatus, a device manufactured by the exposure apparatus, and a device manufacturing method.

[0002]

2. Description of the Related Art A semiconductor exposure apparatus includes a reticle stage for mounting a reticle (or mask), a wafer stage for mounting a wafer, and a projection optical system for projecting and exposing a pattern formed on the reticle to a wafer. Each stage is appropriately driven by a motor and a motor control device that controls the motor, and the pattern formed on the reticle is projected and exposed accurately at a predetermined position on the wafer. In driving the stage, an interferometer using a laser or the like is used to accurately detect the position of the stage. The motor control device performs highly accurate control while monitoring signals from the interferometer. The interferometer is provided with one interferometer in each of the X-axis direction and the Y-axis direction to detect a planar movement of the stage. Further, in order to detect the rotation state in the XY plane, there may be a case where two interferometers in either the X-axis direction or the Y-axis direction are provided and a total of three interferometers are provided.

[0003] If these interferometers are out of order, the signals from the interferometers differ from the original signal specifications, so that a motor control device or the like can easily detect an abnormality in the interferometers. it can. However, when some interferometers are mistakenly connected by mistake, each interferometer does not have a failure and outputs a signal of regular specifications. For this reason, erroneous connections cannot be found by looking at the signal specifications.

When each stage is driven by, for example, a three-phase linear motor or the like, when the power of the apparatus is turned on, magnetic pole positioning, which is an operation of aligning an armature coil and a magnet of the linear motor, is performed. Usually, a misconnection is found during this magnetic pole alignment.

[0005]

However, in some cases, there is no abnormality in the output signal of the interferometer, and erroneous connection of the interferometer cannot be found even though the magnetic pole alignment has been completed normally. Was. Therefore, the position information from the interferometer does not change even though a predetermined motor is driven to move the stage in a certain direction. As a result, current is supplied to the motor to drive the motor further,
There was a problem that the motor malfunctioned.

An object of the present invention is to provide a stage apparatus and an exposure apparatus capable of accurately detecting an erroneous connection of an interferometer or the like.

[0007]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to FIG. In order to achieve the above object, the invention according to claim 1 includes a stage (10X, 10Y) on which a moving object (W) is mounted, and a stage (10X) for moving the moving object (W) in a predetermined direction. 10Y), a first position detecting device (14X) for detecting a position of the stage (10X, 10Y) in a predetermined direction, and outputting a signal corresponding to the detected position, and a stage. A second position detecting device (14Y) that detects a position in a direction different from the predetermined direction of (10X, 10Y) and outputs a signal corresponding to the detected position; and a first position detecting device (14Y).
X) is connected to the second position detecting device (14Y), and drives the motor (12) while monitoring a signal from the connecting portion (19) to which the first position detecting device (14X) is to be connected. The control device (8) controls driving of the motor (12) so as to perform magnetic pole alignment of the motor (12).
After the magnetic pole alignment is completed, the motor (12) is driven by a predetermined amount to receive a signal from the connection part (19), and the connection between the first position detecting device (14X) and the control device (8) based on the received signal. Is determined. According to a second aspect of the present invention, in the stage apparatus according to the first aspect, the control device (8) performs magnetic pole alignment of the motor (12),
This is performed when the stage device is started. According to a third aspect of the present invention, there is provided a stage (10X, 10Y) on which a moving object (W) is mounted, and a stage (10X, 10Y) for moving the moving object (W) in a predetermined direction.
And a stage (10X, 10X)
Y) a first position detection device (14X) that detects a position in a predetermined direction and outputs a signal corresponding to the detected position, and a position of the stage (10X, 10Y) in a direction different from the predetermined direction. A second position detecting device (14Y) for detecting and outputting a signal corresponding to the detected position, a first position detecting device (14X) and a second position detecting device (14Y) are connected, and the first position detecting device (14Y) is connected to the first position detecting device (14X). While monitoring the signal from the connecting portion (19) to which the position detecting device (14X) of the
The first position detecting device (14X) and the second position detecting device (14Y) are applied to a stage device having a control device (8) for controlling the driving of 2). And the control device (8) receives the identification signal from the connection section (19), and determines whether or not the connection between the first position detection device (14X) and the control device (8) is good based on the received identification signal. This is to make a judgment. According to a fourth aspect of the present invention, there is provided an exposure apparatus for forming a predetermined pattern on a substrate (W).
The stage device (3 or 10) described in the item is provided. According to a fifth aspect of the present invention, in the exposure apparatus according to the fourth aspect, the exposure apparatus exposes a pattern formed on the mask (R) onto the substrate (W),
The stage device (3 or 10) has at least one of the substrate (W) and the mask (R) mounted and moved. According to a sixth aspect of the present invention, a device is manufactured by the exposure apparatus according to the fourth or fifth aspect. According to a seventh aspect of the present invention, there is provided a device manufacturing method, comprising the steps of preparing an exposure apparatus according to the fourth or fifth aspect and performing exposure by the exposure apparatus.

[0008] In the section of the means for solving the above-mentioned problems, the description is made in correspondence with the drawings of the embodiments for easy understanding, but the present invention is not limited to the embodiments.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 is a view showing a schematic configuration of a projection exposure apparatus according to a first embodiment. The projection exposure apparatus is a stepper type (step and repeat type) projection exposure apparatus that exposes a reduced image of a reticle pattern to each shot area of a wafer.
Although the term “reticle” is used in the first embodiment, in the present specification, both the reticle and the mask are treated as synonymous with a pattern to be projected on a wafer. In FIG. 1, exposure light IL from an illumination optical system 1 is reflected by a dichroic mirror 2 to illuminate a pattern area of a reticle R. Z parallel to the optical axis of the exposure light IL after being reflected by the dichroic mirror 2
An X axis is taken in a direction parallel to the plane of FIG. 1 in a two-dimensional plane perpendicular to the Z axis, and a Y axis is taken in a direction perpendicular to the plane of FIG.

The reticle R is a reticle side Y stage 3
Y, and mounted on reticle base 4 via reticle side X stage 3X. The reticle-side X stage 3X is configured such that the reticle base 4 is
The reticle side Y stage 3Y is driven in the Y direction by a linear motor (not shown) with respect to the reticle side X stage 3X via a linear motor composed of B (hereinafter, referred to as “linear motor 5”). You.

A movable mirror 6X for the X axis and a movable mirror for the Y axis (not shown) are fixed on the reticle side Y stage 3Y, and the movable mirror 6X and the X axis reticle side installed outside are fixed. X coordinate X of reticle side X stage 3X by laser interferometer (hereinafter referred to as “reticle interferometer”) 7X
R is measured. A reticle-side Y stage 3 is provided by a Y-axis moving mirror (not shown) and a Y-axis reticle interferometer 7Y.
The Y coordinate of Y is measured. The measured X-coordinate XR and Y-coordinate YR are supplied via connectors 17 and 18 to a central control system 8 which controls the overall operation of the apparatus. A stage system including the reticle side Y stage 3Y, the reticle side X stage 3X, the reticle base 4, the X axis linear motor 5, and the Y axis linear motor is referred to as a reticle stage device 3.

Under the exposure light IL, an image of the pattern of the reticle R is reduced via a projection optical system PL having a projection magnification β (β is, for example, ５) and projected onto each shot area on the wafer W. Exposed. The wafer W is placed on the wafer-side Y stage 1
0Y and a wafer-side X stage 10X mounted on the wafer base 11 via a wafer-side X stage 10X. The wafer-side X stage 10X is a linear motor (hereinafter, referred to as a “linear motor 1
2 "), and the wafer-side Y stage 10Y is driven in the Y-direction by a linear motor (not shown) with respect to the wafer-side X stage 10X.

A movable mirror 13X for the X-axis and a movable mirror for the Y-axis (not shown) are fixed on the wafer-side Y stage 10Y, and the movable mirror 13X and the externally mounted wafer for the X-axis are fixed. The X coordinate XW of the wafer-side X stage 10X is measured by a laser interferometer (hereinafter, referred to as a "wafer interferometer") 14X, and a wafer is moved by a Y-axis moving mirror (not shown) and a Y-axis wafer interferometer 14Y. Side Y stage 10
The Y coordinate YW of Y is measured, and the measured X coordinate XW and Y coordinate YW are supplied to the central control system 8 via the connectors 19 and 20. Wafer-side Y stage 10Y, wafer-side X stage 10X, wafer base 11, X-axis linear motor 12, Y-axis linear motor, and wafer W
A stage system composed of a Z leveling stage (not shown) for controlling the position and the tilt angle in the Z direction is referred to as a wafer stage device 10.

In the first embodiment, a three-phase linear motor is used as a linear motor. For example, linear motor 1
2 will be described as an example. The linear motor 12 includes a stator 12A and a mover 12B. The stator 12A includes a three-phase armature coil (not shown), and the mover 12B has a polarity that is sequentially inverted on the side surface of the wafer-side X stage 10X. And four permanent magnets (not shown) fixed side by side in the X direction.
That is, the linear motor 12 is a moving magnet type linear synchronous motor. Note that a moving coil type linear motor in which an armature coil is housed on the mover side may be used.

The central control system 8 controls the operation of the X-axis linear motor 5 and the Y-axis linear motor on the reticle side via the reticle stage drive system 15 to position the reticle R, and to control the position of the reticle R. The operation of the X-axis linear motor 12 and the Y-axis linear motor on the wafer side is controlled via the drive system 16 to position the wafer W. By such control, the pattern of the reticle R is reduced and exposed on each shot area of the wafer W.

In the projection exposure apparatus having the above-described configuration, at the time of startup, that is, when the power of the projection exposure apparatus is turned on, initialization of the projection exposure apparatus is performed prior to the projection exposure operation. In this initial setting, first, it is checked whether or not each interferometer is out of order. After that, each stage is set to an initial position, and the magnetic pole alignment of each linear motor is performed. The magnetic pole alignment is performed by driving each stage by controlling the drive system of each stage, moving the stage to the initial position while checking with an interferometer or other sensors, and maintaining the stage at the initial position. The driving state of each phase of the child coil is stored.

Conventionally, misalignment of the interferometer has been discovered during the magnetic pole alignment. However, it has been found that, in very rare cases, the stage may be at the initial position from the beginning, and the magnetic pole alignment may be terminated without driving the stage. As a result, even if there is a misconnection of the interferometer, it may not be found in the magnetic pole alignment.

Therefore, the projection exposure apparatus of the present embodiment executes the following initialization routine. FIG. 2 is a diagram showing a flowchart of the initialization routine. The initial setting routine is executed by the central control system 8 and is executed for each linear motor of each stage. However, in FIG. The same processing is performed for other linear motors. This routine is started immediately after the power of the projection exposure apparatus is turned on.

When the power of the projection exposure apparatus is turned on, first, in step S1, it is checked whether or not the connected interferometer is out of order. Specifically, the central control system 8 receives a signal from the connector 19 and checks whether the received signal is normal. Since the interferometers 7X, 7Y, 14X, and 14Y of the present embodiment output a digital signal together with a clock signal, it checks whether a clock signal is output or whether the digital signal is in a predetermined format. If it is determined that there is an abnormality in the signal and it is out of order, a predetermined warning process is performed. In the flowchart of FIG. 2, the warning process is omitted. In this step, not only the interferometers 7X, 7Y, 14X, and 14Y are out of order but also the case where the connector is disconnected or the wiring is disconnected or short-circuited is confirmed. The interface between each interferometer and the central control system 8 may be any type such as a serial interface or a parallel interface.

If it is determined in step S1 that there is no failure or the like in the interferometer, the operation proceeds to step S2. In step S2, the magnetic poles of the linear motor 12 are aligned. The magnetic pole alignment is to store the driving state of the armature coil for moving the stage to the initial position and holding it at that position. To move the stage to the initial position means that the wafer-side Y stage 10Y is mounted on the wafer-side X stage 10X, so that both stages are appropriately driven to set the wafer-side Y stage 10Y to a predetermined initial position. It is. For this reason, the central control system 8 controls the wafer stage drive system 1
6, the wafer-side Y stage 10Y and the wafer-side X stage 10X are appropriately driven. When it is confirmed by a sensor or the like (not shown) that the wafer-side Y stage 10Y has been set to the predetermined initial position, the driving state of the armature coil (not shown) of the stator 12A of the linear motor 12 at that time is stored. The alignment of the magnetic pole of a wafer stage or a reticle stage using a linear motor in a projection exposure apparatus is known (for example, Japanese Patent Application Laid-Open No. 8-250388).
Therefore, detailed description is omitted.

When the magnetic pole alignment of the linear motor 12 is completed in step S2, the process proceeds to step S3. Step S
In 3, the linear motor 12 is driven by a predetermined amount with a small thrust. The predetermined amount is, for example, a minute amount for one magnet distance.
In step S4, the central control system 8 inputs a signal of the interferometer connected to the connector 19, and checks whether or not the input signal has changed within a predetermined time by driving the linear motor 12 by a predetermined amount. That is, it is determined whether or not the wafer side stage 10X has moved slightly by driving the linear motor 12 by a predetermined amount. Actually, the movement of the wafer-side stage 10X moves the wafer-side stage 10Y mounted thereon,
The change in the position is confirmed by the wafer interferometer 14X. If it has changed, the process proceeds to step S5, where a flag indicating normality is set, and the process ends. If it does not change, the process proceeds to step S6, where the interferometer 14X sets a flag indicating incorrect connection, and ends. In other words, if there is no change, another interferometer, for example, a wafer interferometer 14Y for the Y-axis, is connected to the connector 19.

When the normal flag is set, the central control system 8 normally performs other predetermined processing. If the misconnection flag is set, an alarm or warning is displayed in another routine to notify the operator of the misconnection. Note that, even if the connection is erroneous, the linear motor 12 is driven with only a small amount by a small thrust in step S3, so that the linear motor 12 and other components are not broken.

As described above, in the exposure apparatus of the first embodiment, after the magnetic pole alignment is completed, the interferometer is checked by driving the linear motor 12 in a very small amount. Erroneous connection can be found without fail even if is not driven. In addition, since this check drives the linear motor 12 with only a small amount of force with a small thrust, even if there is an erroneous connection, the linear motor 12 itself and other components are not damaged. Note that all other linear motors are processed similarly.

-Second Embodiment- FIG. 3 is a diagram showing a flowchart of an initialization routine according to a second embodiment. The configuration of the projection exposure apparatus of the second embodiment is the same as that of the first embodiment shown in FIG. However, each of the interferometers 7X, 7Y, 1
4X, 14Y can set the address which can identify itself,
The signal (identification signal) can be output. For example, a DIP switch for setting an address is provided on a control circuit board inside each interferometer, and a different address is set for each interferometer.
It can be set by an IP switch. The DIP switch may set an address in a writable nonvolatile memory such as an EPROM.

The initialization routine shown in FIG. 3 is executed by the central control system 8 immediately after the power of the projection exposure apparatus is turned on. When the power of the projection exposure apparatus is turned on, first, in step S
At 11, the address of each interferometer connected to the connectors 17 to 20 is read. In step S12, it is determined whether each interferometer is normally connected to each connector based on the address read from each connector. A memory (not shown) of the central control system 8 stores a table of addresses of interferometers to be connected to each connector. The central control system 8 makes the determination with reference to the table.

When an address signal having normal specifications is not received from each of the connectors 17 to 20, a failure of the interferometer can be confirmed at the same time. That is, similar to the first embodiment,
If no clock signal is output from the interferometer or if the address signal is not in a predetermined format, it can be determined that the interferometer connected to the connector has failed.

If it is determined in step S12 that the connections of the interferometers are normal, the process proceeds to step S13, where a flag indicating normality is set, and the process ends. If it is determined that the connection is not normal, the process proceeds to step S14, and a flag indicating incorrect connection is set, and the process ends. Subsequent processing is the same as in the first embodiment.

As described above, by reading the address signal, erroneous connection of the interferometer can be found without driving the linear motor. Since the stage is not driven by the linear motor, the interferometer can be checked at any time, not only in the initialization routine.

Third Embodiment FIG. 4 is a flowchart showing an initialization routine according to a third embodiment. The configuration of the projection exposure apparatus according to the third embodiment is the same as that of the first embodiment shown in FIG. However, each of the interferometers 7X, 7Y, 1
As in the second embodiment, an address capable of identifying itself can be set in 4X and 14Y, and its signal (identification signal) can be output. In the following, the description will be limited to the linear motor 12 of the wafer stage device 10, but the same applies to other linear motors.

The initial setting routine of FIG. 4 performs both the processing of the initial setting routine of the first embodiment and the processing of the initial setting routine of the second embodiment. FIG.
Is executed by the central control system 8 immediately after the power of the projection exposure apparatus is turned on.

When the power of the projection exposure apparatus is turned on, first, in step S21, the addresses of the interferometers connected to the connectors 17 to 20 are read. In step S22, it is determined whether each interferometer is normally connected to each connector based on the address read from each connector.
A memory (not shown) of the central control system 8 stores a table of addresses of interferometers to be connected to each connector. The central control system 8 makes the determination with reference to the table.

When an address signal of a normal specification is not received from each of the connectors 17 to 20, a failure of the interferometer can be confirmed at the same time. That is, similar to the first embodiment,
If no clock signal is output from the interferometer or if the address signal is not in a predetermined format, it can be determined that the interferometer connected to the connector has failed.

If it is determined in step S22 that the connections of the interferometers are normal, the flow advances to step S23. Step S2
In step 3, the magnetic poles of the linear motor 12 are aligned. The magnetic pole alignment has the same contents as in the first embodiment.
On the other hand, if it is determined in step S22 that the connection of the interferometer 14X is not normal, the process proceeds to step S27, where a flag indicating that the interferometer 14X is erroneously connected is set, and the process ends. In addition,
In step S22, the connection of another interferometer is also checked, but for convenience of explanation, the explanation will be limited to the interferometer 14X.

When the alignment of the magnetic poles of the linear motor 12 is completed in step S23, the process proceeds to step S24. In step S24, the linear motor 12 is driven by a predetermined amount with a small thrust. The very small amount drive of the linear motor 12 is the first
This is the same as the embodiment. In step S25, the central control system 8 inputs a signal of the interferometer connected to the connector 19, and checks whether or not the input signal has changed within a predetermined time by driving the linear motor 12 by a predetermined amount. If it has changed, the process proceeds to step S26, where a flag indicating normality is set, and the process ends. Step S if not changed
Proceeding to step S27, the interferometer 14X sets a flag indicating incorrect connection, and terminates. Subsequent processing is the same as in the first embodiment.

As described above, the third embodiment is similar to the first embodiment.
In this embodiment, both the processing of the second embodiment and the processing of the second embodiment are performed. Thus, for example, even if the address of the interferometer is set erroneously and the erroneous connection cannot be detected by mistake, the erroneous connection can be reliably detected in the next step of driving the linear motor 12 by a predetermined amount. As a result, an erroneous connection can be found more reliably.

In the above embodiment, the example in which the stage is driven by the linear motor has been described. However, the present invention is not limited to this. The present invention is also applicable to a case where a stage is driven by a rotation motor such as a stepping motor or a DC motor.

The DIP switch according to the above embodiment has an EPR
The address may be set in a writable nonvolatile memory such as the OM. That is, any type may be used as long as the address and identification signal of each interferometer can be set freely.

In the above embodiment, the position of the stage is detected by the interferometer. However, the present invention is not limited to this. Any device that can detect the position of the stage may be used.

In the above embodiment, the example of the stage device in the projection exposure apparatus has been described. However, the present invention is not limited to this. The present invention can be applied to any stage apparatus that carries a moving object and moves the object.

The exposure apparatus of the present embodiment can be applied to a scanning type exposure apparatus that exposes a mask pattern by moving a mask and a substrate synchronously. A scanning type exposure apparatus is disclosed, for example, in US Pat. No. 5,473,410, and the present invention is applicable to such an exposure apparatus.

The exposure apparatus of the present embodiment can be applied to a proximity exposure apparatus that exposes a mask pattern by bringing a mask and a substrate into close contact without using a projection optical system.

The application of the exposure apparatus is not limited to the exposure apparatus for manufacturing semiconductors. For example, the present invention can be widely applied to a liquid crystal exposure apparatus for exposing a liquid crystal display element pattern to a square glass plate and an exposure apparatus for manufacturing a thin film magnetic head.

The light source of the exposure apparatus of this embodiment is g
Line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), ArF excimer laser (19
3 nm), not only the F ₂ laser (157 nm) only, it is possible to use a charged particle beam such as X-ray or electron beam. For example, when an electron beam is used, thermionic emission type lanthanum hexaborite (LaB6), tantalum (Ta)
Can be used. Further, when an electron beam is used, a structure using a mask may be used, or a pattern may be formed on a substrate by direct drawing using an electron beam without using a mask.

The magnification of the projection optical system may be not only a reduction system but also any one of an equal magnification and an enlargement system.

When far ultraviolet rays such as an excimer laser are used as the projection optical system, a material that transmits far ultraviolet rays such as quartz or fluorite may be used as a glass material. If an F ₂ laser or X-ray is used, use a catadioptric or refractive optical system (use a reticle of a reflective type).
When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

Vacuum ultraviolet light (V
In an exposure apparatus using (UV light), a catadioptric optical system may be used as the projection optical system. Examples of the catadioptric optical system include, for example, Japanese Patent Application Laid-Open No. Hei 8-171504 and US Pat. No. 5,668,67 corresponding thereto.
2, a catadioptric optical system having a beam splitter and a concave mirror as a reflective optical element, as disclosed in Japanese Patent Application Laid-Open No. 10-20195 and US Pat. No. 5,835,275 corresponding thereto. Can be used. Further, Japanese Patent Application Laid-Open No. 8-334695 and US Patent No. 5,689,377 corresponding thereto, and Japanese Patent Application Laid-Open No. 10-3039 and US Patent Application No. 873605 corresponding thereto (filing date: 1997) June 12,
And the like, a catadioptric optical system having a concave mirror or the like can be used without using a beam splitter as a reflective optical element. The present invention is also applicable to an exposure apparatus having such a projection optical system.

In addition, US Pat. No. 5,031,976
Nos. 5,488,229 and 5,717,518
Nos. 1 and 2, a plurality of refractive optical elements and two mirrors (a primary mirror that is a concave mirror, and a sub-mirror that is a back-side mirror in which a reflection surface is formed on the reflection element or a plane opposite to the plane of incidence of the plane-parallel plate).
Are arranged on the same axis, and a catadioptric optical system that re-images an intermediate image of the reticle pattern formed by the plurality of refractive optical elements on the wafer by the primary mirror and the secondary mirror can be used. Good. In this catadioptric optical system, a primary mirror and a secondary mirror are arranged following a plurality of refractive optical elements, and illumination light reaches a wafer through a part of the primary mirror.

The catadioptric projection optical system has, for example, a circular image field, is telecentric on both the object side and the image side, and has a projection magnification of 1/4 or 1 / x. It is also possible to use a five-fold reduction system. In the case of a scanning exposure apparatus having this catadioptric projection optical system, the irradiation area of the illumination light has its optical axis substantially centered within the field of view of the projection optical system and is substantially perpendicular to the scanning direction of the reticle or wafer. It may be of a type defined in a rectangular slit shape extending along the direction of movement.
According to such a scanning exposure apparatus, for example, the wavelength 15
Be used F ₂ laser beam 7nm as exposure illumination light 1
It is possible to transfer a fine pattern of about 00 nm L / S pattern onto a wafer with high accuracy. The present invention is also applicable to an exposure apparatus having such a projection optical system.

As the linear motor of the wafer stage or the reticle stage, either an air floating type using an air bearing or a magnetic floating type using a Lorentz force or a reactance force may be used. Further, the stage may be of a type that moves along a guide, or may be a guideless type in which a guide is not provided.

When a plane motor is used as the stage driving device, one of the magnet unit and the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is provided on the moving surface side of the stage. Good. As the planar motor, for example, a configuration disclosed in Japanese Patent Application Laid-Open No. H11-27925 can be used.

The reaction force generated by the movement of the wafer stage may be mechanically released to the floor (ground) by using a frame member as described in Japanese Patent Application Laid-Open No. 8-166475. The present invention is also applicable to a wafer stage having such a reaction force processing mechanism.

The reaction force generated by the movement of the reticle stage may be mechanically released to the floor (ground) using a frame member as described in Japanese Patent Application Laid-Open No. 8-330224. The present invention is also applicable to a reticle stage having such a reaction force processing mechanism.

The exposure apparatus according to the embodiment of the present invention includes the components (eleme) described in the claims of the present application.
It is manufactured by assembling various subsystems including nts) so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. After the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustments including electrical adjustment, operation confirmation, and the like are performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

As shown in FIG. 5, in the semiconductor device, a step S301 for designing the function and performance of the device, a step S302 for manufacturing a mask (reticle) based on this design step, and a step S303 for manufacturing a wafer from a silicon material A wafer processing step S304 of exposing a reticle pattern to a wafer by the exposure apparatus of the above-described embodiment, and a device assembling step (including a dicing step, a bonding step, and a package step) S3
05, manufactured through the inspection step S306 and the like.

Hereinafter, the device manufacturing method will be described in more detail. FIG. 5 shows the devices (IC and LSI semiconductor chips, liquid crystal panels, CCDs, thin-film magnetic heads,
The flowchart which shows an example of the example of manufacture of a micromachine etc.) is shown. As shown in FIG. 5, first, in step S301 (design step), device functions and
A performance design (for example, a circuit design of a semiconductor device) is performed, and a pattern design for realizing the function is performed. Subsequently, in step S302 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S303 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step S304 (wafer processing step), steps S301 to S303
Using the mask (reticle) and the wafer prepared in the above, an actual circuit or the like is formed on the wafer by lithography technology or the like, as described later. Next, in step S305 (device assembly step), device assembly is performed using the wafer processed in step S304. Step S305 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.

Finally, in step S306 (inspection step), inspections such as operation confirmation dest and a durability test of the device manufactured in step S305 are performed. After these steps, the device is completed and the device is shipped.

FIG. 6 shows a detailed flow example of step S304 in the case of a semiconductor device. In FIG. 6, in step S311 (oxidation step), the surface of the wafer is oxidized. In step S312 (CVD step), an insulating film is formed on the wafer surface. In step S313 (electrode forming step), electrodes are formed on the wafer by vapor deposition. In step S314 (ion implantation step), ions are implanted into the wafer. Step S3 above
Each of the steps 11 to S314 constitutes a preprocessing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage.

At each stage of the wafer process, when the above-described pre-processing step is completed, a post-processing step is executed as follows. In this post-processing step, first, step S
At 315 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step S316 (exposure step), the circuit pattern of the mask (reticle) is transferred to the wafer using the exposure apparatus of the present embodiment.
Next, the wafer exposed in step S317 (development step) is developed, and in step S318 (etching step), the exposed member surface other than the portion where the resist remains is removed by etching. Then, in step S319 (resist removing step), unnecessary resist after etching is removed.

By repeating these pre-processing and post-processing, multiple circuit patterns are formed on the wafer.

[0061]

Since the present invention is configured as described above, it has the following effects. According to the first and second aspects of the invention, the motor is driven by a predetermined amount after the magnetic pole alignment is completed.
Since the quality of the connection between the position detection device and the control device is determined, an erroneous connection can be reliably detected even if the stage is not driven due to magnetic pole alignment. Moreover,
In this check, the motor is driven with only a small amount by a small thrust, so that even if there is an erroneous connection, the motor itself and other components are not damaged. According to the third aspect of the present invention, since the connection between the position detecting device and the control device is determined based on the identification signal of each position detecting device, an erroneous connection can be found without driving the motor. In addition, since the stage is not driven by the motor, it is possible to confirm which position detecting device is connected not only at the time of initial setting but also at any time. The invention according to claims 4 and 5 has the above-described effects in the exposure apparatus. The invention of claim 6 has the above-described effects when manufacturing the device according to the invention. The invention of claim 7 has the above-mentioned effects when the device manufacturing method according to the invention is used.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a schematic configuration of a projection exposure apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating a flowchart of an initial setting routine according to the first embodiment.

FIG. 3 is a diagram illustrating a flowchart of an initialization routine according to a second embodiment.

FIG. 4 is a diagram illustrating a flowchart of an initialization routine according to a third embodiment.

FIG. 5 is a view illustrating a flowchart illustrating a semiconductor manufacturing process.

FIG. 6 is a diagram showing a detailed flowchart of step S304 in FIG. 5;

[Explanation of symbols]

 R Reticle W Wafer IL Exposure light PL Projection optical system 1 Illumination optical system 2 Dichroic mirror 3X Reticle-side X stage 3Y Reticle-side Y stage 4 Reticle base 5A, 12A Linear motor stator 5B, 12B Linear motor mover 6X Moving mirror 7X, 7Y reticle interferometer 8 Central control system 9 Reference mark member 10X Wafer-side X stage 10Y Wafer-side Y stage 11 Wafer base 13X Moving mirror 14X, 14Y Wafer interferometer 15 Reticle stage drive system 62 Wafer stage drive system

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/30 525D

Claims (7)

[Claims] 1. A stage on which a moving object is mounted, a motor for driving the stage to move the moving object in a predetermined direction, and a position of the stage in the predetermined direction is detected and detected. A first position detection device that outputs a signal corresponding to a position, a second position detection device that detects a position of the stage in a direction different from the predetermined direction, and outputs a signal corresponding to the detected position. A control in which the first position detection device and the second position detection device are connected, and the driving of the motor is controlled while monitoring a signal from a connection portion to which the first position detection device is to be connected. A stage device comprising a device, wherein the control device controls the drive of the motor to perform magnetic pole alignment of the motor, and after the magnetic pole alignment is completed, drives the motor by a predetermined amount to perform the magnetic pole alignment. Receiving a signal from the connection part, a stage apparatus characterized by determining received based on said signal a first position detecting device and the quality of the connection between the control device. 2. The stage device according to claim 1, wherein the control device performs magnetic pole alignment of the motor when the stage device is started. 3. A stage on which a moving object is mounted, a motor for driving the stage to move the moving object in a predetermined direction, and a position of the stage in the predetermined direction is detected and detected. A first position detection device that outputs a signal corresponding to a position, a second position detection device that detects a position of the stage in a direction different from the predetermined direction, and outputs a signal corresponding to the detected position. A control in which the first position detection device and the second position detection device are connected, and the driving of the motor is controlled while monitoring a signal from a connection portion to which the first position detection device is to be connected. A stage device comprising: a first position detection device and a second position detection device, each of which outputs an identification signal capable of identifying itself, and wherein the control device outputs an identification signal from the connection unit. Receiving a stage apparatus characterized by determining the quality of the connection of the received and based on said identification signal first position detecting device and the control device. 4. An exposure apparatus for forming a predetermined pattern on a substrate, comprising: the stage apparatus according to claim 1. Description: 5. The stage device according to claim 4, wherein the exposure device exposes a pattern formed on a mask onto the substrate, and the stage device mounts at least one of the substrate and the mask. An exposure apparatus characterized by moving. 6. A device manufactured by the exposure apparatus according to claim 4. Description: 7. A device manufacturing method, comprising the steps of preparing the exposure apparatus according to claim 4 and performing exposure using the exposure apparatus.