JP2001123319A - Mouthpiece for shaping and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shaping mouthpiece in which flow way shape whose processing have been impossible or difficult or flow way shape whose processing cost has been increased can easily be formed at a low cost. SOLUTION: This mouthpiece (1) for shaping is formed from plural plates (2) comprising a same kind and quality of a metal material. Flow ways (3, 5) for polymer materials are dividedly processed in the plates (2), and residual stresses generated on the processing of the flow ways are removed. A pure nickel solid phase thin film is formed on the bonding surface of the plate (2), and then the divided flow ways are matched and bonded to each other by a solid phase diffusion bonding method. The obtained mouthpiece (1) for shaping has a nickel-containing diffusion bonded region (7) on the solid phase diffusion bonded surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a spinneret for forming a polymer material into a desired shape, for example, melt spinning, dry spinning, wet spinning, etc., and various molding die for blow molding, extrusion molding and the like. The present invention relates to a molding die and a method of manufacturing the same.

[0002]

BACKGROUND OF THE INVENTION Generally,
This type of forming die is processed by various processing methods alone or in combination, such as mechanical processing such as drilling, end milling, and punching, electric discharge processing, and etching. In recent years, in order to impart high performance and high added value, complicated shapes and structures of shaped articles are required, and at the same time, the flow path of the shaping die is also required to have a complicated and precise shape. However, depending on the shape of the flow path in the forming die, there are also shapes that cannot be processed by the current processing method and shapes that greatly increase the processing cost, and the desired shaped product cannot be obtained. Was.

Conventionally, a method of manufacturing a breaker plate having a large number of openings formed in a thin plate material, and laminating those plate materials to form an integrated structure by diffusion bonding or sintering is disclosed in, for example, JP-A-3-241002. Have been. Further, for example, Japanese Patent Application Laid-Open No. 4-323393 discloses a micro nozzle applied to an ink jet printer manufactured by diffusion bonding. In these methods, members having a thickness of at most about 2 mm are bonded to each other, and a predetermined shape can be obtained after bonding without performing a process of removing a stress remaining on a processed member before bonding. is there. Further, since the tempering of the materials to be joined disclosed in these publications is not the same, the coefficients of linear expansion of the materials are different, and the members may be greatly deformed by the high-temperature treatment during the joining. In particular, JP-A-3-241002
In the jointed component disclosed in Japanese Patent Application Laid-Open Publication No. H11-284, since the opening area of the component is sufficiently larger than the joint area, distortion after joining is not a problem.

On the other hand, in the case of the molding die to which the present invention is applied, the thickness of the members to be joined varies widely depending on the use conditions and purposes, and in many cases, a thick member of several millimeters or more and a thin member of several millimeters or less. When joining is performed without removing stress remaining on the member before joining, the member is deformed and a predetermined shape cannot be obtained. This is fatal for this type of molding die which aims to uniformly shape and discharge or extrude from a large number of precisely machined discharge holes or extrusion ports. In addition, in the case of this type of forming die, the flow path shape of the polymer material formed in the die is often precise and complicated, and in the case of only processing a thin plate material to be laminated and joined, On the other hand, there may be many independent joining surfaces on the same plane at the time of joining, and conversely, precise joining techniques such as alignment at the time of joining are required.

[0005] Alternatively, a method is also conceivable in which a flow path is processed in a state in which the polymer material flow path portion of the shaping die is divided, and these divided members are fastened and integrated by bolts or the like. The jig for fastening the joint takes up an arrangement space, which makes it difficult to make the shaping die compact, and inevitably reduces the effective area of the shaping part in the die.

[0006] Further, after the base material is divided and the flow path, the discharge port, and the extrusion port are processed, bonding can be performed by fusion bonding, brazing bonding, liquid phase insert diffusion bonding, or the like. In some cases, when the periphery of the flow path is joined to melt the work member or liquefy the brazing material, a predetermined flow path shape cannot be maintained or the flow path may be closed.

Therefore, the present applicant first processes the flow path of the polymer material on a plurality of plates made of the same kind and the same kind of metal material, and then performs a stress removing process such as annealing. We have proposed a die for polymer material shaping which joins each plate by solid-phase diffusion bonding. By making the material of each plate the same kind and the same, and by removing the stress of each plate before joining by the solid phase diffusion joining method, even if the plate has a thickness of about 10 mm, for example, The deformation can be suppressed, and the bonding strength between the plates can be improved.

However, the solid-phase diffusion bonding method is a method of bonding metal surfaces to be bonded in a solid state by applying pressure and heat without significant deformation.
Therefore, in order to join strongly, the joining surface needs to be smooth with few irregularities and clean without an oxide film or an oil film. Further, in order to achieve the close contact of the bonding surface, it is necessary to increase the pressing force at the time of bonding and uniformly pressurize in addition to the above-mentioned surface condition of the bonding surface. Therefore, in order to achieve strong bonding by the solid-phase diffusion bonding method, the number of surface treatment steps for the bonding surface increases, and precise control of the pressing conditions must be performed.
Not only does production efficiency decrease, but it also increases costs.

SUMMARY OF THE INVENTION It is an object of the present invention to facilitate the workability of a flow path shape which has been conventionally impossible or difficult to process and a flow path shape in which the processing cost is increased, the number of manufacturing steps is small, and each process operation is difficult. It is an object of the present invention to provide a polymer material forming die and a method for manufacturing the same, which can easily control the conditions at the same time and can keep the manufacturing cost low.

[0010]

This problem is solved by the present invention. That is, the invention according to claim 1 is a variety of bases for shaping a polymer material having a flow path of the polymer material, wherein the bases are made of a plurality of divided metal materials of the same kind and the same kind. The flow passage is divided into two or more parts and processed, and the divided flow passages are joined to each other by solid-phase diffusion bonding. The solid-phase diffusion bonding surface includes a diffusion bonding region containing a metal different from the metal material. Is characterized by being interposed.

Further, as a method of manufacturing the shaping die, the invention according to claim 6 is a method of manufacturing a shaping die having a flow path of a polymer material, wherein a plurality of divided members are made of the same kind. And made of the same metal material, dividing the channel into the divided members and processing the same, removing residual stress from the divided members when processing the flow channel, and joining the divided members to each other. The method is characterized in that a solid phase thin film made of a metal different from the metal material is formed on one or both of the surfaces, and the joining surface is joined by the solid phase diffusion joining method via the solid phase thin film.

[0012] The shape of the flow channel of the shaping die is rarely a simple linear shape, for example, a curved shape,
In many cases, the flow path has a complicated shape in which the curved flow path is further merged or branched. Since such a flow path cannot be processed in a single step by laser processing or etching as well as a single mechanical processing in the first place, the flow paths in the related art have been conventionally used. Divide the base material into a form that allows for the processing of the desired flow path, process the desired flow path, combine the processing surfaces and fasten with bolts as described above, or perform fusion welding, brazing welding, liquid phase We perform joining by insert diffusion joining method,
Problems such as those described above occur in such joining and the like.

In the present invention, the flow channel processing is the same as the conventional one, but the diffusion bonding method disclosed in the above-mentioned publication, in particular, the solid phase diffusion bonding method is employed for the bonding. However, even in this solid-phase diffusion bonding method, if the materials to be bonded and the conditions at the time of processing the flow path do not match, high-precision bonding is difficult due to their physical properties and processing history. In addition, since the bonding is performed in a solid state, the bonding state depends on the surface state of the bonding surface as described above. Therefore, in the forming die of the present invention, the solid-phase diffusion bonding method is employed as described above, and the metal material of the die is made of the same material. After removing the residual stress, solid-phase diffusion bonding is performed by matching the corresponding divided channels, and further, a diffusion bonding region containing a metal different from the metal material is interposed on the bonding surface. I have.

Here, the shaping die of the present invention is capable of uniformly discharging or extruding a polymer material in a specific shape. It is impossible in the process, and refers to a molding die obtained by using the solid phase diffusion bonding method as described above. The shaping die of the present invention thus obtained has a reduced processing cost,
Further, unexpected advantages such as improvement of pressure resistance and abrasion resistance at the time of shaping are obtained. In addition, the channel in the mouthpiece in the present invention refers to all portions where the shaping mouthpiece and the polymer material are in contact, and the shape is not particularly limited, and there are a through hole, a distribution groove, a slit portion, and the like. is there.

The fact that the flow channel of the present invention is divided into at least two or more means that a portion of the shaping die that enables processing of the flow channel is processed in advance into a separate plate, The division position is appropriately changed according to the difficulty and the shape of the processing.

The removal of residual stress according to the present invention is to remove a stress remaining inside the divided material by processing when a flow path of a polymer material such as a hole or a groove is processed into a divided material of a forming die. That means. The method and processing conditions for removing the residual stress vary depending on the material of the shaping die. However, due to the stress removal, the divided material is heated during the subsequent solid phase diffusion bonding, or cooled after the bonding. It is important that no distortion occurs in such cases. As a method of removing the residual stress, it is generally desirable to employ a heat treatment, for example, a treatment method such as annealing.

On the other hand, it is possible to employ a method in which stress is hardly generated as a processing method of the flow path to the divided material or the like, but it is impossible to reduce the residual stress by all the processing methods. Considering the complexity and cost of finding a processing method that does not generate stress due to processing, it is most economical and effective to remove stress by heat treatment or the like. The removal of the residual stress may be performed by itself, but heating and cooling at the time of joining may be used together. However, since the heat treatment conditions for the residual stress vary depending on the thickness and size of the divided material, it is necessary to raise and lower the temperature so as to make the temperature of the divided material uniform, avoiding rapid heating and rapid cooling. .

The solid-phase diffusion bonding used in the present invention is a kind of diffusion bonding method, in which bonding surfaces are bonded in a solid state under pressure and under heating or non-heating as described above. .
On the other hand, a method in which a dissimilar metal (insert material) is inserted into a joining surface and melted and joined using the liquefied insert material as a medium is called liquid phase diffusion joining.

In the present invention, after forming a solid-phase thin film made of a metal different from the above-mentioned metal material on one or both of the opposing bonding surfaces, the two bonding surfaces are bonded by solid-phase diffusion bonding. At the time of the solid phase diffusion bonding, the material and the bonding temperature of the solid phase thin film are controlled so as not to be liquefied. The solid phase thin film does not liquefy at the time of bonding, but functions to increase the adhesion between bonding surfaces, promote diffusion, and promote bonding. That is, the solid-phase thin film of the present invention is different from an insert material that liquefies in liquid-phase diffusion bonding and fills a gap between bonding surfaces.

As described above, by forming the solid phase thin film on one or both of the bonding surfaces in advance, the adhesion between the bonding surfaces is increased, and the metal of the solid phase thin film is diffused to the member to be bonded.
Diffusion between the joining surfaces is promoted, a good joining state is established between the joining surfaces, and the opposing divided members are joined and integrated. In addition, since the solid-phase thin film is joined by solid-phase diffusion bonding without liquefaction, the solid-phase thin film melts and flows into the flow path of the polymer material at the time of bonding, thereby deforming the flow path shape or closing the flow path. The inconvenience such as described above does not occur.

Since the shaping die thus manufactured is subjected to a stress removing treatment before the diffusion bonding, no distortion occurs in the shaping die at the time of bonding or after bonding, and the shape of the flow path is maintained. You. Further, since the diffusion bonding region containing a metal different from the metal material is interposed on the solid phase diffusion bonding surface,
The joining surfaces are strongly joined. In addition, since the solid-phase diffusion bonding is employed, a high-quality shaped die can be obtained without the inconvenience that the material of the metal thin film flows into the flow path or closes the flow path. Although the diffusion bonding region contains a metal different from the metal material as described above, the content of the metal gradually increases as approaching the bonding surface.

The invention according to claims 2 and 3 defines the dividing direction of the flow path. In the invention according to claim 2, the flow path is divided along a cross section.
This is because the flow path form is simple and, for example, when the diagonal length of the cross-sectional shape of the flow path is dmm and the flow path length is Lmm, d ≦ 1.0 and L / d ≧ 1.0. This is effective when the flow path extends over a long dimension, that is, when the flow path is linear and the thickness of the base must be increased.
Further, in the invention according to claim 3, the flow path is divided along a vertical section, and the flow path form extends in a curved shape, or the flow path branches or merges in the middle. It is especially effective when you are doing.

In the invention according to claim 4, the metal different from the metal material contained in the diffusion bonding region is nickel. The metal is not limited to nickel, and may be any metal that does not liquefy at the processing temperature during solid phase diffusion bonding and has a melting point that can maintain a solid phase state. Further, it is preferable to use a metal that has a high affinity with the metal material of the shaping die, provides sufficient bonding strength, and further has excellent heat and corrosion resistance.

[0024] The invention according to claim 5 stipulates that stainless steel is used as a base material. Since it is essential that deformation of the shaping die, such as distortion, warping, etc. occurring after bonding, and bending due to the discharge pressure during spinning, be suppressed to the utmost, the same material of the same type and the same material in the present invention is the same. It is to make the history before joining the same kind of material such as heat treatment. Basically, it is desirable that the linear expansion coefficients of the materials be the same in the temperature range of the high-temperature treatment at the time of joining, but since the linear expansion coefficients differ greatly depending on different types of materials and types of refining, It is necessary to use the same kind of metal with the same quality, and stainless steel having excellent workability and corrosion resistance is preferable.

According to the present invention, the solid-phase thin film is formed by electrolytic plating. The method of forming the solid phase thin film is not limited to electrolytic plating, and any film forming method such as various kinds of vapor deposition may be adopted. Preferably, the above-mentioned electrolytic plating is performed.
For example, when using nickel as the metal of the solid phase thin film,
If the plating process is electroless (chemical) plating, impurities such as phosphorus are present in the plating, so that a pure nickel thin film cannot be formed. The presence of such impurities lowers the melting point, so that even when solid-phase diffusion bonding is attempted, the nickel thin film is liquefied and flows into the channel of the shaping die, and the channel shape is deformed. Or the flow path may be closed.

The same effect as that of the present invention can be obtained by performing solid phase insert diffusion bonding by inserting a pure nickel metal foil between the bonding surfaces instead of forming a solid phase thin film on the bonding surface. It is possible. However, since the holes and grooves of the flow path are formed on the joint surface, the metal foil must be processed according to the shape of the joint surface, and the grooves and holes are aligned to interpose the metal foil. Since it must be mounted, the number of steps increases and the operation becomes complicated. From the viewpoint of such work efficiency, it is preferable to form a solid phase thin film on the joint surface in advance by plating or the like as in the present invention.

In the formation of the solid phase thin film, from the viewpoint of performing bonding in a solid state later, it is desirable to finish the entire surface of the bonding surface and the local surface roughness to a lesser degree and to a high degree. Finish so that the surface roughness is 1 μm or less, more preferably 0.4 μm or less.

Furthermore, according to the invention of claim 8, the thickness a of the solid phase thin film is 0.1 μm ≦ a ≦ 75 μm,
More preferably, the thickness a of the solid phase thin film is 0.1 μm ≦ a
≦ 50 μm. When the film thickness is 0.1 μm or less, it is not preferable because the solid phase thin film may not be formed uniformly on the bonding surface, though it depends on the surface condition of the bonding surface. On the other hand, when the thickness is 75 μm or more, the time and cost required for forming the solid phase thin film increase, which is not preferable.

As the pressure at the time of joining, any method may be used as long as a force acts so that the joining surfaces come into close contact with each other. For example, there is a method of sandwiching with a fastening jig or placing a weight.
Preferably, the adhesive strength is such that plastic deformation is not generated as much as possible.

Heating at the time of joining is various, such as arc heating, electric resistance heating, heating by radiant heat, heating by heat transfer, and non-heating. Preferably, heating by radiant heat or heat transfer is preferable.
At this time, it is more preferable to avoid a rapid temperature change and to make the temperature of the divided material uniform.

According to the ninth aspect of the present invention, at the time of joining by the solid phase diffusion joining method, the method includes holding the divided material at a temperature equalizing treatment temperature for a certain period of time and then increasing the temperature to the joining temperature. I have.

Here, the bonding temperature means a temperature at which bonding starts due to diffusion. By maintaining the divided material at a soaking temperature slightly lower than the joining temperature for a certain period of time in this way, the divided material has a uniform temperature throughout its interior, eliminating temperature unevenness, and preventing distortion and warping. Generation can be suppressed.

It should be noted that the soaking process is performed at a temperature approximately 5 times lower than the joining temperature so that the temperature can be raised to the joining temperature in a short time after the soaking process.
It is preferable to carry out at a temperature lower by 0 ° C. If the soaking temperature is lower than the joining temperature by 50 ° C. or more, a temperature unevenness occurs in the member when the temperature is raised to the soaking temperature, and there is a concern that large distortion or warpage may occur.

Further, in the treatment by the solid-phase diffusion bonding method, in particular, the rate of temperature rise from about 300 ° C. and the cooling rate to about 300 ° C. minimize the occurrence of distortion, warpage, and the like to obtain a good bonding state. In order to do this, you need to relax. According to the tenth aspect of the present invention, the method includes increasing the temperature to the bonding temperature, maintaining the temperature for a predetermined time, and then gradually cooling.

Specifically, the cooling rate is 5 ° C./min. Or less, more preferably 2 ° C./min. Hereinafter, further, 0.
5 ° C / min. 1 ° C./min. The following is preferred.

The temperature rise to the soaking temperature is 1
0 ° C./min. It is preferable to set the value as below.
5 ° C / min. 1 ° C./min. It is more preferable to set the following.

However, if the heating rate and the cooling rate are too slow, the time required for the joining process is increased, which not only increases the processing cost but also exposes the die to a high temperature for a long period of time. It is preferable to set the value within the above-mentioned range, since there is a possibility that the number of members may be increased, resulting in inconvenience such as chipping. The heat treatment time from the temperature rise to the cooling at the time of joining is preferably 2 hours or more, more preferably 8 hours or more, and further preferably 15 hours or more.

The joining is preferably performed in a vacuum furnace or in a furnace replaced with an inert gas atmosphere so that an oxide film is not formed. Further, in order to increase the bonding strength, the bonding surface is preferably mirror-finished with a center line average roughness of 0.8 μm or less so that the bonding surface is more closely adhered. The mirror finish can be performed after the formation of the solid phase thin film. However, when the solid phase thin film is formed by electrolytic plating, it is preferable that the joint surface is mirror-finished before plating.

It is desirable that the magnitude of deformation such as distortion or warpage be as small as possible in view of the characteristics of the shaping die, and it is natural that no deformation occurs after bonding.
Deformation caused by joining after joining may be removed by post-processing. Preferably, when used as a shaping die, it is ideal that the flatness of the superimposed surface or the discharge surface is both within a tolerance of 1 mm with respect to the size of the shaping die discharge surface. Preferably, the flatness tolerance should be within 0.5 mm.

In particular, when the spinneret is a spinneret, it is preferable that the thickness of the spinneret be large in order to improve the pressure resistance during spinning used for spinning. However, if the thickness is too large,
Since the processing time and the processing cost are increased, and the weight is also increased, the handling property is reduced. Therefore, it is preferable that the thickness of the processed plate be kept to a minimum necessary for exhibiting the function as a molding die.

There may be a plurality of joint surfaces in one die. However, if the number of joint surfaces is too large, the processing cost increases due to the misalignment of the hole and the increase in the number of finished portions of the joint surface. Therefore, it is preferable to reduce the performance as much as possible. The bonding may be performed several times, but it is preferable to perform the bonding a smaller number of times in order to suppress deformation or the like due to repeated heating and cooling.

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below based on typical illustrated examples and comparative examples. The present invention is, of course, not limited to these. Embodiment 1 FIGS. 1 and 2 show a molding die 1 according to Embodiment 1 of the present invention. The channel form of the base 1 includes an outlet channel 5 that extends vertically downward and joins two vertically extending inlet channels 3. The shaping die 1 has a square shape with an upper surface of 130 mm on a side, and a flow path having the above-described shape is formed in the die 1 in the same horizontal plane with 200 holes. Each channel has a cylindrical shape, the diameter D is 0.4 mm, and the width W of the plate 2 to be joined is 1
0 mm, the hole length L1 of the inlet channel 3 is 10 mm, the hole length L2 of the outlet channel 3 is 5 mm, and the distance P between the two inlet channels 3 is 5 mm.

First, the bonding surface 4 is
A vertical plane connecting the center lines of the flow paths was determined, and flow processing was performed on each plate 2 of SUS316 so as to have a shape divided by this plane. Thereafter, in order to remove the stress due to the channel processing from the plate 2, a force of 784.5 N was applied to a wide surface of the plate 2 in a heating furnace, and an annealing treatment at 1030 ° C. for 30 minutes was performed on each plate 2. It was applied to. Next, the surface to be joined (joining surface 4) was subjected to electrolytic nickel plating. In this embodiment, the electrolytic nickel plating treatment is performed by masking the inner surface of the flow path of each plate 2 and then immersing the plate 2 in a nickel sulfate solution adjusted to pH 4.8 for 40 seconds. As shown in FIG. 2, a solid nickel thin film 6 having a thickness of about 1 μm was formed on the bonding surface 4.

Thereafter, the plates 2 were overlapped so that the processed flow paths 3 were made to coincide with each other to have the above-mentioned shape, and the surfaces (joining surfaces 4) divided by the solid phase diffusion bonding method were joined. The solid-phase diffusion bonding conditions at this time were as follows:
^{Under -10} MPa (abs), a force of 784.5N is applied. Further, the heating and cooling are controlled so as to have a temperature profile shown in the graph of FIG.
The temperature is maintained at a temperature lower by 50 ° C. for 1 hour to perform a soaking process. Diffusion bonding regions 7 containing nickel are formed on opposing bonding surfaces of the shaping die 1 after bonding. In the diffusion bonding region 7, the nickel content gradually increases as approaching the bonding surface.

In the shaping die 1, since the plurality of plates 2 are made of the same kind and the same kind of metal material, and the stress is sufficiently removed after the passage processing, the die 1 is distorted after the joining. Therefore, it is possible to obtain a high quality molding die 1 having a desired flow path configuration. Further, at the time of joining, the solid-phase thin film 6 made of pure nickel promotes diffusion, so that the joining strength can be improved, the joining surfaces 4 are strongly joined together, and the joining surface 4 does not peel off after spinning. Did not. Furthermore, since the solid-phase thin film 6 does not liquefy because of solid-phase diffusion bonding, no blockage of the flow path is observed in the shaping die 1, and the shaping of the polymer material by the shaping die is not performed. It has become possible. In this way, a molding die having a flow path configuration that has been conventionally impossible or difficult to process can be easily obtained, and at the same time, a molding die having a flow path configuration having a high processing cost can be obtained. It could be obtained at low processing cost. (Embodiment 2) After the same flow path processing was performed on each plate of SUS 316, which was the same as the above-described embodiment 1, the same stress removing process as that of the embodiment 1 was performed. Next, electrolytic nickel plating was applied to the surface to be joined to form a solid nickel thin film having a thickness of about 2 μm. Thereafter, the processed flow paths were overlapped with each other and joined by a solid-phase diffusion bonding method. At this time, the furnace was filled with hydrogen gas under a solid-phase diffusion bonding condition using a vacuum furnace at a degree of vacuum of 3 × 10 ⁻¹⁰ MPa (abs). The heating and cooling were controlled so as to have the temperature profile shown in the graph of FIG.
The temperature is maintained at a temperature lower by 50 ° C. for 1 hour to perform a soaking process. From the start of heating up to 400 ° C and 300 ° C
The net time required for joining, excluding cooling from the temperature to the normal temperature, is about 20 hours, and the temperature rise and cooling are gradually performed over time. During cooling from 300 ° C. to room temperature, the inside of the furnace was replaced with nitrogen gas.

Diffusion bonding regions 7 containing nickel are formed on opposing bonding surfaces of the shaping die 1 after bonding, and the bonding surfaces are strongly bonded to each other. In the diffusion bonding region 7, the nickel content gradually increases as approaching the bonding surface. In addition, the flatness of the shaping die after joining is 0.5 mm for both the ejection and the size of the superimposed surface, and no obstruction of the flow path is observed after joining,
The polymer material can be shaped by the shaping die.
Furthermore, no peeling of the bonding surface was observed after spinning. (Embodiment 3) FIG. 3 shows a molding die 1 according to Embodiment 3 of the present invention. The base 1 has a flow path form of a polymer material having a part having a very small hole diameter of 0.075 mm in diameter, and is provided at a lower end of a large diameter inlet flow path 3 having a diameter of 0.4 mm and extending vertically downward. , An outlet channel 5 having a small diameter of 0.075 mm is connected. According to the present embodiment, the inlet channel 3 is vertically divided into three parts, and the inlet channel 3 and the outlet channel 5 are horizontally divided at the switching portion. It is configured by laminating and joining two plates 2 up and down.

That is, the inlet channels 3a to 3c having the same diameter are pierced at the same positions of the three plates 2, respectively.
The inlet channels 3a to 3c of the remaining one plate 2 are centered on positions corresponding to the center positions of the inlet channels 3a to 3c.
The outlet channel 5 having a diameter smaller than 3c is pierced. The inlet channels 3a to 3c and the outlet channel 5 have 700 holes formed in each plate 2 at a predetermined interval (0.6 mm × 1.2 mm).

After processing the flow path, a stress removing process is performed.
Next, electrolytic nickel plating was performed on the surface to be joined to form a solid phase thin film of pure nickel. Then, each plate 2
The inlet channels 3a to 3c formed at the corresponding positions of
And the upper and lower layers were stacked with the center of the outlet flow path 5 aligned, and the divided surfaces were joined using the solid-phase diffusion bonding method under the same conditions as in Example 1 to obtain a molding die 1 of the present invention. Similarly to the first embodiment, the shaping die 1 is formed with a diffusion bonding region 7 containing nickel on opposing bonding surfaces, and the bonding surfaces are strongly bonded to each other. No blockage of the flow path was observed after joining, and no peeling of the joining surface was observed even after shaping of the polymer material. (Embodiment 4) As shown in FIG. 4, the shape of the flow path of the extrusion die as the shaping die 1 according to Example 4 has a rectangular cross section extending in the horizontal direction. According to the present embodiment, the small width plates 2b are arranged along the widthwise opposite edges of the two wide plates 2a at the top and bottom, respectively, and the rectangular cross section formed at the center thereof is formed. The hollow portion is used as an extrusion channel 3 of a polymer material.

After the passage processing, each plate was subjected to a stress removing treatment, and then a solid nickel thin film was formed on the surface to be joined by electrolytic nickel plating. Thereafter, the four plates 2a,
2b is joined to each divided surface using the solid-state diffusion bonding method under the same bonding conditions as in the first embodiment, and the diffusion bonding region 7 containing nickel is interposed on the bonding surface. I got

Even in the shaping die 1, since the stress is sufficiently removed from each plate 2 before the bonding, the die 1 is not distorted even after the bonding as in the above embodiment. No change is seen in the channel configuration. In addition, the solid-phase thin film promoted diffusion during solid-phase diffusion bonding, and the bonding surfaces were strongly bonded to each other. No peeling of the bonding surfaces was observed even after extrusion molding of the polymer material. Furthermore, since solid-phase diffusion bonding was performed and the solid-phase thin film did not liquefy, nickel did not flow into the channel, and no blockage of the channel was recognized. (Embodiment 5) FIG. 5 shows Embodiment 5 of the present invention. In this embodiment, the shape of the flow path of the shaping die 1 is a rhombus-shaped cross section. According to the illustrated example, the flow path 3 having the rhombic cross section is divided by a diagonal dividing plane that connects a pair of opposing corners, and a half of the rhombus is placed at a corresponding position of each of the obtained divided plates 2. A triangular groove having a cross-sectional shape of is formed. After the passage processing, each plate 2 was subjected to a stress removing treatment, and then a solid nickel thin film was formed on the surface to be joined by electrolytic nickel plating. Thereafter, the corresponding bonding surfaces are combined and solid-phase diffusion bonding is performed under the same bonding conditions as in the above embodiment, and the divided surfaces are bonded to obtain the shaping die 1 having a desired flow path form and bonding strength. Was. (Embodiment 6) FIG. 6 shows Embodiment 6 of the present invention. In this embodiment, the shape of the channel of the shaping die 1 is a straight channel having a rectangular cross section. According to the illustrated example, the rectangular section is divided along a straight line connecting the midpoints of the opposing long sides, and a rectangular groove that is の of the rectangle is formed at the corresponding position of each obtained divided plate 2. I do. After the passage processing, each plate 2 was subjected to a stress removing treatment, and then a solid nickel thin film was formed on the surface to be joined by electrolytic nickel plating. Thereafter, the corresponding bonding surfaces are combined and solid-phase diffusion bonding is performed under the same bonding conditions as in the above embodiment, and the divided surfaces are bonded and integrated to form the desired shape of the flow channel and the bonding strength. 1 was obtained. (Comparative Example 1) Machine processing was performed in the same manner as in Example 1 except that a solution treatment material of SUS630 was used as a base material and a treatment material of TH1050 of SUS631 was used as an adhesive thin plate, and stress was removed and bonding was performed. A solid-state thin film of pure nickel was formed on the surface and joined by a solid-phase diffusion bonding process to produce a forming die. The resulting molding die had a warpage of about 2 mm as a whole, and a part of the joint surface was unjoined. (Comparative Example 2) A shaping die was manufactured in the same manner as in Example 1 except that annealing for removing stress was not performed after the passage processing. The resulting molding die had a warpage of about 2 mm as a whole, and a part of the joint surface was unjoined. (Comparative Example 3) A shaping die was manufactured in the same manner as in Example 1, except that electrolytic nickel plating was not performed on the joint surface after the passage processing. In order to confirm the bonding state of the obtained molding die, the molding die was immersed in soapy water, and then a pressure of 0.2 MPa was applied to a 0.4 mm flow path to obtain a 0.4 mm flow. Leakage of air was observed from the joint surface other than the flow path.

[0051]

As described above in detail, according to the present invention, a molding die having a flow path configuration which is conventionally impossible or difficult to process is inexpensive and easy. Can be obtained. Further, according to the present invention, a through hole having a small hole shape can be machined even with a thick plate material, so that the pressure resistance can be improved, and the flow path is blocked after joining. No peeling of the bonding surface was observed even after spinning or molding, and it was confirmed that it could sufficiently withstand practical use as a molding die.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a part of a spinneret according to a first embodiment of the present invention, which is cut away.

FIG. 2 is an enlarged perspective view showing a part of a plate before joining.

FIG. 3 is a cutaway perspective view showing a part of a spinneret according to a third embodiment of the present invention.

FIG. 4 is a perspective view in which a part of a spinneret according to a fourth embodiment of the present invention is cut away.

FIG. 5 is a cutaway perspective view showing a part of a spinneret according to a fifth embodiment of the present invention.

FIG. 6 is a perspective view in which a part of a spinneret according to a sixth embodiment of the present invention is cut away.

FIG. 7 is a graph showing a temperature profile of a temperature rise and a temperature fall during a solid phase diffusion bonding process of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 shaping die 2 plate 3, 5 fluid flow path 4 division surface (joining surface) 6 solid thin film 7 diffusion bonding region

Claims (11)

[Claims] 1. A die for shaping a polymer material having a flow path (3, 5) for the polymer material, wherein the die (1) is divided into a plurality of homogeneous and homogeneous materials. The channel (3, 5) is made of a metal material, and is processed by being divided into two or more, and the divided channels are joined together to perform solid-phase diffusion bonding. Wherein a diffusion bonding region (7) containing a different metal is interposed. 2. The method according to claim 1, wherein the divided flow passages (3a to 3b, 5) are provided in
2. The molding die according to claim 1, wherein the molding die is divided along a transverse cross section of the molding die. 3. The molding die according to claim 1, wherein the divided flow path is divided along a vertical section of the flow path. 4. The molding die according to claim 1, wherein the metal different from the metal material contained in the diffusion bonding region is nickel. 5. The shaping die according to claim 1, wherein the metal material is stainless steel. 6. A method of manufacturing a shaping die having a flow path of a polymer material, wherein a plurality of divided members are formed of the same kind and the same metal material, and the flow path is divided into the divided members. Removing the residual stress at the time of processing the flow path from the divided material; one or both of the opposing joint surfaces of the divided material, a solid-phase thin film made of a metal different from the metal material And bonding the bonding surface via the solid-phase thin film by a solid-phase diffusion bonding method. 7. The method according to claim 6, further comprising forming the solid phase thin film by plating. 8. The film thickness a of the solid phase thin film is 0.1 μm ≦ a
The method according to claim 6, wherein ≤75 µm. 9. At the time of joining by the solid phase diffusion joining method,
7. The method according to claim 6, further comprising: holding the divided material at a soaking temperature for a certain period of time, and then increasing the temperature to a joining temperature.
A method for producing the shaping die according to the above. 10. The method according to claim 9, further comprising increasing the temperature to the bonding temperature, maintaining the temperature for a predetermined time, and then gradually cooling.
A method for producing the shaping die according to the above. 11. The cooling rate is 5 ° C./min. The method for producing a shaping die according to claim 10, which is as follows.