JP2001122215A - Taping equipment and taping method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten taping time. SOLUTION: Chip parts 17 in a parts storage area are taken out one after another by the suction nozzle 19 of a parts insertion mechanism 15. After the parts 17 are inserted in a plurality of storage grooves 3B repeatedly a plurality of times, a tape is transported while a shutter 30 covers the top face opening of the grooves. This way the jump out of the chip part 17 from the grooves 3B can be controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inserting a chip component into a storage groove in a storage tape wound around a tape reel,
The present invention relates to a taping device and a taping method in which an opening on the upper surface of a storage groove is closed with a cover tape, and particularly to stabilization of tape conveyance after a chip component is inserted into the storage groove.

[0002]

2. Description of the Related Art A conventional taping device and a conventional taping method will be described below.

Conventionally, chip-shaped electronic components (hereinafter, referred to as "chips") are individually stored in storage grooves in a storage tape wound around a tape reel.
Called chip components. ) Is inserted, and the operation of transporting the storage tape by one pitch is repeated a plurality of times, and the opening at the upper surface of the storage groove of the storage tape in which the chip component transported to the predetermined position is inserted is covered with a cover tape. By closing, the chip component was taped.

Here, in order to shorten the taping time, the present inventor repeatedly inserts chip components into a plurality of storage grooves a plurality of times, and then collects the storage tapes at a predetermined pitch by a tape feed mechanism. A technology for transporting downstream has been developed. As a result, the time required for tape feeding can be reduced as compared with the method in which the chip components are inserted one by one into the storage grooves and the tape body is conveyed one pitch downstream each time. Taping time was shortened.

[0005]

However, in the taping apparatus and the taping method described above, there is a risk that the following problems may occur.

[0006] That is, there is a concern that the chip components in the storage groove may jump out during tape transport after the chip component is inserted into the storage groove. In other words, the upper surface of the storage tape in the transport path is provided with a cover for the purpose of guiding the tape at the time of transport and preventing the parts from jumping out.For example, an opening is formed in the cover only at the component insertion work position. Is widely adopted. Then, as described above, when the chip components are inserted one by one into the storage groove and the tape is conveyed each time, there is no problem in the above configuration, but a plurality of chip components are inserted and conveyed collectively. in case of,
A wide opening corresponding to a storage groove for inserting a plurality of chip components into the cover is required.

[0007] For this reason, a problem occurs in that the chip components in the storage groove jump out to the outside due to vibration (braking) at the time of starting and stopping during tape transport.

[0008]

SUMMARY OF THE INVENTION Accordingly, a taping apparatus and taping method according to the present invention have been made in view of the above problems, and as shown in FIG. 5 are sequentially taken out, and the operation of inserting the chip component 17 into the plurality of storage grooves 3B of the tape main body 3A is repeated a plurality of times based on the recognition result by the recognition camera 26 as shown in FIG.
As shown in FIG. 7, the tape main body 3A is transported downstream by a predetermined pitch by the tape feed mechanism while closing the openings on the upper surfaces of the plurality of storage grooves 3B by the shutter 30, so that the chip components 17 from the storage grooves 3B during the transfer are transferred. Suppress jumping out.

Further, since the standby positions of the plurality of storage grooves 3B into which the chip components 17 are inserted are recognized in advance by the recognition camera 26, the insertion workability is improved.

Further, since the tape holding mechanism 29 for regulating the position of the tape main body 3A is provided outside the recognition area of the plurality of storage grooves 3B by the recognition camera 26, the insertion workability is improved.

Further, since the shutter 30 is linked with the Y movement of the component insertion mechanism 15, the workability is good.
Further, the uncertain insertion mode due to static electricity, vibration, catching, or the like at the time of insertion can be stabilized by operating the shutter 30 while moving the suction nozzle 19.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a taping device and a taping method according to the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a taping device to which the present invention is applied. Reference numeral 1 denotes a taping device main body, and a tape reel 2 is rotatably locked to a pin 2A provided on a side wall of the main body 1. Then, the tip of the tape body (also referred to as a carrier tape) 3A wound around the tape reel 2 is connected to pulleys 4, 5, 6, 7, 8, and 8 for applying an appropriate tension to the tape body 3A. It is fixed to the take-up reel 12 via the transfer rails 9 and 10. The take-up reel 12 is driven by a rotation drive system (not shown).
While the tape main body 3A is sequentially conveyed by a predetermined amount (wound on the take-up reel 12) in accordance with the rotation of the tape chip, the chip component is inserted into the storage groove 3B of the tape main body 3A and further conveyed to a predetermined position. The cover tape 3 supplied from the cover tape supply reel 13 to the opening on the upper surface of the storage groove 3B
After being covered with C, it is wound on the winding reel 12. As described above, the tape 3 is formed by the tape main body 3A, the accommodating groove 3B (see FIG. 3 and the like) provided therein, and the cover tape 3C pressed on the upper surface thereof.

FIG. 2 is a partially enlarged view of FIG. 1 and shows various working steps performed by the taping apparatus in order from the right on the paper of FIG. That is, from the right, a component insertion process by the component insertion mechanism 15 into the storage groove 3B of the tape main body 3A, a component inspection process by the component inspection mechanism 35, and a crimping process of the tape main body 3A and the cover tape 3C by the tape crimping mechanism 50. The chip components 17 to be processed in the various working steps are blacked out for convenience.

Reference numeral 15 denotes a component insertion mechanism for inserting a chip component into the accommodating groove 3B of the tape main body 3A. Hereinafter, a plan view (FIG. 3) and a side view (FIGS. 4 to 6) will be described. I will explain it.

(I) is a component suction station, in which chip components 17 in the component storage 16 are sequentially suctioned and taken out by suction nozzles 19 installed on the back surface of a rotary plate 18 of the component insertion mechanism 15, and the suction nozzles The chip component 17 adsorbed by 19 is transported to the next station in accordance with the rotation of the turntable 18. In addition, the component storage unit 16 mounts the wafer on which the dicing tape is attached to the mounting table 20 in a state where the wafer is diced and divided into individual chip components 17. While being pushed up by 21, the suction nozzle 19 sucks and takes out. Reference numeral 22 denotes an XY table that positions the desired chip component 17 above the push-up pins 21 by moving the mounting table 20 XY. Also, 23
Is a recognition camera for recognizing the chip components 17 on the wafer.

(II) is a component recognition station for recognizing the attitude of the chip component 17 by a recognition camera 25 prepared below the chip component 17 that is being sucked by the suction nozzle 19. At this time, in the previous component suction station, another suction nozzle 19 that has reached this station is used.
Thereby, the chip components 17 in the wafer are sucked and taken out.

(III) is a component insertion station, which is a storage groove 3 of the tape body 3A on the transport rail 11 on which the chip component 17 sucked by the suction nozzle 19 is waiting below.
Insert into B. Note that the chip component 17 is inserted into the storage groove 3B with its back surface facing upward so that inspection by a component inspection mechanism 35 described later is easy. Further, although not shown, a cover is provided on the upper surface of the tape main body 3A mounted on the transport rail 11 for the purpose of guiding the tape during transport and preventing the components from jumping out. A predetermined width is provided on the cover only at the inspection operation position (in the present embodiment, six chip components 17 are considered as one unit, and thus, the width in which six storage grooves 3B are exposed).
Opening is provided. The reason why one unit described above is six chip parts 17 is based on the recognition camera 2 described later.
This is because the number of storage grooves 3B recognized by 6 is six.
Therefore, in implementing the present invention, the number is not limited to the above-mentioned six, but the number can be appropriately set according to the size of the recognition area (field of view) of the recognition camera 26. Accordingly, the time required for tape transport by the tape feed mechanism described later can be set as appropriate.

Here, first, the position of the storage groove 3B is recognized by the recognition camera 26, and the result of this recognition and the result of recognition of the component posture at the previous component recognition station (II) are taken into consideration, so that the turntable 18 is recognized. Arm 2 with attached
7 is an X table 28A, Y constituting the XY table 28
The XY movement is performed by the table 28B. Therefore, the chip component 17 is inserted into the storage groove 3B in an appropriate form.

The reference numeral 29 denotes the suction nozzle 19 after the recognition.
A vertically movable tape holding mechanism for holding down the tape body 3A so that the position of the storage groove 3B does not fluctuate due to contact with the tape body 3A at the time of insertion or mechanical vibration, etc. For example, when the rod portion of the cylinder is moved downward, the tape pressing plate abuts on the upper surface of the tape main body 3A and presses the tape main body 3A.

Reference numeral 30 denotes a shutter for closing the opening on the upper surface of the storage groove 3B after the chip component 17 has been inserted into the storage groove 3B, and is linked with the Y movement of the XY table 28 by the Y table 28B. After inserting the chip component 17 into the storage groove 3B,
When the turntable 18 moves to the left on the paper surface in FIG. 6 by the Y movement of the Y table 28B, the shutter 30 is also moved in the Y direction and the shutter 30 is closed (FIG. 4 shows the chip component 17 in the storage groove 3B). 5 shows a state immediately before the chip component 17 is inserted into the storage groove 3B, and FIG. 6 shows a state where the chip component 17 is inserted into the storage groove 3B.
9 and the chip component 17 are separated from each other, and the opening on the upper surface of the storage groove 3B is closed by the shutter 30. ).

In the present invention, the component insertion mechanism 15 (the suction nozzle 19 and the shutter 30 can be interlocked (both are fixed to the XY table 28 and can be interlocked with the movement in the Y direction)). Therefore, as shown in FIG. 6, with the chip component 17 inserted into the storage groove 3B,
When the table 28B moves in the Y direction, the opening on the upper surface in the storage groove 3B is closed by the shutter 30 while the chip component 17 is left in the storage groove 3B by the suction nozzle 19, and these two operations are performed. Since the control can be performed only by the Y movement of the Y table 28B, the workability is good. In addition, when the chip component 17 is inserted into the storage groove 3B, an unreliable insertion mode due to static electricity, vibration, catching, or the like causes a stable insertion by operating the shutter 30 while moving the suction nozzle 19. Will be possible.

Further, in the present invention, the positions of a plurality of (six in this embodiment) storage grooves 3B are recognized at once by the recognition camera 26, and the chip components 17 are sequentially inserted into these storage grooves 3B. Let me. Conventionally, for example, the chip components 17 are inserted one by one into the accommodating groove 3B by adopting a method in which a plurality of such components are inserted and the tape main body 3A is transported downstream by six pitches by the tape feeding mechanism. Thus, the overall operation time can be reduced as compared with the case where the tape main body 3A is transported downstream by one pitch and the above operation is repeated again. That is, for example, tape 1
In pitch feed, the time required for the feed is about 0.2
If it is a second, this is repeated six times, so that conventionally it would take about 1.2 seconds in total,
In contrast, with the tape 6 pitch feed of the present invention, the conveyance can be completed in about 0.4 seconds (the insertion time of the chip component 17 is the same, so the difference is only the conveyance time).

More specifically, at the start of tape transport,
Vibration (braking) at the time of stoppage has caused problems such as jumping out of the chip component 17 in the storage groove 3B.
In the present invention, the pitch of one tape feed is increased, and the number of times of transport as a whole is reduced. Therefore, the influence of vibration is reduced accordingly, and the transport operation can be stabilized as compared with the conventional one pitch feed.

Reference numeral 35 denotes a component inspection mechanism for inspecting a chip component inserted into the accommodating groove 3B of the tape main body 3A. A plan view (FIG. 7) and a side view (FIG. 8) 10 to FIG. 10).

In FIG. 2, FIG. 7, etc., reference numeral 36 denotes a recognition camera prepared above the chip component 17 inserted into the storage groove 3B.
7 is recognized (in FIG. 7, only the recognition area is indicated by a two-dot chain line).

In FIG. 8, reference numeral 37 denotes an inspection unit having a probe needle on its lower surface, and an arm 3 to which the inspection unit 37 is fixed.
8 can move up and down along a guide 39, and the up-and-down movement mechanism 40 is mounted on an XY table 41. Therefore,
The inspection unit 37 moves by XYZ (up and down) to contact and inspect the chip component 17 inserted into the storage groove 3B (FIG. 8 shows the chip inserted into the storage groove 3B). FIG. 9 shows a state in which the component 17 has been transported to the inspection position (at this time, the upper surface of the chip component 17 before inspection is closed by a shutter 47 described later).
FIG. 10 shows a state in which the tip part 17 in the storage groove 3B is exposed by the Y movement and the probe needle of the inspection unit 37 is held while the chip part 17 in the storage groove 3B is pressed by a component pressing plate 43 described later. 17 shows a state in which the inspection is performed by contacting the contact member 17. ). In this inspection work, since the six chip components 17 are inspected at once by the inspection part 37, the cover has a large enough size to expose six storage grooves 3B in the same manner as the above-mentioned insertion work position. An opening is drilled.

Reference numeral 42 denotes a component position regulating mechanism for preventing the chip component 17 inserted into the storage groove 3B from being displaced at the time of component inspection by the inspection unit 37, and a component presser for holding the six chip components 17. The plate 43 is attached to the up-down movement mechanism 44, and the up-down movement mechanism 44 is placed on the XY table 45.
-Y-Z movement is possible.

A shutter 47 for closing the upper surface of the chip component 17 before inspection by the inspection unit 37 is provided on the transport rail 11 so as to be movable in a Y direction along a Y movement guide 48.

As described above, according to the present invention, the chip component 17 is inserted into the storage groove 3B of the tape main body 3A, and the electrical characteristics of the chip component 17 are inspected while being inserted into the storage groove 3B during the transportation. Therefore, before inserting components into the storage groove as in the past, the chip components are once placed on the work table, inspected at that location, and the chip components are sucked again by the suction nozzle and stored. It is possible to avoid the occurrence of a component failure due to an impact at the time of suction applied after inspection, such as one in which a component is inserted into a groove, and it is possible to suppress a problem that a defective product is mixed in a tape. Furthermore, if the chip component 17 is inserted into the storage groove 3B with the back surface of the chip component 17 facing upward, the inspection by the component inspection mechanism 35 becomes easy and the workability is good.

In the component inspection by the component inspection mechanism 35, after the chip component 17 is inserted into the accommodation groove 3B,
Since it is sufficient to perform the operation at a certain point on the conveyance path until the tape main body 3A and the cover tape 3C are press-bonded by the tape pressing mechanism 50 described later, it is relatively easy to secure an installation place in the apparatus.

Finally, reference numeral 50 denotes a vertically movable tape crimping mechanism. The chip component 17 is inserted into the storage groove 3B, and the tape main body 3A and the cover tape 3C whose inspection of the chip component 17 is completed are crimped. , To complete taping.

Then, the tape 3 for which taping has been completed is sequentially wound up on the take-up reel 12.

[0034]

According to the present invention, after the chip components in the component storage section are sequentially taken out by the suction nozzle of the component insertion mechanism and the operation of inserting the chip components into the plurality of storage grooves is repeated a plurality of times, the shutter mechanism is operated. As a result, since the openings on the upper surfaces of the plurality of storage grooves are closed, the protrusion of the chip component from the storage grooves can be suppressed, and the shutter mechanism is interlocked with the movement of the component insertion mechanism in a predetermined direction. Therefore, workability is good.

[Brief description of the drawings]

FIG. 1 is a front view showing a taping device according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of FIG.

FIG. 3 is a plan view for explaining a component insertion mechanism.

FIG. 4 is a side view for explaining a component insertion mechanism.

FIG. 5 is a side view for explaining a component insertion mechanism.

FIG. 6 is a side view for explaining a component insertion mechanism.

FIG. 7 is a plan view for explaining a component inspection mechanism.

FIG. 8 is a side view for explaining a component inspection mechanism.

FIG. 9 is a side view for explaining a component inspection mechanism.

FIG. 10 is a side view for explaining a component inspection mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Taping device main body 2 Tape reel 3 Tape 12 Take-up reel 15 Component insertion mechanism 17 Chip component 19 Suction nozzle 26 Recognition camera 30 Shutter 35 Component inspection mechanism 50 Tape crimping mechanism

Claims (6)

[Claims] In a taping device, a chip component is inserted into a storage groove in a storage tape wound around a tape reel, and an opening on an upper surface of the storage groove is closed with a cover tape. And a component insertion mechanism for sequentially taking out and inserting the chip component into the storage groove by the component insertion mechanism, the operation being repeated a plurality of times for the plurality of storage grooves. A taping device, comprising: a shutter mechanism for closing an opening on an upper surface of each of the storage grooves; and a tape feeding mechanism for conveying the storage tape by a predetermined amount while closing the opening on the upper surface of the storage groove by the shutter mechanism. 2. The taping device according to claim 1, further comprising a recognition mechanism for recognizing standby positions of a plurality of storage grooves into which chip components are inserted by the component insertion mechanism. 3. The taping device according to claim 2, further comprising a tape position regulating mechanism for regulating the storage tape outside a recognition area of the plurality of storage grooves by the recognition mechanism. 4. The taping device according to claim 1, wherein the shutter mechanism is configured to interlock with movement of the component insertion mechanism in a predetermined direction. 5. A taping method for inserting a chip component into a storage groove in a storage tape wound around a tape reel and closing an opening on an upper surface of the storage groove with a cover tape. After repeatedly removing the chip components and inserting the chip components into the storage grooves in the storage tape and inserting the chip components into the plurality of storage grooves a plurality of times, the shutter mechanism opens the plurality of storage groove upper surfaces. And transporting the storage tape by a predetermined amount by a tape feeding mechanism while closing the portion. 6. The taping method according to claim 5, wherein before the chip component is inserted by the component insertion mechanism, the recognition mechanism recognizes the standby positions of the plurality of storage grooves.