JP2001119091A - Semiconductor laser unit connector, semiconductor laser unit mounting connector member and mounting structure of semiconductor laser unit using the connector member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector and a mounting structure, capable of mounting readily a semiconductor laser unit structuring pickup of an optical application system of an optical disc, etc., on an optical application device. SOLUTION: With simple operations in which a housing part 1 of a connector A is only elastically engaged with a socket part 103 of a semiconductor laser unit B, the semiconductor laser unit B can be mounted in an optical application device, such as a mobile or vehicle-equipped player such as a CD-ROM drive, a CD and MD for music, or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser unit which is incorporated in an optical disk or other various optical devices to constitute a pickup, and more specifically, a laser diode chip (hereinafter referred to as an "LD") for a hologram type pickup. Chip)) and a connector for a semiconductor laser unit in which a light receiving element for signal reading is arranged in one package.

[0002]

2. Description of the Related Art Recently, music CDs and other CD-ROs have been developed.
In various optical disk systems such as M and MD, a hologram type pickup employing a hologram element (HOE) having functions such as beam generation, light branching, and error signal generation as an optical system has been proposed. This pickup includes a semiconductor laser unit in which an LD chip for a light source and a light receiving element for signal reading are arranged in one package, and a hologram element bonded and fixed to the upper surface of the semiconductor laser unit. Such a hologram-type pickup can achieve various advantages such as reduction in size and weight, reduction in cost, and high-speed access by reducing the number of components and improving environmental resistance performance.

On the other hand, the applicant of the present application has proposed a further reduction in size, weight, and cost in optical application devices such as portable and car-mounted players such as CD-ROM drives for notebook computers, music CDs and MDs. Japanese Patent Application No. Hei 10-245325 (hereinafter referred to as a prior application) has previously been proposed as a semiconductor laser unit capable of responding to needs. In this prior art, an LD chip and a light receiving element are mounted on an island, and parallel lead pins are used as input / output terminals electrically connected to the LD chip and the light receiving element. A semiconductor laser unit in which the resin molded portion and the islands are integrally assembled into one package by holding the resin molded portion and the island integrally, wherein the resin molded portion is a protruding end of an inner lead and an outer lead with respect to a parallel lead pin. Forming so as to cover each lead pin leaving an electrical connection surface on the surface or side surface, respectively,
A socket portion is formed at a portion of the resin molded portion protruding toward the lower surface of the island so that an electrical connection surface of an outer lead of each lead pin is exposed. And then
Preventing outer lead deformation and external terminals in a semiconductor laser unit that realizes reduction of the number of parts, simplification of assembly work, miniaturization of products, cost reduction, etc. by arranging LD chip and light receiving element in one package. This has the effect of simplifying the work of connecting to the device.

[0004]

A mounting structure for incorporating the above-mentioned prior-art semiconductor laser unit into a portable optical device such as a CD-ROM drive or a music CD / MD or an optical application device such as a car-mounted player. When examined in more detail, the following points left room for improvement. That is,
When mounting the above semiconductor laser unit, refer to FIG.
As shown in FIG. 7, the socket portion is inserted into the mounting portion (opening) provided on the mounting board, and the electrical connection surface of each outer lead (input / output terminal) is connected to the outside of the wiring pattern formed on the film substrate. The soldering operation is performed by soldering to the terminals. However, since the semiconductor laser unit itself is a small part having a length of 1 cm or less, the soldering operation is a fine operation of an extremely small size, and the wiring corresponding to the adjacent input / output terminals High precision is required to prevent short-circuiting and ensure electrical continuity with the external terminals of the pattern, and this requires considerable labor, cost, and skill. In addition, there is a possibility that a gap may be formed between the mounting portion (opening portion) provided on the mounting board and the socket portion, so that there is room for improvement in ensuring reliable conduction.

[0005] The present invention has been made in view of such a conventional situation, and an object of the present invention is to mount the semiconductor laser unit on optical devices without impairing the advantages of the previously proposed semiconductor laser unit. To provide a connector, a housing, and a mounting structure that can easily perform the mounting.

[0006]

In order to achieve the above object, a connector according to the present invention is provided with a socket on the lower surface of an island on which a predetermined electronic component is mounted, and the socket has an input / output terminal for the electronic component. A connector for a semiconductor laser unit comprising: a housing portion elastically fitted to the socket portion; connection terminals provided in correspondence with the input / output terminals; The gist is that a terminal is formed so as to be in contact with each input / output terminal, and a film substrate having a wiring pattern that is electrically connected to each connection terminal is attached to the housing portion.

According to such a configuration, the semiconductor laser unit can be easily connected to the socket portion of the semiconductor laser unit by simply fitting the housing portion of the connector elastically to the CD-ROM drive, music CD, MD, or the like. It can be mounted in optical devices such as portable and car-mounted players.

[0008] As a more specific embodiment of the above-described connector, the configurations described in claims 2 to 5 can be given.

That is, in the connector of the first aspect, the housing portion has a contact surface portion that contacts the input / output terminal exposed surface of the socket portion, and a spring portion that exerts an elastic force for pressing the corresponding contact surface portion against the input / output terminal exposed surface. It is preferable that the connecting terminal is formed in an annular shape with the inside as a socket portion insertion space, and the connection terminals are arranged along the inner surface of the contact surface portion (claim 2). In this case, while the connector has a simple configuration, the mounting work of the semiconductor laser unit can be facilitated, and reliable conduction can be achieved.

The connector according to claim 2, wherein an end of the film substrate is made to extend along the outer surface of the contact surface, and one end of the connection terminal is bent to project outside the contact surface, and the projecting end is formed. Is preferably connected to the wiring pattern of the film substrate to make it conductive. In this case, a connection space between the film substrate and each connection terminal is formed on the side surface of the housing portion, and the lower surface side of the connector (in the height direction of the semiconductor laser unit and the housing portion) in a mounted state.
This is useful when space is restricted.

Further, in the connector according to the present invention, an end of the film substrate extends along a lower surface of the housing portion, and one end of the connection terminal protrudes toward a lower surface of the housing portion. It is preferable to connect to the wiring pattern of the substrate to make it conductive. In this case, a connection space between the film substrate and each connection terminal is formed on the lower surface side of the housing portion, and the connector side surface side (in the width direction of the semiconductor laser unit and the housing portion) in a mounted state.
This is useful when space is restricted.

In the connector according to any one of claims 1 to 4, the housing portion is resin-molded while leaving an electrical connection surface at a tip portion or a side portion of the parallel lead pins held by the lead frame. It is preferable to cut each lead pin held by the above from the lead frame to form each connection terminal, and to integrate these connection terminals and the housing part. In this case, the lead frame is set in the molding die, the housing is molded with a resin, and then the lead pins are cut. Short circuit can be prevented.

The connector member of the present invention is provided with a socket portion on the lower surface side of an island on which a predetermined electronic component is mounted, and is used for mounting a semiconductor laser unit having the input / output terminal of the electronic component on the socket portion. The housing portion elastically fitted to the socket portion is formed of a synthetic resin material. The housing portion has an abutting surface portion abutting on an input / output terminal exposed surface of the socket portion, and an input / output portion corresponding to the input / output terminal. And a spring portion that develops an elastic force to be pressed against the terminal exposed surface.

According to another aspect of the present invention, there is provided a semiconductor laser unit mounting structure using the connector member, wherein the connector member and a socket portion of the semiconductor laser unit into which a housing portion of the connector member elastically fits. A structure in which a film substrate having a wiring pattern corresponding to the input / output terminal of the socket portion is interposed and the wiring pattern and the input / output terminal of the socket portion are brought into contact with each other by the elastic fitting force of the connector member (claim 7). .

In another aspect of the mounting structure of the semiconductor laser unit using the connector member according to the present invention, a wiring pattern for contacting an input / output terminal of a socket portion of the semiconductor laser unit is integrally formed on the connector member. And a structure in which the wiring pattern and the input / output terminal of the socket portion are brought into contact with each other by the elastic fitting force of the connector member.

According to these mounting structures, the connector member is a resin molded product having no connection terminal, and the connector member directly connects the input / output terminal of the socket portion and the wiring pattern of the film substrate without the connection terminal. Can be conducted.

The semiconductor laser unit to which the present invention is applied is not necessarily limited to the above-mentioned prior application. A socket portion is provided on the lower surface side of an island on which predetermined electronic components are mounted, and the socket portion is provided with the socket portion. Any semiconductor laser unit having input / output terminals for the electronic components can be used. However, a semiconductor laser unit having a socket portion provided on the lower surface side of an island on which a laser diode chip for a light source and a light receiving element for signal reading are mounted, and having the input / output terminals of the laser diode chip and the light receiving element in the socket portion is intended. Is most effective. Further, as described in the above-mentioned prior application, the semiconductor laser unit uses parallel lead pins as input / output terminals of a laser diode chip for a light source and a light receiving element for signal reading, and each outer lead of the parallel lead pin is used. It is preferable that the leads are covered with a resin molded portion while leaving an electrical connection surface on the side surface, and the lower ends of the outer leads are preferably bent inward and protected by the resin molded portion. In the case of a semiconductor laser unit having such a configuration, the above-described mounting operation can be more easily performed, and reliable conduction can be achieved.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 show an example of the connector described in claims 1 to 5, wherein A represents the connector of this example, and B represents a semiconductor laser unit.

The basic components of the semiconductor laser unit B are the same as those of the prior application of the present applicant (Japanese Patent Application No. 10-245325), and will not be described in detail. , An LD chip (laser diode chip) for a light source and a light receiving element for signal reading are mounted on an island 101, and parallel lead pins 102 as input / output terminals for electrically connecting the LD chip and the light receiving element are made of resin. The resin molded part is held vertically by the molded part, and the resin molded part and the island 101 are fixed to one package, and the island 101 of the resin molded part is fixed.
The part protruding downward is the socket part 103, and the island 1
01The upper surface side is covered with a cover 104 to protect the LD chip and the light receiving element, and a hologram element 105 is mounted on the upper surface of the cover 104 to form a hologram pip-up.

In the resin molded portion, the side surfaces of the outer leads of the parallel lead pins 102, 102,... Are exposed as left and right side surfaces (input / output terminal exposed surfaces 106, 106) of the socket portion 103 as electrical mounting surfaces 107 for mounting. And, the lead pins 102 are molded so as to connect and fix the lead pins to each other in a state of preventing a short circuit therebetween.

The connector A is mounted on the housing portion 1 which elastically fits into the socket portion 103 by the lead pins 102, 102.
(Specifically, corresponding to the electrical connection surface 107 of each lead pin 102), and each connection terminal 2 is attached to each electrical connection surface 107 by the elastic fitting force of the housing portion 1. Each connection terminal 2 is formed so as to be in contact with each other.
A film substrate 3 having a wiring pattern which is electrically connected to the housing portion 1 is attached to the housing portion 1.

The housing portion 1 is formed integrally with the socket portion 103 using a desired synthetic resin material into an annular body that can be elastically fitted to the socket portion 103.
And left and right abutting surfaces 4 and 4 that abut against the 06 and 106, and springs 5 and 5 that exhibit elastic force for pressing the abutting surfaces 4 and 4 against the input / output terminal exposed surfaces 106 and 106, respectively. The inside is the insertion space 6 of the socket 103.

The spring portion 5 may have various shapes as long as it can press the contact surfaces 4, 4 against the input / output terminal exposed surfaces 106, 106. In this example, as shown in the drawing, the contact surface 4 4 and 4, the central portion is formed so as to bulge inward toward the inside of the housing portion 1 and the both ends are formed so as to bulge outwardly from the housing portion 1. In addition, an elastic force is exerted to press the contact surfaces 4, 4 against the input / output terminal exposed surfaces 106, 106. More specifically, the entire inner surfaces of the contact surface portions 4 and 4 (the pressure contact surfaces with the input / output terminal exposed surfaces 106) are evenly pressed against the input / output terminal exposed surfaces 106 and 106, and the connection terminals 2 are electrically connected to each other. The contact surface 107 is formed so as to exhibit an elastic force capable of being brought into contact with the contact surface 107 without fail.

A plurality of connection terminals 2 are provided along the inner surface of each contact surface portion 4. Each connection terminal 2 is arranged in parallel with a predetermined pitch in a state where the contact surface 7 with the corresponding electric connection surface 107 is exposed on the inner surface of the contact surface portion 4 (the pressure contact surface with the input / output terminal exposed surface 106). Buried in Further, each connection terminal 2 is formed so that the upper end side is bent outward so that the front end protrudes outside the contact surface portion 4, and the protruding end portion 8 is connected to the wiring pattern of the film substrate 3 to conduct.
An upper edge of the contact surface 4 is provided with a step 9 for bending the upper end of each connection terminal 2 outward, so that the protruding end 8 is located at the middle and high position of the housing 1.

The film substrate 3 is formed by forming a wiring pattern (not shown) on a tape-like film material having a width dimension substantially equal to the height of the housing portion 1, and the leading end portion thereof is shown in FIGS. The ends of the wiring pattern are formed at portions corresponding to the respective protruding ends 8, 8... At the portions along the contact surface portions 4, 4 and the protruding ends thereof. The window holes 10 into which the portions 8 are inserted are respectively provided, and the protruding end portions 8,
8 are soldered in advance 11 to the ends of the wiring pattern, thereby achieving conduction between the wiring pattern and each connection terminal 2, and attaching the film substrate 3 to the housing portion 1.

According to the connector A of this embodiment having the above configuration, as shown in FIG. 1, the socket 103 of the semiconductor laser unit B is inserted into the insertion space 6 of the housing 1 of the connector A.
The semiconductor laser unit B is inserted into the socket 103 by a simple operation of merely elastically fitting the housing portion 1 to the socket portion 103.
It can be implemented in optical applied devices such as D-ROM drives, music CDs, MDs, and other portable or car-mounted players. In this mounting state, as shown in FIGS. 4 and 5, each connection terminal 2 in the housing portion 1 is connected to the socket portion.
The contact between the electrical connection surface 107 of each lead pin 2 of the 103 and the elastic force of the spring portions 5 is maintained, so that reliable conduction can be achieved.

In this embodiment, the ends of the film substrate 3 are made to extend along the outer surfaces of the contact surfaces 4 and 4 and the connection terminals 2 and 4 are connected.
2 are projected outside the contact surface 4, and the projected end 8 is attached to the film substrate 3 on the side of the housing 1.
This is useful when the space on the lower surface side of the housing portion 1 (in the height direction of the semiconductor laser unit B and the housing portion 1) is restricted in the mounted state.

For such an example, although not shown, the front end portion of the film substrate 3 is made to extend along the lower surface side of the housing portion 1, and the connection terminals 2, 2,... 1 and projecting to the lower surface side, and the projecting end can be connected to the wiring pattern of the film substrate 3 to conduct electricity. In this case, a connection space between the film substrate 3 and the connection terminals 2, 2,... Is formed on the lower surface side of the housing portion 1,
This is useful when the space on the side surface of the housing portion 1 (the width direction of the semiconductor laser unit B and the housing portion 1) is restricted in the mounted state.

FIG. 6 shows an example of a method of manufacturing the housing portion 1 and the connection terminals 2, 2,... Shown in FIGS. That is,
Each connecting terminal 2 is formed by parallel lead pins 21, 21... Held by a lead frame 20 shown in FIG. 1A, and the leading end side of each lead pin 21 is bent upward to be bent into an L-shape. After that (see FIG. 1B), the housing part 1 is formed by resin molding, including the lead pins 21 and leaving the above-mentioned contact surface 7 and protruding end part 8 at the base end and the inner side surface of each lead pin 21. (Refer to (c) figure). Next, each lead pin 2 held by the housing portion 1
1 is cut from the lead frame 20 to form the respective connection terminals 2, and these connection terminals 2 and the housing part 1 are integrated (see FIG. 4D).

When the housing portion 1 and each connection terminal 2 are formed in this manner, the housing portion 1 is resin-molded in a molding die in which the lead frame 20 is set, and then the lead pins 21 are cut by a simple operation. , Housing part 1
Can be positioned and fixed, and short-circuiting between the connection terminals can be prevented.

FIGS. 7 and 8 show an example of the connector member and the mounting structure according to the sixth and eighth aspects. In the drawings, the same components as those in the examples shown in FIGS. 1 to 6 are denoted by the same reference numerals in the drawings, and overlapping description will be omitted.

The mounting structure of this example is such that the connector member 30
And the film substrate 40, and the connector member 30
It is formed similarly to the housing part 1 of the above-described example. That is, the connector member 30 is formed of a housing unit integrally formed into an annular body that can be elastically fitted to the socket portion 103 by using a desired synthetic resin material, and is provided on the input / output terminal exposed surfaces 106, 106 of the socket portion 103. Left and right contact surfaces 4
4 and the contact surfaces 4, 4 are connected to the input / output terminal exposed surfaces 106, 106.
And spring portions 5 and 5 exhibiting an elastic force to be brought into pressure contact with the socket portion 103, and the inside thereof is defined as an insertion space 6 of the socket portion 103.

Also in this example, the spring portion 5 may have various shapes as long as the contact surface portions 4, 4 can be pressed against the input / output terminal exposed surfaces 106, 106. More specifically, the entire inner surface of the contact surface portions 4 and 4 (the pressure contact surface with the input / output terminal exposed surface 106) is
06, 106 are evenly pressed, and a wiring pattern 45 of a film substrate, which will be described later, is formed so as to reliably contact each of the electrical connection surfaces 107 to exhibit an elastic force capable of achieving conduction.

The film substrate 40 has left and right enlarged surfaces 41, 41 along the left and right side surfaces (input / output terminal exposed surfaces 106, 106) of the socket portion 103 at the leading end of the tape-shaped film material.
And folding lines 42, 43, 44 for aligning the enlarged surface portions 41, 41 along the exposed surfaces 106, 106 are provided at predetermined locations, and the respective electrical connections exposed to the exposed surfaces 106, 106 are formed. The wiring pattern 45 is formed corresponding to the surface 107.

Then, between the connector member 30 and the socket portion 103 into which the connector member 30 elastically fits, the folded surface portions 41, 41 are folded at folding lines 42, 43, 44.
The film substrate 30 is bent along the fold lines 42, 43, 44 along the left and right input / output terminal exposed surfaces 106, 106 of the socket 103, and each end 46, of the wiring pattern 45 is resiliently fitted by the connector member 30. 46... Each of which is brought into contact with the corresponding electrical connection surface 107 of the socket portion 103 to conduct.

According to such a mounting structure, the connector member 30 is a mere resin molded product without the connection terminal 2, and the connector member 30 allows the socket portion 103 to be directly inserted into the socket 103 without the connection terminal 2. The output terminals (lead pins 102) and the wiring patterns 45 of the film substrate 40 can be conducted.

As another example of the mounting structure shown in FIGS. 7 and 8, although not shown, a film substrate 40 having the wiring pattern 45 is integrally provided on the connector member 30 by molding or the like. It is also possible to form the wiring pattern 45 and the input / output terminals (lead pins 102) of the socket portion 103 so as to be brought into contact with each other by the elastic fitting force of 30. According to such a mounting structure, since the connector member 30 is provided with the wiring pattern 45, the mounting operation can be performed more easily and reliable conduction can be achieved.

[0038]

As described above, the present invention has the following advantages without impairing the advantages of the previously proposed semiconductor laser unit by the present applicant. (Claim 1) The semiconductor laser unit can be easily connected to a socket portion of the semiconductor laser unit by a simple operation such as fitting a housing portion to a CD-ROM drive, a music CD, an MD, etc. It can be mounted in optical equipment.

(Claim 2) While the connector has a simple structure, the mounting work of the semiconductor laser unit is facilitated, and reliable conduction can be achieved.

(Claim 3) It is useful when the space in the height direction of the semiconductor laser unit and the housing is restricted in the mounted state.

(Claim 4) It is useful when the space in the width direction of the semiconductor laser unit and the housing is restricted in the mounted state.

(Claim 5) A simple operation of setting a lead frame in a mold, resin-molding a housing portion, and cutting lead pins, thereby accurately integrating a plurality of connection terminals with the housing portion. I can do it.

(Claims 6 to 8). By using a connector member that is a resin molded product having no connection terminal, the input / output terminal of the socket portion and the wiring pattern of the film substrate can be directly conducted without passing through the connection terminal.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a connector according to the present invention.

FIG. 2 is a plan view of the connector shown in FIG. 1;

FIG. 3 is a sectional view taken along lines (X)-(X) in FIG. 2;

FIG. 4 is a sectional view taken along the line (Y)-(Y) of FIG. 2;

FIG. 5 is a bottom view showing a use state.

FIG. 6 is a simplified diagram showing an example of a manufacturing process of the connector according to the present invention.

FIG. 7 is a perspective view showing an example of an embodiment of a connector member and a mounting structure according to the present invention.

FIG. 8 is a simplified plan view of a film substrate used in FIG.

[Explanation of symbols]

 A: Connector 1: Housing portion 2: Lead pin (input / output terminal) 3: Film substrate 4: Contact surface portion 5: Spring portion 6: Insertion space 7: Contact surface 8: Projecting end portion 20: Lead frame 21: Lead pin 30 : Connector member 40: Film substrate 45: Wiring pattern B: Semiconductor laser unit 101: Island 102: Lead pin (input / output terminal) 103: Socket part 106: Input / output terminal exposed surface

Claims (8)

[Claims] 1. A semiconductor laser having a socket portion provided on a lower surface side of an island on which a laser diode chip for a light source and a light receiving element for signal reading are mounted, and the socket portion having input / output terminals of the laser diode chip and the light receiving element. A connector for a unit, wherein connection terminals are provided in a housing portion elastically fitted to the socket portion so as to correspond to the input / output terminals. A connector for a semiconductor laser unit, wherein a film substrate having a wiring pattern formed to be in contact with an output terminal and having a conductive pattern to each connection terminal is attached to the housing portion. 2. The housing portion includes a contact surface portion that comes into contact with the input / output terminal exposed surface of the socket portion, and a spring portion that exhibits an elastic force for pressing the corresponding contact surface portion against the input / output terminal exposed surface. 2. The connector according to claim 1, wherein the connector is formed in an annular shape with the inside as a socket insertion space, and the connection terminals are arranged along an inner surface of the contact surface portion. 3. An end portion of the film substrate is made to extend along an outer surface of the contact surface portion, and one end of the connection terminal is bent to project outside the contact surface portion, and the protruding end portion is connected to a wiring of the film substrate. 3. A circuit connected to a pattern and made conductive.
The connector described. 4. An end portion of the film substrate extends along a lower surface of the housing portion, and one end of the connection terminal protrudes toward a lower surface of the housing portion, and the protruding end is connected to a wiring pattern of the film substrate. 3. The electrical connection of claim 2
The connector described. 5. A resin molding of a housing portion while leaving an electrical connection surface at a front end portion or a side portion of the parallel lead pins held by the lead frame, and each lead pin held by the housing portion is separated from the lead frame. The connection terminals are formed by cutting, and the connection terminals and the housing part are integrated.
The connector according to claim 1. 6. A semiconductor laser having a socket on a lower surface of an island on which a laser diode chip for a light source and a light receiving element for signal reading are mounted, and the socket having an input / output terminal of the laser diode chip and a light receiving element. A connector member for mounting the unit, wherein a housing portion elastically fitted to the socket portion is formed of a synthetic resin material, and the housing portion is in contact with an input / output terminal exposed surface of the socket portion. A connector member for mounting a semiconductor laser unit, comprising: a contact surface portion; and a spring portion that exhibits an elastic force for pressing the contact surface portion against an input / output terminal exposed surface. 7. A wiring pattern corresponding to input / output terminals of the socket portion, between the connector member according to claim 6 and a socket portion of the semiconductor laser unit into which the housing portion of the connector member elastically fits. Wherein the wiring pattern and the input / output terminal of the socket portion are brought into contact with each other by an elastic fitting force of the connector member, with a film substrate having the same interposed therebetween. 8. The connector member according to claim 6, wherein a wiring pattern is provided integrally with the input / output terminal of the socket portion of the semiconductor laser unit, and the wiring pattern and the socket are formed by an elastic fitting force of the connector member. A mounting structure of a semiconductor laser unit, wherein input / output terminals of the unit are brought into contact conduction.