JP2001100648A - Display device - Google Patents

Display device

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Publication number
JP2001100648A
JP2001100648A JP27755299A JP27755299A JP2001100648A JP 2001100648 A JP2001100648 A JP 2001100648A JP 27755299 A JP27755299 A JP 27755299A JP 27755299 A JP27755299 A JP 27755299A JP 2001100648 A JP2001100648 A JP 2001100648A
Authority
JP
Japan
Prior art keywords
liquid crystal
wiring board
display device
wiring
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27755299A
Other languages
Japanese (ja)
Inventor
Miki Morita
海幹 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP27755299A priority Critical patent/JP2001100648A/en
Publication of JP2001100648A publication Critical patent/JP2001100648A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
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Landscapes

  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a display device with which downsizing is achieved. SOLUTION: The liquid crystal display device 14 is constituted by sealing liquid crystals between an upper glass substrate 2 and a lower glass substrate 3 to form a display region 4, disposing a wiring board 16 in juxtaposition near the end of the lower glass substrate 3, arraying plural driving ICs 8 on the wiring board 16 and connecting the terminals of the driving ICs 8 by bonding pads 10 of output side wiring and wires 18 for bonding. The surface of the output side wiring 10 is coated with an insulative synthetic resin 20 and the surfaces of the driving ICs 8 are coated with an insulative synthetic resin 21. The parts near both ends of the wires 18 are fixed by such resin coating and the wiring board 16 is disposed on the non-display region 9 of the liquid crystal panel 15 in such a manner that the terminals of the driving ICs 8 and the output side wiring 10 face each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は液晶、プラズマ、Ｅ
Ｌ等からなる表示板状体に対し、たとえば駆動用ＩＣを
搭載した配線基板を配設してなる表示装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal, a plasma,
The present invention relates to a display device in which, for example, a wiring board on which a driving IC is mounted is disposed on a display plate made of L or the like.

【０００２】[0002]

【従来の技術】表示装置には液晶、プラズマ、ＥＬ等か
らなる表示板状体からなるが、従来の表示装置である液
晶表示装置１を図５〜図７に示す。2. Description of the Related Art A display device comprises a display plate made of liquid crystal, plasma, EL, or the like. A conventional liquid crystal display device 1 is shown in FIGS.

【０００３】図５はその平面図、図６および図７はそれ
ぞれ図５中に示すＡ領域の拡大平面図と拡大断面図であ
る。FIG. 5 is a plan view thereof, and FIGS. 6 and 7 are an enlarged plan view and an enlarged sectional view of an area A shown in FIG. 5, respectively.

【０００４】液晶表示装置１においては、上ガラス基板
２と下ガラス基板３との間に液晶を封入し、それぞれの
内面には表示電極を相互に直交するように配列して表示
領域４をなし、下ガラス基板３には、それぞれの端面が
対向するようにプリント基板等の配線基板５を並設する
とともに、ステンレス等からなる金属プレート６の上に
下ガラス基板３と配線基板５とを接着用樹脂７により固
定している。また、駆動用ＩＣ８を配線基板５と下ガラ
ス基板３との上に配列し、表示電極４は下ガラス基板３
の非表示領域９に設けた出力側配線１０と接続し、さら
に配線基板５上にはボンデイングパッド１１も形成して
いる。そして、駆動用ＩＣ８の端子は出力側配線のボン
デイングパッド１０およびボンデイングパッド１１の各
端子とワイヤーボンデイング１２でもって接続されてい
る。また、１３はＩＣ搭載用もしくはＩＣ端子へのワイ
ヤーボンデイング用の座標認識用マーカーである。In the liquid crystal display device 1, liquid crystal is sealed between an upper glass substrate 2 and a lower glass substrate 3, and display electrodes 4 are arranged on each inner surface of the liquid crystal display device so as to be orthogonal to each other. A wiring board 5 such as a printed board is juxtaposed to the lower glass substrate 3 so that respective end faces thereof face each other, and the lower glass substrate 3 and the wiring board 5 are bonded on a metal plate 6 made of stainless steel or the like. It is fixed by the resin 7 for use. The driving ICs 8 are arranged on the wiring substrate 5 and the lower glass substrate 3, and the display electrodes 4 are arranged on the lower glass substrate 3.
And a bonding pad 11 is also formed on the wiring board 5. The terminals of the driving IC 8 are connected to the respective terminals of the bonding pads 10 and 11 of the output-side wiring by wire bonding 12. Reference numeral 13 denotes a coordinate recognition marker for mounting an IC or bonding a wire to an IC terminal.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、上記構
成の液晶表示装置１においては、下ガラス基板３と配線
基板５とを金属プレート６上で接着用樹脂７を介して固
定しているにすぎないので、下ガラス基板３や配線基板
５に応力が付加されると、それが増幅され、接着用樹脂
７の端に最も大きな応力が加わる状態となり、これによ
り、その端の接着力が低下し、下ガラス基板３や配線基
板５が金属プレート６から剥がれ、その結果、ワイヤー
ボンデイング１２の信頼性が低下するという課題があ
る。However, in the liquid crystal display device 1 having the above structure, the lower glass substrate 3 and the wiring substrate 5 are merely fixed on the metal plate 6 via the bonding resin 7. Therefore, when a stress is applied to the lower glass substrate 3 or the wiring substrate 5, the stress is amplified, and a state where the largest stress is applied to the end of the adhesive resin 7 is caused. There is a problem that the lower glass substrate 3 and the wiring substrate 5 are peeled off from the metal plate 6, and as a result, the reliability of the wire bonding 12 is reduced.

【０００６】このような応力は下ガラス基板３の熱膨張
率（８〜９×１０-6／℃）と配線基板５の熱膨張率（１
４〜１８×１０-6／℃）との差に原因になる場合が多
く、下ガラス基板３や配線基板５が金属プレート６から
剥がれる状態を図８〜図１０により図示する。Such stress is caused by the thermal expansion coefficient of the lower glass substrate 3 (8 to 9 × 10 −6 / ° C.) and the thermal expansion coefficient of the wiring substrate 5 (1.
4 to 18 × 10 −6 / ° C.) in many cases, and the state in which the lower glass substrate 3 and the wiring substrate 5 are peeled off from the metal plate 6 is illustrated in FIGS. 8 to 10.

【０００７】図８は図６において矢印ｂの方向から見た
側面図であり、剥がれる部位を矢印にして示すように、
下ガラス基板３が金属プレート６から剥がれている。ま
た、図９と図１０は図６において矢印ｃの方向から見た
側面図であり、同様に矢印にして示すように配線基板５
が金属プレート６から剥がれている。FIG. 8 is a side view of FIG. 6 as viewed from the direction of arrow b. As shown in FIG.
The lower glass substrate 3 has been peeled off from the metal plate 6. FIGS. 9 and 10 are side views of FIG. 6 as viewed from the direction of arrow c.
Is peeled off from the metal plate 6.

【０００８】しかも、このように配線基板５を備えた液
晶表示装置１においては、下ガラス基板３に対し配線基
板５を並設したことで、そのサイズが大きくなり、近時
に小型化の要求に応じられないという課題もある。In addition, in the liquid crystal display device 1 provided with the wiring board 5 as described above, the size of the wiring board 5 is increased by arranging the wiring board 5 in parallel with the lower glass substrate 3, and the demand for miniaturization has recently been raised. There is also a problem of not being able to respond.

【０００９】したがって本発明の目的は表示板状体と、
この表示板状体に表示信号を入力する配線基板との熱膨
張率差に起因するワイヤーボンデイング性の低下を解消
し、これによって信頼性の高い表示装置を提供すること
にある。Accordingly, an object of the present invention is to provide a display plate-like body,
An object of the present invention is to provide a highly reliable display device by eliminating a decrease in wire bonding property due to a difference in thermal expansion coefficient between the display plate and a wiring substrate for inputting a display signal.

【００１０】また、本発明の他の目的は小型化を達成し
た表示装置を提供することにある。[0010] Another object of the present invention is to provide a display device which has achieved miniaturization.

【００１１】[0011]

【課題を解決するための手段】本発明の表示装置は、表
示領域を有する表示板状体と、この表示板状体に表示信
号を入力する長尺状の配線基板とからなり、さらに表示
板状体の端部付近に設けた非表示領域上に複数の電極端
子を配列してなる一方の電極端子群を形成し、配線基板
上に複数の電極端子を配列してなる他方の電極端子群を
形成し、一方の電極端子群と他方の電極端子群とをワイ
ヤにて接続した装置構成において、一方の電極端子群お
よび他方の電極端子群の上に絶縁性合成樹脂を被覆し
て、双方の電極端子群が対向するように、配線基板を表
示板状体の非表示領域上に配したことを特徴とする。A display device according to the present invention comprises a display plate having a display area, a long wiring board for inputting a display signal to the display plate, and a display plate. One electrode terminal group formed by arranging a plurality of electrode terminals on a non-display area provided near an end of the shape body, and the other electrode terminal group formed by arranging a plurality of electrode terminals on a wiring board In an apparatus configuration in which one electrode terminal group and the other electrode terminal group are connected by wires, the one electrode terminal group and the other electrode terminal group are covered with an insulating synthetic resin, The wiring substrate is disposed on the non-display area of the display plate so that the electrode terminal groups of the display panel face each other.

【００１２】[0012]

【発明の実施の形態】以下、本発明の表示装置を液晶表
示装置でもって詳述する。本発明の液晶表示装置１４を
図１〜図４に示すと、図１はその平面図、図２は前記表
示板状体である液晶パネル１５と配線基板１６との関係
を示す概略断面図、図３は配線基板１６の液晶パネル１
５に対する配置構成を示す概略断面図である。図４は図
２中の矢印ａ方向から見た要部平面図である。なお、従
来の液晶表示装置１と同一部材には同一符号を付す。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a display device of the present invention will be described in detail with a liquid crystal display device. 1 to 4 show a liquid crystal display device 14 of the present invention, FIG. 1 is a plan view thereof, FIG. 2 is a schematic sectional view showing a relationship between a liquid crystal panel 15 as the display plate and a wiring board 16, FIG. 3 shows the liquid crystal panel 1 of the wiring board 16.
5 is a schematic cross-sectional view illustrating an arrangement configuration with respect to FIG. FIG. 4 is a plan view of a main part viewed from the direction of arrow a in FIG. Note that the same members as those of the conventional liquid crystal display device 1 are denoted by the same reference numerals.

【００１３】液晶表示装置１４においては、矩形状の液
晶パネル１５の対向辺には２個のプリント基板等の配線
基板１６を配し、液晶パネル１５の他辺端部には配線基
板１７を並設している。In the liquid crystal display device 14, two wiring boards 16 such as printed boards are arranged on opposite sides of a rectangular liquid crystal panel 15, and wiring boards 17 are arranged side by side on the other side of the liquid crystal panel 15. Has been established.

【００１４】本例では、さらに図２〜図４に示すように
配線基板１６でもって本発明の配設構造を述べる。In this embodiment, an arrangement structure of the present invention will be described with a wiring board 16 as shown in FIGS.

【００１５】配線基板１６は液晶パネル１５の対向辺
に、それぞれ設けている。そして、配線基板１６は液晶
パネル１５に対し自在になるように金やアルミニウムな
どからなるワイヤ１８によって結ばれている。The wiring boards 16 are provided on opposite sides of the liquid crystal panel 15, respectively. The wiring board 16 is connected to the liquid crystal panel 15 by wires 18 made of gold, aluminum, or the like so as to be free.

【００１６】液晶表示装置１４の液晶パネル１５におい
ても、コモン側のガラス基板である上ガラス基板２とセ
グメント側のガラス基板である下ガラス基板３との間に
液晶を封入し、それぞれの内面には表示電極を相互に直
交するように配列して表示領域４をなしている。そし
て、表示電極４は下ガラス基板３の非表示領域９に設け
た出力側配線１０と接続している。Also in the liquid crystal panel 15 of the liquid crystal display device 14, liquid crystal is sealed between the upper glass substrate 2 which is a common side glass substrate and the lower glass substrate 3 which is a segment side glass substrate. The display region 4 is formed by arranging display electrodes so as to be orthogonal to each other. The display electrode 4 is connected to an output wiring 10 provided in the non-display area 9 of the lower glass substrate 3.

【００１７】配線基板１６の上には複数の駆動用ＩＣ８
を配列し、ボンデイングパッド１１も形成している。そ
して、駆動用ＩＣ８の端子は出力側配線のボンデイング
パッド１０およびボンデイングパッド１１の各端子とボ
ンデイング用のワイヤ１８、１９でもって接続されてい
る。A plurality of driving ICs 8 are provided on the wiring board 16.
And the bonding pad 11 is also formed. The terminals of the driving IC 8 are connected to the terminals of the bonding pad 10 and the bonding pad 11 of the output side wiring by bonding wires 18 and 19.

【００１８】さらに出力側配線１０の上にたとえばエポ
キシ系樹脂、シリコン系樹脂などからなる絶縁性合成樹
脂２０を被覆し、駆動用ＩＣ８とボンデイングパッド１
１の上にたとえばエポキシ系樹脂、シリコン系樹脂など
からなる絶縁性合成樹脂２１を被覆している。このよう
に樹脂被覆することで、ワイヤ１８の両端付近が固定さ
れ、ワイヤ１８のほぼ中央付近でもって折れ曲げること
ができる。Further, the output side wiring 10 is coated with an insulating synthetic resin 20 made of, for example, an epoxy-based resin, a silicon-based resin or the like, so that the driving IC 8 and the bonding pad 1 are covered.
1 is coated with an insulating synthetic resin 21 made of, for example, an epoxy resin or a silicon resin. By coating with the resin in this manner, the vicinity of both ends of the wire 18 is fixed, and the wire 18 can be bent near substantially the center.

【００１９】上記構成においては、配線基板１６と液晶
パネル１５とが、かかるワイヤ１８によって結ばれてい
るので、図３に示すように駆動用ＩＣ８の端子と出力側
配線１０が対向するように、配線基板１６を液晶パネル
１５の非表示領域９上に配することができる。In the above configuration, since the wiring board 16 and the liquid crystal panel 15 are connected by the wires 18, the terminals of the driving IC 8 and the output-side wirings 10 face each other as shown in FIG. The wiring board 16 can be arranged on the non-display area 9 of the liquid crystal panel 15.

【００２０】ただし、本例に示す他方の配線基板１７に
ついては、従来の配線基板５の配設構造と同じように設
けている。すなわち、ステンレス（ＳＵＳ）等から成る
金属プレート６の上に下ガラス基板３と配線基板１７と
をテープ（たとえば日東電工（株）製Ｎｏ．３１６１−
Ｆ〔黒色片面テープ〕とＮｏ．５９１５〔両面テー
プ〕）でもって貼り付け固定し、黒色接着樹脂層７を介
在させている。However, the other wiring board 17 shown in the present embodiment is provided in the same manner as the conventional wiring board 5 arrangement structure. That is, the lower glass substrate 3 and the wiring substrate 17 are taped on a metal plate 6 made of stainless steel (SUS) or the like (for example, No. 3161 manufactured by Nitto Denko Corporation).
F [black one-sided tape] and No. 5915 (double-sided tape)), and the black adhesive resin layer 7 is interposed.

【００２１】上記配線基板１６、１７は、たとえば基板
内部に１種もしくは２種以上の配線層が形成できる多層
配線構造および／または両主面上に配線層を形成した構
造であって、駆動用ＩＣ８の駆動に必要な電源や信号線
を擁したバスライン群を配線している。さらに必要に応
じて電源、ロジック等の各系を層別に配線したり、ある
いは外部から供給される各種電源や信号の処理回路を搭
載してもよい。The wiring boards 16 and 17 have, for example, a multilayer wiring structure in which one or more wiring layers can be formed inside the boards and / or a structure in which wiring layers are formed on both main surfaces. A bus line group having a power supply and a signal line necessary for driving the IC 8 is wired. Further, if necessary, each system such as power supply and logic may be wired for each layer, or a processing circuit for various power supplies and signals supplied from the outside may be mounted.

【００２２】かくして上記構成の液晶表示装置１４によ
れば、配線基板１６と液晶パネル１５とをワイヤ１８に
よって結ぶことで、配線基板１６を液晶パネル１５の非
表示領域９上に配し、これによって装置の寸法が小さく
なり、小型になった。Thus, according to the liquid crystal display device 14 having the above configuration, the wiring board 16 and the liquid crystal panel 15 are connected to each other by the wires 18 so that the wiring board 16 is arranged on the non-display area 9 of the liquid crystal panel 15. The size of the device has become smaller and smaller.

【００２３】しかも、配線基板１６の液晶パネル１５に
対する配設構造によれば、従来のようにガラス基板３や
配線基板１６に応力が加えられるようなこともなく、下
ガラス基板３や配線基板１６が金属プレート１７から剥
がれるというような課題もなくなり、これによってワイ
ヤーボンデイング性が高められる。Further, according to the arrangement structure of the wiring substrate 16 with respect to the liquid crystal panel 15, no stress is applied to the glass substrate 3 and the wiring substrate 16 unlike the conventional case, and the lower glass substrate 3 and the wiring substrate 16 are not subjected to stress. There is no problem that the metal is peeled off from the metal plate 17, thereby improving the wire bonding property.

【００２４】なお、本例においては、配線基板１６でも
って本発明の配設構造を述べたが、配線基板１７に対し
ても同様な液晶パネル１５に対し自在になるように金や
アルミニウムなどからなるワイヤ１８によって結ぶこと
で、本発明の作用効果が得られる。In the present embodiment, the arrangement structure of the present invention has been described using the wiring board 16. However, the wiring board 17 is made of gold, aluminum, or the like so as to be freely attached to the similar liquid crystal panel 15. The effect of the present invention can be obtained by tying the wires 18 together.

【００２５】本発明の液晶表示装置１４によれば、装置
内の装着するに当たり、配線基板１６を筐体に当接させ
るよりも、筐体とに隙間を設けて負荷がかからないよう
にするとよい。According to the liquid crystal display device 14 of the present invention, it is preferable to provide a gap between the wiring board 16 and the housing so that a load is not applied when the wiring board 16 is mounted inside the device.

【００２６】また、上記構成の液晶表示装置１４におい
て、配線基板１６と液晶パネル１５とを結ぶワイヤ１８
に対し絶縁性の保護樹脂を被覆するとよく、これによっ
て狭いピッチに配列した各ワイヤ１８の間にて電気的な
短絡（ショート）がなくなる。In the liquid crystal display device 14 having the above configuration, the wires 18 connecting the wiring board 16 and the liquid crystal panel 15 are provided.
In this case, it is preferable to coat an insulating protective resin, so that there is no electrical short between the wires 18 arranged at a narrow pitch.

【００２７】上記ワイヤ被覆用樹脂には、被覆後にて柔
軟性があり、かつワイヤの曲げ加工性に追従できるとい
う特性が求められ、そのような樹脂として、たとえばエ
ポキシ系樹脂、シリコン系樹脂がある。The above-mentioned resin for wire coating is required to have characteristics of being flexible after coating and of being able to follow the bending workability of the wire. Examples of such resins include epoxy resins and silicone resins. .

【００２８】また、ワイヤに被覆するには、スプレーに
よる噴霧によってコーティングしたり、あるいはディッ
ピングしてもよい。スプレーによる噴霧であれば、ロボ
ットアームの先端にスプレーノズルを取り付け、さらに
被噴霧領域以外をマスクでもって覆うことで、その被噴
霧領域にそってロボットアームの先端を移動することで
所要とおりの噴霧ができる。The wire may be coated by spraying or dipping. In the case of spraying by spraying, a spray nozzle is attached to the tip of the robot arm, and the area other than the area to be sprayed is covered with a mask, and the tip of the robot arm is moved along the area to be sprayed as required to perform spraying. Can be.

【００２９】このような構成の液晶表示装置１４であれ
ば、まずワイヤ１８に対し絶縁性の保護樹脂を被覆し、
その後に出力側配線１０の上に絶縁性合成樹脂２０を被
覆し、さらに駆動用ＩＣ８とボンデイングパッド１１の
上にも絶縁性合成樹脂２１を被覆し、そして、配線基板
１６を液晶パネル１５の非表示領域９上に配すればよ
い。In the case of the liquid crystal display device 14 having such a configuration, first, the wire 18 is coated with an insulating protective resin.
After that, the insulating synthetic resin 20 is coated on the output side wiring 10, and the insulating synthetic resin 21 is further coated on the driving IC 8 and the bonding pad 11. What is necessary is just to arrange on the display area 9.

【００３０】なお、本発明は上記の実施形態例に限定さ
れるものではなく、本発明の要旨を逸脱しない範囲内で
種々の変更や改良等は何ら差し支えない。たとえば、本
例では、表示板状体として液晶パネルでもって説明した
が、その他の表示装置としてプラズマ、ＥＬ等からなる
表示板状体においても同様な作用効果がある。It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements may be made without departing from the scope of the present invention. For example, in this example, the liquid crystal panel has been described as the display plate, but a similar operation and effect can be obtained in a display plate made of plasma, EL, or the like as another display device.

【００３１】[0031]

【発明の効果】以上のように、本発明の表示装置によれ
ば、表示板状体の端部付近に設けた非表示領域上に複数
の電極端子を配列してなる一方の電極端子群を形成し、
配線基板上に複数の電極端子を配列してなる他方の電極
端子群を形成し、一方の電極端子群と他方の電極端子群
とをワイヤにて接続した装置構成において、一方の電極
端子群および他方の電極端子群の上に絶縁性合成樹脂を
被覆して、双方の電極端子群が対向するように、配線基
板を表示板状体の非表示領域上に配したことで、装置の
寸法が小さくなり、小型化が達成できた。As described above, according to the display device of the present invention, one electrode terminal group in which a plurality of electrode terminals are arranged on a non-display area provided near the end of the display plate is formed. Forming
In a device configuration in which the other electrode terminal group formed by arranging a plurality of electrode terminals on a wiring board and one electrode terminal group and the other electrode terminal group are connected by a wire, one electrode terminal group and By coating the insulating synthetic resin on the other electrode terminal group and disposing the wiring board on the non-display area of the display plate so that both electrode terminal groups face each other, the dimensions of the device are reduced. It became smaller and smaller.

【００３２】しかも、本発明の表示装置によれば、液晶
表示装置にて、従来のようにガラス基板や配線基板に応
力が加えられるようなこともなく、ガラス基板や配線基
板が金属プレートから剥がれるというような課題もなく
なり、これによってワイヤーボンデイング性が高めら
れ、高品質な液晶表示装置が提供できた。Further, according to the display device of the present invention, in the liquid crystal display device, the glass substrate or the wiring substrate is separated from the metal plate without applying stress to the glass substrate or the wiring substrate as in the conventional case. Such a problem was eliminated, thereby improving the wire bonding property, and providing a high quality liquid crystal display device.

【００３３】しかも、このような金属プレートを用いな
いことで、その分、軽量化がはかられた。Furthermore, by not using such a metal plate, the weight was reduced accordingly.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る液晶表示装置の平面図である。FIG. 1 is a plan view of a liquid crystal display device according to the present invention.

【図２】本発明に係る液晶表示装置において液晶パネル
と配線基板との関係を示す概略断面図である。FIG. 2 is a schematic sectional view showing a relationship between a liquid crystal panel and a wiring board in the liquid crystal display device according to the present invention.

【図３】本発明に係る液晶表示装置において配線基板の
液晶パネルに対する配置構成を示す概略断面図である。FIG. 3 is a schematic cross-sectional view showing an arrangement configuration of a wiring substrate with respect to a liquid crystal panel in the liquid crystal display device according to the present invention.

【図４】図２中の矢印ａ方向から見た要部平面図であ
る。FIG. 4 is a plan view of a main part viewed from a direction of an arrow a in FIG. 2;

【図５】従来の液晶表示装置の平面図である。FIG. 5 is a plan view of a conventional liquid crystal display device.

【図６】図５中に示すＡ領域の拡大平面図である。6 is an enlarged plan view of an area A shown in FIG.

【図７】図６において矢印ｂ方向から見た側面図であ
る。FIG. 7 is a side view seen from the direction of arrow b in FIG.

【図８】図６において矢印ｂの方向から見た側面図であ
る。FIG. 8 is a side view as viewed from the direction of arrow b in FIG.

【図９】図６において矢印ｃの方向から見た側面図であ
る。FIG. 9 is a side view as viewed from the direction of arrow c in FIG.

【図１０】図６において矢印ｃの方向から見た側面図で
ある。FIG. 10 is a side view as seen from the direction of arrow c in FIG.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】表示領域を有する表示板状体と、該表示板
状体に表示信号を入力する長尺状の配線基板とからな
り、上記表示板状体の端部付近に設けた非表示領域上に
複数の電極端子を配列してなる一方の電極端子群を形成
し、前記配線基板上に複数の電極端子を配列してなる他
方の電極端子群を形成し、一方の電極端子群と他方の電
極端子群とをワイヤにて接続した表示装置において、前
記一方の電極端子群および他方の電極端子群の上に絶縁
性合成樹脂を被覆して、双方の電極端子群が対向するよ
うに、配線基板を表示板状体の非表示領域上に配したこ
とを特徴とする表示装置。1. A display plate comprising a display plate having a display area and a long wiring board for inputting a display signal to the display plate, wherein a non-display provided near an end of the display plate. One electrode terminal group formed by arranging a plurality of electrode terminals on the region is formed, and the other electrode terminal group formed by arranging a plurality of electrode terminals on the wiring board is formed. In a display device in which the other electrode terminal group is connected by wires, an insulating synthetic resin is coated on the one electrode terminal group and the other electrode terminal group so that both electrode terminal groups face each other. And a wiring board disposed on a non-display area of the display plate.
JP27755299A 1999-09-29 1999-09-29 Display device Pending JP2001100648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27755299A JP2001100648A (en) 1999-09-29 1999-09-29 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27755299A JP2001100648A (en) 1999-09-29 1999-09-29 Display device

Publications (1)

Publication Number Publication Date
JP2001100648A true JP2001100648A (en) 2001-04-13

Family

ID=17585130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27755299A Pending JP2001100648A (en) 1999-09-29 1999-09-29 Display device

Country Status (1)

Country Link
JP (1) JP2001100648A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022204015A1 (en) * 2021-03-26 2022-09-29 Corning Incorporated Methods and systems for managing electrical connections during assembly of glass articles with displays

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022204015A1 (en) * 2021-03-26 2022-09-29 Corning Incorporated Methods and systems for managing electrical connections during assembly of glass articles with displays

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