JP2001094025A - Electronic component and method for manufacturing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide technique which enables miniaturization and cost reduction of an electronic component. SOLUTION: In this electronic component, an electrode is connected with a functional element, and a part of the electrode is exposed from an insulator covering the functional element, which is connected to the inside end surface of the electrode. An insulator is formed on at least a part of an external end surface and a peripheral surface of the electrode and is unified in a body with the insulator covering the functional element. One ends of the plurality of functional elements are connected with an electrode plate on which the plurality of electrodes are collectively formed. The insulator covering the functional elements and the insulator covering at least a part of the external end surface and the peripheral surface of the electrodes are formed into a unified body. The electrode plate, on which the insulator is formed, is cut out and divided into individual electronic components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component or a manufacturing method, and more particularly to a technology effective when applied to miniaturization of electronic components such as a diode.

[0002]

2. Description of the Related Art In semiconductor devices, with the progress of miniaturization, high integration of mounting more circuits on a single semiconductor pellet has been promoted. However, if all the elements that make up a semiconductor integrated circuit are integrated into a single pellet, the integrated circuit must be redesigned every time a trivial specification change occurs due to a model change, etc., and prompt response is difficult. Becomes Therefore, in order to cope with such minor changes, a configuration is adopted in which a part of circuit elements such as transistors are externally mounted on a semiconductor integrated circuit on a mounting substrate without being integrated, and by changing the externally mounted electronic components, A method of coping with minor changes while using the same semiconductor integrated circuit device is adopted.

In the field of semiconductors, individual semiconductor devices have been reduced in thickness to reduce the mounting area and volume.
Miniaturization is always required, and miniaturization is also required for such a single electronic component. For example, in the case of a single diode, an external dimension 1005 (planar shape 1 m
(m × 0.5 mm) is required.

At present, as such a diode, for example, a DHD type glass diode is used. In the glass diode, a lead wire is formed by welding a Dumet wire and a CP wire, and the lead wire is formed on a glass sleeve by a jig. After charging one end, and then charging the pellet, the jig charged with another lead wire was joined from the other end of the glass sleeve, and the combination was heated together with the jig in a sealing furnace, and the dumet wire and glass After sealing the element by welding with the sleeve, the CP wire of the lead wire exposed from the glass sleeve is subjected to solder plating in order to improve solder wettability during mounting.

In addition to such a glass diode, a resin-type resin diode is used. In the resin diode, a pellet is bonded to one of the leads of a lead frame in which a plurality of sets of leads are integrally formed. Wire bond the pellet and the other lead,
After sealing the inner ends of the pellets, bonding wires, and leads with resin or the like, the frame and unnecessary leads are cut to form individual diodes.

[0006]

However, with such conventional product shapes, there is a limit to downsizing of the product and reduction of the unit price, and it has become impossible to cope with further downsizing of the product and reduction of the unit price. That is, in the DHD type glass diode, the diameter of the lead wire or the glass sleeve is limited,
It is more difficult to reduce the size than the current situation. In addition, in the resin type, pellets are attached to the leads and wiring is performed by wires. Therefore, the loop height is added to the thickness of the leads and the thickness of the pellets, making it difficult to reduce the size of the product. There is a limit to cost reduction due to index restrictions.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a technique capable of reducing the size and cost of an electronic component. The above and other problems and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows. In an electronic component in which an electrode is connected to a functional element and a part of the electrode is exposed from an insulator covering the functional element, the functional element is connected to an inner end face of the electrode, and an outer end face and a peripheral face of the electrode An insulator is formed on at least a part of the insulator, and the insulator and the insulator covering the functional element are integrated.

Further, in the manufacturing method, one end of each of the plurality of functional elements is connected to an electrode plate on which the plurality of electrodes are integrally formed, and an insulator covering the functional elements; An insulator covering at least a part of the peripheral surface is integrally formed, and the electrode plate on which the insulator is formed is cut and separated into individual electronic components.

According to the above-described means, since the functional element is sandwiched between the electrodes and sealed with the resin,
Products can be downsized. In addition, since batch processing can be performed in the manufacturing process, product cost can be reduced.

Hereinafter, the configuration of the present invention will be described together with embodiments. In all the drawings for describing the embodiments, components having the same functions are denoted by the same reference numerals, and repeated description thereof will be omitted.

[0012]

FIG. 1 is a perspective view showing a small chip diode as an electronic component according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a part of FIG. FIG. 3 is a perspective view showing the resin except for the resin of FIG. FIG.
5 is a longitudinal sectional view along the line aa in FIG. 1, FIG. 5 is a longitudinal sectional view along the line bb in FIG.
FIG. 7 is a cross-sectional view along the line dd, and FIG. 7 is a cross-sectional view along the line dd.

The functional element according to the present embodiment is a semiconductor pellet 1 on which a diode shown in FIG. 12 is formed. The semiconductor pellet 1 has an n-type diffusion layer 3 on the main surface of a semiconductor substrate 2 such as p-type single crystal silicon. Is formed, and the n-type diffusion layer 3 is formed.
A protruding electrode 4 made of silver or the like is formed on the
Is covered with an insulating film 5 made of, for example, silicon oxide, and a back electrode 6 formed by vapor deposition or the like using silver or the like is formed on the back surface opposite to the main surface of the p-type semiconductor substrate 2. I have.

As an electronic component, the semiconductor pellet 1
Is sandwiched between a pair of electrodes 7, 7 and the semiconductor pellet 1 is sealed with a resin 8 as an insulator. Each electrode 7 has a cross-shaped semicircular groove 7a formed in a cross shape connecting sides facing the outer end surface, and a semicircular cross-sectional groove 7b formed continuously from the groove 7a to vertically cross each peripheral surface. Have been.

A semiconductor pellet 1 is provided on the inner end face of each electrode 7.
The semiconductor pellet 1 is covered with a resin 8 formed in the center,
The resin 8 is also filled in the groove 7a formed on the outer end surface of each electrode 7 and the groove 7b formed on the peripheral surface of the electrode 7.
The resin 8 is formed in a cross shape on the outer end surface of the electrode 7 to connect the opposing sides to each other, and is integrated with the resin 8 covering the semiconductor pellet 1 by the resin 8 formed on the peripheral surface. The joining of the pellet 1 or the joining of the electrode 7 and the resin 8 can be stabilized.

As shown in FIG. 8, the electrode 7 connected to the protruding electrode 4 of the semiconductor pellet 1 and the semiconductor pellet 1
By changing the distance from the inner end face to the outer end face, that is, the thickness of the electrode 7 with the electrode 7 connected to the back electrode 6, the position of the resin 8 at the center changes, and the anode / cathode is identified based on this position. It can be a polarity display.
By changing the color of the resin 8 that is used elsewhere, it is possible to distinguish the varieties.

Further, as shown in FIG. 9, by covering the entire outer end face of the electrode 7 with the resin 8, the bonding becomes stronger, and in addition, the solder does not adhere to the outer end face of the electrode 7 when mounted on the substrate. Even when the interval between components is small, there is no short circuit with other components.

Further, as shown in FIG.
Forms a groove 7a having a semicircular cross-section in an X-shape connecting the corners facing the outer end face, and forms a groove 7b having a semicircular cross-section continuously traversing each peripheral corner from the groove 7a. Thereby, the connection area at the time of mounting the electrode 7 can be increased.

As shown in FIG. 11, a projection 7c is provided on the inner end face of the electrode 7, and the semiconductor pellet 1 is connected to the projection 7c. With this configuration, the distance between the outside and the element is increased, and defects such as migration (silver migration) due to intrusion of a plating solution or the like can be prevented. Further, by providing the projections 7c on the electrodes 7, it is possible to cope with semiconductor pellets 1 having different thicknesses.

Next, a method of manufacturing an electronic component according to the present embodiment will be described with reference to FIGS.

FIG. 13 is a plan view showing an electrode plate on which a plurality of electrodes 7 are integrally formed. For example, copper is used for the electrode plate 9 and guide holes 9a for positioning are provided at its four corners. ing. The electrode plate 9 is cut in the vertical and horizontal directions by dicing to become individual electrodes 7, and a region where a plurality of the regions are formed is a portion surrounded by a broken line in the drawing. A guide line 9b at the time of cutting is provided around this portion. FIG. 14 shows FIG.
FIG. 15 is an enlarged partial plan view showing a part a in FIG. 14, FIG. 15 is a longitudinal sectional side view along line bb in FIG. 14, and FIG. 16 is a longitudinal sectional view along line cc in FIG. It is a side view. FIG.
The portion with the middle oblique line is the cutting region, and the portion surrounded by the cutting region corresponds to each electrode 7, and an oblong hole serving as a vertical groove 7 b is formed on four sides thereof, Grooves 7a are formed in a cross shape connecting the opposing sides of the regions to be the individual electrodes 7 respectively.

First, as shown in FIG. 17, a plurality of semiconductor pellets 1 formed collectively on a wafer and separated into individual elements by dicing are accommodated in a jig 10 and are connected to the back electrode 6 connection region of the semiconductor pellet 1. The jig 10 is aligned with the electrode plate 9 on the back surface to which the bonding agent 11 has been applied. In this state, the bottom plate 10 a of the jig 10 is removed, and the semiconductor pellet 1 is placed at a predetermined position on the electrode plate 9.

Next, as shown in FIG. 18, an electrode plate 9 on the main surface on which a bonding agent 12 is applied is aligned and connected to a connection region of the semiconductor pellet 1 to the protruding electrode 4, and the electrode plate 9 on the back surface is connected. A plurality of semiconductor pellets 1 are sandwiched between the electrode plate 9 and the main surface side electrode plate 9. Heating is performed in this state to dry the bonding agents 11 and 12, and the upper and lower electrode plates 7 and the element 5 are bonded by the bonding agent. In addition, as the bonding agents 11 and 12, a silver paste or a solder paste is used, and application is performed by a dispenser or screen printing.

Next, as shown in FIG. 19, the electrode plates 9, 9 and the plurality of semiconductor pellets 1 are accommodated in a mold 13, and the mold 13 is filled with a resin to perform resin sealing.

Next, the resin-sealed electrode plates 9 and 9
Then, a plurality of semiconductor pellets 1 are attached to a film 14 and the individual electrodes 7 are attached by a blade or a wire.
20 is cut in the vertical and horizontal directions by dicing or the like between the respective regions (shown by broken lines).
As shown in FIG.

Thereafter, the film 14 is peeled off, and the exposed parts of the electrodes 7 are subjected to a surface treatment, for example, by applying solder or the like by barrel plating.

In the present embodiment, the grooves 7a and 7b have a semicircular cross section, but may have another shape such as a triangular cross section as shown in FIG. An electronic component formed using the electrode plate of FIG. 21 has a form shown in FIG.

The electrode 7 exposed from the resin 8 as an insulator has a shape exposed only from one surface of the resin 8, a shape exposed only from two adjacent surfaces, or a shape exposed only from one surface, that is, exposed only from three surfaces. It may be shaped. Such a difference in the shape of the exposed surface makes it possible to distinguish between various types.

In this embodiment, a diode has been described as an electronic component. However, the present invention can be applied to other two-terminal electronic components such as a thermistor, a capacitor, a light emitting diode, and a resistor.

By separating the electrode by penetrating one of the two cross-shaped grooves of the electrode used in the above-described embodiment, the present invention can be applied to a three-terminal transistor or a four-terminal rectifying bridge. It is possible.

As described above, the invention made by the present inventor is:
Although a specific description has been given based on the above-described embodiment, the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the invention.

[0032]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows. (1) According to the present invention, since the functional element is sandwiched between the electrodes and sealed with resin, there is an effect that the size of the product can be reduced.

(2) According to the present invention, since batch processing can be performed in the manufacturing process, there is an effect that the cost of products can be reduced.

(3) According to the present invention, since the insulator integrated with the insulator for sealing the functional element is also formed on the outer end surface and the peripheral surface of the electrode, the bonding between the functional element and the electrode is stabilized. There is an effect that can be made.

(4) According to the present invention, since the insulator integrated with the insulator for sealing the functional element is also formed on the outer end surface and the peripheral surface of the electrode, the bonding between the insulator and the electrode is stabilized. There is an effect that can be made.

(5) According to the present invention, since the electrodes are provided on four sides with good stability in a dice shape, there is an effect that the substrate can be mounted on any surface.

(6) According to the present invention, by forming the insulator in a cross shape on the outer end face of the electrode, the substrate can be mounted at two places of the electrode, and the connection can be made more reliably. is there.

(7) According to the present invention, there is an effect that the mounting area of the electrode can be increased by forming the insulator in an X-shape on the outer end face of the electrode.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a small chip diode which is an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a part of FIG.

FIG. 3 is a perspective view showing a state in which a resin in FIG. 2 is omitted.

FIG. 4 is a longitudinal sectional view taken along the line aa in FIG.

FIG. 5 is a longitudinal sectional view taken along line bb in FIG. 1;

FIG. 6 is a transverse sectional view taken along the line cc in FIG. 1;

FIG. 7 is a transverse sectional view taken along line dd in FIG. 1;

FIG. 8 is a perspective view showing a modification of the embodiment of the present invention.

FIG. 9 is a perspective view showing a modification of the embodiment of the present invention.

FIG. 10 is a perspective view showing a modification of the embodiment of the present invention.

FIG. 11 is a longitudinal sectional view showing a modification of the embodiment of the present invention.

FIG. 12 is a vertical cross-sectional view showing a semiconductor pellet serving as a functional element according to one embodiment of the present invention.

FIG. 13 is a plan view showing an electrode plate used for manufacturing an electronic component according to one embodiment of the present invention.

FIG. 14 is an enlarged partial plan view showing an electrode plate used for manufacturing an electronic component according to an embodiment of the present invention.

FIG. 15 is a longitudinal sectional view taken along the line bb in FIG. 14;

FIG. 16 is a longitudinal sectional view taken along the line cc in FIG. 14;

FIG. 17 is a longitudinal sectional view illustrating the method for manufacturing the electronic component according to the embodiment of the present invention.

FIG. 18 is a longitudinal sectional view illustrating the method for manufacturing the electronic component according to the embodiment of the present invention.

FIG. 19 is a longitudinal sectional view illustrating the method for manufacturing the electronic component according to one embodiment of the present invention.

FIG. 20 is a perspective view illustrating the method for manufacturing the electronic component according to the embodiment of the present invention.

FIG. 21 is a partial plan view showing a modification of the electrode plate used for manufacturing the electronic component according to one embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor pellet, 2 ... Semiconductor substrate, 3 ... Diffusion layer, 4
... projecting electrode, 5 ... insulating film, 6 ... back electrode, 7 ... electrode, 7
a, 7b groove, 8 resin, 9 electrode plate, 10 jig, 1
0a: bottom plate, 11, 12: bonding agent, 13: mold, 14 ...
the film.

Claims (11)

[Claims] An electronic component in which an electrode is connected to a functional element and a part of the electrode is exposed from an insulator covering the functional element, wherein the functional element is connected to an inner end surface of the electrode, and An electronic component, wherein an insulator is formed on at least a part of an outer end surface and a peripheral surface, and the insulator and the insulator covering the functional element are integrated. 2. The electronic component according to claim 1, wherein electrodes are connected to both surfaces of the functional element. 3. The electronic component according to claim 2, wherein the thickness of each of the electrodes connected to the both surfaces is different. 4. The semiconductor device according to claim 1, wherein an insulator formed on the electrode is filled in a groove formed on the outer end face and the peripheral face. Electronic components. 5. The electronic component according to claim 1, wherein the functional element is a semiconductor pellet on which a diode is formed. 6. The functional element according to claim 1, wherein a projection electrode is formed on a main surface of the functional element, and a back surface electrode is formed on a back surface opposite to the main surface. The electronic component according to claim 1. 7. A method for manufacturing an electronic component in which an electrode is connected to a functional element and a part of the electrode is exposed from an insulator covering the functional element, wherein an electrode plate on which a plurality of the electrodes are integrally formed A step of connecting one end of the plurality of functional elements to an insulator; a step of integrally forming an insulator covering the functional element, and an insulator covering at least a part of an outer end surface and a peripheral surface of the electrode; Cutting the electrode plate on which the body is formed and separating it into individual electronic components. 8. The method according to claim 7, further comprising a step of connecting an electrode plate to the other end of the plurality of functional elements connected to the electrode plate. 9. The method according to claim 8, wherein the thickness of each electrode plate connected to the functional element is different. 10. The method according to claim 7, wherein an insulator formed on the electrode is filled in a groove formed on the outer end surface and the peripheral surface. Manufacturing method of electronic components. 11. The method according to claim 7, wherein the functional element is a semiconductor pellet on which a diode is formed.