JP2001085819A5 - - Google Patents

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Publication number
JP2001085819A5
JP2001085819A5 JP2000228296A JP2000228296A JP2001085819A5 JP 2001085819 A5 JP2001085819 A5 JP 2001085819A5 JP 2000228296 A JP2000228296 A JP 2000228296A JP 2000228296 A JP2000228296 A JP 2000228296A JP 2001085819 A5 JP2001085819 A5 JP 2001085819A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000228296A
Other versions
JP2001085819A (ja
Filing date
Publication date
Priority claimed from US09/369,898 external-priority patent/US6320754B1/en
Application filed filed Critical
Publication of JP2001085819A publication Critical patent/JP2001085819A/ja
Publication of JP2001085819A5 publication Critical patent/JP2001085819A5/ja
Withdrawn legal-status Critical Current

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JP2000228296A 1999-08-06 2000-07-28 集積回路応力低減装置 Withdrawn JP2001085819A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US369898 1999-08-06
US09/369,898 US6320754B1 (en) 1999-08-06 1999-08-06 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package

Publications (2)

Publication Number Publication Date
JP2001085819A JP2001085819A (ja) 2001-03-30
JP2001085819A5 true JP2001085819A5 (ja) 2007-09-06

Family

ID=23457388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000228296A Withdrawn JP2001085819A (ja) 1999-08-06 2000-07-28 集積回路応力低減装置

Country Status (6)

Country Link
US (1) US6320754B1 (ja)
JP (1) JP2001085819A (ja)
KR (1) KR100709832B1 (ja)
DE (1) DE10034309B4 (ja)
GB (1) GB2356084B (ja)
TW (1) TW497233B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235886B1 (en) * 2001-12-21 2007-06-26 Intel Corporation Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
US20030116860A1 (en) * 2001-12-21 2003-06-26 Biju Chandran Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses
US20040240188A1 (en) * 2003-05-28 2004-12-02 Cromwell Stephen Daniel Protective coating for attach hardware for circuits
DE10340866A1 (de) * 2003-09-04 2005-03-31 Siemens Ag Verfahren zum Befestigen einer Elementgruppe an einer Trägerschicht
US20120081872A1 (en) 2010-09-30 2012-04-05 Alcatel-Lucent Canada Inc. Thermal warp compensation ic package
DE102018104521B4 (de) 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate
CN108550559A (zh) * 2018-05-28 2018-09-18 北京比特大陆科技有限公司 散热片、芯片组件及电路板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107247A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Hybrid integrated circuit
US4437718A (en) * 1981-12-17 1984-03-20 Motorola Inc. Non-hermetically sealed stackable chip carrier package
JPS58138050A (ja) * 1982-02-10 1983-08-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
DE69123626T2 (de) 1990-04-16 1997-04-17 Fujitsu Ltd Chipträger zum Herstellen einer Mikrowellen-Halbleiteranordnung hoher Leistung durch Anordnen eines Halbleiterchips darauf
GB2276977B (en) 1992-12-08 1996-09-18 Hughes Aircraft Co Thermal matched ic chip assembly and fabrication method
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JP2828021B2 (ja) * 1996-04-22 1998-11-25 日本電気株式会社 ベアチップ実装構造及び製造方法
US5868887A (en) 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method for minimizing warp and die stress in the production of an electronic assembly
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US5877070A (en) * 1997-05-31 1999-03-02 Max-Planck Society Method for the transfer of thin layers of monocrystalline material to a desirable substrate
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US5936304A (en) 1997-12-10 1999-08-10 Intel Corporation C4 package die backside coating
US6081416A (en) * 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic

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