JP2001081332A - Curable composition and curable conductive composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a curable composition which can exhibit excellent workability and excellent storage stability at higher temperatures than room temperature by compounding an organic compound having one or more specific groups, a hydrosilyl group-containing compound, a hydrosilylation catalyst, and an amine. SOLUTION: This curable composition contains (A) an organic compound having at least one alkenyl group capable of being hydrosilylated in the molecule, (B) a compound having at least two hydrosilyl groups in the molecule, (C) a hydrosilylation catalyst, and (D) an amine as essential components. The curable composition may preferably further contain (E) an acetylene alcohol. The organic compound of the component A is preferably an isobutylenic polymer and/or a polyoxyalkylene-based polymer. The component B is preferably used in such an amount that the amount of the silicon atom-bound hydrogen atoms of the component B is 0.8 to 5.0 equivalents based on the total amount of the alkenyl groups of the component A. The component C is preferably used in an amount of 10-1 to 10-8 mole per mole of the alkenyl group of the component A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a curable composition and a curable conductive composition. More specifically, an organic compound having at least one alkenyl group capable of undergoing a hydrosilylation reaction in a molecule, a compound having at least two hydrosilyl groups in a molecule, a hydrosilylation catalyst, and a curable composition containing an amine as a main component The present invention also relates to a curable conductive composition comprising the above-mentioned component containing acetylene alcohol as an essential component, and a curable conductive composition comprising the above-mentioned component containing a conductivity-imparting substance as an essential component.

[0002]

2. Description of the Related Art An alkenyl group-containing organic compound, a compound containing a hydrosilyl group, and an addition-type curable composition using a hydrosilylation catalyst have already been published and are known (JP-A-3-188166, JP-A-3-294320).
etc). However, when the main component is a polymer, the viscosity is not necessarily low, and it is necessary to improve workability, processability, and the like.

In order to lower the viscosity of the above composition, a method of diluting with a plasticizer having a lower viscosity than the main component has been generally used. However, in this method, there is a concern that the reliability such as the physical properties of the cured product may be reduced due to the addition of a large amount of a plasticizer or the like.

[0004] On the other hand, these polymers have a property of decreasing in viscosity as the temperature rises. If a composition containing a polymer as a main component can be handled at a temperature higher than ordinary temperature, the reliability of physical properties and the like will increase. Good workability can be ensured without lowering workability. However, when the curable composition was handled at a temperature higher than room temperature, it gelled immediately, that is, the storage stability at room temperature or higher was extremely poor.

[0005] Even when the main component is not a polymer but a low molecular weight compound, it may be necessary to handle the compound at a high temperature, such as when the compound has a high softening temperature or low reactivity. There was a problem with stability.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and has a curability excellent in storage stability at a high temperature, which enables the composition to be handled at a temperature higher than room temperature. It provides a composition.

[0007]

Means for Solving the Problems The present inventors have intensively studied to solve the above-mentioned problems, and have studied an organic compound having an alkenyl group capable of performing a hydrosilylation reaction and a compound such as a compound having a hydrosilyl group and a hydrosilylation catalyst. In the curable material consisting of, by adding an amine as a storage stability improver, it is found that a composition having excellent storage stability at a temperature higher than room temperature can be obtained, and further adding acetylene alcohol It has been found that a composition having more excellent storage stability can be obtained, and the present invention has been accomplished.

That is, the present invention relates to (A) an organic compound having at least one hydrosilyl-reactive alkenyl group in a molecule, (B) a compound having at least two hydrosilyl groups in a molecule, and (C) a hydrosilylation compound. The present invention relates to a curable composition comprising a catalyst (D) an amine and a curable composition comprising the curable composition containing acetylene alcohol as an essential component as a component (E).

Further, the present invention relates to a curable conductive composition comprising the above components (A) to (E) and a conductivity-imparting substance as a component (F) as an essential component.

In the present invention, the flow of the curable composition refers to, for example, mixing, stirring, and discharging the curable composition, or injection into a mold or the like and / or compression by a press or the like to thereby cure the curable composition. Changing the shape or bonding. In the present invention, in the case of simply curing a curable composition at 30 ° C. or higher and lower than 100 ° C.,
It is not said that the curable composition is caused to flow. That is, 3
After sealing the product with a curable composition below 0 ° C,
When this is cured by heating at a temperature of 30 ° C. or more and less than 100 ° C., it is not said that the curable composition is fluidized.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The component (A) used in the present invention is an organic compound having at least one alkenyl group capable of undergoing a hydrosilylation reaction in a molecule.

Here, the alkenyl group is not particularly limited as long as it is a group containing a carbon-carbon double bond that is active in a hydrosilylation reaction. Examples of the alkenyl group include an aliphatic unsaturated hydrocarbon group such as a vinyl group, an allyl group, a methylvinyl group, a propenyl group, a butenyl group, a pentenyl group, and a hexenyl group, a cyclopropenyl group, a cyclobutenyl group, a cyclopentenyl group, and a cyclohexenyl group. And the like, a cyclic unsaturated hydrocarbon group, a methacryl group and the like. The component (A) in the present invention is desirably an organic compound having at least two alkenyl groups capable of undergoing a hydrosilylation reaction in a molecule. The component (A) in the present invention desirably has the alkenyl group capable of undergoing a hydrosilylation reaction introduced at the polymer terminal. When the alkenyl group is located at the terminal of the polymer as described above, the amount of the effective network chain of the finally formed cured product is increased, and a high-strength rubber-like cured product is easily obtained.

The component (A) used in the present invention may be an isobutylene-based polymer having at least one alkenyl group capable of undergoing a hydrosilylation reaction in the molecule. The term “isobutylene polymer” as used herein means a polymer in which the monomer units constituting the skeleton of the polymer mainly consist of isobutylene units. In this case, all of the monomers may be formed from isobutylene units, and the monomer units having copolymerizability with isobutylene are more preferably 50% (% by weight, the same applies hereinafter) of the isobutylene-based polymer. Is 3
The content may be 0% or less, particularly preferably 20% or less. However, in these polymer skeletons, from the viewpoint of moisture resistance, weather resistance, and heat resistance, the repeating unit constituting the main chain excluding the alkenyl group substantially does not contain a carbon-carbon unsaturated bond other than the aromatic ring. It is particularly preferred that it is composed of a saturated hydrocarbon. The isobutylene polymer used as the component (A) in the present invention includes butadiene, isoprene, 1,1 and 1, as long as the object of the present invention is achieved.
3-tetradecadiene, 1,9-decadiene, 1,5-
After polymerization, such as a polyene compound such as hexadiene 2
A small amount of unit monomer, preferably 10
% May be contained in the range of not more than%.

Specific examples of such a copolymer component constituting the main chain skeleton of the isobutylene polymer include 1-butene, 2-butene, 2-methyl-1-butene, 3-methyl-1-butene, Pentene, 4-methyl-1-pentene,
Hexene, vinylcyclohexane, methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, styrene, α-methylstyrene, dimethylstyrene, pt-butoxystyrene, p-hexenyloxystyrene, p-allyloxystyrene, p- Hydroxystyrene, β-pinene, indene, vinyldimethylmethoxysilane, vinyltrimethylsilane, divinyldimethoxysilane, divinyldimethylsilane, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, trivinylmethylsilane, Tetravinylsilane, allyldimethylmethoxysilane, allyltrimethylsilane, diallyldimethoxysilane, diallyldimethylsilane, γ-methacryloyloxypropyltrimethoxysilane, γ-methacryloyloxypro Methyl dimethoxysilane and the like.

The component (A) used in the present invention may be a polyoxyalkylene polymer. The term “oxyalkylene polymer” as used herein refers to a polymer in which 30% or more, preferably 50% or more of the units constituting the main chain are composed of oxyalkylene units. A compound having two or more active hydrogens, which is used as a starting material in the production of a polymer,
For example, units from ethylene glycol, bisphenol compounds, glycerin, trimethylolpropane, pentaerythritol and the like can be mentioned. In the case of an oxypropylene-based polymer, it may be a copolymer (including a graft polymer) with a unit composed of ethylene oxide, butylene oxide, or the like.

The molecular weight of the oxyalkylene-based polymer is 500 to 5 in terms of number average molecular weight (Mn) from the viewpoint of improving the balance between reactivity and low hardness.
It is preferably from 000, more preferably from 1,000 to 40,000. In particular, those having a number average molecular weight of 5,000 or more, more preferably 5,000 to 40,000 are preferred. When the number average molecular weight is less than 500, it becomes difficult to obtain sufficient mechanical properties (rubber hardness, elongation) and the like when the curable composition is cured. On the other hand, if the number average molecular weight is too large, the molecular weight per alkenyl group contained in the molecule will be large, or the reactivity will decrease due to steric hindrance, so curing is often insufficient, Further, the viscosity tends to be too high and the processability tends to be poor.

The alkenyl group contained in the oxyalkylene polymer is not particularly limited, but may be represented by the following general formula (1): H ₂ C ＝ C (R ¹ ) —CH ₂ — (1) (where R ¹ is An alkenyl group represented by a hydrogen atom or a methyl group) is particularly preferable because of excellent curability. One of the characteristics of this curable composition is that it is easy to set the hardness to be low, and in order to exhibit this characteristic, the number of alkenyl groups is preferably two or more at the molecular terminal. If the number of alkenyl groups is too large compared to the molecular weight of the component, the component becomes rigid and it becomes difficult to obtain good rubber elasticity.

The organic compound (A) of the present invention comprises:
They may be used alone or in combination of two.

The compound having a hydrosilyl group as the component (B) of the present invention is not limited as long as it contains two or more silicon-bonded hydrogen atoms in the molecule.
Here, the hydrosilyl group means a group having a Si—H bond, and in the present invention, the same silicon atom (S
When two hydrogen atoms (H) are bonded to i), it is calculated as two hydrosilyl groups.

As the component (B), polyorganohydrogensiloxane is one of preferred examples. The term "polyorganohydrogensiloxane" as used herein refers to a siloxane compound having a hydrocarbon group or a hydrogen atom on a silicon atom. To show the structure specifically,

[0021]

Embedded image Or two or more of these units, such as a chain or a ring represented by

[0022]

Embedded image And the like.

In using these components (B), compatibility with the components (A), (C) and (D),
Alternatively, those having good dispersion stability in the system are preferable. In particular, when the viscosity of the entire system is low, if a component having low compatibility with the above components is used as the component (B), phase separation may occur to cause poor curing. Further, a filler having a small particle size such as fine powder silica may be blended as a dispersing aid. (A) component, (C) component, (D)
To show concretely the compatibility with the components or the dispersion stability is relatively good,

[0024]

Embedded image And the like.

In the present invention, the amount of the component (B) used is based on the total amount of the alkenyl groups of the component (A).
Component (B) has a silicon-bonded hydrogen atom of 0.8 to 5.0.
It is preferable to use it in an equivalent amount. The above (A)
When the silicon-bonded hydrogen atom of the component (B) is less than 0.8 with respect to the total amount of the alkenyl groups of the component, crosslinking may be insufficient. On the other hand, if it exceeds 5.0, there is a problem that the physical properties are greatly changed due to the influence of silicon-bonded hydrogen atoms remaining after curing. In particular, when it is desired to suppress this effect, it is preferable to use the component (B) so as to be 1.0 to 2.0 equivalents.

The hydrosilylation catalyst which is the component (C) of the present invention is not particularly limited, and any catalyst can be used. Specifically, chloroplatinic acid, a simple substance of platinum,
Solid platinum supported on a carrier such as alumina, silica or carbon black; platinum-vinylsiloxane complex {for example, Pt _n (ViMe ₂ SiOSiMe ₂ Vi) n, P
t [(MeViSiO) ₄ ] _m }; platinum-phosphine complex {eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ }; platinum-phosphite complex {eg, Pt [P (OP
h) ₃ ] ₄ , Pt [P (OBu) ₃ ] ₄ (where, Me represents a methyl group, Bu represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, and n and m represent integers), Pt (acac)
₂ , the platinum-hydrocarbon complexes described in Ashby et al., U.S. Pat. Nos. 3,159,601 and 3,159,662, and Lamoreaux et al., U.S. Pat.
Platinum alcoholate catalysts described in JP-A-220972 are also included.

As an example of a catalyst other than a platinum compound,
Is RhCl (PPh_Three)_Three, RhCl _Three, Rh / Al
_TwoO_Three, RuCl_Three, IrCl_Three, FeCl_Three, AlCl_Three,
PdCl_Two・ 2H_TwoO, NiCl_Two, TiCl_Four, Etc.
Can be These catalysts may be used alone or in combination of two or more.
It may be used together. From the viewpoint of catalytic activity, chloroplatinic acid,
Platinum-olefin complex, platinum-vinylsiloxane complex,
Pt (acac)_TwoAre preferred. Especially for the amount of catalyst
There is no limitation, but 1 mol of alkenyl group in component (A)
10 for^-1-10^-8It is good to use in the range of mol.
Preferably 10^-2-10^-6Use in the range of mol
No. Also, hydrosilylation catalysts are generally expensive and corrosive.
In addition, a large amount of hydrogen gas is generated and the cured product foams
10^-1It is better not to use more than mole
Good.

The components (D) and (E) of the present invention comprise:
It is a component for improving the storage stability of a curable composition containing, as a main component, an organic compound having at least one alkenyl group capable of undergoing a hydrosilylation reaction in a molecule at a temperature higher than room temperature.

The amine compound as the component (D) used in the composition of the present invention is not particularly limited as long as it is a compound containing at least one nitrogen atom in the molecule, but the hydrosilylation catalyst of the component (C) From the point of not lowering the activity of
In particular, an amine compound containing no nitrogen-hydrogen bond in the molecule is preferable, and from the viewpoint of enhancing storage stability,
Amine compounds containing two nitrogen atoms in the molecule are preferred.

The amine compound as the component (D) preferably has the following structure.

[0031]

Embedded imageNote that R in the formula¹~ R^FourIs a monovalent having 1 to 20 carbon atoms
Is represented by R ^FiveAs the one having 1 to 20 carbon atoms
Having a saturated hydrocarbon group or an aromatic ring having 1 to 24 carbon atoms
Hydrocarbon groups (but not containing unsaturated groups other than aromatic rings)
Is preferred.

Specific examples of preferred component (D) include:
N, N, N ', N'-tetramethylethylenediamine,
N, N-dimethylethylenediamine, N, N-diethylethylenediamine, N, N-dibutylethylenediamine, N, N-dibutyl-1,3-propanediamine,
N, N-dimethyl-1,3-propanediamine, N,
N, N ', N'-tetraethylethylenediamine, N,
N-dibutyl-1,4-butanediamine, 2,2′-bipyridine and the like can be mentioned. Among these, N, N,
N ', N'-tetramethylethylenediamine is more preferred.

The amount of component (D) used is not particularly limited, but is preferably 1 to 10 parts per mole of the hydrosilylation catalyst of component (C).
It is preferable to use in a range of 50 molar equivalents. If the amount is too large, the activity of the hydrosilylation catalyst of the component (C) decreases, and if it is too small, the storage stability decreases.
The amine compound as the component (D) may be used alone, or two or more kinds may be used in combination.

The acetylene alcohol (E) used in the composition of the present invention is an unsaturated alcohol having an acetylene bond in the molecule.

[0035]

Embedded image It has a structure shown by. In particular, in these acetylene alcohols, the bulkiness of R ¹ or R ² is greatly involved in the storage stability, and the bulky R ¹ or R ² is preferable because of its excellent storage stability at high temperatures. . But if it gets too bulky,
Although it has excellent storage stability, it has the drawback of poor curability, and it is important to select acetylene alcohol having a good balance between storage stability and curability. R ¹ or R ² may be the same or different and is usually a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms, but is preferably a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms. . Examples of acetylene alcohols having a good balance between storage stability and curability include 2-phenyl-3-butyne-
2-ol, 1-ethynyl-1-cyclohexanol,
3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-hexyn-3-ol, 3-ethyl-1-pentyn-3-ol, 2-methyl-3-butyn-2-ol, 3-methyl-1-pentyn-3-ol and the like.

The amount of the component (E) can be almost arbitrarily selected as long as it is uniformly dispersed in the components (A) and (B). It is preferable to use in the range of 2 to 10,000 molar equivalents.

The acetylene alcohol of the component (E) may be used alone or in combination of two or more.

The component (F) used in the composition of the present invention can be used as a conductive material for a cured product obtained from a curable composition containing, as a main component, an organic compound having at least one alkenyl group capable of hydrosilylation in a molecule. It is a component for imparting properties.

Examples of the conductivity-imparting substance (F) include carbon black, metal oxides, metal fine powders, quaternary ammonium salts, carboxylic acid groups, sulfonic acid groups, sulfate ester groups, and phosphoric acid. Organic compound or polymer having an ester group or the like, ether ester imide,
Or ether imide polymer, ethylene oxide
Examples include compounds having a conductive unit represented by an epihalohydrin copolymer, methoxypolyethylene glycol acrylate, and the like, and compounds such as an antistatic agent such as a polymer compound.

The component (F) in the present invention may be used alone or in combination of two or more.

Examples of the carbon black include furnace black, acetylene black, lamp black, channel black, thermal black, oil black and the like. There is no limitation on the type, particle size, etc. of these carbon blacks, but the conductive resistance region is 10 ⁵
It is preferable to add Ωcm to 10 ¹³ Ωcm. The amount of the component (F) added depends on the amount of the polymer 10 of the component (A).
0.1 to 200 parts by weight, more preferably 1 to 1 part by weight per 0 parts by weight
It is preferable to use 00 parts by weight. If the addition amount is too small, the conductivity of the obtained conductive material tends to vary, and if the addition amount is too large, the fluidity of the composition is impaired and the processability is reduced.

Further, depending on the type or the amount of the conductivity-imparting substance used, some substances may inhibit the hydrosilylation reaction. Therefore, it is necessary to consider the effect of the conductivity-imparting substance on the hydrosilylation reaction.

Further, a softener or a plasticizer may be added to the curable composition of the present invention for the purpose of adjusting viscosity and hardness. The amount of the softener or plasticizer to be used is (A) 100
0.01 to 150 parts by weight based on parts by weight is preferred.
Addition of 150 parts by weight or more may cause problems such as bleeding.

The curable composition of the present invention contains various fillers, various functionalizing agents such as conductivity-imparting substances, antioxidants, ultraviolet absorbers, pigments, surfactants, solvents, and silicon compounds. You may add suitably. Specific examples of the filler include silica fine powder, calcium carbonate, clay, talc, titanium oxide, zinc white, diatomaceous earth, carbon black, and barium sulfate. Among these fillers, in particular, silica fine powder, especially having a particle size of 50 to 7
Finely divided silica having a particle diameter of about 0 nm (BET specific surface area: about 50 to 380 m ² / g) is preferred. Among them, hydrophobic silica having been subjected to surface treatment is particularly preferred because it has a large effect of improving strength in a preferred direction.

In the present invention, the curable composition is cured by the addition reaction of the Si—H group to the alkenyl group using the hydrosilylation catalyst, so that the curing speed is very high, which is convenient for performing line production. . In particular, the heat curing temperature is preferably in the range of 100C to 200C, and more preferably in the range of 100C to 180C. 10
At a temperature lower than 0 ° C., the curing reaction hardly proceeds because the composition has excellent storage stability, but when the temperature is about 100 ° C. or higher, the hydrosilylation reaction rapidly proceeds,
A cured product can be obtained in a short time.

The curable composition of the present invention has excellent storage stability even at a relatively high temperature, so that the composition can be handled with a lower viscosity, and is suitable for liquid injection molding at a high temperature.

In the present invention, the flow of the curable composition is preferably carried out at a temperature of 30 ° C. or more and less than 200 ° C., more preferably at a temperature of 30 ° C. or more and less than 100 ° C. It is more preferable to flow at a temperature of at least 80 ° C.

In the present invention, the curable composition is heated at a temperature of 30 ° C. or more and less than 200 ° C., more preferably 30 ° C.
The curing reaction can be performed while flowing at a temperature of 30 ° C. or higher and lower than 100 ° C. That is, the curable composition of the present invention can be used as a resin for injection molding (RIM, LIM, etc.).

[0049]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) As the component (A), an allyl-terminated polyisobutylene (compound A) having a molecular weight of 5400 was used, and the component (A) 100
Plasticizer PW-380 (manufactured by Idemitsu Kosan) 30 parts by weight
1 part by weight of MARK AO-50 (Adeka Argus Chemical Co., Ltd.) as an antioxidant was added, and the mixture was manually mixed and kneaded. At this time, the mixture was heated to about 70 ° C. to dissolve the antioxidant. Then, as a component (B), a compound B having the following structure is added to this mixture.

[0050]

Embedded image Was mixed with 9.3 parts by weight per 100 parts by weight of the component (A). Furthermore, bis (1,3-divinyl-) is used as the component (C).
1,1,3,3-tetramethyldisiloxane) platinum complex catalyst (Pt vinyl siloxane complex) (17.9 × 10 ⁻⁵ )
mmol / μl, xylene solution) as N, N, N ′, N′- as component (D) such that platinum is 5 × 10 ⁻⁴ equivalents to the number of moles of alkenyl groups in component (A). Tetramethylethylenediamine is used in an amount of 5 molar equivalents with respect to platinum, and as component (E), 1-ethynyl-1-
Cyclohexanol was weighed and uniformly mixed so as to be 50 molar equivalents with respect to platinum. The curable composition thus obtained is stored in an oven at 50 ° C,
At each elapsed time, a composition in which no gelation was observed was evaluated as ○, and a composition in which some gelation was observed was evaluated as x.
At the same time, the snap-up time at 150 ° C. was measured for each elapsed time. Table 1 shows the formulation and the evaluation results.

[0051]

[Table 1] (Example 2) N, N,
The same operation and evaluation were performed except that the amount of N ', N'-tetramethylethylenediamine was changed to 10 equivalents relative to platinum. Table 1 shows the formulation and the evaluation results. (Example 3) N, N,
The same operation and evaluation were performed except that the blending amount of N ', N'-tetramethylethylenediamine was changed to 20 equivalents to platinum. Table 1 shows the formulation and the evaluation results. (Comparative Example 1) Without adding the component (D) in Example 2,
The operation and evaluation were performed in the same manner. Table 1 shows the formulation and the evaluation results. (Example 4) The component (E) in Example 2 was not added,
The operation and evaluation were performed in the same manner. Table 1 shows the formulation and the evaluation results.

From Table 1, it can be seen that storage stability cannot be sufficiently obtained by using only acetylene alcohol, but the curable composition of the present invention has excellent storage stability at high temperature and has a hardening delay with the passage of time. It is clear that it does not.

[0053]

According to the present invention, a curable composition having excellent storage stability at a high temperature can be provided, and handling at a high temperature becomes possible, so that workability can be improved without using a large amount of diluent or the like. Can be secured.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08K 5/541 C08L 23/26 C08L 23/26 71/00 A 71/00 H01B 1/20 Z H01B 1 / 20 1/22 Z 1/22 1/24 Z 1/24 C08K 5/54

Claims (19)

[Claims] 1. A curable composition comprising the following components (A) to (E) as essential components. (A) Organic compound having at least one hydrosilyl-reactive alkenyl group in the molecule (B) Compound having at least two hydrosilyl groups in the molecule (C) Hydrosilylation catalyst (D) Amine 2. The curable composition according to claim 1,
(E) A curable composition containing acetylene alcohol as an essential component. 3. The method according to claim 1, wherein the component (A) is an isobutylene-based polymer and / or a polyoxyalkylene-based polymer having at least one alkenyl group capable of undergoing a hydrosilylation reaction in a molecule. The curable composition according to claim 1. 4. The curable composition according to claim 1, wherein the polymer (A) contains an alkenyl group capable of undergoing a hydrosilylation reaction at a molecular terminal. 5. The curable composition according to claim 1, wherein the component (A) is an isobutylene-based polymer. 6. The curable composition according to claim 1, wherein the total amount of the repeating units derived from isobutylene in the polymer as the component (A) is 50% by weight or more. 7. The curable composition according to claim 1, wherein the component (A) is a polyoxypropylene polymer. 8. The compound according to claim 1, wherein the compound having a hydrosilyl group in the molecule of the component (B) is a polyorganohydrogensiloxane containing on average at least two hydrosilyl groups in a molecule. The curable composition according to claim 1. 9. The acetylene alcohol of the component (E),
2-phenyl-3-butyn-2-ol, 1-ethynyl-1-cyclohexanol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-hexyn-3-
All, 3-ethyl-1-pentyn-3-ol, 2-
The curable composition according to any one of claims 2 to 8, which is at least one compound selected from methyl-3-butyn-2-ol and 3-methyl-1-pentyn-3-ol. . 10. The method according to claim 1, wherein the component (D) is an amine containing two nitrogen atoms in one molecule.
The curable composition according to item. 11. The curable composition according to claim 1, wherein the amine as the component (D) has a structure shown below. Embedded image 12. The curable composition according to claim 1, wherein the component (D) is N, N, N ′, N′-tetramethylethylenediamine. 13. A curable conductive composition comprising the curable composition according to claim 1 and a conductivity-imparting substance as an essential component as the component (F). 14. The curable conductive composition according to claim 13, wherein the component (F) is a carbon black. 15. A method for handling a curable composition, comprising causing the curable composition according to claim 1 to flow at a temperature of 30 ° C. or more and less than 200 ° C. 16. The curable composition is heated at 30 ° C. to 100 ° C.
16. Flow at a temperature of less than 15.
4. The method for handling the curable composition according to item 1. 17. The method for handling a curable composition according to claim 15, wherein the curable composition is flowed at a temperature of 40 ° C. or more and less than 80 ° C. 18. The curable composition according to claim 1, wherein the curable composition is allowed to flow at a temperature of 30 ° C. or more and less than 200 ° C., and a curing reaction is further performed while flowing at 30 ° C. or more. A method for handling a curable composition, comprising: 19. The curable composition is heated at a temperature of 30 ° C. or higher and 100 ° C.
Characterized by performing a curing reaction while flowing at a temperature of less than 30 ° C.
A method for handling the curable composition according to claim 18.