JP2001077504A - Ultrasonic wave equipment, flexible board using the ultrasonic wave equipment and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form an aperture of satisfactory precision for a resin film on a metal film by using a simple process. SOLUTION: A protrusion 65 is made to abut against a resin film 6 formed on a metal film 1, and ultrasonic vibration is applied, while the resin film 6 is pressed. The resin film 6 is dug, digging is stopped when the tip of the protrusion 65 abuts against the metal film 1, and an aperture part 8 is formed. By arranging the plurality of protrusions 65 at positions corresponding to the positions of the aperture parts 8 to be formed, the plurality of aperture parts 8 are formed simultaneously. Thereby the control of etchant is dispensed with, and precision is high also.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the technical field of a flexible substrate, and more particularly to a technique for forming an opening in a resin film of a flexible substrate.

[0002]

2. Description of the Related Art Conventionally, a flexible substrate has a flexibility,
It has excellent features such as lightness and thinness, and is widely used in precision small electronic devices. Among them, a flexible substrate having a multilayer structure in which a metal film and a resin film are laminated in a plurality of layers is widely used because a large number of wirings can be connected thereto.

[0003] Generally, a flexible substrate having a multilayer structure is formed by laminating a plurality of single-layer flexible substrates. Therefore, in order to electrically connect the single-layer flexible substrates, an opening is formed in a resin film of the flexible substrate. A technique of forming a portion and connecting the metal films by making the bumps abut on the metal film exposed at the opening is adopted.

A conventional manufacturing method for forming an opening in a single-layered flexible substrate as described above will be described.

[0005] First, referring to FIG.
A liquid polyimide precursor is applied to the surface of a rolled copper foil having a thickness of 18 μm (here, a rolled copper foil is used) and dried to form a resin film 112 made of a polyimide film.

Next, a photosensitive film 113 is attached on the resin film 112 (FIG. 10B), and is patterned into a desired shape by exposure and development (FIG. 10C). Next, using the photosensitive film 113 as a mask, the resin film 1
12 is alkali-etched, and the resin film 112 is patterned.

Reference numeral 114 in FIG. 10D indicates an opening of the patterned resin film 112, and the metal film 111 is exposed at the bottom thereof.

The photosensitive film 113 is peeled off to expose the patterned resin film 112 (FIG. 10E).
Next, a mask film 116 is attached to the surface (FIG. 11F). In FIG. 11F, the metal film 111 is shown on the upper side of the drawing and the resin film 112 is shown on the lower side of the metal film 111, contrary to FIG.

In this state, the surface of the metal film 111 is exposed, and a photosensitive film 117 is attached to the exposed portion (FIG. 11 (g)), exposed, developed, and patterned into a desired shape (FIG. h)).

Next, when the metal film 111 is alkali-etched using the patterned photosensitive resin film 117 as a mask, the metal film 111 is patterned.
(i)). Reference numeral 119 denotes a patterned metal film 1
11 shows a separation part between the wirings formed.

Next, the photosensitive film 117 is removed to expose the surface of the metal film 118 (FIG. 12 (j)). Metal film 1
When a polyimide precursor solution is applied to the surface of the substrate 18, the inside of the separation part 119 of the patterned metal film 111 is filled with the polyimide precursor (FIG. 9 (k)). When dried, a resin film 120 composed of a polyimide precursor and having a flat surface is obtained.Next, a photosensitive film 121 is attached on the resin film 120 ((l) in the same figure), and exposed and developed to be patterned. ((M) in the figure).

When the resin film 120 is alkali-etched using the photosensitive film 121 as a mask, the resin film 120 is patterned (FIG. 13 (n)). FIG.
Reference numeral 122 of 3 (n) indicates an opening of the resin film 120. The metal film 111 is exposed at the bottom of the opening 122.

Finally, when the photosensitive film 121 and the mask film 116 are peeled off and then subjected to a heat treatment, the resin films 112 and 120 are imidized and cured to obtain a single-layered flexible substrate 125 having double-sided wiring. Figure
(o)).

In the flexible substrate 125, the resin film 1 formed on the front and back surfaces of the metal film 111
Openings 114 and 122 are formed in the openings 12 and 120, respectively. The metal film 111 is exposed on the bottom surface of each of the openings 114 and 122, and a bump of another flexible substrate is connected to the exposed portion. , And terminal portions of other circuit components can be connected.

As described above, in the method of patterning the resin films 112 and 120 by etching, since a fine opening can be formed as compared with a laser etching method, a drill method, or the like, a flexible substrate having openings with a narrow pitch can be formed. Widely used in the manufacture of

However, in the above-described etching method using an alkaline liquid, it is troublesome to control the liquid temperature and the state of the liquid. In particular, when the control of the etching conditions is poor, there is a problem that the openings 114 and 122 cannot be formed accurately. In addition, since the photosensitive films 113, 117, and 121 are used to form the openings 114 and 122, there is a problem that the manufacturing cost increases.

[0017]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned disadvantages of the prior art, and an object of the present invention is to improve the productivity of a single-layer substrate and the accuracy of opening a substrate connection port. It is.

[0018]

Means for Solving the Problems The inventors of the present invention have proposed that when an opening is formed in a resin film using ultrasonic vibration,
The present invention has been found to have higher accuracy than the etching method, and has led to the creation of the present invention. The invention according to claim 1 is an ultrasonic device, which is an ultrasonic generator for generating ultrasonic vibration. And an ultrasonic device having a resonance unit to which the ultrasonic vibration is transmitted, wherein the resonance unit is provided with a plurality of projections that can be brought into contact with a planar workpiece. Features. The invention according to claim 2 digs a resin film disposed on a metal film,
2. The ultrasonic vibration device according to claim 1, wherein the metal film is exposed on a bottom surface and forms a plurality of openings arranged at predetermined positions, wherein each of the protrusions is to be formed on the resonance part. It is characterized by being arranged at a position corresponding to each opening. The invention according to claim 3 is the ultrasonic apparatus according to claim 2, wherein the height of the projection is greater than the thickness of the resin film to be excavated. According to a fourth aspect of the present invention, in any one of the first to third aspects,
The ultrasonic device according to claim, wherein, when the flat processing object is pressed against the protrusion, the ultrasonic vibration from the ultrasonic generation unit to which the resonance unit is transmitted, the protrusion,
It is characterized in that it is configured to vibrate ultrasonically in a direction along the surface of the processing object. According to a fifth aspect of the present invention, in the ultrasonic device according to any one of the first to fourth aspects, the ultrasonic generator is disposed at an oblique posture with respect to the workpiece. It is characterized by. The invention according to claim 6 is a flexible having a metal film, a resin film disposed on the metal film, and a plurality of openings disposed at predetermined positions of the resin film and exposing the metal film on a bottom surface. A method of manufacturing a substrate, wherein projections are respectively brought into contact with positions where the respective openings of the resin film are to be formed, ultrasonic vibration is performed while pressing the respective projections, and the resin is applied until the metal film is exposed. A method of manufacturing a flexible substrate, comprising excavating a film to form the opening. The invention according to claim 7 is the method for manufacturing a flexible substrate according to claim 6, wherein the projection is ultrasonically vibrated in a direction along a surface of the resin film. The invention according to claim 8 is the method for manufacturing a flexible substrate according to any one of claims 6 and 7, wherein the height of the protrusion is larger than the thickness of the resin film. It is characterized by.
The invention according to claim 9 is the method for manufacturing a flexible substrate according to any one of claims 6 to 8, wherein the opening is formed after the resin film is cured. I do. The invention according to claim 10 is a flexible substrate having a metal film and a resin film disposed on the metal film, wherein the resin film is excavated by ultrasonic vibration, and the metal film is formed on a bottom surface. An opening that is exposed is formed.

The present invention is configured as described above. Since a plurality of projections are formed at the tip of the resonance part of the ultrasonic device, each projection is pressed against the resin film, and ultrasonic vibration is applied while pressing. The bump excavates the resin film, and an opening is formed.

Since one opening is formed by each projection,
The number of projections needs to be provided in accordance with the number of openings.

Further, since the position of the opening formed in the resin film is predetermined, each projection must be arranged at a position corresponding to the position of the opening of the object to be processed. Especially when excavating resin film by ultrasonic vibration,
Since the opening to be formed is larger than the diameter of the projection, the tip of each projection is preferably disposed at a substantially central position of the opening to be formed.

Table 1 below shows the relationship between the diameter of the protrusion and the dimension of the opening when the opening is formed in a resin film made of a polyimide film using ultrasonic waves.

[0023]

[Table 1]

The frequency of the ultrasonic vibration is 40 kHz,
The application time is one minute. From Table 1, it can be seen that the size of the opening increases as the diameter of the protrusion increases. Since the protrusion having a height of 40 μm was used, when the thickness of the resin film was larger than the height of the protrusion, no opening was formed and the film was rejected. Table 1 also shows the dimensions of the opening when the opening is formed by etching as in the prior art.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible substrate according to the present invention and an ultrasonic apparatus used for producing the same will be described with reference to the drawings together with a method for producing a flexible substrate.

First, referring to FIG. 1A, reference numeral 1 indicates a thickness 18
It is a metal film made of a rolled copper foil of μm to 30 μm, and a mask film 2 is adhered on the back surface. This metal film 1
A photosensitive film 3 is adhered to the surface (FIG. 1B), and patterned by exposure and development (FIG. 1C).

Next, using the photosensitive film 3 as a mask, the metal film 1 is alkali-etched and patterned (FIG. 1D). Reference numeral 5 in FIG. 1D indicates a separation portion between wirings constituted by the patterned metal film 1. The surface of the carrier film 2 is exposed on the bottom surface of the separation section 5.

Next, the photosensitive film 3 is peeled off to expose the metal film 1 (FIG. 1 (e)), and a polyimide precursor solution is applied to the surface thereof, and the separating section 5 is filled with the polyimide precursor solution. . When heated and imidized in this state, a resin film 6 composed of a polyimide film and having a flat surface is formed (FIG. 1 (f)). Reference numeral 4 in FIG. 1F indicates a flexible substrate on which the resin film 6 is formed.

Using the flexible substrate 4 as an object to be processed, an opening is formed in the resin film 6 by an ultrasonic device.

Reference numeral 60 in FIG. 6 denotes an ultrasonic device used for forming the opening. The ultrasonic device 60 includes a cylindrical ultrasonic generating section 61, a resonance section 62 for applying ultrasonic vibration to an object to be processed, a plate-shaped pedestal 66, and two guides 67.
And a _1, 67 _2.

The guide 67 _1, 67 ₂ is erected on the pedestal 66, the ultrasonic generator 61 is mounted to be vertically movable in guides 67 _1, 67 ₂ in a horizontal position.

One end of the resonance section 62 is connected to the ultrasonic wave generation section 61.
The other end is bent, and the front end surface 69 has an ultrasonic generator 61 and a resonance unit 62.
Are formed so as to be horizontal with respect to the central axis 81.

FIG. 8 is an enlarged view of the vicinity 64 of the tip of the resonance section 62.
Shown in Ultrasound generating unit 61 and the resonance unit 62 around the Bi ° 67 _1, 67 ₂ have become attached way, the central axis 81 of ultrasonic wave generator 61 and the resonance unit 62 in that state in a horizontal state When rotated and aligned, the tip surface 69 can be made horizontal.

The tip surface 69 is provided with a plurality of projections 65. When the tip surface 69 is horizontal, each projection 65 is directed vertically downward.

A work 68 having a flat upper surface is disposed on the pedestal 66, and the object to be processed is placed on the work 68 with the resin film 6 forming the opening facing upward.
When the (flexible substrate 4) is arranged, the front end surface 69 of the resonance part 62 and the resin film 6 face in parallel in a horizontal state.

[0036] In this state, the air cylinder 63 which is arranged above the resonance unit 62 is operated, the lowering vertically along the ultrasonic wave generator 61 and the resonance unit 62 in the guide 67 _1, 67 _2, the base portion The protrusion 65 arranged on 69 is vertically in contact with the resin film 6.

FIG. 2G shows this state, in which each projection 65 formed on the front end surface 69 is attached to the front end surface 69.
Are made substantially equal, and therefore, when the resonance part 62 is vertically lowered, the respective protrusions 65 contact the resin film 6 almost simultaneously.

When the ultrasonic generator 61 is operated in a state where each projection 65 is in contact with the resin film 6, the generated ultrasonic vibration is transmitted to each projection 65 via the resonance section 62.

The direction of the ultrasonic vibration generated by the ultrasonic generator 61 is such that the component perpendicular to the ultrasonic generator 61 is almost zero, and only the component along the central axis 81 of the ultrasonic generator 61. It is composed of Since the ultrasonic wave generator 61 is arranged horizontally, when the ultrasonic vibration is transmitted to the projection 65, each projection 65 ultrasonically vibrates in the horizontal direction.

Each projection 65 is ultrasonically vibrated while being pressed against the resin film 6 by the air cylinder 63.
The flexible substrate 4 which is a processing object is stationary with respect to the work 68 by frictional force.

For this reason, each projection 65 excavates the resin film 6 by the force of the ultrasonic vibration and cuts into the inside. Here, since the shape of each projection 65 is hemispherical, the resin film 6 is formed by a curved surface forming the surface of each projection 65.
Is excavated, and as a result, an elliptical concave portion whose longitudinal direction is the vibration direction of the ultrasonic wave is formed. Reference numeral 7 in FIG.
The recess is shown.

The position of the opening to be formed in the resin film 6 is predetermined, and each projection 65 is arranged at a position corresponding to the opening. Since the metal film 1 should be exposed at the bottom surface of the opening, the metal film 1 is arranged below each projection 65 instead of the separation portion 5.

Here, the height H of each projection 65 is formed so as to be larger than the thickness T of the resin film 6.
(H> T) Therefore, as the excavation proceeds, the tip surface 69
Before the contact with the resin film 6, the tip of each projection 65 reaches the metal film 1.

FIG. 2 (i) shows this state. Since the projection 65 that is ultrasonically vibrated is pressed against the metal film 1, the metal film 1 ultrasonically vibrates together with the projection 65, and no force is applied to the metal film 1 by the ultrasonic vibration. Stop. As a result, an opening 8 in which the metal film 1 is exposed on the bottom surface is formed in the resin film 6.

After the opening 8 is formed, the ultrasonic wave generator 6
1 is stopped, the air cylinder 63 is operated, and the resonance unit 6
2 and ultrasonic generator 61 along the guide 67 _1, 67 ₂ are moved upward to take out the flexible substrate 4 to form an opening 8 on the work 68. FIG. 3 (j) shows the flexible substrate 4 in that state. When the openings are continuously formed, the flexible substrate 4 after the processing is replaced with an unprocessed flexible substrate, and excavation is performed by ultrasonic vibration.

FIG. 9A is a perspective view of the opening 8 formed in the resin film 6 by the hemispherical projection 65. FIG. 2B is a plan view of the opening 8 as viewed from above the resin film 6. The major axis L ₁ > the minor axis L ₂ , and the direction of the ultrasonic vibration is the direction of the major axis L ₁ .

When a rectangular projection 69 ′ as shown in FIG. 9C is arranged on the front end surface 69, and each projection 69 ′ is pressed vertically against the resin film 6, The opening 8 'formed has a rectangular shape as shown in the plan view of FIG.

Next, the mask film 2 of the flexible substrate 4 in which the opening 8 has been formed is peeled off to expose the back surface of the metal film 1 (FIG. 9 (k)).

The state in which the resin film 6 faces downward and the metal film 1 faces upward (FIG. 3 (k)) is turned upside down. ), Applying a polyimide precursor solution on the exposed metal film 1,
It is imidized by heating to form a resin film 10 made of a polyimide film (FIG. 3 (l)).

Next, the resin film 10 is excavated by using the above-described ultrasonic device 60 in the same process as above to form an opening, whereby the flexible substrate 2 of the present invention is obtained (FIG. 3 (m)). ). Reference numeral 11 in FIG. 3 (m) indicates the opening. The metal film 1 is exposed at the bottom of the opening 11.

Next, a process of manufacturing a flexible substrate having a multilayer structure using the flexible substrate 2 will be described. Reference numeral 16 in FIG. 4A denotes a flexible substrate having a metal film 13, bumps 17 erected on the metal film 13, and resin films 14 and 15 formed on the front and back surfaces of the metal film 13. Is shown.

The tip of the bump 17 protrudes onto one of the resin films 14. A plurality of bumps 17 are provided, and each bump is arranged at a position corresponding to the opening 8 of the flexible substrate 2.

The bumps 17 of the flexible substrate 16
And the opening 8 of the flexible substrate 2 are opposed to each other with the adhesive film 12 interposed therebetween, and the bump 17 is brought into contact with the metal film 1 exposed on the bottom surface of the opening 8 via the adhesive film 12.

A solder film is formed on the surface of each bump 17. When the bump 17 and the adhesive film 12 are heated, the bump 17 and the metal film 1 are electrically connected by the molten solder film, and two bumps are formed. The flexible substrates 2 and 16 are integrally bonded by the adhesive film 12 exhibiting an adhesive force, and a multilayer flexible substrate 3 shown in FIG. 4B is obtained.

In the flexible substrate 3 having the multilayer structure,
An opening 18 through which the metal film 13 is exposed is formed on the back surface, so that another flexible substrate having a bump can be further laminated. The opening 11 formed on the surface can be connected to a bump of a semiconductor element or used as a connection terminal for another electric circuit.

In the single-layer flexible substrate 2 described above, the openings 8 and 11 are formed in the resin films 6 and 10 on both surfaces of the metal film 1.
An opening may be formed in the resin film on either the front surface or the back surface by ultrasonic vibration, and the metal film may be exposed on the bottom surface.

In the above embodiment, the openings 8 and 11 were formed after the metal film 1 was patterned. However, the openings were formed in the resin film in the state of the metal foil before patterning, and the bottom surface was formed. Alternatively, the metal film may be exposed.

Next, an ultrasonic device which is more suitable for forming an opening will be described. Referring to FIG. 7, reference numeral 70 denotes an ultrasonic device obtained by improving the ultrasonic device 60 used in the above embodiment.

The ultrasonic device 70 is the same as the ultrasonic device 6
Similarly to FIG. 0, a cylindrical ultrasonic generator 71, a resonance unit 72 for applying ultrasonic vibration to an object to be processed, and a flat base 76
When, and a two guide 77 _1, 77 _2.

In this ultrasonic device 70, each guide 77 ₁ ,
77 ₂ has been erected on the pedestal 76, unlike the ultrasonic device 60, ultrasonic generator 71 is attached to guide _771, 77 ₂ in the inclined posture.

One end of the resonance section 72 is attached to the tip of the ultrasonic wave generation section 71. As shown in FIG. 8, a plurality of projections 75 are vertically provided on the tip surface 79 of the other end. I have.

The distal end portion of the resonance section 72 is bent, and the front end surface 79 is formed by the ultrasonic wave generation section 71 and the resonance section 7.
It is configured to incline at a predetermined angle with respect to the center axis 82 of the second. In FIG. 8, the tip surface 79 and the central axis 82
Is represented by θ.

Accordingly, the ultrasonic generator 71 is connected to the guide 7
7 _1, when attached to the 77 _2, tilting the center axis 82 of the ultrasonic generator 71 from the horizontal direction by an angle theta, resonance portion 72
The surface 79 of the tip portion of is horizontal. When the tip surface 79 is horizontal, each projection 75 is directed vertically downward.

After aligning the front end surface 79 in this way, the flexible substrate 4 to be processed is placed on the work 78 placed on the pedestal 76, and the air cylinder 73
When the ultrasonic wave generating section 71 and the resonance section 72 are vertically moved downward, the tip of the projection 75 comes into vertical contact with the resin film 6 on the surface of the flexible substrate 4 as in the case of the ultrasonic apparatus 60 described in the above embodiment. Is done.

In the ultrasonic device 70, the ultrasonic generator 7
The ultrasonic vibration generated by 1 has a component parallel to and perpendicular to the central axis 82 of the ultrasonic generator 71,
When the ultrasonic generator 71 is in a tilted posture and the front surface 79 of the tip of the resonance unit 72 is horizontal, the protrusion 75 is configured to ultrasonically vibrate only in the horizontal direction.

Therefore, when ultrasonic vibration is applied while pressing the projection 75 against the surface of the resin film 6, the projection 75 excavates the resin film 6, similarly to the ultrasonic device 60.

In the ultrasonic device 70, the ultrasonic generator 7
Since the resonance part 1 and the resonance part 72 are attached at an angle, the resonance part 72 does not come into contact with the object to be processed, and the workability is high.

Further, the opening can be formed even when the area of the work 78 is increased and a processing object having a large area is arranged. In the ultrasonic device 60 described in the above embodiment, the range that can be processed is about 20 to 30 mm. However, when the ultrasonic device 70 is used, there is substantially no limit. Resonance part 7
The inclination between 2 and the front surface 79 of the tip is suitably about 0 ° (horizontal posture) to about 30 °.

Table 2 below shows the ultrasonic vibration components (horizontal component and vertical component) applied to the protrusion 75 and the conduction results. The specification of the resonance unit as “horizontal” (when the inclination with respect to the horizontal direction is 0 °) is in the case of the ultrasonic device 60 in the horizontal posture described above. The horizontal direction is the direction of the X axis in FIG. 8, and the vertical direction is the Y axis direction in FIG.

[0070]

[Table 2]

As can be seen from Table 2, when a vibration component in the vertical direction is included, conduction failure occurs.

Although the case where the openings are formed in the cured polyimide film using the ultrasonic devices 60 and 70 has been described above, the present invention is not limited to the polyimide film, but includes polyester film, epoxy film and the like. Openings can be formed in other resin films.

The resonance portions 62 and 72 and the projection 6
5, 65 ', 75 are made of iron, and the projections 65, 65', 75
Was formed by electric discharge machining of the tip portions of the resonance portions 62 and 72, but the ultrasonic device of the present invention is not limited to this, and includes those made of titanium and other metals.

In order to make the height T of each of the projections 65, 65 ', 75 uniform, it is preferable to carry out polishing after electric discharge machining. Further, a coating may be formed on the surface of each of the protrusions 65, 65 ', and 75 to enhance durability.

Further, a plurality of projections 65, 65 ', 75 may be provided on the front end surfaces 69, 79, or only one projection may be provided.

[0076]

According to the present invention, since the opening is not formed by using an etching solution, it is not necessary to manage a chemical solution, and the process is simplified, so that productivity is increased. The accuracy of the opening formed is also high.

[Brief description of the drawings]

FIGS. 1A to 1F are views for explaining steps up to the formation of an opening in a flexible substrate according to the present invention.

FIGS. 2G to 2I are diagrams for explaining a step of forming an opening.

FIGS. 3 (j) to 3 (m): views for explaining steps after forming an opening.

FIGS. 4A and 4B are diagrams for explaining a step of laminating a flexible substrate of the present invention.

FIG. 5 shows an example of the ultrasonic apparatus of the present invention.

FIG. 6 is an enlarged view of the vicinity of the tip.

FIG. 7 shows another example of the ultrasonic apparatus of the present invention.

FIG. 8 is an enlarged view of the vicinity of the tip.

FIGS. 9A to 9D are diagrams for explaining states of openings.

FIGS. 10A to 10E are diagrams for explaining a manufacturing process of a conventional flexible substrate.

FIGS. 11 (f) to (i): diagrams for explaining subsequent steps

FIGS. 12 (j) to (m): diagrams for explaining subsequent steps

FIGS. 13 (n) and (o): diagrams for explaining the last part of the process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Metal film 2, 3 ... Flexible board 4 ... Workpiece 6 ... Resin film 8, 11 ... Opening 60, 70 ... Ultrasonic device 61, 71 ... Ultrasonic wave generator 62, 72 ...... Resonance part 65, 65 ', 75 ... Protrusion

[Procedure amendment]

[Submission date] July 31, 2000 (2007.3.
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

An ultrasonic apparatus, a flexible substrate using the ultrasonic apparatus, and a method of manufacturing the same.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction contents]

[0018]

Means for Solving the Problems The inventors of the present invention have proposed that when an opening is formed in a resin film using ultrasonic vibration,
The inventors have found that the accuracy is higher than that of the etching method, and have come to create the present invention. The invention according to claim 1 includes an ultrasonic generator that generates ultrasonic vibration, and an ultrasonic generator that generates ultrasonic vibration. The transmitted resonance part, and a plurality of projections provided on the surface of the tip part of the resonance part and capable of abutting against a planar object to be processed, the resin film disposed on a metal film, The protrusions are brought into contact with each other, ultrasonic waves are applied to the protrusions, and the resin film is excavated, and a plurality of openings in which the metal film is exposed on the bottom surface are formed at predetermined positions on the resin film. The ultrasonic vibration device according to claim 1, wherein each of the protrusions is disposed at a position on the resonance unit corresponding to each of the openings to be formed. Claim 2
The invention described in the above is the ultrasonic apparatus according to claim 1, wherein the front end surface is arranged in parallel with the resin film to be processed. The invention according to claim 3 is the ultrasonic apparatus according to any one of claims 1 and 2, wherein the height of the projection is greater than the thickness of the resin film to be excavated. A sonic device.
The invention according to claim 4 is the ultrasonic apparatus according to any one of claims 1 to 3, wherein the ultrasonic vibration generated by the ultrasonic generation unit and transmitted to the resonance unit is: An ultrasonic device configured to ultrasonically vibrate each of the projections in a direction along the surface of the resin film when each of the projections is pressed against the surface of the resin film to be processed. The invention according to claim 5 is the ultrasonic apparatus according to any one of claims 1 to 4, wherein the ultrasonic generator is configured to perform processing on the resin film to be processed.
This is an ultrasonic device arranged in an oblique posture. The invention according to claim 6 is a flexible having a metal film, a resin film disposed on the metal film, and a plurality of openings disposed at predetermined positions of the resin film and exposing the metal film on a bottom surface. A method of manufacturing a substrate, wherein projections are respectively brought into contact with the resin film at positions where the respective openings are to be formed, and ultrasonic vibration is performed while pressing the respective projections. A method of manufacturing a flexible substrate in which excavation is performed and the ultrasonic vibration is stopped after the tip of each projection reaches the metal film, and the opening is formed in the resin film. The invention according to claim 7 is the method for manufacturing a flexible substrate according to claim 6, wherein the protrusion is ultrasonically vibrated in a direction along a surface of the resin film. The invention according to claim 8 is the method for manufacturing a flexible substrate according to any one of claims 6 and 7, wherein the height of the protrusion is greater than the thickness of the resin film. This is a method for manufacturing a substrate. According to a ninth aspect of the present invention, there is provided the method for manufacturing a flexible substrate according to any one of the sixth to eighth aspects, wherein the opening is formed after the resin film is cured. Is the way. The invention according to claim 10 is a flexible substrate having a metal film and a resin film disposed on the metal film, wherein the resin film is excavated by ultrasonic vibration, and the metal film is formed on a bottom surface. This is a flexible substrate on which an exposed opening is formed.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0030

[Correction method] Change

[Correction contents]

Reference numeral 60 in FIG . 5 indicates an ultrasonic device used for forming the opening. The ultrasonic device 60 includes a cylindrical ultrasonic generating section 61, a resonance section 62 for applying ultrasonic vibration to an object to be processed, a plate-shaped pedestal 66, and two guides 67.
And a _1, 67 _2.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction contents]

FIG. 8 is an enlarged view of the vicinity 64 of the tip of the resonance section 62.
Shown in Ultrasound generating unit 61 and the resonance unit 62 rotates about the guide 67 _1, 67 ₂ have become attached way, the central axis 81 of ultrasonic wave generator 61 and the resonance unit 62 in that state in a horizontal state Then, when the alignment is performed, the front end surface 69 can be made horizontal.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroyuki Usui 12-3 Satsukicho, Kanuma City, Tochigi Prefecture Sony Chemical Co., Ltd. 2nd factory F-term (reference) 5E338 AA12 AA16 BB02 BB19 BB28 CC01 EE31

Claims (10)

[Claims] 1. An ultrasonic apparatus comprising: an ultrasonic generator for generating ultrasonic vibration; and a resonance unit to which the ultrasonic vibration is transmitted, wherein the resonance unit includes a flat object to be processed. An ultrasonic device comprising a plurality of projections which can be brought into contact with each other. 2. Excavating a resin film disposed on a metal film, exposing the metal film on a bottom surface of the resin film,
A plurality of openings arranged at predetermined positions are formed.
The ultrasonic vibration device according to claim 1, wherein each of the protrusions is disposed on the resonance portion at a position corresponding to each of the openings to be formed. 3. The ultrasonic apparatus according to claim 2, wherein the height of the projection is larger than the thickness of the resin film to be excavated. 4. When the planar processing object is pressed against the projection, the ultrasonic vibration from the ultrasonic generation unit to which the resonance unit is transmitted causes the projection to move the projection to the processing object. The ultrasonic device according to any one of claims 1 to 3, wherein the ultrasonic device is configured to perform ultrasonic vibration in a direction along a surface. 5. The ultrasonic apparatus according to claim 1, wherein the ultrasonic generator is disposed at an oblique posture with respect to the object to be processed. 6. A flexible substrate, comprising: a metal film; a resin film disposed on the metal film; and a plurality of openings disposed at predetermined positions of the resin film and exposing the metal film on a bottom surface. A method, wherein projections are respectively brought into contact with positions where the respective openings of the resin film are to be formed, and ultrasonic vibration is performed while pressing the respective projections, and the resin film is excavated until the metal film is exposed. And forming the opening. 7. The ultrasonic vibration of the projection in a direction along a surface of the resin film.
The manufacturing method of the flexible substrate as described in the above. 8. The method according to claim 6, wherein the height of the projection is larger than the thickness of the resin film. 9. The method according to claim 6, wherein the opening is formed after the resin film is cured.
The method for manufacturing a flexible substrate according to any one of the above items. 10. A flexible substrate having a metal film and a resin film disposed on the metal film, wherein the resin film is excavated by ultrasonic vibration,
A flexible substrate, wherein an opening for exposing the metal film is formed on a bottom surface.