JP2001077483A - Wiring substrate and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring substrate incorporated with a capacitor element which can be manufactured easily moreover at a low cost, and its manufacturing method. SOLUTION: After a capacitor element 13 is arranged in a mold for formation of a substrate, an insulation substrate 3 is formed by injecting a resin into the inside of the mold. Therefore, the capacitor element 13, which is sufficiently large in size (capacitance) to prevent the switching noises of an IC chip or to stabilize the operational power voltage, can be built freely in a wiring substrate 1 in terms of dimension and more easily than heretofore. Then, the possibility of failure to incorporate the capacitor element 13 can be reduced, and results in a low-cost manufacture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a wiring board on which an integrated circuit element is mounted and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, integrated circuit elements (hereinafter referred to as "IC
In order to reduce the switching noise of the IC chip and stabilize the operating power supply voltage, a capacitor element is provided on the wiring board on which the chip is mounted. However, when the capacitor element is provided on the wiring board, the longer the wiring length between the IC chip and the capacitor element, the greater the inductance component of the wiring, and it is difficult to sufficiently achieve the above object. It is desirable to provide as close as possible to the IC chip.

Therefore, conventionally, for example, Japanese Patent Application Laid-Open No. 7-26
As described in Japanese Patent No. 3619, a concave portion is provided in a base substrate (a substrate constituting a bottom portion of a multilayer wiring substrate), and a capacitor element is accommodated and covered in the concave portion.
As disclosed in Japanese Patent Application Laid-Open No. H11-67961, a technique for embedding a capacitor element inside a wiring board, and mounting a capacitor element on the surface of a core board (a board that is the center of a multilayer wiring board). There is also known a technique in which an insulating layer and a conductor layer are laminated thereon by a build-up method to form a multilayer wiring board, thereby incorporating a capacitor element inside the multilayer wiring board. By incorporating the capacitor element in the wiring board in this way, the wiring length between the IC chip and the capacitor element can be shortened and the switching noise can be reduced as compared with the case where the capacitor element is mounted on the surface. It is also advantageous in stabilizing the operating power supply voltage.

[0004]

SUMMARY OF THE INVENTION Incidentally, Japanese Patent Application Laid-Open No. Hei 7-2
The technique described in Japanese Patent No. 63619 is preferable in that a capacitor element can be built in the substrate while suppressing the thickness of the substrate. However, it is necessary to form a concave accommodating portion in the substrate, thereby increasing the number of steps. In addition, the construction period is lengthened, and the production cost is increased.

On the other hand, in the method described in Japanese Patent Application Laid-Open No. 11-67961, it is not necessary to provide a concave portion in advance, and a capacitor element is disposed on an insulating layer laminated on a core substrate. However, while the thickness of a typical insulating layer laminated by the build-up method is several tens of μm, the thickness of a capacitor element of several hundred nF or more that is actually necessary to perform the above-described operation is Since the thickness is 500 μm or more, lamination of the insulating layers is not easy. If the embedding of the capacitor element is not successful, a number of steps performed up to that point (that is, steps before the step of incorporating the capacitor element, for example, a step of forming a core substrate, a step of forming a conductor pattern, and the like) ) Is wasted and may cause an increase in manufacturing cost.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a wiring board with a built-in capacitor element which can be manufactured easily and at low cost, and a method of manufacturing the wiring board.

[0007]

Means for Solving the Problems and Effects of the Invention A wiring board according to the present invention (described in claim 1) made to solve the above-mentioned problems has an insulating substrate and the insulating substrate as a support. A conductive layer formed on a conductive substrate, and a capacitor element built in the insulating substrate and connected to the conductive layer, and a wiring board for connecting and mounting an integrated circuit element to the conductive layer. The insulating board of the present invention (claim 1) is characterized in that the insulating board is formed by arranging a capacitor element inside a predetermined mold and injecting a resin. After the capacitor element is placed inside the substrate molding die, the resin is molded by injecting the substrate molding resin into the die. That is, by arranging the capacitor element in a mold for molding the insulating substrate in advance, the capacitor element is incorporated in the wiring board.

Since the insulating substrate functioning as a support for the wiring substrate is formed to be thick, the insulating substrate has a size (in other words, a size necessary for suppressing the switching noise of the integrated circuit element and stabilizing the operating power supply voltage). (Capacitance) can be arranged with a margin in dimension.

In other words, when the insulating substrate is constructed as in the present invention (claim 1), a conventional method (that is, a method in which a concave portion is provided in a previously formed substrate and a capacitor element is disposed in the concave portion, In other words, the capacitor element can be built in more easily than in the method of arranging the capacitor element inside the insulating layer laminated by the build-up method). Then, the possibility of failing to incorporate the capacitor is reduced, and it is possible to manufacture the capacitor at low cost.

The step of forming an insulating substrate functioning as a support for the wiring board is the first step in the manufacturing process of the wiring board. Therefore, in the conventional configuration of the wiring board, when the embedding of the capacitor element fails,
On the other hand, while the numerous steps performed up to that point are wasted and contribute to an increase in the manufacturing cost, the wiring board having the structure of the present invention (claim 1) has a structure in which the capacitor element is mounted on the insulating board. Even if the embedding is not successful, the influence on the manufacturing process of the wiring board is relatively small, and the manufacturing can be performed at low cost.

By the way, as described above, when a capacitor element is embedded in an insulating substrate, when an external force is applied to the insulating substrate, stress is also applied to the capacitor element built in the insulating substrate, and It is undeniable that adverse effects (e.g., deformation or destruction of the capacitor element) may be exerted on the device, and it may not be possible to sufficiently obtain functions such as a reduction in switching noise and a stabilization of the operating power supply voltage.
Further, even if no external force is applied, stress may be applied to the capacitor element due to thermal expansion of the insulating substrate itself.

Therefore, it is preferable that the insulating substrate is provided with a reinforcing member embedded therein (of the insulating substrate). This makes it possible to improve the dimensional stability (that is, the dimensional stability of the substrate with respect to a temperature change) and the rigidity of the insulating substrate in addition to the effects of the first aspect of the present invention, so that the insulating substrate is built in the insulating substrate. This provides an effect that the capacitor element can be effectively protected.

Further, by improving the dimensional stability of the insulating substrate, it is possible to more accurately form a wiring pattern on the insulating substrate by the build-up method.
In addition, by improving the rigidity of the insulating substrate, it is possible to create a wiring substrate using a large-sized multi-piece substrate, and as a result, it is possible to reduce man-hours, thereby facilitating the manufacture of the wiring substrate, and further promote cost reduction. Becomes

As the reinforcing member, a wire made of glass, metal, resin, or the like, a woven or non-woven fabric obtained by knitting them, or a material obtained by impregnating these with a resin can be considered. Further, a plate member made of glass, metal, resin, ceramic, or the like may be used as the reinforcing member.

That is, for example, it is conceivable that the reinforcing member includes a glass cloth buried inside the insulating substrate. To configure the insulative substrate to include a glass cloth embedded therein means that, for example, a glass cloth is arranged in a layer along the substrate surface inside the insulative substrate as in an embodiment described later. Can be considered.

Further, for example, the reinforcing member may include a metal plate embedded inside the insulating substrate. To configure the insulating substrate to include a metal plate embedded therein means, for example, to arrange the metal plate in a layered form along the substrate surface inside the insulating substrate as in an embodiment described later. Can be considered.

Here, when the conductor layers (wiring patterns) are provided on both surfaces of the insulating substrate, through holes for electrically connecting the conductor layers on both surfaces of the insulating substrate may be formed in the insulating substrate. In that case, at a predetermined position of the metal plate corresponding to the through hole, a through hole having a diameter larger than the through hole is provided in advance so that the metal plate and the through hole are not electrically connected. good. When a metal plate is used as a power supply layer or a ground layer, the metal plate and the through hole may be electrically connected. In this case,
To make it easy to form a through hole through the metal plate,
It is preferable that a concave portion having a diameter larger than that of the through hole is previously provided at a predetermined position of the metal plate corresponding to the through hole.
In this case, a hole is formed easily by a laser, a drill, or the like because the thickness of the metal plate in the recess is small.

It is preferable that at least the side surface of the capacitor element is roughened in order to enhance the adhesion to the resin injected into the mold. With this configuration, the bonding strength between the resin for forming the insulating substrate and the capacitor element can be increased, and the rigidity of the insulating substrate can be improved. Therefore, it is possible to create a wiring board using a large-sized multi-piece board, and as a result, it is possible to further facilitate the manufacturing of the wiring board and to further reduce the cost.

Next, according to a sixth aspect of the present invention, there is provided an insulating substrate made of resin, a conductor layer formed on the insulating substrate using the insulating substrate as a support, and connected to the conductor layer. A method for manufacturing a wiring board including a capacitor element, wherein the first step of forming the insulating substrate by arranging the capacitor element in a mold for forming the insulating substrate and injecting a resin;
A second step of exposing the terminals of the capacitor element to the outside of the insulating substrate, and forming a conductor layer on the insulating substrate so as to be connected to the terminals of the capacitor element exposed to the outside of the insulating substrate. And a third step of forming.

As described above, in the method of manufacturing a wiring board according to the present invention, in the first step, the capacitor element is arranged in the mold for forming the insulating substrate and the resin is injected.
Form an insulating substrate. Then, after the first step, in a second step, the terminals of the capacitor element are exposed outside the insulating substrate. Then, in the third step, a conductor layer is formed on the insulating substrate so as to be connected to the terminal of the capacitor element exposed to the outside of the insulating substrate in the previous step.

Therefore, according to the method of manufacturing a wiring board of the present invention, the insulating substrate is formed by arranging the capacitor element in the mold for forming the insulating substrate and injecting the resin to form the insulating substrate. This makes it possible to easily incorporate the capacitor element as compared with the conventional method. And the possibility of failing to incorporate the capacitor is reduced,
As a result, a wiring board can be manufactured at low cost.

The step of forming an insulating substrate functioning as a support for the wiring board is the first step in the manufacturing process of the wiring board. Therefore, in the conventional configuration of the wiring board, when the embedding of the capacitor element fails,
While the numerous steps performed up to that point are wasted and contribute to an increase in manufacturing cost, according to the method of manufacturing a wiring board of the present invention (claim 6), Even if embedding of the capacitor element does not go well, the effect on the manufacturing process of the wiring board is relatively small,
As a result, a wiring board can be manufactured at low cost.

The capacitor element is placed at a predetermined position inside the mold (an optimal position preset according to the size and thickness of the insulating substrate and the size of the capacitor element) in a predetermined posture (for example, the insulating substrate). The terminal of the capacitor element may be arranged in such a manner that the terminal of the capacitor element is exposed to the outside of the insulating substrate by polishing the surface of the substrate or by forming an opening in the insulating substrate by laser processing.

According to the manufacturing method of the sixth aspect,
The wiring board according to the first aspect can be obtained. For example, to obtain the wiring board according to the third aspect, the wiring board according to the seventh aspect can be obtained. That is, in the manufacturing method according to the seventh aspect, in the first step, the resin injection into the mold is divided into a plurality of times, and the glass cloth is placed on the resin inside the mold in the interval between the resin injections. The insulating substrate on which the resin and the glass cloth are laminated is molded.

According to the method of manufacturing a wiring board according to the seventh aspect, it is possible to mold an insulating substrate in which a resin and a glass cloth are laminated in the thickness direction. The dimensional stability (that is, the dimensional stability of the substrate with respect to temperature change) and rigidity of the insulating substrate can be improved, and the capacitor element built in the insulating substrate can be effectively protected.

That is, for example, due to the external force applied to the insulating substrate or the thermal expansion of the insulating substrate itself, stress is also applied to the capacitor element built in the insulating substrate, and the capacitor element is adversely affected (for example, deformation or destruction of the capacitor element) And the like), and it is possible to eliminate the problem that functions such as the reduction of the original switching noise and the stabilization of the operating power supply voltage cannot be sufficiently obtained.

Further, by improving the dimensional stability of the insulating substrate, it is possible to form a wiring pattern on the insulating substrate by the build-up method with higher accuracy. And, by improving the rigidity of the insulating substrate, it is possible to produce a wiring board with a large-sized multi-piece substrate, and as a result, it is possible to reduce the number of man-hours, thereby facilitating the manufacture of the wiring board,
It is possible to further promote low cost.

Further, in order to obtain the wiring board according to the fourth aspect, it is preferable to form the insulating substrate as described in the eighth aspect. That is, in the manufacturing method according to claim 8, in the first step, the resin injection into the mold is divided into a plurality of times, and the metal plate is disposed on the resin inside the mold in the interval between the resin injections, so that the resin is injected in the thickness direction. That is, an insulating substrate on which a resin and a metal plate are laminated is formed.

According to the method of manufacturing a wiring board according to the eighth aspect, an insulating substrate in which a resin and a metal plate are laminated in the thickness direction can be formed, and the same effect as the manufacturing method of the seventh aspect can be obtained. Obtainable. Here, when the conductor layers (wiring patterns) are provided on both surfaces of the insulating substrate, through holes may be formed in the insulating substrate to electrically connect the conductor layers on both surfaces. In that case, to prevent the metal plate and the through hole from being electrically connected,
The step of providing a through hole having a diameter larger than the through hole at a predetermined position of the metal plate corresponding to the through hole may be performed before the first step.

In order to obtain the wiring substrate according to the fifth aspect, it is preferable to form an insulating substrate as described in the ninth aspect. That is, in the method for manufacturing a wiring board according to claim 9,
Before the first step, a step of roughening at least the side surface of the capacitor element is performed.

According to the method of manufacturing a wiring board according to the ninth aspect, the surface of the capacitor element is roughened,
Since the adhesion to the resin injected into the mold is enhanced, the bonding force between the resin for forming the insulating substrate and the capacitor element can be increased, and the rigidity of the insulating substrate can be improved. Therefore, it is possible to produce a wiring board using a large-sized multi-piece substrate, and as a result, it is possible to further reduce the number of steps, further facilitate the production of the wiring board, and further reduce the cost.

[0032]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing a configuration of a wiring board 1 as a first embodiment and a manufacturing procedure thereof. FIG.
As shown in (f), in this wiring board 1, a wiring pattern 7 made of Cu is formed on both front and back surfaces (first surface 5a and second surface 5b) of an insulating substrate 3 made of resin having a thickness of about 1 mm.
a and 7b are formed using the insulating substrate 3 as a support. The wiring patterns 7a and 7b are referred to as “conductor layers” in the claims.
Is equivalent to

The insulating substrate 3 is formed with a plated through hole 11 on the inner wall of a through hole 9 penetrating from one surface to the other surface. This through hole 11
Accordingly, the wiring pattern 7a on the first surface 5a and the wiring pattern 7b on the second surface 5b are connected to each other. The inside of the through hole 11 is filled with resin.

A capacitor element 13 is provided inside the insulating substrate 3. The capacitor element 13 is for suppressing switching noise generated in the IC chip 15 provided on the wiring board 1 and stabilizing an operation power supply voltage to be supplied to the IC chip 15. The terminals 13a of the capacitor element 13 are connected to the wiring patterns 7a,
7b.

The wiring patterns 7a and 7b are covered with the solder resist 17 except for predetermined portions to be exposed (connection portions for mounting components such as the IC chip 15). A bump 19 for connecting the IC chip 15 is formed in a portion to be connected. In this embodiment, the capacitor element 13
Is described with reference to one having only one built-in, but the invention is not limited to this, and a plurality of capacitor elements 13 may be built-in.

Hereinafter, a method of manufacturing the wiring board will be described with reference to FIG. First, capacitor element 1
The surface including the side surface of No. 3 is roughened (FIG. 1A). In this embodiment, the surface roughening of the capacitor element 13 is performed by barrel polishing. In addition, a belt sander, sand blast, buff polishing, or the like may be used. This corresponds to the “step of roughening at least the side surface of the capacitor element before the first step” in the claims.

Next, the capacitor element 13 thus roughened is placed inside a mold (corresponding to a “mold” in the claims, not shown) for molding the insulating substrate 3, and this metal is formed. After the resin 4 is further injected into the mold, the resin 4 is cured (FIG. 1).
(B)). In order to cure the resin 4, various methods can be considered according to the type of the resin 4, but in the present embodiment, the resin 4 is cured (so-called cured) by heating and drying. In addition,
This corresponds to the “first step” in the claims.

The resin 4 used for molding the insulating substrate 3
Is a filler 4a having a smaller coefficient of thermal expansion than the resin 4.
(For example, SiO ₂ or the like) is preferably mixed, so that the coefficient of thermal expansion of the insulating substrate 3 as a composite of the resin 4 and the filler 4a can be accurately controlled. As a result, for example, it becomes easy to match the thermal expansion coefficient between the insulating pattern 3 and the wiring pattern formed of Cu or the like or the IC chip 15 formed of Si or the like, The reliability of the electronic circuit configured on (ie, on the wiring board 1) with respect to heat can be improved.

After molding the insulating substrate 3 with the resin 4, both surfaces of the insulating substrate 3 are polished by polishing both surfaces of the insulating substrate 3, and the outside (at least one surface) of the insulating substrate 3 is formed. The terminal 13a of the capacitor element 13 is exposed on both sides in this embodiment (FIG. 1C). This corresponds to the "second step" in the claims.

Then, a through hole 9 for forming the through hole 11 is formed by a drill (FIG. 1D). Thereafter, plating is performed on the inner surface of the through hole 9 to form the through hole 11, and wiring patterns 7a and 7b are formed on both surfaces of the insulating substrate 3 by a subtractive method (FIG. 1E). . It should be noted that this is the "third"
In this case, a part of the wiring patterns 7a and 7b is formed so as to be electrically connected to the terminal 13a of the capacitor element 13. Further, a part of the wiring patterns 7 a and 7 b provided on both surfaces of the insulating substrate 3 are electrically connected to each other through the through holes 11. The inside of the through hole 11 is filled with resin.

After the wiring patterns 7a and 7b are formed in this manner, the solder resist 17 is further formed on both surfaces of the insulating substrate 3.
Are laminated. At this time, of the wiring patterns 7a and 7b,
An opening is formed in the solder resist 17 by an exposure / development process at a portion where a mounting component such as the IC chip 15 is to be connected, so that the solder resist 17 is exposed. Of the exposed parts, the part to which the IC chip 15 is to be connected (a part of the wiring pattern 7a on the first surface 5a side in this embodiment) is
The bump 19 for connecting the C chip 15 is formed by solder. The bumps 19 are formed on the wiring patterns 7a on which Ni / Au plating (not shown) has been formed in advance (FIG. 1F).

According to the first embodiment described above, the following effects (1) to (3) can be obtained. (1) Since the insulating substrate 3 is formed by disposing the capacitor element 13 in a mold for molding a substrate and then injecting a resin 4 for molding the substrate into the mold, an IC is formed.
The capacitor element 13 having a size (that is, a capacitance) required to perform the function of suppressing the switching noise of the chip 15 and stabilizing the operation power supply voltage has a margin in dimension and is more easily than the conventional one. Can be built in the wiring board 1. Then, the possibility of failing to incorporate the capacitor element 13 is reduced, and it is possible to manufacture the capacitor element 13 at low cost.

(2) The step of forming the insulating substrate 3 functioning as a support for the wiring substrate 1 is shown in FIG. 1 (b).
This is the first step in the manufacturing process of the wiring board 1.
Therefore, even if embedding of the capacitor element 13 in the insulating substrate 3 is not successful, the influence on the manufacturing process of the wiring substrate 1 is relatively small, and the wiring substrate 1 can be manufactured at lower cost.

(3) The surface of the capacitor element 13 is roughened (FIG. 1 (a)) to improve the adhesion to the resin injected into the mold. By increasing the bonding force between the resin and the capacitor element, the rigidity of the insulating substrate can be improved. Therefore, it is possible to create a wiring board using a large-sized multi-piece board, and as a result, it is possible to further facilitate the manufacturing of the wiring board and further reduce the cost.

Next, a second embodiment of the present invention will be described. FIG. 2 is an explanatory diagram showing the configuration of the wiring board 1 as the second embodiment. Although the wiring board 1 of the first embodiment has been described as having only one conductive layer (wiring patterns 7a and 7b) formed on both surfaces of the insulating substrate 3, the wiring board 1 of the second embodiment is made of Cu. Conductor layer (second wiring pattern 10
5a, 105b) and the insulating layer 103 (so-called multilayer wiring board).

That is, on the wiring patterns 7a and 7b,
The insulating layer 103 is laminated, and the second wiring patterns 105a and 105b are formed on the insulating layer 103 on each of the first surface 5a and the second surface 5b. The wiring pattern 7a (7b) and the second wiring pattern 105a (1
05b) means a via 107 formed in the insulating layer 103.
a (107b). The inside of the through hole 11 is filled with an insulating resin.

Then, the second wiring patterns 105a, 105
b is covered with the solder resist 109 except for a predetermined portion to be exposed (a connection portion of a mounting component such as the IC chip 15), and a portion of the exposed portion to which the IC chip 15 is to be connected has an IC. A bump 111 for connecting the chip 15 is formed.

As shown in FIGS. 1A to 1E, the method of manufacturing the wiring board 1 is the same as that shown in FIGS. 1A to 1E until the wiring patterns 7a and 7b are formed on both sides of the insulating substrate 3. It is performed in the procedure, and the description corresponding to this is omitted. In manufacturing the wiring board 1 of the second embodiment, FIG.
After the step described with (e), the insulating layers 103 are laminated on both surfaces of the insulating substrate 3 by a known build-up method as shown in FIG.
And a conductor layer (second wiring patterns 105a and 105b).

Thus, the second wiring patterns 105a, 105a
After forming 5b, a solder resist 109 is further laminated. At this time, a portion of the second wiring patterns 105a and 105b to which a mounting component such as the IC chip 15 is to be connected is
An opening is formed in the solder resist 109 through an exposure / development process to make the solder resist 109 exposed. Then, of the exposed parts, the part to which the IC chip 15 is to be connected (in this embodiment,
On a part of the second wiring pattern 105a on the first surface 5a side), a bump 111 for connecting the IC chip 15 is formed by soldering. Note that the bump 111 is made of Ni / A in advance.
Second wiring pattern 10 formed with u plating (not shown)
5a.

According to the second embodiment described above, the same effects as the effects (1) to (3) can be obtained. The same effect can be obtained not only in the wiring substrate shown in the second embodiment but also in the case of further multi-layering. Next, a third embodiment will be described. In the third embodiment, the resin 4
The insulating substrate 3 is configured by laminating the glass cloth 203 and the glass substrate 203. That is, in the step described with reference to FIG. 1B (that is, the “first step” in the claims), the injection of the resin 4 into the mold is divided into a plurality of times (three times in the third embodiment).
By arranging the glass cloth 203 on the resin 4 inside the mold between the injections of the resin 4, the insulating substrate 3 on which the resin 4 and the glass cloth 203 are laminated in the thickness direction is formed.

This step will be described in detail with reference to FIG.
As shown in (a), first, the roughened capacitor element 13 is placed inside a mold (not shown) for molding the insulating substrate 3, and a predetermined amount (the insulating substrate 3) is placed in the mold. 3) (about 1/3 of the amount necessary to form 3). Here, the injection of the resin 4 is temporarily interrupted, and the glass cloth 203 is arranged on the injected resin 4. FIG. 3C shows FIG.
FIG. 3A is a cross-sectional view taken along the line AA in FIG. 3A, and as shown in FIG. 3C, the glass cloth 203 has substantially the same size as the insulating substrate 3 to be formed, and corresponds to the capacitor element 13. The portion is provided with a through hole 203a larger than the capacitor element 13.

Thereafter, a predetermined amount of the resin 4 is further injected, and the glass cloth 203 is arranged in order. Finally, a predetermined amount of the resin 4 is injected again, and the resin 4 is cured. Then, the insulating substrate 3 on which the glass cloth 203 is laminated is obtained (FIG. 3B).

The other configuration and the manufacturing procedure of the wiring board of the third embodiment are the same as those of the second embodiment, and the description is omitted. According to the third embodiment described above, the following effects (4) to (7) are exhibited in addition to the effects (1) to (3).

(4) Since the insulating substrate 3 is formed by laminating the resin 4 and the glass cloth 203 in the thickness direction, the dimensional stability of the insulating substrate 3 (that is, the dimensional stability of the substrate with respect to a temperature change). (Stability) and rigidity can be improved, and the capacitor element built in the insulating substrate 3 can be effectively protected.

(5) By improving the dimensional stability of the insulating substrate 3, the wiring patterns 7a and 7b and the second wiring patterns 105a and 105b can be formed on the insulating substrate 3 by a build-up method.
Can be formed with higher accuracy. (6) By improving the rigidity of the insulating substrate 3, it is possible to manufacture the wiring board 1 using a large-sized multi-piece substrate, and as a result, it is possible to reduce the number of steps, thereby facilitating the manufacturing of the wiring board and reducing the cost. It can be further promoted.

(7) Since the resin injected into the mold soaks into and impregnates the glass fibers constituting the glass cloth, the adhesive strength between the resin and the glass cloth increases. As a result, it is possible to obtain the wiring board 11 having excellent rigidity. Then the fourth
An example will be described. In the fourth embodiment, the resin 4 and the metal plate 303 (Cu plate in this embodiment) are arranged in the thickness direction.
Are laminated to constitute the insulating substrate 3. That is, in the step described with reference to FIG. 1B (ie, the “first step”), the injection of the resin 4 into the mold is divided into a plurality of times (two times in the fourth embodiment). By arranging the metal plate 303 on the resin 4 inside the mold between injections of the resin 4, the insulating substrate 3 on which the resin 4 and the glass cloth 203 are laminated in the thickness direction is formed (see FIG. 4). ).

This step will be described in detail. First, the roughened capacitor element 13 is placed inside a mold (not shown) for molding the insulating substrate 3, and
A predetermined amount (1/2 of the amount necessary to form the insulating substrate 3)
) Resin 4 is injected. Here, the injection of the resin 4 is temporarily interrupted, and the metal plate 303 is disposed on the injected resin 4.

The metal plate 303 is made of the above-described glass cloth 20.
3, the same size as the insulating substrate 3 to be molded, and a portion corresponding to the capacitor element 13 includes:
A through hole 303a larger than the capacitor element 13 is provided. Cu is used for the metal plate 303. In order to prevent electrical connection between the metal plate 303 and the through hole 11, a through hole 303 b having a diameter larger than that of the through hole 11 is provided at a position of the metal plate 303 corresponding to the through hole 11. deep.

Thereafter, a predetermined amount of the resin 4 is further injected, and the resin 4 is cured, so that the resin 4
And the insulating substrate 3 on which the metal plate 303 is laminated. When the both surfaces of the insulating substrate 3 are polished to flatten both surfaces of the insulating substrate 3 and the terminals 13a of the capacitor element 13 are exposed on both surfaces of the insulating substrate 3, the insulating substrate 3 shown in FIG. 4 is obtained.

The other configuration and the manufacturing procedure of the wiring board of the fourth embodiment are the same as those of the second embodiment, so that the description will be omitted. According to the fourth embodiment described above, in addition to the effects (1) to (3), the insulating substrate 3
Is formed by laminating the resin 4 and the metal plate 303 in the thickness direction thereof, so that the same effects as in the above (4) to (6) can be obtained. According to the fourth embodiment, the following effect (8) is further obtained.

(8) Wiring pattern (wiring pattern 7a,
7b and a metal plate 303 made of the same material as the metal material (Cu) used for the second wiring patterns 105a and 105b).
Is used, the spatial distribution of the thermal expansion coefficient of the entire wiring board 1 is stabilized, and as a result, the reliability of the wiring board 1 is improved.

Next, a fifth embodiment will be described. FIG. 5 shows a configuration of a wiring board 1 as a fifth embodiment. 5B is a diagram schematically showing the appearance of the inside of the insulating substrate 3 from the direction of the IC chip 15 in FIG. 5A, in the vicinity of the capacitor element 413. FIG.

In the first to fourth embodiments, one capacitor element 13 has been described as being built in the insulating substrate 3. However, in the wiring board 1 of this embodiment shown in FIG. The element 413 is built in the insulating substrate 3. A fiber 430 as a “reinforcing member” is provided between the individual capacitor elements 413. The fiber 430 is made of an insulating material (a nylon resin in this embodiment), and has a thickness substantially equal to the interval between the capacitor elements 413.

Such a configuration can be realized, for example, as follows. First, a plurality of capacitor elements 413 are arranged in a molding die, and a fiber 430 is arranged between the capacitor elements 413 so as to intersect in the vertical and horizontal directions. Then, by injecting the resin into the mold and curing it, the insulating substrate 3 having the capacitor element 413 and the fiber 430 built therein can be obtained as shown in FIG. The fiber 430 may be arranged in the mold before the capacitor element 413 is arranged in the mold.
3 is easy to position.

Since the other structure is the same as that of the second embodiment, the description is omitted. However, according to the wiring board of the fifth embodiment configured as described above, the above effects (1) to (5) are obtained.
In addition to (3), the following effect is obtained. (9) Since the fibers 430 are embedded in the insulating substrate 3, the rigidity of the insulating substrate 3 can be improved. Therefore, the capacitor element 413 built in the insulating substrate 3 can be effectively protected.

(10) Since the fibers 430 are located between the capacitor elements 413, the possibility that the insulating substrate 3 is broken or cracked between the capacitor elements 413 can be reduced. . In addition, it is possible to secure an interval between the capacitor elements 413.

(11) The thickness of the fiber 430 disposed between the capacitor elements 413 is
The distance between the three is substantially equal to the distance between the three. That is, it is easy to arrange the capacitor elements 413 at desired intervals. That is, the positional relationship between the capacitor elements 413 can be reliably maintained, and the interval required for insulating the capacitor elements 413 from each other can be reliably maintained.

(12) Since the fibers 430 are arranged not only in one direction but also in a vertical and horizontal direction,
The insulating substrate 3 can be reinforced so as to withstand forces from various directions. (13) The fiber 430 is made of a nylon resin which is an insulating material. Therefore, the fiber 43
0 is preferable without causing a short circuit.

As described above, one embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and can take various aspects. For example, in the above embodiment,
The conductor layer (wiring pattern 7a,
7b) (FIG. 1 (e)).
However, the present invention is not limited to this, and may be formed by various methods such as a semi-additive method and a full-additive method.

In the third and fourth embodiments, the glass cloth 203 or the metal plate 303 is used as a reinforcing member for the insulating substrate 3.
Although described as being built in the inside, the present invention is not limited to this. For example, a ceramic plate may be embedded (that is, the resin 4 and the ceramic plate are alternately stacked). Here, the wiring patterns 7a on both sides of the insulating substrate 3,
7b are connected to each other,
Vias may be formed in advance in the ceramic plate at positions corresponding to the through holes by simultaneous firing with the ceramic plate using tungsten, molybdenum, or the like.

When a plate member is provided as a reinforcing member,
The material is not limited to metals and ceramics, and it goes without saying that a plate made of glass, resin or the like may be adopted. In addition, a through hole (for example, a through hole 303a of the metal plate 303) for accommodating the capacitor element is provided in the plate material, and irregularities or through holes for improving the adhesion to the resin 4 forming the insulating substrate 3 are provided. It is good to provide a hole. By providing the irregularities and the through holes, the contact area between the plate material and the resin 4 can be increased, and the adhesion between them can be increased. Further, in order to increase the adhesion between the plate material and the resin 4, it is preferable to apply a primer (for example, a silane coupling agent or the like) to the surface of the plate material according to the material of the plate material and to perform a base treatment.

In the fourth embodiment, the metal plate 303
However, the present invention is not limited to this, and various metals can be considered. In this case, it is preferable that the rigidity is as high as possible, and it is preferable that the wiring pattern is formed of the same metal as the metal forming the wiring pattern.

In the first to fourth embodiments, the second step of exposing the terminal 13a of the capacitor element 13 to the outside of the insulating substrate 3 is as follows. The step of flattening both surfaces of the insulating substrate 3 and exposing the terminals 13a of the capacitor elements 13 to the outside of the insulating substrate 3 is performed (according to this method). It is not something that can be done. For example, the terminal 13a of the capacitor element 13 may be exposed to the outside (both sides or one side) of the insulating substrate 3 by forming an opening in the insulating substrate 3 by laser processing.

If the "step of polishing both sides of the insulating substrate 3" is adopted as the second step of exposing the terminal 13a of the capacitor element 13 to the outside of the insulating substrate 3, Can be performed at the same time, which is preferable in terms of man-hour reduction. On the other hand, according to the “step of forming an opening in the insulating substrate 3 by laser processing”, the thickness of the insulating substrate 3 is larger than the thickness of the insulating substrate 3. Even when the capacitor element 13 is small (thin), it is relatively easy to expose the terminal 13a (that is, the capacitor element 13 of various sizes and shapes is not limited by the thickness of the insulating substrate 3 and can be designed. Is improved).

When a plurality of capacitor elements 413 are buried in the insulating substrate 3 as in the fifth embodiment, for example, the height (depth) of each capacitor varies, or individual The thickness of the capacitor element 413 may be different. In such a case, it is difficult to expose the terminals 413a of all the capacitor elements 413 at once by polishing, but according to the laser processing,
Even if the height (depth) varies, all terminals 41
The opening exposing 3a can be reliably formed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a wiring board according to a first embodiment and a manufacturing method thereof.

FIG. 2 is an explanatory diagram illustrating a configuration of a wiring board according to a second embodiment.

FIG. 3 is an explanatory view showing a configuration of a wiring board according to a third embodiment and a manufacturing method thereof.

FIG. 4 is an explanatory diagram illustrating a configuration of a wiring board according to a fourth embodiment.

FIG. 5 is an explanatory diagram illustrating a configuration of a wiring board according to a fifth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wiring board 3 ... Insulating board 4 ... Resin 7a, 7b ... Wiring pattern 13, 413 ... Capacitor element 13a, 413a ... Terminal of capacitor element 15 ... IC chip 105a, 105b ... Second wiring pattern 203 ... Glass cloth 303 ... Metal plate 430: Fiber

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 5E338 AA02 AA03 AA16 BB63 BB72 BB75 CC01 EE14 EE26 EE28 EE33 5E346 AA02 AA12 AA15 AA32 AA43 BB20 CC02 CC32 DD03 DD22 DD32 EE31 FF04 FF07 FF45 GG15 GG17 GG15H

Claims (9)

[Claims] 1. An insulating substrate, a conductor layer formed on the insulating substrate using the insulating substrate as a support, and a capacitor element built in the insulating substrate and connected to the conductor layer. A wiring board for connecting and mounting an integrated circuit element to the conductor layer, wherein the insulating substrate is formed by arranging a capacitor element inside a predetermined mold and injecting a resin. A wiring board characterized by the above-mentioned. 2. The wiring board according to claim 1, wherein the insulating substrate includes a reinforcing member embedded inside the insulating substrate. 3. The wiring substrate according to claim 2, wherein the insulating substrate includes, as the reinforcing member, a glass cloth embedded inside the insulating substrate. 4. The wiring board according to claim 2, wherein the insulating substrate includes a metal plate embedded inside the insulating substrate as the reinforcing member. 5. The capacitor element according to claim 1, wherein at least a side surface of the capacitor element is roughened in order to enhance adhesion with a resin injected into the mold. The wiring board as described. 6. A wiring board comprising: an insulating substrate made of resin; a conductor layer formed on the insulating substrate using the insulating substrate as a support; and a capacitor element connected to the conductor layer. A manufacturing method, comprising: a first step of forming an insulating substrate by arranging a capacitor element in a mold for forming an insulating substrate and injecting a resin; and forming a terminal of the capacitor element outside the insulating substrate. And a third step of forming a conductor layer on the insulating substrate so as to be connected to a terminal of the capacitor element exposed to the outside of the insulating substrate. Method for manufacturing a wiring board. 7. In the first step, the resin injection into the mold is divided into a plurality of times, and a glass cloth is placed on the resin inside the mold between the resin injections, so that the resin and the glass 7. The method according to claim 6, wherein the insulating substrate on which the cloth is laminated is formed. 8. In the first step, the resin injection into the mold is divided into a plurality of times, and a metal plate is placed on the resin inside the mold between the resin injections, so that the resin and the metal are arranged in the thickness direction. 7. The method for manufacturing a wiring board according to claim 6, wherein the insulating board on which the boards are laminated is formed. 9. The method according to claim 6, further comprising a step of roughening at least a side surface of the capacitor element before the first step. .