JP2001076943A - High-frequency coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency coil which can be constituted in a small size, easily assembled and is equipped with a capacitor. SOLUTION: This high-frequency coil comprises a bobbin 11 formed like a hollow cylinder, coil 12 wound around the bobbin 11, base 13 disposed at the lower end of the bobbin, plurality of terminals 14 extending down from the bottom face of the base and chip capacitor 16 housed in a recess 13a formed into the bottom of the base, the winding ends 12a, 12b of the coil are bound to the terminals 14a, 14b, thereby being electrically connected thereto, and the terminals 14a, 14b to which the chip capacitor is to be connected are led around along the side face of the base 13 from its top face and butted to electrodes 16a, 16b of the chip capacitor 16 in the recess of the base.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency coil having a capacitor connected in parallel to the coil, for example.

[0002]

2. Description of the Related Art Conventionally, such a high-frequency coil is configured, for example, as shown in FIG. In FIG. 6, a high-frequency coil 1 includes a substantially cylindrical hollow cylindrical bobbin 2 and a base 3 formed integrally with the lower end of the bobbin 2.
And a plurality of (six in the illustrated case) terminals 4 implanted around the bottom surface of the base 3 and housed in a recess 3 a provided substantially near the center of the base 3. Capacitor 5
And is composed of

A winding of a coil (not shown) is wound around the outer peripheral surface of the bobbin 2, and its winding terminals 6a, 6b
Is removed from the terminal 4 at the roots of the terminals 4a and 4b. The capacitor 5 is a so-called cylindrical capacitor, and lead wires (not shown) protruding from both ends thereof are lapped to the terminals 4a and 4b. And
From this state, the winding terminals 6a, 6b of the coils carved at the terminals 4a, 4b and the lead wires of the capacitor 5 are electrically connected to each other by soldering or the like, and the capacitor 5 is connected in parallel to the coil. Will be done.

[0004]

The high-frequency coil 1 having such a configuration has the following problems. That is, since the capacitor 5 to be connected in parallel to the coil is a cylindrical capacitor, it is difficult to reduce the size of the base 3 and soldering work is required for connecting the capacitor 5. Thus, there is a problem that workability is poor and assembly is complicated.

SUMMARY OF THE INVENTION In view of the above, the present invention has a small size and can be easily assembled.
An object is to provide a high-frequency coil including a capacitor.

[0006]

According to the present invention, there is provided a bobbin formed into a hollow cylindrical shape, a coil wound around an outer peripheral surface of the bobbin, and a base provided at a lower end of the bobbin. And a plurality of terminals provided to extend downward from the bottom surface of the base, and a chip capacitor housed in a recess provided on the bottom surface of the base, and a winding terminal of the coil. However, in the high-frequency coil, which is electrically connected by being entangled with the terminal, the terminal to which the chip capacitor is to be connected is routed along the side surface from the upper surface of the base, Characterized by being in contact with the electrode portion of the chip capacitor in the recess of
Achieved by high frequency coils.

According to the above configuration, a chip capacitor is used as a capacitor, is housed in a recess provided on the bottom surface of the base, and should be connected to an electrode of the chip capacitor in the recess. Since the upper end of the terminal is drawn along the side surface from the top surface of the base and is in contact with the base, the coil terminal wound around the bobbin is wound around the base of the terminal. The connection with the chip capacitor can be made at the same time. Therefore, the chip capacitor can be easily connected to the coil with a simple configuration, and the chip capacitor is used as the capacitor. Therefore, the base and the entire high-frequency coil can be made small.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. 1 to 5 show an embodiment of a high-frequency coil according to the present invention. In FIG. 1, a high-frequency coil 10 includes a bobbin 11 formed in a hollow cylindrical shape extending substantially vertically, a coil 12 wound on an outer peripheral surface 11 a of the bobbin 11, and a base formed integrally with a lower end of the bobbin 11. A base 13, a plurality of terminals 14 provided to extend downward from the bottom surface of the base 13, a core 15 provided in a hollow portion of the bobbin 11, and a concave portion 13a provided on the bottom surface of the base It comprises a chip capacitor 16 housed therein and a case 17 covering the periphery of the bobbin 11. The recess 13a is formed in a circular shape in FIG. 4, but may be rectangular as shown in FIG.

As shown in FIG. 5, three terminals 14 are arranged side by side on the bottom surface of the base 13 near the opposite side edges. The winding terminals 12 a and 12 b of the coil 12 are connected to the terminal 1 of the terminals 14.
It is tied near the base of 4a, 14b.

The terminals 14a and 14b have upper ends,
After being routed along the upper surface of the base 13 to the vicinity of the center in the vertical direction in FIG. 4, along the end surface of the base 13,
It is arranged so as to be drawn to the lower surface of the base 13 and further extend inward so as to approach each other in the left-right direction in FIG. And the terminals 14a, 14b
As shown in FIG. 5, the tips 14a 'and 14b' of the base contact the electrode portions 16a and 16b at both ends of the chip capacitor 16 housed in the recess 13a on the bottom surface of the base 13. In the above case, the engagement groove 13b, 1
3b is preferably provided for positioning when the terminals 14a and 14b are routed.

A high-frequency coil 10 according to an embodiment of the present invention
Are configured as described above, and the winding terminals 12a, 12a of the coil 12 wound on the outer peripheral surface 11a of the bobbin 11
b are terminals 14a, 1 extending downward from the bottom surface of the base 11.
The base 4b is tied to the base and is electrically connected by soldering or the like. At this time, the terminals 14a,
14b is a concave portion 1 provided on the lower surface of the base 13 by drawing the upper surface and the side surface of the base 13 respectively.
Electrode part 16 of chip capacitor 16 housed in 3a
Since the coils 12 are in contact with the terminals 16a and 16b, the winding terminals 12a and 12b of the coil 12 are electrically connected to the chip capacitor 16 by being wound around the terminals 14a and 14b.

As a result, the connection of the coil 12 to the chip capacitor 16 is established by the winding terminals 12a of the coil 12,
This can be performed by a simple operation of just hanging the terminal 12b to the terminals 14a and 14b, and the assembling operation is easily performed, so that the assembling time can be shortened and the assembling cost can be reduced. Further, since the chip capacitor 16 is used as a capacitor constituting the high-frequency coil, the recess 13a of the base 13 in which the chip capacitor 16 is to be accommodated is small, and the base 13 and the entire high-frequency coil 10 are small. It can be configured as follows.

In the above-described embodiment, the high-frequency coil 10 provided with one coil 12 and one chip capacitor 16 has been described. However, the present invention is not limited to this. Since the present invention is in contact with the high-frequency coil provided with the coil, the coil and the chip capacitor are connected at the same time by winding the winding end of the coil wound on the bobbin around the base of the terminal. Can be done.

Accordingly, the chip capacitor can be easily connected to the coil with a simple structure, and the chip capacitor is used as the capacitor. Become.

Thus, according to the present invention, it is possible to reduce the size and to facilitate the assembly.
High frequency coils with very good capacitors can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a high-frequency coil according to the present invention.

FIG. 2 is a partially cutaway side view showing the high-frequency coil of FIG.

FIG. 3 is a partially cutaway side view of a bobbin in the high-frequency coil of FIG. 1;

FIG. 4 is a bottom view of a bobbin in the high-frequency coil of FIG. 1;

FIG. 5 is a schematic perspective view showing a bottom surface of a base in the high-frequency coil of FIG. 1;

FIG. 6 is a schematic perspective view of an example of a conventional high-frequency coil viewed from below.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 High frequency coil 11 Bobbin 12 Coil 12a, 12b Winding terminal of coil 13 Base 13a Depression 14 Terminal 14a, 14b Terminal which is routed on the upper surface and side surface of base 15 Core 16 Chip capacitor 16a, 16b Electrode 17 Cover

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E058 DA06 DB03 5E070 AA05 AB01 CA12 CB18 DB02 EA06 EB02

Claims (1)

[Claims] 1. A bobbin formed in a hollow cylindrical shape, a coil wound around an outer peripheral surface of the bobbin, a base provided at a lower end of the bobbin, and a base provided to extend downward from a bottom surface of the base. A plurality of terminals, and a chip capacitor accommodated in a recess provided on the bottom surface of the base, and the winding terminal of the coil is electrically tied to the terminal. In the connected high-frequency coil, the terminal to which the chip capacitor is to be connected is routed from the upper surface of the base along the side surface, and is in contact with the electrode portion of the chip capacitor in the concave portion of the base. A high-frequency coil, characterized in that: