JP3648362B2 - Multiple electronic composite parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multiple electronic composite component in which a coil such as a lumped constant delay line and a lumped constant filter used in communication devices and other electronic devices, a so-called LC filter, and a capacitor such as a chip capacitor are combined in a multiple manner. About.
[0002]
[Prior art]
A conventional electronic composite component that combines a coil and a capacitor in a multiplex-constant delay line or LC filter, which is a multi-unit type, has a plurality of coils arranged side by side on the substrate, and a capacitor is placed on the side or below the coil. Is formed.
[0003]
[Problems to be solved by the invention]
However, in an electronic composite part in which a coil and a capacitor are combined in a multiplex constant type delay line or a conventional LC filter, the bobbin type or drum type is formed separately from the circuit board. When a coil member is formed by winding a winding around the core portion of the winding member and connecting the terminal of each winding to the corresponding terminal pin, the coil member is often used for winding work and terminal pin connection work. It is a problem that requires a lot of work. In this case, each coil member is a mechanically or electrically independent component with respect to the circuit board, and electrical connection between the windings is performed after the coil member is mounted on the circuit board. Therefore, when changing the electrical connection between the windings, the wiring pattern of the circuit board must be changed, the circuit manufacturing work process becomes complicated, and various wiring patterns must be prepared. The above cost is a problem.
[0004]
In addition, a plurality of flanges each having a terminal pin and having a notch formed on the side are arranged side by side, and the lead wire of the winding section partitioned by the flange is connected to the other through the notch of the flange. When wiring to the winding section, in order to electrically connect the windings between the winding sections in the distant sections, the lead lines must be wired across several sections, Is broken, or electrical interference occurs between the lead wire and the winding portion through which the lead wire passes.
[0005]
In a multi-component electronic composite part, a capacitor is provided on the side or lower side of each coil bobbin of a multi-unit coil, and the lead wire of the coil or the lead wire of the capacitor is formed so as to be connected to the outside. In order to make a complicated connection between coils, between capacitors, or between a coil and a capacitor, it is not easy to connect with a stable solder, and a long time is required.
An object of the present invention is to solve the problems relating to the difficulty of arrangement work in the conventional multiple electronic composite parts.
[0006]
[Means for Solving the Problems]
SUMMARY OF THE INVENTION An object of the present invention is to provide a multiple electronic composite component that can be easily connected between coils, between capacitors, and between a coil and a capacitor.
That is, the present invention relates to an electronic composite component in which a coil and a capacitor are combined in a multiple manner in which a plurality of winding portions are provided at intervals in the long axis direction on a long board member. A plurality of insulating wall portions that are erected between the upper wall portion and the bottom wall portion of the side portion at an interval in the longitudinal direction at one side end portion of the member; and the upper wall portion, A plurality of recesses formed surrounded by the bottom wall and the insulating wall, and two notches formed to be recessed inwardly at the end of the recess on the recess opening side of the upper wall portion, A tongue-shaped capacitor holding piece formed between the two notches, a terminal pin disposed in a recess below the notch, and the terminal pin in the recess is received between the terminal pins, And a chip capacitor whose upper surface is pressed by a capacitor pressing portion. In the composite parts.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a plurality of winding portions are provided on the upper portion of the substrate, and capacitor attachment portions are provided in recesses formed in the lower portion of the substrate. In the recess of each capacitor mounting part, the ceiling wall part faces inward at both ends of one side part so that the lead wire from the winding part can be easily and easily connected to the electrode terminal of the chip capacitor. Notches are formed, and terminal pins are provided below the notches. In the present invention, the terminal pin passes through the bottom wall portion and enters the recess portion, and the end portion exiting from the recess portion is located above the substrate so that the coil lead wire and the chip capacitor electrode terminal can be connected easily and easily. It may be raised toward the side, or may be bent outward from the side of the substrate. An end portion of the terminal pin that protrudes below the bottom wall portion is fitted and fixed to the wiring board during wiring.
[0008]
In the present invention, in order to stably attach the chip capacitor to a predetermined location in the recess, a tongue-like capacitor pressing part is formed between the notches so as to hold the chip capacitor from the upper surface. In the present invention, the chip capacitor is provided between the terminal pins so that the electrode terminals can be easily connected to the terminal pins. In the present invention, the number of chip capacitors can be made equal to the number of coil bobbin portions, but the number of coil bobbin portions and the number of capacitor mounting portions are not necessarily matched.
[0009]
The present invention provides a plurality of insulating wall portions erected between an upper wall portion and a bottom wall portion of the side portion at an interval in a major axis direction at one side end portion of the substrate member, A plurality of recesses formed surrounded by the upper wall portion, the bottom wall portion and the insulating wall, and two recesses formed inwardly at the end of the upper wall portion of the recess portion on the recess opening side. A notch, a tongue-shaped capacitor pressing piece formed between the two notches, a terminal pin disposed in a recess below the notch, and the terminal pin in the recess And the lead wire of each coil can be connected to the terminal pin through the notch, and the chip capacitor can be connected to the terminal pin. Since the electrode terminals are also close to the terminal pins, these connections are easy. One can be easily performed.
In the present invention, since the chip capacitors are accommodated in the recesses formed in the side edge portions of the substrate member on which the plurality of coil bobbin portions are mounted, the arrangement intervals of the coil bobbins can be formed densely.
[0010]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to the above description and examples.
FIG. 1 is a schematic partial cross-sectional side view of a substrate portion including a winding portion and a capacitor mounting portion of a multiple electronic composite component according to an embodiment of the present invention.
FIG. 2 is a schematic plan view of the multiple electronic composite component of the embodiment shown in FIG. FIG. 3 is a schematic side view of the multiple electronic composite component of the embodiment shown in FIGS. 1 and 2. In FIG. 1 to FIG. 3, corresponding parts are denoted with the same reference numerals.
[0011]
In one embodiment of the present invention shown in FIG. 1 to FIG. 3, a multiple electronic composite component 1 having multiple coils and chip capacitors is provided with a substrate 2, and the substrate 2 has a longitudinal direction of the substrate. The coil bobbin portion 3 is provided upright on one side of the substrate 2 with a predetermined interval therebetween. On one outer side portion 4 of the substrate 2, there is formed a recess portion 5 having a U-shaped cross section with a predetermined interval in the longitudinal direction of the substrate and having an opening at the outer end portion of the substrate 2. Yes. Each recess 5 of the substrate 2 is a space for chip capacitor placement, and is partitioned by a partition wall 6 at a predetermined interval in the longitudinal direction of the substrate. The recesses upper wall 7 above the recess and below the recess It is formed surrounded by the recess lower wall 8. In this example, the end portion 9 of the recess upper wall 7 of the chip capacitor arrangement space is provided with a notch 10 with a predetermined interval in the longitudinal direction so as to facilitate connection work to the chip capacitor. A plurality are formed.
[0012]
In this example, the tongue-shaped capacitor pressing portion 11 remaining between the two notches 10 is in contact with the top of the chip capacitor 12 disposed in the recess 5 and has a function of pressing the chip capacitor 12. . In the recess 5, a terminal pin 13 for connecting the electrode terminal of the chip capacitor 12 and a lead wire for the coil 14 wound around the coil bobbin portion 3 are provided through the recess lower wall 8. In this example, the terminal pin 13 is formed in a shape bent in a key shape outward from the recess 5 with respect to the longitudinal axis of the substrate 2, that is, the end portion protrudes laterally. , And can be shaped to penetrate the recess upper wall 7
In this example, the multiple electronic composite component 1 is provided with three coil bobbin portions 3 with a predetermined interval in the longitudinal direction of the substrate 2, and with a predetermined interval in the longitudinal direction of the substrate 2 and 4. A plurality of chip capacitor placement recesses 5 are provided, and one terminal pin 13 is provided on each side of the recess 5. The coil bobbin portion 3 is formed integrally with the substrate 2.
[0014]
In this example, the recess 5 in the chip capacitor placement space is partitioned by a partition wall 6 and provided at one side edge along the longitudinal direction of the substrate 2 with a predetermined interval. The recess 5 is formed in such a size that the chip capacitor 12 and the terminal pins 13 can be arranged on both sides thereof.
[0015]
Since this example is configured as described above, the multiple electronic composite component 1 forms a coil 14 by winding windings around the three coil bobbin portions 3 provided on the upper surface of the substrate 2. Further, chip capacitors 12 are accommodated in the four recesses 5 respectively. In this example, the terminal pin 13 provided in the recess 5 so as to penetrate the recess lower wall 8 is provided at a position perpendicular to or intersecting the longitudinal axis of the substrate 2, that is, outward from the recess 5. It is formed by protruding the end sideways.
[0016]
In this example, the lead wire of the coil 14 is connected to a predetermined terminal pin 13 through the notch 10, and the electrode terminal of the chip capacitor 12 is the terminal pin 13 when the chip capacitor 12 is accommodated in the recess 5. Contact with.
[0017]
In this example, the recess 5 is provided on one side of the substrate 2, but can be provided on both sides of the substrate 2. In this case, various connections can be made by bending the end portion of the terminal pin 13 horizontally through the upper portion of the recess upper wall.
[0018]
【The invention's effect】
The present invention provides, for example, a recess formed by an upper wall portion, a bottom wall portion, and an insulating wall in the longitudinal direction of one side end portion of a substrate member integrally formed with a bobbin portion on the upper surface. Since the chip capacitor is accommodated in the portion, the coil bobbin portion can be formed densely on the upper surface of the substrate member, and thus the outer dimension of the substrate member itself can be reduced. In addition, it is possible to easily and easily connect the lead wire of the coil winding and the electrode terminal of the chip capacitor and the terminal pin.
[Brief description of the drawings]
FIG. 1 is a schematic partial cross-sectional side view of a substrate portion including a winding portion and a capacitor mounting portion of a multiple electronic composite component according to an embodiment of the present invention.
FIG. 2 is a schematic plan view of the multiple electronic composite component of the embodiment shown in FIG.
FIG. 3 is a schematic side view of the multiple electronic composite component of the embodiment shown in FIGS. 1 and 2;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Multiple electronic composite component 2 Board | substrate 3 Coil bobbin part 4 One outer side part 5 of the board | substrate 2 The recessed part 6 Partition 7 The recessed part upper wall 8 The recessed part lower wall 9 The edge part 10 of the recessed part upper wall 7 Notch 11 Capacitor holding piece 12 Chip capacitor 13 Terminal pin 14 Coil

Claims (1)

In an electronic composite component in which a plurality of winding portions are provided spaced apart from each other in the longitudinal direction on an axially long board member, one side of the board member A plurality of insulating wall portions erected between the upper wall portion and the bottom wall portion of the side portion at an interval in the major axis direction, the upper wall portion, the bottom wall portion, and the insulating wall A plurality of recesses formed by being surrounded by two recesses formed inwardly at the recess opening side end of the upper wall portion of the recesses, and the two notch portions A tongue-shaped capacitor pressing piece formed between the terminal pin and a terminal pin disposed in a recess below the notch; A multiple electronic composite component comprising a chip capacitor whose upper surface is pressed.

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