JP2001071510A5 - - Google Patents
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- Publication number
- JP2001071510A5 JP2001071510A5 JP2000200581A JP2000200581A JP2001071510A5 JP 2001071510 A5 JP2001071510 A5 JP 2001071510A5 JP 2000200581 A JP2000200581 A JP 2000200581A JP 2000200581 A JP2000200581 A JP 2000200581A JP 2001071510 A5 JP2001071510 A5 JP 2001071510A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000200581A JP4596612B2 (en) | 1999-07-02 | 2000-07-03 | Method for manufacturing liquid discharge head |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-189629 | 1999-07-02 | ||
| JP18962999 | 1999-07-02 | ||
| JP2000200581A JP4596612B2 (en) | 1999-07-02 | 2000-07-03 | Method for manufacturing liquid discharge head |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010186184A Division JP4702963B2 (en) | 1999-07-02 | 2010-08-23 | Liquid discharge head manufacturing method, liquid discharge head, head cartridge, liquid discharge recording apparatus, silicon plate manufacturing method, and silicon plate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001071510A JP2001071510A (en) | 2001-03-21 |
| JP2001071510A5 true JP2001071510A5 (en) | 2007-08-09 |
| JP4596612B2 JP4596612B2 (en) | 2010-12-08 |
Family
ID=26505578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000200581A Expired - Fee Related JP4596612B2 (en) | 1999-07-02 | 2000-07-03 | Method for manufacturing liquid discharge head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4596612B2 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7052117B2 (en) * | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
| US6824246B2 (en) * | 2002-11-23 | 2004-11-30 | Kia Silverbrook | Thermal ink jet with thin nozzle plate |
| JP2006095891A (en) * | 2004-09-29 | 2006-04-13 | Canon Finetech Inc | Liquid discharge head and its manufacturing method |
| JP4337723B2 (en) | 2004-12-08 | 2009-09-30 | セイコーエプソン株式会社 | Droplet discharge head manufacturing method, droplet discharge head, and droplet discharge apparatus |
| JP4665598B2 (en) * | 2005-05-11 | 2011-04-06 | セイコーエプソン株式会社 | Silicon substrate processing method |
| JP4632441B2 (en) | 2005-09-05 | 2011-02-16 | キヤノン株式会社 | Inkjet recording head and inkjet recording apparatus |
| WO2007105801A1 (en) * | 2006-03-10 | 2007-09-20 | Canon Kabushiki Kaisha | Liquid ejection head base body, liquid ejection head making use of the same and process for manufacturing them |
| JP4967777B2 (en) * | 2006-05-31 | 2012-07-04 | コニカミノルタホールディングス株式会社 | Inkjet head manufacturing method |
| JP2008091779A (en) * | 2006-10-04 | 2008-04-17 | Sanyo Electric Co Ltd | Method for manufacturing semiconductor device |
| JPWO2008155986A1 (en) * | 2007-06-20 | 2010-08-26 | コニカミノルタホールディングス株式会社 | Method for manufacturing nozzle plate for liquid discharge head, nozzle plate for liquid discharge head, and liquid discharge head |
| JP2009018463A (en) * | 2007-07-11 | 2009-01-29 | Seiko Epson Corp | Silicon-made nozzle substrate, method for manufacturing the same, droplet discharge head, and droplet discharge device |
| JP4985199B2 (en) * | 2007-08-07 | 2012-07-25 | パナソニック株式会社 | Semiconductor wafer separation method |
| JP5218164B2 (en) * | 2009-03-10 | 2013-06-26 | セイコーエプソン株式会社 | Nozzle substrate manufacturing method and droplet discharge head manufacturing method |
| JP5709536B2 (en) * | 2010-01-14 | 2015-04-30 | キヤノン株式会社 | Silicon substrate processing method |
| JP2013120660A (en) * | 2011-12-06 | 2013-06-17 | Canon Inc | Manufacturing method of through hole substrate |
| US8551692B1 (en) * | 2012-04-30 | 2013-10-08 | Fujilfilm Corporation | Forming a funnel-shaped nozzle |
| JP2018056159A (en) * | 2016-09-26 | 2018-04-05 | セイコーエプソン株式会社 | Adhesive tape peeling jig, manufacturing apparatus of semiconductor chip, manufacturing apparatus of mems device, manufacturing apparatus of liquid injection head, and adhesive tape peeling method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63199653A (en) * | 1987-02-16 | 1988-08-18 | Canon Inc | Protective film of ink jet recording head |
| JPH01253453A (en) * | 1988-04-01 | 1989-10-09 | Nec Corp | Ink jet head and its manufacture |
| JPH0629386A (en) * | 1992-07-10 | 1994-02-04 | Sharp Corp | Separating method for semiconductor device |
| JPH08336976A (en) * | 1995-06-14 | 1996-12-24 | Canon Inc | Liquid-jet recording head, manufacture thereof, and liquid-jet recording device mounted with the same |
| JPH10226079A (en) * | 1997-02-12 | 1998-08-25 | Canon Inc | Manufacture of liquid-jet recording head |
| JP3820747B2 (en) * | 1997-05-14 | 2006-09-13 | セイコーエプソン株式会社 | Manufacturing method of injection device |
| JPH1158746A (en) * | 1997-08-18 | 1999-03-02 | Shimeo Seimitsu Kk | Method for surface treating of nozzle plate of ink jet printer head |
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2000
- 2000-07-03 JP JP2000200581A patent/JP4596612B2/en not_active Expired - Fee Related