JP2001071251A - Grinding work method and device for thin plate member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a flat ground surface over the whole surface by executing the rough grinding work while moving a grinding tape in the rotational normal direction of a thin plate member, and then executing the finishing grinding work. SOLUTION: A tape moving mechanism 6 determines the moving direction S of a grinding tape T in the rotational tangent direction RT of a thin plate member W by a roughing work moving mechanism 7a of a moving mechanism 7, the rough grinding is executed while moving the grinding tape T in the rotational normal direction RN of the thin plate member W, then after the completion of the rough grinding, the moving direction S of the grinding tape T is determined in the rotational normal direction RN of the thin plate member W by a finishing work moving mechanism 7b, and the finishing grinding is executed while moving the grinding tape in the rotational normal direction RN of the thin plate member W to complete the grinding work. That is, the rough grinding and the finishing grinding work are executed on the surface of the thin plate member W respectively with the different relative directions between the rotating direction of the thin plate member W and the moving direction S of the grinding tape, whereby a smooth ground surface can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin plate-shaped member, for example, an optical disk such as a CD or DVD, which comprises forming a conductive film on the surface of a master, nickel-plating it, and transferring the signal surface to a thin metal. The present invention relates to a method and apparatus for polishing a thin plate-like member used when polishing the back surface of a so-called stamper as a plate.

[0002]

2. Description of the Related Art This stamper is used as a so-called mold in a copying process, and is required to have flatness and smoothness on the back surface because of the mold from which an optical disk is copied.

[0003] Conventionally, as this type of polishing apparatus, for example, a rotating disk on which a thin plate-like member can be mounted, as disclosed in Japanese Patent Publication No. 7-100294, Japanese Patent Laid-Open No. 4-86868, and Japanese Patent Laid-Open No. 3-256660, The structure includes a rotating mechanism for rotating the rotating disk, and a tape transferring mechanism having a polishing portion formed by continuously transferring the polishing tape above the rotating disk and guiding the polishing tape back. Are known.

[0004]

However, in the case of the above-mentioned conventional structure, the polishing portion made of the polishing tape is formed by a pressure receiving member which receives a polishing pressure, and the thin plate-like member is rotated to apply the polishing tape to the surface of the thin plate-like member. Since the polishing is performed by pressing the polishing portion, the peripheral speed in the radial direction is different, that is, the peripheral speed on the outer side is larger than the peripheral speed on the inner side. This is disadvantageous in that it is not easy to obtain a flat polished surface over the entire surface.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to solve such a problem, and among the present invention, a method according to the first aspect of the present invention is a method of polishing by rotating a thin plate member. When the polishing process is performed by the polishing section formed by guiding the tape back, the polishing tape is moved in the rotation tangential direction of the thin plate member and the polishing tape is moved in the rotation normal direction of the thin plate member. And rough polishing, then
The polishing direction of the polishing tape is arranged in the normal direction of rotation of the thin plate member, and the polishing tape is moved in the normal direction of rotation of the thin plate member to finish polishing the thin plate member. In the way.

Further, the invention according to claim 2 is characterized in that the polishing tape is caused to oscillate in a direction orthogonal to the tape transport direction. During the rough polishing, the rotation speed of the thin plate member is set to be faster than the oscillation speed of the polishing tape. On the contrary, during the finish polishing, the oscillation speed of the polishing tape is set to be faster than the rotation speed of the thin plate member. It is characterized by doing.

Further, according to the invention of an apparatus according to claim 4, a rotating disk on which a thin plate member can be mounted, a rotating mechanism for rotating the rotating disk, and a polishing tape above the rotating disk. A tape transport mechanism having a polishing section formed by continuously transporting and returning the polishing tape by a pressure receiving member, a moving mechanism for moving the tape transport mechanism, and a vertical movement mechanism for vertically moving the tape transport mechanism. A roughing moving mechanism for moving the polishing tape in a rotation normal direction of the thin plate member by disposing a transfer direction of the polishing tape in a rotation tangential direction of the thin plate member; and A polishing tape transfer direction is arranged in a rotation normal direction of the thin plate member, and the polishing tape is moved in a rotation normal direction of the thin plate member. is there.

According to a fifth aspect of the present invention, there is provided a vibration mechanism for oscillating the polishing tape in a direction perpendicular to the tape transport direction. According to a sixth aspect of the present invention, the rotation speed of the thin plate member is set to be higher than the oscillation speed of the polishing tape during the roughing, and the oscillation speed of the polishing tape is decreased during the finishing operation. The rotation speed is set to be faster than the rotation speed, and the invention according to claim 7 allows the tilting operation of the rotation axis of the pressure receiving member and the inner position of the rotation axis of the pressure receiving member. And a polishing pressure adjusting mechanism capable of adjusting a polishing pressure at an outer position.
The polishing pressure adjusting mechanism includes a pressure controllable pressure control cylinder that holds an inner position of a rotation axis of the pressure receiving member and a pressure controllable pressure control cylinder that holds an outer position of a rotation axis of the pressure receiving roll. It is characterized by consisting of.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 11 show an embodiment of the present invention, in which 1 is a rotating disk, 2 is a rotating mechanism, and in this case, a rotating shaft 4 is provided at the center of a machine base 3. The rotating disk 1 is installed vertically at the upper end of the rotating shaft 4 by the bearing 5, and a detaching mechanism (not shown) for fixing the thin plate member W on the rotating disk 1 is provided.
As the attachment / detachment mechanism, for example, a clamp structure or a negative pressure suction structure is used. A rotation motor (not shown) is attached to the lower portion of the machine base 3 and the rotation plate 1 is rotated by the rotation motor to rotate the rotation center O.
Is made to rotate around the center.

Reference numeral 6 denotes a tape transfer mechanism, 7 denotes a moving mechanism, and 8 denotes a vertical movement mechanism. The moving mechanism 7 comprises a lower roughing moving mechanism 7a and an upper finishing moving mechanism 7b. was disposed movably back and forth sliding table 10a in the rotation normal direction R _N of the thin plate-like member W to be back and forth toward the turntable one direction by the sliding portion 9a on the machine base 3, sliding base before and after this 10a is a motor 11 for moving back and forth
a and a ball screw mechanism 12a so as to be movable, and freely movable in a rotational tangential direction _RT of the thin plate member W in the left-right direction toward the turntable 1 by a sliding portion 9b on the front and rear slide table 10a. A left and right slide table 10b is provided, and the left and right slide table 10b is
1b and a ball screw mechanism 12b so as to be movable. The vertical movement mechanism 8 has a support 13 standing on a left and right slide table 10b, a mounting table 14 is mounted on the support table 13, and a slide is mounted on the mounting table 14. A vertical slide base 16 is provided so as to be vertically movable by a moving part 15, and the vertical slide base 16 is provided so as to be vertically movable by a vertical movement cylinder 17.

Numeral 18 denotes an inclination adjusting mechanism, in which a holding table 19 is protruded from the vertical slide table 16 to hold the holding table 1.
9, a holding member 21 is pivotally supported by a fulcrum shaft 20 so as to be tiltable, a locking plate 22 is protruded above the vertical slide base 16, and a stopper that can abut the locking plate 22 on the front surface of the holding member 21. An adjusting screw body having a bolt 23 mounted thereon, a spring member 24 interposed between the locking plate 22 and the front surface of the holding member 21, and an abutment bolt 25 provided on the holding base 19 on the holding member 21. The holding member 21 is provided so as to be capable of adjusting the tilt forward or backward about the fulcrum shaft 20 by an adjusting screw body 26 and a stopper bolt 23.

Reference numeral 27 denotes a swinging mechanism, and the holding member 2
1, a support bracket 29 is mounted on the holding member 21, a support frame 29 is mounted on the holding member 21, two guide shafts 30 are installed on the support frame 29 and the holding member 21, and the shaking table 31 is rocked on the guide shaft 30. A swing plate 32 is mounted on the upper surface of the swing table 31, a swing motor 33 is horizontally mounted on the support bracket 28, and an eccentric wheel 34 is mounted on the main shaft of the swing motor 33, A pair of guide plates 35 are erected while the eccentric ring 34 is sandwiched between the plates 32, and the oscillating table 31 is moved eccentrically by the eccentric ring 34 and the action of the pair of guide plates 35 to move the polishing tape T in the tape transport direction. The oscillating motion is made in a direction M orthogonal to S.

In this case, the tape transport mechanism 6 has a support plate 36 attached to the holding member 21 and aluminum oxide, chromium oxide, and silicon on base materials such as polyester film, metal, and cloth on the left and right sides of the support plate 36. Carbide, a winding motor 37a is provided for rotating the actual winding reel 37 by rotating the actual winding reel 37 and the winding reel 38 around a polishing tape T formed by coating or bonding abrasive particles of a predetermined particle size such as diamond. A winding motor 40 for winding and rotating the winding roll 39 is provided. The winding motor 40 rotates the winding reel 38 via the belt 41 to rotate the polishing tape T pulled out from the actual winding reel 37. It is folded back by a roll-shaped pressure receiving member 43 via a roll 42, thereby forming a polishing portion K made of a polishing tape T. , Between 46 and winding roll 39 and clamped roll 47, the take-up reel 38 via the roll 47a
The polishing tape T is continuously or intermittently transferred in one direction by a winding roll 39 while rotating the actual winding reel 37 and the winding reel 38.

Reference numeral 48 denotes a polishing pressure adjusting mechanism. In this case, a pair of left and right sliding portions 49 are provided on the shaking table 31 so as to be positioned inward and outward in the radial direction of the turntable 1, respectively. 51 is slidably mounted vertically.
The roller shaft 43a of the pressure receiving member 43 is rotatably supported by the free bearing 52 with the rotation axis L being set in the radial direction of the turntable 1, and two pressure control units each including a pneumatic cylinder are mounted on the vibration plate 32. Cylinders 53 and 54 are provided vertically, and the rods 53a and 54a of the two pressure control cylinders 53 and 54 are provided.
Is connected to the bearing bodies 50 and 51 via a universal joint 55, and a pressure control valve (not shown) is connected to the pressure control cylinders 53 and 54 to reduce the supply air pressure to each of the pressure control cylinders 53 and 54. The pressure is controlled by a pressure control valve, and the pressing forces of the rods 53a and 54a of the two pressure control cylinders 53 and 54 are separately adjusted, whereby the rotation axis L of the pressure receiving member 43 is adjusted.
Of the pressure receiving member 43 and the rotation axis L of the pressure receiving member 43.
The polishing pressures at the inner position and the outer position are individually adjustable.

Since this embodiment has the above configuration,
A thin plate member W as a stamper to be polished is artificially or automatically placed and fixed on the rotating disk 1, and the rotating disk 1 is rotated about the rotation center O by the rotating mechanism 2. Are arranged by the roughing movement mechanism 7a of the movement mechanism 7 such that the transport direction S of the polishing tape T is in the rotational tangential direction _RT of the thin plate member W as shown in FIGS.
The vertical movement mechanism 8 polishing unit K consisting of the abrasive tape T which is continuously or intermittently transferred by moving the abrasive tape T is lowered the tape transport mechanism 6 in the rotational direction normal R _N of the thin plate member W is a stamper The surface of the thin plate member W is pressed against the surface of the thin plate member W as the back surface, and the surface of the thin plate member W is polished by the interaction of the transfer S of the polishing tape T and the rotation R of the turntable 1, and the polishing pressure is received by the pressure receiving member 43. will be, when the transfer direction S of the abrasive tape T is rotated tangentially R _T rough polishing for moving the placed in polishing tape T in the rotation normal direction R _N of the thin plate member W on completion of the thin plate member W The tape transfer mechanism 6 is moved up by the vertical movement mechanism 8 and moved backward by the roughing movement mechanism 7a of the movement mechanism 7, and then, as shown in FIG. 11, the transfer direction of the polishing tape T by the finishing movement mechanism 7b. Rotation normal direction R _N and arranged such that, the thin plate member W to the polishing tape T is lowered the tape transport mechanism 6 by vertically moving mechanism 8 but the thin plate member W
Rotating polishing unit K consisting of the polishing tape T by moving in the normal direction R _N is pressed against the surface of the thin plate member W as the rear surface of the stamper, the transfer S and rotation of the rotating disk 1 R abrasive tape T The surface of the thin plate member W is polished by the interaction, and the transport direction S of the polishing tape T is
Rotational direction normal disposed R _N and finish moving the abrasive tape T in the rotation normal direction R _N of the thin plate member W polishing is performed by the completion of the polishing, the tape transport mechanism 6
Is raised by the vertical movement mechanism 8 and retreated by the finishing movement mechanism 7b, whereby the surface of the thin plate member W is rotated in the rotation direction of the thin plate member W and the transfer direction S of the polishing tape T.
Rough polishing and finish polishing are performed in different directions.

[0016] Therefore, rough grinding and the polishing tape T is moved in the rotation normal R _N direction of the thin plate member W by the transfer direction S of the polishing tape T placed in the rotation tangential direction R _T of the thin plate member W and, then, moved to polished finish in the rotation normal direction R _N of the rotary normal R _N arranged in a direction abrasive tape T a thin plate member W in the transfer direction S of the polishing tape T thin plate member W That is, it is possible to perform rough polishing and finish polishing on the surface of the thin plate member W in which the rotation direction of the thin plate member W and the relative direction of the transport direction S of the polishing tape T are different, and the smooth polishing is performed accordingly. A surface can be obtained, and good polishing can be performed.

Further, in this case, since there is provided a vibration mechanism 27 for oscillating the polishing tape T in a vibration direction M perpendicular to the tape transport direction S, the vibration of the polishing tape T is controlled. The polishing process can be performed more favorably by the motion, and the oscillating motion of the polishing tape T may cause a circumferential wave shape to be exposed on the surface of the thin plate member W during the rough polishing. The wave shape is removed by polishing,
A good polished surface can be obtained by the above-mentioned finish polishing even if a rocking motion is applied, and in this case, the relationship is set so that the rotation speed of the thin plate member becomes faster than the rocking speed of the polishing tape during the rough polishing. At the same time, during the finish polishing, the oscillation speed of the polishing tape is set to be faster than the rotation speed of the thin plate member. That is, the rotation speed V of the thin plate member W and the oscillation speed of the polishing tape T during the rough polishing are set. The relationship with the speed F is V>
F, and conversely, a better polished surface can be obtained by setting the relationship between the rotation speed V and the oscillation speed F of the thin plate member W to V <F during the finish polishing.

In this case, the rotation axis L of the pressure receiving member 43 is provided so as to be tiltable by the polishing pressure adjusting mechanism 48, and the polishing pressure at the inner position and the outer position of the rotation axis L of the pressure receiving member 43 is also set. Is provided so as to be adjustable. When the polishing portion K made of the polishing tape T is pressed against the surface of the thin plate-like member W while the turntable 1 is rotated to perform the polishing, the radius of the thin plate-like member W is adjusted. The difference in the polishing condition at the radially inner and outer positions due to the difference in the peripheral speed in the direction can be followed, and a uniform polished surface can be obtained over the entire surface at the radially inner and outer positions. be able to.

In this case, the polishing pressure adjusting mechanism 48 is used.
Are pressure controllable pressure control cylinders 53 for holding the inner position of the rotation axis L of the pressure receiving member 43 and pressure controllable pressure control cylinders 54 for holding the outer position of the rotation axis L of the pressure receiving member 43. , The structure can be simplified and, for example, by adjusting the internal pressure of the pressure-pressure control cylinders 53 and 54 by manual or automatic operation of the pressure control valve, the inner side of the rotation axis L of the pressure-receiving member 43 is adjusted. The polishing pressure at the position and the outer position can be easily adjusted.

The present invention is not limited to the above-described embodiment, but may be, for example, a wet type in which a polishing liquid is sprayed at the time of polishing, or a dry type in which a polishing liquid is not used. In addition, a structure in which not only the pressure receiving member but also the tape transfer mechanism is oscillated as the oscillating mechanism is employed, and the structures of the moving mechanism 7, the vertical moving mechanism 8, the tape transferring mechanism 6, the oscillating mechanism 27, and the like are appropriately changed. It is designed to be.

[0021]

As described above, according to the present invention, the polishing tape is transported in the rotation tangential direction of the thin plate member and the polishing tape is rotated by the rotation of the thin plate member. Finish polishing by moving the polishing tape in the normal direction of the thin plate and moving the polishing tape in the normal direction of the thin plate. That is, it is possible to perform rough polishing and finish polishing on the surface of the thin plate member in which the relative direction between the rotation direction of the thin plate member and the transport direction of the polishing tape is different, and obtain a smoother polishing surface accordingly. And good polishing can be performed.

According to the second or fifth aspect of the present invention, there is provided a rocking mechanism for rocking the polishing tape in a rocking direction perpendicular to the tape transport direction. The polishing process can be performed more favorably by the oscillation motion of the polishing tape, and the oscillation motion of the polishing tape may cause a circumferential wave shape to be exposed on the surface of the thin plate member during the rough polishing. However, a wave shape is removed by the finish polishing, and a good polished surface can be obtained by the finish polishing even if a swinging motion is applied. In the invention according to claim 3 or 6, At the time of rough polishing, the rotation speed of the thin plate member is set to be faster than the oscillation speed of the polishing tape, and conversely, at the time of finish polishing, the oscillation speed of the polishing tape is set to be faster than the rotation speed of the thin plate member. Better It is possible to obtain a polishing surface.

According to the present invention, the rotation axis of the pressure receiving member is provided so as to be tiltable by the polishing pressure adjusting mechanism, and the inner and outer positions of the rotation axis of the pressure receiving member. Since the polishing pressure is provided so as to be adjustable, the polishing portion made of a polishing tape is pressed against the surface of the thin plate-like member while the rotating disk is rotated, and the polishing process is performed in the radial direction of the thin plate member. It is possible to follow the difference in the polishing state at the radially inner and outer positions due to the difference in the peripheral speed, thereby obtaining a uniform polished surface over the entire surface at the radially inner and outer positions. Further, in the invention according to claim 8, the polishing pressure adjusting mechanism includes a pressure controllable pressure control cylinder that holds an inner position of the rotation axis of the pressure receiving member, and a rotation axis of the pressure receiving member. Pressure control to keep outside position The pressure control cylinders, the structure can be simplified and the internal pressure of each pressure / pressure control cylinder can be adjusted by manual or automatic operation of the pressure control valve. The polishing pressure at the outer position and the outer position can be easily adjusted.

As described above, the intended purpose can be sufficiently achieved.

[Brief description of the drawings]

FIG. 1 is an overall side sectional view of an embodiment of the present invention.

FIG. 2 is an overall plan view of an embodiment of the present invention.

FIG. 3 is a front view of the tape transport mechanism according to the embodiment of the present invention.

FIG. 4 is a partially enlarged side sectional view of the embodiment of the present invention.

FIG. 5 is a partially enlarged side sectional view of the embodiment of the present invention.

FIG. 6 is a partially enlarged plan view of the embodiment of the present invention.

FIG. 7 is a partially enlarged front view of the embodiment of the present invention.

FIG. 8 is a partially enlarged plan sectional view of the embodiment of the present invention.

FIG. 9 is an explanatory perspective view of a rough polishing state according to the embodiment of the present invention.

FIG. 10 is an explanatory plan view of a rough polishing state according to the embodiment of the present invention.

FIG. 11 is an explanatory plan view of a finish polishing state according to the embodiment of the present invention.

[Explanation of symbols]

W Thin plate member T Polishing tape K Polishing section L Rotation axis S Tape transport direction R Rotation direction R _T Rotation tangential direction R _N Rotation normal direction M Shaking direction 1 Rotary disk 2 Rotary mechanism 6 Tape transport mechanism 7 Moving mechanism 7a Rough Processing moving mechanism 7b Finishing processing moving mechanism 8 Vertical movement mechanism 27 Oscillating mechanism 43 Pressure receiving member 48 Polishing pressure adjusting mechanism 53 Pressure control cylinder 54 Pressure control cylinder

Claims (8)

[Claims] When the polishing process is performed by a polishing section formed by rotating a thin plate member to guide a polishing tape in a folded manner, the transport direction of the polishing tape is arranged in a rotational tangential direction of the thin plate member. The polishing tape is moved in the rotation normal direction of the thin plate member to perform rough polishing, and then the polishing tape is transferred in the rotation normal direction of the thin plate member, and the polishing tape is placed in the thin plate shape. A method of polishing a thin plate-like member, wherein the polishing is performed by moving the member in the direction of the rotation normal line. 2. The method of polishing a thin plate member according to claim 1, wherein the polishing tape is caused to oscillate in a direction perpendicular to the tape transport direction. 3. The rotation speed of the thin plate member is set to be higher than the oscillation speed of the polishing tape during the rough polishing, and the oscillation speed of the polishing tape is set lower than the rotation speed of the thin plate member during the finish polishing. 3. The method according to claim 2, wherein the relationship is set to be faster. 4. A rotating plate on which a thin plate-like member can be placed, a rotating mechanism for rotating the rotating plate, a polishing tape continuously transferred above the rotating plate, and the polishing tape is folded back by a pressure receiving member. A tape transport mechanism having a polishing section formed by the above, a moving mechanism for moving the tape transport mechanism, and a vertical movement mechanism for vertically moving the tape transport mechanism, wherein the moving mechanism transports the polishing tape. A roughing moving mechanism for moving the polishing tape in the rotation normal direction of the thin plate member by disposing the polishing tape in the rotation tangent direction of the thin plate member, and changing the transfer direction of the polishing tape to the normal rotation direction of the thin plate member A finishing processing moving mechanism for moving the polishing tape in a direction normal to the rotation of the thin plate member by disposing the polishing tape in the direction of the thin plate member. 5. The apparatus for polishing a thin plate member according to claim 4, further comprising a swinging mechanism for swinging the polishing tape in a direction orthogonal to the tape transport direction. 6. The rotation speed of the thin plate member is set to be higher than the oscillation speed of the polishing tape during the roughing, and the oscillation speed of the polishing tape is set to be smaller than the rotation speed of the thin plate member during the finishing operation. 6. The apparatus for polishing a thin plate member according to claim 5, wherein the relationship is set to be faster. 7. A polishing pressure adjusting mechanism which allows a tilting operation of the rotation axis of the pressure receiving member and adjusts a polishing pressure at an inner position and an outer position of the rotation axis of the pressure receiving member. The thin plate-like member polishing apparatus according to any one of claims 4 to 6. 8. A pressure control cylinder for controlling the pressure, which holds an inner position of a rotation axis of the pressure receiving member, and a pressure controllable for holding an outer position of a rotation axis of the pressure receiving roll, the polishing pressure adjusting mechanism. 8. The thin plate-like member polishing apparatus according to claim 7, comprising a pressure control cylinder.