JP2001068888A - Electromagnetic wave absorbing body - Google Patents
Electromagnetic wave absorbing bodyInfo
- Publication number
- JP2001068888A JP2001068888A JP23919499A JP23919499A JP2001068888A JP 2001068888 A JP2001068888 A JP 2001068888A JP 23919499 A JP23919499 A JP 23919499A JP 23919499 A JP23919499 A JP 23919499A JP 2001068888 A JP2001068888 A JP 2001068888A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- wave absorbing
- absorbing body
- heating
- organic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電磁波吸収体に関す
る。より詳しくは、電子部品などから放射する電磁波を
吸収するための電磁波吸収材料と有機結合材を混練して
形成した電磁波吸収体に関するものである。[0001] The present invention relates to an electromagnetic wave absorber. More specifically, the present invention relates to an electromagnetic wave absorber formed by kneading an electromagnetic wave absorbing material for absorbing electromagnetic waves radiated from electronic components and an organic binder.
【０００２】[0002]
【従来の技術】電子機器あるいは通信装置等において、
電子部品から放射する電磁波による周囲の半導体装置等
への悪影響を防止するために、磁性体粒子からなる電磁
波吸収材料と有機結合材を混練した電磁波吸収体が用い
られている。2. Description of the Related Art In electronic devices or communication devices,
In order to prevent adverse effects on surrounding semiconductor devices and the like due to electromagnetic waves radiated from electronic components, an electromagnetic wave absorber obtained by kneading an electromagnetic wave absorbing material composed of magnetic particles and an organic binder is used.
【０００３】図２は従来の電磁波吸収体の使用状態を示
す概略図である。図示したように、基板３１上に銅パタ
ーン３２が形成され、この銅パターン３２にリード端子
３３を介してＩＣチップ３４が接合されている。このよ
うにして形成された半導体装置から放射する電磁波によ
る電磁干渉を抑制するために、ＩＣチップ３４上に、両
面テープ３５を介してシート状の電磁波吸収体（吸収シ
ート）３６を貼着していた。FIG. 2 is a schematic diagram showing a state of use of a conventional electromagnetic wave absorber. As illustrated, a copper pattern 32 is formed on a substrate 31, and an IC chip 34 is joined to the copper pattern 32 via a lead terminal 33. In order to suppress electromagnetic interference due to electromagnetic waves radiated from the semiconductor device formed in this way, a sheet-like electromagnetic wave absorber (absorbing sheet) 36 is adhered to the IC chip 34 via a double-sided tape 35. Was.
【０００４】このシート状電磁波吸収体３６は、電磁波
吸収材料としてフェライト系や金属系のものを用い、フ
ェライト系には例えば、Ｎｉ−Ｚｎ系、Ｍｎ−Ｚｎ系の
フェライト材料があり、金属系には例えば、ケイ素鋼
（Ｆｅ−Ｓｉ）、センダスト（Ｆｅ−Ａｌ−Ｓｉ）、パ
ーマロイ（Ｆｅ−Ｎｉ）などの合金材料がある。これら
をそれぞれ１００μｍ以下の粒子の球状や扁平状のもの
をゴム、シリコン又は塩化ビニル等の有機結合材と混合
し、シート状にしたものを使用する。The sheet-like electromagnetic wave absorber 36 uses a ferrite-based or metal-based electromagnetic wave-absorbing material. Examples of the ferrite-based material include Ni-Zn-based and Mn-Zn-based ferrite materials. For example, there are alloy materials such as silicon steel (Fe-Si), sendust (Fe-Al-Si), and permalloy (Fe-Ni). These are used by mixing spherical or flat particles each having a particle size of 100 μm or less with an organic binder such as rubber, silicon or vinyl chloride to form a sheet.
【０００５】このように、一定の厚さや形状に安定して
保持されるシート状の電磁波吸収体を用いることによ
り、これを使用すべき場所の形状や大きさに合わせて適
宜切断して貼布することができ、ムラなく安定した吸収
特性が得られるとともに取扱い性や取付け作業性が良好
なものとなる。[0005] As described above, by using the sheet-like electromagnetic wave absorber stably held at a constant thickness and shape, the sheet-shaped electromagnetic wave absorber is appropriately cut in accordance with the shape and size of the place where it is to be used, and Thus, stable absorption characteristics can be obtained without unevenness, and handling and mounting workability can be improved.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の電磁波吸収体では、半導体装置からの電磁波による
放射ノイズを完全に吸収することはできなかった。これ
は、放射ノイズはリード端子からも放射されるため、従
来のようにＩＣチップの上面に吸収シートを被せただけ
では、リード端子と吸収シートとの間に隙間が形成さ
れ、そこから電磁波が漏れて放射されるためである。However, the above-mentioned conventional electromagnetic wave absorber cannot completely absorb the radiation noise due to the electromagnetic wave from the semiconductor device. This is because radiation noise is also radiated from the lead terminals. Therefore, if the absorption sheet is simply placed on the upper surface of the IC chip as in the past, a gap is formed between the lead terminals and the absorption sheet, from which electromagnetic waves are emitted. This is due to leakage and radiation.
【０００７】一方、磁性粉を流動性のある有機結合材と
混合してペースト状混合体を形成し、これをリード端子
等を含め電子部品全体を覆って塗布するペースト状電磁
波吸収体が従来用いられている。On the other hand, a paste-like electromagnetic wave absorber in which a magnetic powder is mixed with a flowable organic binder to form a paste-like mixture, which is applied to cover the entire electronic component including lead terminals and the like is conventionally used. Have been.
【０００８】しかしながら、このようなペースト状電磁
波吸収体は、流動性のため一定の厚さや形状に保たれ
ず、塗布ムラが生じたり、凸部や隅部での塗布不良が生
じやすく、安定した吸収特性が得られず、また形状が一
定でないため取扱い性も不便である。[0008] However, such a paste-like electromagnetic wave absorber is not maintained in a constant thickness or shape due to its fluidity, and tends to cause coating unevenness and poor coating at convex portions and corners. Absorption characteristics are not obtained, and handling is inconvenient because the shape is not constant.
【０００９】本発明は、上記従来技術を考慮したもので
あって、取扱い性が良好でかつ電子部品から放射される
電磁波を漏れなく充分に吸収する電磁波吸収体の提供を
目的とする。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned prior art, and has as its object to provide an electromagnetic wave absorber having good handleability and capable of sufficiently absorbing electromagnetic waves radiated from electronic components without leakage.
【００１０】[0010]
【課題を解決するための手段】前記目的を達成するた
め、本発明では、磁性体粒子からなる電磁波吸収材料
と、前記電磁波吸収材料と有機結合材を混練して形成さ
れた混合体からなる電磁波吸収体において、前記有機結
合材は加熱により軟化しさらに硬化可能な半硬化状態に
形成されたことを特徴とする電磁波吸収体を提供する。In order to achieve the above object, the present invention provides an electromagnetic wave absorbing material comprising magnetic particles and an electromagnetic wave comprising a mixture formed by kneading the electromagnetic wave absorbing material and an organic binder. In the absorber, the organic binder is softened by heating and formed in a semi-cured state that can be further cured.
【００１１】この構成によれば、有機結合材として、加
熱により容易に軟化し、さらに加熱して硬化重合し、形
状や性質が安定する半硬化状態の例えばＢステージエポ
キシ系樹脂を用いる。使用時には、このような半硬化状
態の電磁波吸収体を電子部品などの上に載せ、これを加
熱して軟化させることによって電磁波を放射する部位
を、その形状の複雑さに関係なく覆うことができる。さ
らにこれを加熱、硬化させることによってその形状を保
つことができるので、電子部品から放射される電磁波を
漏れなく充分に吸収することができる。According to this structure, a semi-cured state resin, such as a B-stage epoxy resin, which is easily softened by heating, is cured by heating, is polymerized, and has stable shape and properties, is used as the organic binder. At the time of use, such a semi-cured electromagnetic wave absorber can be placed on an electronic component or the like, and heated and softened to cover a portion that emits electromagnetic waves regardless of the complexity of its shape. . Further, since the shape can be maintained by heating and curing it, the electromagnetic wave radiated from the electronic component can be sufficiently absorbed without leakage.
【００１２】好ましい構成例においては、前記混合体を
シート状に形成したことを特徴としている。[0012] In a preferred configuration example, the mixture is formed in a sheet shape.
【００１３】この構成によれば、混合体である半硬化状
態の電磁波吸収体はシート状の一定の形状を保つことが
できるので、ペースト状のように塗布したときに流れ落
ちたり、塗布ムラや塗布不良を生ずることはなく、ムラ
なく安定した吸収特性が得られ取扱い性も良好なものと
なる。According to this structure, the semi-cured electromagnetic wave absorber in the form of a mixture can maintain a constant sheet-like shape. There is no failure, stable absorption characteristics are obtained without unevenness, and the handleability is also good.
【００１４】[0014]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図１は本発明に係る電磁波
吸収体の使用方法を順番に示す概略図である。（Ａ）に
示すように、基板１上に銅パターン２が形成され、この
銅パターン２にリード端子３を介してＩＣチップ４が接
合されている。このようにして形成された半導体装置か
ら放射する電磁波による電磁干渉を抑制するための、シ
ート状の厚さ０．５〜１ｍｍの電磁波吸収体５を用意す
る。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view sequentially showing a method of using the electromagnetic wave absorber according to the present invention. As shown in FIG. 1A, a copper pattern 2 is formed on a substrate 1, and an IC chip 4 is bonded to the copper pattern 2 via a lead terminal 3. A sheet-shaped electromagnetic wave absorber 5 having a thickness of 0.5 to 1 mm is prepared for suppressing electromagnetic interference caused by electromagnetic waves radiated from the semiconductor device formed as described above.
【００１５】このシート状電磁波吸収体５は、電磁波吸
収材料としてフェライト系や金属系のものを用い、フェ
ライト系には例えば、Ｎｉ−Ｚｎ系、Ｍｎ−Ｚｎ系のフ
ェライト材料があり、金属系には例えば、ケイ素鋼（Ｆ
ｅ−Ｓｉ）、センダスト（Ｆｅ−Ａｌ−Ｓｉ）、パーマ
ロイ（Ｆｅ−Ｎｉ）などの合金材料がある。これらをそ
れぞれ１００μｍ以下の粒子の球状や扁平状のものを樹
脂（樹脂２０％以下）等の有機結合材と混合し、シート
状にしたものを使用する。The sheet-shaped electromagnetic wave absorber 5 uses a ferrite-based or metal-based electromagnetic wave-absorbing material. Examples of the ferrite-based material include Ni-Zn-based and Mn-Zn-based ferrite materials. Is, for example, silicon steel (F
e-Si), sendust (Fe-Al-Si), and permalloy (Fe-Ni). Each of these is mixed with an organic binder such as a resin (resin 20% or less) by mixing spherical or flat particles each having a particle diameter of 100 μm or less, and used as a sheet.
【００１６】この有機結合材には、Ｂステージエポキシ
系樹脂等からなり、加熱により軟化しさらに加熱するこ
とによって硬化する半硬化状態のものを用いる。As the organic binder, a semi-cured material made of a B-stage epoxy resin or the like, which is softened by heating and cured by heating is used.
【００１７】次に（Ｂ）に示すように、電磁波吸収体５
をＩＣチップ４に載置した後、加熱（８０〜１００℃）
する。この加熱により電磁波吸収体５の軟化が開始する
ので、電磁波吸収体５の端部を下方（矢印方向）に押圧
する。Next, as shown in FIG.
Is placed on the IC chip 4 and then heated (80 to 100 ° C.)
I do. The softening of the electromagnetic wave absorber 5 starts due to this heating, so that the end of the electromagnetic wave absorber 5 is pressed downward (in the direction of the arrow).
【００１８】続いて（Ｃ）に示すように、軟化した電磁
波吸収体５がＩＣチップ４、リード端子３などの電磁波
を放射する電子部品を覆った後、１５０℃に加熱してキ
ュア（硬化）させる。この加熱を２時間ほど行うことに
より、電磁波吸収体５は硬化重合し、形状や性質が安定
し電子部品を完全に覆う。Subsequently, as shown in FIG. 2C, after the softened electromagnetic wave absorber 5 covers the electronic components that emit electromagnetic waves, such as the IC chip 4 and the lead terminal 3, it is heated to 150 ° C. to cure (harden). Let it. By performing this heating for about 2 hours, the electromagnetic wave absorber 5 is cured and polymerized, and the shape and properties are stabilized, and the electronic component is completely covered.
【００１９】これにより取扱い性のよいシート状の電磁
波吸収体を用いて、ペースト状のように流れ落ちること
なく、安定した厚さを保って充分に電子部品を覆うこと
ができる。なお、本発明はリード端子を有するＩＣ部品
に限らず、各種電子部品や通信装置などに対し適用可能
であり、適用対象物をその形状に合わせて簡単に確実に
電磁的に覆うことができる。By using the sheet-like electromagnetic wave absorber having good handleability, the electronic component can be sufficiently covered while maintaining a stable thickness without flowing down like a paste. The present invention is not limited to an IC component having a lead terminal, but can be applied to various electronic components, communication devices, and the like, and can easily and reliably electromagnetically cover an object to be applied according to its shape.
【００２０】[0020]
【発明の効果】以上説明したように、本発明において
は、有機結合材として、加熱により容易に軟化し、さら
に加熱して硬化重合し、形状や性質が安定する半硬化状
態の例えばＢステージエポキシ系樹脂を用いるので、こ
れにより形成されたシート状電磁波吸収体を対象物の上
に載せて軟化させることによって電磁波を放射する部位
をその形状の複雑さに関係なく覆うことができ、さらに
硬化させることによってその形状を保つことができるの
で、電子部品から放射される電磁波を漏らすことなく充
分に吸収することができる。As described above, according to the present invention, as an organic binder, for example, a B-stage epoxy in a semi-cured state in which the material is easily softened by heating, further cured by heating, and is stable in shape and properties. Since the base resin is used, the sheet-shaped electromagnetic wave absorber formed thereby is placed on the object and softened, so that the electromagnetic wave radiating portion can be covered regardless of the complexity of the shape, and further cured. As a result, the shape can be maintained, so that the electromagnetic wave radiated from the electronic component can be sufficiently absorbed without leaking.
【図１】 本発明に係る電磁波吸収体の使用方法を順番
に示す概略図。FIG. 1 is a schematic view showing in order a method of using an electromagnetic wave absorber according to the present invention.
【図２】 従来の電磁波吸収体の使用状態を示す概略
図。FIG. 2 is a schematic view showing a state of use of a conventional electromagnetic wave absorber.
１：基板、２：銅パターン、３：リード端子、４：ＩＣ
チップ、５：電磁波吸収体1: substrate, 2: copper pattern, 3: lead terminal, 4: IC
Chip 5, electromagnetic wave absorber
Claims (2)
混合体からなる電磁波吸収体において、 前記有機結合材は加熱により軟化しさらに硬化可能な半
硬化状態に形成されたことを特徴とする電磁波吸収体。1. An electromagnetic wave absorbing material comprising an electromagnetic wave absorbing material composed of magnetic particles, and a mixture formed by kneading the electromagnetic wave absorbing material and an organic binder, wherein the organic binder is softened by heating and further cured. An electromagnetic wave absorber formed in a possible semi-cured state.
徴とする請求項１に記載の電磁波吸収体。2. The electromagnetic wave absorber according to claim 1, wherein said mixture is formed in a sheet shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919499A JP2001068888A (en) | 1999-08-26 | 1999-08-26 | Electromagnetic wave absorbing body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919499A JP2001068888A (en) | 1999-08-26 | 1999-08-26 | Electromagnetic wave absorbing body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001068888A true JP2001068888A (en) | 2001-03-16 |
Family
ID=17041131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23919499A Pending JP2001068888A (en) | 1999-08-26 | 1999-08-26 | Electromagnetic wave absorbing body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001068888A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001250873A (en) * | 2000-01-24 | 2001-09-14 | Infineon Technologies Ag | Protection device and electric constituent element with device |
| JP2003273571A (en) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | High-frequency module for shielding inter-element radio wave interference |
| KR100814278B1 (en) | 2006-09-14 | 2008-03-18 | 한국기계연구원 | Using for b-stage cured resin films electromagnetic waves absorbent material and method for manufacturing the same |
| US11444397B2 (en) | 2015-07-07 | 2022-09-13 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
| US11469554B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
| US11522310B2 (en) | 2012-08-22 | 2022-12-06 | Amphenol Corporation | High-frequency electrical connector |
| US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
| US11715914B2 (en) | 2014-01-22 | 2023-08-01 | Amphenol Corporation | High speed, high density electrical connector with shielded signal paths |
| US11757224B2 (en) | 2010-05-07 | 2023-09-12 | Amphenol Corporation | High performance cable connector |
| US11757215B2 (en) | 2018-09-26 | 2023-09-12 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed electrical connector and printed circuit board thereof |
| US11799246B2 (en) | 2020-01-27 | 2023-10-24 | Fci Usa Llc | High speed connector |
| US11817655B2 (en) | 2020-09-25 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, high speed electrical connector |
| US11942716B2 (en) | 2020-09-22 | 2024-03-26 | Amphenol Commercial Products (Chengdu) Co., Ltd. | High speed electrical connector |
-
1999
- 1999-08-26 JP JP23919499A patent/JP2001068888A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001250873A (en) * | 2000-01-24 | 2001-09-14 | Infineon Technologies Ag | Protection device and electric constituent element with device |
| JP2003273571A (en) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | High-frequency module for shielding inter-element radio wave interference |
| KR100814278B1 (en) | 2006-09-14 | 2008-03-18 | 한국기계연구원 | Using for b-stage cured resin films electromagnetic waves absorbent material and method for manufacturing the same |
| US11757224B2 (en) | 2010-05-07 | 2023-09-12 | Amphenol Corporation | High performance cable connector |
| US11901663B2 (en) | 2012-08-22 | 2024-02-13 | Amphenol Corporation | High-frequency electrical connector |
| US11522310B2 (en) | 2012-08-22 | 2022-12-06 | Amphenol Corporation | High-frequency electrical connector |
| US11715914B2 (en) | 2014-01-22 | 2023-08-01 | Amphenol Corporation | High speed, high density electrical connector with shielded signal paths |
| US11444397B2 (en) | 2015-07-07 | 2022-09-13 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
| US11955742B2 (en) | 2015-07-07 | 2024-04-09 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
| US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
| US11757215B2 (en) | 2018-09-26 | 2023-09-12 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed electrical connector and printed circuit board thereof |
| US11469554B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
| US11817657B2 (en) | 2020-01-27 | 2023-11-14 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
| US11799246B2 (en) | 2020-01-27 | 2023-10-24 | Fci Usa Llc | High speed connector |
| US11469553B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed connector |
| US11942716B2 (en) | 2020-09-22 | 2024-03-26 | Amphenol Commercial Products (Chengdu) Co., Ltd. | High speed electrical connector |
| US11817655B2 (en) | 2020-09-25 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, high speed electrical connector |
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