JP2001060626A5 - - Google Patents

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Publication number
JP2001060626A5
JP2001060626A5 JP2000167839A JP2000167839A JP2001060626A5 JP 2001060626 A5 JP2001060626 A5 JP 2001060626A5 JP 2000167839 A JP2000167839 A JP 2000167839A JP 2000167839 A JP2000167839 A JP 2000167839A JP 2001060626 A5 JP2001060626 A5 JP 2001060626A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000167839A
Other versions
JP4491113B2 (ja
JP2001060626A (ja
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Publication date
Application filed filed Critical
Priority to JP2000167839A priority Critical patent/JP4491113B2/ja
Priority claimed from JP2000167839A external-priority patent/JP4491113B2/ja
Priority to US09/592,244 priority patent/US6550049B1/en
Publication of JP2001060626A publication Critical patent/JP2001060626A/ja
Publication of JP2001060626A5 publication Critical patent/JP2001060626A5/ja
Application granted granted Critical
Publication of JP4491113B2 publication Critical patent/JP4491113B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000167839A 1999-06-14 2000-06-05 半導体集積回路の設計方法 Expired - Fee Related JP4491113B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000167839A JP4491113B2 (ja) 1999-06-14 2000-06-05 半導体集積回路の設計方法
US09/592,244 US6550049B1 (en) 1999-06-14 2000-06-13 Semiconductor integrated circuit and method of designing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-166937 1999-06-14
JP16693799 1999-06-14
JP2000167839A JP4491113B2 (ja) 1999-06-14 2000-06-05 半導体集積回路の設計方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006260202A Division JP4544230B2 (ja) 1999-06-14 2006-09-26 半導体集積回路

Publications (3)

Publication Number Publication Date
JP2001060626A JP2001060626A (ja) 2001-03-06
JP2001060626A5 true JP2001060626A5 (ja) 2006-11-09
JP4491113B2 JP4491113B2 (ja) 2010-06-30

Family

ID=26491131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000167839A Expired - Fee Related JP4491113B2 (ja) 1999-06-14 2000-06-05 半導体集積回路の設計方法

Country Status (2)

Country Link
US (1) US6550049B1 (ja)
JP (1) JP4491113B2 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6958545B2 (en) * 2004-01-12 2005-10-25 International Business Machines Corporation Method for reducing wiring congestion in a VLSI chip design
US7412900B2 (en) * 2005-09-30 2008-08-19 Rockwell Automation Technologies, Inc. Sensor mounting structure with adjustable swivel ball and panel mounting mechanism
JP2008091722A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体集積回路
JP4353257B2 (ja) 2007-02-20 2009-10-28 セイコーエプソン株式会社 集積回路装置及び電子機器
US8195995B2 (en) * 2008-07-02 2012-06-05 Infineon Technologies Ag Integrated circuit and method of protecting a circuit part of an integrated circuit
KR102403735B1 (ko) 2017-09-07 2022-05-30 삼성전자주식회사 비대칭적인 엔딩 셀들을 포함하는 집적 회로 및 시스템 온 칩

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4815003A (en) * 1987-06-19 1989-03-21 General Electric Company Structured design method for high density standard cell and macrocell layout of VLSI chips
US5822214A (en) * 1994-11-02 1998-10-13 Lsi Logic Corporation CAD for hexagonal architecture
US5623420A (en) * 1994-11-16 1997-04-22 Sun Microsystems, Inc. Method and apparatus to distribute spare cells within a standard cell region of an integrated circuit
US6175952B1 (en) * 1997-05-27 2001-01-16 Altera Corporation Technique of fabricating integrated circuits having interfaces compatible with different operating voltage conditions
US6000829A (en) * 1996-09-11 1999-12-14 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit capable of compensating for flucuations in power supply voltage level and method of manufacturing the same
JPH10284690A (ja) * 1997-04-07 1998-10-23 Toshiba Corp 半導体集積回路装置及びその電源配線方法
US6336207B2 (en) * 1997-05-27 2002-01-01 Matsushita Electric Industrial Co., Ltd. Method and apparatus for designing LSI layout, cell library for designing LSI layout and semiconductor integrated circuit
US6114903A (en) * 1998-01-14 2000-09-05 Lsi Logic Corporation Layout architecture for core I/O buffer
US6308307B1 (en) * 1998-01-29 2001-10-23 Texas Instruments Incorporated Method for power routing and distribution in an integrated circuit with multiple interconnect layers
US6083271A (en) * 1998-05-05 2000-07-04 Lsi Logic Corporation Method and apparatus for specifying multiple power domains in electronic circuit designs
JP3971033B2 (ja) * 1998-07-28 2007-09-05 富士通株式会社 レイアウトデータ作成方法、レイアウトデータ作成装置、及び、記録媒体
US6260184B1 (en) * 1998-10-20 2001-07-10 International Business Machines Corporation Design of an integrated circuit by selectively reducing or maintaining power lines of the device
US6202191B1 (en) * 1999-06-15 2001-03-13 International Business Machines Corporation Electromigration resistant power distribution network

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