JP2001060566A - Method and apparatus for cutting semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting a semiconductor package, without having to increase the number of steps or needing masks. SOLUTION: For cutting a substrate 2 which has a plurality of mounted semiconductor chips 4 into a plurality of individual semiconductor chips 4, a camera 7 and a recognition circuit 8 recognize the cutting pattern of the substrate 2, an arithmetic circuit 9 specifies cutting positions using the recognition result by the recognizer circuit 8, a control circuit 10 and a drive circuit 11 are driven according to the computed result, and a nozzle 15 and a stage 6 are relatively moved, while feeding a blasting material from a discharging part 12 to the nozzle 15, thereby jetting cutting grains 16 against the substrate 2 from the nozzle 15 to cut the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a BGA (Ball Gr
The present invention relates to a method and an apparatus for cutting a semiconductor package such as an id array package, and more particularly to a method for cutting a plurality of semiconductor packages mounted on one substrate by blasting into individual semiconductor packages. Related to the device.

[0002]

2. Description of the Related Art When a semiconductor device having a plurality of semiconductor chips mounted on a single substrate is individually cut for each chip,
Conventionally, a cutting device that cuts while rotating a disk-shaped dicing saw (or dicing blade) has been generally used. In the cutting using a dicing saw, a UV sheet larger than the substrate is attached to the back surface of the substrate on which the semiconductor chip is mounted, and the substrate with the UV sheet attached is positioned on a stage. Next, the dicing saw cuts only the substrate in the X direction along the cutting position, and does not cut the UV sheet. In this way, the cutting in the X direction is sequentially executed for other cutting positions in the X direction. After all the cutting in the X direction is completed, the stage is rotated by 90 degrees, and the cutting in the Y direction is similarly performed sequentially. Thereby, the substrate is cut like a grid on a chip-by-chip basis.

As another cutting method, there is a blast method, and a manufacturing method, a cutting method and a cutting apparatus using the blast method are disclosed in Japanese Patent Application Laid-Open Nos. 57-117242 and 10-2.
No. 56450, and the like. In the blast method, a blast material using fine solid particles is blown to a cutting position through a mask having an opening to perform cutting.

[0004]

However, according to the conventional method and apparatus for cutting a semiconductor package, in the case of a cutting apparatus using a dicing saw, it is necessary to attach a UV sheet to the back surface of the substrate. The number of processes increases. On the other hand, a cutting device using a blast method uses a mask having an opening corresponding to a cutting pattern.
A photolithography process including development and etching is required.

Accordingly, it is an object of the present invention to provide a method and an apparatus for cutting a semiconductor package which do not require a mask without increasing the number of steps.

[0006]

In order to achieve the above object, the present invention has, as a first feature, a method in which a single substrate on which a plurality of semiconductor packages are mounted is cut to separate the plurality of semiconductor packages. In the method of cutting a semiconductor package, a nozzle for cutting the one substrate by recognizing a cutting pattern of the one substrate and spraying a blast material for cutting in accordance with the cutting pattern is provided. And a cutting method for cutting the semiconductor package, wherein the cutting blast material is ejected from the nozzle arranged at the predetermined position.

According to this method, a cutting pattern of one substrate on which a plurality of semiconductor packages are mounted is recognized, and a blast material for cutting is sprayed from the nozzle while arranging the nozzle according to the cutting pattern. The substrate is cut into a plurality of semiconductor packages. This allows
There is no increase in the number of steps for cutting the substrate. Also,
Since a dedicated mask is not required for cutting, the running cost can be reduced.

According to a second aspect of the present invention, there is provided a semiconductor package for cutting a single substrate on which a plurality of semiconductor packages are mounted to singulate the plurality of semiconductor packages. A cutting means for recognizing a cutting pattern of the one substrate, and a nozzle for cutting the one substrate by injecting a blast material for cutting in accordance with the cutting pattern to the one substrate. A semiconductor package cutting device, comprising: an arrangement means for disposing the cutting blast material from the nozzle arranged at the predetermined position with respect to the semiconductor package.

According to this configuration, the cutting pattern of one substrate on which a plurality of semiconductor packages are mounted is recognized by the recognition means, and the nozzle is moved to a predetermined position on the substrate by the arranging means in accordance with the recognized cutting pattern. Be placed. From the arranged nozzles, a blast material for cutting is jetted onto the substrate by the jetting means, and the substrate is cut into a plurality of semiconductor packages. Thus, the number of steps for cutting the substrate is not increased. Further, since a dedicated mask is not required for cutting, the running cost can be reduced.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a semiconductor package cutting apparatus according to the present invention. A semiconductor device (BGA package) 1 to be cut includes a substrate 2 provided with a positioning mark (not shown) at a predetermined position, a plurality of semiconductor chips 4 bonded to one surface of the substrate 2 with a resin 3, and a substrate 2. A plurality of solder balls 5 provided at predetermined positions on the other surface of the semiconductor chip 4 and electrically connected to pads of the semiconductor chip 4 through the substrate 2.
It is provided with. The semiconductor device 1 is mounted on an XY stage (or table) 6 at the time of cutting, and is fixed by means (not shown).

The semiconductor package cutting apparatus includes a camera 7, a recognition circuit 8, an arithmetic circuit 9, a control circuit 10, a drive circuit 11, a discharge section 12, a link 13, a pipe 14, and a nozzle 15. The camera 7 is configured by using a CCD or the like as an image sensor, captures an image of the semiconductor device 1 from above, and outputs a video signal thereof. The recognition circuit 8 analyzes a video signal from the camera 7, recognizes the position (or arrangement pattern) of the solder ball 5, a mark on the substrate 2, and the like, and includes a memory 8a for storing the recognition result.
The arithmetic circuit 9 performs the operation on the substrate 2 based on the recognition result of the recognition circuit 8.
Is calculated, and the calculation result is stored in the memory 8a as necessary. The control circuit 10 controls the drive circuit 11 based on the operation result of the operation circuit 9. Drive circuit 11
Is connected to the discharge unit 12 via a link 13, and the nozzle 15 connected to the discharge unit 12 can be arbitrarily moved in the X direction and the Y direction. The discharge unit 12 guides the blast material made of fine particles such as ceramics and glass to the nozzle 15 through the pipe 14 by high-pressure air. Have. The discharge unit 12 includes a high-pressure air pump, a control device thereof, an air tank, a blast tank for storing a blast material, and the like (neither is shown).
Is connected. From the nozzle 15, the blast material is sprayed on the substrate 2 at high speed as processing particles 16.

In the above configuration, when cutting, the semiconductor device 1 to be cut is mounted on the stage 6 with the solder balls 5 facing upward, and the semiconductor device 1 is fixed at a predetermined position. Next, the entire upper surface of the semiconductor device 1 is photographed by the camera 7. The video signal of the camera 7 is taken into the recognition circuit 8 and recognizes the position of the solder ball 5, the mark on the substrate 2 and the like as a specific point. Based on this recognition result, the arithmetic circuit 9 calculates the X and Y directions from the mark on the substrate 2, calculates the cutting line from the positional relationship of the solder balls 5,
The angle between the direction of Y and the cutting line is calculated. Thus, a route for scanning (moving) the nozzle 15 is determined. The control circuit 10 controls the drive circuit 11 according to the information from the arithmetic circuit 9. The drive circuit 11 moves the discharge unit 12 in the X and Y directions under the control of the control circuit 10 so that the nozzle 15 continuously moves along the cutting line. Nozzle 1
After moving to the starting point of cutting, the valve of the discharge unit 12 is opened to discharge the processing particles 16 from the nozzle 15, and at the same time, the movement of the discharge unit 12 is started. Since the processing particles 16 discharged from the nozzle 15 collide with the substrate surface at a high speed,
The surface of the substrate is dug out sequentially by the frictional impact force, and a groove reaching the bottom surface of the substrate 2 is generated. When the nozzle 15 reaches the end point of the cutting, the valve is closed and the cutting is stopped. Thereafter, the nozzle 15 is moved to the cutting start position of the next cutting line. This operation is repeatedly performed until there is no longer any object to be disconnected.

In the above embodiment, cutting is performed by moving the discharge unit 12 and the nozzle 15 in the X and Y directions. However, the discharge unit 12 and the nozzle 15 are fixed, and the stage 6 is fixed to the X and Y directions. It may be configured to move in the Y direction. Alternatively, a configuration in which both the nozzle 15 and the stage 6 are moved may be employed.

Although the recognition circuit 8, the arithmetic circuit 9, and the control circuit 10 are configured as different circuit components, they may be formed into one unit by a microcomputer. Further, the camera 7 may be omitted, and the pattern of the solder balls 5 or the mark of the substrate 2 may be stored in the X memory in advance.

Further, in the above embodiment, the nozzle 15 is fixed via the pipe 14, but the pipe 14 is replaced with a hose having a structure which is flexible and can withstand high-pressure air. With the part 12 fixed,
A configuration in which only the nozzle 15 is moved in the X and Y directions on the semiconductor device may be adopted. And the injection of the processing particles 16
It can be jetted continuously and linearly on the cutting line, or can be jetted in a dotted line.

Although a BGA package is taken as an example of the semiconductor device 1, the present invention is not limited to a BGA, but includes a CSP (Chip Size Package) and an FC (Flip Chip).
, PBGA (Plastic Ball Grid Array), TBGA (T
ape Ball Grid Array).

[0017]

As described above, according to the method and apparatus for cutting a semiconductor package, a cutting pattern of a semiconductor device is recognized, and a blast material for cutting is jetted to a specified cutting position using the recognition result. I decided to
Since the number of steps is not increased and a mask is not used, running costs can be reduced.
Further, automatic disconnection becomes possible. Further, since the change of the cutting position can be easily performed based on the cutting pattern, the versatility is excellent.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a semiconductor package cutting device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Substrate 3 Resin 4 Semiconductor chip 5 Solder ball 6 Stage 7 Camera 8 Recognition circuit 8a Memory 9 Arithmetic circuit 10 Control circuit 11 Drive circuit 12 Discharge part 13 Link 14 Pipe 15 Nozzle 16 Processing particles

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/12 L

Claims (5)

[Claims] 1. A semiconductor package cutting method for cutting a single substrate on which a plurality of semiconductor packages are mounted to singulate the plurality of semiconductor packages, comprising: recognizing a cutting pattern of the one substrate; A nozzle that cuts the one substrate by spraying a blast material for cutting in accordance with a cutting pattern is arranged at a predetermined position with respect to the one substrate, and the nozzle arranged at the predetermined position is A method for cutting a semiconductor package, comprising injecting a cutting blast material. 2. The method according to claim 1, wherein the cutting pattern is recognized by using a solder ball of a plurality of BGA packages as the plurality of semiconductor packages disposed on the one substrate or a mark formed on the one substrate. The nozzle is arranged at the predetermined position by moving the nozzle or moving the XY stage on which the one substrate is placed in the X-axis and Y-axis directions. 2. The method for cutting a semiconductor package according to claim 1, wherein: 3. A recognizing means for recognizing a cutting pattern of a single substrate in an apparatus for cutting a single substrate on which a plurality of semiconductor packages are mounted and cutting the plurality of semiconductor packages into individual pieces. Positioning means for arranging a nozzle for cutting the one substrate by spraying a blast material for cutting in accordance with the cutting pattern at a predetermined position with respect to the one substrate; and arranging the nozzle at the predetermined position. A cutting device for spraying the cutting blast material from the nozzle. 4. The method according to claim 1, wherein the recognizing means includes a plurality of B packages as the plurality of semiconductor packages disposed on the one substrate.
A camera for imaging a solder ball of a GA package or a mark formed on the one substrate; and a recognition circuit for processing an output signal of the camera, wherein the arranging means includes the nozzle or the one substrate. 4. The apparatus for cutting a semiconductor package according to claim 3, further comprising a driving circuit for moving an XY stage on which is mounted. 5. The method according to claim 1, wherein the recognizing means includes a plurality of B packages as the plurality of semiconductor packages disposed on the one substrate.
A memory for storing a pattern of a solder ball of a GA package or a mark formed on the one substrate;
A recognition circuit that reads and recognizes the pattern or the mark from the memory, wherein the arranging unit is a drive circuit that moves the nozzle or an XY stage on which the one substrate is mounted. 4. The semiconductor package cutting device according to claim 3, wherein: