JP2001055487A - Encapsulant for flip chip type semiconductor device and flip chip type semiconductor device - Google Patents

Encapsulant for flip chip type semiconductor device and flip chip type semiconductor device

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Publication number
JP2001055487A
JP2001055487A JP2000165448A JP2000165448A JP2001055487A JP 2001055487 A JP2001055487 A JP 2001055487A JP 2000165448 A JP2000165448 A JP 2000165448A JP 2000165448 A JP2000165448 A JP 2000165448A JP 2001055487 A JP2001055487 A JP 2001055487A
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JP
Japan
Prior art keywords
weight
epoxy resin
group
parts
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000165448A
Other languages
Japanese (ja)
Other versions
JP3707531B2 (en
Inventor
Kazumasa Sumida
和昌 隅田
Kimitaka Kumagai
公孝 熊谷
Miyuki Wakao
幸 若尾
Toshio Shiobara
利夫 塩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
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Filing date
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Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2000165448A priority Critical patent/JP3707531B2/en
Publication of JP2001055487A publication Critical patent/JP2001055487A/en
Application granted granted Critical
Publication of JP3707531B2 publication Critical patent/JP3707531B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909Post-treatment of the layer connector or bonding area
    • H01L2224/83951Forming additional members, e.g. for reinforcing, fillet sealant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01012Magnesium [Mg]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain the subject encapsulant material of high reliability by compounding a liquid epoxy resin, a curing agent, a specific copolymer and specific two kinds of fillers. SOLUTION: The objective encapsulant comprises (A) 100 pts.wt. of a liquid epoxy resin, (B) 0-80 pts.wt. of the curing agent, (C) 1-15 pts.wt. per 100 pts.wt. of the total of the component A and the component B, of a copolymer obtained from an organopolysiloxane of formula I [R is a (substituted) monovalent hydrocarbon group; a is 0.005-0.2; b is 1.8-2.2 where 1.805<=a+b<=2.0] and an alkenyl group-bearing epoxy resin, (D) 50-350 pts.wt. of an inorganic filler with a specific surface area of <=4 m2/g, (E) 5-120 pts.wt. of microfine inorganic filler that has a specific surface area of >=4 m2/g, and is surface-treated with an amino silane or an organosilazene represented by formula II or formula III (R1 is vinyl, phenyl or the like, R2 is H or R1; m is 0-4) where the total of the components D and E is 100-400 pts.wt. per 100 pts.wt. of the total of the components A through C.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板の配線パター
ン面に複数個のバンプを介して半導体チップが搭載され
たフリップチップ型半導体装置の封止材及びこの封止材
にて封止されたフリップチップ型半導体装置に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing material for a flip-chip type semiconductor device in which a semiconductor chip is mounted on a wiring pattern surface of a substrate via a plurality of bumps, and the sealing material is used for sealing. The present invention relates to a flip-chip type semiconductor device.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】電気機
器の小型、軽量化、高機能化に伴い、半導体の実装方法
もピン挿入タイプから表面実装が主流になっている。そ
して、ベアチップ実装の一つにフリップチップ(FC)
実装がある。FC実装とは、LSIチップの配線パター
ン面に高さ10〜100μm程度のバンプといわれる電
極を数個から数千個形成し、基板の電極を導電ペースト
或いは半田等で接合する方式である。このため、FCの
封止保護に用いる封止材料は基板とLSIチップのバン
プによる数10μm程度の隙間に浸透させる必要があ
る。従来のフリップチップ用アンダーフィル材として使
用される液状エポキシ樹脂組成物は、エポキシ樹脂と硬
化剤及び無機質充填剤を配合し、信頼性を高めるために
半導体のチップや基板、バンプと線膨張係数を一致させ
るため多量の無機質充填剤を配合する処方が主流となっ
てきている。
2. Description of the Related Art With the miniaturization, weight reduction, and enhancement of functions of electric equipment, semiconductor mounting methods have become the mainstream from pin insertion type to surface mounting. And one of bare chip mounting is flip chip (FC)
There is an implementation. FC mounting is a method in which several to thousands of electrodes called bumps having a height of about 10 to 100 μm are formed on the wiring pattern surface of an LSI chip, and the electrodes on the substrate are joined by a conductive paste or solder. For this reason, it is necessary that the sealing material used for sealing protection of the FC penetrates into a gap of about several tens of μm between the substrate and the bump of the LSI chip. The liquid epoxy resin composition used as the conventional underfill material for flip chips is composed of an epoxy resin, a hardener and an inorganic filler. In order to make the same, a formulation in which a large amount of an inorganic filler is blended has become mainstream.

【0003】しかし、このような充填剤を高充填したフ
リップチップ用アンダーフィル材においては、応力特性
においては何ら問題はなくなってきているが、一方では
充填剤の高充填化により粘度が高くなり、更にチキソ性
が上昇し、チップと基板の隙間に侵入する速度が著しく
低下し、生産性が非常に悪くなるといった問題点が提示
されており、この問題点の改善が望まれる。
However, in the underfill material for a flip chip which is highly filled with such a filler, there is no longer any problem with respect to the stress characteristics, but on the other hand, the viscosity increases due to the increased filling of the filler. Further, there is a problem that the thixotropy is increased, the speed of entering the gap between the chip and the substrate is significantly reduced, and the productivity is extremely deteriorated. It is desired to improve this problem.

【0004】即ち、従来は、フィラー表面とエポキシ樹
脂の親和性や接着強度を改善するためシランカップリン
グ剤のような表面改質剤を用いている。しかし、フィラ
ー量が少ない場合は何ら問題ないが、フィラーを高充填
したものは、単純にフィラーの表面改質材処理や表面改
質材の添加だけでは十分な特性が得られないのが現状で
ある。
That is, conventionally, a surface modifier such as a silane coupling agent has been used to improve the affinity and adhesive strength between the filler surface and the epoxy resin. However, if the amount of filler is small, there is no problem.However, in the case of highly filled filler, sufficient properties cannot be obtained simply by treating the surface of the filler with a surface modifier or simply adding a surface modifier. is there.

【0005】本発明は、上記事情に鑑みなされたもの
で、多量の無機質充填剤を配合しても、低粘度で隙間侵
入させることが可能でかつ信頼性の優れたフリップチッ
プ型半導体装置用封止材及びこの封止材で封止されたフ
リップチップ型半導体装置を提供することを目的とす
る。
The present invention has been made in view of the above circumstances, and even when a large amount of an inorganic filler is blended, a low-viscosity sealing material for a flip-chip type semiconductor device which is capable of penetrating into gaps and has excellent reliability. It is an object to provide a stopper material and a flip-chip type semiconductor device sealed with the sealing material.

【0006】[0006]

【課題を解決するための手段及び発明の実施の形態】本
発明者は、上記目的を達成するため鋭意検討を重ねた結
果、液状エポキシ樹脂100重量部、硬化剤0〜80重
量部に対し、(c)下記平均組成式(1) HabSiO(4-a-b)/2 (1) (但し式中、Rは置換又は非置換の一価炭化水素基、a
は0.005〜0.2、bは1.8〜2.2、1.80
5≦a+b≦2.3を満足する正数を示す。)で示され
るオルガノポリシロキサンのケイ素原子に結合した水素
原子(SiH基)とアルケニル基含有エポキシ樹脂のア
ルケニル基との付加反応により得られる共重合体を上記
オルガノポリシロキサン単位が上記(a),(b)成分
の合計量100重量部に対して1〜15重量部含まれる
ように配合し、かつ、無機質充填剤として比表面積(B
ET法、以下同じ)が4m2/g未満のものと4m2/g
以上のものを併用すること、この場合比表面積が4m2
/g以上の無機質充填剤は、下記一般式(2)又は
(3)で示されるアミノシラン又はオルガノシラザン化
合物で表面処理したものを使用すること、更に、これら
無機質充填剤は、上記(a),(b),(c)成分の合
計量100重量部に対して合計で100〜400重量部
を配合すると共に、上記比表面積が4m2/g以上の微
細な無機質充填剤を全無機質充填剤中に5〜30重量%
含有させることにより、このエポキシ樹脂組成物は、多
量の無機質充填剤を配合しても、低粘度で薄膜侵入特性
に優れており、フリップチップ型半導体装置用封止材と
して有効であり、この封止材を用いたフリップチップ型
半導体装置は非常に信頼性の高いものであることを見出
し、本発明をなすに至ったものである。
Means for Solving the Problems and Embodiments of the Invention The present inventors have made intensive studies to achieve the above object, and as a result, based on 100 parts by weight of a liquid epoxy resin and 0 to 80 parts by weight of a curing agent, (c) the following average compositional formula (1) H a R b SiO (4-ab) / 2 (1) ( where Shikichu, R represents a substituted or unsubstituted monovalent hydrocarbon radical, a
Is 0.005 to 0.2, b is 1.8 to 2.2, 1.80
Indicates a positive number satisfying 5 ≦ a + b ≦ 2.3. The copolymer obtained by the addition reaction of the hydrogen atom (SiH group) bonded to the silicon atom of the organopolysiloxane and the alkenyl group of the alkenyl group-containing epoxy resin is represented by the above-mentioned (a), (B) It is blended so as to be contained in an amount of 1 to 15 parts by weight based on 100 parts by weight of the total amount of the components, and has a specific surface area (B) as an inorganic filler.
ET method, hereinafter the same) that is less than 4m 2 / g and 4m 2 / g
Use the above materials together, in this case, the specific surface area is 4 m 2
/ G or more of the inorganic filler used is a surface-treated with an aminosilane or an organosilazane compound represented by the following general formula (2) or (3). A total of 100 to 400 parts by weight is blended with respect to 100 parts by weight of the total amount of the components (b) and (c), and the above-mentioned fine inorganic filler having a specific surface area of 4 m 2 / g or more is contained in all inorganic fillers. 5-30% by weight
By containing the epoxy resin composition, even if a large amount of an inorganic filler is blended, the epoxy resin composition has low viscosity and excellent thin film penetration properties, and is effective as a sealing material for flip-chip type semiconductor devices. The present inventors have found that a flip-chip type semiconductor device using a stopper is very reliable, and have accomplished the present invention.

【0007】[0007]

【化2】 (但し各式中、R1は同一又は異種の炭素数1〜4のア
ルキル基、ビニル基又はフェニル基、R2は水素原子又
はR1、mは0〜4の整数である。)
Embedded image (However, in each formula, R 1 is the same or different and is an alkyl group having 1 to 4 carbon atoms, a vinyl group or a phenyl group, R 2 is a hydrogen atom or R 1 , and m is an integer of 0 to 4.)

【0008】即ち、本発明は、 (a)液状エポキシ樹脂:
100重量部、 (b)硬化剤:
0〜80重量部、 (c)下記平均組成式(1) HabSiO(4-a-b)/2 (1) (但し式中、Rは置換又は非置換の一価炭化水素基、a
は0.005〜0.2、bは1.8〜2.2、1.80
5≦a+b≦2.3を満足する正数を示す。)で示され
るオルガノポリシロキサンのケイ素原子に結合した水素
原子とアルケニル基含有エポキシ樹脂のアルケニル基と
の付加反応により得られる共重合体:上記オルガノポリ
シロキサン単位が上記(a),(b)成分の合計量10
0重量部に対して1〜15重量部含まれる量、 (d)比表面積が4m2/g未満の無機質充填剤:
50〜350重量部、 (e)下記一般式(2)又は(3)で示されるアミノシ
ラン又はオルガノシラザン化合物で表面処理された比表
面積が4m2/g以上の微細な無機質充填剤:5〜12
0重量部 を含有し、(d),(e)成分の無機質充填剤が(a)
液状エポキシ樹脂、(b)硬化剤、(c)共重合体の合
計量100重量部に対して合計で100〜400重量部
含有されていることを特徴とするフリップチップ型半導
体装置用封止材、及びこの封止材の硬化物にて封止され
たフリップチップ型半導体装置を提供する。
That is, the present invention provides: (a) a liquid epoxy resin:
100 parts by weight, (b) curing agent:
0-80 parts by weight, (c) the following average compositional formula (1) H a R b SiO (4-ab) / 2 (1) ( where Shikichu, R represents a substituted or unsubstituted monovalent hydrocarbon radical, a
Is 0.005 to 0.2, b is 1.8 to 2.2, 1.80
Indicates a positive number satisfying 5 ≦ a + b ≦ 2.3. A) a copolymer obtained by an addition reaction between a hydrogen atom bonded to a silicon atom of an organopolysiloxane and an alkenyl group of an alkenyl group-containing epoxy resin represented by the following formula: wherein the organopolysiloxane unit is the above component (a) or (b) Total amount of 10
(D) an inorganic filler having a specific surface area of less than 4 m 2 / g:
50 to 350 parts by weight, (e) a fine inorganic filler having a specific surface area of at least 4 m 2 / g, which is surface-treated with an aminosilane or an organosilazane compound represented by the following general formula (2) or (3): 5 to 12
0 parts by weight, and the inorganic filler of the components (d) and (e) is (a)
A sealing material for a flip-chip type semiconductor device, comprising 100 to 400 parts by weight in total with respect to 100 parts by weight in total of a liquid epoxy resin, (b) a curing agent, and (c) a copolymer. And a flip-chip type semiconductor device sealed with a cured product of the sealing material.

【0009】[0009]

【化3】 (但し各式中、R1は同一又は異種の炭素数1〜4のア
ルキル基、ビニル基又はフェニル基、R2は水素原子又
はR1、mは0〜4の整数である。)
Embedded image (However, in each formula, R 1 is the same or different and is an alkyl group having 1 to 4 carbon atoms, a vinyl group or a phenyl group, R 2 is a hydrogen atom or R 1 , and m is an integer of 0 to 4.)

【0010】以下、本発明について更に詳しく述べる。
本発明のフリップチップ型半導体装置用封止材(エポキ
シ樹脂組成物)において、(a)成分の液状のエポキシ
樹脂は、1分子中に2個以上のエポキシ基があればいか
なるものでも使用可能であるが、特に、ビスフェノール
A型エポキシ樹脂、ビスフェノールF型エポキシ樹脂等
のビスフェノール型エポキシ樹脂、フェノールノボラッ
ク型エポキシ樹脂、クレゾールノボラック型エポキシ樹
脂等のノボラック型エポキシ樹脂、ナフタレン型エポキ
シ樹脂、ビフェニル型エポキシ樹脂、シクロペンタジエ
ン型エポキシ樹脂などが例示される。この中でも室温
(25℃)で液状のエポキシ樹脂を使用する。これらの
エポキシ樹脂には下記構造で示されるエポキシ樹脂を浸
入性に影響を及ぼさない範囲で添加しても何ら問題はな
い。
Hereinafter, the present invention will be described in more detail.
In the sealing material (epoxy resin composition) for a flip-chip type semiconductor device of the present invention, any liquid epoxy resin as the component (a) can be used as long as it has two or more epoxy groups in one molecule. Among them, in particular, bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolak type epoxy resins such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, naphthalene type epoxy resin and biphenyl type epoxy resin And cyclopentadiene type epoxy resins. Among them, an epoxy resin liquid at room temperature (25 ° C.) is used. There is no problem even if an epoxy resin having the following structure is added to these epoxy resins within a range that does not affect the infiltration property.

【0011】[0011]

【化4】 Embedded image

【0012】上記液状エポキシ樹脂中の全塩素含有量
は、1,500ppm以下、望ましくは1,000pp
m以下であることが好ましい。また、100℃で50%
エポキシ樹脂濃度における20時間での抽出水塩素が1
0ppm以下であることが好ましい。全塩素含有量が
1,500ppmを超え、抽出水塩素が10ppmを超
えると半導体素子の信頼性、特に耐湿性に悪影響を与え
るおそれがある。
The total chlorine content in the liquid epoxy resin is 1,500 ppm or less, preferably 1,000 pp
m or less. 50% at 100 ° C
Extraction water chlorine in 20 hours at epoxy resin concentration is 1
It is preferably at most 0 ppm. If the total chlorine content exceeds 1,500 ppm and the amount of chlorine in the extracted water exceeds 10 ppm, the reliability of the semiconductor element, particularly, the moisture resistance may be adversely affected.

【0013】上記エポキシ樹脂は、自己重合型である場
合、後述する硬化促進剤を用いることで単独でも硬化さ
せることができるが、必要によって硬化剤を配合するこ
とができる。硬化剤として例えば、テトラヒドロ無水フ
タル酸、メチルテトラヒドロ無水フタル酸、メチルヘキ
サヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、無
水メチルハイミック酸、ピロメリット酸二無水物、ベン
ゾフェノンテトラカルボン酸二無水物、3,3’,4,
4’−ビフェニルテトラカルボン酸二無水物、ビス
(3,4−ジカルボキシフェニル)エーテル二無水物、
ビス(3,4−ジカルボキシフェニル)メタン二無水
物、2,2−ビス(3,4−ジカルボキシフェニル)プ
ロパン二無水物などの、好ましくは分子中に脂肪族環又
は芳香族環を1個又は2個有すると共に、酸無水物基を
1個又は2個有する、炭素原子数4〜25個、好ましく
は8〜20個程度の酸無水物や、ジシアンジアミド、ア
ジピン酸ヒドラジド、イソフタル酸ヒドラジドなどのカ
ルボン酸ヒドラジドを使用することができる。
When the epoxy resin is of a self-polymerizing type, it can be cured alone by using a curing accelerator described later, but a curing agent can be blended if necessary. As the curing agent, for example, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, 3 , 3 ', 4,
4′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride,
Preferably, one molecule of an aliphatic or aromatic ring such as bis (3,4-dicarboxyphenyl) methane dianhydride or 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride is present in the molecule. Acid anhydride having one or two and one or two acid anhydride groups, and having 4 to 25, preferably about 8 to 20 carbon atoms, dicyandiamide, adipic hydrazide, isophthalic hydrazide and the like. Can be used.

【0014】上記硬化剤の配合量は、エポキシ樹脂10
0重量部に対して0〜80重量部である。なお、酸無水
物を硬化剤として用いる場合は、エポキシ樹脂中のエポ
キシ基1モルに対し、硬化剤中の酸無水物基(即ち、−
CO−O−CO−基)の比を0.3〜0.7モルの範囲
とすることが望ましい。0.3モル未満では硬化性が不
十分であり、0.7モルを超えると、未反応の酸無水物
が残存し、ガラス転移温度の低下となるおそれがある。
より望ましくは0.4〜0.6モルの範囲である。
The compounding amount of the above curing agent is 10
0 to 80 parts by weight with respect to 0 parts by weight. When an acid anhydride is used as the curing agent, the acid anhydride group in the curing agent (ie,-
It is desirable that the ratio of (CO—O—CO— group) be in the range of 0.3 to 0.7 mol. If it is less than 0.3 mol, the curability is insufficient, and if it exceeds 0.7 mol, unreacted acid anhydride remains and the glass transition temperature may be lowered.
More preferably, it is in the range of 0.4 to 0.6 mol.

【0015】本発明には、硬化促進剤を配合することが
好ましい。硬化促進剤としては公知のものを使用するこ
とができる。具体的には、イミダゾール誘導体、3級ア
ミン化合物、有機リン系化合物から選ばれる1種又は2
種以上を配合することができる。ここで、イミダゾール
誘導体としては、2−メチルイミダゾール、2−エチル
イミダゾール、4−メチルイミダゾール、4−エチルイ
ミダゾール、2−フェニルイミダゾール、2−フェニル
−4−メチルイミダゾール、2−フェニル−4−ヒドロ
キシメチルイミダゾール、2−エチル−4−メチルイミ
ダゾール、1−シアノエチル−2−メチルイミダゾー
ル、2−フェニル−4−メチル−5−ヒドロキシメチル
イミダゾール、2−フェニル−4,5−ジヒドロキシメ
チルイミダゾール等が挙げられる。また、3級アミン化
合物としては、トリエチルアミン、ベンジルトリメチル
アミン、α−メチルベンジルジメチルアミン等の窒素原
子に結合する置換基としてアルキル基やアラルキル基を
有するアミン化合物、1,8−ジアザヒシクロ[5.
4.0]ウンデセン−7及びそのフェノール塩、オクチ
ル酸塩、オレイン酸塩などのシクロアミジン化合物やそ
の有機酸との塩、或いは下記式の化合物などのシクロア
ミジン化合物と4級ホウ素化合物との塩又は錯塩などが
挙げられる。
In the present invention, it is preferable to add a curing accelerator. Known curing accelerators can be used. Specifically, one or two selected from imidazole derivatives, tertiary amine compounds, and organic phosphorus compounds
More than one species can be blended. Here, as the imidazole derivative, 2-methylimidazole, 2-ethylimidazole, 4-methylimidazole, 4-ethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-hydroxymethyl Imidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and the like. Examples of the tertiary amine compound include amine compounds having an alkyl group or an aralkyl group as a substituent bonded to a nitrogen atom, such as triethylamine, benzyltrimethylamine, and α-methylbenzyldimethylamine, and 1,8-diazacyclo [5.
4.0] Undecen-7 and cycloamidine compounds such as phenol salts, octylates, oleates and salts thereof with organic acids, or salts of cycloamidine compounds such as compounds of the following formulas with quaternary boron compounds Or a complex salt.

【0016】[0016]

【化5】 Embedded image

【0017】また、有機リン系化合物としては、トリフ
ェニルホスフィン等のトリオルガノホスフィン化合物や
テトラフェニルホスホニウムテトラフェニルボレート等
の4級ホスホニウム塩などが挙げられる。
Examples of the organic phosphorus compounds include triorganophosphine compounds such as triphenylphosphine and quaternary phosphonium salts such as tetraphenylphosphonium tetraphenylborate.

【0018】硬化促進剤の配合量は、上記エポキシ樹脂
100重量部に対して0〜10重量部、通常は、0.0
1〜10重量部、望ましくは0.5〜5重量部である。
0.01重量部より少ないと硬化性が低下する場合があ
り、10重量部より多いと硬化性に優れるが、保存性が
低下する傾向となる。
The curing accelerator is used in an amount of 0 to 10 parts by weight, usually 0.0
It is 1 to 10 parts by weight, preferably 0.5 to 5 parts by weight.
If the amount is less than 0.01 part by weight, the curability may decrease. If the amount is more than 10 parts by weight, the curability is excellent, but the storage stability tends to decrease.

【0019】本発明には、(c)成分として、下記平均
組成式(1) HabSiO(4-a-b)/2 (1) (但し式中、Rは置換又は非置換の一価炭化水素基、a
は0.005〜0.2、bは1.8〜2.2、1.80
5≦a+b≦2.3、好ましくはaは0.01〜0.
1、bは1.9〜2.0、1.91≦a+b≦2.1を
満足する正数を示す。)で示されるオルガノポリシロキ
サン(即ち、オルガノハイドロジェンポリシロキサン)
のケイ素原子に結合した水素原子(SiH基)とアルケ
ニル基含有エポキシ樹脂のアルケニル基との付加反応に
より得られる共重合体を配合する。
[0019] The present invention, as component (c), the following average compositional formula (1) H a R b SiO (4-ab) / 2 (1) ( where Shikichu, R represents a substituted or unsubstituted monovalent Hydrocarbon group, a
Is 0.005 to 0.2, b is 1.8 to 2.2, 1.80
5 ≦ a + b ≦ 2.3, preferably a is 0.01 to 0.5.
1 and b are positive numbers satisfying 1.9 to 2.0, 1.91 ≦ a + b ≦ 2.1. ) (Ie, organohydrogenpolysiloxane)
A copolymer obtained by an addition reaction between a hydrogen atom (SiH group) bonded to a silicon atom and an alkenyl group of an alkenyl group-containing epoxy resin is blended.

【0020】ここで、共重合体の原料としてのアルケニ
ル基含有エポキシ樹脂としては、1分子中に少なくとも
1個、好ましくは2個以上の芳香族環に結合したグリシ
ジルオキシ基等のエポキシ基を有すると共に、少なくと
も1個、好ましくは2個以上のアルケニル基を有するも
のであれば種々のエポキシ樹脂を使用することができ、
例えば、下記式(4)〜(6)の構造のアルケニル基含
有エポキシ樹脂等が例示される。
Here, the alkenyl group-containing epoxy resin as a raw material of the copolymer has at least one, preferably two or more epoxy groups such as a glycidyloxy group bonded to two or more aromatic rings in one molecule. In addition, various epoxy resins can be used as long as they have at least one, preferably two or more alkenyl groups,
For example, alkenyl group-containing epoxy resins having the structures of the following formulas (4) to (6) are exemplified.

【0021】[0021]

【化6】 (上記各式においてR3は水素原子、メチル基又は臭素
原子、R4は水素原子、メチル基又はトリフルオロメチ
ル基であり、p,qはそれぞれ自然数で、好ましくはp
+qが2〜50、より好ましくは2〜20の整数であ
る。)
Embedded image (In each of the above formulas, R 3 is a hydrogen atom, a methyl group or a bromine atom, R 4 is a hydrogen atom, a methyl group or a trifluoromethyl group, and p and q are natural numbers, preferably p
+ Q is an integer of 2 to 50, more preferably 2 to 20. )

【0022】一方、上記オルガノポリシロキサン(1)
のケイ素原子の数は、1分子中に10〜400個、好ま
しくは20〜400個、特に40〜200個であること
が好ましく、また、SiH基の数は1〜5個、より好ま
しくは2〜4個、特にはSiH基が2個であることが好
ましい。なお、式(1)において、Rの、ケイ素原子に
結合した置換又は非置換の一価炭化水素基としては、炭
素数1〜10、特に1〜8のものが好ましく、また、脂
肪族不飽和結合を有さないものが好ましく、例えばメチ
ル基、エチル基、プロピル基、イソプロピル基、ブチル
基、イソブチル基、tert−ブチル基、ヘキシル基、
シクロヘキシル基、オクチル基、デシル基等のアルキル
基、ビニル基、アリル基、プロペニル基、ブテニル基、
ヘキセニル基等のアルケニル基、フェニル基、キシリル
基、トリル基等のアリール基、ベンジル基、フェニルエ
チル基、フェニルプロピル基等のアラルキル基などや、
これらの炭化水素基の水素原子の一部又は全部を塩素、
フッ素、臭素等のハロゲン原子で置換したクロロメチル
基、ブロモエチル基、トリフルオロプロピル基等のハロ
ゲン置換一価炭化水素基を挙げることができる。
On the other hand, the organopolysiloxane (1)
Is preferably 10 to 400, preferably 20 to 400, and particularly preferably 40 to 200 in one molecule, and the number of SiH groups is 1 to 5, more preferably 2 to 2. It is preferable that the number of SiH groups is 2 to 4, particularly 2. In the formula (1), the substituted or unsubstituted monovalent hydrocarbon group of R bonded to a silicon atom preferably has 1 to 10 carbon atoms, particularly 1 to 8 carbon atoms. Those having no bond are preferable, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, hexyl group,
Cyclohexyl group, octyl group, alkyl group such as decyl group, vinyl group, allyl group, propenyl group, butenyl group,
Alkenyl group such as hexenyl group, phenyl group, xylyl group, aryl group such as tolyl group, benzyl group, phenylethyl group, aralkyl group such as phenylpropyl group,
Some or all of the hydrogen atoms of these hydrocarbon groups are chlorine,
Examples include a halogen-substituted monovalent hydrocarbon group such as a chloromethyl group, a bromoethyl group, and a trifluoropropyl group substituted with a halogen atom such as fluorine and bromine.

【0023】このようなオルガノハイドロジェンポリシ
ロキサンとしては、両末端トリメチルシロキシ基封鎖メ
チルハイドロジェンポリシロキサン、両末端トリメチル
シロキシ基封鎖ジメチルシロキサン・メチルハイドロジ
ェンシロキサン共重合体、両末端ジメチルハイドロジェ
ンシロキシ基封鎖ジメチルポリシロキサン、両末端ジメ
チルハイドロジェンシロキシ基封鎖ジメチルシロキサン
・メチルハイドロジェンシロキサン共重合体、両末端ジ
メチルハイドロジェンシロキシ基封鎖ジメチルシロキサ
ン・ジフェニルシロキサン共重合体、両末端ジメチルハ
イドロジェンシロキシ基封鎖ジメチルシロキサン・メチ
ルフェニルシロキサン共重合体などの基本的に直鎖状構
造のものが挙げられるが、これらは一部に分岐状のシロ
キサン構造を含んだものであってもよい。
Examples of such organohydrogenpolysiloxane include methylhydrogenpolysiloxane having trimethylsiloxy groups at both ends, dimethylsiloxane / methylhydrogensiloxane copolymer having trimethylsiloxy groups at both ends, and dimethylhydrogensiloxy group at both ends. Blocked dimethylpolysiloxane, dimethylhydrogensiloxy group-terminated dimethylsiloxane / methylhydrogensiloxane copolymer, dimethylhydrogensiloxy group-blocked dimethylsiloxane / diphenylsiloxane copolymer at both ends, dimethylhydrogensiloxy group-blocked dimethyl at both ends Basically, those having a linear structure such as a siloxane / methylphenylsiloxane copolymer may be mentioned, but these partially include a branched siloxane structure. It may be the one.

【0024】上記のオルガノポリシロキサンの分子量
は、特に限定されるものではないが、700〜50,0
00が望ましい。これはオルガノポリシロキサンの分子
量が700〜50,000である場合、得られた共重合
体をエポキシ樹脂組成物に配合すると、マトリックス中
に共重合体が相溶せず、かつ微細な海島構造を形成する
ためである。分子量が700未満であるとマトリックス
中に共重合体が相溶し、海島構造が消滅し、分子量が5
0,000より大きければ海島構造が大きくなってしま
い、いずれの場合も、低粘度性、薄膜侵入性が低下する
場合がある。
The molecular weight of the above-mentioned organopolysiloxane is not particularly limited, but is 700 to 50,0.
00 is desirable. This is because, when the molecular weight of the organopolysiloxane is 700 to 50,000, when the obtained copolymer is blended with the epoxy resin composition, the copolymer is not compatible with the matrix and a fine sea-island structure is formed. It is for forming. If the molecular weight is less than 700, the copolymer is compatible in the matrix, the sea-island structure disappears, and the molecular weight is 5
If it is larger than 000, the sea-island structure becomes large, and in any case, the low viscosity and the infiltration of the thin film may be reduced.

【0025】上記アルケニル基含有エポキシ樹脂とオル
ガノハイドロジェンポリシロキサンとを反応させて共重
合体を得る方法としては、エポキシ樹脂中のアルケニル
基とオルガノハイドロジェンポリシロキサン中の珪素原
子結合水素原子(即ち、SiH基)とを、いわゆるハイ
ドロサイレーション反応として公知の付加反応を採用す
ることができる。
As a method for obtaining a copolymer by reacting the above alkenyl group-containing epoxy resin with an organohydrogenpolysiloxane, an alkenyl group in the epoxy resin and a silicon-bonded hydrogen atom in the organohydrogenpolysiloxane (ie, , SiH groups) can be employed as an addition reaction known as a so-called hydrosilation reaction.

【0026】上記ブロック共重合体としては、例えば特
公昭61−48544号、特公昭63−60069号公
報等に記載の公知のものが使用し得、その一例を挙げる
と下記のものが挙げられる。
As the above-mentioned block copolymer, for example, known ones described in JP-B-61-48544 and JP-B-63-60069 can be used, and examples thereof include the following.

【0027】[0027]

【化7】 Embedded image

【0028】[0028]

【化8】 (上記式中、R及びR4は上記と同じ、R11は水素原子
又は炭素数1〜4のアルキル基、R12は−CH2CH2
2−、−OCH2−CH(OH)−CH2−O−CH2
2CH2−又は−O−CH2CH2CH2−である。nは
4〜199、好ましくは19〜99の整数、pは1〜1
0の整数、qは1〜10の整数である。)
Embedded image (In the above formula, R and R 4 are the same as above, R 11 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R 12 is —CH 2 CH 2 C
H 2 —, —OCH 2 —CH (OH) —CH 2 —O—CH 2 C
H 2 CH 2 — or —O—CH 2 CH 2 CH 2 —. n is an integer of 4 to 199, preferably 19 to 99, and p is 1 to 1.
An integer of 0 and q is an integer of 1 to 10. )

【0029】上記共重合体は、上記オルガノポリシロキ
サン単位が液状エポキシ樹脂(a)と硬化剤(b)の合
計量100重量部に対して1〜15重量部、好ましくは
2〜10重量部含まれるように配合する。1重量部より
少ないとシリカとのぬれ性に乏しく、組成物のチキソ性
が高くなり侵入性が低下することとなり、15重量部よ
り多いと組成物の粘度が高くなり、やはり侵入性が低下
する。
The copolymer contains the organopolysiloxane unit in an amount of 1 to 15 parts by weight, preferably 2 to 10 parts by weight, based on 100 parts by weight of the total amount of the liquid epoxy resin (a) and the curing agent (b). To be blended. If the amount is less than 1 part by weight, the wettability with silica is poor, the thixotropy of the composition is increased, and the penetration is reduced. If the amount is more than 15 parts by weight, the viscosity of the composition is increased, and the penetration is also decreased. .

【0030】なお、本発明には、上記共重合体に加え、
応力を低下させる目的でシリコーンゴム、シリコーンオ
イルや液状のポリブタジエンゴム、メタクリル酸メチル
−ブタジエン−スチレン共重合体といった熱可塑性樹脂
などを配合してもよい。
In the present invention, in addition to the above copolymer,
For the purpose of reducing the stress, a thermoplastic resin such as silicone rubber, silicone oil, liquid polybutadiene rubber, or methyl methacrylate-butadiene-styrene copolymer may be blended.

【0031】一方、無機質充填剤としては、膨張係数を
小さくする目的から、従来より知られている各種の無機
質充填剤を添加することができる。具体的に無機質充填
剤としては、溶融シリカ、結晶シリカ、アルミナ、ボロ
ンナイトライド、窒化アルミ、窒化ケイ素、マグネシ
ア、マグネシウムシリケートなどが使用される。中でも
真球状の溶融シリカが低粘度化、高侵入性のため望まし
いものである。アンダーフィル部の封止材には、侵入性
の向上と低線膨張化の両立を図るためフリップチップギ
ャップ幅(基板と半導体チップとの隙間)に対して平均
粒径が約1/10以下、最大粒径が1/2以下の充填剤
が望ましく、通常は最大粒径50μm以下、望ましくは
25μm以下、更に望ましくは10μm以下である。平
均粒径は0.5〜10μm、望ましくは0.5〜5μ
m、より望ましくは0.8〜4μmである。なお、この
平均粒径は、例えばレーザー光回折法による重量平均値
(又はメディアン径)等として求めることができる。
On the other hand, as the inorganic filler, various kinds of conventionally known inorganic fillers can be added for the purpose of reducing the expansion coefficient. Specific examples of the inorganic filler include fused silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, magnesia, and magnesium silicate. Above all, spherical fused silica is desirable because of its low viscosity and high penetration. The sealing material of the underfill portion has an average particle size of about 1/10 or less with respect to the flip chip gap width (gap between the substrate and the semiconductor chip) in order to achieve both improvement in penetration and low linear expansion. A filler having a maximum particle size of 1/2 or less is desirable, and usually has a maximum particle size of 50 μm or less, preferably 25 μm or less, and more preferably 10 μm or less. Average particle size is 0.5 to 10 μm, preferably 0.5 to 5 μm
m, more preferably 0.8 to 4 μm. The average particle diameter can be determined, for example, as a weight average value (or median diameter) by a laser diffraction method.

【0032】本発明においては、上記無機質充填剤とし
て、(d)比表面積(BET吸着法による、以下同様)
が4m2/g未満(なお、その下限は通常0.5m2
g、好ましくは1m2/gである)の無機質充填剤と
(e)比表面積が4m2/g以上(なお、その上限は通
常15m2/g、好ましくは8m2/gである)の無機質
充填剤とを併用する。
In the present invention, (d) specific surface area (based on a BET adsorption method, hereinafter the same)
There 4m 2 / less than g (Note that the lower limit is usually 0.5 m 2 /
g, preferably 1 m 2 / g) and an inorganic filler (e) having a specific surface area of 4 m 2 / g or more (the upper limit is usually 15 m 2 / g, preferably 8 m 2 / g). Use in combination with filler.

【0033】この場合、比表面積が4m2/g以上の通
常平均粒径が1μm以下の球状シリカは、比表面積が大
きすぎる(即ち、平均粒径が小さすぎる)ことから、こ
の種のシリカを配合したものは高粘度となり、本発明の
材料には多量に使用できないものである。しかし、式
(2)又は(3)のアミノシラン、オルガノシラザン化
合物から選ばれる1種又は2種以上の処理剤で微細なシ
リカのみを予め表面処理したものと他の充填剤を所定の
割合で混合し使用することで、従来得られなかった低シ
ェア領域での粘度を低下させることが可能となり、かつ
薄膜への侵入性も向上したものである。
In this case, a spherical silica having a specific surface area of 4 m 2 / g or more and an average particle diameter of 1 μm or less has too large a specific surface area (ie, an average particle diameter is too small). The compounded product has a high viscosity and cannot be used in a large amount in the material of the present invention. However, a mixture obtained by preliminarily surface-treating only fine silica with one or two or more kinds of treating agents selected from aminosilanes and organosilazane compounds of formula (2) or (3) and another filler at a predetermined ratio. By using this, it is possible to reduce the viscosity in the low shear region, which has not been obtained conventionally, and the penetration into the thin film is improved.

【0034】[0034]

【化9】 (但し各式中、R1は同一又は異種の炭素数1〜4のア
ルキル基、ビニル基又はフェニル基、R2は水素原子又
はR1、mは0〜4の整数である。)
Embedded image (However, in each formula, R 1 is the same or different and is an alkyl group having 1 to 4 carbon atoms, a vinyl group or a phenyl group, R 2 is a hydrogen atom or R 1 , and m is an integer of 0 to 4.)

【0035】ここで、一般式(2)で示されるアミノシ
ラン化合物としては、例えば、トリメチルシリルアミ
ン、トリエチルシリルアミン、ビニルジメチルシリルア
ミン、フェニルジメチルシリルアミン、(N−メチルア
ミノ)トリメチルシラン、(N−エチルアミノ)トリメ
チルシラン、(N,N−ジメチルアミノ)トリメチルシ
ラン、(N,N−ジエチルアミノ)トリメチルシラン、
(N,N−ジエチルアミノ)トリエチルシラン、(N,
N−ジエチルアミノ)ビニルジメチルシラン、(N,N
−ジエチルアミノ)フェニルジメチルシラン等の、非置
換アミノ基(−NH2基)又は低級アルキル置換アミノ
基(−NHR’基又は−NR’2基、但し、R’はC1
4の低級アルキル基)を有するトリオルガノアミノシラ
ン化合物を挙げることができる。
Here, as the aminosilane compound represented by the general formula (2), for example, trimethylsilylamine, triethylsilylamine, vinyldimethylsilylamine, phenyldimethylsilylamine, (N-methylamino) trimethylsilane, (N- Ethylamino) trimethylsilane, (N, N-dimethylamino) trimethylsilane, (N, N-diethylamino) trimethylsilane,
(N, N-diethylamino) triethylsilane, (N, N-diethylamino) triethylsilane
(N-diethylamino) vinyldimethylsilane, (N, N
- diethylamino) such as phenyl dimethyl silane, unsubstituted amino group (-NH 2 group) or lower alkyl-substituted amino group (-NHR 'group or -NR' 2 group, provided that, R 'is C 1 ~
( A lower alkyl group of 4 ).

【0036】また、一般式(3)で示されるオルガノシ
ラザン化合物としては、ヘキサメチルジシラザン、1,
3−ジビニルテトラメチルジシラザン、1,3−ジメチ
ルテトラビニルジシラザン、ヘキサビニルジシラザン、
1,3−ジフェニルテトラメチルジシラザン等のヘキサ
オルガノジシラザン、オクタメチルトリシラザン、1,
5−ジビニルヘキサメチルトリシラザン、1,1,5,
5−テトラビニル−テトラメチルトリシラザン、1,5
−ジフェニルヘキサメチルトリシラザン等のオクタオル
ガノトリシラザン、デカメチルテトラシラザン等のデカ
オルガノテトラシラザン、ドデカメチルペンタシラザン
等のドデカオルガノペンタシラザンなどのケイ素原子数
が2〜6個のシラザンオリゴマーを挙げることができ、
好ましくはヘキサオルガノジシラザンである。
As the organosilazane compound represented by the general formula (3), hexamethyldisilazane,
3-divinyltetramethyldisilazane, 1,3-dimethyltetravinyldisilazane, hexavinyldisilazane,
Hexaorganodisilazane such as 1,3-diphenyltetramethyldisilazane, octamethyltrisilazane,
5-divinylhexamethyltrisilazane, 1,1,5
5-tetravinyl-tetramethyltrisilazane, 1,5
-Silazane oligomers having 2 to 6 silicon atoms, such as octaorganotrisilazane such as diphenylhexamethyltrisilazane, decaorganotetrasilazane such as decamethyltetrasilazane, and dodecaorganopentasilazane such as dodecamethylpentasilazane. Can be
Preferred is hexaorganodisilazane.

【0037】なお、微細球状シリカとアミノシラン及び
/又はオルガノシラザンとの反応は公知であり、シリカ
に対し0.5〜5重量%のアミノシラン及び/又はオル
ガノシラザンをシリカに噴霧し、密閉した状態で5〜2
4時間放置した後、120℃の温度で5時間乾燥させて
行うことができる。
The reaction of fine spherical silica with aminosilane and / or organosilazane is known, and 0.5 to 5% by weight of aminosilane and / or organosilazane with respect to silica is sprayed on silica and the silica is sealed. 5-2
After leaving for 4 hours, drying can be performed at a temperature of 120 ° C. for 5 hours.

【0038】ここで、比表面積が4m2/g以上の無機
質充填剤は、このように式(2)又は(3)のアミノシ
ラン、オルガノシラザン化合物から選ばれる1種又は2
種以上の処理剤で表面処理したものを使用するが、比表
面積が4m2/g未満の無機質充填剤は、公知のシラン
カップリング剤(反応性官能基含有アルコキシシラン化
合物)や上記と同様のアミノシラン及び/又はオルガノ
シラザンなどで表面処理したものを用いることができ
る。
Here, the inorganic filler having a specific surface area of 4 m 2 / g or more is one or two selected from the aminosilanes and organosilazane compounds of the formula (2) or (3).
The surface-treated with at least one kind of treating agent is used, and the inorganic filler having a specific surface area of less than 4 m 2 / g is a known silane coupling agent (reactive functional group-containing alkoxysilane compound) or the same as described above. Those surface-treated with aminosilane and / or organosilazane can be used.

【0039】上記比表面積が4m2/g未満の無機質充
填剤(d)の配合量は、エポキシ樹脂100重量部に対
して50〜350重量部、比表面積が4m2/g以上の
無機質充填剤(e)の配合量は同5〜120重量部であ
り、かつエポキシ樹脂(a)、硬化剤(b)、共重合体
(c)の合計100重量部に対し、(d),(e)の無
機質充填剤が合計で100〜400重量部、特に150
〜250重量部となるように、しかも(e)成分の全無
機質充填剤中の含有量が5〜35重量%、特に8〜30
重量%となるように配合することが好ましい。(d),
(e)の無機質充填剤の総配合量が少なすぎると、膨張
係数が大きく、冷熱試験においてクラックの発生を誘発
させるおそれがある。一方、多すぎると、粘度が高くな
り、薄膜侵入性の低下をもたらすおそれがある。
The amount of the inorganic filler (d) having a specific surface area of less than 4 m 2 / g is 50 to 350 parts by weight with respect to 100 parts by weight of the epoxy resin, and the inorganic filler having a specific surface area of 4 m 2 / g or more. The compounding amount of (e) is 5 to 120 parts by weight, and (d) and (e) are based on 100 parts by weight of the epoxy resin (a), the curing agent (b), and the copolymer (c) in total. 100 to 400 parts by weight, especially 150 parts by weight,
So that the content of the component (e) in the total inorganic filler is 5 to 35% by weight, especially 8 to 30% by weight.
It is preferable to mix them so as to be in% by weight. (D),
If the total amount of the inorganic filler (e) is too small, the coefficient of expansion is large, and cracks may be induced in a thermal test. On the other hand, if the amount is too large, the viscosity becomes high, and there is a possibility that the penetration of the thin film is reduced.

【0040】本発明の好ましい態様は、比表面積が4m
2/g以上の微細な無機質充填剤を式(2)又は(3)
で示されるアミノシラン又はオルガノシラザン化合物か
ら選ばれる少なくとも1種の処理剤で表面処理したもの
を全無機質充填剤の5〜35重量%含有させることで低
粘度かつ低シェア域の粘度を低くしたものであるが、特
に上記アルケニル基含有エポキシ樹脂のアルケニル基と
下記式(1) HabSiO(4-a-b)/2 (1) で示される1分子中のケイ素原子の数が10〜400で
あり、SiH基の数が1〜5であるオルガノハイドロジ
ェンポリシロキサンのSiH基との付加反応により得ら
れる共重合体と、上記特定の無機質充填剤を組み合わせ
ることで、より一層低粘度かつ低シェア域の粘度を下げ
ることができ、薄膜侵入性に優れることを知見したもの
であり、上述したように、エポキシ樹脂と硬化剤と共重
合体の合計量100重量部に対し、上記無機質充填剤を
100〜400重量部の範囲とし、かつ共重合体中のオ
ルガノポリシロキサン単位の配合量をエポキシ樹脂と硬
化剤の合計量100重量部に対して1〜15重量部の割
合とすることが有効であることを見出したものである。
この範囲外では高粘度、高チキソ性になり、十分な薄膜
侵入特性が得られない。特に、無機質充填剤量が200
重量部を超えて使用する場合、共重合体中のオルガノポ
リシロキサン単位の配合量はエポキシ樹脂と硬化剤の合
計量100重量部に対して2重量部以上、特に4重量部
以上が好ましい。この範囲外では高粘度、高チキソ性に
なり、十分な薄膜侵入特性が得られない場合が生じる。
In a preferred embodiment of the present invention, the specific surface area is 4 m
2 / g or more of a fine inorganic filler of formula (2) or (3)
A low-viscosity and low-shear region viscosity is reduced by containing 5-35% by weight of the total inorganic filler containing a surface-treated material with at least one treating agent selected from the group consisting of an aminosilane and an organosilazane compound. In particular, the number of silicon atoms in one molecule represented by the following formula (1) H a R b SiO (4-ab) / 2 (1) is 10 to 400 and the alkenyl group of the alkenyl group-containing epoxy resin is preferably And a copolymer obtained by an addition reaction of an organohydrogenpolysiloxane having 1 to 5 SiH groups with SiH groups, and the above-mentioned specific inorganic filler, thereby further lowering the viscosity and lowering the share. It has been found that the viscosity of the region can be lowered and the thin film penetration is excellent, and as described above, the total amount of the epoxy resin, the curing agent and the copolymer is 100 parts by weight. The inorganic filler is in the range of 100 to 400 parts by weight, and the amount of the organopolysiloxane unit in the copolymer is 1 to 15 parts by weight based on 100 parts by weight of the total amount of the epoxy resin and the curing agent. It has been found that setting the ratio is effective.
Outside this range, high viscosity and high thixotropy are obtained, and sufficient thin film penetration properties cannot be obtained. In particular, when the amount of the inorganic filler is 200
When used in excess of parts by weight, the amount of the organopolysiloxane unit in the copolymer is preferably at least 2 parts by weight, particularly preferably at least 4 parts by weight, based on 100 parts by weight of the total amount of the epoxy resin and the curing agent. Outside this range, high viscosity and high thixotropy may result, and sufficient thin film penetration properties may not be obtained.

【0041】本発明の封止材には、更に必要に応じ、接
着向上用炭素官能性シラン、カーボンブラックなどの顔
料、染料、酸化防止剤、表面処理剤(γ−グリシドキシ
プロピルトリメトキシシランなど)、その他の添加剤を
配合することができる。
The sealing material of the present invention may further include, if necessary, pigments such as carbon-functional silane for improving adhesion, dyes such as carbon black, antioxidants, and surface treatment agents (γ-glycidoxypropyltrimethoxysilane). Etc.), and other additives.

【0042】本発明の封止材(エポキシ樹脂組成物)
は、例えば、エポキシ樹脂、硬化剤、硬化促進剤、無機
質充填剤を同時に又は別々に必要により加熱処理を加え
ながら撹拌、溶解、混合、分散させることによって製造
することができる。これらの混合物の混合、撹拌、分散
等の装置は特に限定されないが、撹拌、加熱装置を備え
たライカイ機、3本ロール、ボールミル、プラネタリー
ミキサー等を用いることができる。これら装置を適宜組
み合わせて使用してもよい。
The sealing material of the present invention (epoxy resin composition)
Can be produced, for example, by stirring, dissolving, mixing, and dispersing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler simultaneously or separately while applying a heat treatment as needed. The apparatus for mixing, stirring, and dispersing the mixture is not particularly limited, but a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, or the like can be used. These devices may be used in appropriate combination.

【0043】なお、本発明において、封止材として用い
る液状エポキシ樹脂組成物の粘度は、25℃において1
0,000ポイズ以下のものが好ましい。また、この封
止材の成形方法、成形条件は、常法とすることができる
が、好ましくは、先に100〜120℃,0.5時間以
上、後硬化として150℃、0.5時間以上で熱オーブ
ンキュアを行う。後硬化が150℃,0.5時間未満で
は、十分な硬化物特性が得られないおそれがある。ま
た、最初の成形条件が100〜120℃,0.5時間未
満では、硬化後にボイドが発生するおそれがある。
In the present invention, the viscosity of the liquid epoxy resin composition used as a sealing material is 1 at 25 ° C.
Those having a value of not more than 000 poise are preferred. Further, the molding method and molding conditions of the sealing material may be ordinary methods, but are preferably 100 to 120 ° C. and 0.5 hours or more first, and 150 ° C. and 0.5 hours or more for post-curing. Perform heat oven cure with. If the post-curing is performed at 150 ° C. for less than 0.5 hour, sufficient cured product properties may not be obtained. If the initial molding conditions are 100 to 120 ° C. and less than 0.5 hour, voids may be generated after curing.

【0044】ここで、本発明に用いるフリップチップ型
半導体装置は、図1に示したように、通常、有機基板1
の配線パターン面に複数個のバンプ2を介して半導体チ
ップ3が搭載されているものであり、上記有機基板1と
半導体チップ3との隙間(バンプ2間の隙間)をアンダ
ーフィル材4が充填され、その側部がフィレット材5で
封止されたものとすることができるが、本発明の封止材
は、特にアンダーフィル材を形成する場合に有効であ
る。
Here, the flip-chip type semiconductor device used in the present invention usually has an organic substrate 1 as shown in FIG.
The semiconductor chip 3 is mounted on the wiring pattern surface via a plurality of bumps 2, and an underfill material 4 fills a gap between the organic substrate 1 and the semiconductor chip 3 (a gap between the bumps 2). Although the side portion can be sealed with the fillet material 5, the sealing material of the present invention is particularly effective when forming an underfill material.

【0045】本発明の封止材をアンダーフィル材の形成
に用いる場合、その硬化物のガラス転移温度以下の膨張
係数が20〜40ppm/℃であることが好ましい。な
お、フィレット材用の封止材は、公知のものでよく、特
には、上述したと同様の液状エポキシ樹脂組成物を用い
ることができるが、この場合はその硬化物のガラス転移
温度以下のときの膨張係数が10〜20ppm/℃であ
るものが好ましい。
When the sealing material of the present invention is used for forming an underfill material, the cured product preferably has an expansion coefficient of not more than the glass transition temperature of 20 to 40 ppm / ° C. In addition, the sealing material for the fillet material may be a known material, and in particular, the same liquid epoxy resin composition as described above can be used. In this case, when the temperature is equal to or lower than the glass transition temperature of the cured product. Having an expansion coefficient of 10 to 20 ppm / ° C. is preferred.

【0046】[0046]

【実施例】以下、実施例と比較例を示し、本発明を具体
的に説明するが、本発明は下記の実施例に制限されるも
のではない。
EXAMPLES The present invention will be described below in detail with reference to examples and comparative examples, but the present invention is not limited to the following examples.

【0047】[実施例1〜6、比較例1〜4]表1,2
で示す成分を配合し、3本ロールで均一に混練すること
によりエポキシ樹脂組成物を得た。なお、フィラーA〜
Gは、表3に示すシリカ微粉末を表3に示す組成で均一
に混合したフィラー混合物である。これらのエポキシ樹
脂組成物を用いて、以下に示す試験を行った。その結果
を表1,2に示す。 [粘度]BH型回転粘度計を用いて2rpm、10rp
mの回転数で25℃における粘度を測定した。 [チキソ比]BH型回転粘度計を用いて2rpmと10
rpmの粘度の比を25℃におけるチキソ比とした。 [ゲル化時間]組成物のゲル化時間を150℃の熱板上
で測定した。 [Tg]:ガラス転移温度 5mm×5mm×15mmの硬化物サンプルを用いてT
MA(熱機械分析装置)により5℃/分の速度で昇温し
た際の値を測定した。 [CTE−1]:Tg以下の膨張係数 [CTE−2]:Tg以上の膨張係数 上記ガラス転移温度の測定において、CTE−1は50
〜80℃の温度範囲、CTE−2は200〜230℃の
温度範囲における値を求めた。
Examples 1 to 6, Comparative Examples 1 to 4 Tables 1 and 2
Were mixed and uniformly kneaded with three rolls to obtain an epoxy resin composition. In addition, filler A ~
G is a filler mixture obtained by uniformly mixing the silica fine powder shown in Table 3 with the composition shown in Table 3. The following tests were performed using these epoxy resin compositions. The results are shown in Tables 1 and 2. [Viscosity] 2 rpm, 10 rpm using a BH-type rotational viscometer
The viscosity at 25 ° C. was measured at a rotation speed of m. [Thixo ratio] Using a BH-type rotational viscometer at 2 rpm and 10 rpm
The ratio of the viscosity at rpm was the thixo ratio at 25 ° C. [Gelling time] The gelling time of the composition was measured on a hot plate at 150 ° C. [Tg]: glass transition temperature T using a cured product sample of 5 mm × 5 mm × 15 mm
The value when the temperature was raised at a rate of 5 ° C./min by an MA (thermomechanical analyzer) was measured. [CTE-1]: Expansion coefficient of Tg or less [CTE-2]: Expansion coefficient of Tg or more In the above measurement of the glass transition temperature, CTE-1 was 50.
The temperature in the temperature range of 8080 ° C. and the value of CTE-2 in the temperature range of 200 to 230 ° C. were determined.

【0048】[侵入試験]図2(A),(B)に示した
ように、熱板11上に下側スライドガラス12を載置
し、その上にそれぞれ厚さ80μmの2枚のポリイミド
フィルム13,13を1cmの間隔を隔ててセットし、
その上から上側スライドガラス14を被せ、上記両スラ
イドガラス12,14と2枚のポリイミドフィルム1
3,13とにより、幅1cm、高さ80μmの間隙15
を形成した。上記下側スライドガラス12上にエポキシ
樹脂組成物16を置き、熱板11を80℃、120℃に
設定した時、上記組成物16が上記間隙15に20mm
の距離まで浸透、到達するまでの時間を測定した。
[Penetration Test] As shown in FIGS. 2A and 2B, a lower slide glass 12 was placed on a hot plate 11 and two polyimide films each having a thickness of 80 μm were placed thereon. 13 and 13 are set at an interval of 1 cm,
The upper slide glass 14 is covered from above, and the two slide glasses 12 and 14 and the two polyimide films 1 are placed.
A gap 15 having a width of 1 cm and a height of 80 μm is formed by 3 and 13.
Was formed. When the epoxy resin composition 16 is placed on the lower slide glass 12 and the hot plate 11 is set at 80 ° C. and 120 ° C., the composition 16
And measured the time to reach.

【0049】[0049]

【表1】 [Table 1]

【0050】[0050]

【表2】 [Table 2]

【0051】[成分] RE310:ビスフェノールA型エポキシ樹脂(日本化
薬(株)製) RE304:ビスフェノールF型エポキシ樹脂(日本化
薬(株)製) MH700:メチルテトラヒドロ無水フタル酸(新日本
理化(株)製)
[Components] RE310: Bisphenol A type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) RE304: Bisphenol F type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) MH700: Methyltetrahydrophthalic anhydride (Shin Nippon Chemical Co., Ltd.) Co., Ltd.)

【0052】[0052]

【化10】 Embedded image

【0053】KBM403:シランカップリング剤、グ
リシドキシプロピルトリメトキシシラン(信越化学工業
(株)製) 2PHZ−PW:2−フェニル−4,5−ジヒドロキシ
メチルイミダゾール(四国化成(株)製) HX3741:イミダゾール化合物を含有するマイクロ
カプセル化触媒(旭チバ(株)製)
KBM403: silane coupling agent, glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.) 2PHZ-PW: 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Chemicals Co., Ltd.) HX3741 : Microencapsulated catalyst containing imidazole compound (manufactured by Asahi Ciba Co., Ltd.)

【0054】[0054]

【表3】 [Table 3]

【0055】SE8FC:平均粒径6μmの球状シリカ
((株)龍森社製) SO32H:平均粒径2μmの真球状シリカ((株)ア
ドマテックス製) SO25R:平均粒径0.5μmの真球状シリカ
((株)アドマテックス製)
SE8FC: Spherical silica having an average particle diameter of 6 μm (manufactured by Tatsumori Co., Ltd.) SO32H: Spherical silica having an average particle diameter of 2 μm (manufactured by Admatex) SO25R: Spherical spherical having an average particle diameter of 0.5 μm Silica (manufactured by Admatechs)

【0056】[0056]

【発明の効果】本発明のフリップチップ型半導体装置用
封止材は、多量の無機質充填剤を配合しても低シェア域
での粘度が低く、薄膜侵入特性に優れており、この封止
材を用いたフリップチップ型半導体装置は非常に信頼性
の高いものである。
The sealing material for flip-chip type semiconductor devices of the present invention has a low viscosity in a low shear region even when a large amount of an inorganic filler is blended, and has excellent thin film penetration properties. Is highly reliable.

【図面の簡単な説明】[Brief description of the drawings]

【図1】フリップチップ型半導体装置の一例を示す概略
図である。
FIG. 1 is a schematic view illustrating an example of a flip-chip type semiconductor device.

【図2】侵入試験で用いたテストピースを示し、(A)
は側面図、(B)は平面図である。
FIG. 2 shows a test piece used in the penetration test, (A)
Is a side view, and (B) is a plan view.

【符号の説明】[Explanation of symbols]

1 有機基板 2 バンプ 3 半導体チップ 4 アンダーフィル材 5 フィレット材 11 熱板 12 下側スライドガラス 13 ポリイミドフィルム 14 上側スライドガラス 15 間隙 16 エポキシ樹脂組成物 Reference Signs List 1 organic substrate 2 bump 3 semiconductor chip 4 underfill material 5 fillet material 11 hot plate 12 lower slide glass 13 polyimide film 14 upper slide glass 15 gap 16 epoxy resin composition

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 23/29 H01L 23/30 R 23/31 (72)発明者 若尾 幸 群馬県碓氷郡松井田町大字人見1番地10 信越化学工業株式会社シリコーン電子材料 技術研究所内 (72)発明者 塩原 利夫 群馬県碓氷郡松井田町大字人見1番地10 信越化学工業株式会社シリコーン電子材料 技術研究所内──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification FI FI Theme Court ゛ (Reference) H01L 23/29 H01L 23/30 R 23/31 (72) Inventor Sachi Wakao Daijito, Matsuidamachi, Usui-gun, Gunma Prefecture No. 1-10 Shin-Etsu Chemical Co., Ltd. Silicone Electronic Materials Research Laboratory (72) Inventor Toshio Shiobara 1-10, Hitomi, Matsuida-cho, Usui-gun, Gunma Prefecture Shin-Etsu Chemical Co., Ltd. Silicone Electronics Materials Research Laboratory

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 (a)液状エポキシ樹脂:
100重量部、 (b)硬化剤:
0〜80重量部、 (c)下記平均組成式(1) HabSiO(4-a-b)/2 (1) (但し式中、Rは置換又は非置換の一価炭化水素基、a
は0.005〜0.2、bは1.8〜2.2、1.80
5≦a+b≦2.3を満足する正数を示す。)で示され
るオルガノポリシロキサンのケイ素原子に結合した水素
原子とアルケニル基含有エポキシ樹脂のアルケニル基と
の付加反応により得られる共重合体:上記オルガノポリ
シロキサン単位が上記(a),(b)成分の合計量10
0重量部に対して1〜15重量部含まれる量、 (d)比表面積が4m2/g未満の無機質充填剤:
50〜350重量部、 (e)下記一般式(2)又は(3) 【化1】 (但し各式中、R1は同一又は異種の炭素数1〜4のア
ルキル基、ビニル基又はフェニル基、R2は水素原子又
はR1、mは0〜4の整数である。)で示されるアミノ
シラン又はオルガノシラザン化合物で表面処理された比
表面積が4m2/g以上の微細な無機質充填剤:
5〜120重量部 を含有し、(d),(e)成分の無機質充填剤が(a)
液状エポキシ樹脂、(b)硬化剤、(c)共重合体の合
計量100重量部に対して合計で100〜400重量部
含有されていることを特徴とするフリップチップ型半導
体装置用封止材。
1. (a) Liquid epoxy resin:
100 parts by weight, (b) curing agent:
0-80 parts by weight, (c) the following average compositional formula (1) H a R b SiO (4-ab) / 2 (1) ( where Shikichu, R represents a substituted or unsubstituted monovalent hydrocarbon radical, a
Is 0.005 to 0.2, b is 1.8 to 2.2, 1.80
Indicates a positive number satisfying 5 ≦ a + b ≦ 2.3. A) a copolymer obtained by the addition reaction of a hydrogen atom bonded to a silicon atom of an organopolysiloxane with an alkenyl group of an alkenyl group-containing epoxy resin represented by the following formula: wherein the organopolysiloxane unit is the above component (a) or (b) Total amount of 10
(D) an inorganic filler having a specific surface area of less than 4 m 2 / g:
50 to 350 parts by weight, (e) the following general formula (2) or (3) (Wherein, R 1 is the same or different alkyl group having 1 to 4 carbon atoms, vinyl group or phenyl group, R 2 is a hydrogen atom or R 1 , and m is an integer of 0 to 4). Fine inorganic filler having a specific surface area of 4 m 2 / g or more, which is surface-treated with an aminosilane or an organosilazane compound to be used:
5 to 120 parts by weight, and the inorganic filler of the components (d) and (e) is (a)
A sealing material for a flip-chip type semiconductor device, comprising 100 to 400 parts by weight in total with respect to 100 parts by weight in total of a liquid epoxy resin, (b) a curing agent, and (c) a copolymer. .
【請求項2】 (e)成分の含有量が全無機質充填剤中
5〜35重量%である請求項1記載の封止材。
2. The sealing material according to claim 1, wherein the content of the component (e) is 5 to 35% by weight based on the total amount of the inorganic filler.
【請求項3】 硬化促進剤を配合した請求項1又は2記
載の封止材。
3. The sealing material according to claim 1, further comprising a curing accelerator.
【請求項4】 請求項1,2又は3記載の封止材の硬化
物にて封止されたフリップチップ型半導体装置。
4. A flip-chip type semiconductor device sealed with a cured product of the sealing material according to claim 1, 2 or 3.
JP2000165448A 1999-06-08 2000-06-02 Flip chip type semiconductor device sealing material and flip chip type semiconductor device Expired - Fee Related JP3707531B2 (en)

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JP16067199 1999-06-08
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* Cited by examiner, † Cited by third party
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JP2003055439A (en) * 2001-08-16 2003-02-26 Shin Etsu Chem Co Ltd Liquid epoxy resin composition and semiconductor device made by using it
JP2003124402A (en) * 2001-10-17 2003-04-25 New Japan Radio Co Ltd Semiconductor package and method for producing it
JP2003261770A (en) * 2002-03-08 2003-09-19 Kanegafuchi Chem Ind Co Ltd Sealant, method of sealing for semiconductor device or the like, method of production for semiconductor device, and semiconductor device
US6780674B2 (en) 2001-12-25 2004-08-24 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition and semiconductor device
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JP2005170771A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Slightly basic silica powder, method for producing the same, and resin composition
JP2006306985A (en) * 2005-04-28 2006-11-09 Shin Etsu Chem Co Ltd Method for producing encapsulating material for cob mounting
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003055439A (en) * 2001-08-16 2003-02-26 Shin Etsu Chem Co Ltd Liquid epoxy resin composition and semiconductor device made by using it
JP2003124402A (en) * 2001-10-17 2003-04-25 New Japan Radio Co Ltd Semiconductor package and method for producing it
US6780674B2 (en) 2001-12-25 2004-08-24 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition and semiconductor device
JP2003261770A (en) * 2002-03-08 2003-09-19 Kanegafuchi Chem Ind Co Ltd Sealant, method of sealing for semiconductor device or the like, method of production for semiconductor device, and semiconductor device
JP4610839B2 (en) * 2002-03-08 2011-01-12 株式会社カネカ Sealant, method for sealing semiconductor, semiconductor device manufacturing method, and semiconductor device
JP2005170771A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Slightly basic silica powder, method for producing the same, and resin composition
JP2005171208A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Filler and resin composition
WO2005080270A1 (en) * 2003-12-15 2005-09-01 Admatechs Co., Ltd. Fine basic silica powder, process for producing the same and resin composition
JP2005171199A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Slightly basic alumina powdery material, method for producing the same and resin composition
JP2006306985A (en) * 2005-04-28 2006-11-09 Shin Etsu Chem Co Ltd Method for producing encapsulating material for cob mounting
JP2008094902A (en) * 2006-10-10 2008-04-24 Shin Etsu Chem Co Ltd Thixotropic sealant
JP2013014643A (en) * 2011-06-30 2013-01-24 Nippon Zeon Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2014156593A (en) * 2013-01-16 2014-08-28 Somar Corp Liquid epoxy resin composition and adhesive using the same
JP2021518483A (en) * 2018-03-16 2021-08-02 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー Storage stable and curable resin composition
JP7411587B2 (en) 2018-03-16 2024-01-11 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー Storage stable and curable resin composition

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