JP2001053333A - Projector and receiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate assembling. SOLUTION: When this device is used for a VICS(vehicle information communication system), the device is attached aslant with respect to a horizontal plane. The package body H is manufactured by performing resin molding to a lead frame. Since a flexible board FCB which is a flexible wiring board is used for it, the electrical wiring to a passive diode PD and a light emitting diode LED provided within the package body can be easily adapted with respect to such a slant, and the device can be assembled easily. An outer lead part for heat radiation extended from a die pad part is connected to a third wiring pattern, and this functions as a heat sink or a heat conductor to the heat sink.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting and receiving device, and more particularly, to an on-vehicle optical beacon information sending and receiving device used in a VICS (road traffic information communication system).

[0002]

2. Description of the Related Art A conventional on-vehicle optical beacon information transmitting / receiving device is disclosed in Japanese Patent Application Laid-Open No. 10-38991.
This light emitting and receiving device is composed of a plurality of LEDs (light emitting diodes) and P
D (photodiode) is provided on the same circuit board.

[0003]

However, in the above-mentioned light emitting and receiving device, since the LED and PD are provided on the circuit board, the assembly is complicated, and it is necessary to adjust a predetermined angle, and the adjustment itself is very difficult. It was a complicated operation.
The present invention has been made in view of such a problem, and an object of the present invention is to provide a light emitting and receiving device that is easy to assemble.

[0004]

In order to solve the above problems, a light emitting and receiving device according to the present invention comprises a package body formed by resin molding so as to have first and second openings on one side of a lead frame. , A light receiving element and a plurality of infrared light emitting elements respectively mounted on a lead frame in the first and second openings, and a light emitting element lens mounted on the package body so as to close the second opening. And The package body is formed by resin molding so as to have first and second openings. A light receiving element and a plurality of infrared light emitting elements are mounted on a lead frame of the package body. The light receiving element is provided in the first opening and the light emitting element is provided in the second opening. The light emitting element lens is attached to the package body so as to close the second opening. As described above, the light emitting and receiving device of the present invention can be easily assembled.

The light emitting and receiving device according to the present invention comprises a first resin material filled in the first opening and transparent to infrared rays, and a second resin material provided in the second opening and transparent to infrared rays. It is preferable to further provide. The first opening is filled with a first resin material RSN1 to prevent foreign matter from entering the opening. The light emitted from the light emitting element is condensed through the lens so as to have a predetermined directivity and becomes substantially parallel light,
Since it is preferable that the refractive index difference between the lens and the inside of the second opening is relatively large, the inside of the second opening has a small difference in refractive index between the second resin material and the lens. Since it is desired to provide two resin materials, there is no need to reach filling.

The package body has a flexible substrate mounted on the surface thereof, the flexible substrate having a first wiring pattern for extracting output from the light receiving element and a second wiring pattern for supplying driving power to the light emitting element. It is preferable to have When the light emitting and receiving device is used for a VICS, it is attached to be inclined with respect to a horizontal plane. The electrical connection to the light receiving element and the light emitting element provided in the package body is preferably made of a flexible substrate which is a flexible wiring substrate so as to easily adapt to such an inclination.

In such an electrical connection, the flexible substrate has an electrically isolated third wiring pattern, and the lead frame has a plurality of die pad portions to which the light emitting elements are attached, respectively. It is preferable that the outer lead portion of the lead extending from at least one of the above is connected to the third wiring pattern.

Since the light emitting element generates heat, the light emitting and receiving device according to the present invention preferably has a heat radiating plate attached to the back surface of the flexible substrate so as to face the package body. Since the heat from the package body is transmitted to the radiator plate via the flexible substrate, the heat storage of the package body can be suppressed.

When the apparatus is mounted on a vehicle, it is preferable that the apparatus further includes a support for supporting the heat sink so that the surface of the heat sink faces obliquely upward with respect to the horizontal. By performing the step of attaching the heat radiating plate to the support portion, this can easily function as a light emitting and receiving device for VICS.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light emitting and receiving device according to an embodiment of the present invention will be described together with a manufacturing method. The same elements or elements having the same functions will be denoted by the same reference symbols, without redundant description.

FIG. 1 is an exploded perspective view of the main part of the light emitting and receiving device, FIG. 2 is a plan view of the main part of the light emitting and receiving device, FIG. 3 is a front view of the main part of the light emitting and receiving device, and FIG. FIG.

The light emitting and receiving unit 1 constituting a main part of the light emitting and receiving device is composed of rigid plate-like conductors 1D, 2D, 3D,
4D, 5D, 6D, 7D, 8D, 10D, 11D, 1
F, 2F, 3F, 4F, 5F, 6F, 7F, 8F, 10
F, 11F, 12F, 1B, 2B, 3B, 4B, 5B,
6B, 7B, 8B, 10B, 11B, 12B, 9, 13
A package main body H formed by resin molding so as to have first and second openings 1op and 2op on one surface side (upper surface side) of a lead frame composed of the first and second openings 1op and 2op.
A light receiving element PD (Si photodiode) and a plurality of infrared light emitting elements LED1, LED2, LED3, and LED respectively mounted on the lead frame in 2op
4, LED5, LED6 (light emitting diode), and a light emitting element lens L attached to the package body H so as to close the second opening 2op.

The package body H has first and second openings 1o.
It is resin-molded so as to have p and 2op. As a resin material forming the package body H, a heat-resistant resin such as PPS, a liquid crystal polymer, an epoxy resin, or the like is used. A partition I is provided between the first opening 1op and the second opening 2op.
W is provided.

A light receiving element PD and a plurality of infrared light emitting elements LED1, LED are mounted on a lead frame of a package body H.
2, LED3, LED4, LED5, and LED6 are mounted, and the light receiving element PD is provided in the first opening 1op in the light emitting elements LED1, LED2, LED3, LED4, and LED5.
The LED 6 is provided in the second opening 2op. The light emitting element lens L is attached to the package body H so as to close the second opening 2op.

Here, the lead frame will be described.

The lead frame comprises a pair of front and rear outer lead portions 1F, 1B, 2F, 2B, 3F,
3B, 4F, 4B, 5F, 5B, 6F, 6B, 7F, 7
B, 8F, 8B, 10F, 10B, 11F, 11B, 1
2F and 12B are provided.

The outer lead portions 1F, 1B, 2F, 2B,
Die pad portions 1D, 2D, 3D, 4D, 5D, 6D to which elements are connected by die bonding are connected between 3F, 3B, 4F, 4B, 5F, 5B, 6F, 6B, and outer lead portions 7F, 7B, Bonding lead portions 7D, 8D, and 10D to which bonding wires are connected are connected between 8F, 8B, 10F, and 10B, and die pad portions 11D are connected to outer lead portions 11F, 11B, 12F, and 12B.
Is connected. In the present embodiment, an example in which the outer lead portions 9 and 13 extending in the left-right direction are connected to the bonding lead portion 8D and the die pad portion 11D, however, the outer lead portions 9 and 13 are not necessarily connected to the bonding lead portion and the die pad portion 11D. It does not have to be connected to the die pad. The region of the lead frame between the outer lead portion and the die pad portion is an inner lead portion.

In the initial stage of manufacturing, the lead frame is formed including a frame made of a plate-like conductor for connecting the ends of the outer lead portions, but this is removed after each element is attached.

If the die bonding is described in detail, the light emitting elements LED1, LED2, LED3, LED4, LE
One of the anode and the cathode in D5 and LED6 is a die pad portion 1D, 2D, 3D,
It is attached to 4D, 5D, 6D, and one of the anode and cathode of the light receiving element PD is attached to the die pad 11D. The die pad portions 3D and 4D are continuous,
It functions as a common electrode. Light emitting element LED1, LE
The other of the anode and cathode of D2, LED3, LED4, LED5, and LED6 is connected to the adjacent die pad portion 8.
D, 1D, 2D, 5D, 6D, and 7D are connected via bonding wires. The other of the anode and the cathode of the light receiving element PD is connected to the die pad portion 10D via a bonding wire.

After resin molding such as insert molding, each element is attached to the lead frame as described above, and then the first resin material R that is transparent to infrared rays is placed in the first opening 1op.
A second resin material R filled with SN1 and transparent to infrared rays
SN2 is coated on the bottom surface in the second opening 2op. That is, the present light emitting and receiving device includes a first resin material RSN1 filled in the first opening 1op and transparent to infrared rays, and a second opening 2op.
The second resin material R provided in the op and transparent to infrared rays
SN2 (see FIG. 5). The first and second resin materials RSN1 and RSN2 may be the same material,
For example, these are made of heat-resistant, flexible resin such as silicone resin.

More specifically, the first resin material RSN is provided in the first opening 1op in order to prevent foreign matter from entering the opening.
1 is filled. The light emitted from the light emitting element LED is condensed through the lens L so as to have a predetermined directivity and becomes substantially parallel light, but the refractive index difference between the lens L and the inside of the second opening 2op is relatively large. Is preferable, the inside of the second opening 2o
In p, the second resin material RSN2 is provided so that air having a small refractive index is interposed between the second resin material RSN2 and the lens L. This only needs to be a coating and need not lead to filling.

The die pad on which the light emitting element is provided will be described in detail. Each light emitting element LED1, LED2, LED
Since the functional structures of the die pads of LED3, LED4, LED5, and LED6 are the same, the light emitting element LED1 is used here.
Will be described only.

FIG. 5 is a longitudinal sectional view of the vicinity of the light emitting diode LED1. The light emitting diode LED1 is attached to the center of a concave portion provided in the die pad portion 1D. This concave portion has a circular bottom surface RF1 having a surface parallel to the flat portion FLT constituting the concave portion peripheral region, and an inner surface RF2 formed of a conical surface connecting between the outer periphery of the bottom surface RF1 and the flat portion FLT. , In a mortar shape. Inner surface R
F2 may be curved outward even in a cross section perpendicular to the bottom surface RF1, in which case the recess forms a cup shape. For example, the cup shape is set to an outer shape of 1.3 mm, an inner diameter of 0.61 mm, and a depth of 0.3 mm, and the distance between the recesses is set to 2.9 mm. The bottom surface RF1 and the inner surface RF2 constitute a reflecting mirror, and reflect light from the light emitting element leaking to the side surface toward the surface. That is, the lead frame is made of a material containing copper, and its surface is plated with a metal having high reflectivity, such as Au, Pd, Al, or Ag.

Next, the lens L will be described.

FIG. 6 is a front view of the lens L. Lens L
Has an outer surface Lo located outside the package body H and an inner surface Li located inside. Outer surface L
Reference symbol o denotes a semi-cylindrical lens (cylindrical lens) that forms a straight line whose center of curvature coincides with the longitudinal direction (width direction) of the package body H. Package body H
Of the light emitting elements LED1 to LED6 coincides with the arrangement direction of the light emitting elements LED1 to LED6. The inner surface Li is in the longitudinal direction and the opening 2
A plurality of cylindrical lenses which coincide with directions (front-back direction) perpendicular to both of the depth direction of the op and have a plurality of line segments arranged in the longitudinal direction and each having a center of curvature are formed.

The emitted lights from the light emitting elements LED1 to LED6 are condensed in the width direction and the front-back direction by the cylindrical lenses Li and Lo, respectively. The directivity in the width direction of the light emitted from the light emitting and receiving unit 1 is ± 2.
The directivity in the front-back direction is set to ± 10 °. When the unit 1 is mounted on a vehicle, the light emission direction is inclined from the horizontal plane by an angle α (45 °). Therefore, the directivity in the front-rear direction is determined by setting the angle α from the horizontal plane to the reference ray. Is set as the elevation angle.

The maximum distance between the surface of the outer cylindrical lens Lo and the flat portion FLT of the lead frame is, for example, 4.5 mm, and the cylindrical lens Lo is
Is set to 3.1 mm. The surface of the inner cylindrical lens Li and the flat part FLT of the lead frame
Is set to 1.3 mm, for example, and the radius of curvature of the cylindrical lens Li is set to 3 mm.

Incidentally, the cylindrical lens may be an aspherical or spherical lens.

At the end of the lens L on the light receiving element PD side, an engaging portion LFR protruding along the longitudinal direction is integrally formed, and this is a vertical section provided on the partition wall IW of the package body H. The lens L is fitted into the L-shaped engaging portion HFR, and regulates the positioning of the lens L with respect to the package body H in the longitudinal direction and the relative movement in the longitudinal direction (movement on the light receiving element PD side).

At the end of the lens L opposite to the light receiving element PD, an engaging portion LFB protruding along the thickness direction is integrally formed, and this is formed on the opposite side of the package body H from the light receiving element PD. In contact with the side surface, positioning of the lens L with respect to the package body H in the longitudinal direction and regulation of relative movement in the longitudinal direction are performed. The engaging portion LFB is provided with a through hole LTH extending in the longitudinal direction, and the projecting portion HFL protruding in the longitudinal direction from the side surface of the package body H.
(See FIG. 3) fits into the through hole LTH, and regulates the positioning of the lens L in the front-rear direction with respect to the package body H and the relative movement in the front-rear direction. The engagement portion LFB may have a slit extending along the depth direction or a concave portion extending from the inside to the outside, instead of the through hole LTH.

Next, the electrical connection of the light emitting elements LED will be described.

FIG. 7 is a circuit diagram of the light emitting element LED in the light emitting and receiving unit 1. Note that the relationship between the anode and the cathode of the light emitting element LED may be opposite to that shown in the figure. Between the common electrode 4D and the left end electrode 8D, 3
The three diodes LED3, LED2, and LED1 are sequentially connected in series, and three diodes LED4, LED5, and LED6 are provided between the common electrode 4D and the right end electrode 7D.
Are sequentially connected in series, and these are given a forward bias. These series diodes are in a parallel relationship. Since the rising voltage of the diode is about 1.2 V, one series diode group can operate at about 3.6 V. Even when this device is mounted on a vehicle, a sufficient drive current is supplied to the light emitting element. be able to. The outer lead portions 8B, 4B, and 7B are connected to a bias power supply, but the other outer lead portions are electrically isolated. These outer lead portions function as a heat sink or a heat conductor for conducting heat to the heat sink, and dissipate heat generated in the light emitting element LED.

Next, the electrical connection of the light receiving element PD will be described.

FIG. 8 is a circuit diagram of the light receiving element PD in the light emitting and receiving unit 1. Note that the relationship between the anode and the cathode of the light receiving element PD may be opposite to that shown in the figure. The light receiving element PD has outer lead portions 10B and 1
A reverse bias is applied via 1B.

Next, the wiring in the light emitting and receiving device will be described together with the light emitting and receiving device including the peripheral portion.

FIG. 9 is a plan view of the light emitting and receiving device including the peripheral portion, and FIG. 10 is a front view of the light emitting and receiving device. In the present light emitting and receiving device, the package body H includes a flexible substrate FCB mounted on the surface thereof, and the flexible substrate FCB is a first substrate for extracting an output from the light receiving element PD.
Wiring patterns 10BL, 11BL and light emitting element LED1
To supply the driving power to the LEDs 6. When the light emitting and receiving device is used for a VICS, it is attached to be inclined with respect to a horizontal plane. Since the present device uses the flexible printed circuit board FCB, which is a flexible wiring board, the electrical connection to the light receiving element PD and the light emitting element LED provided in the package main body H is easy against such an inclination. Can adapt to

In such an electrical connection, the flexible substrate FCB is provided with the electrically isolated third wiring patterns 1BL, 2BL, 3BL, 5BL, 6BL, 12B.
L, 1FL, 2FL, 3FL, 4FL, 5FL, 6F
L, 7FL, 8FL, 10FL, 11FL, and 12FL. Although the lead frame includes a plurality of die pad portions to which the light emitting elements LED are attached,
Outer lead portions (radiation outer lead portions) of leads extending from at least one of the die pad portions (for example, 1D) are connected to the third wiring pattern (for example, 1BL). The heat generated inside the package body H via the outer lead portions for heat dissipation is transmitted to the heat sink or the third wiring pattern functioning as a heat conductor to the heat sink.

Since the light emitting element LED generates heat, the present light emitting and receiving device has a heat radiating plate HS attached to the back surface of the flexible substrate FCB so as to face the package body.
Heat from the package body H is transferred to the flexible substrate FCB
The heat is transmitted to the heat radiating plate HB via the fins, so that the heat storage of the package body H can be suppressed. Note that the third wiring pattern may be thermally connected directly to the heat sink HS. That is, the third wiring pattern may partially penetrate the flexible substrate FCB in the thickness direction so as to be exposed on the back surface side of the flexible substrate FCB. It may be made to reach the back side of the FCB.

Next, a case where the present light emitting and receiving device is mounted on a vehicle will be described.

FIG. 11 is a side view of the light emitting and receiving device including the supporting portion. When the present device is mounted on a vehicle, the present device further includes a support portion SPT that supports the heat sink HS so that the surface of the heat sink HS faces obliquely upward with respect to the horizontal (elevation angle α). The support portion SPT has a slit SLT extending at an angle α with respect to the vertical line, and the slit SLT
By inserting the flat heat sink HS into the inside, the light emitting direction has an angle α with respect to the horizontal plane.
The supporting portion SPT has a fixing portion FIX for fixing the device to a position where the light emitting and receiving device in the vehicle is mounted, and a standing portion STD standing upright from the fixing portion FIX.
LT is formed in the standing portion STD. In this device,
By performing the step of attaching the heat sink HS to the support portion SPT, this can easily function as a light emitting and receiving device for VICS.

As a modification of the light emitting and receiving device shown in FIG. 1, a lens may be arranged on the light receiving element PD.

FIG. 12 is a perspective view of the main part of such a light emitting and receiving device, FIG. 13 is a plan view of the main part of the light emitting device, FIG. 14 is a front view of the main part of the light emitting device, and FIG. It is a right view of a part.

The light-emitting element lens L is integrally provided with a light-receiving element lens L ', and the light-receiving element lens L' covers the opening 1op. On the right end side of the lens L ', a left end side engaging portion LF of the lens L shown in FIG.
L, HFL and engaging portion LF having the same structure as through hole LTH
R ′, HFR ′ and a through hole LTH are provided to fix and position the lens.

The outer surface Lo 'of the lens L' forms a cylindrical lens whose center of curvature is a line segment parallel to the longitudinal direction (light emitting element arrangement direction). The inner surface Lo 'of the lens L' is parallel to the light receiving surface of the light receiving element PD and flat.

The radius of curvature of the light receiving element side cylindrical lens Lo 'is larger than the radius of curvature of the light emitting element side cylindrical lens Lo. The area of the light receiving surface of the light receiving element PD is
It is smaller than the cross-sectional area perpendicular to the depth direction of the light receiving element opening 1op. Since the light incident on the light receiving element PD is collected by the lens L 'in a direction (front-back direction) perpendicular to both the longitudinal direction and the depth direction, the amount of light incident on the light receiving element PD is increased. Can be. Note that, with the installation of the lens L ', the thickness of the transparent resin material filled in the opening 1op is reduced.

The light emitting element lens L and the light receiving element lens L ′ are integrally formed, but their boundary is located on the partition wall IW, and the inner surface of the lens at the boundary is erected in the thickness direction. A concave groove is formed so as to fit into the upper end of the partition IW.

The light emitted from the light emitting element LED is shown in FIG.
The lateral progression is suppressed by the reflection by the concave reflecting mirror RF2 and the shielding by the partition wall IW shown in FIG. That is, light emitted from the light emitting element LED is unlikely to be incident on the light receiving element PD arranged on the horizontal extension line. In this example, since the boundary is provided between the integrally formed lenses L and L ', the light transmission efficiency in the lateral direction with the lens interposed is reduced, and the optical link between the light emitting element LED and the light receiving element PD is further increased. Can be suppressed.

[0048]

As described above, the light emitting and receiving device of the present invention can be easily assembled.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a main part of a light emitting and receiving device.

FIG. 2 is a plan view of a main part of the light emitting and receiving device.

FIG. 3 is a front view of a main part of the light emitting and receiving device.

FIG. 4 is a right side view of a main part of the light emitting and receiving device.

FIG. 5 is a longitudinal sectional view of a portion near the light emitting diode LED1.

FIG. 6 is a front view of a lens L.

FIG. 7 is a circuit diagram of a light emitting element LED in the light emitting and receiving unit 1.

FIG. 8 is a circuit diagram of a light receiving element PD in the light emitting and receiving unit 1.

FIG. 9 is a plan view of the light emitting and receiving device including a peripheral portion.

FIG. 10 is a front view of the light emitting and receiving device including a peripheral portion.

FIG. 11 is a side view of the light emitting and receiving device including a support portion.

FIG. 12 is a perspective view of a main part of the light emitting and receiving device.

FIG. 13 is a plan view of a main part of the light emitting device.

FIG. 14 is a front view of a main part of the light emitting device.

FIG. 15 is a right side view of a main part of the light emitting device.

[Explanation of symbols]

LED: light emitting element, PD: light receiving element, L: lens, FC
B: Flexible board, HS: Heat sink, SPT: Support, H: Package body.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA01 CA21 DA01 EA10 EC04 EC05 EC11 ED04 FA03 GA01 5F041 DA07 DA13 DA17 DA26 DA83 DC03 DC04 DC10 DC25 EE16 FF16 5F088 EA09 JA02 JA07 JA10 JA12 JA18 5F089 AA05 AC21 AC21

Claims (6)

[Claims] 1. A package body formed by resin molding so as to have first and second openings on one surface side of a lead frame, and a light receiving unit mounted on the lead frame in the first and second openings, respectively. A light emitting and receiving device comprising: an element, a plurality of infrared light emitting elements, and a light emitting element lens attached to the package body so as to close the second opening. 2. The method according to claim 1, further comprising a first resin material filled in the first opening and transparent to infrared rays, and a second resin material provided in the second opening and transparent to infrared rays. The light emitting and receiving device according to claim 1, wherein 3. The package body includes a flexible substrate mounted on a surface of the package body, wherein the flexible substrate is used to supply an output from the light receiving element to a first wiring pattern and to supply driving power to the light emitting element. The light emitting and receiving device according to claim 1, further comprising a second wiring pattern. 4. The flexible substrate has a third wiring pattern that is electrically isolated, the lead frame includes a plurality of die pad portions to which the light emitting elements are attached, and at least one of the die pad portions. The light emitting and receiving device according to claim 3, wherein an outer lead portion of a lead extending from one of the leads is connected to the third wiring pattern. 5. The light emitting and receiving device according to claim 4, further comprising a heat radiating plate attached to a back surface of the flexible substrate so as to face the package body. 6. A support portion for supporting the heat sink so that a surface of the heat sink faces obliquely upward with respect to the horizontal when mounted on a vehicle.
3. The light emitting and receiving device according to claim 1.