JP2001049465A - Thick film pattern forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thick film pattern forming method to transfer a barrier of a back plate for a plasma display panel large in area, high in precision and satisfactory in quality. SOLUTION: In this thick film pattern forming method using a transfer slab to fill a stock 120 for transfer into a recessed part of a specified shape to meet the shape for transfer, and press the stock against an objective medium (a work) 130, the stock for transfer of the thick film pattern is filled in the recessed part of the transfer slab, a plastic layer is provided between the stock for transfer filled in the recessed part and the medium, and the stock for transfer filled in the recessed part and the medium are pressed and adhered against each other via the plastic layer 140. Then, at least the pressed transfer slab part and the medium part are separated from each other, and the stock for transfer is transferred to the medium from the recessed part of the transfer slab via the plastic layer to form the thick film pattern on the medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for forming a thick film pattern.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter, also referred to as PDPs) have been used in various display devices because of their small depth, light weight, clear display, and wide viewing angle compared to liquid crystal panels. It is being used.
Generally, a plasma display panel (PDP) has two
A pair of regularly arranged electrodes are provided on a pair of opposed glass substrates, and a gas mainly containing neon, xenon, or the like is sealed between the pair of electrodes. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed. In particular, in order to display information, regularly arranged cells are selectively discharged to emit light.

Here, the structure of a PDP is shown in FIG.
An example of a C-type PDP will be described. Figure 10 shows PD
Although it is a perspective view of the P configuration, the front plate (glass substrate 610) and the back plate (glass substrate 620) are shown apart from actuality for easy understanding. As shown in FIG. 10, two glass substrates 610 and 620 are provided in parallel and opposed to each other, and both are glass substrates 620 serving as a back plate.
Barriers (also referred to as cell barriers or ribs) 630 provided above in parallel with each other keep the cells at a fixed interval. On the back plate side of the glass substrate 610 serving as one front plate, composite electrodes composed of a transparent electrode 640 serving as a discharge sustaining electrode and a metal electrode 650 serving as a bus electrode are formed in parallel with each other. A dielectric layer 660 is formed, and a protective layer (MgO layer) 670 is further formed thereon. An address electrode 680 is formed on the front plate side of the glass substrate 620 serving as a back plate, between the barriers 630 so as to be orthogonal to the composite electrode, and in parallel with each other. Fluorescent surface 690 is provided so as to cover. The barrier 630 is for defining a discharge space, and each partitioned discharge space is called a cell or a unit light emitting region. This AC type PDP is of a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on the front panel to cause discharge. In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. The ultraviolet light generated by this discharge causes the phosphor 690 to emit light.
And the light transmitted through the front plate can be visually recognized by an observer. The DC PDP differs from the AC PDP in that the electrodes have a structure that is not coated with a dielectric layer, but the discharge effect is the same. 10 has a structure in which a base layer 667 is provided on one surface of a glass substrate 620 and a dielectric layer 665 is provided thereon, but the base layer 667 and the dielectric layer 665 are not necessarily required. .

[0004] As a method of forming a barrier on the glass substrate 620, a printing method or a sandblasting method has conventionally been adopted. In the case of the printing method, a paste for forming a barrier is printed in a predetermined pattern on a glass substrate by a thick-film printing method, and dried. The thickness of the barrier is large (for example, 100 to 200 μm).
This thickness cannot be obtained by one thick-film printing, so that printing and drying of the barrier-forming paste are performed a plurality of times. After a predetermined film thickness is obtained, the paste is fired. In the case of the sand blast method, a barrier forming material is applied on a glass substrate, a predetermined resist pattern is further formed thereon, and then polishing sand is sprayed to process the barrier forming material into a shape corresponding to the resist pattern. Is fired to form a barrier. However, in the case of the printing method, there is a problem that the printing is performed a plurality of times, which is troublesome, and the shape of the formed barrier cannot be obtained uniformly. There is a problem that it is difficult to maintain a uniform cutting property, a problem of dust, and a difficulty in maintaining a processing device and a processing member (such as abrasive sand).

[0005]

Under these circumstances, a large-area, high-definition device, such as a barrier for a back panel for a PDP, can be formed with a satisfactory quality and can be formed easily. There was a need for a way to do it. The present invention is directed to a method of forming a thick film pattern by transfer-forming a large-area, high-definition object such as a barrier of a back plate for a plasma display panel so that the quality can be satisfied. It is intended to provide.

[0006]

According to the method of forming a thick film pattern of the present invention, a transfer material is filled in a concave portion having a predetermined shape corresponding to a shape to be transferred and formed. A method for forming a thick film pattern using a transfer plate that is pressed onto an object) and transferred, wherein a concave portion of the transfer plate is filled with a material for transferring a thick film pattern, and the concave portion is filled with a transfer material. A plastic layer is provided between the material and the medium, and after the transfer material and the medium filled in the recesses are pressure-bonded through the plastic layer, at least, a transfer plate portion that is pressed and a medium portion that is pressed. , And the transfer material is transferred from the concave portion of the transfer plate to the medium via the plastic layer to form a thick film pattern on the medium. And in the above, the plastic layer is
It is supplied in the form of a sheet, is laminated on the medium side or the transfer plate side filled with the transfer material, and is provided between the transfer plate and the medium. Further, in the above, the plastic layer is characterized in that it is provided between the transfer plate and the medium by printing or coating on a medium or a transfer plate filled with a transfer material.

Further, in the above, the medium is a back plate for a plasma display panel, the thick film pattern is a barrier portion, and the plastic layer is a dielectric layer. The plastic layer is plastically deformed by the close contact pressure between the transfer plate filled with the transfer material and the medium, and 5 to 5 parts of the transfer plate or the medium filled with the transfer material.
It is characterized by following irregularities of 0 μm.

Further, the plastic layer is characterized in that it has tackiness, and the plastic layer is characterized in that it has tackiness. Further, in the above, the transfer material does not contain a solvent.
The tackiness is one of the main properties of the pressure-sensitive adhesive, and refers to the property of adhering to an adherend in a short time with a light force.

Further, in the above, the transfer material has curability to be cured by energy such as light, and after the transfer material filled in the concave portion is cured by energy such as light, the plastic layer is cured. The transfer material is transferred to the medium mainly by the action of the adhesive force of the plastic layer. Further, in the above, the transfer material is a material having curability that is cured by energy such as light, and in a state where the transfer material and the medium filled in the concave portion are pressure-bonded through the plastic layer, It is characterized in that a curing treatment for curing the transfer material with energy is performed. Alternatively, in the above, the transfer material has curability to be cured by energy such as light, and after the transfer material filled in the concave portion is cured by energy such as light, the material is transferred through the plastic layer. In this state, the transfer material is cured again by energy such as light in a state where the transfer material is pressed against the medium, and the transfer material is transferred to the medium. The plastic layer has a curability that is cured by energy such as light. The plastic layer is cured by energy such as light in a state where the plastic layer is pressed against the medium via the plastic layer, and the (transfer material) And the plastic layer are integrated, and the transfer material is transferred to a medium. Further, in the above, the material for transfer is characterized by being cured by energy such as light and contracting in volume by 0.01 to 10%.

The plastic layer referred to here is plastically deformed by the contact pressure between the transfer plate filled with the transfer material and the medium,
It follows the unevenness of 5 to 50 μm of the transfer plate or medium filled with the transfer material. As a result, when the transfer plate is filled with the transfer material, it follows micro (local) irregularities such as filling pits, and macro irregularities such as transfer plate thickness unevenness and medium thickness unevenness, It enables perfect contact between the transfer plate and the medium, and enhances the transfer accuracy of thick film patterns.

[0011]

According to the method of forming a thick film pattern of the present invention, a large-area, high-definition device such as a barrier of a back plate for a PDP can be satisfied in quality by adopting such a structure. In addition, it is possible to provide a method for forming a thick film pattern which enables transfer formation on a target medium.
Specifically, a transfer plate is used in which a transfer material is filled in a concave portion having a predetermined shape corresponding to a shape to be formed by transfer, and is pressed and transferred onto a target medium (object). A method of forming a thick film pattern, wherein a concave portion of a transfer plate is filled with a material for transferring a thick film pattern, a plastic layer is provided between the transfer material filled in the concave portion and a medium, and the concave portion is filled. After pressing the transferred transfer material and the medium through the plastic layer, at least separating the pressed transfer plate portion and the pressed medium portion, the transfer material is removed from the concave portion of the transfer plate by the medium. By transferring through a plastic layer to form a thick film pattern on the medium,
This has been achieved. In other words, the transfer plate can be manufactured with a large area and high definition by applying the photolithography method, etc., and the transfer material can be formed in the concave portion of the transfer plate with a large area and high definition, and By transferring the transfer material from the transfer plate to the medium via the plastic layer, the transfer can be reliably performed.

As a method for forming the plastic layer, a method in which a sheet is supplied and laminated on a medium side or a transfer plate side filled with a transfer material and provided between the transfer plate and the medium, Or a method in which a transfer plate filled with a transfer material is printed or coated and provided between the transfer plate and a medium as a method suitable for mass production.

The present invention can also be applied to a case where the medium is a back plate for a plasma display panel and the thick film pattern to be formed is a barrier portion. In particular, it is effective if the plastic layer is a dielectric layer. In this case, the plastic layer is plastically deformed by the contact pressure of the transfer plate and the medium, and follows the unevenness of 5 to 50 μm, so that the variation in the filling of the transfer material for forming the barrier of the transfer plate can be absorbed. In addition, variations in the concave portions of the transfer plate and variations in the flatness of the back plate can be sufficiently coped with.

The transferability can be facilitated by the plastic layer having tackiness. In particular, the workability can be easily improved by the plastic layer having tackiness. . Further, the transfer material has a curability that is cured by energy such as light, and after the transfer material filled in the concave portion is cured by energy such as light, the material is pressed against the medium via a plastic layer. By transferring the transfer material to the medium mainly by the action of the adhesive force of the plastic layer, or in a state where the transfer material filled in the concave portion and the medium are press-bonded through the plastic layer, the energy of light or the like is increased. By applying a curing treatment to cure the transfer material by curing, or alternatively, after the transfer material filled in the concave portion is cured by energy such as light, and then pressed again with the medium via the plastic layer, again By hardening the transfer material with energy such as light and transferring the transfer material to a medium, the transfer can be reliably performed. Furthermore, the plastic layer has a curability that is cured by energy such as light, and in a state where the plastic layer is pressed against the medium via the plastic layer, the plastic layer is cured with energy such as light, and the transfer material and the plastic layer are cured. And transferring the transfer material to the medium, thereby enabling more reliable transfer. In particular, when the transfer material is cured by energy such as light and undergoes volume contraction of 0.01 to 10%, the transfer material is easily removed from the concave portion of the transfer plate, and the transfer property is further improved. Can be good. In addition, since the transfer material does not contain a solvent, it is possible to shorten the process without filling the concave portion of the transfer plate with the transfer material and then drying it.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a process cross-sectional view of a first example of an embodiment of a method of forming a thick film pattern according to the present invention, and FIG. 2 is a schematic cross-sectional view for explaining a method of filling a concave portion of a transfer plate with a transfer material. 3 is a cross-sectional view showing a method for forming a plastic layer on a medium, FIG. 4 is a cross-sectional view showing how a transfer plate and a medium are in close contact with each other, and FIG. FIG. 6 is a schematic view showing a form of a transfer plate, and FIG. 7 is a sectional view showing a method of forming a thick film pattern according to a fourth embodiment of the present invention. FIG. 8 is a cross-sectional view for explaining a fifth example of the embodiment, and FIG. 9 is a process diagram showing one example of a method for manufacturing a transfer plate. 11 is a process sectional view for explaining a second example of the embodiment of the method for forming a thick film pattern according to the present invention,
FIG. 12 is a process sectional view for describing a third example of the embodiment. 1 to 8, 11 and 12, 110 is a transfer plate, 115 is a recess, 120 is a transfer material, and 120 </ b> A.
Is a barrier, 130 is a medium (an object to be transferred), 140 is a plastic layer, 140A is a material for a plastic layer, 150 is ultraviolet light (UV light), 160 and 165 are squeegees, 170 is a (pressing) roll, and 180 is an elasticity. ) Spacer, 185 is a (pressing) roll, 190 is a rotating cam, 210 is a transfer plate,
215 is a recess (groove), 220 and 225 are squeegees, 23
0 is a light source, 235 is a mirror, 240 is a transfer material supply roll, and 250 is a transfer material container.

First, a first embodiment of the method for forming a thick film pattern according to the present invention will be described with reference to FIG. This example is an example of a method of forming a barrier on a back plate for a PDP using a flat transfer plate. In the case where a transparent glass substrate is used as a medium and an ultraviolet curing type material is used as a transfer material. It is an example. A material for transfer, which is a material for forming a barrier, is filled in a concave portion of a transfer plate having a predetermined shape corresponding to a shape to be transferred, and is pressed onto a back plate for PDP to transfer the thick film pattern. It is a forming method. In brief, the transfer plate is filled with a transfer material for a thick film pattern in the concave portion of the transfer plate, the transfer material filling side is set to the medium side, and a plastic layer is provided between the transfer plate and the medium. Then, the transfer plate and the medium are separated from each other, and then the transfer material of the thick film pattern is transferred from the transfer plate to the medium via the plastic layer, and the thick film pattern is transferred onto the medium. To form. First, a transfer plate 110 is prepared (FIG. 1A),
Is filled with a transfer material 120. As the transfer plate, a transfer plate (30 in FIG. 9) manufactured in a step shown in FIG.
0) etc. can be used. As shown in FIG. 2, the filling of the concave material 115 with the transfer material is performed by moving the squeegee 160 in the direction of the arrow while scraping off the transfer material 120 attached to the portion other than the concave portion 115 with the squeegee 160.
Only the concave portions 115 are filled with the transfer material 120. (Figure 1
(B)) Next, the transfer plate 110 is filled with the transfer material 120 on the medium 130 side, and a plastic layer 140 is provided between the transfer plate 110 and the medium 130.
After pressing 0, ultraviolet rays 150 are exposed to cure the filled transfer material 120 for barrier formation. (Figure 1
(C)) The pressure bonding between the transfer plate 110 and the medium 130 is performed, for example, as shown in FIG.
As shown in (a), the plastic layer 1 supplied in sheet form
3 is laminated on the medium 130 side as a back plate using a (pressing) roll 170, or FIG.
As shown in (b), the transfer plate 1 is applied to the medium 130 as a back plate by a squeegee 165 and dried.
10 and the medium 130 are pressed. Of course, before crimping,
The plastic layer 140 is placed on the transfer plate side as shown in FIG.
It may be formed using the method shown in FIG.

As shown in FIG. 4 (a), the transfer plate 110 and the medium 130 are pressure-bonded by sealing the transfer plate 110 and the medium 130 with a spacer 180, evacuating the space under reduced pressure, and reducing the pressure between the two. Transfer plate 110 and media 1
30 and a (pressing) roll 185
And a method of sufficiently pressing the transfer plate 110 and the medium 130 in close contact with each other.

After the transfer material 120 for forming the barrier is cured, the transfer plate 110 and the medium 130 are separated from each other, and the transfer material is transferred from the transfer plate 110 to the medium 130 by the plastic layer 14.
0 through the barrier 120A which is a thick film pattern.
Is formed on the medium 130. (FIG. 1D) The separation between the transfer plate 110 and the medium 130 is performed by, for example, forming a gap between the transfer plate 110 and the medium 130 by using a (rotating) cam 190 as shown in FIG. It can be performed using atmospheric pressure.

Although the transfer material 120 of this embodiment is of an ultraviolet curable type, the transfer material may be appropriately selected and cured by other energy. As the transfer material 120, a material that undergoes volume shrinkage of 0.01 to 10% upon curing is particularly preferable from the viewpoint of transferability. As the transfer material 120, a material containing no solvent may be used.
After filling the transfer material 120 into the recesses 115 of No. 0, drying is not required, and the process can be shortened, which is preferable. Specifically, as described later, a material containing at least an inorganic component containing a glass frit and an organic component that can be removed by firing can be applied.

In the case of this embodiment, the plastic layer 140 is a dielectric layer, and is a transfer material 120 for forming a barrier of the transfer plate 110.
And the transfer plate 110
The plastic layer 140 is plastically deformed by the adhesion pressure between the transfer plate and the medium and can follow the unevenness of 5 to 50 μm in order to sufficiently cope with the unevenness of the concave portion and the unevenness of the flatness of the back plate. Choose as appropriate. The plastic layer 140
From the viewpoint of transferability and workability, those having tackiness are good, and those having tackiness are particularly preferable. Specifically, as will be described later, those containing at least an inorganic component containing a glass frit, an organic component that can be removed by firing, and a transfer imparting agent can be applied.

Hereinafter, the transfer material 120 will be described.
As the transfer material 120, a material containing at least an inorganic component (1) containing a glass frit and an organic component (2) that can be removed by firing, as described below, can be applied. (1) Inorganic component As the above glass frit, for example, the softening temperature is 3
50 to 650 ° C., and the coefficient of thermal expansion α ₃₀₀ is 60 × 10
^A glass frit having a temperature of ^{−7 to} 100 × 10 ⁻⁷ / ° C. can be used. Glass frit softening temperature 650 ℃
If the temperature exceeds the above, it is necessary to increase the firing temperature. For example, if the heat resistance of the pattern formation target is low, thermal deformation occurs in the firing step, which is not preferable. On the other hand, if the softening temperature of the glass frit is lower than 350 ° C., the glass frit is fused before the organic components are completely decomposed and volatilized and removed by baking, which is not preferable because voids are easily formed. Furthermore, the matte expansion coefficient α ₃₀₀ of the glass frit is 60 × 10
^{If it is} less than ^-7 / ° C or more than 100 × ^10-7 / ° C, the difference from the coefficient of thermal expansion of the pattern-formed body may become too large, causing distortion and the like, which is not preferable. The average particle size of such a glass frit is 0.1 to
A range of 10 μm is preferred. As such a glass frit, for example, a glass frit containing Bi ₂ O ₃ , ZnO or PbO as a main component can be used.

The transfer material 120 is made of an inorganic powder such as aluminum oxide, boron oxide, silica, titanium oxide,
Inorganic powders such as magnesium oxide, calcium oxide, strontium oxide, barium oxide, and calcium carbonate can be contained in a range of 30 parts by weight or less based on 100 parts by weight of the glass frit. Such an inorganic powder preferably has an average particle size in the range of 0.1 to 10 μm, and serves as an aggregate to prevent pattern casting during firing and to control the reflectance and the dielectric constant. Things.

Further, in order to reduce external light reflection of the formed pattern, the transfer material 120 may contain a refractory black or white pigment as an inorganic powder. Co-Cr-Fe, C
o-Mn-Fe, Co-Fe-Mn-Al, Co-Ni
-Cr-Fe, Co-Ni-Mn-Cr-Fe, Co-
Ni-Al-Cr-Fe, Co-Mn-Al-Cr-F
e-Si etc. can be mentioned. Examples of the fire-resistant white pigment include titanium oxide, aluminum oxide, silica, and calcium carbonate.

(2) Organic Component A thermoplastic resin can be used as the organic component contained in the transfer material 120 that can be removed by firing.

The thermoplastic resin is contained as a binder for the above-mentioned inorganic component and for the purpose of improving transferability. Examples thereof include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, and the like. n-propyl notacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n- Hexyl acrylate, n-
Hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, n-decyl acrylate, n-decyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate ,
2-hydroxypropyl methacrylate, styrene, α
1 such as methylstyrene, N-vinyl-2-pyrrolidone, etc.
Examples thereof include polymers or copolymers composed of at least two or more species, and cellulose derivatives such as ethyl cellulose.

Particularly, among the above, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl Acrylate, isobutyl methacrylate, tert-butyl acrylate, tert
Preferred is a polymer or copolymer of at least one of -butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, and 2-hydroxypropyl methacrylate, and ethyl cellulose.

The thermoplastic resin has a molecular weight of 10,0.
The range of 00 to 500,000 is preferred.

A photosensitive resin composition can be used as the organic component contained in the transfer material 120 that can be removed by firing.

The photosensitive resin composition contains at least a polymer, a monomer, and an initiator, and does not volatilize and decompose upon firing to leave no carbide in the film after firing. .

As the polymer, methyl acrylate,
Methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-
Butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, te
rt-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, n-decyl Acrylate, n-decyl methacrylate, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, styrene, α
-Methylstyrene, one or more of N-vinyl-2-pyrrolidone, acrylic acid, methacrylic acid, a dimer of acrylic acid (for example, M-5600 manufactured by Toa Gosei Co., Ltd.), 2-methacryloyl succinate Oxyethyl, 2-acryloyloxyethyl succinate, 2-methacryloyloxyethyl phthalate, 2-acryloyloxyethyl phthalate,
2-methacryloyloxyethyl hexahydrophthalate, 2-acryloyloxyethyl hexahydrophthalate, itaconic acid, crotonic acid, maleic acid, fumaric acid,
Examples thereof include vinyl acetic acid, polymers or copolymers of one or more of these acid anhydrides, and carboxyl group-containing cellulose derivatives.

Examples of the copolymer include a polymer obtained by adding an ethylenically unsaturated compound having a glycidyl group or a hydroxyl group to the above copolymer, but the present invention is not limited thereto.

The molecular weight of the above polymer is from 5,000 to
300,000, preferably 30,000 to 150,0
00 range. Further, other polymers such as a methacrylate polymer, a polyvinyl alcohol derivative, an N-methyl-2-pyrrolidone polymer, a cellulose derivative, and a styrene polymer can be mixed with the above-mentioned polymer.

As the reactive monomer constituting the photosensitive resin composition, a compound having at least one polymerizable carbon-carbon unsaturated bond can be used. Specifically, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl Acrylate, isobonyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate,
Phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3
-Propanediol acrylate, 1,4-cyclohexanediol diacrylate, 2.2-dimethylolpropane diacrylate, glycerol diacrylate,
Tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethylene oxide-modified pentaerythritol triacrylate, ethylene oxide-modified pentaerythritol tetra Acrylate, propylene oxide-modified pentaerythritol triacrylate, propylene oxide-modified pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyltrimethylolpropane triacrylate, butylene glycol diacrylate, 1,2,4-butanetriol triacrylate , 2,2,4-trimethyl-1,3
-Pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate,
Pentaerythritol hexaacrylate, and the above acrylate changed to methacrylate, γ-
Methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, and the like. The reactive monomers described above can be used as one kind or a mixture of two or more kinds, or as other compounds.

As the photopolymerization initiator constituting the photosensitive resin composition, benzophenone, methyl 0-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamine) benzophenone,
α-amino-acetophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,2-diethoxyacetophonone, 2,2-dimethoxy-2-phenylacetophenone, -Hydroxy-2-methylpropiophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-
Chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketal, benzylmethoxyethylacetal, benzoinmethylether, benzoinbutylether, anthraquinone, 2-tert-butylanthraquinone, 2-amylanthraquinone, β-chloranthraquinone, anthrone, benzantrone , Dibenzsuberone, methyleneanthrone, 4-azidobenzylacetophenone, 2,6
-Bis (p-azidobenzylidene) cyclohexane,
2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2- (0-methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (0-ethoxycarbonyl) ) Oxime, 1,3-diphenyl-propanetrione-2- (0-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (0-benzoyl) oxime, Michler's ketone, 2-methyl-
[4- <Methylthio) phenyl] -2-morpholino-
1-propane, 2-benzyl-2-dimethylamino-1
-(4-morpholinophenyl) -butanone-1, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, n-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzothiazole disulfide, triphenylphosphine,
Examples include combinations of photoconductive dyes such as camphorquinone, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide, eosin, and methylene blue with reducing agents such as ascorbic acid and triethanolamine. One or more initiators may be used.

The content of the thermoplastic resin or the photosensitive resin composition in the transfer material 120 is in the range of 3 to 50 parts by weight, preferably 5 to 30 parts by weight based on 100 parts by weight of the above-mentioned inorganic component. It can be set with. When the content of the thermoplastic resin or the photosensitive resin composition is less than 3 parts by weight, the shape retention of the transfer material 120 is low, and the reliability of transfer may be impaired. On the other hand, when the content of the thermoplastic resin or the photosensitive resin composition exceeds 50 parts by weight, the organic components cannot be completely removed by firing, and carbides remain in the film after firing, resulting in deterioration in quality. Not preferred.

Further, in the above-mentioned mature plastic comb resin and complete resin composition, additives such as a sensitizer, a polymerization terminator, a chain transfer agent, a leveling agent, a dispersant, a transferability-imparting agent, A stabilizer, an antifoaming agent, a thickener, a suspending agent, a release agent and the like can be contained as required.

The transferability-imparting agent is added for the purpose of improving the transferability and the fluidity of the ink composition. Examples thereof include dimethyl phthalate, dibutyl phthalate and di-n.
Normal alkyl phthalates such as octyl phthalate, phthalic acid esters such as di-2-ethylhexyl phthalate, diisodecyl phthalate, butyl benzyl phthalate, diisononyl phthalate, ethyl phthalyl ethyl glycolate, and butyl phthalyl butyl glycolate; tri-2 -Ethylbexyltrinolate, tri-
trimellitate esters such as n-alkyl trimellitate, triisononyl trimellitate, triisodecyl trinolitate, dimethyl adipate, dibutyl adipate, di-2-ethylhexyl adipate, diisodecyl adipate, dibutyl diglycol adipate, di -2
-Ethylhexyl acetate, dimethyl separate, dibutyl separate, di-2-ethylhexyl separate, di-2-ethylhexyl malate, acetyl-tri- (2-ethylhexyl) citrate, acetyl-tri-n-butyl citrate, acetyl tributyl citrate Aliphatic dibasic acid esters, such as polyethylene glycol benzoate, triethylene glycol
-Ethylhexoate), glycol derivatives such as polyglycol ether, glycerin derivatives such as glycerol triacetate and glycerol diacetyl monolaurate, polyesters composed of sebacic acid, adipic acid, azelaic acid, phthalic acid, etc., having a molecular weight of 300 to 3,000. Low-molecular-weight polyester, low-molecular-weight, poly-α-styrene, low-molecular-weight polystyrene, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, triphenyl phosphate,
Orthophosphates such as tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xyenyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, ricinoleates such as methyl acetyl ricinoleate, poly-1,3
-Polyester / epoxidized esters such as butanediol adipate and epoxidized soybean oil; and acetic esters such as glycerin triacetate and 2-ethylhexyl acetate.

The dispersant and the anti-settling agent are intended to improve the dispersibility and anti-settling property of the above-mentioned inorganic powder, and include, for example, phosphate ester type, silicone type, castor oil ester type and various types. Surfactants and the like, examples of the antifoaming agent include silicone-based, acrylic-based, various surfactants and the like, and examples of the release agent include silicone-based, fluorine oil-based, paraffin-based, and fatty acid-based , Fatty acid ester type, castor oil type, wax type, compound type and the like, and as the leveling agent, for example, fluorine type, silicone type, various surfactants and the like,
Each can be added in an appropriate amount.

Examples of the solvent used together with the thermoplastic resin or the photosensitive resin composition for forming the transfer material 120 include, for example, alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol and propylene glycol. Class, α- or β
Terpenes such as terpineol, ketones such as acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, diethyl ketone, 2-heptanone and 4-heptanone; and aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene. , Cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene Glycol monomethyl ether, glycol ethers such as triethylene glycol monoethyl ether, ethyl acetate, butyl acetate,
Cellosolp Acetate, Ethyl Cellosolp Acetate,
Butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 2-methoxyethyl acetate, cyclohexyl acetate, 2-ethoxyethyl acetate,
Acetates such as 3-methoxybutyl acetate; diethylene glycol dialkyl ether; dipropylene glycol dialkyl ester; ethyl 3-ethoxypropionate; methyl benzoate; N, N-dimethylacetamide; N, N-dimethylformamide; Can be

The plastic layer 140, like the transfer material 120, contains at least an inorganic component including a glass frit and an organic component that can be removed by baking, and requires a transfer imparting agent as an essential component. As the inorganic component contained in the plastic layer 140, for reducing external light reflection, except that a fire-resistant black pigment cannot be used as the inorganic powder, the same inorganic component as the transfer material 120 is used. Can be used. As the plastic layer 140, the same organic material as the transfer material 120 can be used as the organic component contained in the plastic layer 140 and capable of being removed by firing. Although this example is an example of forming a barrier portion on the back plate for PDP, in forming another thick film pattern, the material of the plastic layer is appropriately selected.

Next, an example of a method of forming the transfer plate 110 used in this embodiment will be briefly described with reference to FIG.
The method of forming the transfer plate shown in FIG. 9 simply has a predetermined thickness corresponding to the concave portion to be formed on one surface of the non-conductive base substrate 310 and is adjusted to the pattern of the concave portion. After a predetermined resist pattern is formed by a photolithography method, a conductive thin film is provided on the surface of the base substrate 310 on the side where the resist pattern (corresponding to the cured portion 320A in FIG. 9) is formed. Then, electrolytic plating is performed so as to integrally cover the entire resist pattern, an electrolytic plating layer is formed, and then the electrolytic plating layer and the conductive thin film are separated from the base substrate 310 and the resist pattern formed thereon. This is a method of manufacturing a transfer plate which is peeled to obtain a transfer plate comprising an electrolytic plating layer and a conductive thin film.

First, a film is formed on one surface of the base substrate 310 with a predetermined thickness corresponding to the concave portion where the negative photosensitive resist 320 is to be formed. (FIG. 9A) As the base substrate 310, a non-conductive glass substrate is generally used. However, the base substrate 310 is non-conductive and rigid.
Those having a plating-removable surface are preferred, and are not particularly limited to glass substrates. The resist 320 is not particularly limited as long as it is suitable for forming a target concave portion. That is, it is preferable that a material having a thickness corresponding to the depth of the concave portion to be formed and having good plating releasability and resolution can be obtained. For example, when it is desired to obtain a thickness of the barrier (100 μm to 200 μm) of the back plate for a plasma display panel, NITGO-MORTON CO., LTD.
A resist such as 650 can be used. Next, a predetermined region of the resist 320 is exposed using a predetermined photomask (also referred to as a pattern plate) 330. (FIG. 9 (b)) Since a negative resist is used in this example, a portion irradiated with predetermined ionizing radiation, which has passed through the (ionizing radiation) transmitting portion 330A of the photomask 330, is cured to form a cured portion. Form 320A. As the ionizing radiation, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray, or the like can be used according to the resist 320 used. By performing the subsequent development processing, only the cured portion 330A is
Remains. (FIG. 9C) The remaining cured portion 320A corresponds to the shape of the concave portion to be formed. Next, an activation process for performing electroless plating is performed on the surface portion (exposed portion) of the base substrate 310 on which the cured portion 320A of the resist (this is also simply referred to as a resist pattern here) is formed. Electroless plating is performed to form a conductive thin film 370. (FIG. 9D) This is performed using a metal serving as a catalyst such as Pd, and electroless Ni plating, electroless Pd plating, or the like is performed. As described above, after the surface portion of the base substrate on the side where the cured portion 320A of the resist is formed is made conductive, based on the surface portion, the entire cured portion 320A of the resist (resist pattern) is covered. Then, electrolytic plating is performed integrally. (FIG. 9 (e)) As the electrolytic plating, electrolytic Ni plating is preferable, but not limited thereto. Also, plating of various materials may be formed in multiple layers. Next, the electroplated layer 380 and the conductive thin film 370 are peeled off from the base substrate 310 and the resist pattern (cured portion 320A) formed thereon, so that a transfer plate including the electroplated layer 380 and the conductive thin film 370 is formed. 300 (corresponding to 110 in FIG. 1) is obtained. (FIG. 9
(F))

In the method of forming a transfer plate shown in FIG. 9, the conductive thin film 370 is formed by electroless plating. However, the method of forming the transfer plate in this embodiment is not particularly limited to this. Although a negative resist is used in FIG. 9,
In some cases, a positive resist can be used. When the thickness of the resist is large, the portion of the cured portion 320A in contact with the base substrate may be thinned depending on the amount of exposure (ionizing radiation irradiation) of the resist.

Next, a second embodiment of the method for forming a thick film pattern according to the present invention will be described with reference to FIG.
In this example, as in the first example, the PD
This is an example of a method of forming a barrier on the back plate for P. In the case where a transparent glass plate is used as a medium, an ultraviolet-curable material is used as a transfer material, and an adhesive material is used as a material for a plastic layer. It is an example. A thick film pattern in which a transfer material, which is a material for forming a barrier, is filled into a concave portion of a transfer plate having a predetermined shape corresponding to a shape to be transferred, and is pressed onto a back plate for PDP and transferred. Is a method of forming Briefly, the concave portion of the transfer plate is filled with a transfer material of the thick film pattern, the transfer material filling side is set to the medium side, and an adhesive plastic layer is provided between the transfer plate and the medium, The transfer plate and the medium are pressure-bonded, and thereafter, the transfer plate and the medium are separated from each other,
A thick film pattern transfer material is transferred from a transfer plate to a medium via an adhesive plastic layer to form a thick film pattern. First, a transfer plate 110 is prepared (FIG. 11).
(A)) After the concave portion 115 is filled with the transfer material 120, the transfer material 120 filled in the concave portion 115 of the transfer plate 110 is cured by irradiating ultraviolet rays. (FIG. 11
(B)) Production of the transfer plate 110 and the concave portion 11 of the transfer material 120
5 is filled in the same manner as in the first example. Next, the transfer plate 110 is filled with the transfer material 120 on the medium side 1.
30 and a plastic layer 140 is provided between the transfer plate 110 and the medium 130, and the transfer plate 110 and the medium 130 are pressed. (FIG. 11C) The method of pressing the transfer plate 110 and the medium 130 and the method of disposing the plastic layer are performed in the same manner as in the first example. Next, the transfer plate 11
0 is separated from the medium 130, and the transfer material 120 is transferred to the medium side by the adhesive force of the plastic layer 140, so that the barrier 120A, which is a thick film pattern, is formed on the medium 130.
(FIG. 11D) The separation between the transfer plate 110 and the medium 130 is performed in the same manner as in the first example. Further, the same material as in the first example can be used for the transfer plate material.
It is particularly preferable to use a material having a high adhesive strength.

Next, a third embodiment of the method for forming a thick film pattern according to the present invention will be described with reference to FIG.
In this example, as in the first example, the PD
This is an example of a method of forming a barrier on the back plate for P, in which a transparent glass plate is used as a medium and an ultraviolet-curable material is used as a transfer material and a plastic layer. The transfer material, which is a barrier forming material, is filled in a concave portion having a predetermined shape according to the shape to be transferred and formed on the transfer plate,
This is a method for forming a thick film pattern which is transferred by being pressed onto a back plate for PDP. In brief, the transfer plate is filled with a transfer material for a thick film pattern in the concave portion of the transfer plate, the transfer material filling side is set to the medium side, and a plastic layer is provided between the transfer plate and the medium. And a medium, and then the transfer plate and the medium are separated from each other, and the transfer material of the thick film pattern is transferred from the transfer plate to the medium via the plastic layer to form a thick film pattern. It is. First, the transfer plate 110 is prepared (FIG. 12A), and after filling the concave portion 115 with the transfer material 120, the concave portion 115 is irradiated with ultraviolet light, and the concave portion 11 of the transfer plate 110 is formed.
The transfer material 120 filled in 5 is cured. (Figure 1
2 (b)) Production of the transfer plate 110 and the concave portion 11 of the transfer material 120
5 is filled in the same manner as in the first example. Next, the transfer plate 110 is filled with the transfer material 120 on the medium side 1.
30, and a plastic layer 140 is provided between the transfer plate 110 and the medium 130, and after the transfer plate 110 and the medium 130 are pressed, in this state, ultraviolet rays 150 are irradiated.
The transfer material 120 and the plastic layer 140 are cured and integrated. (FIG. 12C) The method of pressing the transfer plate 110 and the medium 130 and the method of disposing the plastic layer are performed in the same manner as in the first example. Next, the transfer plate 11
0 is separated from the medium 130, and the transfer material 120 is transferred to the medium side by the adhesive force of the plastic layer 140, so that the barrier 120A, which is a thick film pattern, is formed on the medium 130.
(FIG. 12D) The separation between the transfer plate 110 and the medium 130 is performed in the same manner as in the first example. Further, the same material as in the first example can be used for the transfer plate material.
It can be used only for UV-curable ones.

Next, a fourth embodiment of the method of forming a thick film pattern according to the present invention will be described with reference to FIG. This example is an example of a method of forming a barrier on the back plate for PDP using a roll-shaped transfer plate. In the case where a transparent glass substrate is used as a medium and an ultraviolet-curable material is used as a transfer material. This is an example. As in the first example, a transfer material, which is a material for forming a barrier, is filled in a concave portion of a transfer plate having a predetermined shape corresponding to a shape to be formed by transfer, and is pressed onto a back plate for PDP. This is a method of forming a thick film pattern to be transferred. Briefly, a plastic layer is provided between the transfer material and the medium filled in the concave portion, and the transfer material and the medium filled in the concave portion are press-bonded through the plastic layer, at least,
Transferring the transfer material from the concave portion of the transfer plate to the medium via a plastic layer by separating the pressed transfer plate portion and the pressed medium, forming a thick film pattern on the medium. It is. In this example, as the roll-shaped transfer plate 210, a transfer plate provided with a concave portion (groove) 215 corresponding to a picture in the axial direction of the roll as shown in FIG. 6B is used. ) May be used in which a concave portion (groove) 215 is provided along the circumference of the roll. First, the plastic layer 140 is formed on one surface of the medium by using the method shown in FIGS. 3A and 3B. Then, while rotating the transfer plate 210, the medium 130 is filled with the transfer material 120 of the roll-shaped transfer plate 210 by the concave portion (FIG. 3).
215) and moves straight in accordance with the rotation of the transfer plate 210. The plastic layer 140 is directed to the transfer plate 210 side, and pressure is applied so that the medium 130 and the transfer plate 210 are in contact on one line of a roll (transfer plate).

In the present embodiment, the transfer material 120 is filled into the concave portion having a predetermined shape of the transfer plate 210. In this example, as shown in FIG. The filling material 120 is filled. The filled transfer material 120 in the concave portion advances to a position in contact with the medium 130 due to the rotational movement of the transfer plate 210, but the medium 13
The light source 230 and the mirror 235 provided at a position in contact with 0
Then, ultraviolet rays (UV light) 150 are irradiated to cure the transfer material 120 in the concave portions. Transfer plate 210, medium 130
Is moved, the press-bonded transfer plate portion and the press-bonded medium are separated from each other. As a result, the transfer material 120 having the recessed portions hardened is transferred from the transfer plate 210 to the medium 13.
Transferred to 0. In this example, the above procedure can be repeated by continuously rotating the transfer plate 210, and it is also possible to perform continuous transfer. The transfer plate to be used may be the same transfer plate as in the first example in the form of a roll, but is not limited thereto. The same material as the first example can be used for the transfer material and the plastic layer.

Next, a fifth embodiment of the method for forming a thick film pattern according to the present invention will be briefly described with reference to FIG.
In this example, as in the fourth example, P
This is an example of a method of forming a barrier on the back plate for DP, in which a transparent glass substrate is used as a medium and an ultraviolet curing type material is used as a transfer material. Is transferred from the transfer material container 250 to the transfer material supply roll 240.
Through the squeegee 225 and the extra transfer material 1
20 scrapes. Others are the same as the fourth example, and the description is omitted here.

[0049]

According to the present invention, as described above, a large-area, high-definition object such as a barrier of a back panel for PDP is transferred onto a target medium so that the quality can be satisfied. A method for forming a thick film pattern that can be formed can be provided. In particular, this makes it possible to cope with an ever-increasing size and definition of PDPP, and to cope with mass production.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a process of a first example of an embodiment of a method for forming a thick film pattern according to the present invention.

FIG. 2 is a schematic view for explaining a method of filling a transfer material into a concave portion of a transfer plate.

FIG. 3 is a schematic view showing a method for forming a plastic layer on a medium.

FIG. 4 is a cross-sectional view showing how the transfer plate and the medium adhere to each other.

FIG. 5 is a cross-sectional view illustrating a method of separating a transfer plate and a medium that are in close contact with each other (also called removal)

FIG. 6 is a view showing a form of a transfer plate.

FIG. 7 is a sectional view of a step in a fourth example of the embodiment of the method for forming a thick film pattern according to the present invention;

FIG. 8 is a cross-sectional view of a step of a fifth example of the embodiment of the method of forming a thick film pattern according to the present invention.

FIG. 9 is a cross-sectional view of a step of an example of a method for manufacturing a transfer plate.

FIG. 10 illustrates a PDP substrate.

FIG. 11 is a sectional view of a step in a second example of the embodiment of the method for forming a thick film pattern according to the present invention;

FIG. 12 is a sectional view of a step in a third example of the embodiment of the method for forming a thick film pattern according to the present invention;

[Explanation of symbols]

 110 transfer plate 115 recess 120 transfer material 120A barrier 130 medium (transfer target) 140 plastic layer 140A plastic layer material 150 ultraviolet (UV light) 160, 165 squeegee 170 (pressing) roll 180 (elasticity) spacer 185 ( Pressing) roll 190 rotating cam 210 transfer plate 215 recess (groove) 220 squeegee 230 light source 235 mirror 240 transfer material supply roll 250 transfer material container 300 transfer plate 310 base substrate (base material) 320 (negative type) Photosensitive resist 320A Hardened part 330 Photomask 330A (ionizing radiation) transmitting part 330B Light shielding part 340 Ionizing radiation 370 Conductive thin film 380 Electrolytic plating layer 390 Concave part

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K044 AA12 AB02 BA06 BA08 BB03 CA04 CA15 CA18 5C027 AA09 5C040 GF18 GF19 JA02 JA09 JA19 JA20 JA32 KA16 MA24 MA25

Claims (14)

[Claims] 1. A thick film pattern using a transfer plate in which a transfer material is filled into a concave portion having a predetermined shape corresponding to a shape to be formed by transfer and is pressed and transferred onto a target medium. Forming a thick film pattern transfer material in the recesses of the transfer plate, providing a plastic layer between the transfer material filled in the recesses and the medium, and filling the recesses with the transfer material. After the material and the medium are pressure-bonded via the plastic layer, at least, the transfer plate portion that is pressed and the medium portion that is pressed are separated, and the transfer material is transferred from the concave portion of the transfer plate to the medium by the plastic layer. Forming a thick film pattern on a medium by transferring the thick film pattern on a medium. 2. The method according to claim 1, wherein the plastic layer is supplied in the form of a sheet, laminated on a medium side or a transfer plate side filled with a transfer material, and provided between the transfer plate and the medium. A method for forming a characteristic thick film pattern. 3. The thickness according to claim 1, wherein the plastic layer is printed or coated on a medium or a transfer plate filled with a transfer material and provided between the transfer plate and the medium. A method for forming a film pattern. 4. The method according to claim 1, wherein the medium is a back plate for a plasma display panel, and the thick film pattern is a barrier. 5. The method according to claim 4, wherein the plastic layer is a dielectric layer. 6. The plastic layer according to claim 4 or 5,
A method for forming a thick film pattern, wherein the transfer plate filled with the transfer material and the medium are plastically deformed by the close contact pressure, and follow the irregularities of 5 to 50 μm of the transfer plate or the medium filled with the transfer material. . 7. The plastic layer according to claim 1, wherein
A method for forming a thick film pattern, characterized by having adhesiveness. 8. The method for forming a thick film pattern according to claim 7, wherein the plastic layer has tackiness. 9. The method according to claim 1, wherein the transfer material does not contain a solvent. 10. The transfer material according to claim 1, wherein the transfer material has a curability that is cured by energy of light or the like, and after the transfer material filled in the recess is cured by energy of light or the like. A method of forming a thick-film pattern, comprising: pressing a medium through a plastic layer through a plastic layer, and transferring a transfer material to the medium mainly by the adhesive force of the plastic layer. 11. The transfer material according to claim 1, wherein the transfer material has curability which is cured by energy such as light, and the transfer material filled in the concave portion and the medium are press-bonded via a plastic layer. A hardening treatment for hardening the transfer material with energy such as light in the state after the heat treatment. 12. The transfer material according to claim 1, wherein the transfer material has curability to be cured by energy such as light, and the transfer material filled in the concave portion is cured by energy such as light. A method of forming a thick film pattern, wherein the transfer material is cured again by energy such as light while the film is pressed against the medium via the plastic layer, and the transfer material is transferred to the medium. 13. The plastic layer according to claim 11 or 12, which has curability to be cured by energy such as light, and is pressurized with a medium via the plastic layer.
A method for forming a thick film pattern, comprising curing a plastic layer with energy such as light, integrating a transfer material and a plastic layer, and transferring the transfer material to a medium. 14. The transfer material according to claim 11, wherein the material for transfer is cured by energy such as light to obtain a material for transfer.
A method for forming a thick film pattern, wherein a volume shrinks by 10% to 10%.