JP2001044271A - Carrier and detection method for housing state of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make substrates, such as wafers, housed in a cassette, in parallel to each other without making the substrates interfere with each other, and moreover at equal intervals. SOLUTION: The peripheral edge parts of respective wafers W are inserted in a box sidewall 15 and a support pillar 14, which constitute a carrier 11, and a plurality of groove parts 16 which are supported by each wafer W are provided in the alignment directions of the wafers W. Tapered parts 17b on the depth sides on the sides of the lower surfaces of the groove parts 16 and upper surface parts 18 of the groove parts 16 are formed into a tapered shape, which is formed gradually narrower toward the depth sides. When the peripheral edge parts of the wafers W are mounted on the sides of these sides on the sides of the lower surfaces of the groove parts 16, planar parts 17a, which are formed almost in parallel with the rears of the wafers W, are provided on the sides of the lower surfaces of the groove parts 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for accommodating a substrate such as a semiconductor wafer and a method for detecting the accommodated state of a substrate for detecting the accommodated state of the substrate contained in the carrier.

[0002]

2. Description of the Related Art Conventionally, a semiconductor wafer (hereinafter, referred to as a wafer) has been transported in a state of being stored in a carrier.
As shown in FIGS. 17 to 19, the carrier 1 is composed of a box body 3 provided with an outlet 2 for a wafer W on the front side, and a plurality of support columns 4 provided on the back side. I have.

The side wall 5 of the box 3 constituting the carrier 1
As shown in FIG. 20, a plurality of grooves 6 are formed at equal intervals in the support pillar 4, and the peripheral edge of the wafer W is inserted into and supported by these grooves 6. . In other words, the wafers W are supported from the outlet 2 of the carrier 1 while being inserted into the grooves 6 so that the wafers W are stored at equal intervals.

Here, the groove 6 formed in the carrier 1 is formed in a tapered shape gradually narrowing toward the back. In other words, when the carrier 1 is placed vertically with the outlet 2 facing upward in a state where the wafer W is stored in the carrier 1, the peripheral portion of each wafer W is guided by the taper. Thus, the wafers W are disposed at the back of the groove 6 so that the wafers W are held at equal intervals so that the wafers W do not interfere with each other.

[0005]

By the way, when the carrier 1 which has been placed vertically as described above is started up for installation in a transfer device or the like and the wafer W is placed horizontally, the wafer W
21 is supported by the tapered portion of the groove 6, the support position of the wafer W varies, as shown in FIG. Could be tilted and supported.

In such a state, it becomes difficult to insert the arm of the transfer device for taking the wafer W in and out of the outlet 2 of the carrier 1 between the wafers W, and the transfer operation is delayed. For this reason, the carrier and the wafer W which are difficult to
However, there is a demand for a detection method for easily detecting the inclination when the inclination is stored in the carrier 1.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a carrier capable of storing substrates such as wafers in parallel at equal intervals without interfering with each other and a storage of the substrates stored in the carrier. It is an object of the present invention to provide a method for detecting a stored state of a substrate, which can easily detect a state.

[0008]

In order to achieve the above-mentioned object, a carrier according to the present invention is a carrier (11) for accommodating a plurality of substrates (W) in an aligned state at intervals. A plurality of grooves (16) for supporting the peripheral edge of the substrate (W) are provided along the alignment direction of the substrate (W), and the groove (16) is provided at the outlet (1) of the substrate (W).
2) The tapered portion (17b, 1
8) and a flat portion (17a) substantially parallel to the back surface of the substrate (W) when the peripheral portion of the substrate (W) is placed.

As described above, when the peripheral portion of the substrate (W) is placed in the groove (16) supporting the peripheral portion of the substrate (W), the flat portion becomes substantially parallel to the back surface of the substrate (W). (17
a), the peripheral portion of the substrate (W) is placed on the flat portion (17a) of the groove portion (16) when the substrate (W) is placed in a horizontal position in a horizontal direction. Thus, the substrates (W) can be housed in a state where they are aligned parallel to each other without tilting. This facilitates the transfer of the substrate (W) transfer means (28) between the substrates (W).

Further, since the groove portion (16) is provided with a tapered portion (17b, 18) gradually narrowing toward the back side thereof, the substrate (W) is arranged vertically so as to be disposed vertically. At this time, the periphery of the substrate (W) is tapered (17b,
18), it can be arranged at the back of the groove (16) by being guided, and can be held at a predetermined interval from each other;
This prevents interference between the substrates (16).

Further, according to the storage state detecting method of the present invention, a substrate (W) for detecting a storage state of the substrate (W) in a carrier (11) for storing a plurality of substrates (W) in an aligned state at intervals. Detecting the position of the substrate (W) stored in the carrier (11) in the alignment direction at a plurality of locations in the surface direction of the substrate (W), and detecting the position of the substrate (W). The method is characterized in that the inclination of the substrate (W) is detected by comparing the detection results at a plurality of locations in the plane direction of (1).

As described above, the inclination of the substrate (W) can be detected very easily by detecting the substrate (W) at a plurality of locations in the plane direction and comparing the detection results. In other words, when a part of the peripheral portion of the substrate (W) is erroneously inserted into the groove portion (16) constituting the upper and lower storage slots and is stored in a tilted state, the storage failure caused by the tilted storage is considered. The condition is easily detected.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for detecting a stored state of a carrier and a substrate according to an embodiment of the present invention will be described below with reference to the drawings. 1 to 3, reference numeral 11 denotes a carrier according to the present embodiment. As described above, the carrier 11 is composed of a box 13 provided with an outlet 12 for a wafer (substrate) W on the front side, and a plurality of support columns 14 on the back side. .

As shown in FIG. 4, a plurality of grooves 16 are formed at equal intervals in the side wall 15 of the box 13 and the support column 14 constituting the carrier 11.
6, the peripheral portion of the wafer W is inserted and supported. That is, by supporting the wafers W from the outlet 12 of the carrier 11 while inserting the peripheral edge into the groove 16, the wafers W are arranged and stored at equal intervals.

The groove 16 formed in the carrier 11 has a tapered portion 17b on the lower surface 17 forming the groove 16 and a flat surface formed on the near side. The portion 17a is provided. The upper surface (tapered portion) 18 forming the groove 16 is also formed in a tapered shape, and together with the tapered portion 17b of the lower surface 17, has a tapered shape gradually narrowing toward the back.

The flat portions 17a are formed parallel to each other. The flat portions 17a are flat surfaces substantially parallel to the rear surface of the wafer W when the wafer W is inserted into the groove portion 16 and housed in the carrier 11. ing. That is, the rear surface of the wafer W stored in the carrier 11 is placed in contact with the flat portion 17a.

As described above, according to the carrier 11 having the above-described structure, when the peripheral portion of the wafer W is mounted on the groove 16 for supporting the peripheral portion of the wafer W, the plane is substantially parallel to the rear surface of the wafer W. Since the portion 17a is provided, the wafer W
When the wafer W is placed horizontally in a horizontal direction, the peripheral portion of the wafer W is placed on the flat surface portion 17a of the groove portion 16, whereby the wafer W is stored in a state where the wafers W are aligned parallel to each other without inclination. Can be done. Accordingly, it is possible to extremely easily perform the transfer of the hand unit 28 for transferring the wafer W, which will be described later, between the wafers W, and the detection between the wafers W by the sensor 31, which will be described later, when performing the transfer of the wafer W, The transfer operation can be facilitated.

The tapered portion 1 on the lower surface 17 of the groove 16
7b and the upper surface portion 18 are formed in a tapered shape that gradually narrows toward the back side, so that when the wafer W is placed vertically and vertically disposed, the peripheral portion of the wafer W is tapered. 17b, it is guided by the upper surface portion 18 and is arranged at the back of the groove portion 16 and can be held at a predetermined interval from each other, whereby interference between the wafers W can be prevented.

FIG. 5 shows a groove 16 having another shape. The groove 16 is formed on the upper surface 18 forming the groove 16.
And flat portions 17a and 18 in which the lower surface portion 17 is formed as a flat surface.
a, and the tapered portion 17 having a tapered shape in which the rear side of the flat portions 17a, 18a gradually narrows toward the back.
b, 18b.

The carrier 1 having the groove 16
1, the groove 16 supporting the peripheral portion of the wafer W
Is provided with a flat portion 17a that is substantially parallel to the back surface of the wafer W when the peripheral portion of the wafer W is mounted. Therefore, when the wafer W is placed horizontally and disposed horizontally. The peripheral portion of the wafer W is placed on the plane portion 17a of the groove portion 16, so that the wafers W can be stored in a state where they are aligned in parallel to each other without tilting. Thereby, it is possible to easily carry out the hand W for loading and unloading the wafer W into and out of the space between the wafers W, and detect the wafer W by the sensor 31 described later when the wafer W is loaded and unloaded. Work can be facilitated.

Further, since the groove 16 is provided with tapered portions 17b and 18b which are gradually narrowed toward the back side thereof, when the wafer W is placed vertically and disposed vertically, The peripheral edge portion is guided by the tapered portions 17b and 18b and is disposed at the back of the groove portion 16, and can be held at a predetermined interval from each other, thereby preventing interference between the wafers W.

FIGS. 6 and 7 show a carrier 11 having an extruding mechanism (extruding means). The carrier 11 is provided on a carrier table 19, and the carrier table 19 is provided with an extruding mechanism 20 arranged in parallel with the support columns 14 along the direction in which the wafers W are arranged. The extruding mechanism 20 includes an extruding mechanism main body 20a and an extruding section 20b provided on the extruding mechanism main body 20a, and the extruding section 20b approaches and separates from the wafer W stored in the carrier 11. It is possible to appear.

In other words, the push-out mechanism 22 makes the push-out portion 20b project so that the groove 1
6 is pushed out from the vicinity of both sides of the wafer W toward the outlet 12 of the carrier 11 so that the peripheral portion of the wafer W is flattened by the support pillars 14 and the grooves 16 of the side walls 15. 17a. In the case where the carrier W is placed vertically with the outlet 12 thereof facing upward, the extruding portion 2
0b is pulled in, the pushing-out state of the wafer W by the pushing section 20b is released, and the wafers W are arranged on the deep side of the taper of the groove 16 so that the wafers W do not interfere with each other.

As described above, according to the carrier 11 provided with the extrusion mechanism 20, the wafer W whose peripheral edge is inserted into the groove 16 and is housed is pushed out by the extrusion mechanism 20, and the peripheral edge is reliably formed. Since the wafers W are arranged on the plane portion 17a of the groove portion 16, the wafers W can be aligned in parallel to each other without inclination.

Next, a transfer device for taking out the wafer W stored in the carrier 11 and storing the wafer W in the carrier 11 will be described. In FIG. 8, reference numeral 21 denotes
It is a transport device. The transfer device 21 stores the wafer W in and removes the wafer W from the carrier 11 installed on the carrier mounting table 23 which is moved up and down by the elevating mechanism 22. It has a supported handling mechanism 25.

The handling mechanism 25 includes a first arm 26 rotatably connected to an upper portion of the base 24 in a horizontal plane.
And a second arm 27 rotatably connected to the tip of the first arm 26 in a horizontal plane. The tip of the second arm 27 has a lift 30 , A hand unit (transporting means) 28 is provided rotatably in a horizontal plane. The hand unit 28 is moved up and down by an elevating unit 30.

As shown in FIGS. 9 and 10, the hand portion 28 is a flat plate having a tip portion formed in a concave shape in plan view and a suction surface 29 on the upper surface side. It is designed to be adsorbed. The hand unit 28 is provided with sensors (detection means) 31 on both sides thereof. These sensors 31 are for detecting an object in front, and one side is an upper sensor 31a,
The other side is a lower sensor 31b.

The upper sensor 31a has a sensor section 33
Is provided so as to be flush with the upper surface of the hand unit 28 so as to detect an object on the front side at a height position flush with the upper surface of the hand unit 28. Conversely, the lower sensor 31b is provided so that the sensor portion 33 thereof is flush with the lower surface of the hand portion 28, and the lower sensor 31b is located at the same height position as the lower surface of the hand portion 28. The object on the side is detected.

According to the transport device 21 having the above-described configuration, when a take-out operation is instructed by a control unit (not shown), the hand unit 28 of the handling mechanism 25 is directed toward the carrier 11 and the carrier loading mechanism 22 moves the carrier unit. The carrier 11 is moved up and down together with the table 23. At this time, the control means controls the driving of the lifting mechanism 22 based on the detection result from the sensor 31 provided in the hand section 28 of the handling mechanism 25.

That is, the driving of the lifting mechanism 22 is controlled by the control means, and the vertical position of the hand unit 28 is
It is arranged below the wafer W to be taken out of the wafers W stored in the carrier 11, that is, in a space formed between the wafer W to be taken out and the wafer W immediately below. When the lowermost wafer W is a wafer W to be taken out, it is arranged in a space formed between the wafer W and the bottom plate of the box 13 constituting the carrier 11.

As described above, when the hand unit 28 is disposed in the space below the wafer W, the handling mechanism 25 is driven, the hand unit 28 is moved in the direction of the carrier 11, and the hand unit 28 is removed from the wafer W to be taken out. It is arranged below. In this state, the hand unit 28 is slightly lifted by the elevating unit 30 provided at the distal end of the second arm 27, and the suction surface 29 of the hand unit 28 is brought into contact with the lower surface of the wafer W. Thereby, the wafer W is sucked to the suction surface 29. Thereafter, the hand unit 28 is pulled out of the carrier 11 by the handling mechanism 25, whereby the wafer W sucked and held on the suction surface 29 of the hand unit 28 is taken out of the carrier 11.

Here, the wafer W
A storage state detection function is provided for detecting the storage state of the wafer W stored in the carrier 11 before taking out the wafer W. Next, a method of detecting the storage state of the wafer W in the carrier 11 by the storage state detection function of the transfer device 21 will be described with reference to the flowchart shown in FIG.

Step S1 First, the hand section 28 of the handling mechanism 25 is turned to the carrier 11 in which the wafer W is stored, and the search slot, that is, the wafer W to be detected for detecting the storage state is set.
Is arranged in a storage slot (under the wafer W to be taken out) (see FIG. 12).

Step S2 The carrier mounting table 23 is lowered by the lifting mechanism 22.
Thereby, the carrier 11 in which the wafer W is stored is lowered.

Step S3 When the carrier 11 is lowered, the wafer W to be detected is detected by the upper sensor 31a of the hand unit 28, and a detection signal is output to the control means (see FIG. 13).

Step S4 When the carrier 11 is further lowered, the wafer W to be detected is detected by the lower sensor 31b of the hand unit 28, and a detection signal is output to the control means (see FIG. 14).

Step S5 On the basis of the detection results from the sensors 31a and 31b, the control means detects the wafer W to be detected by the upper sensor 31a and then detects the wafer W by the lower sensor 31b. Pitch Ps, which is data on the distance the carrier 11 has been moved up and down by the elevating mechanism 22 until the detection of
Is required. Then, the control means calculates the detected pitch P
Based on s and the actual pitch P of the upper and lower sensors 31a and 31b, the storage state of the detection target wafer W is detected based on the following equation.

Ps = P ± α (a)

The control means compares the detected pitch Ps with the actual pitch P to determine whether or not the above equation (a) holds. That is, when the detection target wafer W is normally stored, the above equation (a) holds.
As shown in FIG. 15 or FIG. 16, when a part of the peripheral edge is engaged with another storage slot and the wafer W to be detected is stored obliquely, the detection pitch Ps differs from the actual pitch P. Therefore, the above equation (a) does not hold.

More specifically, in the case of the housed state shown in FIG. 15, the moving distance by the lifting mechanism 22 from the detection of the wafer W by the upper sensor 31a to the detection of the wafer W by the lower sensor 31b is reduced. , Detection pitch Ps
Is smaller than the actual pitch P. In the case of the storage state shown in FIG. 16, the movement distance of the lifting / lowering mechanism 22 from the detection of the wafer W by the upper sensor 31a to the detection of the wafer W by the lower sensor 31b increases.
The detected pitch Ps becomes larger than the actual pitch P.

Step S6 Since the above equation (a) holds, the wafer W to be detected is
Is determined to be stored normally.

Step S7 Since the equation (a) does not hold, it is determined that the wafer W to be detected is stored obliquely.

As described above, according to the transfer device 21 having the function of detecting the storage state of the wafer W stored in the carrier 11, the wafer W is detected at a plurality of locations in the plane direction, and the detection result is obtained. By comparing the above, the inclination of the wafer W can be detected very easily.
In other words, when a part of the peripheral portion of the wafer W is erroneously inserted into the grooves 16 of the other upper and lower storage slots and is stored in a tilted state, the state of the storage failure that is tilted and stored can be easily determined. Can be detected.

Further, the carrier 11 is moved up and down by the elevating mechanism 22 so that the carrier 11 and the handling mechanism 25 are moved up and down.
By relatively moving the sensor 31 of the hand unit 28 in the alignment direction of the wafer W, the sensor 31
To detect the wafer W at a plurality of locations in the surface direction,
The inclination of the wafer W can be detected from the detection result.

As described above, since the stored state of the wafer W is detected before the wafer W is taken out, the wafer W and the transfer device can be obtained by performing the taking-out operation of the wafer W in a state where the wafer W is housed in an inclined state. 21, especially the hand section 2
8 can be prevented from occurring.

In the transfer apparatus 21, the carrier 11 is moved up and down by the elevating mechanism 22, so that the carrier 11 and the sensor 31 of the hand unit 28 are relatively moved in the alignment direction of the wafer W. The handling mechanism 25 is raised or lowered or the carrier 11
Alternatively, both the handling mechanism 25 and the handling mechanism 25 may be moved up and down.

[0047]

As described above, according to the method of detecting a stored state of a carrier and a substrate according to the present invention, the following effects can be obtained. According to the carrier according to claim 1,
In the groove supporting the peripheral portion of the substrate, a flat portion substantially parallel to the back surface of the substrate is provided when the peripheral portion of the substrate is placed, so that the substrate is disposed horizontally in a horizontal direction. At this time, the peripheral portion of the substrate is placed on the flat portion of the groove, whereby the substrates can be stored in a state where they are aligned in parallel with each other without tilting. This makes it possible to smoothly move the transfer means for transferring the substrates into and out of the substrates. In addition, since the groove portion is provided with a tapered portion that gradually narrows toward the back side, when the substrate is placed vertically in which the substrate is disposed vertically, the peripheral portion of the substrate is guided by the tapered portion. And can be held at a predetermined interval from each other,
Interference between the substrates can be prevented.

According to the carrier according to the second aspect, the substrate whose peripheral edge is inserted into the groove is pushed out by the pushing means, and the peripheral edge is securely disposed on the flat surface. It can be in a state where they are aligned parallel to each other without inclination.

According to the third aspect of the present invention, the inclination of the board can be detected very easily by detecting the board at a plurality of locations in the plane direction and comparing the detection results. can do. In other words, when a part of the peripheral portion of the substrate is erroneously inserted into the groove forming the upper and lower storage slots and is stored in a tilted state, the state of the storage failure stored in the tilted state can be easily detected. be able to.

According to the fourth aspect of the present invention, by relatively moving the carrier and the detecting means in the direction in which the substrates are aligned, the detecting means can very easily move the substrate at a plurality of positions in the plane direction. , And the storage state such as the inclination of the substrate can be detected from the detection result.

According to the method of detecting a stored state of a substrate according to the fifth aspect, the stored state of the substrate is detected before the substrate is taken out. This can prevent the substrate and the transfer means from being damaged due to this operation.

[Brief description of the drawings]

FIG. 1 is a front view of a carrier illustrating a configuration and a structure of a carrier according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the carrier illustrating the configuration and structure of the carrier according to the embodiment of the present invention.

FIG. 3 is a side view of the carrier illustrating the configuration and structure of the carrier according to the embodiment of the present invention.

FIG. 4 is a sectional view of the storage slot illustrating a shape of a groove of the storage slot provided in the carrier according to the embodiment of the present invention.

FIG. 5 is a sectional view of the storage slot illustrating another shape of the groove of the storage slot provided in the carrier according to the embodiment of the present invention.

FIG. 6 is a side view of the carrier according to the embodiment of the present invention, illustrating an example in which an extruding mechanism is provided on the carrier.

FIG. 7 is a cross-sectional view of the carrier according to an embodiment of the present invention, illustrating an example in which an extruding mechanism is provided on the carrier.

FIG. 8 is a schematic side view of a transfer device having a storage state detection function for explaining a substrate storage state detection method according to an embodiment of the present invention.

FIG. 9 is a cross-sectional view of a carrier in which a hand unit of a transport device having a storage state detection function is inserted, illustrating a storage state detection method of a substrate according to an embodiment of the present invention.

FIG. 10 is a front view of a part of a carrier into which a hand unit of a transport device having a storage state detection function is inserted, illustrating a substrate storage state detection method according to an embodiment of the present invention.

FIG. 11 is a flowchart illustrating a method for detecting a stored state of a substrate according to an embodiment of the present invention.

FIG. 12 is a schematic front view of a part of a wafer stored in a carrier illustrating a detection state of a wafer by a sensor of a hand unit for explaining a storage state detection method of a substrate according to an embodiment of the present invention.

FIG. 13 is a schematic front view of a part of a wafer stored in a carrier, illustrating a detection state of a wafer by a sensor of a hand unit, illustrating a substrate storage state detection method according to an embodiment of the present invention.

FIG. 14 is a schematic front view of a part of a wafer stored in a carrier illustrating a detection state of a wafer by a sensor of a hand unit for describing a substrate storage state detection method according to an embodiment of the present invention.

FIG. 15 is a schematic front view of a part of a wafer stored in a carrier illustrating a detection state of a wafer by a sensor of a hand unit for explaining a substrate storage state detection method according to an embodiment of the present invention.

FIG. 16 is a schematic front view of a part of a wafer stored in a carrier for explaining a detection state of a wafer by a sensor of a hand unit for explaining a substrate storage state detection method according to an embodiment of the present invention.

FIG. 17 is a front view of a carrier illustrating the configuration and structure of a conventional carrier.

FIG. 18 is a cross-sectional view of a carrier illustrating the configuration and structure of a conventional carrier.

FIG. 19 is a side view of a carrier illustrating the configuration and structure of a conventional carrier.

FIG. 20 is a cross-sectional view of a storage slot illustrating a shape of a groove of the storage slot provided in a conventional carrier.

FIG. 21 is a cross-sectional view of a storage slot illustrating a storage state of a storage slot provided in a conventional carrier in a groove.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Carrier 12 Outlet 16 Groove part 17a, 18a Flat part 17b, 18b Taper part 18 Top surface part (taper part) 19 Extrusion mechanism (extrusion means) 21 Transport device (conveyance means) 31 Sensor (detection means) W Wafer (substrate)

Claims (5)

[Claims] 1. A carrier for accommodating a plurality of substrates in an aligned state at intervals, wherein a plurality of grooves for supporting a peripheral portion of each of the substrates are provided along an alignment direction of the substrates. The groove portion has a tapered portion narrowed from the outlet of the substrate to the back side, and a flat portion substantially parallel to the back surface of the substrate when the peripheral portion of the substrate is placed. Career. 2. The carrier according to claim 1, further comprising an extruding means for extruding the substrate toward the outlet so that a peripheral portion of the substrate is separated from the tapered portion. 3. A method for detecting a storage state of a substrate in a carrier that stores a plurality of substrates in an aligned state at intervals, the method comprising detecting a storage state of the substrate in a carrier. Detecting a position of the substrate at a plurality of locations in the plane direction of the substrate, comparing the detection results of the plurality of locations in the plane direction of the substrate, and detecting a tilt of the board, wherein . 4. A detection means for detecting the substrate is provided around the carrier at a plurality of positions in a plane direction of the substrate, and the carrier and the detection means are relatively moved in the alignment direction. 4. The method according to claim 3, wherein the detecting means detects a position of the substrate in an alignment direction. 5. The method according to claim 1, wherein the detecting unit is provided in a transport unit that takes the substrate in and out of the carrier, and detects a stored state of the substrate before removing the substrate from the carrier. 5. The method for detecting a stored state of a substrate according to claim 4.