JP2001042528A - Photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a relief printing plate having satisfactory water resistance and mechanical strength after photo-curing and capable of stably forming a high definition image over a long period of time by incorporating a polyamide comprising specified amounts of three specified compounds, a monomer having a photopolymerizable unsaturated bond and a photopolymerization initiator. SOLUTION: The photosensitive resin composition contains a polyamide comprising 4-60 wt.% compound units of formula I, 30-50 wt.% compound units of formula II and 5-15 wt.% compound units of formula III, a monomer having a photopolymerizable unsaturated bond and a photopolymerization initiator. In the formula I, R1 is >=5C alkylene. In the formula II, R2 is 2-10C hydrocarbon, R3 is 1-4C alkylene or a single bond and R4 is l-4C alkylene. In the formula III, R5 is 2-10C hydrocarbon and R6 and R7 are each methylene or a single bond.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition, and more particularly, to a photosensitive resin composition suitable for a relief plate for printing.

[0002]

2. Description of the Related Art Photosensitive resin compositions include relief plates for printing and relief masks for sandblasting, relief plates, intaglio plates, planographic plates, decorative patterns, photoresists, displays, nameplates, optical adhesives, and photocurable paints. , UV curable inks, and immobilized enzyme films.

[0003] A photosensitive resin composition of this type generally comprises a synthetic polymer compound (hereinafter also referred to as a filling polymer), a photopolymerizable unsaturated compound, and a photopolymerization initiator as basic components. Among the basic components, the properties of the filled polymer greatly affect the physical properties of the photosensitive resin composition before light irradiation and after curing by light irradiation.
Specifically, the properties of the filled polymer greatly affect the shape retention of the photosensitive resin composition before exposure (before light irradiation) and the hardness and abrasion resistance of the photocured portion after exposure.

[0004] The photosensitive resin composition is developed by exposure to actinic light, the exposed portions are photocured, and the unexposed portions are dissolved and removed with a suitable solvent. recent years,
Development using water as a solvent has become mainstream in terms of handleability and cost. In order for the unexposed portion of the photosensitive resin composition to be removed by water, the filled polymer needs to be water-soluble or have high hydrophilicity that can be dispersed in water. On the other hand, it is preferable that the portion which has been light-cured by exposure absorbs a small amount of water at the time of practical use.

JP-B-49-43565, JP-A-Showa 4
JP-A-9-76602, JP-B-53-2082 and JP-B-54-22229 have proposed a photosensitive resin composition which can be developed with water. However, these still have problems such as long time required for development and insufficient water resistance after photocuring. Further, in recent years, there has been a demand for higher definition of printed images and further improvement of printing durability in a relief plate for printing made of a photosensitive resin composition, and water development capable of satisfying such demands has been required. In fact, a possible photosensitive resin composition has not been obtained.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, has very little light scattering at the time of exposure, can be developed with water in a short time, and has sufficient water resistance after photocuring. In particular, it is an object of the present invention to provide a photosensitive resin composition which exhibits properties and mechanical strength, and in particular, makes it possible to prepare a printing relief plate capable of stably forming a high-definition image for a long period of time.

[0007]

Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, have found that ω-amino acids and / or
Or by using a polyamide resin obtained by polycondensation of a lactam and a dicarboxylate of a diamine having a piperazine ring with a dicarboxylate of a diamine having a cyclohexane ring at a specific weight ratio, as a filling polymer,
The active light penetrates deeply into the photosensitive resin composition with little scattering, and furthermore, it has been found that the unexposed portion can be quickly removed by short-time water development, and that the photocured portion can be cured very strongly. The present invention has been completed based on the findings. That is, the present invention has the following features.

(1) Unit 4 represented by the following general formula (I)
Polyamide comprising 0 to 60% by weight, 30 to 50% by weight of a unit represented by the following general formula (II), and 5 to 15% by weight of a unit represented by the following general formula (III); A photosensitive resin composition comprising a monomer having a bond and a photopolymerization initiator.

Embedded image (Wherein, R ¹ is an alkylene group having 5 or more carbon atoms)

Embedded image (Wherein, R ² is a hydrocarbon group having 2 to 10 carbon atoms, R ³ is an alkylene group or a single bond having 1 to 4 carbon atoms, and R ⁴ is an alkylene group having 1 to 4 carbon atoms)

Embedded image (Wherein, R ⁵ is a hydrocarbon group having 2 to 10 carbon atoms, R ⁶ ,
R ⁷ is a methylene group or a single bond)

(2) The photosensitive resin composition according to the above (1), wherein the total content of the photopolymerizable monomer having an unsaturated bond and the photopolymerization initiator is 30 to 60% by weight.

(3) It further contains a stabilizer and / or a plasticizer, and the total content of the stabilizer and / or the plasticizer, the monomer having a photopolymerizable unsaturated bond and the photopolymerization initiator is 30. The photosensitive resin composition according to the above (1), wherein the amount is from 60 to 60% by weight.

(4) The scattering rate of light having a wavelength of 360 nm is 10
% Of the photosensitive resin composition according to any one of the above (1) to (3).

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention comprises a polyamide resin obtained by copolymerizing the above-mentioned three structural units represented by the general formulas (I), (II) and (III) at a specific weight ratio. A monomer having a photopolymerizable unsaturated bond (hereinafter, referred to as a photopolymerizable unsaturated monomer) and a photopolymerization initiator, which are used as the filling polymer, are required as necessary. It contains additives such as stabilizers and plasticizers.

The structural unit of the general formula (I) is a condensed residue of an ω-amino acid having an alkylene group having 5 or more carbon atoms. Examples of the ω-amino acid include aminocaproic acid, aminoheptanoic acid and aminocaprylic acid. , Aminolauric acid and the like. By using these ω-amino acids or their lactams as copolymerization components, these structural units can be introduced into polyamides, but ε-caprolactam is particularly preferred.

The structural unit of the general formula (II) is a condensed residue of a dicarboxylic acid salt of a diamine having a piperazine ring. R ² is a hydrocarbon group having 2 to 10 carbon atoms,
CO- is the residue of an aliphatic, aromatic or alicyclic dicarboxylic acid. As the aliphatic, aromatic or alicyclic dicarboxylic acid, for example, succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, decanedicarboxylic acid,
Although terephthalic acid, isophthalic acid, and cyclohexanedicarboxylic acid can be mentioned, adipic acid is particularly preferable. R ³ is an alkylene group having 1 to 4 carbon atoms or a single bond; R ⁴ is an alkylene group having 1 to 4 carbon atoms;
NH to NH- are residues of a diamine having a piperazine ring. Examples of the diamine having a piperazine ring include N,
N'-bis (aminomethyl) -piperazine, N, N'-
Bis (aminoethyl) -piperazine, N, N′-bis (γ-aminopropyl) piperazine, N, N′-di (aminopentyl) piperazine and the like can be mentioned.

The structural unit of the general formula (III) is a condensed residue of a dicarboxylic acid salt of a diamine having a cyclohexane ring. R ⁵ is a hydrocarbon group having 2 to 10 carbon atoms,
O to CO- have the same meanings as those in formula (II).
R ⁶ and R ⁷ are each a methylene group or a single bond, and —NH
-NH- is a residue of a diamine having a cyclohexane ring. As the diamine having a cyclohexane ring,
For example, 1,3-diaminocyclohexane, 1,3-bisaminomethylcyclohexane, 1,4-diaminocyclohexane, 1,4-bisaminomethylcyclohexane and the like can be mentioned.

The polyamide used in the present invention has a weight ratio of units of the general formulas (I), (II) and (III) in the polymer of 40.
-60- to 50: 5 to 15, three kinds of raw materials comprising an ω-amino acid and / or a lactam thereof, a dicarboxylate of a diamine having a piperazine ring, and a dicarboxylate of a diamine having a cyclohexane ring And then polycondensed.

The polyamide in the present invention has a content of condensed residue of ω-amino acid and / or lactam (unit of the general formula (I)) of 40 to 60% by weight, preferably 50 to 60% by weight.
The content of the condensed residue (unit of the general formula (II)) of the dicarboxylate of the diamine having a piperazine ring is in the range of 30 to 50 wt%, the content of the dicarboxylate of the diamine having a cyclohexane ring is 60 wt%. The condensed residue (general formula (I
It is important that the content of unit (II)) is in the range of 5 to 15% by weight.
It can be a filled polymer that gives the photosensitive resin composition extremely good physical properties.

When the condensed residue of the ω-amino acid or its lactam (unit of the general formula (I)) is less than 40% by weight, the crystallinity of the polymer is lowered, and the moldability of the resin composition is hindered. The mechanical strength of the hardened part cannot be sufficiently increased. On the other hand, when the content is more than 60% by weight, the hydrophilicity of the polymer decreases, and the water developability decreases. If the condensed residue (unit of the general formula (II)) of the dicarboxylic acid salt of a diamine having a piperazine ring is less than 30% by weight, the hydrophilicity of the polymer is reduced and water developability is hindered. If the amount is too large, the hydrophilicity of the polymer becomes too high, and the mechanical strength of the photocured portion after development cannot be sufficiently increased. If the condensed residue of the dicarboxylic acid salt of diamine having a cyclohexane ring (unit of the general formula (III)) is less than 5%, light scattering at the time of exposure cannot be sufficiently reduced, and
If the depth of relief relief cannot be sufficiently increased, and if it exceeds 15% by weight, the crystallinity and hydrophilicity of the polymer will decrease.

Since the polyamide used in the present invention has the above-mentioned specific copolymer composition and has a crystallization temperature of room temperature or higher, the molded article (raw plate) has good shape stability and has a good flow during storage. There is no problem that the resulting shape changes. Nevertheless, the photosensitive resin composition can be easily subjected to hot melt molding at a relatively low temperature that does not cause thermal denaturation or thermal decomposition. In addition, since the polyamide used in the present invention has a moderate crystallinity in the photosensitive resin composition, it has excellent light transmittance and suppresses the scattering of irradiation light despite good shape stability of the raw plate. As a result, a clear image faithful to the original image can be obtained. The raw plate obtained from the photosensitive resin composition of the present invention has a very small amount of active light scattering at the time of exposure, and the active light can penetrate deeply.Moreover, both the exposure sensitivity and the water developability are extremely good. In the developing operation, a relief plate having a high resolution and a high relief depth can be created. Specifically, a relief image having a slit width of 300 μm and a depth of relief relief of 90 μm or more, which cannot be obtained with a conventional photosensitive resin composition of this type, can be obtained. Furthermore, it should be noted that the photocured portion shows sufficient water resistance and outstanding toughness, and the printing durability is significantly improved as compared with the related art.

The light scattering at the time of exposure of the photosensitive resin composition of the present invention is extremely small because, in addition to the use of a specific polyamide as the filling polymer, the photopolymerizable unsaturated monomer in the photosensitive resin composition is used. The total content of the monomer and the photopolymerization initiator, or the total content of the photopolymerizable unsaturated monomer, the photopolymerization initiator and the additive when further adding an additive such as a stabilizer or a plasticizer described below. The amount is 30-60% by weight, preferably 35-55% by weight, more preferably 40% by weight.
５０50% by weight. For example, U-3210 self-recording spectrophotometer manufactured by Hitachi, Ltd.
Scattering factor of light having a wavelength of 360 nm measured using a 50φ integrating sphere attachment device (150-0901) = [scattering transmission amount /
(Straight transmission amount + scattering transmission amount)] can be reduced to 10% or less (preferably 7.0% or less), which could not be achieved conventionally.

The photopolymerizable unsaturated monomer used in the present invention is a compound containing at least one photopolymerizable unsaturated group in the molecule, and known compounds can be used. Such compounds include, for example, acrylic acid, methacrylic acid, itaconic acid, 2-hydroxyethyl acrylate,
2-hydroxypropyl acrylate, acrylamide, methacrylamide, N-methylolacrylamide, N-acryloylmorpholine, pentaerythritol diacrylate, pentaerythritol triacrylate, glycerol dimethacrylate, ethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether and the like Unsaturated epoxy compounds, such as polyhydric acrylates, methacrylates, and glycidyl acrylates, obtained by the addition reaction of polyhydric glycidyl ether with a compound having an active hydrogen and an ethylenically unsaturated bond such as an unsaturated carboxylic acid or unsaturated alcohol Examples include addition products of compounds having active hydrogen such as acids and amines, unsaturated polyesters and unsaturated polyurethanes. These monomers can be used alone or in combination of two or more. It is preferable that the content of the photopolymerizable unsaturated monomer in the photosensitive resin composition is appropriately selected from the range of 5 to 50% by weight. When the amount is less than 5% by weight, the photocurability of the resin composition is impaired. When the amount is more than 50% by weight, the shape retention of the resin composition (raw plate) before exposure is impaired.

As the photopolymerization initiator, known photopolymerization initiators can be used. Specifically, for example, benzophenones, benzoins, acetophenones, benzyls, benzoin alkyl ethers, benzyl alkyl ketals,
Anthraquinones, thioxanthones and the like can be used. Preferred specific examples include benzophenone, benzoin, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzyldimethyl ketal, anthraquinone, 2-chloroanthraquinone, thioxanthone, 2-chlorothioxanthone, and the like. These are preferably contained in the photosensitive resin composition in an amount of 0.05 to 5% by weight. When the amount is less than 0.05% by weight, the photopolymerization initiation ability is hindered. When the amount is more than 5% by weight, the photocurability in the thickness direction of the raw plate in producing a relief for printing is reduced, and the image is likely to be chipped. Become.

The photosensitive resin composition can contain additives such as a stabilizer and a plasticizer, if necessary, in addition to the filler polymer, the photopolymerizable unsaturated monomer and the photopolymerizable initiator. Examples of the stabilizer include hydroquinone, hydroquinone monomethyl ether and 2,6-di-t-butyl-p-cresol, and these are preferably contained in the composition at about 0.001 to 5% by weight. .
The plasticizer is added for the purpose of changing the physical properties of the photocured product, and examples thereof include low-molecular plasticizers such as esters and amides, and oligomers such as polyesters, polyethers, and liquid rubbers. The plasticizer is contained in the composition in an amount of 0.1 to 20% by weight, preferably 5 to 15% by weight. In addition, according to the product use obtained after exposure and development, a known dye or pigment may be added to color the photosensitive resin composition.

The photosensitive resin composition of the present invention can be prepared by any known method such as hot pressing, casting, melt extrusion, or solution casting, in addition to the melt molding method for obtaining a relief plate for printing. It can be formed into a desired shape according to the target product.

When a relief plate for printing is obtained, a molded product (raw plate) formed into a sheet can be used by laminating it on a support with or without a known adhesive.
As the support, any material such as steel, aluminum, glass, a plastic film such as a polyester film, and a metal-deposited film can be used. When the sheet-like molded product (raw plate) is supplied as a laminate laminated on a support, a protective layer is further laminated in contact with the sheet-shaped molded product (raw plate). As the protective layer, a film-like plastic, for example, a polyester film having a thickness of 1 to 3 μm coated with a 125-μm-thick polyester film having a non-adhesive and transparent and dispersible or soluble in a developing solution is used. By contacting the protective layer having the thin polymer film with the sheet-shaped molded product (raw plate), even if the surface adhesiveness of the sheet-shaped molded product (raw plate) is strong, the protection performed at the next exposure operation is performed. The layer can be easily peeled off.

A layer of such a composition alone, or a photosensitive original plate comprising this layer and a support, is laminated on a negative layer or a positive film having a transparent image portion on a photosensitive layer in close contact with each other. When exposure is carried out by irradiating with actinic rays from above, only the exposed portions are insolubilized and cured. As the actinic ray, a light source such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a xenon lamp, and a chemical lamp having a wavelength of usually 300 to 450 nm is used.

Next, the unexposed portion is dissolved and removed with an appropriate solvent, particularly in the present invention, neutral water to obtain a relief plate having a clear image area. For this purpose, a spray developing device, a brush developing device, or the like is used.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. The number of parts in the following Examples and Comparative Examples is parts by weight.

Example 1 ε-caprolactam 52.5
Parts, N, N'-bis (γ-aminopropyl) piperazine adipate (40.0 parts), 1,3-bisaminomethylcyclohexane adipate (7.5 parts) and water (100 parts) were added to the reactor, and the mixture was sufficiently purged with nitrogen. After the internal pressure reached 10 kg / cm ² , the water in the reactor was gradually distilled off and returned to normal pressure in about 1 hour, and then normal pressure for 0.5 hour Was reacted. Maximum polymerization temperature is 210
A clear pale yellow polyamide-1 having a melting point of 140 ° C. and a specific viscosity of 1.83 at ℃ was obtained.

55.0 parts of polyamide-1, 7.7 parts of N-methyltoluenesulfonic acid amide, 0.02 parts of 1,4-naphthoquinone, 50.0 parts of methanol and 10 parts of water are heated and melted with a stirrer. After mixing in a kettle at 60 ° C. for 2 hours to completely dissolve the polymer, an acrylic acid adduct of trimethylolpropane triglycidyl ether was added in an amount of 30.1.
Parts, 3.1 parts of methacrylic acid, 0.1 part of hydroquinone monomethyl ether, 0.3 part of ammonium sulfite and 1.0 part of benzyldimethyl ketal were mixed and dissolved for 30 minutes. Next, the temperature was gradually raised to distill off methanol and water, and concentrated until the temperature in the kettle reached 110 ° C. At this stage, a viscous photosensitive resin composition having fluidity was obtained.

This photosensitive resin composition was placed on a polyester film having a thickness of 125 μm, and the same polyester film was laminated thereon. A sheet having a total thickness of 1050 μm was formed with a laminator, left at room temperature for 24 hours and heated at 85 ° C. for 3 minutes. . The light scattering property of the photosensitive resin composition sheet from which the polyester film was peeled was measured at 360 nm using a U-3210 type self-recording spectrophotometer manufactured by Hitachi, Ltd. and a 150φ integrating sphere attachment device (150-0901).
Was measured, the light scattering rate was 7.0%.

Copolyester (Vylon RV-30)
SS, manufactured by Toyobo Co., Ltd.) and a reaction product of a polyfunctional isocyanate (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) and a brown dye coated with a 15 μm-thick film to a thickness of 180 μm
The above photosensitive resin composition is cast by contacting the film with the polyester film as a support. 2 μm thick polyvinyl alcohol (AH-24, manufactured by Nippon Synthetic Chemical Co., Ltd.)
A 125 μm-thick polyester film coated with a film of the above was coated so that the film side was in contact with the photosensitive resin composition,
Using a laminator, a sheet-like laminate having a total thickness of 1080 μm was formed. This sheet solidified into a hard plate at room temperature. After 24 hours, the sheet was heated at 85 ° C. for 3 minutes to obtain a raw plate.

After storing the raw plate for 7 days or more,
Then, the test negative film (the gray scale negative film for sensitivity measurement and the negative film of the image for evaluating image reproducibility) was brought into close contact with each other under vacuum, and exposed to an ultrahigh pressure mercury lamp for 40 seconds. Next, tap water was used as a developer with a brush type washer (100 μmφ nylon brush, JW-A2-PD manufactured by JEOL Ltd.),
Development at 2 ° C. for 2 minutes gave a relief image.
After further drying at 60 ° C. for 5 minutes with hot air, the relief obtained by post-exposure with an ultra-high pressure mercury lamp for 30 seconds was evaluated.
Gray scale: 17 steps, image area: 2% halftone, 100μ
m independent points and 30 μm thin lines were reproduced. Also, 30
The depth of relief relief at a slit width of 0 μm was 90 μm. As a result of performing a printing test with this relief, a printed matter of a sharp image without sharpening of the image was obtained. Further, 300,000 copies were printed, but no relief jumps or cracks were generated, and extremely good printing durability was exhibited.

Comparative Example 1 ε-caprolactam 55.0
Part, N, N′-bis (γ-aminopropyl) piperazine adipate was used as a starting material, and polyamide-2 was synthesized in the same manner as in Example 1 except for the above. The obtained polymer was transparent and pale yellow with a melting point of 150 ° C. and a specific viscosity of 2.02. Using the polyamide-2, a photosensitive resin composition was prepared in the same manner as in Example 1 to prepare a raw plate. However, since the water development time became 10 minutes or more, the heat treatment temperature of the raw plate was set to 100 ° C. 3
Minutes, so that the development time could be 3 minutes.
When the light scattering rate of the raw plate was measured in the same manner as in Example 1, it was 11.4%. The image reproducibility was evaluated in Example 1.
When I went in the same way as above, the gray scale was 16 steps,
The image area reproduces 5% halftone dots, 200 μm independent points, and 30 μm fine lines, and the relief depth of 300 μm slit width is 4
It was 5 μm. Further, 300,000 copies were printed, but cracks were found on the relief surface.

Example 2 ε-caprolactam 55.0
Parts, N, N'-bis (γ-aminopropyl) piperazine adipate 40.0 parts, 1,3-bisaminomethylcyclohexane adipate 5.0 parts
In the same manner as in the above, polyamide-3 was obtained. The obtained polymer was transparent and pale yellow with a melting point of 145 ° C. and a specific viscosity of 1.88.
Using this polyamide-3, a photosensitive resin composition was prepared in the same manner as in Example 1 to prepare a raw plate. The heat treatment is 9
Performed at 5 ° C. for 3 minutes. The light scattering rate of the raw plate was measured in the same manner as in Example 1, and it was 5.3%. When the image reproducibility was evaluated in the same manner as in Example 1, the gray scale was 17 steps, 2% halftone dot, 200 μm independent point,
The fine line of 0 μm was reproduced, and the depth of relief with a slit width of 300 μm was 95 μm, which was good. Further, 300,000 copies were printed, but no relief jumps or cracks were generated, and extremely good printing durability was exhibited.

Comparative Example 2 ε-caprolactam 52.5
Parts, N, N'-bis (γ-aminopropyl) piperazine adipate (37.5 parts) and 1,6-hexamethylenediamine adipate (10.0 parts) as raw materials, and the same procedure as in Example 1 was repeated, except that the polyamide- 4 was synthesized. The obtained polymer was transparent and pale yellow with a melting point of 145 ° C. and a specific viscosity of 1.89. Using this polyamide-4, a photosensitive resin composition was prepared in the same manner as in Example 1 to prepare a raw plate. The light scattering rate of the raw plate was measured in the same manner as in Example 1 and found to be 15.2%. When the image reproducibility was evaluated in the same manner as in Example 1, the gray scale was 17 steps, 2% halftone dots,
00μm independent point, 30μm fine line reproduced but 300μm
The relief depth of the slit width was 35 μm, and a clear image could not be obtained.

Example 3 ε-caprolactam 52.5
Parts, N, N'-bis (γ-aminopropyl) piperazine adipate (37.5 parts), 1,3-bisaminomethylcyclohexane adipate (10.0 parts) as raw materials, and the same procedure as in Example 1 except for polyamide- 5 was synthesized. The obtained polymer was transparent and pale yellow with a melting point of 145 ° C. and a specific viscosity of 2.00. Using this polyamide-5, a photosensitive resin composition was prepared in the same manner as in Example 1 to prepare a raw plate. When the light scattering rate of the raw plate was measured in the same manner as in Example 1, it was 5.1%.
Met. When the image reproducibility was evaluated in the same manner as in Example 1, the gray scale was 17 steps, 2% halftone dots,
A 200 μm independent point and a 30 μm thin line were reproduced. 300μ
The depth of relief relief of m slit width was 105 μm, and a clear image was obtained. Further, 300,000 copies were printed, but no relief jumps or cracks were generated, and extremely good printing durability was exhibited.

Comparative Example 3 ε-caprolactam 37.5
Parts, N, N'-bis (γ-aminopropyl) piperazine adipate (42.5 parts), 1,3-bisaminomethylcyclohexane adipate (20.0 parts) as raw materials, and operating as in Example 1, polyamide -6 was synthesized. The obtained polymer was transparent and pale yellow with a melting point of 135 ° C. and a specific viscosity of 1.80. Using this polyamide-6, a photosensitive resin composition was prepared in the same manner as in Example 1, and a polyester film was laminated to form a laminated sheet. However, the photosensitive resin composition layer was not solidified and had a strong adhesive property. Since only the version was obtained, the performance evaluation was interrupted.

[0039]

As is apparent from the above description, the photosensitive resin composition of the present invention can be developed with water, has high sensitivity, and exhibits sufficient water resistance and mechanical strength after photocuring. A photosensitive resin composition can be obtained. In particular, a raw plate can be prepared by melt molding by a short-time heat treatment, and a relief plate for printing can be produced in which a high-definition print image can be stably formed for a long period of time by a short time of water development. A beneficial effect is obtained.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) C08K 5/092 C08K 5/092 5/10 5/10 5/13 5/13 5/20 5/20 5 / 45 5/45 C08L 77/00 C08L 77/00 G03F 7/00 502 G03F 7/00 502 7/004 501 7/004 501 502 502 7/027 502 7/027 502 7/028 7/028 F term ( Reference) 2H025 AA00 AA13 AB02 AC01 AD01 BC13 BC31 BJ00 CA00 CB24 CB41 CC01 CC05 FA17 FA42 2H096 AA02 BA05 EA02 GA08 4J001 DA01 DB02 DB04 DC13 DC25 EA06 EA14 EA15 EA17 EB06 EB07 EB08 GB03 EB09 GB03 GB06 JA20 JB06 JB34 JB42 JC01 4J002 CL051 EE037 EE047 EE057 EF046 EH009 EH076 EJ028 EP009 EP016 FD029 FD038 FD207 GP03 4J011 AA05 PA30 PA33 PA37 PA96 PB23 PB24 PC02 PC08 QA02 QA03 QA03 QA03 QAQ3 QB19 QB23 SA02 SA12 SA22 SA32 SA34 SA38 SA41 SA54 SA58 SA63 SA64 UA01 VA01 WA01

Claims (4)

[Claims] 1. A unit represented by the following general formula (I):
60% by weight and a unit 30 represented by the following general formula (II)
Characterized by containing a polyamide comprising 50 to 50% by weight and 5 to 15% by weight of a unit represented by the following general formula (III), a photopolymerizable monomer having an unsaturated bond, and a photopolymerization initiator. Photosensitive resin composition. Embedded image (Wherein, R ¹ is an alkylene group having 5 or more carbon atoms) Wherein R ² is a hydrocarbon group having 2 to 10 carbon atoms, R ³ is an alkylene group or a single bond having 1 to 4 carbon atoms, and R ⁴ is an alkylene group having 1 to 4 carbon atoms. ] (Wherein, R ⁵ is a hydrocarbon group having 2 to 10 carbon atoms, R ⁶ ,
R ⁷ is a methylene group or a single bond) 2. The photosensitive resin composition according to claim 1, wherein the total content of the monomer having a photopolymerizable unsaturated bond and the photopolymerization initiator is 30 to 60% by weight. 3. The composition further contains a stabilizer and / or a plasticizer, and the total content of the stabilizer and / or the plasticizer, the monomer having a photopolymerizable unsaturated bond and the photopolymerization initiator is 30 to The photosensitive resin composition according to claim 1, which is 60% by weight. 4. The photosensitive resin composition according to claim 1, wherein a scattering rate of light having a wavelength of 360 nm is 10% or less.