JP2001037713A - Electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic endoscope which prevents the occurrence of trouble, such as peeling, in a joint part, etc., even when autoclave sterilization is repetitively carried out. SOLUTION: Adhesives are respectively separately applied to the respective parts of a solid-state image pickup element 13, ceramic substrates 19 and 20 and a coated fiber 30 with an insulation tube 31 and thereafter, the solid-state image pickup element 13, the ceramic substrates 19 and 20 and the coated fiber 30 with the insulation tube 31 are coated with the adhesives or packing materials, etc., which are resin members, by which resin layers A are disposed and the solid-state image pickup element 13, the ceramic substrates 19 and 29 and the coated fiber 30 are sealed. At this time, the adhesives constituting the resin layers A are in the state that the adhesives are not adhered at all to a shielding frame 22, cable fixing frame 23, image pickup frame 14 and field lens 15 arranged to cover the solid-state image pickup element 13, the first ceramic substrate 19, the second ceramic substrate 20 and the coated fiber 30 or the state that the adhesives partly adhere thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic endoscope in which sterilization after use is performed by an autoclave.

[0002]

2. Description of the Related Art Conventionally, endoscopic procedures for observing the inside of a body cavity by inserting a slender insertion portion into the body cavity, and performing a therapeutic treatment using a treatment tool as necessary have been widely performed. .

As the endoscope, for example, there is an electronic endoscope having a built-in image pickup device provided with a solid-state image pickup device such as a charge-coupled device (abbreviated as CCD) at a distal end portion of an insertion portion. In an endoscope apparatus using this electronic endoscope, an image signal obtained by imaging with the solid-state imaging device and photoelectrically converted is generated as a video signal by a signal processing unit which is an external device of the endoscope. Observation and treatment can be performed while outputting to the monitor device and observing the endoscope image displayed on the monitor screen.

[0004] The imaging device of the electronic endoscope is, for example, as disclosed in Japanese Patent Application Laid-Open No. 9-56671, in which a solid-state imaging device and a circuit board having a cover glass bonded to a light receiving surface side and a signal line are covered by a shield member. An adhesive is filled in an inner space of the shield member, and the solid-state imaging device, a circuit board,
This is a structure for sealing a signal line.

[0005] An endoscope used in the medical field inserts an insertion portion into a body cavity to observe an organ or the like. Therefore, when an endoscope or the like used once is reused for another patient, the endoscope is used. Since it is necessary to prevent patient-to-patient infection by an endoscope, washing and disinfection must be performed after the completion of examination and treatment.

[0006] For disinfecting and sterilizing such endoscopes and the like, a gas such as ethylene oxide gas (EOG) or a disinfecting solution has been used. However, as is well known, sterilizing gases are highly toxic, and there has been a problem that the working process is complicated to ensure the safety of the sterilizing operation. Also, after sterilization, it takes time to aerate to remove gas adhering to the equipment. Therefore, there is a problem that the device cannot be used immediately after sterilization. Furthermore, there was a problem that running cost became expensive.

On the other hand, in the case of the disinfecting solution, there is a problem that management of the disinfecting solution is complicated, and it takes a lot of cost to dispose of the disinfecting solution.

Therefore, in recent years, without complicated work,
Autoclave sterilization, which can be used immediately after sterilization and has low running costs, is becoming the mainstream of disinfection and sterilization of endoscope devices. This autoclave sterilization is performed by exposing a used endoscope or the like to high pressure and high temperature steam.

[0009]

However, when an electronic endoscope provided with an imaging device disclosed in Japanese Patent Application Laid-Open No. 9-56671 is sterilized in an autoclave, the electronic endoscope is exposed to a high-temperature steam, and thus the solid-state imaging device is exposed. Elements, circuit boards,
The signal line, the shield member and the adhesive expand.

At this time, since the coefficient of thermal expansion of the adhesive is larger than that of other members such as a solid-state imaging device, a circuit board, a signal line, and a shield member, when the adhesive expands, a cover is formed by the expanded adhesive. In some cases, stress was applied in the direction in which the joint between the glass and the solid-state imaging device was peeled off.

[0011] Each time the stress is applied to, for example, autoclave sterilization, the stress is repeatedly applied to the joint between the cover glass and the solid-state image pickup device. In particular, a rigid endoscope used in a surgical field such as a laparoscope or a thoracoscope is sterilized in a short time by autoclave sterilization. Therefore, a rigid endoscope having a high autoclave resistance has been desired.

The present invention has been made in view of the above circumstances, and even when autoclave sterilization is repeatedly performed,
It is an object of the present invention to provide an electronic endoscope in which a problem such as peeling is prevented from occurring at a joint or the like.

[0013]

An electronic endoscope according to the present invention comprises:
An electronic endoscope including a solid-state imaging device sealed with a resin member, a joining member joined and arranged on a light receiving surface side of the solid-state imaging device, and a frame arranged around the solid-state imaging device. When sealing the solid-state imaging device with the resin member, sealing the solid-state imaging device by applying the resin member in a state where at least a part thereof is not attached to the joining member and the frame body. are doing.

According to this configuration, during autoclave sterilization, even if the adhesive expands, the expanded adhesive does not give stress to other members. Thus, it is possible to reliably prevent the joint between the solid-state imaging device and the joining member arranged in the solid-state imaging device from being stressed and peeled off from the joining portion.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to an embodiment of the present invention, FIG. 1 is a diagram illustrating an endoscope system including an electronic endoscope of the present embodiment, FIG. 2 is a diagram illustrating a configuration inside an insertion unit, FIG. 3 is a diagram for explaining the configuration inside the grip portion.

As shown in FIG. 1, the endoscope system of this embodiment has, for example, an effective length of 300 mm and an outer diameter of φ10 m.
m, a hard insertion part 2 whose exterior part is formed of a metal member.
And a so-called rigid endoscope 1 which is an electronic endoscope for the abdominal cavity and thoracic cavity in which an imaging unit described later is built in the distal end portion of the insertion section 2, and a light source which is an external device for supplying illumination light to the rigid endoscope 1 It mainly comprises a device 6 and a camera control unit 7 including an image processing circuit for generating an image signal transmitted from an image pickup unit provided in the insertion section 2 into a video signal.

A grip portion 3 serving also as an operation portion is provided at a base end of the insertion portion 2, and a universal cord having a signal line, a light guide, and the like inserted therein from the base end of the grip portion 3. 4 is extended. At the base end of the universal cord 4, a light source connector 4 a which is detachable from the light source device 6 is provided. A camera cable 5 having the signal line inserted therein extends from a side portion of the light source connector 4a. A camera connector 5a detachable from the camera control unit 7 is provided at a base end of the camera cable 5. Is provided.

A specific configuration of the insertion section 2 will be described with reference to FIG. As shown in the figure, the exterior of the insertion section 2 is made of a stainless steel outer tube 8 and an inner tube 9.
And a double-pipe structure in which is overlapped. A gap is provided between the outer tube 8 and the inner tube 9, and a light guide fiber 10 for transmitting illumination light of the light source device 6 is provided in the gap.

A cover glass 11 made of sapphire is provided on the distal end surface of the inner tube 9. The cover glass 11 is air-tightly joined to the inner peripheral surface of the distal end portion of the inner tube 9 by a joining / sealing means such as soldering or laser welding in a state where the outer peripheral surface of the glass side is coated with a metal coat. . This prevents high-pressure high-temperature steam from entering the insertion portion internal space 2a from the distal end side of the inner tube 9.

An objective lens unit 12 having a plurality of optical lenses disposed on a ceramic lens frame 12a facing the cover glass 11 is disposed in the insertion portion internal space 2a. Objective lens unit 1
The solid-state imaging device 13 is disposed at the image forming position 2.

The solid-state image pickup device 13 includes the lens frame 1.
2a is fixed to the base end of the imaging frame 14 made of, for example, metal and fixed to the base end of the inner peripheral surface of the imaging frame 14 with a convex surface at the front end and a flat surface at the base end side of the field lens 15 with an adhesive. The joint is arranged. That is, the solid-state imaging device 13 is joined by applying an adhesive between the light receiving side surface of the solid-state imaging device 13 and the plane of the field lens 15 as a joining member. The adhesive used at this time is
It is a UV-curable epoxy adhesive. Then, the solid-state imaging device 13, the imaging frame 14, the field lens 15
These are collectively referred to as the imaging unit 16. The solid-state imaging device 13 is a TAB-mounted CCD.

A cable connecting portion 17 is provided on the base end side of the image pickup section 16, and a TAB lead 18 extending from the solid state image pickup element 13 is connected to the solid state image pickup element 13 constituting the image pickup section 16. The first ceramic substrate 19 disposed on the base end side and the land (not shown) formed on the outer peripheral surface of the second ceramic substrate 20 disposed on the base end side of the first ceramic substrate 19 are electrically connected by soldering. Is fixedly connected.

An adhesive made of an insulating material is applied to the outer surface of the TAB lead 18 except for a soldered portion to be soldered to the land. By applying this adhesive, the adhesive is disposed so as to cover the outer surface of the TAB lead 18, the outer surface (metal) of the chip body 21 provided on the solid-state imaging device 13, and the periphery of the imaging section 16. The metal shield frame 22 and the metal cable fixing frame 23 are electrically insulated.

An IC 24 is provided on the first ceramic substrate 19.
a and electrical components such as the capacitor 24b are mounted.
The capacitor 24b located on the solid-state imaging device 13 side is fixedly arranged on the first ceramic substrate 19 by an adhesive made of an insulating member. As a result, electrical insulation between the capacitor 24b and the chip body 21 of the solid-state imaging device 13 is ensured.

On the second ceramic substrate 20, electric components such as a capacitor 26 and a resistor 27 are mounted. A plurality of through-holes 28 are formed in the second ceramic substrate 20, and core wires 30 of a multi-core cable 29 passing through the insertion section 2 are fixed to these through-holes 28 by soldering. An insulating tube 31 made of an insulating member is covered on the outer periphery of the core wire 30.

The root of the core wire 30 fixed to the through hole 28 by soldering is used as a protective layer for preventing breakage due to stress applied to the solder fixing portion and the like in the assembling process after the soldering. For example, an adhesive is applied.

That is, in this embodiment, an adhesive is individually applied to each part of the solid-state imaging device 13, the first ceramic substrate 19, the second ceramic substrate 20, and the core wire 30 with the insulating tube 31, and thereafter, The solid-state imaging device 13, the first ceramic substrate 19, the second ceramic substrate 20, and the core wire 30 are provided with a resin layer A by applying a resin member such as an adhesive or a filler. The first ceramic substrate 19, the second ceramic substrate 20, and the core wire 30 are sealed.

At this time, the adhesive forming the resin layer A is the solid-state imaging device 13, the first ceramic substrate 19,
The second ceramic substrate 20, the shield frame 22, the cable fixing frame 23, the imaging frame 14, and the field lens 15 which are arranged so as to cover the core wire 30 are not attached to the field lens 15 at all, or are in a state where a part of the adhesive is attached. The most desirable mode is that the resin layer A does not adhere to the shield frame 22, the cable fixing frame 23, the imaging frame 14, and the field lens 15 at all.

A first shield 32 formed by braiding a tin-plated copper wire having a wire diameter of about 0.05 mm, for example, is provided on the outer periphery of the core wire 30 with the insulating tube 31.
A first insulating coating 3 is provided on the outer periphery of the first shield 32.
3, and a second shield 34 formed by braiding a tin-plated copper wire having a wire diameter of about 0.08 mm so as to cover the entire first insulating coating 33, for example. A second insulating coating 35 is provided on the outer periphery of the secondary shield 34 to insulate the second shield 34 from a conductive member disposed around the second shield 34.

After the first shield 32 of the core wire 30 is integrally bound by a copper wire 36, the copper wire 36 and the first shield 32 are connected to each other at an equal potential by soldering.

After the core wire 30 is configured as described above, the base end side of the cable fixing frame 23 is arranged around the cable connection portion 17. At this time, the position of the opening 37 provided on the side surface of the cable fixing frame 23 and the position of the copper wire 36 are substantially matched, and the copper wire 38 is wound and tightened from the opening 37 side. Adhesive 39
Is poured and cured. As a result, the first shield 32, the second shield 34, and the cable fixing frame 23 are integrally fixed in an equipotential state.

On the other hand, a shield frame 22 is integrally fixed to the distal end side of the cable fixing frame 23 by soldering or a conductive adhesive. The distal end of the shield frame 22 is integrally fixed to the imaging frame 14 with a conductive adhesive.

A metal tip pipe 40 is integrally fixed to the outer periphery of the cable fixing frame 23 on the base end side by a conductive adhesive. The distal end of the distal connecting pipe 41 is integrally fixed to the inner peripheral surface of the proximal end of the distal pipe 40 by a conductive adhesive.

The proximal end of the connecting pipe 41 at the distal end is 60% to 70% of the outer diameter of the distal pipe 40.
%, The distal end of a small-diameter pipe 42 having an outer diameter of about% is fitted and fixed integrally with a conductive adhesive. The small-diameter pipe 42 extends through the insertion section 2 and extends the base end to the vicinity of the grip section 3.

Referring to FIG. 3, a specific configuration of the gripping section 3 will be described. As shown in the figure, on the inner peripheral surface of the proximal end portion of the small diameter pipe 42 extending to the vicinity of the grip portion 3, a rear end side connecting pipe 4 configured substantially similarly to the front end side connecting pipe 41.
3 are integrally fixed. A stainless steel pipe receiver 45 having an insulating pipe 44 provided on the inner peripheral surface side is disposed at a base end of the rear end side connection pipe 43. A stainless steel hermetic is provided at the base end of the pipe receiver 45. The connector 46 is connected and fixed in an electrically conductive state.

A stainless steel pipe 47 is hermetically joined to the outer peripheral surface of the hermetic connector 46 by laser welding. An airtight frame 48 made of stainless steel is airtightly joined to the outer peripheral surface side of the pipe 47 by high frequency soldering. Further, the tip of the hermetic frame 48 is hermetically joined to the ceramic frame 49 by high-frequency soldering.

On the other hand, a connecting member 50 made of stainless steel is hermetically joined to the tip of the ceramic frame 49 by laser welding. A hole for fitting the outer peripheral surface of the inner tube 9 is formed at the distal end of the connection member 50, and the inner tube 9 fitted to the hole and the connection member 50 are hermetically sealed by laser welding. Is joined to.

A through-hole for arranging a plurality of signal transmission pins 51 is formed in the center of the hermetic connector 46, and the hermetic glass 52 is placed in a state where the pins 51 are disposed in the through-holes. By sealing, the main body of the hermetic connector 46 and the hermetic glass 5 are sealed.
2 and between the hermetic glass 52 and the pin 51 are hermetically bonded and fixed.

The distal end of the pin 51 protruding from the distal end face of the hermetic connector 46 is connected to the core 30 extending through the insertion portion 2 and the proximal end of the first shield 32 by soldering. It is electrically connected.
A cylindrical solder receiver 54 is provided at the base end of the pin 51.
One end of a plurality of core wires 56 inserted into a cable 55 having the other end connected to the CCU 7 is connected to the base end of the solder receiver 54 by soldering. Electrically fixed.

As described above, by forming the joint between the members, the cover glass 1 shown in FIGS.
1, an inner space surrounded by the inner tube 9, the connecting member 50, the ceramic frame 49, the airtight frame 48, the pipe 47, and the hermetic connector 46 is completely airtight. That is, by configuring the rigid endoscope 1 with this structure, high-temperature and high-pressure steam during autoclave sterilization does not enter the internal space.

On the other hand, in the outer tube 8, in order to electrically insulate all components disposed on the inner peripheral surface side of the outer tube 8, the objective lens unit 12, the imaging frame 14, the shield frame 22, Tip pipe 4
0, a heat-shrinkable tube 53 is covered over the front end connecting pipe 41, the small diameter pipe 42, and the rear end connecting pipe 43.

At this time, since the lens frame 12a of the objective lens unit 12 is made of ceramic, it is not necessary to cover the heat-shrinkable tube 53. However, in order to secure a creepage distance for the purpose of further increasing the withstand voltage, Shrink tube 53
4 mm to 5 mm from the tip surface of the tip pipe 40.
mm and extends over the objective lens unit 12. This further improves electrical safety.

In this embodiment, all the members are covered with one heat-shrinkable tube 53, but, for example, from the objective lens unit 12 to the distal connecting pipe 41
Up to one heat-shrinkable tube, end-side connecting pipe 41
Another heat-shrinkable tube may be used to cover the entire length of the small-diameter pipe 42 from the end, and the rear end-side connecting pipe 43 may be separately covered with another heat-shrinkable tube. In this case, in order to secure the creepage distance for electric safety, the portion where the heat shrink tubes overlap each other is 4 m.
m to 5 mm.

In any case, a heat-shrinkable tube is placed over the portion from the objective lens unit 12 to the distal connecting pipe 41 so that the objective lens unit 12 and the imaging section 16 are not deformed or damaged by vibration or the like. In this state, it is fitted and arranged on the inner circumference of the inner tube 9.

A plurality of core wires 56 whose ends are joined to the solder receiver 54 by brazing or the like are connected to a resin pipe 57 for insulation.
The space of the resin pipe 57 is filled with a filler 58 made of silicone rubber for stably holding and fixing the core wires 56.

On the outer peripheral surface side of the resin pipe 57, a stainless steel protection frame 59 is screwed to the hermetic connector 46 via a screw portion 60 in order to protect the core wire 56, the resin pipe 57, and the filler 58. It is fixed.
Thus, the protection frame 59 and the hermetic connector 46 are electrically connected.

Further, the plurality of core wires 56 are united by a net-shaped shield 61, and are disposed so as to be pressed by a screw 62 provided on the base end side of the protective frame 59 and a distal end surface of the screw 62. It is electrically connected to the protection frame 59 via the ferrule 63. The ferrule 63 is electrically connected to the mesh shield 61 by being pressed from the outside by the screw 62.

That is, the pipe receiver 45, the rear end side connecting pipe 43, the small diameter pipe 42, and the front side connecting pipe 4 which are on the front end side of the hermetic connector 46.
1, the tip pipe 40 and the imaging frame 14 are electrically connected.

Therefore, the net-like shield 61 extends substantially to the base end portion of the objective lens unit 12 and is in the same state as covering the solid-state image pickup device 13 and the like. The generation of harmful electromagnetic noise through the 30 or the like and the reception of external electromagnetic noise are extremely reduced.

A cylindrical rubber ring 64 is disposed on the outer periphery of the cable 55.
4 is a hole 65 formed at the base end of the protection frame 59.
And pressed by screws 66 from the proximal end side. Thus, the cable 55 is fixed to the protective frame 59, and when a stress such as pulling, pushing, bending, or the like is applied to the proximal end of the cable 55, the influence of the stress is applied to the distal end side of the ferrule 63. It is configured not to give.

The grip body 3a covering the connection member 50 and the screw 66 configured as described above is fixed to the base end of the outer tube 8 in a watertight manner.

As described above, the adhesive is individually applied to each part of the solid-state imaging device, the first ceramic substrate, the second ceramic substrate, and the core wire, and thereafter, the solid-state imaging device, the first ceramic substrate, and the second ceramic substrate are coated. When the resin layer A is formed by applying an adhesive so as to cover the substrate and the core wire, the edge of the resin layer A is formed by the solid-state imaging device, the first ceramic substrate, and the second ceramic substrate.
Ceramic substrate, shield frame arranged around the core wire,
Due to the high temperature during autoclave sterilization, the cable fixing frame, the imaging frame, and the field lens are configured so that they do not adhere to the field lens at all, or that some parts adhere to other parts without attaching. When the solid-state imaging device, the first ceramic substrate, the second ceramic substrate, the core wire, and the resin layer A thermally expand, respectively, the resin layer A expands, thereby forming a shield frame, a cable fixing frame, an imaging frame, a field lens, and a solid. It is possible to prevent stress generated between the image sensor and the image sensor.

That is, when the resin layer is not attached to the shield frame, the cable fixing frame, the imaging frame, and the field lens at all, or is in a state where a part is attached but the other part is not attached, Stress applied to the joint between the lens and the solid-state imaging device is eliminated. This prevents the solid-state image sensor and the cover glass or lens bonded to the image sensor from peeling even after repeated autoclave sterilization, so that image deterioration caused by peeling of the bonded portion is eliminated.

In this embodiment, the member joined to the solid-state imaging device 13 is a glass member such as a lens. However, the member joined to the solid-state imaging device 13 is not limited to a glass member. It may be joined to a metal frame or a ceramic frame. Also in this case, similarly to the above, the resin layer A applied around the solid-state imaging device 13 does not adhere to a metal frame or the like at all, or has a configuration in which one part adheres and the other part does not adhere. is there. This prevents separation of the joint between the solid-state imaging device 13 and the metal frame or the ceramic frame during autoclave sterilization.

The rigid endoscope 1 shown in the above-described embodiment is an electronic endoscope in which the solid-state imaging device 13 is disposed at the distal end of the insertion section 2. However, from the viewpoint of making the surgical operation less invasive. For the rigid endoscope 1 having an outer diameter of about φ10 mm, for example, an electronic endoscope having an extremely thin insertion section 2 having an outer diameter of the insertion section 2 of φ5 mm or less is desired.

However, since it is difficult to dispose the solid-state imaging device 13 inside the extra-fine insertion section 2, when the above-mentioned electronic endoscope is configured, the outside diameter of the insertion section 2 is reduced to a small diameter. A structure in which a relay lens that can be formed is provided, and the solid-state imaging device 13 is provided in the grip portion 3 is adopted. In addition,
Of course, even an ultra-fine electronic endoscope having this structure needs to be compatible with autoclave sterilization.

For this reason, as shown in FIG. 4, the hermetic connector 46, the pipe 47, the airtight frame 48, the ceramic frame 49, the connecting member 50, the inner tube 9 and the cover glass made of the sapphire at the tip (not shown) are the same as in the above-described embodiment. The interior space surrounded by these components is completely airtightly joined by airtight joining.

Also in this ultra-fine electronic endoscope, an adhesive applied around the solid-state image sensor 13 to prevent the joint between the solid-state image sensor and the member joined to the solid-state image sensor from peeling off during autoclave sterilization. Does not adhere to the holding frame 102 at all, or even if it adheres, only a part and the other parts do not adhere.

However, there are the following problems in assembling. That is, it is necessary to match the optical axis of the relay lens 100 disposed inside the insertion section 2 with the optical center of the solid-state imaging device 13, and when placing the inner tube 9 in the outer tube 8, That is, the central axis of the fixed pipe receiver 109 and the central axis of the lens frame 110 must be matched.

If the central axis of the pipe holder 109 does not coincide with the central axis of the lens frame 110, the outer diameter of the hermetic connector 46 integrated with the lens frame 110 is attached to the pipe 47. It becomes stuck and cannot be inserted. For this reason, in the present embodiment, the optical axis of the relay lens 100 and the optical center of the solid-state imaging device 13 are provided by providing fine adjustment means without relying only on the processing accuracy and assembly accuracy of the ordinary lens and frame. And the central axis of the pipe holder 109 and the central axis of the lens frame 110 are aligned.

As shown in the figure, in the present embodiment, a first fine adjustment mechanism for adjusting the optical axis of the relay lens 100 and the optical center of the solid-state imaging device 13 as fine adjustment means,
A second fine adjustment mechanism for adjusting the center axis of the pipe holder 109 and the center axis of the lens frame 110 is provided.

The first fine adjustment mechanism sets the outer diameter of the holding frame 102 of the solid-state imaging device 13 to be smaller than the inner diameter of the frame 101 on the base end side of the relay lens 100. Are provided with a plurality of adjustment screws 103 which penetrate through and protrude toward the inner peripheral surface side. Therefore,
The screwing amount (projection amount toward the inner peripheral surface side) of the plurality of adjustment screws 103 is appropriately adjusted, and the optical center of the solid-state imaging device 13 is moved with respect to the optical axis of the relay lens 100 to perform positioning. After the completion of the alignment adjustment, the optical axis of the relay lens 100 and the optical center of the solid-state imaging device 13 coincide with each other by positioning and fixing.

On the other hand, the second fine adjustment mechanism
The inner diameter of the pipe holder 109 is set to be larger than the outer diameter of 2, and a plurality of adjustment screws 104 penetrating the side surface of the pipe receiver 109 and protruding toward the inner peripheral surface side are provided. Therefore, the screwing amount (projection amount to the inner peripheral surface side) of the plurality of adjusting screws 104 is appropriately adjusted to adjust the center axis of the pipe receiver 109 and the hermetic connector 46 connected to the pipe receiver 109 to the relay lens 100 and the relay lens 100. Positioning can be performed by moving the solid-state imaging device 13 with respect to the coincident axis center. After the completion of the alignment adjustment, the central axis of the hermetic connector 46 and the central axis of the lens frame 110 are brought into a state in which they are positioned and fixed.

By providing the above-described fine adjustment mechanism, the inner tube 9 can be easily and reliably inserted into the outer tube 8.

The holding frame 102 is preferably made of an insulating member such as ceramic from the viewpoint of electrical insulation.

The electrical connection between the solid-state imaging device 13 and the pins 51 of the hermetic connector 46 is made by a simple line 105 having no shield. This is because the simple wire 105 is easier to handle than the coaxial wire having the shield, and the length of the assembly is short, so that the use of the simple wire 105 can shorten the entire length of the grip portion 3. .

Further, in order to prevent the holding frame 102 from dropping into the hermetic connector 46 by mistake when the adjusting screw 104 is removed, the pins 51 and the like are prevented from being damaged. By providing a movement restricting member 106 such as a screw or a rivet, troubles during assembly are eliminated.

It should be noted that the present invention is not limited to only the above-described embodiments, but can be variously modified without departing from the gist of the invention.

[Appendix] According to the above-described embodiment of the present invention, the following configuration can be obtained.

(1) A solid-state image sensor sealed with a resin member, a joining member joined to the light-receiving surface of the solid-state image sensor, and a frame disposed around the solid-state image sensor. In the electronic endoscope provided, when the solid-state imaging device is sealed with the resin member, the resin member is applied to the joining member and the frame so that at least a part thereof is not attached to the solid-state imaging device. An electronic endoscope in which the element is sealed.

(2) The electronic endoscope according to appendix 1, wherein the resin member is an adhesive or a filler.

(3) The electronic endoscope according to appendix 1, wherein the joining member is a glass member, a metal member, or a ceramic member.

(4) The electronic endoscope according to appendix 1, wherein the frame is formed of a metal member.

(5) The electronic endoscope according to appendix 1, wherein the solid-state imaging device and the joining member are joined and fixed by an adhesive.

(6) The electronic endoscope according to appendix 5, wherein the adhesive is an ultraviolet-curable adhesive.

(7) The electronic endoscope according to appendix 5, wherein the adhesive is an epoxy adhesive.

[0077]

As described above, according to the present invention, it is possible to provide an electronic endoscope in which even if autoclave sterilization is repeatedly performed, occurrence of a problem such as peeling at a joint or the like is prevented. .

[Brief description of the drawings]

FIG. 1 to FIG. 3 relate to an embodiment of the present invention,
FIG. 1 is a diagram illustrating an endoscope system including an electronic endoscope according to the present embodiment.

FIG. 2 is a diagram illustrating a configuration inside an insertion unit.

FIG. 3 is a diagram illustrating a configuration inside a gripping unit.

FIG. 4 is a diagram illustrating a configuration of a gripping portion of an electronic endoscope having an extremely thin insertion portion.

[Explanation of symbols]

 2 Insert portion 8 Outer tube 9 Inner tube 13 Solid-state imaging device 15 Field lens 19 First ceramic substrate 20 Second ceramic substrate 30 Core wire

Claims (1)

[Claims] 1. A solid-state imaging device sealed with a resin member, a joining member joined and arranged on a light receiving surface side of the solid-state imaging device, and a frame arranged around the solid-state imaging device. In the electronic endoscope, when the solid-state imaging device is sealed with the resin member, the resin member is applied to the joining member and the frame so that at least a part thereof is not attached to the solid-state imaging device. An electronic endoscope characterized in that the endoscope is sealed.