JP2001036295A - Apparatus and method for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting a component wherein the component can be mounted more accurately with as simple a structure as possible. SOLUTION: After images of a component 60 to be mounted and a substrate 50 for receiving the component are overlapped by an image pickup unit 40, both relative positions are adjusted while visually checking the picked-up images. Since the image pickup unit is structured so that an image pickup point and a retreat point can be advanced/retreated, mounting can be completed only by lowering the component with respect to the substrate after adjustment of the positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method, and more particularly, to a BGA (Ball Grid).
The present invention relates to a component mounting apparatus and a component mounting method suitable for mounting components according to (d Array).

[0002]

2. Description of the Related Art Conventionally, as this type of component mounting apparatus, one shown in FIG. 1A, the component mounting apparatus 1 includes a chuck 2, CCD cameras 3 and 4, and an XY table 5.
And the CCD camera 3 are supported by a plate-shaped member 6x.
The chuck 2 and the CCD camera 3 are configured to be integrally movable in the longitudinal direction of the plate member 6x, and the plate member 6x is supported by the plate member 6y and moves in the longitudinal direction of the plate member 6y. It is possible. Further, the plate member 6
y is supported by the plate-shaped member 6z, and is movable in the longitudinal direction of the plate-shaped member 6z.

The chuck 2 supports a mounting component 7, and the XY table 5 supports a mounting substrate 8. Therefore, chuck 2 and CC
The D camera 3 moves along the plate member 6x, the plate member 6x moves along the plate member 6y, and the plate member 6y moves along the plate member 6z. Is transported to a desired position in the x, y, z space shown in FIG.

In mounting components, first, an image is taken while the chuck 2 transported above the CCD camera 4 supports the mounted component 7. FIG. 12C shows an example of a captured image of the CCD camera 4. At this time, the position of the contact point indicated by a small circle on the mounted component 7 relative to the predetermined position of the chuck 2 is calculated based on the captured image of FIG.

After that, the chuck 2 and the CCD camera 3 move on the XY plane to near the mounting position. And FIG.
An image of the mounting board 8 is taken as shown in FIG. According to the captured image, the relative position of the mounting position indicated by a small circle on the mounting substrate 8 with respect to the current position is determined. Here, since the relative position of the contact point on the mounting component 7 has already been determined, the chuck 2 is moved on the XY plane so that the position of the contact point on the mounting component 7 and the mounting position on the mounting substrate 8 match. Move with
It is moved downward along the Z axis to complete the mounting.

[0006]

The above-described conventional component mounting apparatus and component mounting method have the following problems. That is, in the conventional example, as a process of determining the mounting position of the component, the contact point of the mounted component held on the chuck and the mounting position of the mounting board are determined based on the CCD image, and the mounted component is transported. Is required. Therefore, an error occurs at the time of calculation based on an image and an error occurs at the time of transport, and the occurrence of these errors cannot be essentially avoided.

The present invention has been made in view of the above problems, and has as its object to provide a component mounting apparatus and a component mounting method capable of performing mounting with higher accuracy with a configuration as simple as possible.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, there is provided a mounting board supporting member for supporting a mounting board, and a movable member for supporting a mounting component in a direction perpendicular to the mounting board. A Z-axis moving mechanism for mounting the mounted component, a positioning adjustment mechanism capable of adjusting the relative positioning of the mounted component with respect to the mounting board, and an imaging point between the mounting board and the mounted component and between the two. An imaging unit that is supported so as to be able to advance and retreat between the evacuation points withdrawn from the evacuation point, and forms an image vertically above and vertically below the image pickup point on one image sensor,
Image output means for outputting an image captured by the imaging unit.

In the invention according to claim 1 configured as described above, the mounting board supporter supports the mounting board, and the Z-axis moving mechanism supports the mounting component while supporting the mounting component. It is possible to move the component in a vertical direction with respect to the supported mounting board and mount the mounting component.
Here, since the relative position between the mounted component and the mounting board is adjusted while visually recognizing the image, the relative positioning of the mounted component with respect to the mounting board can be adjusted by the positioning adjustment mechanism. It has become.

The imaging unit is supported so as to be able to advance and retreat between an imaging point between the mounting board and the mounting component and a retreat point retracted from between the mounting substrate and the mounting component. The lower image is formed on one image sensor. The image picked up by the image pickup unit is output by the image output means. Therefore, the user can position the mounted component and the mounting board by the positioning adjustment mechanism while visually recognizing the image picked up by the image pickup unit output by the image output means. After that, the imaging unit is retracted, and the mounted component is moved and mounted on the mounting board by the Z-axis moving mechanism.

At this time, the image picked up by the image pickup unit is picked up between the mounting board and the mounted components, and the images vertically above and below the image pickup unit are superimposed on one. Therefore, the positioning adjustment is performed while visually recognizing the real images of the two. Further, only the Z-axis adjustment mechanism is driven for component mounting by retreating the imaging unit after performing the positioning adjustment, so that errors can be reduced and very high-precision component mounting is possible.

As described above, according to the present invention, it is possible to mount components with high accuracy. Therefore, a so-called leadless component such as a BGA that mounts a mounted component on a solder pad on a mounting board is mounted. Although it is particularly preferable to use it, it goes without saying that it can be used for mounting out-lead components. In addition, the mounting board supporting member only needs to be able to support the mounting board. The mounting board support may be fixed by grasping the edge of the board on a so-called XY table, or the mounting board may be mounted on a portable base. It may be configured to be placed in the Z-axis of the Z-axis moving mechanism while being supported.

Here, the mounting board is generally about 1 mm thick and various in size. Therefore, when a mounting board of a certain size is supported by gripping an edge or the like, bending may occur at the center of the mounting board. Since this bending means that the mounting substrate moves in the Z-axis direction in the present invention, it may be necessary to fix the mounting substrate without bending at the mounting position. Therefore, as an example of a configuration for this purpose, the invention according to claim 2 is the component mounting apparatus according to claim 1, wherein the mounting substrate support is substantially the same as a mounting portion while supporting an edge of the mounting substrate. The position is supported from below the mounting board.

In the second aspect of the present invention, the mounting board supporting member supports the edge of the mounting board, and furthermore, the mounting board supporting member is located at substantially the same position as the mounting portion. Support from below. Here, what is supported from below is substantially the same position as the mounting portion, and does not necessarily need to be directly below the mounting position. In other words, here, it is sufficient that the positional variation in the Z-axis direction of the mounting portion can be reduced by supporting from below, and it is often sufficient to support from below at a position slightly away from the mounting position. .
Needless to say, it is preferable to support the device directly below the mounting position.However, it is conceivable that some element or the like is already wired on the lower surface of the mounting board immediately below the mounting position. A sufficient support effect can be obtained.

Further, the member for supporting from below can adopt various structures. For example, it can be configured by interposing a member having substantially the same height as the portion where the mounting substrate is hollow, and as a more preferable example, the mounting substrate is mounted in this opening while opening upward. It is conceivable to use a member capable of adsorbing the substrate and supporting the mounting substrate at substantially the same height as the hollow portion. In this case, since the mounting substrate is attracted, it is possible to reduce positional variations not only in the Z-axis direction but also in the XY-axis direction, and it is possible to mount components with higher precision.

When mounting a component, the Z-axis moving mechanism can move the mounted component in a direction perpendicular to the mounting board, that is, in the Z-axis direction, and mount the mounted component so as to be mounted on the mounting board. Good. Here, at the time of positioning adjustment, it is sufficient that the mounted component can be supported above the Z-axis of the mounting board, and various configurations such as mechanical gripping of the mounted component can be considered. In many cases, it is desired to prevent the user from moving due to contact friction when releasing the gripping state after mounting the device on the mounting board. As a preferred example in such a case, the invention according to claim 3 is the component mounting apparatus according to claim 1 or 2, wherein
The shaft moving mechanism has a configuration in which a mounted component is suction-supported by a chuck connected to a suction mechanism that suctions gas.

In the invention according to claim 3 configured as described above, the Z-axis moving mechanism includes a chuck for sucking and supporting the mounted component, and the chuck is connected to a suction mechanism for sucking gas. I have. That is, the mounted component is suction-supported by a mechanism such as a so-called vacuum chuck, and mounting is performed by releasing the suction after mounting the mounted component on the mounting board. At this time, the suction is performed on the upper surface of the mounted component, so that it can be adopted for a mounted component of any thickness. There is no displacement of mounted components.

Here, the suction mechanism only needs to be capable of sucking the mounting member, and may be configured to be capable of sucking gas. In order to obtain a simple configuration, for example, it may be configured by a small jet pump called an ejector, or may be configured by connecting various other types of vacuum pumps.

When the mounted component is supported by the chuck connected to the suction mechanism as described above, the mounted component is attracted to a predetermined opening, but the size of the mounted component varies. In some cases, one component mounting apparatus may want to handle mounted components of various sizes. As a preferable example in such a case, the invention according to claim 4 is the component mounting apparatus according to claim 3, wherein the chuck is:
The suction nozzle portion for sucking and supporting the mounted component can be replaced according to the size of the mounted component.

In the invention according to claim 4 configured as described above, the chuck is provided with a suction nozzle as an opening of the suction mechanism, and the suction nozzle portion sucks and supports the mounted component. The suction nozzle portion can be replaced according to the size of the mounted component. As a result, it becomes possible to select a suction nozzle having an optimum diameter according to the size of the mounted component, and the suction support becomes unstable due to the small suction nozzle with respect to the mounted component, It is possible to prevent the mounting nozzle from becoming impossible to support due to the large suction nozzle.

The mounted components supported by suction can be mounted on the mounting board by releasing suction, but the user often operates while looking at the image output means or the mounting board. It is convenient if the inhalation can be released without greatly moving the line of sight. Therefore, as an example of such a configuration, the invention according to claim 5 is the component mounting apparatus according to claim 3 or 4, wherein the suction mechanism moves the mounted component onto a mounting board. After that, the suction of the mounted component can be released by a switch disposed at the user's foot.

In the invention according to claim 5 configured as described above, a switch is disposed at the foot of a user who operates the component mounting apparatus, and the switch is disposed after the mounted component is moved onto the mounting board. When the user operates the switch at the same foot, the suction of the mounted component by the suction mechanism is released. Therefore, the user can perform the component mounting by releasing the suction without moving the line of sight from his / her own hand.

Further, as another example of the configuration that enables the release of inhalation while suppressing the movement of the user's line of sight, the invention according to claim 6 is the invention according to claims 3 to 5
In the component mounting apparatus according to any one of the above, the suction mechanism can release suction of the mounted component by a switch arranged at a user's hand after moving the mounted component onto a mounting board. There is.

In the invention according to claim 6 configured as described above, a switch is provided near a user who operates the component mounting apparatus, and the switch is disposed after moving the mounted component onto the mounting board. When the user operates the switch at hand, the suction of the mounted components in the suction mechanism is released. Therefore, the user can perform the component mounting by releasing the suction without moving the line of sight from his / her own hand. Here, the switch at hand may be configured to be operable by the user without moving the line of sight, and its position is various. For example, it is possible to adopt a configuration in which a lever for moving a mounted component by the Z-axis moving mechanism during component mounting is provided, and a button switch is provided at the end of the lever.

In the above-mentioned positioning adjustment mechanism, it is sufficient that the positioning of the mounted component relative to the mounting substrate can be adjusted. After this adjustment, the Z-axis is moved and the contact point of the mounted component and the mounting of the mounting substrate are mounted. It is only necessary that the position can be adjusted so as to be in contact with the position. That is, the mounting component and the mounting board are physically supported above and below the Z-axis at the time of positioning adjustment, and when either of them is moved, the relative positions of the two change. Therefore, the positioning is adjusted by changing the relative position based on the image captured by the imaging unit.

Here, as a specific example of a configuration for moving either the mounted component or the mounting board, the invention according to claim 7 is the component mounting apparatus according to any one of claims 1 to 6. In the above, the positioning adjustment mechanism is configured to
An XY-axis adjusting mechanism capable of adjusting a relative position in an XY-axis direction in an XY plane orthogonal to the Z-axis in the axis moving mechanism;
And a θ adjustment mechanism capable of adjusting a relative position in the θ rotation direction about the Z axis in the XY plane.

According to a seventh aspect of the present invention, the positioning adjustment mechanism includes an XY-axis adjustment mechanism, and the positioning adjustment mechanism has a relative position in the XY-axis direction on an XY plane orthogonal to the Z-axis in the Z-axis moving mechanism. The position is adjustable. Also,
A θ adjustment mechanism is provided, and the relative position can be adjusted in the θ rotation direction about the Z axis in the XY plane.
In other words, in consideration of superimposing congruent figures placed apart on the same plane, generally, a parallel movement operation and a rotation movement operation of the figures are required.

Therefore, it is possible to perform parallel movement in the XY plane by the XY axis adjustment mechanism, and to perform rotational movement by the θ adjustment mechanism. As a result, it is possible to position and adjust the relative position between the mounted component and the mounting board while visually recognizing the image of the imaging unit. Here, at the time of positioning adjustment, adjustment may be performed not only in the XY plane but also in the Z-axis direction. That is, since the Z-axis direction is parallel to the optical axis of the image captured by the above-described image pickup unit, if the mounting component and the mounting board can be adjusted in the Z-axis direction, an image can be formed on the image sensor with higher precision. Can be.

As an example of a more specific structure for performing the parallel movement in the XY plane as described above, the invention according to claim 8 is the component mounting apparatus according to claim 7, wherein the XY axis adjustment mechanism is , Provided on the mounting board support,
It is configured to adjust the relative position while moving the mounting board in the XY directions.

In the invention according to claim 8 configured as described above, the XY-axis adjustment mechanism is provided on the mounting board support. Then, the relative position is adjusted while moving the mounting substrate in the XY directions by the XY axis adjustment mechanism of the mounting substrate support. That is, the mounting board supporter can move the mounting board in the X and Y axis directions by the XY axis adjustment mechanism while supporting the mounting board.

The XY-axis adjustment mechanism only needs to be able to move the mounting board in the X and Y-axis directions. For example, a rack and pinion mechanism, a rack and pin wheel mechanism, which are generally used in an XY table. And the operation handle can be linked to each other, or can be adjusted by a ball screw mechanism. Further, in order to perform positioning adjustment with higher accuracy, the operation handle may be configured to be capable of adjusting two systems of a coarse movement handle and a fine movement handle. Further, the mounting substrate support may be configured to be attached to a generally used XY table.

Further, as another example of constituting the XY axis adjusting mechanism, the invention according to claim 9 is the component mounting apparatus according to claim 7 or 8, wherein
The Y-axis adjusting mechanism is provided in the Z-axis moving mechanism, and is configured to adjust the relative position while moving the mounted component in the XY directions.

In the ninth aspect of the present invention, the XY-axis adjusting mechanism is provided in the Z-axis moving mechanism. Then, X in the Z-axis moving mechanism
The relative position is adjusted while moving the mounted component in the XY directions by the Y-axis adjustment mechanism. That is, the Z-axis moving mechanism can move the mounted component in the X and Y-axis directions by the XY-axis adjustment mechanism while supporting the mounted component.

Also in this case, the XY axis adjusting mechanism can be constituted by various mechanisms such as a rack and pinion mechanism, a rack and pin wheel mechanism, and a ball screw mechanism, and can be configured to be capable of coarse and fine movement operations. . In order to position and adjust the relative position between the mounted component and the mounting board, it is sufficient to provide the XY-axis adjustment mechanism in either the mounting board support or the Z-axis moving mechanism. It is also possible to provide both a mounting board support and a Z-axis moving mechanism in order to increase the number of components and improve operability.

Further, as an example of a more specific configuration for performing rotational movement in the θ direction, the invention according to claim 10 is the component mounting apparatus according to any one of claims 7 to 9, wherein The θ adjustment mechanism is provided on the mounting board support, and is configured to adjust the relative position while rotating the mounting board in the θ direction.

In the invention according to claim 10 configured as described above, the θ adjustment mechanism is provided in the mounting board support. Then, the relative position is adjusted while rotating the mounting board in the θ direction by the θ adjustment mechanism of the mounting board support. In other words, the mounting substrate support can rotate the mounting substrate in the θ direction by the θ adjustment mechanism while supporting the mounting substrate. The θ adjustment mechanism only needs to be able to rotate the mounting substrate about the Z axis, and may be configured to be able to rotate the mounting substrate by linking various gears with the rotation of the handle. Coarse movement and fine movement can be adjusted.

According to another aspect of the present invention, there is provided a component mounting apparatus according to any one of claims 7 to 10, wherein the .theta. The mechanism is provided in the Z-axis moving mechanism, and is configured to adjust the relative position while rotating the mounted component in the θ direction.

According to the eleventh aspect of the present invention, a θ adjusting mechanism is provided in the Z-axis moving mechanism. Then, the relative position is adjusted while rotating the mounted component in the θ direction by the θ adjustment mechanism in the Z-axis moving mechanism. That is, the Z-axis moving mechanism can rotate the mounted component in the θ direction by the θ adjustment mechanism while supporting the mounted component. Also in this case, the θ adjustment mechanism can be configured by various mechanisms such as various kinds of gears and the rotation of the handle in cooperation with each other, and can also be configured to enable a coarse movement and a fine movement operation. It is also possible to provide both the mounting board support and the Z-axis moving mechanism.

In the above-mentioned image pickup unit, it is only necessary that the images vertically above and below the image are formed on one image pickup device, and the image can be moved back and forth between the image pickup point and the retreat point. Therefore, the invention according to claim 12 is an example of a configuration for moving the imaging unit forward and backward.
The component mounting apparatus according to claim 11,
The imaging unit is rotatably supported with respect to a predetermined fixed axis, and is configured to advance and retreat between the imaging point and the retreat point by rotating about the fixed axis.

In the twelfth aspect of the present invention, the imaging unit is supported so as to be rotatable about a predetermined fixed axis. Then, by rotating about the fixed axis, the camera moves back and forth between the imaging point and the evacuation point. That is, the imaging point at which the imaging unit advances and retreats is an optical path, and in order to obtain a desired image, it is necessary to have an accuracy that does not cause a shift of the optical axis with respect to images from vertically above and vertically below. It is becoming. Here, when moving a member of a predetermined size, it is often easier to use rotational movement than to use parallel movement. Therefore, the desired accuracy can be easily ensured by making the imaging unit rotatable about the fixed axis.

Further, as an example of a structure for forming images vertically above and below vertically on one image pickup device in the image pickup unit, the invention according to claim 13 is the invention according to claims 1 to 12 In the component mounting apparatus according to any one of the first to third aspects, the imaging unit may include a mirror disposed parallel to the vertical direction while facing the imaging element, and an optical axis and a vertical direction connecting the mirror and the imaging element. And a transflective plate disposed at an angle of 45 degrees with respect to both.

In the invention according to claim 13 configured as described above, the imaging unit includes a mirror and a semi-transmissive reflector. The mirror is disposed parallel to the vertical direction while facing the image sensor, and the semi-transmissive reflector is at 45 degrees to both the optical axis connecting the mirror and the image sensor and the vertical direction. It is arranged at an angle. That is, the transflective plate reflects incident light and transmits the same at the same time, and reflects the incident light on one surface to guide it toward the image sensor.

Further, the incident light is reflected on the other surface, guided in the direction opposite to the image pickup device, reflected by the mirror, and transmitted again to the semi-transmissive reflection plate, so that the light is directed toward the image pickup device. Leading. As a result, both of the incident light incident on the transflective plate from two directions are guided toward the image sensor. Here, the semi-transmissive reflection plate only needs to be able to transmit incident light at a predetermined transmittance while reflecting the incident light at a predetermined reflectance, and can be configured by a beam splitter such as a so-called half mirror.

As described above, by using the mirror and the semi-transmissive reflection plate, incident light from above and below vertically can be guided toward the image pickup device. A convenient configuration can be achieved. As an example of the configuration, the invention according to claim 14 is the component mounting apparatus according to claim 13, wherein the semi-transmissive reflection plate reflects a vertically lower image on a lower surface so as to reflect the image on the image sensor. And an image vertically above is reflected on the upper surface and further reflected on the mirror to form an image on the image sensor.

[0045] In the invention according to claim 14 configured as described above, the semi-transmissive reflection plate reflects a vertically lower image on the lower surface to form an image on the image sensor.
Also, an image vertically above is reflected on the upper surface and further reflected on the mirror to form an image on the image sensor. That is, light from vertically below is reflected once and forms an image on the image sensor, and light from vertically above is reflected once by the semi-transmissive reflector and is reflected by the mirror for the second time. The light passes through the transmissive reflector to form an image on the image sensor.

Here, as an image formed on the image sensor,
The components from above vertically are those of mounted components, and those from below vertically are components of the mounting board, and are superimposed and imaged for positioning adjustment. Therefore, the optical path length from the mounting component to the image sensor must be the same as the optical path length from the mounting board to the image sensor, and the incident light from vertically above is once guided in the opposite direction to the image sensor and reflected. Then, the distance from the semi-transmissive reflector to the mounting component is shorter than the distance from the semi-transmissive reflector to the mounting board. In other words, with such a configuration, the distance from the imaging unit including the transflective plate to the lower mounting board can be longer, even when various components are already mounted on the mounting board. They do not get in the way.

As described above, according to the present invention, the relative position between the mounting component and the mounting board is adjusted by forming the incident light from above vertically and the incident light from below vertically on the same image pickup device. However, it is preferable for the user to be able to distinguish between the mounted component and the mounted board. As an example of a configuration for achieving this, the invention according to claim 15 is the component mounting apparatus according to any one of claims 1 to 14, wherein the imaging unit is configured to display images vertically above and below vertically at an imaging point. When an image is formed on one image sensor, a vertically upper part and a vertically lower part are illuminated with light having different wavelengths.

[0048] In the invention according to claim 15 configured as described above, the imaging unit includes an illuminating device, and forms an image vertically above and below the image at one imaging point on one imaging element. At this time, vertically vertically and vertically below are illuminated with light of different wavelengths. In other words, when illuminated with light of different wavelengths in the wavelength region of visible light, the user can grasp light vertically above and below vertically as images of different colors, and even in one image. It is easy to recognize which image the image is, and the displacement of the relative position between the mounted component and the mounted substrate is more reliably clarified.

Further, it is more convenient to automate the component mounting operation by utilizing the fact that the displacement between the mounted component and the mounting board is clearly understood in one image. As an example of such a configuration, the invention according to claim 16 is the component mounting apparatus according to any one of claims 1 to 15, wherein the imaging unit can control the positioning adjustment mechanism. In the case where the relative position between the mounting component and the mounting board is displaced in the captured images of the vertical upper part and the vertical lower part, the relative position is controlled so as to eliminate the deviation by controlling the positioning adjustment mechanism. There is a configuration to adjust.

In the invention according to claim 16 configured as described above, the imaging unit can adjust the relative position by controlling the positioning adjustment mechanism. That is, when the relative position between the mounting component and the mounting board is displaced in the image of the vertically upper part and the vertically lower part captured, the relative position is controlled so as to eliminate the deviation by controlling the positioning adjustment mechanism. adjust. As a result,
The relative positional relationship between the mounting component and the mounting board automatically becomes an optimal state. Needless to say, it is possible to control the Z-axis moving mechanism to automate the mounting of the mounted components on the mounting board after this.

As described above, there are various devices for capturing images vertically above and below the image. As a preferred example, the invention according to claim 17 is the invention according to any one of claims 1 to 16 In the component mounting apparatus described above, the imaging element provided in the imaging unit is a CCD.

In the invention according to claim 17 configured as described above, the image pickup device provided in the image pickup unit is CC.
D. Here, the CCD can be very small, and the component mounting apparatus itself can be reduced in size. When two colors of illumination are used as described above, for example, the illumination is made in two colors of red and green, and the elements of the CCD are not configured for three colors of “RGB”, but are composed of “R” and “G”. It is also conceivable to use only two colors.

As described above, each of the above-described inventions based on the technique of displaying the mounted component and the mounting board on the same image so as to be superimposed on each other and adjusting the relative positioning between the mounted component and the mounting board based on the moving image, It can be easily understood that it functions not only as an apparatus but also as an invention of a method. For this reason, the invention according to claim 18 is directed to a component which is capable of moving back and forth between an imaging point between the mounting board and the mounted component and a retreat point evacuated from the both while imaging the mounted substrate and the mounted component. A component mounting method for mounting a component on a mounting substrate such that the mounted component is vertically movable with respect to a mounting board, and images of the mounting board and the mounting component are connected on one image sensor with the same optical path length. The components are mounted by adjusting the relative positioning of the mounted components with respect to the mounting board while visually recognizing the captured image.

[0054]

As described above, according to the present invention, the positioning adjustment is performed while capturing the real image of the mounted component and the mounting board by the imaging unit capable of retracting the imaging point. And a component mounting apparatus capable of mounting the components on the device. Further, according to the second aspect of the present invention, it is possible to prevent the mounting board from moving in the Z-axis direction, and it is possible to perform mounting with higher accuracy. Further, according to the third aspect of the present invention, it is possible to more accurately mount the mounted component on the mounting board with a simple configuration.

Further, according to the invention of claim 4,
Various sizes of mounted components can be supported, and versatility is improved. Further, according to the invention according to claim 5,
This is convenient because the user can operate without moving his / her eyes. Further, according to the invention according to claim 6,
This is convenient because the user can operate without moving his / her eyes.

Further, according to the seventh aspect of the present invention,
The relative positioning between the mounted component and the mounting board can be easily adjusted. Further, according to the invention of claim 8, the relative positioning between the mounted component and the mounting board can be easily adjusted in the XY axis directions. Furthermore, according to the ninth aspect, the relative positioning between the mounted component and the mounting board can be easily adjusted in the XY axis directions.

Furthermore, according to the tenth aspect of the present invention, the relative positioning between the mounted component and the mounting board can be easily adjusted in the θ direction. Further, according to the eleventh aspect, the relative positioning between the mounted component and the mounting board can be easily adjusted in the θ direction. Further, according to the twelfth aspect of the present invention, it is possible to accurately move the imaging unit forward and backward.

Further, according to the thirteenth aspect, light from vertically above and vertically below can be easily imaged on one image pickup device. Claim 14
According to the present invention, a sufficient space can be secured below the imaging unit, and operability is improved. Further, according to the fifteenth aspect, it is possible to accurately grasp whether the image is vertically upward or vertically downward, and to perform more accurate positioning adjustment.

Further, according to the sixteenth aspect of the present invention, the positioning adjustment is performed without any operation by the user, which is convenient. Further, according to the seventeenth aspect, a small-sized imaging unit can be provided.
Furthermore, according to the invention according to claim 18, since the positioning adjustment is performed while capturing the real image of the mounted component and the mounting board by the imaging unit capable of retracting the imaging point, the mounting is performed with a simple configuration and with higher accuracy. Can be provided.

[0060]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing a main configuration of a component mounting apparatus according to an embodiment of the present invention. In the figure, the component mounting apparatus includes a pedestal 10, a Y-axis slide unit 20, a Z-axis moving mechanism 30, an imaging unit 4
0, a display 70 is provided. The pedestal 10 has a central portion on which the mounting substrate 50 can be placed, and has rails 12 on both sides for guiding the movement of the Y-axis slide portion 20 in its longitudinal direction.

A rack & pinion mechanism is provided inside the rails 12, 12, and rotation of a handle 11 provided in front of the pedestal 10 is transmitted to the rack & pinion mechanism by a gear mechanism (not shown). The lower part of the Y-axis slide portion 20 is a rack fitted to the rail 12, and the Y-axis slide portion 20 moves in the longitudinal direction of the rail 12 by rotation of the pinion. Here, the longitudinal direction of the rail 12 is the Y-axis direction.

The Y-axis slide section 20 is mounted on the rail 12
And is connected at a predetermined height above both rails 12, 12 in a direction perpendicular to the Y axis. Y
In front of the shaft slide portion 20, there are provided rails 22, 22 for guiding the movement of the Z-axis moving mechanism 30 in the longitudinal direction thereof, and similarly to the rails 12, 12, a rack & pinion mechanism is provided inside. Have been. The Y-axis slide unit 20 has a handle 21 like the pedestal 10, and the rotation of the handle 21 causes the Z-axis moving mechanism 30 to rotate.
Is moved in the longitudinal direction of the rail 22. Here, the longitudinal direction of the rail 22 is the X-axis direction.

The Z-axis moving mechanism 30 comprises a near-side Z-axis slide portion 31 that moves in the Z-axis direction and a far-side X-axis slide portion 32 that moves in the X-axis direction along the Y-axis slide portion 20. ing. The X-axis slide part 32 has a Y
The shaft slide portion 20 is bent downward, and
It is further bent in the X-axis direction below the shaft slide portion 20 and connected to the fixed shaft 41. The imaging unit 40 is Y
The shaft is supported by the fixed shaft 41 below the shaft slide portion 20. Therefore, the imaging unit 40 is configured to be rotatable about the fixed shaft 41, and Z
The Z-axis slide unit 31 is moved directly below the shaft slide unit 31 and is rotated at the time of component mounting, so that the Z-axis slide unit 31 can move vertically below.

Further, the Z-axis slide portion 31 is configured to suck the mounted component 60 by a chuck provided at a lower portion thereof. FIG. 2 is a schematic diagram showing the internal configuration of the Z-axis moving mechanism 30. In FIG. 2, a chuck 33 is formed below the Z-axis slide portion 31.
Consists of a replaceable nozzle 33a and a tubular member 33b. The tubular member 33b is formed of a hollow cylindrical member, and a replaceable nozzle 33a is attached to a lower portion.
This replaceable nozzle 33a can be replaced with a nozzle having various opening diameters as shown in FIG. 3 in order to accommodate components of various sizes. That is, the exchangeable nozzles 33a, 33
The openings a1 and 33a2 have different lower opening diameters, and can adsorb components of various sizes such as the mounted components 60, 60a1 and 60a2.

The cylindrical member 33b communicates with the Z-axis slide portion 31 and is connected at an upper portion to a rotary joint 33c. An opening on one side of the rotary joint 33c is connected to an air filter 34 via a hose. I have. Further, the air filter 34 is connected to an ejector (not shown) via a hose. The ejector is a small jet pump, which is connected to a switch 34a, and the operation of the switch 34a is switched between the generation of the negative pressure and the release of the negative pressure. Therefore, the mounted component 60 is attracted to the chuck 33 when a negative pressure is generated by the ejector.

A handle 35 is provided on one ZY plane of the Z-axis slide portion 31 and is connected to a rotary mechanism 35a provided at a lower portion in the Z-axis slide portion 31.
The rotary mechanism 35a is attached to a lower portion of the tubular member 33b, and rotates the tubular member 33b about the axis of the tubular member 33b in the XY plane. Therefore, the θ position of the mounted component 60 is adjusted by rotating the handle 35 with the mounted component 60 being attracted to the chuck 33.

The cylindrical member 33b is fixed to the slide member 31a in the Z-axis slide portion 31, and the air filter 34 and the ejector are also fixed to the slide member 31a.
It is fixed to. The X-axis slide portion 32 has a rail in the Z-axis direction. The slide member 31a has connection pins 31b and 31b at two places. Are linked. When the connecting pin 31b slides along the rail, the Z-axis slide portion 31 is moved up and down in the Z-axis direction. Thus, in the present embodiment, the pedestal 1
0 constitutes the mounting board support, and handles 11 and
1, 35, the Y-axis slide section 20, the X-axis slide section 32, and the rotary mechanism 35a constitute the positioning adjustment mechanism, and the display 70 constitutes the image output means.

FIG. 4 shows a schematic structure inside the image pickup unit 40 and a schematic structure around the image pickup unit 40. In FIG. 4, the image pickup unit 40 is formed of a substantially L-shaped casing and has a cylindrical body provided with an optical system. And a connecting portion connected to the fixed shaft 41. That is, the X-axis slide portion 32
Is bent at a substantially right angle in the Y-axis direction at the lower portion, and further bent in the X-axis direction below the Y-axis slide portion 20. This portion serves as a connecting portion connecting the X-axis slide portion 32 and the fixed shaft 41. Has become. The imaging unit 40 has a fixed shaft 4
By rotating the rotation axis and the longitudinal direction of the cylinder of the imaging unit 40 on the X axis, the rotation angle is smaller than when the rotation axis is not shifted. The cylinder is largely retracted by the rotation.

Further, a lever 42 for assisting the rotation is attached in front of the imaging unit 40, and the user operates the lever 42 to move the imaging unit 40 from the imaging point to the evacuation point. It is designed to be evacuated. Here, as shown in FIG. 1, when the imaging unit 40 is at a predetermined position immediately below the Z-axis moving mechanism 30, the imaging of the mounting component 60 and the mounting substrate 50 is performed. It is. Also,
In the present embodiment, more than this imaging point
It does not rotate in the negative direction of the X axis.

A mirror 43, a half mirror 44, and a CCD camera 45 are provided as an optical system in the cylinder of the imaging unit 40. Further, a red LED 46 is provided on the upper surface to illuminate the upper and lower portions of the imaging unit 40, and a green LED 47 is provided. Further, the imaging unit 4
A predetermined cable is configured to be connectable to the back side of 0, power is supplied to the red LED 46, the green LED 47, and the CCD camera 45, and image data from the CCD camera 45 is sent to the display 70.

The mirror 43 is disposed so as to be parallel to the XZ plane when the imaging unit 40 is at the imaging point, and the reflection surface of the mirror 43 is directed to the inside of the imaging unit 40. The CCD camera 45 is disposed at a position facing the mirror 43 toward the inside of the imaging unit 40, and the half mirror 44 is
It is disposed so as to be at an angle of 45 degrees with respect to both the optical axis direction connecting the camera 45 and the vertical direction. Further, it is inclined upward from the front of the imaging unit 40 to the back.

Accordingly, the incident light from vertically above is reflected once by the half mirror 44 and then reflected by the mirror 43 and guided toward the CCD camera 45. The incident light from below vertically is reflected once by the half mirror 44. After that, the light enters the CCD camera 45. Here, by guiding incident light from above vertically to the mirror 43 by the first reflection by the half mirror 44, the imaging unit 40
The lower space can be widened.

FIG. 5 shows the mounting board 50, the mounting components 60, the mirror 43, the half mirror 44, and the CCD camera 45 in FIG. 4 in an extracted manner, and shows an example of the optical path. FIG. 3 shows an optical path from a point A of the mounting component 60 and a point B of the mounting board 50. Here, the points A and B are on a vertical line. Mounted component 60
The reflected light from point A of FIG. 1 reaches the half mirror 44 through the optical path a1, is reflected and changes the traveling direction by 90 degrees, and reaches the mirror 43 through the optical path a2. The light that reaches the mirror 43 is reflected by the mirror 43, travels the optical path a2 again, passes through the half mirror 44, and travels the optical path c.

The reflected light from the mounting board 50 is transmitted through the optical path b1.
And the light reaches the half mirror 44, is reflected and changes the traveling direction by 90 degrees, and travels along the optical path c. Accordingly, two points A and B on the vertical line travel along the same optical path c and reach the same position of the CCD camera 45. Therefore, point A and point B are at the same position on the CCD image. As described above, since the point A and the point B form an image at the same position, the optical distance from the point A to the CCD camera 45 and the CCD from the point B
The optical distance to the camera 45 is the same. Therefore,
The distance relationship between the optical distance L1 of the optical path a1, the optical distance L2 of the optical path a2, and the optical distance L3 of the optical path b1 is "L1 + L2 + L2 = L3".

Accordingly, the mounting substrate 5 is moved from the half mirror 44
The distance to 0 is longer than the distance “L1” from the “L3” half mirror 44 to the mounted component 60. Here, since components having a predetermined height are mounted on the mounting board 50, if there is room in the space below the imaging unit 40, the components already mounted will not interfere with positioning adjustment and the like. It is suitable because it does not become any.

As described above, the center of the pedestal 10 is configured so that the mounting board 50 can be mounted thereon. However, as shown in FIG. 6, the center is hollow, and both ends in the Y-axis direction are notched. It is formed in a step shape. The support jig 13 is provided below the mounting board 50. The lower support jig 13 is configured as a cylindrical body 13b, and has a columnar portion 13a at substantially the center inside the cylindrical body 13b. Further, a push mechanism 13c is connected to a part of the cylindrical body 13b, and an opening above the cylindrical body 13b is made of a member such as rubber.

Therefore, when the push mechanism 13c is pressed without any components being placed on the upper part of the cylindrical body 13b, the gas inside is pushed out. In this state, the mounting substrate 50 is mounted on the opening of the cylindrical body 13b. When the push mechanism 13c is released, the inside is in a negative pressure state, and the mounting substrate 50 is sucked. At this time, the mounting board 50 comes into contact with the columnar portion 13a, and the mounting board 50 is supported at a predetermined height. The support jig 13 is freely movable, and the mounting substrate 5
Although it is preferable that the support is provided immediately below the component mounting position of 0, the support may be provided at a slightly shifted position when components are already mounted immediately below the component mounting position.

Next, the operation of the present embodiment having the above configuration will be described with reference to the flowchart shown in FIG.
In step S100, the mounting component 60 is sucked to the chuck 33 while the ejector performs the suction operation. In step S110, the mounting substrate 50 is placed on the pedestal 10, and the lower surface of the mounting substrate 50 is sucked and fixed by the lower support jig 13. Next, in step S120, the mounting substrate 50 and the mounting component 60 are displayed on the display 70.
The positioning adjustment is performed while visually recognizing the image on which the and are superimposed. Here, FIG. 8A illustrates an example of an image displayed on the display 70, and a white circle indicates a contact point image of the mounted component 60 displayed as a red image on the display 70. The shaded circle indicates an image of the mounting position of the mounting board 50 displayed as a green image on the display 70.

FIG. 8 schematically shows an image of the display 70, but since the colors of the images of the mounted component 60 and the mounted substrate 50 are different, the user can clearly identify the actual positioning as shown in FIG. The positioning adjustment can be performed while grasping the difference between the two. Here, in the present invention, the real image of the mounting component 60 and the mounting substrate 50 is visually recognized on the display 70, and the point that the red image and the green image match on the display 70 always matches at the time of mounting. . Therefore,
The mounting can be performed with extremely high accuracy as compared with the above-described conventional example in which the relative position between the mounting component and the mounting board is determined based on separate images. In this case, the vertical direction on the paper corresponds to the Y-axis direction, and the horizontal direction on the paper corresponds to the X-axis direction. In addition, for ease of understanding,
Images not displayed on the screen are also indicated by dotted lines.

As shown in FIG. 8A, when the mounting component 60 and the mounting substrate 50 are set, the contact point of the mounting component 60 and the contact position of the mounting substrate 50 generally deviate from each other. The relative positions are adjusted by moving the handles 11, 21, 35 in the X-axis, Y-axis, and θ directions in the XY plane. The adjustment of the relative position may be performed from any of the X axis, the Y axis, and the θ direction. However, according to an example of the adjustment in FIG. 8A, first, while visually checking the image on the display 70, The handle 35 is rotated with an aim when the θ angle is shifted. Then, the mounted component 60 rotates, and accordingly, the image of the mounted component 60 also rotates in the image on the display 70.

Here, a predetermined angle .theta.
When the mounting board and the mounted component are in a positional relationship such that they are overlapped only by parallel movement as shown in FIG.
At 21, it is moved in the Y-axis and X-axis directions. FIG.
In the case of, when the handle 11 is rotated, the Y-axis slide portion 20 gradually moves, and the image of the mounting board also moves downward in the image on the display 70 with this.
It is moved by a distance Y1 in the Y-axis direction. Further, when the handle 21 is rotated, the Z-axis moving mechanism 30 gradually moves, and the image of the mounting board also moves rightward in the image on the display 70 with the movement, so that only the distance X1 in the X-axis direction. Move.

In this way, as shown in FIG. 8C, the mounted board image and the mounted component image can be superimposed.
As described above, when the two images overlap on the screen of the display 70, the contact point of the mounting component 60 and the mounting substrate 50
Since the mounting position is on a vertical line, the relative positioning has been performed. Then, the operation shifts to the following component mounting operation. FIG. 9 shows the operation of each part at the time of component mounting. First, in step S130, the imaging unit 40 is rotated and retracted so that the Z-axis moving mechanism 30 can be lowered as shown in FIG.

In step S140, the Z-axis slide section 31
Is lowered, and the mounting component 60 is placed on the mounting substrate 50. Further, at step S150, the switch 34a
To release the ejector. And
When the Z-axis slide portion 31 is raised in step S160, the mounting component 60 is mounted on the mounting substrate 50 because the chuck 33 has not been attracted to the mounting component 60, and mounting is completed.

As described above, in the present embodiment, the relative position is manually adjusted. However, the positioning adjustment mechanism may be configured to be computer-controllable to achieve automation. That is, in this embodiment, the mounting substrate 50 is
, And the mounted component 60 is illuminated with a red LED,
When the two images match on the display 70, they always match during mounting. Therefore, a position adjustment amount required for superimposing the red image and the green image on the basis of one image on the display 70 may be calculated, and the positioning adjustment mechanism may be controlled and driven based on the calculated amount.

In the above embodiment, the positioning is adjusted by moving the Y-axis slide portion 20 in the Y-axis direction, by moving the X-axis slide portion 32 in the X-axis direction, and adjusted in the θ direction. The adjustment is performed by rotating the mounted component 60.
That is, it is the mounted component 60 that moves during each adjustment. However, in these positioning adjustments, it is sufficient that the relative position can be changed.
0 may be moved, or both may be movable.

FIGS. 10 and 11 show another embodiment of the present invention. FIG. 10 shows a pedestal 100 including a Z-axis adjustment mechanism and an imaging unit, and FIG. 11 shows a moving stage 200 configured as a positioning adjustment mechanism.
The pedestal 100 is formed by connecting two prisms at an upper portion, and a flange is provided on a lower surface to prevent tilting. A fixed shaft is provided on one of the prism portions of the pedestal, and an L-shaped imaging unit 400 is pivotally supported. A Z-axis moving mechanism 300 is provided above the imaging unit 400, and is slidable in the vertical direction after the evacuation of the imaging unit 400 as in the above-described embodiment.

Although the mounting components can be suction-supported in the same manner, in this embodiment, the Z-axis moving mechanism 300 does not move in the XY plane direction and the θ direction. To do it. The moving stage 200 is formed of a four-stage substantially rectangular parallelepiped, and it is possible to fix the mounting substrate on the upper surface of the uppermost θ rotation stage 210.

The second rectangular parallelepiped is an X-axis moving stage 220.
The third rectangular parallelepiped is the Y-axis moving stage 230, and the lowest rectangular parallelepiped is the fixed stage 240. The fixed stage 240 is provided with a handle 241 and is interlocked with a rack and pinion mechanism provided inside. The rack and pinion mechanism is connected to the rack of the upper Y-axis moving stage 230, and when the handle 241 is rotated, the Y-axis moving stage 230 moves in the Y-axis direction.

The Y-axis moving stage 230 has a handle 2
31 are provided, and are interlocked with a rack and pinion mechanism provided inside. This rack and pinion mechanism is connected to the rack of the upper X-axis moving stage 220,
When the handle 231 is rotated, the X-axis moving stage 220 is rotated.
Moves in the X-axis direction. Further, the same X-axis moving stage 2
20 is provided with a handle 221 and is interlocked with a gear mechanism provided inside. This gear mechanism is connected to the key of the upper θ rotation stage 210,
When the 21 is rotated, the θ rotation stage 210 rotates.

In such a configuration, the moving stage 2
00 is placed below the imaging unit 400 provided on the pedestal 100, and a captured image is displayed on a display (not shown). As in the above-described embodiment, the image of the mounted component and the mounting board is superimposed on one image. Is displayed. Of course, the height of the moving stage 200 is such that a video of the mounting substrate is formed on the CCD camera. However, a moving stage having a degree of freedom of movement in the Z-axis direction can also be used.

The user can adjust the position of each stage of the moving stage 200 by using each handle in the same manner as in the above embodiment. The operation of each unit after component mounting is the same. As described above, according to the present embodiment, a component mounting apparatus can be provided with a simpler configuration, and a widely used XY stage can be used as the moving stage 200.

As described above, in the present invention, the real images of the mounted components and the mounting board are superimposed by the image pickup unit, and the relative positions of the two are adjusted while visually recognizing the picked-up image. In addition, since the imaging unit is configured to be able to advance and retreat at the imaging point and the retreat point, mounting can be completed only by lowering the mounted component with respect to the mounting board after performing the positioning adjustment. Therefore, the mounting components can be mounted with higher accuracy with a simple configuration.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a main configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing an internal configuration of a Z-axis moving mechanism.

FIG. 3 is a sectional view showing a specific example of a replaceable nozzle.

FIG. 4 is a diagram showing a schematic configuration inside an image pickup unit and a schematic configuration around it.

FIG. 5 is a diagram illustrating an arrangement and an optical path of an optical system in an imaging unit.

FIG. 6 is a cross-sectional view showing a lower portion of the mounting board.

FIG. 7 is a flowchart showing an operation at the time of component mounting.

FIG. 8 is a diagram showing an example of an image at the time of component mounting.

FIG. 9 is a diagram illustrating the operation of each unit during component mounting.

FIG. 10 is a diagram illustrating a Z-axis adjustment mechanism and an imaging unit according to another embodiment.

FIG. 11 is a diagram showing a positioning adjustment mechanism according to another embodiment.

FIG. 12 is a schematic perspective view showing a main configuration of a conventional component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Pedestal 11, 21, 35 ... Handle 20 ... Y-axis slide part 30 ... Z-axis movement mechanism 31 ... Z-axis slide part 32 ... X-axis slide part 33 ... Chuck 40 ... Imaging unit 43 ... Mirror 44 ... Half mirror 45 ... CCD camera 46 red LED 47 green LED 50 mounting board 60 mounting component 70 display

Claims (18)

[Claims] A mounting board supporting member for supporting the mounting board; a Z-axis moving mechanism for supporting the mounting component and moving the mounting component in a vertical direction with respect to the mounting board so as to mount the mounting component; A positioning adjustment mechanism capable of adjusting the relative positioning with respect to the board; and an imaging point between the mounting board and the mounting component and an evacuation point retracted from between the two. What is claimed is: 1. A component mounting apparatus comprising: an imaging unit that forms images vertically above and below a point on a single image sensor; and an image output unit that outputs an image captured by the imaging unit. 2. The component mounting apparatus according to claim 1, wherein the mounting substrate support supports an edge portion of the mounting substrate and supports substantially the same position as a mounting portion from below the mounting substrate. Component mounting equipment. 3. The component mounting apparatus according to claim 1, wherein the Z-axis moving mechanism sucks and supports the mounted component by a chuck connected to a suction mechanism that suctions a gas. A component mounting apparatus characterized in that: 4. The component mounting apparatus according to claim 3, wherein in the chuck, a suction nozzle portion for sucking and supporting the mounted component is replaceable according to a size of the mounted component. Mounting device. 5. The component mounting apparatus according to claim 3, wherein the suction mechanism is provided at a foot of a user after moving the mounted component onto a mounting board. A component mounting apparatus, wherein suction of mounted components can be released by a switch. 6. The component mounting apparatus according to claim 3, wherein the suction mechanism is disposed at a user's hand after moving the mounted component onto a mounting board. A component mounting apparatus, wherein suction of mounted components can be released by a switch. 7. The component mounting apparatus according to claim 1, wherein the positioning adjustment mechanism is a Z-axis moving mechanism.
An XY-axis adjustment mechanism capable of adjusting a relative position in an XY-axis direction in an XY plane orthogonal to the axis, and a θ capable of adjusting a relative position in a θ-rotation direction about the Z-axis in the XY plane
A component mounting apparatus comprising an adjusting mechanism. 8. The component mounting apparatus according to claim 7, wherein the XY axis adjustment mechanism is provided on the mounting board support, and adjusts a relative position while moving the mounting board in the XY directions. Component mounting equipment. 9. The component mounting apparatus according to claim 7, wherein the XY axis adjustment mechanism is provided in the Z axis movement mechanism,
A component mounting apparatus for adjusting a relative position while moving a mounted component in XY directions. 10. The component mounting apparatus according to claim 7, wherein the θ adjustment mechanism is provided on the mounting board support, and rotates the mounting board in the θ direction to adjust the relative position. A component mounting apparatus characterized in that the component mounting is adjusted. 11. The component mounting apparatus according to claim 7, wherein the θ-axis adjusting mechanism is provided in the Z-axis moving mechanism, and rotates the mounted component in the θ direction while rotating the mounted component in the θ direction. A component mounting apparatus characterized by adjusting a position. 12. The component mounting apparatus according to claim 1, wherein the imaging unit is rotatably supported with respect to a predetermined fixed axis, and about the fixed axis. A component mounting apparatus, wherein the component mounting apparatus moves back and forth between the imaging point and the retreat point by rotating. 13. The component mounting apparatus according to any one of claims 1 to 12, wherein the imaging unit is a mirror disposed in parallel with the vertical direction while facing the imaging device; A component mounting apparatus, comprising: a semi-transmissive reflection plate disposed at an angle of 45 degrees with respect to both an optical axis connecting the mirror and the imaging device and a vertical direction. 14. The component mounting apparatus according to claim 13, wherein the semi-transmissive reflection plate reflects a vertically lower image on a lower surface to form an image on the image sensor, and a vertically upward image. A component mounting apparatus, wherein the image is reflected on the upper surface and further reflected on the mirror to form an image on the image sensor. 15. The component mounting apparatus according to any one of claims 1 to 14, wherein the image pickup unit forms an image vertically above and below the image at an image pickup point on one image sensor. A component mounting apparatus for illuminating vertically above and vertically below with light of different wavelengths. 16. The component mounting apparatus according to any one of claims 1 to 15, wherein the imaging unit is capable of controlling the positioning adjustment mechanism, and includes: Wherein the relative position between the mounting component and the mounting board is displaced in the video of the above, and the relative position is adjusted so as to eliminate the deviation by controlling the positioning adjustment mechanism. . 17. The component mounting apparatus according to claim 1, wherein the image pickup device provided in the image pickup unit is a CCD. 18. A component mounting method for mounting a component while capturing an image of the mounting substrate and the mounted component by a unit that can move back and forth between an imaging point between the mounting substrate and the mounted component and a retreat point retracted from the both. The mounting component is supported movably in the vertical direction with respect to the mounting board, and images of the mounting board and the mounting component are imaged on one image sensor with the same optical path length, and the captured image is formed. A component mounting method characterized in that component mounting is performed by adjusting the relative positioning of a mounted component with respect to a mounting board while visually recognizing a component.