JP2001036005A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reform assembly structure of a semiconductor device so that it can realize improvement of setup property at the attaching of itself to an inverter device, a motor controller, or the like and the enlargement of the freedom of assembly procedure, by adopting the discrete product of two-in-a-set semiconductor modules. SOLUTION: An aggregate unit body is constituted by storing a required number of two-in-a-set semiconductor modules en block, with their directions trued up, within a top open type of assembly case 4, and in this assembly case 4, square holes 4a to expose metallic bases 4d for heat radiation of each semiconductor module and screw holes 4b for attachment of the module are made at its bottom, and further fixing claws 5 are attached to the topstde, and they hold each semiconductor module in stored position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an inverter device,
The present invention relates to a power semiconductor device applied to a motor control device and the like, and more particularly, to an assembly structure thereof.

[0002]

2. Description of the Related Art As is well known, an inverter device applied to a motor control device of a robot, an NC machine tool or the like has four elements (for a single-phase circuit) or six elements (for a three-phase circuit) in its main circuit. Power switching devices (eg IG
BT) is used to form a bridge circuit.

[0003] On the other hand, semiconductor device manufacturers provide single-, two-, and six-module modules in which one, two, and six power switching elements are incorporated into a package and internally connected as a large-capacity power semiconductor module. Although products are grouped in such a manner, products with a larger number of elements are more expensive in terms of the yield rate of semiconductor elements and product cost.

For this reason, the user adopts a discrete product of a set of two semiconductor modules as a power semiconductor device from the viewpoint of versatility and product price. In many cases, the motor control device is assembled by combining the above.

FIGS. 4 (a) and 4 (b) show a discrete product of the above-described two-piece semiconductor module, and an inverter circuit section (a three-phase circuit) such as an inverter device and a motor control device using the discrete product. 5), an operation procedure for assembling the semiconductor module to the radiation fins when assembling is described with reference to FIG.

First, in FIGS. 4 (a) and 4 (b), reference numeral 1 denotes a two-piece semiconductor module, 1a denotes a resin package thereof, and 1a-1
Are mounting screw holes provided at four corners of the package 1, 1b is a main circuit terminal drawn out from the upper surface of the package, 1c is an auxiliary terminal, 1d is a metal base for heat radiation exposed on the bottom surface of the package 1, and As shown in the equivalent circuit diagram of FIG. 4B, two power switching elements (IGBT), a freewheeling diode, and an auxiliary circuit (not shown) are incorporated therein. Note that C1, C2 E1, E2 shown in the figure are main circuit terminal symbols.

On the other hand, the above-described two-piece semiconductor module 1
In the case where three units are combined and attached to the radiation fins on the device side, as shown in FIG.
Is positioned on the radiating fins 2 and placed thereon, and the fastening screws 3
After fixing to the radiation fins 2, a power board (printed board) (not shown) is attached to the upper surface side of each semiconductor module 1 so as to interconnect with each terminal.

[0008]

In the case where the required number of double-package semiconductor modules are assembled on the motor control device or the like by the user as described above, conventionally, each semiconductor module 1 is separately radiated one by one. In order to attach to the fin 2, the assembling man-hour is large and the work is troublesome. In addition, since the individual semiconductor modules 1 are disassembled at the stage before the assembling, the method of assembling the devices and the order of assembling are naturally determined, and there is almost no flexibility in the working procedure.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to solve the above-mentioned problems, and to adopt an inverter device,
It is an object of the present invention to provide a semiconductor device assembly structure which is improved so as to improve assemblability when assembling to a motor control device or the like and to increase the degree of freedom of an assembling procedure.

[0010]

According to the present invention, in order to achieve the above object, according to the present invention, in a semiconductor device configured by combining a plurality of two-piece semiconductor modules, (1) a plurality of semiconductor modules are integrated. In this case, a square hole for exposing a heat-dissipating metal base corresponding to each semiconductor module is opened on the bottom surface of the assembly case (claim 1).

(2) With respect to a plurality of semiconductor modules arranged in a line on the left and right, connecting frames are laid on both sides so as to straddle between the modules, and each of the semiconductor modules is mounted on the connecting frames. The package of the module is screwed and assembled together (claim 2).

According to the above configuration, a required number of two-pack semiconductor modules to be mounted on a control device or the like are integrally assembled as one collective unit. Therefore, the user can handle a plurality of semiconductor modules as a single unit when assembling it to a control device, etc., and can easily and efficiently attach to the radiating fins and connect to the power board. The degree of freedom in the assembly procedure can be increased, for example, the power board can be mounted before mounting on the power board.

[0013] More specifically, a maker prepares the above-mentioned assembling case and connecting frame as optional items, and a unit assembly in which a required number of two-piece semiconductor modules are set in the assembling case and connecting frame according to a user's order. Shipped in condition.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the illustrated embodiments. In the embodiment shown in FIG.
The same reference numerals are given to the same parts corresponding to and the description thereof is omitted. Embodiment 1 FIGS. 1A to 1C show an assembly structure of a semiconductor device according to a first aspect of the present invention. In this embodiment, a semiconductor device for a three-phase circuit is constructed by combining three products of a two-package semiconductor module 1 having the same specifications, and three devices are arranged in a line on the left and right in the same direction as shown in the figure. Of the semiconductor module 1 is assembled in the assembly case 4.

Here, the assembling case 4 is made as a resin molded product having an open top surface, and its outer dimensions correspond to the three semiconductor modules 1 arranged on the left and right sides, and each semiconductor module is provided on the bottom surface. Square holes 4a are dispersedly opened so that the first metal base 1d for heat radiation is exposed to the outside. Further, peripheral holes correspond to screw holes 1a-1 opened at four corners of the package 1a of the semiconductor module 1. The structure is such that the screw hole 4b is opened. Then, in a state where the semiconductor module 1 is housed in the assembly case 4, a fixing claw 5 is fastened to the upper surface side of the case by a screw 5a to hold the semiconductor module 1 in the housing position.

According to this configuration, the three semiconductor modules 1 can be handled as one collective unit. Even when the semiconductor modules 1 are mounted on the radiating fins, as shown in FIG. Without mounting, positioning and fixing separately on the radiation fins, three units can be mounted collectively. It is also possible to mount the power board over the upper surface side of each semiconductor module 1 before mounting on the heat radiation fins, thereby increasing the degree of freedom in the method and procedure of assembling the device.

[Embodiment 2] FIGS. 2A and 2B show the first embodiment.
FIG. This embodiment has a structure basically similar to that of FIG. The supporting tongue piece 4c is integrally formed on the side of the semiconductor module 1.
The bottom is fitted to a recess formed on the side edge of the metal base side to support it.

[Embodiment 3] FIGS. 3A and 3B show an embodiment corresponding to claim 2 of the present invention. In this embodiment, a pair of connecting frames 6 are laid on three semiconductor modules 1 arranged in a line in the right and left directions so as to extend over each semiconductor module 1 and to be attached to both sides thereof. The connection frame 6 and the package of each semiconductor module 1 are fastened with screws 7 to assemble the collective unit. This connecting frame 6 is made as a metal sheet metal product, and a supporting tongue piece 6a projecting toward the bottom surface side of each semiconductor module 1 is connected to the base side of the semiconductor module 1 in the same manner as the embodiment of FIG. And is fastened with screws 7. The fastening screw 7 can be attached to the side surface of the connection frame 6 and screwed to the side surface of the package of the semiconductor module 1. With this configuration, a plurality of two-piece semiconductor modules 1 can be handled as one collective unit as in the first and second embodiments.

In the illustrated example, an example is shown in which three discrete products of a two-pack semiconductor module are combined to form a six-pack. However, by changing the specifications of the assembling case 4 and the connecting frame 6, the two-pack unit is changed. It goes without saying that two semiconductor modules can be combined to form a set of four.

[0020]

As described above, according to the structure of the present invention, when a plurality of discrete products of a two-piece semiconductor module are combined and assembled into an inverter device, a motor control device, or the like, a semiconductor device as in the prior art is used. The required number of semiconductor modules can be handled as one collective unit without the trouble of assembling the modules one by one to the radiation fins, thereby reducing the number of man-hours for assembling the device and the assembling method and procedure on the user side. The degree of freedom can be increased.

[Brief description of the drawings]

1A and 1B are diagrams illustrating an assembly structure of a semiconductor device according to a first embodiment of the present invention, wherein FIG. 1A is a plan view, FIG. 1B is a sectional side view of FIG. Figure

FIGS. 2A and 2B are diagrams illustrating an assembly structure of a semiconductor device according to a second embodiment of the present invention, wherein FIG. 2A is a rear view and FIG.

3A and 3B are diagrams illustrating an assembly structure of a semiconductor device according to a third embodiment of the present invention, wherein FIG. 3A is a rear view and FIG.

4A and 4B are configuration diagrams of a two-piece semiconductor module employed in an embodiment of the present invention, wherein FIG. 4A is an external perspective view, and FIG. 4B is an equivalent circuit diagram.

FIG. 5 is an explanatory view of a conventional assembling procedure when three two-piece semiconductor modules are attached to a radiation fin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 2-pack semiconductor module 1a Package 1a-1 Screw hole 1b Main circuit terminal 1c Auxiliary terminal 1d Metal base for heat radiation 2 Heat radiation fin 4 Assembly case 4a Square hole 4b Screw hole 4c Support tongue piece 5 Fixing claw 6 Connection frame 6a Support tongue Piece 7 Fastening screw

Claims (2)

[Claims] 1. A semiconductor device comprising a combination of a plurality of two-piece semiconductor modules, wherein a plurality of semiconductor modules are collectively arranged and housed in an open-top assembly case, and provided on a bottom surface of the assembly case. The semiconductor device according to claim 1, wherein a square hole for exposing a metal base for heat radiation is opened corresponding to each semiconductor module. 2. A semiconductor device comprising a combination of a plurality of two-piece semiconductor modules, wherein a connecting frame is laid on both sides of a plurality of semiconductor modules arranged in a line on the left and right sides. And a package of each semiconductor module is screwed to the connection frame and assembled.