JP2001035952A - Organic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an organic package for reducing a switching noise or the like, and for loading a chip capacitor for removing a noise without projecting it. SOLUTION: A pad part 9 to be connected with a head part 8a of an outer connection pin 8 is formed on a resin substrate face 7, and the head part 8a is connected with the pad part 9 in this organic package. In this case, a resin layer 17 for adhesion which covers the root part of the outer connection pin 8 including the head part 8a is formed for increasing the strength of connection between the outer connection pin 8 and the resin substrate 1, and a hole part 18 for housing a chip capacitor 15 and a pad part 19 for loading the chip capacitor are formed at the resin layer 17 for adhesion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic package, and more particularly, to a pin-type organic package employing pins as external connection terminals.

[0002]

2. Description of the Related Art As an organic package, a so-called BGA (Ball Grid Array) package in which solder balls as external connection terminals are formed in a grid on a resin substrate surface is known. The BGA package has attracted attention as an effective package for increasing the number of external connection terminals for connection to a motherboard.

[0003] However, in the case of a BGA package,
Once mounted on the motherboard by soldering, it is difficult to remove it after mounting, causing a problem in terms of compatibility.

On the other hand, a PGA (Pin Grid Array) package, which has been widely known in the field of ceramic packages, has some difficulties in terms of increasing the number of terminals as compared with a BGA package, but can be easily attached to and detached from a motherboard. It is superior to the BGA package in that it can be performed. Therefore, the demand for pin-type packages has been increasing in the field of organic packages.

FIG. 7 is a sectional view schematically showing a conventional pin-type organic package. In the figure, reference numeral 1 denotes a resin substrate. The resin substrate 1 includes a core 2 composed of a plurality of layers of a conductor layer 3 made of copper foil and an insulating layer 4 and a solder resist layer 5 laminated on both sides of the core 2. It is formed including. The insulating layer 4 and the solder resist layer 5 are made of a material mainly composed of an organic resin such as a glass epoxy resin.

A pad 9 is formed on the motherboard connection surface 7 on the lower surface in the figure to be joined to the head 8a of the external connection pin 8, and the pad 9 is brought into contact with the head 8a of the external connection pin 8. It is fixed using solder 10.

The semiconductor element mounting surface 6 has a semiconductor element 12
Is formed, and a pad portion 1 for mounting the
Numeral 1 is connected to a pad (not shown) formed on the semiconductor element 12 via a solder ball 13.

[0008]

In recent years, with high integration of semiconductor devices, high performance and miniaturization of electronic devices have been rapidly progressing, and a method of mounting the semiconductor devices in a package has been conventionally used. From the mounting method by wire bonding,
The mounting method by flip chip bonding (see FIG. 7) suitable for multi-chip and high-density mounting has been changed. Also, with the increase in control speed and signal processing speed of electronic devices, noise during switching has become a problem.

The problem of the switching noise has naturally arisen not only in an organic package employing a mounting method by flip chip bonding but also in a conventional ceramic package.

Therefore, the present inventor has paid attention to the fact that in the field of ceramic packages, a ceramic substrate provided with a chip capacitor is used to absorb this switching noise. It has been found that by using a resin substrate provided with a capacitor, switching noise and the like can be effectively reduced.

FIG. 1 is a sectional view schematically showing an organic package in which a chip capacitor is provided.
Here, the same components as those of the organic package shown in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted. In addition, as described in the item of “Embodiment of the invention”,
The organic package shown in FIG. 1 is a cross-sectional view schematically showing the organic package according to the embodiment (1) of the present invention.

In FIG. 1, reference numeral 14 denotes a pad portion for mounting a chip capacitor. The pad portion 14 is formed on the semiconductor element mounting surface 6 so that the chip capacitor 15 is disposed on the pad portion 14. Has become.

By providing the chip capacitor 15 in this manner, switching noise can be reduced. However, as is clear from FIG. If it is provided, the chip capacitor 15 and the peripheral members may be separated or damaged due to contact with other peripheral members or the like when attached to a motherboard (not shown).

In order to prevent the chip capacitor 15 and the peripheral members from being peeled or damaged, the chip capacitor 1
It suffices if the portion where the protrusion 5 protrudes from the resin substrate 1 can be reduced.

However, usually, the thickness of the chip capacitor 15 is 1 to 1.5 mm, and the thickness of the resin substrate 1 is
Since it is 1 mm or less, the chip capacitor 15 cannot be completely accommodated in the resin substrate 1. Therefore, the chip capacitor 15 has to be mounted in a state of protruding from the resin substrate 1, that is, in a state of protruding outside the package.

The present invention has been made in view of the above problems, and provides an organic package that can reduce switching noise and the like, and that can be mounted without projecting a chip capacitor for removing noise. It is an object.

[0017]

In order to achieve the above object, an organic package (1) according to the present invention has a pad portion formed on a surface of a resin substrate for bonding to a head portion of an external connection pin. In the organic package in which the head portion is joined to the pad portion, a pad portion for mounting a chip capacitor is formed on the resin substrate surface.

According to the organic package (1), a chip capacitor for absorbing switching noise can be provided on the pad portion for mounting the chip capacitor, so that noise at the time of switching is effectively reduced. be able to.

Further, in the organic package (2) according to the present invention, in the organic package (1), in order to increase a connection strength between the external connection pins and the resin substrate, the external connection including at least the head portion is provided. It is characterized in that a connection reinforcing portion for covering a root portion of the pin is formed, and a hole for accommodating a chip capacitor is formed in the connection reinforcing portion.

As described in the section of “Prior Art”,
The external connection pins 8 have their head portions 8 a abutted on pad portions 9 formed on the outer surface of the resin substrate 1, and are fixed using solder 10.

However, in this pin connection method, the fixing of the head portion 8a of the external connection pin 8 is performed exclusively by the solder 10, and the resin substrate 1 made of resin is used.
The bonding strength between the boundary and the pad portion 9 made of copper foil or the like is weak, so that the pull strength of the external connection pin 8 is extremely low at 2-3 kgf / pin.

That is, since the connection strength between the external connection pins 8 and the resin substrate 1 is small, it is difficult to endure practical use.
Incidentally, in order to use the external connection pins 8 for practical use, a pull strength of 10 kgf / pin or more is usually required.

According to the organic package (2), in order to increase the connection strength between the external connection pins and the resin substrate, the connection reinforcing portion covering at least a root portion of the external connection pins including the head portion is provided. Since it is formed, even if the bonding of the boundary layer between the resin substrate and the pad portion for bonding with the head portion of the external connection pin is weak, the connection strength between the external connection pin and the resin substrate is increased. And sufficient practical strength can be secured.

Further, since a chip capacitor for absorbing switching noise can be provided on the pad portion for mounting the chip capacitor, noise at the time of switching can be effectively reduced.

Further, the chip capacitor can be housed in the hole formed in the connection reinforcing portion.
That is, since the portion where the chip capacitor protrudes outside the package can be reduced, peeling, damage, and the like of the chip capacitor and other peripheral members that occur when the chip capacitor is mounted on the motherboard can be prevented.

Further, in the organic package (3) according to the present invention, in the organic package (1) or (2), the pad portion for mounting the chip capacitor faces the semiconductor element mounting surface of the resin substrate. Are formed at the center of the.

According to the organic package (3), the chip capacitor is located immediately below the semiconductor element (see FIG. 2 and the details will be described later), and the chip capacitor is disposed around the semiconductor element. As compared with the case (see FIG. 1), the wiring distance between the chip capacitor and the semiconductor element, mainly the wiring distance of the horizontal component, can be greatly reduced. Therefore, the inductance and resistance of the wiring inside the resin substrate can be reduced, so that the switching noise can be reduced more effectively.

Further, the organic package (4) according to the present invention has an organic package in which a pad portion is formed on a resin substrate surface for bonding to a head portion of an external connection pin, and the head portion is bonded to the pad portion. At
A chip capacitor is mounted, and a connection reinforcing portion for increasing a connection strength between the external connection pin and the resin board by covering a root portion of the external connection pin including at least the head portion, the chip capacitor is provided. It is characterized by being formed to cover.

According to the organic package (4), in order to increase the connection strength between the external connection pins and the resin substrate, the connection reinforcing portion covering at least a root portion of the external connection pins including the head portion is provided. Since it is formed, even if the bonding of the boundary layer between the resin substrate and the pad portion for bonding with the head portion of the external connection pin is weak, the connection strength between the external connection pin and the resin substrate is increased. And sufficient practical strength can be secured.

Since the chip capacitor is mounted, switching noise can be absorbed.
Noise at the time of switching can be effectively reduced.

Further, since the chip capacitor is covered with the connection reinforcing portion, that is, the chip capacitor can be prevented from being exposed to the outside of the package, the chip capacitor generated when the chip capacitor is mounted on a motherboard is provided. In addition, peeling and damage of other peripheral members can be prevented.

Further, in the organic package (5) according to the present invention, in the organic package (4), the chip capacitor is mounted at a central portion of a surface of the resin substrate facing the semiconductor element mounting surface. It is characterized by.

Further, according to the organic package (5), the chip capacitor is located immediately below the semiconductor element (see FIGS. 5 and 6 and the details will be described later). Compared with the case where it is arranged in the periphery (see FIG. 1), the wiring distance between the chip capacitor and the semiconductor element, mainly the wiring distance of a horizontal component, can be greatly reduced.
Therefore, the inductance and resistance of the wiring inside the resin substrate can be reduced, so that the switching noise can be reduced more effectively.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an organic package according to the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view schematically showing an organic package according to the embodiment (1). A pad portion 14 for mounting a chip capacitor is provided around a semiconductor element 12 on a semiconductor element mounting surface 6. This pad part 1 is formed.
4 is provided with a chip capacitor 15.

According to the organic package according to the embodiment (1), the chip capacitor 15 for absorbing switching noise can be provided on the pad portion 14 for mounting the chip capacitor. Noise can be effectively reduced.

FIG. 2 is a sectional view schematically showing an organic package according to the embodiment (2). Here, the same components as those of the organic package shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the figure, reference numeral 16 denotes a pad portion for mounting a chip capacitor. The pad portion 16 is formed at the center of the motherboard connection surface 7 facing the semiconductor element mounting surface 6. 15 are provided.

According to the organic package according to the embodiment (2), the chip capacitor 15 for absorbing the switching noise can be disposed on the pad portion 16 for mounting the chip capacitor. Noise can be effectively reduced.

Further, the chip capacitor 15 is located immediately below the semiconductor element 12, and the chip capacitor 15
Is disposed around the semiconductor element 12 (see FIG. 1).
In comparison with the above, the wiring distance between the chip capacitor 15 and the semiconductor element 12, mainly the wiring distance of the horizontal component, can be greatly reduced. Therefore, the inductance and the resistance of the wiring inside the resin substrate 1 can be reduced, so that the switching noise can be more effectively reduced.

FIG. 3 is a sectional view schematically showing an organic package according to the embodiment (3). Here, the same components as those of the organic package shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the figure, reference numeral 17 denotes external connection pins 8 and resin substrate 1.
FIG. 3 shows an adhesive resin layer for increasing the connection strength with the motherboard connection surface of the resin substrate 1 so that the adhesive resin layer 17 covers the roots of the external connection pins 8 including the head 8a. 7 is formed.

A hole 18 is formed in the center of the bonding resin layer 17. The chip capacitor 15 is mounted on the mother board connecting surface 7 of the resin substrate 1 so that the chip capacitor 15 can be accommodated in the hole 18. The pad portion 19 is formed, and the chip capacitor 15 is arranged on the pad portion 19.

Next, a method of manufacturing the organic package according to the embodiment (3) will be partially described.

A) A resin solution, which is one form of the adhesive resin, is poured onto the motherboard connection surface 7 in a thickness that can completely cover the base of the external connection pins 8 and then solidified by heating. Thereby, the bonding resin layer 17 is formed.

(B) As another manufacturing method, a resin sheet is used, and the external connection pins 8 are passed through pin insertion holes provided in the resin sheet, or the external connection pins 8 are pierced into the resin sheet. After the resin sheet is coated so as to be in close contact with the motherboard connection surface 7 of the resin substrate 1, the resin sheet is heated and solidified to form an adhesive resin layer 17.

According to the organic package according to the embodiment (3), the bonding resin layer 17 for increasing the connection strength between the external connection pins 8 and the resin substrate 1 includes the external connection pins including the head portion 8a. 8 is formed so as to cover the base portion of the connection portion 8, the bonding between the boundary layer between the resin substrate 1 and the pad portion 9 and the boundary layer between the head portion 8 a of the external connection pin 8 and the pad portion 9 is weak. Also, the connection strength between the external connection pins 8 and the resin substrate 1 can be increased, and sufficient practical strength can be secured.

Since the chip capacitor 15 for absorbing the switching noise can be provided on the pad portion 19 for mounting the chip capacitor, the noise at the time of switching can be effectively reduced.

Further, the chip capacitor 15 can be accommodated in the hole 18 formed in the bonding resin layer 17, that is, the portion where the chip capacitor 15 protrudes outside the package can be reduced. Chip capacitor 1 generated when mounting on
5 and other peripheral members can be prevented from being peeled or damaged.

Further, the chip capacitor 15 comes directly below the semiconductor element 12, and the chip capacitor 15
Is disposed around the semiconductor element 12 (see FIG. 1).
In comparison with the above, the wiring distance between the chip capacitor 15 and the semiconductor element 12, mainly the wiring distance of the horizontal component, can be greatly reduced. Therefore, the inductance and the resistance of the wiring inside the resin substrate 1 can be reduced, so that the switching noise can be more effectively reduced.

Further, with respect to the organic package according to the embodiment (3), in still another embodiment, the chip capacitor 15 is completely housed in the hole 18 so as not to protrude. The bonding resin layer 17 may be formed.

FIG. 4 is a sectional view schematically showing an organic package according to the embodiment (4). Here, the same components as those of the organic package shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the drawing, reference numeral 20 denotes a reinforcing sheet made of a material mainly composed of an organic resin such as a glass epoxy resin. Between the reinforcing sheet 20 and the mother board connection surface 7, an external portion including a head portion 8a is provided. An adhesive resin layer 21 is formed so as to cover the root of the connection pin 8.

A hole 22 is formed in the center of the reinforcing sheet 20 and the bonding resin layer 21, and the hole 22 is formed in the mother board connection surface 7 of the resin substrate 1 so that the chip capacitor 15 can be accommodated. A pad portion 23 for mounting a chip capacitor is formed, and the chip capacitor 15 is arranged on the pad portion 23.

Next, a method of manufacturing an organic package according to the embodiment (4) will be partially described.

A) The reinforcing sheet 20 having a plurality of pin insertion holes is brought close to the motherboard connection surface 7 of the resin substrate 1 while the external connection pins 8 are inserted through these pin insertion holes, and A resin-filled space is formed between them. Next, an adhesive resin in a molten state is poured into the resin-filled space by heating, and then solidified to form an adhesive resin layer 21.

(B) As another manufacturing method, a reinforcing sheet 20 having an adhesive sheet attached to the back surface is used to form a reinforcing sheet 2
0 is brought close to the motherboard connection surface 7 of the resin substrate 1 while the external connection pins 8 are inserted through the pin insertion holes provided in the reinforcing sheet 20 and is brought into close contact with the motherboard connection surface 7. Next, the adhesive sheet is heated and temporarily melted to form an adhesive resin, which is filled into the space between the reinforcing sheet 20 and the resin substrate 1 and the pin insertion hole without any gap, and solidified. Then, an adhesive resin layer 21 is formed.

According to the organic package according to the embodiment (4), the reinforcing sheet 20 and the head 8
Since the external connection pins 8 and the resin substrate 1 are integrally formed by the adhesive resin layer 21 covering the roots of the external connection pins 8 including a, the boundary layer between the resin substrate 1 and the pad portions 9 is formed. Also, even if the bonding of the boundary layer between the head portion 8a of the external connection pin 8 and the pad portion 9 is weak, the connection strength between the external connection pin 8 and the resin substrate 1 can be increased, and sufficient practical strength can be secured. can do.

Since the chip capacitor 15 for absorbing the switching noise can be arranged on the pad portion 23 for mounting the chip capacitor, the noise at the time of switching can be effectively reduced.

The chip capacitor 15 can be accommodated in the hole 22 formed in the reinforcing sheet 20 and the bonding resin layer 21.
5 can be reduced in the portion protruding outside of the package, so that it occurs when mounting on a motherboard.
Peeling, damage, and the like of the chip capacitor 15 and other peripheral members can be prevented.

Further, the chip capacitor 15 comes directly below the semiconductor element 12, and the chip capacitor 15
Is disposed around the semiconductor element 12 (see FIG. 1).
In comparison with the above, the wiring distance between the chip capacitor 15 and the semiconductor element 12, mainly the wiring distance of the horizontal component, can be greatly reduced. Therefore, the inductance and the resistance of the wiring inside the resin substrate 1 can be reduced, so that the switching noise can be more effectively reduced.

Further, with respect to the organic package according to the above-mentioned embodiment (4), in still another embodiment, the chip capacitor 15 is completely housed in the hole 22 so as not to protrude. The reinforcing sheet 20 and the bonding resin layer 21 may be formed.

FIG. 5 is a sectional view schematically showing an organic package according to the embodiment (5). Here, the same components as those of the organic package shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the figure, reference numeral 24 denotes the external connection pins 8 and the resin substrate 1.
3 shows an adhesive resin layer for enhancing the connection strength with the chip capacitor 15. The adhesive resin layer 24 further completely covers the chip capacitor 15 so as to cover the roots of the external connection pins 8 including the head 8 a. It is formed on the motherboard connection surface 7 of the resin substrate 1 so as to cover it.

According to the organic package of the embodiment (5), in order to increase the connection strength between the external connection pins 8 and the resin substrate 1, the base of the external connection pins 8 including the head 8a is covered. Since the bonding resin layer 24 is formed, the boundary layer between the resin substrate 1 and the pad portion 9,
Even if the bonding of the boundary layer between the head portion 8a and the pad portion 9 of the external connection pin 8 is weak, the connection strength between the external connection pin 8 and the resin substrate 1 can be increased, and sufficient practical strength can be ensured. Can be.

Since the chip capacitor 15 is mounted, switching noise can be absorbed.
Noise at the time of switching can be effectively reduced.

Further, since the chip capacitor 15 is completely covered with the bonding resin layer 24, that is, it is possible to prevent the chip capacitor 15 from protruding outside the package, the chip capacitor 15 is generated at the time of attachment to the motherboard. Peeling, damage, and the like of the chip capacitor 15 and other peripheral members can be prevented.

Further, the chip capacitor 15 is located immediately below the semiconductor element 12, and the chip capacitor 15
Is disposed around the semiconductor element 12 (see FIG. 1).
In comparison with the above, the wiring distance between the chip capacitor 15 and the semiconductor element 12, mainly the wiring distance of the horizontal component, can be greatly reduced. Therefore, the inductance and the resistance of the wiring inside the resin substrate 1 can be reduced, so that the switching noise can be more effectively reduced.

FIG. 6 is a sectional view schematically showing an organic package according to the embodiment (6). Here, the same components as those of the organic package shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the figure, reference numeral 25 denotes a reinforcing sheet made of a material mainly composed of an organic resin such as a glass epoxy resin. Between the reinforcing sheet 25 and the mother board connecting surface 7, there are provided external connection pins 8 and a resin substrate. The adhesive resin layer 26 for increasing the connection strength with the first capacitor 1 is formed so as to cover the root of the external connection pin 8 including the head 8a and to completely cover the chip capacitor 15. .

According to the organic package of the embodiment (6), the reinforcing sheet 25 and the head 8
Since the external connection pins 8 and the resin substrate 1 are integrally formed by the adhesive resin layer 26 covering the roots of the external connection pins 8 including a, the boundary layer between the resin substrate 1 and the pad portions 9 is formed. Also, even if the bonding of the boundary layer between the head portion 8a of the external connection pin 8 and the pad portion 9 is weak, the connection strength between the external connection pin 8 and the resin substrate 1 can be increased, and sufficient practical strength can be secured. can do.

Since the chip capacitor 15 is mounted, switching noise can be absorbed.
Noise at the time of switching can be effectively reduced.

Further, since the chip capacitor 15 is completely covered with the reinforcing sheet 25 and the adhesive resin layer 26, that is, it is possible to prevent the chip capacitor 15 from protruding outside the package. It is possible to prevent the chip capacitor 15 and other peripheral members from being peeled, damaged, and the like, which are generated at this time.

Further, the chip capacitor 15 comes directly below the semiconductor element 12, and the chip capacitor 15
Is disposed around the semiconductor element 12 (see FIG. 1).
In comparison with the above, the wiring distance between the chip capacitor 15 and the semiconductor element 12, mainly the wiring distance of the horizontal component can be greatly reduced. Therefore, the inductance and the resistance of the wiring inside the resin substrate 1 can be reduced, so that the switching noise can be more effectively reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing an organic package according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically showing an organic package according to a second embodiment.

FIG. 3 is a cross-sectional view schematically showing an organic package according to a third embodiment.

FIG. 4 is a cross-sectional view schematically showing an organic package according to an embodiment (4).

FIG. 5 is a sectional view schematically showing an organic package according to the embodiment (5).

FIG. 6 is a sectional view schematically showing an organic package according to the embodiment (6).

FIG. 7 is a cross-sectional view schematically showing a conventional organic package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin board 8 External connection pin 8a Head part 9, 11, 14, 16, 19, 23 Pad part 10 Solder 12 Semiconductor element 15 Chip capacitor 17, 21, 24, 26 Adhesive resin layer 18, 22 Hole part 20, 25 Reinforcement sheet

Claims (5)

[Claims] 1. An organic package in which a pad portion for bonding to a head portion of an external connection pin is formed on a resin substrate surface, and wherein the head portion is bonded to the pad portion, wherein a chip capacitor is mounted on the resin substrate surface. Organic package, characterized in that a pad portion is formed. 2. A connection reinforcing portion which covers at least a root portion of the external connection pin including the head portion is formed in order to increase a connection strength between the external connection pin and the resin substrate. 2. The organic package according to claim 1, wherein a hole for accommodating a chip capacitor is formed. 3. The organic device according to claim 1, wherein the pad portion for mounting the chip capacitor is formed at a central portion of a surface of the resin substrate facing the semiconductor element mounting surface. package. 4. An organic package in which a pad portion for bonding to a head portion of an external connection pin is formed on a resin substrate surface, and a chip capacitor is mounted in an organic package in which the head portion is bonded to the pad portion. A connection reinforcing portion for increasing a connection strength between the external connection pin and the resin substrate by covering a root portion of the external connection pin including a portion, wherein the connection reinforcing portion is formed so as to cover the chip capacitor. Organic package featuring. 5. The organic package according to claim 4, wherein said chip capacitor is mounted at a central portion of a surface of said resin substrate facing a semiconductor element mounting surface.