JP2001028387A - Method of processing wafers - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of processing wafers where the rotation of wafers of various sizes and have orientation flats, can be controlled simply. SOLUTION: This method comprises the steps of attaching a wafer adaptor 10 to a semiconductor wafer 1, the adapter 10 being engageable with the periphery of a semiconductor wafer 1 to make the outer edge circular, and lowering the wafer 1 vertically to at least two, upper and lower, sloped guide rails 2 and 3 while rotating the wafer 1, the rails 2 and 3 which are engaged rotatably with the outer circumferential circle of the adaptor 10, whereby a processing operation is performed onto at least one of the surfaces of the wafer 1 which is lowered sideways, while rolling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer processing method for manufacturing a semiconductor integrated circuit, and more particularly to a processing method therefor.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is manufactured by repeatedly performing various chemical processes such as pattern formation by lithography, etching, crystal growth, and metal deposition on a single crystal silicon wafer.

In general, a single-crystal silicon wafer is fixed horizontally or vertically after each process, and moves to perform the next process. In each step, the wafer is processed while being fixed or stationary or moving horizontally.

However, it is difficult to process the wafer while rolling the wafer vertically in an etching process or the like, or to move the wafer by rolling between the processes.
Was sought. On the other hand, the wafer has a disk shape of a silicon single crystal having a thickness of about 1 mm, a part of the disk shape being cut off, and a shape having a cut called an orientation flat.

[0005] This orientation flat hinders rotation. In addition, due to the rotation, the processing liquid adhering to the periphery of the wafer flows down toward the center of the wafer due to gravity, and there is a concern about contamination. In addition, the wafer has 5 inches, 6
There are various sizes such as inches and 8 inches, and it is difficult to cope with rotation control.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a wafer processing method capable of easily controlling rotation of wafers of various sizes having an orientation flat. As an issue.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 provides a wafer adapter which engages with the outer periphery of a semiconductor wafer and has a circular outer edge. The semiconductor wafer is vertically rolled down on at least two upper and lower inclined guide rails which are mounted and rotatably engaged with the outer peripheral circle of the wafer adapter. On the other hand, a wafer processing method is characterized by performing a processing operation.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The wafer processing method of the present invention will be described in detail below based on one embodiment. In the wafer processing method according to the present invention, the wafer having the orifice can be rotated by attaching the wafer adapter having a circular outer edge to the semiconductor wafer so as to engage with the outer periphery of the semiconductor wafer. That is, the above-mentioned semiconductor wafer can be set on at least two upper and lower inclined guide rails rotatably engaged with the outer peripheral circle of the wafer adapter mounted on the wafer, and can be vertically rolled down by gravity. Wafer processing can be performed by performing a processing operation on one side of the semiconductor wafer that is rotating and descending.

FIG. 1 is an explanatory view showing the concept of an apparatus for rolling a wafer attached to an adapter according to an embodiment of the wafer processing method of the present invention, and FIG. 2 is an explanatory view of a wafer adapter according to the present invention. is there.

The adapter 10 shown in FIG. 2A has a thin ring shape and can be opened and closed as shown in FIG. 2B. That is, two semicircular lunar adapters 11
One end of the is movably threaded through the adapter (axis 12),
At the other end, a locking projection 14 is provided on one adapter and a locking hole 13 is provided on the other, so that the adapter can be closed. FIG. 2C is a cross-sectional view of the AB portion of the adapter 11. As shown in the figure, a recess 15 is provided inside the ring, into which the outer periphery of the wafer 1 is inserted, and the adapter 11 is closed and fixed. Gear teeth are provided on the outer periphery of the adapter (not shown).

In the apparatus shown in FIG. 1A, two parallel guide rails 2, 3 are installed at an angle. As shown in FIG. 1B, the inclined guide rail has a concave cross-sectional shape, and rolls the wafer 7 with the adapter 10 mounted along this portion. Gear teeth (not shown) are provided on the lower inclined guide rail 3 and engage with gear teeth provided on the outer periphery of the adapter 10 to control the rolling of the adapter 10. The wafer 7 moves along the inclined guide rails 2 and 3 while rotating by gravity. In the middle of the movement, there is a wet process using a developing, etching nozzle 4, rinsing nozzle 5, etc., and after being dried by an air knife 6, an air blow or the like, it is removed.

The processing time is adjusted by changing the inclination angle of the inclined guide rail. Further, by changing the direction of the inclination of the inclined guide rail and reciprocating the wafer 7, the processing time can be increased.

It is to be noted that the wafer (adapter) 7 can be used for movement between processes by this method. Adapters prepared for various sizes of wafers are prepared and used. The distance between the vertically inclined guide rails is set according to the outer diameter of the adapter.

In the present embodiment, the concave portion is provided inside the adapter to fix the wafer. However, a spacer may be provided inside the adapter, and the wafer may be held down and fixed via the spacer. Further, a fixing claw 16 may be provided on the adapter to hold down the wafer. Further, although the gear teeth are provided in the embodiment, the control can be performed without the gear teeth on the adapter and the inclined guide rail.

[0015]

The wafer processing method of the present invention has the above constitutional requirements, and can easily control the rotation of wafers having various sizes with orientation flats. In addition, energy for transportation is not required, the operation cost of the production line can be reduced, and since it is a vertical line, it is difficult for dust to fall, and the processing time and tact time can be reduced by the inclination of the guide rail. It can be adjusted by changing or reciprocating on the inclined guide rail.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing the concept of an apparatus according to one embodiment of a wafer processing method of the present invention.

FIG. 2 is an explanatory view showing an embodiment of the adapter according to the present invention.

[Explanation of symbols]

 1. Wafer 2. Upper inclined guide rail 3. Lower inclined guide rail 4. Etching nozzle 5. Rinsing nozzle 6. Air knife 7. Adapter mounting wafer 10 ··· Adapter 11 ··· Semicircular lunar adapter 12 ··· Shaft 13 ··· Locking hole 14 ··· Locking projection 15 ··· Recess 16 ..Fixed claws

Claims (1)

[Claims] At least two upper and lower inclined guides which are engaged with the outer periphery of a semiconductor wafer and have a circular outer edge are mounted on the semiconductor wafer, and are rotatably engaged with the outer periphery of the wafer adapter. A wafer processing method, wherein the semiconductor wafer is vertically rolled down on a rail, and a processing operation is performed on at least one surface of the semiconductor wafer being rotated down.