JP2001028364A - Method of forming conductor pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently remove a plating base for use in the formation of a conductor pattern by ion milling and easily manufacture a narrow conductor pattern with a high aspect ratio. SOLUTION: A plating base 12 is formed on the surface of a substrate 10. A conductor portion 16 is formed in a prescribed pattern on the plating base 12, by charging the plating base 12 to perform electroplating. Unwanted portions of the plating base 12 are removed through etching by ion milling, so that the conductor section 16 is left. Consequently, a conductor pattern with a high aspect ratio is formed. In this method of forming a conductor pattern, when the plating base 12 is removed by ion milling, a required conductor pattern is obtained by a plurality of ion milling processes, having incident angles for ion milling which are different.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a narrow conductor pattern with a high aspect ratio on a substrate.

[0002]

2. Description of the Related Art In a process of manufacturing an electronic component such as an MR head used in a magnetic disk drive, a method of forming a conductive pattern having a narrow pattern width on a substrate is widely used.
Among these manufacturing processes, there is a method of forming a required conductor pattern by forming a plating base on a substrate or an underlayer. In this method, a plating base is formed on a substrate by sputtering or vapor deposition, and then a photosensitive resist is applied to the surface of the plating base, and a portion where a conductor is to be formed is exposed by photolithography. Next, the plating base is energized to perform electrolytic plating, and a conductor portion is formed on an exposed portion of the plating base. Next, when the resist is removed, the conductor portion is formed in a predetermined pattern on the plating base. Therefore, an unnecessary portion of the plating base between the conductor portions is removed by ion milling, and the substrate surface between the conductor portions is removed. To expose. Thus, a predetermined conductor pattern is formed on the substrate.

[0003]

As described above, a method of forming a plating base, applying a current to the plating base to form a conductor portion, and removing unnecessary portions of the plating base by an ion mill is described. When the base is removed, there is a problem in that the residue of the plating base adheres to the conductor pattern by the ion mill and hinders formation of the conductor pattern in a narrow pattern. The present invention relates to a method for forming a conductor portion by electrolytic plating using a plating base, and forming a conductor pattern by removing unnecessary portions of the plating base by an ion mill,
An object of the present invention is to provide a method for forming a conductor pattern having a very narrow pattern and a high aspect ratio.

[0004]

The present invention has the following arrangement to achieve the above object. That is, a plating base is formed on the surface of the substrate, a conductive portion is formed in a predetermined pattern on the plating base by applying an electric current to the plating base and electrolytic plating is performed, and unnecessary portions of the plating base are left so as to leave the conductor portion. In the method of forming a conductor pattern having a high aspect ratio by etching and removing by an ion mill, when a plating base is removed by the ion mill, a required conductor is formed by a plurality of ion mill processes having different incident angles of the ion mill. It is characterized by obtaining a pattern. Further, in the ion milling step, the plating base formed on the surface of the substrate is etched by an ion mill in which the incident angle is obliquely incident with respect to the normal direction of the substrate, and then the incident angle substantially matches the normal direction of the substrate. Then, the plating base remaining in the vicinity of the base of the conductor is etched, and finally, the incidence angle is set to the direction toward the side surface of the conductor, and ion milling is performed. Further, when the side surface of the conductor portion is subjected to ion milling, the side surface of the conductor portion is etched by an ion mill to form a predetermined conductor pattern width. Also, the conductive pattern is formed with an aspect ratio of 2 to 4.

[0005]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a method for forming a conductive pattern on a substrate 10 using a plating base. FIG. 1A shows a state in which a plating base 12 is formed on the surface of a substrate 10 by sputtering. The plating base 12 is provided for energization for performing electrolytic plating, and can be formed using an appropriate metal such as copper. FIG. 1 (b) shows that a resist is applied to the surface of the plating base 12, exposed and developed to form a conductor pattern on the surface of the plating base 12, and the resist pattern 14 is formed.
Shows a state in which is formed. Reference numeral 14a denotes a recess for forming a conductor pattern on the plating base 12, and the plating base 12 is exposed at the bottom of the recess 14a. FIG. 1C shows a state in which a current is applied to the plating base 12 to perform electrolytic plating such as electrolytic copper plating, and a conductor portion 16 is formed on the plating base 12.

FIG. 2 shows a state where the resist pattern 14 is dissolved and removed to leave the conductor 16 on the plating base 12. The conductor pattern is obtained by removing unnecessary portions of the plating base 12. Therefore, the plating base 12 is subjected to an ion mill so that the plating base 12 exposed on the substrate 10 is removed. FIG. 2 shows a state in which the plating base 12 is etched by setting the incident angle of the ion mill to about 45 degrees with respect to the normal direction of the substrate as a first step of performing the ion mill. The angle of incidence of the ion mill with respect to the substrate is set to be oblique in order to increase the etching efficiency by the ion mill, and is most efficient when the angle of incidence is set to about 45 °. In ion milling by oblique incidence, etching is performed from both sides of the conductor portion 16 while changing the incident direction.

FIG. 3 shows a step of performing the next ion mill on the state where the plating base 12 is etched by the above oblique incidence. In the first ion milling step, the plating base 12 can be efficiently etched by oblique incidence. However, as shown in FIG. 3, the base of the conductor 16 is shadowed by the etching, and the plating base is located near the base of the conductor 16. 12 will remain. High aspect ratio conductor 16
In this case, the plating base 12 at the base of the conductor 16
The rest of it appears greatly. In the second step of the ion mill shown in FIG. 3, the ion mill is set by setting the incident angle of the ion mill to a direction substantially coinciding with the normal direction of the substrate 10. Substrate 10
By setting the angle of incidence of the ion mill in the normal direction of
The plating base 12 remaining at the base of the conductor 16 is etched. At the same time, the conductor 16 is also etched from the top.

FIG. 4 shows a state in which the plating base 12 remaining at the base of the conductor portion 16 has been removed by the second step. In the second step, when the plating base 12 is subjected to ion milling, residues 12 a of the plating base 12 adhere to the side surfaces of the conductor 16. FIG. 4 shows a state in which the residue 12a is attached to the side surface of the conductor portion 16 and the width of the conductor portion 16 is increased. The third step by the ion mill is a step of removing the residue 12a of the plating base 12 attached to the side surface of the conductor section 16 and forming the conductor section 16 to have a required pattern width. That is, in the third step of the ion mill, the side face of the conductor portion 16 is mainly subjected to the ion mill. Therefore, in the third step, the ion mill is performed toward the side surface of the conductor portion 16. In the embodiment, the angle of incidence of the ion mill in the third step is set to 70 ° with respect to the normal direction of the substrate 10, and the ion mill is performed in a direction toward substantially the side surface of the conductor 16.

FIG. 5 shows a state after performing a third step by an ion mill. The residue 12a of the plating base 12 adhered to the side surface of the conductor section 16 in the second step is removed by etching, and the conductor section 16 itself is removed. Is also etched to have a narrow width, and the conductor portion 16 is formed in a predetermined conductor pattern 18.

As described above, when the plating base 12 is subjected to ion milling, an ion milling step in which the incident angle is obliquely incident to the normal line of the substrate, an ion milling step in which the incident angle is substantially normal to the substrate, and an incident angle Are successively subjected to an ion milling process in a direction of the side surface of the conductor portion, whereby a conductor pattern having a high aspect ratio can be formed. In a manufacturing process of a magnetic head used in a magnetic disk drive, it is necessary to form a magnetic pole for writing in a narrow width having a high aspect ratio such as an aspect ratio of 2 to 4. The method for forming a conductor pattern according to the present invention is extremely effective as a method for forming such a conductor pattern having a high aspect ratio with a narrow width.
Of course, the method for forming a conductor pattern according to the present invention can be suitably applied to the formation of a conductor pattern in a process of manufacturing various wiring boards and the like.

[0011]

According to the conductor pattern forming method of the present invention, as described above, when removing the plating base by the ion mill, the direction of the incident angle of the ion mill is changed to remove the plating base. This makes it possible to efficiently remove the plating base and to form the conductor pattern with a narrow width. By conducting the ion mill in multiple stages, the conductor pattern can be etched more precisely, and a conductor pattern having a high aspect ratio can be easily formed.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a step of forming a conductor on a substrate.

FIG. 2 is an explanatory view showing an ion milling process at an oblique incident angle.

FIG. 3 is an explanatory diagram showing an ion milling process based on a normal incident angle.

FIG. 4 is an explanatory view showing an ion milling step of etching a conductor portion from a side direction.

FIG. 5 is a cross-sectional view showing a state where a conductor pattern is formed on a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 12a Residue 12 Base 14a Depression 14 Resist pattern 16 Conductor 18 Conductor pattern

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Mitsumasa Okada 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Hideaki Nii 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa No. 1 Fujitsu Limited F term (reference) 4K057 DA12 DB01 DD04 DG18 DN01 5D033 BA32 DA04 DA08 5F004 BA11 DB08 EA28 EB08

Claims (4)

[Claims] 1. A plating base is formed on the surface of a substrate, and a conductive portion is formed in a predetermined pattern on the plating base by applying an electric current to the plating base to perform electrolytic plating. In a method for forming a conductor pattern having a high aspect ratio by removing unnecessary portions by etching with an ion mill, a plurality of ion mill processes having different incident angles of the ion mill when the plating base is removed by the ion mill. A method for forming a conductor pattern, wherein a required conductor pattern is obtained. 2. In the ion milling step, a plating base formed on a surface of a substrate is etched by an ion mill in which an incident angle is obliquely incident with respect to a normal direction of the substrate. The method according to claim 1, wherein the plating base remaining in the vicinity of the base of the conductor is etched by setting the direction substantially equal to the direction of the conductor, and finally, the ion mill is performed by setting the incident angle to the direction toward the side surface of the conductor. 2. The method for forming a conductor pattern according to 1. 3. The method for forming a conductor pattern according to claim 2, wherein when the side surface of the conductor portion is subjected to ion milling, the side surface of the conductor portion is etched by an ion mill to form a conductor pattern having a predetermined width. . 4. The method for forming a conductive pattern according to claim 1, wherein the conductive pattern is formed with an aspect ratio of 2 to 4.