JP2001019771A - Production of compound - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a compound capable of efficiently blending an inorganic filler with a thermosetting resin in high ratios of the inorganic filler without affecting the metal inside the relevant apparatus and the quality of the final compound obtained even in case that the inorganic filler is highly abrasive to the metal for conventional methods, and to obtain such a compound. SOLUTION: This method for producing the objective compound comprising (A) 70-97 wt.% of an inorganic filler and (B) 3-30 wt.% of a thermosetting resin binder comprises blending the components A and B together under agitation in a substantially powdery condition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a compound comprising an inorganic filler and a thermosetting resin, and more particularly, to a method for producing a compound which exhibits remarkable abrasion to a metal material which comes into contact with the compound during production. The present invention relates to a method for producing a compound of a material and a thermosetting resin, and a compound obtained by the method.

[0002]

2. Description of the Related Art In recent years, technological innovations in the electronics industry and the like have been remarkable, and the material technologies that support them have also made great strides. The development of polymer materials that play a role in materials is no exception, and many new or high-performance polymer materials have appeared.
While gradually replacing conventional materials such as metals, ceramics, and glass, we are consolidating our ground. The main characteristics required for polymer materials in the electronics field are quality stability, mass productivity, moldability, heat resistance, durability, electrical properties, corrosion resistance, weight reduction, impact resistance, etc. In addition to thermoplastic resins, thermosetting resins represented by epoxy resins, phenol resins, etc., and various engineering plastics represented by polyimide, polycarbonate, polyphenylene oxide, etc. are mainly used. Needless to say, it is extremely rare that required various material properties can be realized by each resin alone, and in many cases, the purpose is achieved comprehensively by combining with various materials.

Conventionally, a technique of combining various inorganic fillers with a resin binder has improved mechanical properties, electrical properties, thermal properties, surface properties, optical properties, flammability, etc., and reduced costs. Therefore, a wide variety of inorganic fillers have been developed and made available. In order to mix such an inorganic filler and an organic resin, kneading is generally performed by using a device such as a ribbon blender, a tumble mixer, a Henschel mixer, a mixing roll, a coneder, and a screw extruder. In the method of (1), when a large amount of the inorganic filler is mixed, the abrasion of the metal member inside the device becomes a problem. Particularly, when the inorganic filler has a high abrasion to metal, the device or the compound is not used. It was practically impossible to mix the two without adversely affecting the quality of the product.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to develop a novel compound production method which overcomes such technical limitations, and in particular, has a remarkable abrasion property against metal. It is an object of the present invention to provide a method for producing a compound capable of efficiently mixing the inorganic filler shown and a thermosetting resin, and a compound thereof.

[0005]

Means for Solving the Problems The present inventors have worked diligently to achieve the above-mentioned object, and as a result, have found that a large amount of an inorganic filler exhibiting a remarkable abrasion property to a metal, especially a remarkable abrasion to a metal. It has been found that a method of mixing the inorganic filler exhibiting the property and the thermosetting resin binder in a specific ratio in a substantially powdery state as homogeneously as possible is effective. The present invention has been completed based on such findings.
That is, the present invention provides a method for producing a compound comprising (A) 70 to 97% by weight of an inorganic filler and (B) 3 to 30% by weight of a thermosetting resin binder. A method for producing a compound, characterized by mixing and stirring a thermosetting resin binder in a substantially powder state. Here, the component (A) is silica, alumina,
It is preferably at least one inorganic filler selected from glass powder, aluminum silicate, calcium silicate, silicon carbide and silicon nitride.

In the above production method, in order to stir and mix the thermosetting resin binder as the component (B) substantially in a powder state, the thermosetting resin binder should be selected from the following. preferable. That is, the component (B) is preferably a thermosetting resin binder comprising at least one thermosetting resin selected from an epoxy resin, an unsaturated polyester resin and a vinyl ester resin, and a curing agent thereof. The component (B) is preferably a thermosetting resin binder comprising a vinyl ester resin, at least one monomer selected from an allyl ester monomer, an acrylate ester monomer and a methacrylate ester monomer, and a radical polymerization initiator. . Further, the component (B) includes a vinyl ester resin alone or a mixed resin of a vinyl ester resin and an unsaturated polyester resin, and at least one monomer selected from an allyl ester monomer, an acrylate ester monomer, and a methacrylate ester monomer; A thermosetting resin binder composed of a thermoplastic polyester resin having a glass transition temperature (Tg) of 0 ° C. or lower and a radical polymerization initiator is preferable. Further, in the present invention, in the method for producing a compound, an organic or inorganic reinforcing short fiber may be added and mixed. Further, the present invention also provides a compound comprising the inorganic filler obtained by the above-mentioned production method and a thermosetting resin binder.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the inorganic filler as the component (A) is not particularly limited.
Any known materials used for improving mechanical properties, electrical properties, thermal properties, surface properties, optical properties, flammability, etc., and reducing costs, such as silica, mica, alumina, water Examples include summed alumina, bentonite, barium titanate, calcium carbonate, clay, talc, vermiculite, gypsum, glass powder, aluminum silicate, calcium silicate, silicon carbide, silicon nitride, and the like, and any one or a mixture thereof is used. . The particle size of these inorganic fillers is preferably about 0.01 to 100 microns, and it is preferable that coarse particles and micron particles are mixed at an appropriate ratio so that the particle size distribution is close to the closest packing.
The mixing amount of these inorganic fillers must be 70 to 97% by weight based on the total amount of the inorganic filler and the thermosetting resin binder, and the inherent properties of the inorganic filler are sufficiently exhibited. Although it depends on the specific gravity, the amount of the inorganic filler is preferably 80 to 96% by weight. If the amount of the inorganic filler is less than 70% by weight, it becomes difficult to handle the powder in the present invention at the time of mixing, and as a result of the kneading situation of the conventional method, wear of the contact metal due to the inorganic filler is caused. Not only will the inside of the equipment be seriously damaged, but the mixing of metal powder into the compound will be at a non-negligible level, deteriorating the quality. On the other hand, when the content exceeds 97% by weight, the binding ability becomes unsatisfactory, and the practical strength of the composite obtained by curing the compound becomes insufficient. Among the above-mentioned inorganic fillers, silica, alumina, glass powder, aluminum silicate, calcium silicate, silicon carbide, silicon nitride and the like have remarkable abrasion properties to metals. In the present invention, when these inorganic fillers are used, In this case, metal wear on the inner surface of the mixing apparatus and the stirring blades can be significantly suppressed.

On the other hand, the thermosetting resin used as the component (B) in the present invention is not particularly limited, but examples thereof include a phenol resin, a melamine resin, a urea resin, an allyl resin, an epoxy resin, and an unsaturated polyester. Resins, vinyl ester resins, etc. are preferred, and epoxy resins, unsaturated polyester resins, and vinyl ester resins are preferred. These resins have a low viscosity of the composition when a curing agent is blended, and have good mixing properties with the inorganic filler, but also have good adhesiveness. The curing agent is not particularly limited and known ones can be used.For example, in the case of an epoxy resin, there are amines and acid anhydrides, and particularly, a composition using an acid anhydride has low viscosity. Therefore, it is suitably used for the purpose of the present invention. In the case of an unsaturated polyester resin, a curing agent such as a vinyl monomer is suitably used.

In the present invention, the vinyl ester resin used as the component (B) is described in a narrow sense, for example, in "Polyester Resin Handbook" by Eiichiro Takiyama (published by Nikkan Kogyo Shimbun in 1988, p. 336). It is composed of a series of oligoacrylates (vinyl esters) that share a secondary hydroxyl group generated by the ring-opening reaction of an epoxy group, an acryloyl group or a methacryloyl group in the same molecule, and a monomer as a crosslinking agent. However, in the present invention, vinyl ester resins in a broad sense also include condensates of acrylic acid or methacrylic acid with compounds having terminal hydroxyl groups such as bisphenol A, hydrogenated bisphenol A, and cyclohexane dimethanol. Applied. In the present invention, a novolak type vinyl ester resin is also suitably used.

Next, the thermosetting resin binder as the component (B) in the present invention comprises a vinyl ester resin and at least one monomer selected from an allyl ester monomer, an acrylate ester monomer and a methacrylate ester monomer. , A radical polymerization initiator, and preferably a vinyl ester resin alone or a mixed resin of a vinyl ester resin and an unsaturated polyester resin, and an allyl ester monomer, an acrylate monomer and a methacrylate monomer. It is preferable to use at least one monomer, a thermoplastic polyester resin having a glass transition temperature (Tg) of 0 ° C. or lower, and a radical polymerization initiator. Here, examples of the allyl ester monomer include diallyl orthophthalate, diallyl isophthalate, diallyl terephthalate, diallyl cyclohexanedicarboxylate, and the like. Preferred are diallyl isophthalate and diallyl terephthalate, and particularly preferred is diallyl terephthalate.

The acrylate monomer and methacrylate monomer include, for example, phenoxyethyl methacrylate, isobornyl methacrylate, benzyl methacrylate, dicyclopentenyloxyethyl acrylate, dicyclopentenyloxyethyl methacrylate, trimethylolpropane diacrylate , Trimethylolpropane dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane tris-oxyethylene acrylate, trimethylolpropane tris-oxyethylene methacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, glycerin diacrylate , Glycerin Methacrylate, 1,6-hexanediol diacrylate and the like, can also be used such halogen-substituted compounds for imparting flame retardancy.

Further, the glass transition temperature (Tg) is 0
When a thermoplastic polyester resin having a temperature of not more than ° C is used, the shrinkage ratio of the compound at the time of curing can be effectively reduced. This thermoplastic polyester resin is an esterification reaction that produces water between dibasic acid and glycol,
Alternatively, it can be easily synthesized by a ligation reaction between the reaction product and a polyisocyanate, or can be synthesized by a transesterification reaction of dimethyl ester of dibasic acid and glycol as a by-product of methanol. The number average molecular weight of such a thermoplastic polyester resin is preferably from 5,000 to 50,000, but for this purpose, some contrivance is required in the esterification reaction. For example, the glycol component is made slightly excessive, and an initial esterification reaction is performed using a titanium-based catalyst or the like. When the acid value falls below a certain value, 1 torr is further added.
It is desirable to carry out the deglycol reaction under a high vacuum condition of a certain degree, and according to this method, those having a number average molecular weight exceeding 20,000 can be easily produced. The number average molecular weight of the thermoplastic polyester resin used in the present invention is particularly preferably from 15,000 to 30,000.

The glycol as a raw material of the thermoplastic polyester resin includes, for example, propylene glycol,
1,3-butylene glycol, 1,6-hexanediol, 2-methyl-1,3-propanediol, 1-methyl-1,3-propanediol, 3-methyl-1,5-
Pentanediol, 4-methyl-1,7-heptanediol, 2-methyl-1,6-hexanediol, 3-methyl-1,6-hexanediol, 1-methyl-1,6
-Hexanediol, 4-methyl-1,9-nonanediol, 2-methyl-1,9-nonanediol, 3-methyl-1,9-nonanediol, ethylene glycol, diethylene glycol, neopentyl glycol, 1,5
-Pentanediol and the like. Examples of the dibasic acid as a raw material of the thermoplastic polyester resin include, for example, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, tetrahydrophthalic anhydride, heptic anhydride, adipic acid, azelaic acid, sebacic acid, Dodecandioic acid and the like are mentioned, and among them, any one of adipic acid, azelaic acid, sebacic acid and dodecandioic acid alone or a mixture thereof is preferable.

The Tg of the thermoplastic polyester resin is
It can be easily measured by a generally used measuring method using DSC (differential scanning calorimeter). The Tg of the thermoplastic polyester resin used in the present invention is preferably 0 ° C or lower, particularly preferably -10 ° C or lower. If Tg exceeds 0 ° C., the compound of the present invention may not exhibit the effect of reducing shrinkage. As the radical polymerization initiator necessary for curing the unsaturated polyester resin or vinyl ester resin in the present invention, a known organic peroxide can be used. For example, benzoyl peroxide, t
-Butylperoxy-2-ethylhexanate, 2,5
-Dimethyl-2,5-di (2-ethylhexanoyl) peroxyhexane, t-butylperoxybenzoate, t-butyl hydroperoxide, cumene hydroperoxide, dicumyl peroxide, di-t-
Butyl peroxide, 2,5-dimethyl-2,5-dibutylperoxyhexane, and the like. The amount of the polymerization initiator used is 0.2 to 4% by weight based on the resin composition.
The range of the degree is preferable. Further, the compound of the present invention has a certain length or less, preferably an average fiber length of 1 to 10
mm, glass fiber, carbon fiber,
Adds reinforcing short fibers such as wollastonite and synthetic fibers.
By mixing, the product strength after curing can be further improved. In the compound manufacturing method of the present invention, even when such fibers are mixed, damage to the fibers can be effectively suppressed.

As the mixing device for obtaining the compound in the present invention, a general-purpose device such as a ribbon blender, a tumble mixer, a Henschel mixer, a mixing roll, a co-kneader, and a screw extruder can be used. However, in the present invention, it is necessary to stir and mix while substantially maintaining the state of the powder, and it is desirable to mix as uniformly as possible. For this purpose, it is preferable to select the specific thermosetting resin binder as described above as the component (B). However, when the mixed material is liquid, the liquid material is uniformly absorbed and dispersed in powder. After that, mixing while maintaining the state of the powder is important for ensuring the stability of quality. The composite compound thus obtained can be molded as it is while hot, but if necessary, a step of kneading with a device such as a kneader may be added. When the thermosetting resin binder contains an epoxy resin, it is preferable to freeze or refrigerate the obtained compound for stable storage until processing. When the thermosetting resin is an unsaturated polyester resin or a vinyl ester resin, it can be stably stored at room temperature by appropriately selecting a polymerization initiator.

In molding the compound according to the present invention, the compound is formed into a desired shape by using a generally known molding method such as injection molding, transfer molding, press molding and the like. Can be cured by radicals generated by As the conditions for the heat curing, an optimum temperature can be selected according to the type of the organic peroxide. For example, when dicumyl peroxide is used as the organic peroxide, curing is performed at 160 ° C. for 5 minutes. After removing the mold, 1
Sufficient curing can be obtained by after-curing at 80 ° C for 1 hour, but it is also possible to complete the curing to such an extent that after-curing can be omitted by stopping in a mold at 185 ° C for 5 minutes. Can be. further,
When an acid anhydride curing agent is used for the epoxy resin, for example, 175 ° C. for 2 minutes, and after-curing at 185 ° C. for 3 minutes.
Curing conditions of the order of hours can be applied. In the present invention, the thermosetting resin binder is fluidized by heating in the above-mentioned processing step, and is subsequently cured. In addition, in order to improve the hardness, durability, weather resistance, water resistance, etc., the above-mentioned compound includes an ultraviolet absorber, a light stabilizer, an antioxidant, an antifoaming agent, a leveling agent, Additives such as a release agent and a water-repellent agent can be added to further improve the performance. According to the present invention, since a large amount of inorganic filler filler and thermosetting resin, which has been considered difficult in the past, can be easily compounded, it can be applied as an effective means for developing new materials.

[0017]

(Vinyl ester resin)

(1) Bisphenol-based vinyl ester resin (manufactured by Kyoeisha Chemical Co., Ltd .; epoxy ester EH-1001). Hereinafter, this is referred to as A-1 resin. (2) Novolak-based vinyl ester resin (manufactured by Showa Polymer Co., Ltd .; Lipoxy SP-470). Hereinafter, this is referred to as A-2 resin. [Epoxy resin] 100 parts by weight of alicyclic diepoxy carbonate resin, 80 parts by weight of 4-methylhexahydrophthalic anhydride, 0.4 parts by weight of 2-ethyl-4-methylimidazole, and 1.5 parts by weight of an antioxidant Plus 60
The compound obtained by mixing at ℃ was cooled and stored frozen. Hereinafter, this is referred to as A-3 resin.

[Unsaturated polyester resin] It is a condensate having the following composition and having a number average molecular weight of 3,800 and a melting point of 120 ° C. Hereinafter, this is referred to as B-1 resin. 1,4-butanediol 5.3 mol ethylene glycol 4 mol 1,4-cyclohexanedimethanol 1 mol 2,6-naphthalenecarboxylic acid dimethacrylate 6 mol fumaric acid 4 mol [thermoplastic polyester resin] thermometer, stirrer, 682 g (11.0 mol) of ethylene glycol was placed in a 5-liter flask equipped with a distillation condenser and a gas inlet tube.
679 g (3.5 mol) of dimethyl terephthalate and 2.6 g of zinc acetate were added, and transesterification was carried out at 200 ° C. Next, 332 g (2.0 mol) of isophthalic acid, 909 g (4.5 mol) of sebacic acid, 0.3 g of hydroquinone and 1.3 g of tetraisopropyl orthotitanate were added, and an esterification reaction was further carried out at a temperature of 220 ° C. to obtain an acid value. When the pressure reaches 6.8, the pressure inside the flask is reduced to 1.5 Torr.
After reacting for 3 hours, the resin was poured into a metal vat and solidified by cooling. The obtained pale yellow resin is GPC
(Gel permeation chromatogram), the number average molecular weight was 13,200 and the weight average molecular weight was 58,00.
It was 0. The Tg of this resin was-
15 ° C. Hereinafter, this is referred to as C-1 resin.

Example 1 Using a universal mixing stirrer in which stirring blades rotate and revolve, the following materials were mixed for 30 minutes while stirring at high speed at room temperature, taking care to always maintain the state of powder. As a result, a granular compound was obtained. This compound did not change its properties even after storage at 30 ° C. for 3 months, and the storage stability was sufficient. A-2 resin 22 parts by weight B-1 resin 22 parts by weight trimethylolpropane trisoxyethylene methacrylate 22 parts by weight diallyl terephthalate 27 parts by weight C-1 resin 7 parts by weight Spherical alumina-1 (manufactured by Showa Denko KK; AS- 20, average particle diameter 21 micron) 350 parts by weight Spherical alumina-2 (manufactured by Micron Co., Ltd .; average particle diameter 21 microns) 350 parts by weight Milled fiber 40 parts by weight Hoechst wax 1 part by weight Tertiary butyl perbenzoate 2 parts by weight The spiral flow value at 155 ° C. of the compound was 72 cm, indicating good workability. The cure shrinkage of this compound was 0.10% as measured according to JIS K6911, and a shrinkage reduction effect as intended was observed. In addition, this compound
The specimen for physical property measurement obtained by preheating to 165 ° C and transfer molding at 165 ° C has a flexural strength of 10.2 kg / m.
m ² , flexural modulus 3270 kgf / mm ² , thermal expansion coefficient 11 ppm / ° C., and thermal conductivity 5.5 W / K · ° C.
This value of the thermal conductivity was extremely good data indicating that it was located between plastics and ceramics. In addition, a test was conducted in which the sample was immersed in a 1% aqueous solution of sodium hydroxide (NaOH) at 40 ° C. for one day, and no abnormality was found.

Example 2 A powdery compound was obtained by mixing at room temperature for 45 minutes while sequentially adding the following materials using a kneader. A-3 resin 100 parts by weight Spherical alumina-1 (manufactured by Showa Denko KK; AS-20, average particle diameter 21 microns) 350 parts by weight Spherical alumina-2 (manufactured by Micron Corporation; average particle diameter 21 microns) 350 parts by weight Milled fiber 40 parts by weight Hoechst wax 1 part by weight The above compound was immediately frozen and preserved, and was used after being left in a low-humidity atmosphere from the day before molding.
The spiral flow value of this compound at 155 ° C. was 55 cm, indicating substantially good workability. The cure shrinkage was 0.18% as measured according to JIS K6911. In addition, this compound
The specimen for physical properties measurement obtained by press molding at 70 ° C. has a flexural strength of 9.4 kg / mm ² and a flexural modulus of 2260.
kgf / mm ² , and the coefficient of thermal expansion was 16 ppm / ° C.
In addition, a test was conducted in which the sample was immersed in a 1% aqueous NaOH solution at 40 ° C. for one day, and no abnormality was found.

Example 3 Using an all-purpose mixing stirrer in which the stirring blades rotate and revolve, the following materials are mixed for 30 minutes while stirring at high speed at room temperature, taking care to always maintain the powdery state. As a result, a granular compound was obtained. This product did not show any change in its properties even after storage at 30 ° C. for 3 months, and storage stability was sufficient. A-1 resin 30 parts by weight B-1 resin 20 parts by weight Trimethylolpropane triacrylate 15 parts by weight Diallyl terephthalate 25 parts by weight C-1 resin 10 parts by weight Spherical silica (manufactured by Tatsumori Corporation; average particle size 28 microns) 1050 parts by weight Milled fiber 50 parts by weight Dicumyl peroxide 2 parts by weight The spiral flow value at 155 ° C. of the above compound was 67 cm, indicating good processability. The cure shrinkage of this compound was 0.08% when measured according to JIS K6911, and a shrinkage reduction effect as intended was observed. In addition, this compound is
The specimen for physical properties measurement obtained by preheating at 160 ° C. and transfer molding at 160 ° C. has a bending strength of 10.1 kg / mm ² ,
Flexural modulus 2800kgf / mm ² , Thermal expansion coefficient 8
ppm / ° C.

Example 4 Using a universal mixing stirrer in which the stirring blades rotate and revolve, the following materials are mixed for 30 minutes while stirring at a high speed at room temperature, taking care to always keep the powder state. As a result, a granular compound was obtained. This product showed no change in its properties even after storage at 30 ° C. for 3 months, and storage stability was sufficient. A-2 resin 25 parts by weight B-1 resin 20 parts by weight Trimethylolpropane triacrylate 10 parts by weight ethoxydiethylene glycol acrylate 10 parts by weight Diallyl terephthalate 25 parts by weight C-1 resin 10 parts by weight Calcium carbonate 350 parts by weight Glass fiber (average length) : 3 mm) 40 parts by weight Tertiary butyl peroxybenzoate 2 parts by weight The spiral flow value at 155 ° C of the above compound was 85 cm, showing good workability. The cure shrinkage of this compound was measured in accordance with JIS K6911 and was found to be 0.05%, indicating a shrinkage-reducing effect as intended. Further, a specimen for measuring physical properties obtained by injection molding this compound at 160 ° C. has a flexural strength of 12.1 kg / mm ² and a flexural modulus of 205
It was 0 kgf / mm ² and the coefficient of thermal expansion was 11.6 ppm / ° C.

[0023]

As described above, according to the present invention, when the inorganic filler and the thermosetting resin are mixed, the mixing ratio of the inorganic filler is large, and in the conventional method, the inorganic filler is mixed with the metal. Even in the case of showing a large wear property, the inorganic filler and the thermosetting resin can be efficiently mixed without adversely affecting the metal inside the device and the quality of the obtained compound. In addition, the compound obtained by the present invention can be easily manufactured using a general-purpose mixing device, so that the compound has high practicality. It can be widely applied to various applications such as electrical products, mechanical parts, and vehicles.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F070 AA44 AA46 AA49 AB10 AC15 AC22 AC23 AC28 AC43 AC44 AC56 AC88 AD02 AE01 AE16 FA01 FB06 FC03 4F201 AA36 AA39 AA41 AA43 AB03 AB11 AB16 AB17 AB25 AC04 AD16 AR15 BA01 BC01 BC12 BC37 BC37 4J002 AA013 AA021 BF051 CC031 CC071 CC161 CC181 CD001 CD201 CF002 CF271 DA017 DE146 DJ006 DJ007 DJ016 DL006 DL007 EH078 EH108 EK019 EK039 EK049 EK069 FA043 FA047 FD013 FD016 FD017 FD159 GM00 GN00 G00

Claims (7)

[Claims] (A) 70 to 97% by weight of an inorganic filler
And (B) a thermosetting resin binder in an amount of 3 to 30% by weight, the (A) inorganic filler and (B) the thermosetting resin binder are substantially powdered. A method for producing a compound, characterized by stirring and mixing. 2. The compound according to claim 1, wherein the component (A) is at least one inorganic filler selected from silica, alumina, glass powder, aluminum silicate, calcium silicate, silicon carbide and silicon nitride. Method. 3. The compound according to claim 1, wherein the component (B) comprises at least one thermosetting resin selected from an epoxy resin, an unsaturated polyester resin, and a vinyl ester resin, and a curing agent thereof. Method. 4. The composition according to claim 1, wherein the component (B) is a vinyl ester resin,
The method for producing a compound according to claim 1, comprising at least one monomer selected from an allyl ester monomer, an acrylate ester monomer and a methacrylate ester monomer, and a radical polymerization initiator. 5. The component (B) is a vinyl ester resin alone or a mixed resin of a vinyl ester resin and an unsaturated polyester resin, and at least one kind selected from an allyl ester monomer, an acrylate ester monomer and a methacrylate ester monomer. The method for producing a compound according to claim 1, comprising a monomer, a thermoplastic polyester resin having a glass transition temperature (Tg) of 0 ° C or lower, and a radical polymerization initiator. 6. The method for producing a compound according to claim 1, further comprising adding and mixing an organic or inorganic reinforcing short fiber. 7. A compound comprising an inorganic filler obtained by the production method according to claim 1 and a thermosetting resin.