JP2001015968A - Cooling structure for electronic device and attaching structure for cooling fan - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the cooling efficiency of a cooling structure for electronic device, by integrally attaching a radiator that radiates heat by means of a cooling fan which blows air in parallel with the surface of a thermally conductive substrate to one surface of the substrate through a planar heat transfer medium. SOLUTION: A cooling structure for electronic device is constructed in such a way that cooling air is taken in individual amplifiers 33 from the front faces of the amplifiers 33, and the air is discharged from the backsides of the amplifiers 33. In each amplifier 33, a heat exchanger 36 composed of a radiator and cooling fins is integrally attached to and coupled with one surface of a thermally conductive substrate 35 mounted with a unit 34 to be cooled on the other surface through a planar heat transfer medium. In addition, side plates 37 are attached to both side faces of the substrate 35 to surround and secure a longitudinal ventilating passage to the heat exchanger 36. Thus, the heat exchanger 36 is made to make heat exchange by means of the cooling fan which blows air in parallel with the surface of the substrate 35. Consequently, the cooling efficiency of a cooling structure can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a cooling structure for an electronic device and a mounting structure for a cooling fan. In addition,
In the present invention, an electronic device for performing various information processing to which the present invention is applied, a communication device, and the like are collectively referred to simply as an electronic device in the present invention.

A wireless communication device, for example, a transmission device of a base station device for a mobile phone, amplifies a transmission output signal with a radio frequency output power by a signal amplifying device, and transmits it as a radio signal from an external antenna to the air. However, a plurality of such amplifying devices are configured in parallel.

[0003] By using a plurality of amplifying devices, for example, two outputs of the same type are combined and transmitted as double transmission power, or four outputs are combined and transmitted as four times transmission power. Is performed.

[0004]

2. Description of the Related Art FIG. 18 shows such a conventional apparatus configuration. That is, the amplification device panel 2 is mounted and mounted on an upper portion where a power supply panel, a control panel, and other device panels (not shown) are mounted and mounted in a housing frame 1 installed in the station building. 18A is a front view, FIG. 18B is a side sectional view,
It is.

[0005] A plurality of amplifying devices 3 which are vertically long in a front view are mounted on the amplifying device panel 2 in parallel in the horizontal direction, and a cooling air intake portion 4 is provided below and a cooling fan 5 for discharging cooling air is provided above. A plurality of them are arranged in the plane direction.

Since the size of the housing rack 1 is standardized, it cannot be set to an arbitrary size. For this purpose, 12 amplifiers 3 are mounted in the horizontal direction in the illustrated example, and one of the amplifiers 3 has a narrow width in the horizontal direction when viewed from the front and is vertically elongated.

[0007] Since these amplifiers 3 generate heat during operation, external air is taken in from the lower cooling air intake section 4 as shown by the arrow, and is discharged by the upper cooling fan 5 to generate heat. Forced cooling is performed.

Since the width of the amplifying device 3 is narrow and flat in the front-back direction, it is difficult to provide the cooling fan 5 for each amplifying device 3, as shown in the perspective view of the separated state in FIG. A plurality of amplifying devices 3, in this case three units, are forcibly cooled by two cooling fans 5 in the front-rear direction.

The cooling fan 5 is a propeller type having a square shape in a plan view. For this reason, the cooling fans 5 need to have a width corresponding to three units, and must also be provided in the depth direction.

The cooling air intake section 4 is provided with an air guide plate 6 which is inclined upward from the front to the rear as viewed from the side, and the air sucked by the cooling fan 5 is shown in FIG.
As shown by an arrow, the air flows almost uniformly into the amplification device 3 along the air guide plate 6, and when passing through the radiation fins 7 of the amplification device 3, the heat of the device is removed and the air becomes warm and upward. Is discharged. This is the same for the two vehicles indicated by the two-dot chain line in FIG.

The amplifying device 3 is as shown in a perspective view of a separated state in FIG. That is, various circuit units necessary for circuit configuration are arranged on one side surface of a substrate 8 made of one flat aluminum alloy plate, and
It is attached so that it is close to. A large number of radiating fins 7 for radiating heat, which are also made of an aluminum alloy and extend in the vertical direction, are provided on almost the entire rear surface side of the substrate 8 in parallel in the horizontal direction (front-back direction).

The schematic circuit configuration of each unit mounted on the surface of the substrate 8 is such that a first amplifier 9 as a main amplifier for signal amplification is mounted below and a second amplifier 11 as a final stage amplifier is mounted above. Attached to. A printed circuit board 12 on which a control circuit is mounted is mounted on an intermediate portion, and a power supply unit 13 and a printed circuit board 14 on which a power supply circuit is mounted are mounted on the rear side.

Guide plates 15 and 16 extending in the front-rear direction are attached to the upper and lower edges of the substrate 8, and a front plate 17 is provided on the front end surface, and a back plate 18 and a plug-in connector 19 are provided on the rear end surface. , Respectively, and a side plate 21 covering the whole of them is attached.

In order to assemble and assemble as described above, they are assembled along the connection lines shown respectively, and are removably connected by mounting screws (not shown) to form a thin and flat box as a whole.

Each of the first amplifier 9, the second amplifier 11, the power supply unit 13, and the like has an electronic circuit having a circuit configuration for amplification and power supply in a metal case formed by cutting an aluminum alloy material. By attaching the parts,
The heat generated from these electronic components and the like is transmitted to the metal case and is transmitted and diffused to the substrate 8 so as to radiate the heat from the radiating fins 7 on the rear surface side where the heat is transmitted.

In this way, since the heat dissipating fins 7 and the heat dissipating fins 7 are arranged as flat as possible on the substrate 8 as much as possible, a high-density mounting structure requiring a vertically extending height is obtained. I have.

Further, by covering the circuit configuration amplifier and other units in a box shape, almost all of the cooling air can be effectively made by the rear surface of the substrate 8 and the side plate 21 of the amplifying device 3 adjacent thereto. It flows through the portion of the radiation fins 7 in the narrow air passage that is formed.

[0018]

According to the above-mentioned conventional structure, the cooling air flows through the radiating fins 7, but the air cannot flow through the box-shaped portion for the circuit configuration. However, it is inevitable that this portion becomes air resistance.

For this reason, the cooling fan 5 must be large and powerful, so that the entire apparatus cannot be reduced in size other than the requirement for downsizing. In addition, a large cooling fan 5 and noise countermeasures against the airflow are required.

In order to mount a large number of amplifying devices 3 in parallel, it is unavoidable to extend in the height direction because the structure is as thin and flat as possible, and unless the height of the fins of the radiation fins 7 is also reduced. No.

This means that in order to effectively dissipate a large amount of heat, it is necessary to narrow the interval between the radiation fins 7 to increase the number of fins. However, since the air flow path is narrow and long, the air flow path becomes long. There is a limit to increasing the number of fins because the air resistance to air flow increases.
The heat radiation fins 7 cannot improve the heat radiation efficiency.

Although the substrate 8 is a metal material having good thermal conductivity, the heat generation portion is concentrated, and the diffusion of the heat generation element parts to the wide heat radiation fin 7 by the substrate 8 is limited to the high heat generation element parts. Therefore, the efficiency of heat radiation cannot be improved. It is only necessary to disperse the heat-generating components for the concentrated heat-generating portions, but this is difficult due to restrictions on the circuit configuration.

The above arrangement of the same substrate 8 on a plane makes it possible to secure a large area on the plane.
By reducing the size in the width direction, it is ideal for work such as assembly in device manufacturing, adjustment of electric circuits, and maintenance at a later date. Since there is a limit in reducing the height and narrowing the fin interval, it must be said that the heat dissipation structure is an inefficient heat dissipation structure, and cannot cope with concentrated heat generation.

The present invention has been made in view of the above-mentioned various problems of the prior art, and has been made in consideration of the above problems. Accordingly, the present invention provides a novel electronic device capable of improving cooling efficiency and miniaturizing the device. An object of the present invention is to provide a cooling structure and a structure for mounting a cooling fan.

[0025]

Means for Solving the Problems According to a first aspect of the present invention, there is provided a heat conductive substrate for mounting a unit requiring cooling on one surface. A radiator is integrally attached to the other surface of the substrate via a flat heat transfer medium, and the radiator is radiated by a cooling fan blown in a direction parallel to the surface of the heat conductive substrate. It is.

According to the first means, since the radiator is integrally attached to the surface of the heat conductive substrate via the flat heat transfer medium, it can be handled as an integral structure. In addition, the heat conducted from the heat generating unit to the heat conductive substrate by the flat heat transfer medium is quickly diffused and transmitted to the radiator, and is radiated from the radiator by the airflow of the cooling fan.

The radiator has no obstruction, such as obstructing ventilation, between the radiator and the opposing cooling fan. Since the performance of the cooling fan is maximized, the radiator and the cooling fan can be downsized.

From the above, by improving the heat radiation efficiency of the radiator, it is possible to shorten the air passage distance, and the ventilation resistance can be kept low.

One surface side of the heat conductive substrate, which is also a substrate, is secured as a mounting area for a circuit unit that generates heat, and the other surface side is clearly divided as a heat radiation area. Therefore, the size of the apparatus can be reduced.

The second means, which is the gist of the cooling structure of the electronic device of the present invention, is to provide a flat heat transfer device on a pair of heat conductive substrates opposed to each other on which a unit requiring cooling is mounted on both outer surfaces in parallel. A radiator is integrally attached and coupled via a transmission medium, and the radiator is radiated by a cooling fan that is blown in a direction parallel to a surface of the heat conductive substrate.

According to the second means, since the radiator is integrally attached to the opposing surfaces of the heat conductive substrate via the flat heat transfer medium, the radiator is integrated with the integrated structure. In addition, the heat conducted from the heat generating unit to the two heat conductive substrates by the heat transfer media on each plane is quickly diffused and transmitted from both sides of the radiator, and the air is cooled by the cooling fan. The heat is radiated from the radiator by the flow.

The radiator has no obstruction such as obstructing the ventilation between the cooling fan and the opposing cooling fan. Since the performance of the cooling fan is maximized, the radiator and the cooling fan can be downsized.

From the above, by improving the heat radiation efficiency of the radiator, it is possible to shorten the air passage distance, and the ventilation resistance is suppressed low.

Since both outer surfaces of the heat conductive substrate, which is also a substrate, are secured as a mounting area for a circuit unit that generates heat and the other opposing surface side is clearly divided as a heat radiation area, a three-dimensional device is provided. Since the configuration can be made, the size of the device can be reduced.

Means for constituting the mounting structure of the cooling fan of the present invention are as follows. A guide tool and an engaging tool are mounted on both sides of the cooling fan having a rectangular shape as viewed from the front, and the cooling fan is mounted from the surface of the mounting tool. A pair of projecting arm plates are extended so as to be in contact with the other side surfaces of the cooling fan, and guide pieces projecting from both sides of the guide member of the cooling fan are provided between the arm plates of the fixture. The cooling plate is inserted by fitting, and the engaging projection at the tip of the arm plate is elastically projected and engaged into the engaging notch at the end of the engaging member of the cooling fan.

According to the mounting structure of the cooling fan, the guide can be securely inserted by fitting the guide pieces on both sides of the guide tool mounted on both sides of the cooling fan to both sides of the arm plate of the mounting tool. At the final stage of insertion, the engaging projection at the tip of the arm plate is elastically fitted into the engaging notch at the end of the engaging tool, so that it is engaged and held in a retaining state.

In order to take out the cooling fan held by the fixture, the engagement is easily released by moving the ends of the arm plates in a direction approaching each other against their elasticity. Fans can be pulled out.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The cooling structure of an electronic device and the mounting structure of a cooling fan according to the present invention will be described in detail below with reference to the drawings showing preferred embodiments based on the constitution. . For easy understanding, the same reference numerals are given to the same parts.

FIG. 1 shows a schematic device configuration to which the present invention is applied. A power supply panel, a control panel, and other device panels (not shown) are attached and mounted in a device frame 31 grounded in a station building. The amplification device panel 32 is attached and mounted on the upper part to be formed. 1A is a front view, and FIG. 1B is a side sectional view.

The amplifying device panel 32 has a plurality of amplifying devices 33, which are rectangular and slightly elongated in a front view, mounted in a plurality of stages in parallel in the horizontal direction. The device rack 31 has the same size as the conventional device.
A total of 12 units, two units in the vertical direction, are mounted.

The cooling air is taken in from the front of the individual amplifying device 33 and discharged to the back as shown by arrows in FIG.

Referring to the perspective view of the principle configuration of FIG. 2 for the configuration of the main part of the amplifying device 33, the heat conductive substrate 3 on one side of which the unit 34 requiring cooling is mounted.
A heat exchanger 36 composed of a radiator (not shown) and a cooling fan (not shown) is integrally attached and connected to the other surface of the device 5 via a flat heat transfer medium. Further, the side plates 37 are attached to both side surfaces, so that the ventilation path in the front-rear direction to the heat exchanger 36 is reliably surrounded and secured. Therefore, the heat exchanger 36 is configured to exchange heat with a cooling fan blown in a direction parallel to the surface of the heat conductive substrate 35 (the direction of the arrow in the figure).

The plane heat transfer medium interposed between the heat exchanger 36 and the heat conductive substrate 35 is not shown in the figure, and the cooling fan is also shown integrally with the heat exchanger 36. It is abbreviated. However, these will be described later in detail with reference to the detailed drawings.

FIG. 3 is a perspective view showing the detailed configuration of the amplifier 33 in a separated state, and FIG. 4 is a perspective view showing the assembled state. Referring to FIG. 4, the left side of the drawing is referred to as front or front, the right side is referred to as back or back, the opposite side is referred to as an upper surface, the near side is referred to as a lower surface, the near right side is referred to as a right side, and the left side is referred to as a left side.

FIG. 5 is a side view of the assembled state with the right side plate removed, FIG. 6 is a top view which is also a plan view of the assembled state, and FIG. 7 is a bottom view which is also a bottom view of the assembled state. Note that the same applies to the following, but it should be noted that in each of the drawings, screws for assembling and components not directly related to the configuration description are omitted because they are complicated.

Prior to the description with reference to the drawings, the description will be made first with reference to FIG. FIG. 8A is a front view, and FIG.
Is a right side view, and FIG. (C) is a top view. A flat heat transfer medium is provided on the opposing surfaces of a pair of upper and lower parallel thermally conductive substrates (hereinafter, also simply referred to as substrates) 41 and 42, respectively. A radiator board 46 is shown in which radiators 45 are integrally attached and coupled at two locations in the front-rear direction at intervals via 43 and 44.

FIG. 9 is a front view showing the heat radiating substrate 46 in a separated state. The substrates 41 and 42 are formed by cutting an aluminum alloy plate having an appropriate thickness and good thermal conductivity. is there.

The flat heat transfer media 43, 44 have an appropriate width in the left-right direction in the figure and extend long in the front-rear direction perpendicular to the plane of the paper, and are known as heat lanes or flat heat pipes. A large number of thin tubular fluid flow paths are formed inside the material so that they are close to each other and are parallel to each other. Are formed, and a required amount of the working fluid liquid for heat transfer is sealed. Although the heat transfer principle is the same as that of a known heat pipe, the heat is diffused in the length direction when an arbitrary portion is heated. By the way, the thickness is 2mm
The diameter of the internal flow path is about 1 mm and the width is arbitrary. In this case, the length can be set to about 50 to 60 mm and the length can be set to an arbitrary length.

The radiator 45 is provided with the flat heat transfer medium 4.
An integral long planar heat transfer medium 4 similar in construction to 3, 44
7 is bent plurally in an arc shape so as to have a parallel space when viewed from the front, and both ends are bent and formed in the state shown in the drawing so as to be in contact with each folded arc portion, and a flat heat transfer medium 47 is provided between the parallel spaces. The heat radiation fins 48 are formed of a thin aluminum plate having the same width in the front-rear direction and folded at small intervals in a zigzag shape when viewed from the front.

The joining means of the contact portion of the heat transfer medium 47 on the plane of the radiator 45 and the contact portion with the fins 48 for heat dissipation are all joined and integrated by an aluminum brazing material.

The planes of both end faces 49 and 51 of the flat heat transfer medium 47 of the radiator 45 are joined to the opposing faces of the substrates 41 and 42 via the flat heat transfer media 43 and 44, respectively, as shown in FIG. In the state shown, they are integrally attached and joined, but since these joints are also surface joined with an aluminum brazing material or aluminum solder material, there is no space between these joints, and Therefore, heat conduction is performed very effectively.

The board 41, 42 is provided with screw holes for mounting circuit units to be described later, a front plate, a side plate, and the like, cutouts and holes for connection of circuit wiring, and the like in important places. .

Referring to FIGS. 3 to 7 described above, a first amplifying unit 55 which is a pre-amplifier for signal amplification is attached to the lower surface of the substrate 42 below the heat radiating substrate 46. A second amplification unit 56, which is a post-stage amplifier, is attached to the upper surface of the upper substrate 41.

A filter unit 57 and a power supply unit 58 are mounted on the upper substrate 41 in parallel with the second amplification unit 56. Power supply unit 58
A printed circuit board 59 on which a power supply circuit is mounted is also mounted on the upper side in parallel.

A front plate 61 is attached to the front side of the heat radiation board 46. The amplifying device 3 is provided on the front side of the front plate 61.
3 so that the handle 62 can be easily handled at the time of operation such as attachment and detachment.
, Two mounting screws 63 for mounting and fixing to the apparatus frame 31, a power switch 64, an operation state indicator light 65, and an air intake 66 having an air filter.
And are provided.

A right plate 67 and a left plate 68 of the same height are attached to both side surfaces of the heat radiating substrate 46 to cover the whole both side surfaces, and the upper and lower edges of these side plates 67 and 68 are not shown in the device frame (not shown). The guide groove is fitted into the guide groove to facilitate insertion and extraction, and the insertion position is determined.

Two radiators 45 before and after the radiator board 46
As shown in FIG. 5, a cooling fan 71 is attached to each of three places before, after, and in the middle, but only two places are shown in FIG. 3 for convenience.

Each of the first amplification unit 55, the second amplification unit 56, and the power supply unit 58 is provided with an electronic circuit having a circuit configuration for amplification and power supply in a metal case formed by cutting an aluminum alloy material. The components are attached, and heat generated from these electronic components is transmitted to the metal case, and is conductively diffused to the substrates 41 and 42 of the heat radiation substrate 46.

Each of the above units, the front plate 61 and the side plate 6
7, 68 and the like are detachably connected by mounting screws (not shown), but the mounting means of the cooling fan 71 is not shown, but is mounted as described later.

As shown in FIG. 7, a coaxial connector 75 for signal input is provided on the back side of the first amplification unit 55, and is provided on a back plate 76 and is plug-in connection protruding in the back direction. The coaxial connector 77 is connected to the coaxial connector 77 by a coaxial cable 78. Back plate 76
The power supply circuit and control circuit from the outside to the amplification device 33,
A plug-in connection type connector 79 for connecting other signal circuits and the like is also provided.

On the front side of the first amplification unit 55, a coaxial connector 81 for outputting an amplified signal is provided, and the filter unit 5 shown in FIGS. 6 and 3 is provided.
7 is connected to the input coaxial connector 82 by a coaxial cable via the connection line path shown in FIG. 3, and is connected via a coupler (coupler) 83 in the middle. .

A coaxial connector 84 provided on the rear side surface for outputting a signal from the filter unit 57 and an input coaxial connector 85 provided on the rear side surface of the second amplification unit 56 are shown in FIG. 6, the signal is amplified inside the second amplification unit 56, and a plug-in connection type coaxial connector 8 is provided as a final amplified signal protruding to the rear side.
6 is output.

The flat heat transfer medium 43 provided on the substrate 41 above the heat radiating substrate 46 is located immediately below the second amplification unit 56 and immediately below the power supply unit 58, as well shown in each figure. The width and the continuous length are set so as to be located at and.

The flat heat transfer medium 44 provided on the substrate 42 below the heat radiating substrate 46 is similarly set in width and length so as to be located immediately above the first amplification unit 55. I have.

Each of the three cooling fans 71 in series is set to take in air from the front side and discharge and blow air to the rear side. Therefore, the radiator 45 on the front side
The air taken in from outside is pushed in by the cooling fan 71 on the front side and is sucked by the cooling fan 71 on the back side. Regarding the radiator 45 on the rear side,
The same applies to the air from the radiator 45 on the front side by the two cooling fans 71 before and after that, and the cooling is effectively performed by the consistent rapid air flow.

According to the above configuration, the device frame 3 of the communication device
When the cooling fan 71 is rotated and air is blown by the operation of the amplifier 33 mounted on the first amplifying unit 33, the first amplifying unit 55, the second amplifying unit, and the power supply unit 5
8 and the like, heat is generated from the electronic components, and the substrates 41 and 42 of the heat radiation substrate 46 are passed through the respective metal cases.
Heat is transferred to.

Based on the appropriate thickness of the metal case and the substrates 41 and 42 and the good thermal conductivity, the metal case and the substrates 41 and 42 are appropriately diffused and spread inside, and the temperature in a range corresponding to the degree increases. . Such a temperature rise is caused by the substrates 41, 4
The heat transfer media 43, 44 of the respective planes are transmitted to the flat heat transfer media 43, 44 integrally formed with the second heat transfer media.
The heat is rapidly transmitted and diffused toward the entire surface of the device.

This means that heat is transferred from the flat heat transfer media 43 and 44 to the upper and lower surfaces 49 and 51 of the flat heat transfer medium 47 of the heat sink 46 as a result. Rapidly raises the temperature of the entire heat transfer medium 47 in the plane of. However, such a rise in temperature causes heat to be removed by the rapid flow of air flowing in one direction between the surface of the heat dissipating fin 48 and the surface of the flat heat transfer medium 47 integrated with the flat heat transfer medium 47. , The temperature drops.

That is, even if the heat-generating portions of the units 55, 56, 58, etc. are not uniform, and even if the heat-generating portions are uneven or the amount of heat generation is high or low, a certain degree of temperature diffusion by the metal case and the substrates 41, 42 is achieved. As well as a flat heat transfer medium 4
The amplification device 33 is cooled by the quick heat absorption and heat dissipation by the radiator 45 by the transfer and diffusion of heat by the heat transfer devices 3 and 44.

As described above, instead of relying solely on the heat conduction by the substrates 41 and 42, the positive diffusion and transfer of heat by the plane heat transfer media 43 and 44 interposed therebetween
The flow of heat into the radiator 45 is promoted. In the radiator 45 as well, cooling is performed by effective and rapid heat dissipation from the entire surface by the air flow by the same action. Therefore, when the radiator 45 causes a decrease in temperature due to the dissipation of heat, the inflow and transfer of heat are further promoted.

As described above, heat distribution and heat flowing into the radiator 45 are efficiently performed even when the distribution of the amount of heat generated by the heat generating units to the two substrates 41 and 42 is equalized. It depends on what you do.

The passage of the air in the radiator 45 is reduced, the heat is radiated from the entire surface by the dense fins 48, and the cooling fan 71 is disposed before and after the radiator 45 to reduce the air flow. By increasing the flow velocity, the fluid loss of the cooling air was reduced and the entire cooling system could be made much smaller than before.

By increasing the air flow velocity, the effect of the temperature due to the cooling air flow to the cooling fan 71 on the rear side is also reduced. Such a thing,
This is because the facing areas of the radiator 45 and the cooling fan 71 are made substantially equal.

As a result, when comparing the device structures of FIG. 1 and FIG. 18, the front view area occupied by the amplifier panels 2 and 32 including the cooling system is compared with the conventional structure of FIG. In the case of, the size can be reduced to about 70% in the height direction.

Next, the cooling fan 7 is
10 will be described with reference to FIG. 10 and subsequent figures. FIG. 10 is an external view of the cooling fan 71, and FIG. 10A is a front view and FIG. Front view, centering on the center part of the frame body 91 whose periphery is a square,
The propeller 92 is configured to be rotatable by an electric motor supported by the frame 91, and mounting holes 93 are provided at four corners of the frame 91. Arrows shown in FIG. 2B indicate the direction of rotation of the propeller 92 and the direction of air flow. FIG. 11 shows the positional relationship between the radiator 45 and the cooling fan 71 described above, and cooling air is sent in the axial flow direction indicated by the arrow.

FIG. 12 shows a frame 91 of the cooling fan 71.
7 shows a state in which a guide tool 94 is attached to one side surface of the parallel side surfaces, and an engagement tool 95 is attached to the other side surface thereof with screws 96 through through holes 93, respectively. FIG.
In FIG. 1, (a) is a front view, (b) is a left side view of (a), (c) is a right side view of (a), and (d) is a plan view of (a). , Respectively.

The guide tool 94 and the engagement tool 95 will be described with reference to a perspective view of a separated state in FIG. 13. The guide tool 94 has a U shape in a plan view and is parallel to both sides of the main surface 97. A screw insertion hole 99 and a screw hole 101 for attachment are respectively formed on the attachment surface 98, and both upper and lower ends of the attachment surface 98 protrude as guide pieces 102 longer than the height of the main surface 97.

The height of the main surface 97 is substantially equal to the length of one side of the frame 91 of the cooling fan 71, and the interval between the mounting surfaces 98 is a distance suitable for fitting the width of the frame 91. Therefore, the guide pieces 102 protrude to both sides of the side of the frame body 91.

The engagement tool 95 has a U-shape in a plan view, and has a screw insertion hole 106 and a screw hole 107 for mounting on a mounting surface 105 parallel to both sides of a main surface 104 having holes 103 at upper and lower positions. Main surface 1 formed corresponding to each
A bent surface 108 which extends further up and down from 04 and is parallel to the mounting surface 105 in the same direction has a U-shape in a side view, and an engagement notch 109 is formed in this surface 108.

The height of the main surface 104 is appropriately higher than the length of one side of the frame 91 of the cooling fan 71 and is parallel to the surface 108.
Are designed to cover both side surfaces of the frame body 91, and the mounting surface 1
The facing space 05 is a space suitable for fitting the width of the frame 91. Also, an appropriate space is provided between the opposing main surface 104 and the side surface of the frame body 91.

The guide tool 94 and the engagement tool 95 are suitably formed by processing a metal plate such as an aluminum alloy plate or a stainless steel plate, or a synthetic resin molded product.

The guide tool 94 and the engagement tool 95 are fitted on both sides of the frame 91 of the cooling fan 71,
The state shown in FIG. 12 can be obtained by inserting the screw 96 into the screw holes 99 and 106 at the locations and screwing the screws 96 into the screw holes 101 and 107 on the opposite side.

A mounting tool as a means for mounting the cooling fan 71 in this state to the heat dissipation board 46 will be described with reference to the external view of FIG. (A) shows a front view, (b) shows a side view, and (c) shows a plan view. A perspective view is shown on the left side of FIG.
Attachment 111 is provided at the tip of arm plate 113 parallel to the center of support surface 112 with engaging projections 1 projecting to both outsides.
14 are formed, and the distal end 115 is formed narrower than the width of the arm plate 113.

The support surface 112 extends in the vertical direction on the left and right sides in FIG. 2B, which is the front and rear direction of the arm plate 113, and mounting holes 116 are formed in the respective portions.

The arm plate 113 extends parallel to the middle of the arm plate, and extends on the inclined surface so that the distal ends of the arm plate 113 extend and separate from each other.
Reference numeral 15 denotes an inclined surface in a direction to approach again.

The width of the arm plate 113 in a plan view is equal to the width of the frame 91 of the cooling fan 71, and the opposing width between the parallel portions is set to a suitable opposing width to receive the space between both side surfaces of the frame 91. .

The engaging projection 114 has a tip 115
From the side, toward the support surface 112, it is inclined so as to be spaced apart from the surface of the arm plate so as to rise outward and has a triangular shape in a side view, and its tip is an upright surface. When processing a metal plate, it can be formed by stamping from the inner surface side.

Since the attachment 111 needs to have elasticity for the reason described later, the attachment 111 is formed by processing a metal plate such as a stainless steel plate for a spring, or by molding a known synthetic resin having elasticity. It is preferable to select from

With the above configuration, the cooling fan 71 can be assembled in the state shown in FIG. 12 in accordance with the guide line of the path shown in FIG. This will be described with reference to the following figures.

FIG. 15 is a front view showing the mounting procedure. First, the upper and lower sides of the support surface 112 of the mounting member 111 are mounted on the side surfaces of both substrates 41 and 42 of the heat radiation substrate 46 by means of mounting holes 116 using screws (not shown). Attach and fix. This state is shown in FIG. In the state of FIG. 15, the left plate 68 is attached to the heat dissipation board 46, but the right plate 67 is removed to attach a cooling fan.

[0091] Note that the attachments 111 are attached to the front and rear and intermediate portions of the two radiators 45.

In this state, the arm plate 113 is
It extends along the sides 1 and 42 and reaches the open end. It should be noted that the drawings only illustrate the mounting procedure, and do not show components other than related parts, for example, the radiator 45 or the like, for easy understanding.

The projecting end of the engaging projection 114 at the tip of the arm plate 113 is elastically in contact with the opposing inner surfaces of the substrates 41 and 42 by the expanding force of the tip of the arm plate 113 due to elasticity. The part is a heat transfer medium 4 on both planes
3, 44 are located so as to avoid contact with them.

As shown, the cooling fan 71 with the guide tool 94 and the engagement tool 95 attached thereto is
The guide tool 94 side is inserted between the two arm plates 113 facing each other. At this time, it is important to confirm and set the direction of air blowing from the front side to the back side of the paper, that is, from the front side to the back side.

The main surface 97 of the guide tool 94 is
3, the two guide pieces 102
Are positioned on both side surfaces in the width direction of the arm plate 113, are prevented from being displaced in the lateral direction, and can be easily inserted along the arm plate 113 due to the spread of the front end between the opposing arm plates 113.

Next, referring to FIG. 16, this state is such that the cooling fan 71 is inserted into the inside of the fixture 111, and the upper and lower sides of most of the frame body 91 are placed on the arm plate 1
Thirteen parallel opposing surfaces are in contact with each other. Then, both sides of the mounting surface 105 on both sides of the engagement tool 95 receive both sides in the width direction of the distal end of the arm plate 113, and the distal end of the bent surface 108 is
2 and an inclined surface of the distal end portion 115 of the arm plate 113.

From this state, the main surface 104 of the engagement tool 95 is
At the same time, the front end of the bent surface 108 fits between the opposing substrates 41 and 42, and at the same time, comes into contact with the inclined surface of the front end portion 115 of the arm plate 113 to elastically deform both inclined portions in the approaching direction. . This elastic deformation is easy because the length of the arm plate 113 is relatively long.

[0098] By pushing it in and elastically deforming it, finally, the top of the engaging projection 114 is bent.
8 and passes through the distal end surface of the bent surface 108, and at the same time, the main surface 97 of the guide tool 94 is
11 is in contact with the surface of the support surface 112, and
14 resiliently protrudes into the engagement notch 109 of the bent surface 108, and the distal end 115 peeks out from the engagement notch 109 of the main surface 104, and its distal end protrudes from the end surface of the main surface 104. This state is shown in FIG.

The position of the guide tool 94 is regulated by the support surface 112 of the mounting tool 111 and the arm plate 113, and the engaging tool 95 also has a lateral direction in which both ends of the mounting surface 105 are in contact with the tip of the arm plate 113. Is restricted, and the engagement protrusion 114 is engaged with the engagement notch 109.
The inward fit prevents movement in the exit direction. As a result, the pair of upper and lower arm plates 113 is elastically deformed in the direction in which they approach each other.
The upper and lower surfaces of the first frame 91 are held by elastic force,
There is no inconvenience such as rattling.

[0100] The right plate 6
7 is attached and fixed to the side surfaces of the substrates 41 and 42 by screws (not shown). This state is shown in FIG. In order to prevent the tip 115 of the arm plate 113 from interfering with or contacting the right plate 67, the right plate 67 is provided with a hole 117 of a size necessary to avoid the tip 115 in this portion.

If the cooling fan 71 needs to be removed for convenience, the right side plate 67 is removed, and the tip end 115 of the arm plate 113 is pressed with one hand so as to approach from both sides, so that the tip of the engagement projection 114 is engaged. Since the disengagement from the engagement notch 109 is released, the finger of the other hand is hooked on the hole 103 of the engagement tool 95 and can be easily removed in the reverse order of insertion by pulling it out. Engagement tool 95
Since there is an appropriate space between the main surface 104 of the cooling fan 71 and the surface of the frame 91 of the cooling fan 71, it is possible to surely catch a finger.

By making a hole large enough in the right side plate 67 to allow the engagement tool 95 to pass through, the cooling fan 71 can be easily attached and detached with the right side plate 67 attached. It can be done.

Although the present invention has been described by taking an amplifying device in a communication device as an example, the present invention is not limited to such a form, and can be applied to a cooling structure of another electronic device or a device having similar and similar heat generation. Of course, it is needless to say again.

Further, a pair of heat conductive substrates is provided on both sides of the radiator, but it is a basic form that at least one of the substrates is also provided. The number of radiators and cooling fans should be at least one, and more radiators and cooling fans should be included.

[0105]

As described above in detail, according to the cooling structure of the electronic device and the mounting structure of the cooling fan according to the present invention, heat is radiated to the surface of the heat conductive substrate through the flat heat transfer medium. The vessel was attached and joined together,
This can be handled as an integral structure.

The heat conducted from the heat generating unit attached to the surface of the heat conductive substrate to the heat conductive substrate by the flat heat transfer medium is quickly diffused and transmitted to the radiator, and the air of the cooling fan is cooled. The heat is radiated from the radiator by the flow.

Since the radiator is arranged to face the cooling fan, it can flow through the entire surface, and can radiate heat intensively, so that the cooling fan can use its maximum capacity. While the size of the cooling fan can be reduced, the length of the radiator can be shortened by improving the heat radiation efficiency of the radiator. Further, it became possible to reduce the ventilation resistance, that is, the air resistance.

[0108] One side of the heat conductive substrate, which is the substrate, is clearly defined as a mounting mounting area for a circuit unit that generates heat, and the other side is clearly defined as a heat dissipation area.
Since a three-dimensional device configuration can be made, miniaturization of the device has also become possible.

Further, on the surface of the heat conductive substrate facing,
The radiator is integrally attached and coupled via the respective plane heat transfer media, so that it can be handled as an integrated structure, and the heat transfer unit conducts the heat from the heating unit to both heat conductive substrates by the respective plane heat transfer media. The heat is quickly diffused and transmitted from both sides of the radiator, and is radiated from the radiator by the airflow of the cooling fan.

Since the radiator is capable of passing the air of the cooling fan facing the entire surface, the heat is concentrated and effectively radiated, and the capacity of the cooling fan is maximized. Can be made smaller. In addition, since the length of the radiator can be shortened by improving the heat radiation efficiency of the radiator, the air passage distance can be reduced, and the ventilation resistance can be reduced.

[0111] Both outer surfaces of the heat conductive substrate, which is a substrate, are used as a mounting area for a circuit unit that generates heat, and the space between the opposing surfaces is clearly divided as a heat radiation region, thereby reducing the size of the device as a three-dimensional device configuration. Can be done.

Regarding the mounting structure of the cooling fan,
By inserting guide pieces on both sides of the guide tool attached to both sides of the cooling fan on both sides of the arm plate of the fixture, reliable insertion is possible, and at the final stage of insertion, the end of the engagement tool is The engagement protrusion at the tip of the arm plate is elastically fitted into the engagement notch, so that the engagement protrusion can be retained in a retaining state.

In order to take out the cooling fan held by the fixture, the engagement is easily released by moving the ends of the arm plates in a direction approaching each other against their elasticity, so that the engagement is released. The cooling fan can be pulled out. In this way, the holding and unloading operations can be performed only by hand operation without requiring any special tools or tools.

As described above, according to the present invention, the practical effect is extremely remarkable.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a communication device according to the present invention.

FIG. 2 is a perspective view showing the principle configuration of the amplifying device of the present invention.

FIG. 3 is an exploded perspective view of a detailed configuration of the amplifying device of the present invention.

FIG. 4 is an assembled perspective view of FIG. 3;

FIG. 5 is a right side view in a state where a side plate of FIG. 4 is removed.

FIG. 6 is a top view of FIG. 4;

FIG. 7 is a bottom view of FIG.

FIG. 8 is an external view of a heat dissipation board of the present invention.

FIG. 9 is a front view of the separated state of FIG. 8;

FIG. 10 is an external view of a cooling fan.

FIG. 11 is a diagram showing a positional relationship between a radiator and a cooling fan.

FIG. 12 shows a state in which a guide tool and an engagement tool are attached to both sides of a cooling fan.

FIG. 13 is a perspective view of a cooling fan, a guide tool, and a mounting tool in a separated state.

FIG. 14 is an external view of a fitting.

FIG. 15 is a front view (part 1) illustrating a procedure for mounting a cooling fan in the heat dissipation board.

FIG. 16 is a front view (part 2) illustrating a procedure for attaching a cooling fan in the heat dissipation board.

FIG. 17 is a front view (part 3) illustrating a procedure for attaching a cooling fan in the heat dissipation board.

FIG. 18 is a schematic configuration diagram of a conventional communication device.

FIG. 19 is an exploded perspective view (part 1) of a main part of a conventional communication device.

FIG. 20 is an exploded perspective view (part 2) of a conventional communication device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing frame 2 Amplification apparatus board 3 Amplification apparatus 4 Cooling air intake part 5 Cooling fan 6 Air guide plate 7 Radiation fin 8 Substrate 9 First amplifier 11 Second amplifier 12 Control circuit printed board 13 Power supply unit Reference Signs List 14 printed circuit board for power supply 15, 16 guide plate 17 front plate 18 back plate 19 connector 21 side plate 31 device rack 32 amplifying device panel 33 amplifying device 34 unit 35 heat conductive substrate 36 heat exchanger 37 side plate 41 , 42 heat conductive substrate, substrate 43, 44 planar heat transfer medium 45 radiator 46 radiator substrate 47 planar heat transfer medium 48 radiating fins 49, 51 end face 55 first amplifying unit 56 second amplifying unit 57 filter Unit 58 Power supply unit 59 Printed circuit board of power supply circuit 61 Front plate 62 Handle 63 Mounting screw 6 Power switch 65 Indicator light 66 Air intake 67 Right side plate 68 Left side plate 71 Cooling fan 75 Coaxial connector 76 Back plate 77 Coaxial connector 78 Coaxial cable 79 Connector 81, 82 Coaxial connector 83 Coupler 84, 85, 86 Coaxial connector 91 Frame Body 92 Propeller 93 Through hole 94 Guide tool 95 Engagement tool 96 Screw 97 Main surface 98 Mounting surface 99 Screw insertion hole 101 Screw hole 102 Guide piece 103 Hole 104 Main surface 105 Mounting surface 106 Screw insertion hole 107 Screw hole 108 Bending surface, Surface 109 Notch for engagement 111 Mounting tool 112 Support surface 113 Arm plate 114 Engagement protrusion 115 Tip end 116 Mounting hole 117 hole

Continuation of the front page (72) Inventor Yuji Hasegawa 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term in Fujitsu Limited (reference) 5E322 AA01 AA11 BA01 BA03 BA05 BB03 BC02 DB01 EA05 FA04

Claims (3)

[Claims] 1. A radiator is integrally mounted on one surface of a heat conductive substrate on which a unit requiring cooling is mounted via a flat heat transfer medium, and the other surface of the heat conductive substrate is attached to the heat conductive substrate. A cooling structure for a communication device, wherein heat is radiated by a cooling fan blown in a direction parallel to a surface of a flexible substrate. 2. A heat radiator is integrally attached to a pair of heat conductive substrates on opposite sides of a pair of heat conductive substrates through a flat heat transfer medium. The device is radiated by a cooling fan blown in a direction parallel to a surface of the heat conductive substrate. 3. A cooling fan having a rectangular shape as viewed from the front, a guide tool and an engaging tool attached to both sides of the cooling fan. It is extended so as to be in contact with both side surfaces, and the guide pieces protruding on both sides of the guide tool of the cooling fan are fitted and inserted between the arm plates of the mounting tool, and the engagement protrusions at the tip of the arm plate are inserted. A mounting structure for a cooling fan, wherein the cooling fan is elastically projectingly engaged in an engagement notch at an end of an engagement member of the cooling fan.