JP2001011218A - Production of composite part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composite part improved in adhesion of the constituent plastic to the constituent plastic by hot-stamping a metal foil at least either surface of which has microporous structures formed by surface treatment on the surface of a thermoplastic resin molding. SOLUTION: At least either surface of a metal foil having a thickness of at most 0.1 mm is surface-treated by an electroless copper plating process to obtain a metal foil on which microporous structures having a diameter of a single pore of 0.01-10 μm are uniformly and densely formed. This foil is hot- stamped on the surface of a thermoplastic resin molding. It is desirable that the temperature of the mold during hot stamping is equal to or higher than the melting point of softening point of the thermoplastic resin used in order to ensure sufficient interfacial adhesion between the resin and the foil. An example of the process for forming a desired circuit pattern on the surface of the molding consists of hot-stamping a metal foil previously trimmed into a specified circuit pattern on the surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a composite part which is easy to produce at low cost. More specifically, the present invention relates to a method for producing a composite component by hot stamping a metal foil having a specific treatment applied to the surface of a thermoplastic resin molded product.

[0002]

2. Description of the Related Art As a method of manufacturing a circuit component using a thermoplastic resin having excellent moldability and excellent electrical and mechanical properties, a method of partially plating the surface of a plastic molded product has conventionally been used. It has been generally performed (for example, JP-A-63-128181). According to this example, a plating-compatible material is first formed into a predetermined pattern of ridges, and after this is etched and catalyzed, it is inserted into a cavity, and molten plastic is injected to thereby form a predetermined pattern of the ridges. By performing secondary molding in which the pattern is exposed, and plating the secondary molded product, a plastic composite part that has been partially plated (circuit-formed) can be manufactured.

However, in this method, first, a two-stage molding step is required to obtain a plastic molded product, and a complicated processing step is required to apply electroless plating to plastic. There are problems in terms of performance and manufacturing cost. Furthermore, since special waste liquid treatment equipment is required to treat harmful chemical substances generated in the plating process, there is also a great limitation on the parts manufacturing location.

[0004] Under the severe economic environment in recent years, there is a need for a circuit component and a method of manufacturing the component that are inexpensive and stable in quality.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a means for manufacturing circuit components at low cost without a treatment such as a plating step. That is, the present invention is a method for forming an electric circuit on the surface of a plastic molded product by hot stamping a metal foil on the plastic molded product, and further provides a manufacturing technique capable of obtaining good plastic / metal foil adhesion. Aim.

[0006]

Means for Solving the Problems In order to achieve the above object, the present inventors have made intensive studies on a circuit forming technique having good adhesion to a thermoplastic resin molded product without chemical treatment such as plating, and as a result, the present invention has been described. This has led to the invention.

That is, the present invention is characterized in that a metal foil having a microporous structure formed on one surface or both surfaces in advance by surface treatment is hot stamped on the surface of a thermoplastic resin molded product. And a method for producing a composite part having a metal film formed on the surface of a molded article.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a specific configuration of the present invention will be described in detail.

First, the thermoplastic resin molded product used in the present invention will be described. The thermoplastic resin molded product used in the present invention includes polyethylene resin, polypropylene resin, acrylonitrile-butadiene-styrene (ABS) resin, polyacetal resin, polyamide (nylon) resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene terephthalate resin, Polyphenylene ether resin, polyphenylene sulfide resin,
Injection molding method, injection compression molding method, gas assist injection molding method, heat compression molding method, extrusion molding method, blow molding using known thermoplastic resins such as polyimide resin, liquid crystalline polyester resin, syndiotactic polystyrene resin, etc. It is molded by a known processing method such as a molding method.

[0010] The metal foil used in the present invention is not particularly limited in terms of structure, material, shape, thickness and a method for producing the same, but copper and copper alloys having excellent electrical conductivity are particularly preferred. A foil having a thickness of 0.1 mm or less is particularly preferably used from the viewpoint of workability and the like. Further, it is preferable that the material can be easily cut by shearing during hot stamping.

The metal foil used in the present invention needs to have a microporous structure formed on one surface or both surfaces in advance by surface treatment. When such a structure is formed only on one surface, a layer for facilitating secondary processing such as a solder layer, a flux layer, an adhesive layer, and a protective layer may be formed on the other surface. Such a layer may be a single layer or two or more layers.

Next, a surface treatment method for forming a microporous tissue structure on the surface of a metal foil, which is a feature of the present invention, will be described. The microporous metal microstructure defined in the present invention,
A microporous structure having a single pore diameter in the range of 0.01 to 10 μm is formed uniformly and densely on the metal surface. A specific example of a method for forming such a texture structure is, for example, an electroless copper plating method disclosed in Japanese Patent Application Laid-Open No. Hei 10-237664. This method is mainly devised for the purpose of improving the adhesion between a copper foil and a thermosetting resin (prepreg) in a copper-clad laminate or the like. FIG. 1 shows an example of the observation result of the metal surface treated by this method using an electron microscope.

Further, the metal foil used in the present invention may be subjected to a known metal plating treatment such as nickel, tin, gold or the like in order to protect the metal surface from oxidation or corrosion.

Next, with regard to the hot stamping step performed in the present invention, except that a metal foil formed on at least one surface to be adhered to a resin molded product is used as the microporous structure. The apparatus and method are not special, and can be carried out according to a conventional method using a commercially available hot stamping apparatus. There is no particular limitation on the mold temperature at the time of stamping.However, in order to ensure sufficient adhesion at the interface between the thermoplastic resin molded product and the metal foil, the temperature should be higher than the melting point or softening point of the thermoplastic resin used. Is preferred. Further, in order to form a desired circuit pattern on the surface of a thermoplastic resin molded product, a method using a metal foil trimmed in advance into a predetermined circuit pattern, or a punch die provided with a cutting blade in a predetermined circuit pattern shape is used. There is a method of forming a circuit pattern at the same time as hot stamping using, and a method of forming a circuit pattern by cutting a metal foil by shearing force when pressed,
In the present invention, any method may be used.

[0015]

EXAMPLES Examples of the present invention will be described below.
The present invention is not limited to these examples unless departing from the gist of the present invention.

In the examples, the method used to measure the adhesion between the thermoplastic resin molded article and the metal foil is as follows. [Adhesion measurement test] Two cuts at 10 mm intervals were made in the long side direction of the test piece with a cutter knife, and one end of the metal foil was peeled off. Then, the bonding surface was measured with a small tensile tester (100 kg load cell). , The metal foil was pulled in a 90 ° direction (crosshead speed 50 mm / min), and the adhesion of the metal foil was measured.
In addition, the measurement result was displayed in the unit of (kg / 10 mm width).

Example 1 Using a polybutylene terephthalate resin containing 30% by weight of glass fiber, using an injection molding machine, 15 × 130 × 2 mmt
Was made. Next, using an electroless copper foil having a thickness of 0.03 mm, a normal pretreatment for electroless copper plating was performed, and the resultant was immersed in a plating solution having the following composition at a temperature of 70 ° C. for 10 minutes.
When the surface state of the metal foil after immersion was observed with an electron microscope, microporous crystals were obtained as shown in FIG. (Composition of electroless copper plating solution) Copper sulfate 8.0 g / L Sodium citrate 11.0 g / L Sodium hypophosphite 23.8 g / L Boric acid 31.0 g / L Nickel sulfate 0.6 g / L Surfynol 104 1.0 g / L Next Then, using a commercially available hot stamping device, the above-mentioned metal foil was subjected to hot stamping treatment on one surface of the above-mentioned resin molded product under the following conditions to obtain an evaluation sample, and the above-mentioned adhesion evaluation was performed. Table 1 shows the results.・ Temperature: 230 ° C ・ Pressure: 3 kg / cm ²・ Pressure time: 1.5 seconds

Example 2 An evaluation sample was obtained in the same manner as in Example 1 except that a polyphenylene sulfide resin containing 40% by weight of glass fiber was used as a thermoplastic resin, and the hot stamping temperature was 285 ° C. The above adhesion evaluation was performed. Table 1 shows the results.

COMPARATIVE EXAMPLES 1-2 Using an electrolytic copper foil having a thickness of 0.03 mm, after performing a degreasing treatment, the anti-glossy surface (an uneven surface formed by crystal growth of copper) is bonded to a resin molded product. After the evaluation sample was obtained in the same manner as in Examples 1 and 2, except that it was used at the time of hot stamping, the above adhesion evaluation was performed. Table 1 shows the results.

[0020]

[Table 1]

[0021]

As is clear from the above description and the examples, a metal foil having a microporous structure formed in advance by a surface treatment is used, and the metal foil is hot stamped on a thermoplastic resin molded article. By doing so, a metal-resin composite component having good adhesion can be obtained. For this reason, the composite part having a function as an electric circuit substantially produced by the manufacturing method of the present invention can be efficiently manufactured in a short time with inexpensive equipment, and furthermore, since good adhesion can be obtained, various components can be obtained. It can be suitably used for electric circuit components.

[Brief description of the drawings]

FIG. 1 is an electron micrograph showing an example of microporous crystals formed on a metal surface treated by an electroless copper plating method.

FIG. 2 is an electron micrograph showing microporous crystals formed on a metal surface treated by the electroless copper plating method of Example 1.

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Claims (5)

[Claims] 1. A surface of a molded article characterized by hot stamping a metal foil having a microporous structure formed on one or both surfaces by surface treatment in advance on the surface of the thermoplastic resin molded article. A method for producing a composite part having a metal film formed on the composite part. 2. A microporous tissue structure having a diameter of substantially 0.01
2. The method for producing a composite part according to claim 1, wherein said composite part comprises fine pores of about 10 .mu.m. 3. The method for manufacturing a composite part according to claim 1, wherein the metal coating has a function substantially as an electric circuit. 4. The method for manufacturing a composite part according to claim 1, wherein the metal coating substantially has a function as an electromagnetic wave shield. 5. A circuit component manufactured by the method according to claim 1.