JP3420716B2 - Manufacturing method of electric circuit parts - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for manufacturing an electric circuit component.

[0002]

2. Description of the Related Art As a first example of a conventional method for producing a circuit component by using a thermoplastic resin having excellent molding processability and excellent electric / mechanical properties, the surface of a plastic molded product is partially There is also a method of plating (for example, JP-A-63-128181). According to this example, a plating-compatible material is used to perform a primary molding into a predetermined pattern of a ridge, which is etched and catalyzed, and then placed in a cavity, and liquid plastic is injected to obtain the above-mentioned predetermined. By carrying out the secondary molding in which the pattern is exposed and plating the secondary molded product, a partially plated (circuit-formed) plastic composite part can be manufactured. Next, as a second conventional example, there is a method using hot stamping which is currently mainly performed in the European region. In this method, an electrolytic copper foil that has undergone a special etching treatment such as blackening treatment is used, and the etching surface is hot stamped on a plastic molded body and at the same time trimmed to the desired shape by the shearing force of the stamping die. Circuit-formed plastic composite parts can be manufactured.

[0003]

By the way, as is well known, under the recent severe economic environment, there is a demand for low cost and stable quality parts and a method for manufacturing parts. In the first conventional example, first, a two-step molding process is required to obtain a plastic molded product, and a complicated pretreatment process is required to apply electroless plating to plastic. Also, there was a problem in terms of manufacturing cost. Further, since a special waste liquid treatment facility is required to treat harmful chemical substances generated in the plating process, there is a large restriction on the part manufacturing place. On the other hand, the second conventional example has a simpler part manufacturing process and is superior in mass productivity and manufacturing cost as compared with the first example, but has good adhesion at the plastic molded product / metal foil interface. In order to obtain the above, it is necessary to set the mold temperature at the time of stamping processing to around the melting point (melting temperature) of the plastic material or higher. Therefore, there is a problem that this method cannot be applied to relatively thin molded parts due to problems such as thermal deformation. The purpose of the present invention is to
It is to solve the problem in the method of the second example, and for this reason, the melting point (melting temperature) of the plastic material is
It is an object of the present invention to provide a manufacturing technique capable of obtaining good plastic / metal foil adhesion even under the following relatively low processing temperature conditions and having high production efficiency.

[0004]

In order to achieve the above object, the present invention has been accomplished as a result of intensive studies on a technique for lowering the temperature of hot stamping of a metal foil on a thermoplastic resin molded product. That is, the present invention is a method for manufacturing an electric circuit part by hot stamping a metal foil on a thermoplastic resin molded product, wherein the metal foil is preliminarily subjected to the following general formula before the hot stamping step. The method for producing an electric circuit component is characterized in that the surface treatment is performed with the triazine thiol compound represented by and the hot stamping temperature is not higher than the melting point or softening point of the thermoplastic resin.

[0005]

[Chemical 2]

(However, R is -OR ', -SR', -NH
R ', -N (R') ₂ ; R'is H, an alkyl group, an alkenyl group, a phenyl group, a phenylalkyl group, an alkylphenyl group or a cycloalkyl group, and M is H, Na, L.
i, K, 1/2 Ca, 1/2 Ba, aliphatic primary, secondary and tertiary amines, and quaternary ammonium salts. )

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The specific constitution of the present invention will be described in detail below. First, the thermoplastic resin molded product used in the present invention will be described. The thermoplastic resin molded product used in the present invention includes polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene (AB
S) resin, polyacetal resin, polyamide (nylon) resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene ether resin, polyphenylene sulfide resin, polyimide resin, liquid crystalline polyester resin, syndiotactic polystyrene resin, etc. The thermoplastic resin is molded by a known processing method such as an injection molding method, an injection compression molding method, a gas assist injection molding method, a heat compression molding method, an extrusion molding method and a blow molding method.

The metal foil used in the present invention is made of
There is no particular limitation on the shape, the thickness and the manufacturing method thereof, but regarding the material, copper and copper alloy having excellent electric conductivity are particularly preferably used, and regarding the thickness, it is 0.
A foil of 1 mm or less is particularly preferably used. The metal foil used in the present invention may be subjected to a known metal plating treatment with nickel, tin, gold or the like in order to protect the metal surface from oxidation and corrosion.

Next, the surface treatment of the metal foil with the triazine thiol compound, which is a feature of the present invention, will be described.
The triazine thiol compound used in the present invention is represented by the following general formula.

[0010]

[Chemical 3]

(However, R is -OR ', -SR', -NH
R ', -N (R') ₂ ; R'is H, an alkyl group, an alkenyl group, a phenyl group, a phenylalkyl group, an alkylphenyl group or a cycloalkyl group, and M is H, Na, L.
i, K, 1/2 Ca, 1/2 Ba, aliphatic primary, secondary and tertiary amines, and quaternary ammonium salts. ) A part of the triazine thiol compound is generally commercially available (Disnet (registered trademark) / Sankyo Kasei Co., Ltd.). Further, the surface treatment of the metal foil using the triazine thiol compound is intended to form a thin film of the triazine thiol compound on the surface of the metal foil, there is no particular limitation on the method, generally known method As a method of dissolving a triazine thiol compound in water or a specific organic solvent and simply immersing the metal foil in this solution, or a method of electrochemically adsorbing the metal foil as an anode and a platinum plate or the like as a cathode and so on.

Next, regarding the hot stamping step performed in the present invention, except that the metal foil surface-treated with the above-mentioned triazine thiol compound is used, it is not special in the apparatus and the method, and is commercially available hot stamping. It can be performed according to a conventional method using an apparatus. There is no particular restriction on the mold temperature during stamping, but the glass transition temperature of the thermoplastic resin used to ensure sufficient adhesion at the interface between the thermoplastic resin molded product and the metal foil and to prevent thermal deformation of the molded product. It is preferably in the range of not lower than the melting point (melting temperature). Further, in order to form a desired circuit pattern on the surface of a thermoplastic resin molded product, a method of using a metal foil trimmed to a predetermined circuit pattern in advance and a punch die provided with a cutting blade in a predetermined circuit pattern are used. There is a method of forming a circuit pattern at the same time as hot stamping using, but in the present invention, any method may be used.

[0013]

EXAMPLES Examples of the present invention will be described below.
The present invention is not limited to these examples without departing from the spirit of the present invention. In the examples, the method used to measure the adhesion between the thermoplastic resin molded product and the metal foil is as follows. [Adhesion measurement test] Put two cut scratches with a cutter knife in the long side direction of the test piece at intervals of 10 mm, peel off part of the edge of the metal foil, and then bond with a small tensile tester (load cell 100 kg). The metal foil was pulled in a 90 ° direction (crosshead speed 50 mm / min), and the adhesion of the metal foil was measured.
The measurement results are shown in units of (kg / 10 mm width).

Example 1 A polybutylene terephthalate resin containing 30% by weight of glass fiber was used and an injection molding machine was used to produce 15 × 130 × 2 mm.
A strip-shaped molded product of t was created. Next, using electrolytic copper foil with a thickness of 0.03 mm, after degreasing, commercially available 1, 3, 5
-Triazine-2,4,6-trithiol monosodium (trade name: DISNET TTN (registered trademark) / Sankyo Kasei Co., Ltd.) was used for immersion treatment under the following conditions, followed by washing with distilled water and then with methanol. It was dried with hot air at 60 ° C to prepare a metal foil for hot stamping. -Solvent: Distilled water-Concentration: 1 x 10 ^-3 mol / liter-Treatment temperature: 30 ° C-Treatment time: 20 seconds Next, use a commercially available hot stamping device to transform the above metal foil into the above resin molded product. The one side was subjected to hot stamping treatment under the following conditions to obtain an evaluation sample, and then the above-mentioned adhesion evaluation and appearance evaluation (whether or not there was deformation) were performed. The results are shown in Table 1. -Temperature: 200 ° C-Pressure: 3 kg / cm ² -Pressing time: 1.5 seconds Example 2 Polyphenylene sulfide resin containing 40% by weight of glass fiber was used as the thermoplastic resin, and hot stamping temperature was 225 ° C. Others were the same as in Example 1 to obtain an evaluation sample, and the above-mentioned adhesion evaluation and appearance evaluation were performed. The results are shown in Table 1. Example 3 An evaluation sample was obtained in the same manner as in Example 1 except that a liquid crystalline polyester resin containing 30% by weight of glass fiber was used as the thermoplastic resin, and the hot stamping temperature was 225 ° C. The property evaluation and the appearance evaluation were performed. The results are shown in Table 1. Example 4 An evaluation sample was obtained in the same manner as in Example 1 except that a polycarbonate resin containing 30% by weight of glass fiber was used as the thermoplastic resin, and the hot stamping temperature was 175 ° C. In addition, the appearance was evaluated.
The results are shown in Table 1. The samples obtained in Examples 1 to 4 were not deformed, had no defects such as cracks or partial peeling in the metal foil, and were sufficiently usable as circuit components.

Comparative Example 1 An evaluation sample was obtained in the same manner as in Example 1 except that the hot stamping temperature was 230 ° C., and the above-mentioned adhesion evaluation and appearance evaluation were carried out. The results are shown in Table 1. Comparative Example 2 Example 4 except that the hot stamping temperature was 225 ° C.
An evaluation sample was obtained in the same manner as above, and the adhesion evaluation and the appearance evaluation were performed. The results are shown in Table 1.

The samples obtained in Comparative Examples 1 and 2 were slightly deformed, but defects such as cracks and partial peeling were not found in the metal foil.

Comparative Examples 3 to 8 Evaluation samples were obtained in the same manner as in Examples 1 to 4 except that a metal foil not surface-treated with a triazine thiol compound was used, and the above-mentioned adhesion evaluation and appearance evaluation were performed. It was The results are shown in Table 1.

[0018]

[Table 1]

[0019]

As is apparent from the above description and Examples, a metal foil previously surface-treated with a specific triazine thiol compound is used, and hot stamping of this metal foil onto a thermoplastic resin molded article results in hot Even if the temperature at the time of stamping is in a relatively low temperature range below the melting point of the thermoplastic resin, an electric circuit component having good adhesion can be obtained. Therefore, it can be applied to thin-walled parts which have been difficult to process by conventional hot stamping due to the problem of thermal deformation. Therefore, the electricity produced by the manufacturing method of the present invention is
The circuit component can be preferably used for various electric circuit components.

─────────────────────────────────────────────────── --Continued from the front page (56) References JP 62-150896 (JP, A) JP 10-215053 (JP, A) JP 6-316640 (JP, A) JP 54- 48879 (JP, A) JP 61-105895 (JP, A) JP 4-196193 (JP, A) JP 61-291699 (JP, A) JP 4-501138 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) B41M 5/00 101 B32B 15/08 B32B 17/04 C08J 5/12 CFD

Claims (2)

(57) [Claims] 1. A method for producing an electric circuit component by hot stamping a metal foil on a thermoplastic resin molded article, wherein the metal foil is preliminarily treated with a triazine thiol compound represented by the following general formula before the hot stamping step. in surface treatment, and an electric times, characterized in that the hot stamping temperature than the melting or softening point of the thermoplastic resin
Road parts manufacturing method. [Chemical 1] (However, R is -OR ', -SR', -NHR ', -N
(R ') ₂ ; R'is H, an alkyl group, an alkenyl group, a phenyl group, a phenylalkyl group, an alkylphenyl group or a cycloalkyl group, and M is H, Na, Li, K, 1/2
Ca, 1/2 Ba, aliphatic primary, secondary and tertiary amines,
It is a quaternary ammonium salt. ) 2. Electricity obtained by the method according to claim 1.
Circuit parts.