JP2001011180A - Resin composition for electrical insulation material and electrical insulation material using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition having extremely low dielectric constant, excellent electrical insulation properties and also excellent heat resistance, and useful for electrical/electronic equipments or semiconductor devices, by including, as the essential components, a component having a polymerizable functional group and a specific heat-resistant resin or a precursor thereof. SOLUTION: This composition is obtained by including, as the essential components, (A) a component having a polymerizable functional group (e.g. polyethylene glycol dimethacrylate), and (B) a heat-resistant resin having the glass transition temperature higher than the pyrolysis temperature of the polymer of the component A or a precursor thereof (pref. a polyimide resin, a polyimide precursor, or the like) in the weight ratio A/B of pref. (5:95) to (90:10), more pref. (10:90) to (70:30).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating material, and more particularly to a resin composition for an insulating material having excellent characteristics for use in electric / electronic devices and semiconductor devices, and an insulating material using the same. It is.

[0002]

2. Description of the Related Art Among the characteristics required for materials for electric / electronic devices and semiconductor devices, electric characteristics and heat resistance are the most important characteristics. In particular, in recent years, with miniaturization of circuits and speeding up of signals, an insulating material having a low dielectric constant has been required.
An insulating material using a heat-resistant resin is expected as a material for achieving both of these two characteristics. For example, conventionally used inorganic insulating materials such as silicon dioxide exhibit high heat resistance, but have a high dielectric constant, and at the present time the required characteristics are becoming more sophisticated. A heat-resistant resin typified by a polyimide resin is excellent in electrical properties and heat resistance and can achieve both of these properties, and is actually used for a coverlay of a printed circuit, a passivation film of a semiconductor device, and the like.

[0003] However, in recent years, semiconductors have become more sophisticated,
Along with the increase in performance, remarkable improvements in electrical characteristics and heat resistance are required, so that a higher performance resin is required. In particular, regarding the permittivity,
Materials having a low dielectric constant of less than 5 are expected, and the required properties of conventional insulating materials have not been achieved. On the other hand, in the past, for example, by adding a thermally decomposable resin other than polyimide to a resin composition comprising polyimide and a solvent, and decomposing this thermally decomposable resin by a heating step to form voids, Attempts have been made to reduce the dielectric constant of the insulating material. However, when the heat-resistant resin such as polyimide and the heat-decomposable resin are compatible with each other, the glass transition point is lowered. Few. On the other hand, when a thermally decomposable resin that is incompatible with a heat-resistant resin such as polyimide is used, there is a problem that the resin composition for an insulating material becomes non-uniform during storage and cannot be used.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a resin composition for an insulating material which exhibits an extremely low dielectric constant and good insulating properties, and also has excellent heat resistance and an insulating material using the same. Aim.

[0005]

Means for Solving the Problems The present inventors have made intensive studies in view of the above-mentioned conventional problems, and as a result, completed the present invention by the following means.

That is, 1. Insulating material comprising a component (A) having a polymerizable functional group and a heat-resistant resin or a precursor (B) having a glass transition temperature of a resin higher than a thermal decomposition temperature of a polymer of the component (A). Resin composition for

[0007] 2. Heat resistant resin or its precursor (B)
Is a resin composition for an insulating material according to the above item 1, which is a polyimide resin or a polyimide precursor,

[0008] 3. 2. The resin composition for an insulating material according to the above 1, wherein the heat-resistant resin or its precursor (B) is a polybenzoxazole resin or a polybenzoxazole precursor.

4. 4. After polymerizing the component (A) having a polymerizable functional group using the resin composition for an insulating material according to any one of the above items 1 to 3, thermal decomposition of the polymer of the component (A) An insulating material manufactured by a method including a step of performing a heat treatment at a temperature higher than a temperature and at a temperature equal to or lower than a glass transition temperature of a resin in which a heat-resistant resin or a precursor thereof is closed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition for insulating material of the present invention comprises:
A component (A) having a polymerizable functional group and a heat-resistant resin having a glass transition temperature of the resin higher than the thermal decomposition temperature of the polymer of the component (A), or the heat-resistant resin by a reaction by heating or a chemical ring closing reaction. Generated heat-resistant resin precursor (B)
And as essential components. It is possible to use a solvent as a component other than the component (A) and the component (B). However, when the component (A) is a liquid that dissolves the component (B), the component (A) also serves as a solvent. Can also.

The resin composition for an insulating material of the present invention can be applied to a substrate or the like to heat and form a film, or impregnated in a glass cloth or the like and heated to form an insulating material.
In this heating step, first, a temperature range of 50 ° C. to 250 ° C., which is a temperature range in which the polymerizable functional groups of the component (A) can be polymerized.
C., more preferably from 70 to 200.degree. C., causing a cross-linking reaction by polymerization of the polymerizable functional group of the component (A), thereby causing a phase separation with the component (B), thereby achieving heat resistance. A high glass transition temperature inherent to a resin obtained by ring-closing a reactive resin or a precursor thereof is developed. Further, by increasing the heating temperature to a temperature higher than the temperature at which the polymer of the component (A) is thermally decomposed and a temperature equal to or lower than the glass transition temperature of the resin of the component (B), the glass transition of the resin of the component (B) is increased. Before reaching the temperature, the component (A) is thermally decomposed and volatilized to form fine voids. Thereby, an insulating material having a low dielectric constant can be obtained.

Examples of the component (A) having a polymerizable functional group used in the present invention include vinyl acetate, methyl methacrylate, divinylbenzene, hydroxymethacrylate, methacrylamide, N, N-dimethylacrylamide, dimethylaminoethyl methacrylate. Glycerol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, vinyl cinnamate, N-vinylpyrrolidone, phenylglycidyl ether, bisphenol F type epoxy, and the like, but are not limited thereto. It is also possible to add a polymerization initiator.

The resin used in the present invention has a glass transition temperature higher than the thermal decomposition temperature of the polymer of the component (A), or a heat-resistant resin precursor which forms a heat-resistant resin by a reaction by heating or a chemical ring closing reaction. Examples of (B) include polyimide, polyamic acid, polyamic ester, polyisoimide, polyamideimide, polyamide,
Examples include, but are not limited to, bismaleimide, polybenzoxazole, polyhydroxyamide, and polybenzothiazole. Among these, a polyimide resin and a polyimide precursor such as polyamic acid, polyamic acid ester, and polyisoimide, and a polybenzoxazole resin and a polybenzoxazole precursor such as polyhydroxyamide are preferable because of high heat resistance.

When a solvent is used as a component of the resin composition for an insulating material of the present invention, examples of preferred solvents include:
Examples thereof include, but are not limited to, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, tetrahydrofuran, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether, and γ-butyrolactone. Two or more of these may be used simultaneously. Further, a small amount of a surfactant may be added in order to improve coatability and impregnation.

The minute voids formed to reduce the dielectric constant of the insulating material of the present invention have a diameter of 50 nm or less, preferably an average pore diameter of 10 nm or less. Further, the ratio of the minute voids is preferably 5 to 90 vol%, more preferably 10 to 70 vol%, based on the whole formed material of the insulating material. If it is smaller than the lower limit, there is no effect of reducing the dielectric constant, and if it is larger than the upper limit, the mechanical strength of the insulating material is reduced.

In the resin composition for an insulating material of the present invention, each component is blended within a range that forms the above-mentioned void. The weight ratio A / B of component (A) to component (B) is preferably from 5/95 to 90/10, more preferably from 10/90 to 70/30.
It is. These are obtained by mixing them uniformly.

Examples of the method for producing an insulating material of the present invention include:
The resin composition for an insulating material of the present invention is dissolved in the above-mentioned solvent to form a varnish, and then applied to an appropriate support, for example, a glass, metal, silicone wafer, or ceramic substrate. Specific coating methods include spin coating using a spinner, spray coating using a spray coater, dipping,
Printing, roll coating and the like. In this way, a coating film is formed, and after heating and drying, by the method described above,
By heating and forming minute voids and curing,
An insulating material having a low dielectric constant can be formed. The heat curing is preferably performed by a heating device capable of exhausting the volatilized components.

[0018]

EXAMPLES The present invention will be described in detail with reference to the following Examples, but it should not be construed that the invention is limited thereto.

Example 1 (1) Synthesis of Polyimide Resin In a separable flask equipped with a stirrer, a nitrogen inlet tube, and a material inlet, 2,2′-bis (4- (4,4′-aminophenoxy) was used. ) Phenyl) hexafluoropropane 5.1
8 g (0.01 mol) and 9.60 g of 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl
(0.03 mol) is dissolved in 200 g of dried N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP). The solution was cooled to 10 ° C under dry nitrogen, and biphenyltetracarboxylic dianhydride 2.94 (0.01 mol) and hexafluoroisopropylidene-2,2-bis (phthalic anhydride) 13.32 g (0. 03 mol). Five hours after the introduction, the temperature was returned to room temperature, and the mixture was stirred at room temperature for 2 hours to obtain a solution of polyamic acid as a polyimide precursor. After 50 g of pyridine was added to this polyamic acid solution, 0.05 mol of acetic anhydride was added dropwise, and an imidization reaction was carried out for 7 hours while maintaining the temperature of the system at 70 ° C. This solution was dropped into 20 times the volume of water to collect a precipitate, which was then vacuum-dried at 60 ° C. for 72 hours to obtain a solid polyimide resin as a heat-resistant resin. The molecular weight of the polyimide resin is number average molecular weight 26,
000, weight average molecular weight 54,000.

(2) Measurement of Glass Transition Temperature of Heat Resistant Resin 5.0 g of the polyimide resin synthesized above was added to NMP1
After dissolving in 5.0 g and applying on a release-treated glass substrate, the film was held in an oven at 120 ° C. for 30 minutes, and then held at 230 ° C. for 90 minutes to form a film. It was heated at 400 ° C. for 90 minutes to obtain a polyimide resin film. The glass transition temperature of the polyimide resin measured by a differential scanning calorimeter was 335 ° C.

(3) Measurement of thermal decomposition temperature of a product obtained by polymerizing a component having a polymerizable functional group To 10 g of polyethylene glycol dimethacrylate having an average molecular weight of 600, 0.02 g of azobisisobutyronitrile was added, and a nitrogen atmosphere was added. Polymerization was carried out at 80 ° C. The pyrolysis temperature of the obtained polymer in a nitrogen atmosphere was measured by thermogravimetric analysis and found to be 310 ° C.

(4) Preparation of Resin Composition for Insulating Material and Production of Insulating Material 10.0 g of the polyimide resin synthesized as described above was NMP
After dissolving in 50.0 g, 5.0 g of polyethylene glycol dimethacrylate having an average molecular weight of 600 was added and stirred to obtain a resin composition for an insulating material. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. In the case of heat curing, the temperature is kept at 120 ° C. for 30 minutes, then at 230 ° C. for 120 minutes,
Hold for 0 minutes, raise the temperature to 335 ° C,
After the temperature was lowered to 00 ° C., the temperature was returned to room temperature in 60 minutes. Thus, a 0.8 μm-thick insulating film was obtained. An aluminum electrode having an area of 0.1 cm ² was formed on the insulating film by vapor deposition, and the capacitance between the electrode and tantalum on the substrate was measured by an LCR meter.
The dielectric constant of the insulating material calculated from the film thickness, the electrode area, and the capacitance was 2.4. Observation of the cross section of the insulating material film with a TEM revealed that the obtained voids were discontinuous with an average pore diameter of 9 nm.

Example 2 (1) Synthesis of Polyimide Precursor In the synthesis of the polyimide resin of Example 1, the 2,2′-bis (4- (4,4′-
5.18 g (0.01 mol) of aminophenoxy) phenyl) hexafluoropropane and 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl
60 g (0.03 mol) of 4,4′-diaminodiphenyl ether was added to 8.01 g (0.04 mol) of biphenyltetracarboxylic dianhydride 2.94 (0.01 mol).
l) and 13.32 g (0.03 mol) of hexafluoroisopropylidene-2,2-bis (phthalic anhydride) were replaced with 8.72 (0.04 mol) of pyromellitic dianhydride. In the same manner as in 1, a solution of polyamic acid as a polyimide precursor was obtained. This solution was dropped into 20 times the volume of water to collect a precipitate, which was then vacuum-dried at 25 ° C. for 72 hours to obtain a solid of polyamic acid, which is a precursor of polyimide as a heat-resistant resin. The number average molecular weight of the obtained polyamic acid is 27,000, and the weight average molecular weight is 55,0.
00.

(2) Measurement of Glass Transition Temperature of Heat-Resistant Resin 5.0 g of the polyamic acid synthesized as described above was NMP2
After dissolving in 0.0 g and applying on a release-treated glass substrate, the film was held in an oven at 120 ° C. for 30 minutes, then held at 250 ° C. for 90 minutes to form a film, and the film was peeled off from the substrate. Heating was performed at 450 ° C. for 90 minutes to obtain a polyimide resin film as a heat-resistant resin. When the glass transition temperature of this polyimide resin was measured by a differential scanning calorimeter, it was 41
9 ° C.

(3) Measurement of the thermal decomposition temperature of a product obtained by polymerizing a component having a polymerizable functional group To 10 g of polypropylene glycol dimethacrylate having an average molecular weight of 1100, 0.02 g of azobisisobutyronitrile was added, and a nitrogen atmosphere was added. Polymerization was carried out at 80 ° C.
The pyrolysis temperature of the obtained polymer in a nitrogen atmosphere was measured by thermogravimetric analysis and found to be 360 ° C.

(4) Preparation of Resin Composition for Insulating Material and Production of Insulating Material 10.0 g of the polyamic acid synthesized as described above was added to NMP5
After dissolving in 0.0 g, 8.0 g of polypropylene glycol dimethacrylate having an average molecular weight of 1100 was added and stirred to obtain a resin composition for an insulating material. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. At the time of heat curing, after holding at 120 ° C. for 30 minutes, holding at 260 ° C. for 120 minutes,
Hold for 0 minutes, lower the temperature to 200 ° C in 20 minutes,
The temperature was returned to room temperature in another 40 minutes. Thus, a 0.7 μm thick insulating film was obtained. The dielectric constant of this heat-resistant resin was measured in the same manner as in Example 1 and found to be 2.4. The resulting void was a discontinuous phase with an average pore size of 8 nm.

Example 3 (1) Synthesis of polybenzoxazole resin 25 g of 4,4'-hexafluoroisopropylidenediphenyl-1,1'-dicarboxylic acid, 45 m of thionyl chloride
l and 0.5 ml of dry dimethylformamide were placed in a reaction vessel and reacted at 60 ° C. for 2 hours. After completion of the reaction, excess thionyl chloride was distilled off by heating and reduced pressure. The precipitate was recrystallized using hexane to obtain 4,4'-hexafluoroisopropylidenediphenyl-1,1'dicarboxylic acid chloride. In a separable flask equipped with a stirrer, a nitrogen introducing tube, and a dropping funnel, 7.32 g (0.02 mol) of 2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane was added to 100 g of dried dimethylacetamide. Dissolved and 3.96 g of pyridine
(0.05 mol), and then -15 under dry nitrogen introduction.
8.55 g of 4,4'-hexafluoroisopropylidenediphenyl-1,1'-dicarboxylic acid chloride synthesized above was added to 50 g of dimethylacetamide at 50 ° C (0.5 g).
02mol) was added dropwise over 30 minutes.
After completion of the dropwise addition, the mixture was returned to room temperature and stirred at room temperature for 5 hours. Thereafter, the reaction solution was dropped into 1000 ml of water, and the precipitate was collected and vacuum-dried at 40 ° C. for 48 hours to obtain a solid substance of polyhydroxyamide, a polybenzoxazole precursor. This polyhydroxyamide is converted to NMP200
After adding 50 g of pyridine to the solution dissolved in g, 0.03 mol of acetic anhydride was added dropwise, and the oxazolation reaction was carried out for 7 hours while maintaining the temperature of the system at 70 ° C. This solution is
The precipitate was collected by dropping it in 0 times the volume of water, and vacuum-dried at 60 ° C. for 72 hours to obtain a solid substance of a polybenzoxazole resin as a heat-resistant resin. The number average molecular weight of the obtained polybenzoxazole resin was 20,000, and the weight average molecular weight was 40,000.

(2) Measurement of glass transition temperature of heat-resistant resin Polybenzoxazole resin 5.0 synthesized as described above
g was dissolved in a mixed solvent of 8.0 g of NMP and 12.0 g of tetrahydrofuran, applied on a glass substrate subjected to mold release treatment, kept in an oven at 120 ° C. for 30 minutes, and then heated at 240 ° C. for 9 minutes.
Hold for 0 minutes to form a film, and after removing the film from the substrate,
Heating was performed at 00 ° C. for 90 minutes to obtain a film of a polybenzoxazole resin as a heat-resistant resin. The glass transition temperature of this polybenzoxazole resin measured by a differential scanning calorimeter was 362 ° C.

(3) Measurement of thermal decomposition temperature of a product obtained by polymerizing a component having a polymerizable functional group: 0.010 g of ethylene glycol dimethacrylate was added to 10 g of ethylene glycol dimethacrylate.
5 g of azobisisobutyronitrile was added, and polymerization was carried out at 80 ° C. under a nitrogen atmosphere. When the pyrolysis temperature of the obtained polymer under a nitrogen atmosphere was measured by thermogravimetric analysis,
344 ° C.

(4) Preparation of Resin Composition for Insulating Material and Production of Insulating Material Polybenzoxazole resin 5.0 synthesized as described above.
g was dissolved in a mixed solvent of 8.0 g of NMP and 12.0 g of tetrahydrofuran, and then 4.0 g of ethylene glycol dimethacrylate was added and stirred to obtain a resin composition for an insulating material. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. At the time of heat curing, after holding at 120 ° C. for 30 minutes, holding at 260 ° C. for 120 minutes, holding at 350 ° C. for 90 minutes, and holding at 20 minutes for 15 minutes
After lowering the temperature to 0 ° C., the temperature was returned to room temperature in 40 minutes. Thus, a 0.7 μm thick insulating film was obtained. Thereafter, the dielectric constant of this heat-resistant resin was measured in the same manner as in Example 1, and it was 2.1. The obtained void was a discontinuous phase with an average pore diameter of 6 nm.

Example 4 (1) Synthesis of polyhydroxyamide 2,2'-bis (trifluoromethyl) biphenyl-
4,4'-dicarboxylic acid 22g, thionyl chloride 45ml
And 0.5 ml of dry dimethylformamide was put into a reaction vessel and reacted at 60 ° C. for 2 hours. After completion of the reaction, excess thionyl chloride was distilled off by heating and reduced pressure. The precipitate was recrystallized using hexane to obtain 2,2′-bis (trifluoromethyl) biphenyl-4,4′-dicarboxylic acid chloride. In a separable flask equipped with a stirrer, a nitrogen introducing tube, and a dropping funnel, 7.32 g (0.02 mol) of 2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane was added to 100 g of dried dimethylacetamide. After dissolving, 3.96 g of pyridine (0.
After the addition of 2,2 synthesized above to 50 g of dimethylacetamide at -15 ° C under dry nitrogen introduction.
2'-bis (trifluoromethyl) biphenyl-4,
4'-dicarboxylic acid chloride 8.30 (0.02mo
A solution of l) was added dropwise over 30 minutes. After completion of the dropwise addition, the mixture was returned to room temperature and stirred at room temperature for 5 hours. Thereafter, the reaction solution was dropped into 1000 ml of water, and the precipitate was collected.
By vacuum drying at 48 ° C. for 48 hours, a solid substance of polyhydroxyamide, which is a precursor of polybenzoxazole, which is a heat-resistant resin, was obtained. The obtained polyhydroxyamide has a number average molecular weight of 20,000 and a weight average molecular weight of 4
It was 0000.

(2) Measurement of Glass Transition Temperature of Heat Resistant Resin 5.0 g of polyhydroxyamide synthesized as described above was
After dissolving in 20.0 g of MP and applying it on a glass substrate subjected to mold release treatment, it was kept in an oven at 120 ° C. for 30 minutes, and then 24
The film was formed by holding the film at 0 ° C. for 90 minutes, and after peeling the film from the substrate, the film was further heated at 400 ° C. for 90 minutes to obtain a polybenzoxazole film as a heat-resistant resin. The glass transition temperature of this polybenzoxazole was measured by a differential scanning calorimeter, and was 410 ° C.

(3) Measurement of thermal decomposition temperature of a product obtained by polymerizing a component having a polymerizable functional group To 10 g of glycerol dimethacrylate, 0.01 g of azobisisobutyronitrile was added.
Polymerization was carried out at ° C. The pyrolysis temperature of the obtained polymer under a nitrogen atmosphere was measured by thermogravimetric analysis.
° C.

(4) Preparation of Resin Composition for Insulating Material and Production of Insulating Material After dissolving 10.0 g of the polyhydroxyamide synthesized as described above in 50.0 g of NMP, 8.0 g of glycerol dimethacrylate was added, followed by stirring. A resin composition for an insulating material was obtained. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. In the case of heat curing, after holding at 120 ° C. for 30 minutes, holding at 260 ° C. for 120 minutes, holding at 400 ° C. for 90 minutes,
After the temperature was lowered to 00 ° C., the temperature was returned to room temperature in 40 minutes. Thus, a 0.7 μm thick insulating film was obtained. Thereafter, the dielectric constant of this heat-resistant resin was measured in the same manner as in Example 1, and it was 2.1. The obtained void was a discontinuous phase with an average pore diameter of 7 nm. .

Comparative Example 1 The preparation of the resin composition for insulating material was carried out in the same manner as in Example 4 except that 8.0 g of glycerol dimethacrylate used in preparing the resin composition for insulating material of Example 4 was not added. And the production of insulating materials. Thereafter, in the same manner as in Example 1, the dielectric constant of the obtained heat-resistant resin was 2.6. No void was observed.

Comparative Example 2 The same procedure as in Example 4 was carried out except that 8 g of polypropylene glycol having a molecular weight of 1000 was added instead of 8.0 g of glycerol dimethacrylate used in the preparation of the resin composition for insulating material of Example 4. In addition, preparation of a resin composition for an insulating material and production of an insulating material were performed. Thereafter, in the same manner as in Example 1, the dielectric constant of the obtained heat-resistant resin was 2.6. No void was observed.

Comparative Example 3 The polybenzoxazole of Example 3 was used instead of polyhydroxyamide, which is a precursor of polybenzoxazole, which is a heat-resistant resin used in the preparation of the resin composition for an insulating material of Example 4. Except for using polybenzoxazole having a glass transition temperature of 362 ° C. obtained by the synthesis of Example 4, adjustment of the resin composition for insulating material and production of insulating material were performed in the same manner as in Example 4. Thereafter, in the same manner as in Example 1, the dielectric constant of the obtained heat-resistant resin was 2.6. No void was observed.

In Examples 1 to 3, the dielectric constant was 2.1.
A very low heat-resistant resin of ~ 2.4 was obtained.

In Comparative Example 1, no void was obtained because the component (A) having a polymerizable functional group was not contained in the component, and the dielectric constant could not be reduced.

In Comparative Example 2, no void was obtained and the dielectric constant could not be reduced because the added polypropylene glycol did not have a polymerizable functional group.

In Comparative Example 3, since the glass transition temperature of the heat-resistant resin was lower than the thermal decomposition temperature of the polymer of the component (A),
No void was obtained, and the dielectric constant could not be reduced.

[0042]

The resin composition for insulating material of the present invention and the insulating material using the same are excellent in electrical properties and heat resistance, and are used in various fields where these properties are required, for example, for semiconductors. It is a synthetic resin useful as an interlayer insulating film, an interlayer insulating film of a multilayer circuit, and the like.

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Claims (4)

[Claims] 1. A component (A) having a polymerizable functional group,
A resin composition for an insulating material comprising, as an essential component, a heat-resistant resin having a glass transition temperature of a resin higher than a thermal decomposition temperature of a polymer of the component (A) or a precursor thereof (B). 2. The resin composition for an insulating material according to claim 1, wherein the heat-resistant resin or its precursor (B) is a polyimide resin or a polyimide precursor. 3. The resin composition for an insulating material according to claim 1, wherein the heat-resistant resin or its precursor (B) is a polybenzoxazole resin or a polybenzoxazole precursor. 4. After the component (A) having a polymerizable functional group is polymerized using the resin composition for an insulating material according to claim 1, the component (A) is polymerized. An insulating material manufactured by a method having a step of performing a heat treatment at a temperature higher than a thermal decomposition temperature of a polymer and at a temperature equal to or lower than a glass transition temperature of a heat-resistant resin or a resin obtained by ring-closing a precursor thereof.