JP2001011145A - Phenolic resin for molding, its production and phenolic resin molded article obtained from the same resin - Google Patents

Phenolic resin for molding, its production and phenolic resin molded article obtained from the same resin

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Publication number
JP2001011145A
JP2001011145A JP11183114A JP18311499A JP2001011145A JP 2001011145 A JP2001011145 A JP 2001011145A JP 11183114 A JP11183114 A JP 11183114A JP 18311499 A JP18311499 A JP 18311499A JP 2001011145 A JP2001011145 A JP 2001011145A
Authority
JP
Japan
Prior art keywords
phenolic resin
molding
resin
weight
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11183114A
Other languages
Japanese (ja)
Inventor
Masao Sunahara
昌夫 砂原
Tsutomu Sakaida
勤 坂井田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP11183114A priority Critical patent/JP2001011145A/en
Publication of JP2001011145A publication Critical patent/JP2001011145A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a phenolic resin for molding, excellent in preservation stability, being a liquid state at 50 deg.C and excellent in molding property, especially in cast molding property, to provide a method for producing the phenolic resin for molding easily, and to obtain a phenolic resin molded article obtained from the above phenolic resin and excellent in transparency and uniformity. SOLUTION: This phenolic resin for molding has <=5 wt.% water content and 70-95 wt.% non-vaporizable content, and is a self curing phenolic resin being liquid state at 50 deg.C. The phenolic resin for molding is produced by reacting a novolak resin, phenols and aldehydes in the presence of a base catalyst and then distilling off the water content used in the reaction and produced during the reaction to <=5 wt.% water content.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、成形用フェノール
樹脂及びその製造方法、さらにはそれから得られるフェ
ノール樹脂成形体に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin for molding, a method for producing the same, and a phenolic resin molded article obtained therefrom.

【0002】[0002]

【従来の技術】フェノール樹脂は、バランスのとれたプ
ラスチックとして成形材料、バインダー、接着剤等に幅
広く使用されており、特に成形材料として多用されてい
る。このフェノール樹脂は一般にレゾール樹脂とノボラ
ック樹脂とに分けられる。
2. Description of the Related Art Phenolic resins are widely used as well-balanced plastics in molding materials, binders, adhesives, etc., and are particularly widely used as molding materials. This phenol resin is generally divided into a resole resin and a novolak resin.

【0003】従来公知のレゾール樹脂は、例えば水酸化
ナトリウム、アンモニア、又は有機アミンの如き塩基性
触媒の存在下でフェノール類(P)とアルデヒド類
(F)を仕込みモル比(以下、F/Pと略す)を1対1
〜2程度で反応させることによって製造される。かくし
て得られるレゾール樹脂は、比較的多量のメチロール基
を有するフェノールの1〜3量体を主成分としており、
反応性が極めて大きい樹脂である。したがって、通常、
固形分60重量%以下の水溶液又はメタノール溶液とし
て冷暗所に保存されているが、その保存期間は精々3〜
4ヶ月程度である。かかるレゾール樹脂を成形、硬化さ
せる場合は、水又はアルコールを除去し、必要により酸
触媒の存在下で加熱して硬化させる。この硬化反応速度
は極めて大きく、ゲル化は例えば150℃で数10秒間
以内で起こるために成形条件の制御が非常に困難である
という問題があった。
Conventionally known resol resins are prepared by charging a phenol (P) and an aldehyde (F) in the presence of a basic catalyst such as sodium hydroxide, ammonia or an organic amine, and charging them in a molar ratio (hereinafter referred to as F / P). Abbreviated as 1)
It is manufactured by reacting at about 2 or less. The resole resin thus obtained has, as a main component, a trimer of phenol having a relatively large amount of methylol group,
It is a resin with extremely high reactivity. Therefore, usually
It is stored in a cool and dark place as an aqueous solution or a methanol solution having a solid content of 60% by weight or less.
It is about four months. When molding and curing such a resol resin, water or alcohol is removed, and if necessary, the resin is cured by heating in the presence of an acid catalyst. This curing reaction rate is extremely high, and there is a problem that control of molding conditions is extremely difficult because gelation occurs within several tens of seconds at 150 ° C., for example.

【0004】一方、ノボラック樹脂は、通常、フェノー
ル類(P)とホルムアルデヒド類(F)のモル比がF/
P=0.7〜0.9となるようなフェノール過剰の条件
下で、シュウ酸の如き酸触媒の存在下でフェノールとホ
ルマリンとを反応させることによって製造される。この
ような方法で得られるノボラック樹脂は、フェノールが
主としてメチレン基によって結合した3〜5量体を主成
分としており、遊離メチロール基をほとんど含有せず、
したがってそれ自体では自己架橋性を持たず、熱可塑性
を示す。そこで、ノボラック樹脂を成形材料として使用
する場合には、通常、ヘキサメチレンテトラミンのよう
な硬化剤をノボラック樹脂に8〜15重量%程度添加、
混合しておき、成形時に加熱、硬化させる方法が採られ
る。
On the other hand, novolak resins usually have a molar ratio of phenols (P) to formaldehydes (F) of F / F.
It is produced by reacting phenol with formalin in the presence of an acid catalyst such as oxalic acid under conditions of phenol excess such that P = 0.7-0.9. The novolak resin obtained by such a method is mainly composed of a trimer to pentamer in which phenol is mainly bonded by a methylene group, hardly contains a free methylol group,
Therefore, it does not have a self-crosslinking property by itself and shows thermoplasticity. Therefore, when a novolak resin is used as a molding material, a curing agent such as hexamethylenetetramine is usually added to the novolak resin in an amount of about 8 to 15% by weight.
A method of mixing and heating and curing at the time of molding is adopted.

【0005】ヘキサメチレンテトラミンを添加したノボ
ラック樹脂は、一般的には、前記のようにメチレン基が
多いので、レゾール樹脂と比較して熱硬化特性や物性が
良好な場合が多い。しかし、成形材料としてヘキサメチ
レンテトラミンを添加したノボラック樹脂を使用すると
きは、固体のノボラック樹脂と固体のヘキサメチレンテ
トラミンとを混合するだけで用いるので、成形時の加熱
により、フリーのヘキサメチレンテトラミンの分解ガス
が発生し、この分解ガスにより成形物中にボイドが生じ
たり、また、不均一に分散したフリーのヘキサメチレン
テトラミンが成形物中に残留し、成形物の物性を低下さ
せるという問題があった。
[0005] A novolak resin to which hexamethylenetetramine is added generally has a large number of methylene groups as described above, and thus often has better thermosetting properties and physical properties than resol resins. However, when a novolak resin to which hexamethylenetetramine is added is used as a molding material, it is used only by mixing the solid novolak resin and the solid hexamethylenetetramine. Decomposition gas is generated, and there is a problem that voids are generated in the molded article due to the decomposed gas, and free hexamethylenetetramine which is non-uniformly dispersed remains in the molded article, thereby deteriorating the physical properties of the molded article. Was.

【0006】また、特公昭63−46004号公報に
は、硬化前の樹脂組成物の段階で、20重量%以上の水
を含み得る熱硬化性樹脂等が開示されている。しかしな
がら、これに開示されている液状の熱硬化性樹脂を成形
材料として用いる場合には、重合、熱硬化時に樹脂に含
有している大量の水分が逸脱しきれず、ボイドやクラッ
クが発生し易く、また、透明度の高い成形物が得られに
くいという問題があった。さらに、この熱硬化性樹脂溶
液は、貯蔵時に重合が進み易く保存安定性が悪いという
問題があった。
[0006] JP-B-63-46004 discloses a thermosetting resin or the like which can contain 20% by weight or more of water in a resin composition before curing. However, when the liquid thermosetting resin disclosed therein is used as a molding material, polymerization, a large amount of water contained in the resin cannot be completely deviated during thermosetting, and voids and cracks are easily generated, In addition, there is a problem that it is difficult to obtain a molded article having high transparency. Further, this thermosetting resin solution has a problem that polymerization tends to proceed during storage and storage stability is poor.

【0007】[0007]

【発明が解決しようとする課題】上記状況に鑑み、本発
明の課題は、保存安定性に優れ、50℃において液状で
成形性特に注型成形性に優れた成形用フェノール樹脂の
提供、及びこの成形用フェノール樹脂を容易に製造する
ことができる方法の提供、この成形用フェノール樹脂か
ら得られる透明性と均質性に優れたフェノール樹脂成形
体の提供にある。
SUMMARY OF THE INVENTION In view of the above situation, an object of the present invention is to provide a phenolic resin for molding which has excellent storage stability, is liquid at 50 ° C., and has excellent moldability, especially moldability. An object of the present invention is to provide a method for easily producing a phenolic resin for molding, and to provide a phenolic resin molded article obtained from the phenolic resin for molding and having excellent transparency and homogeneity.

【0008】[0008]

【課題を解決するための手段】本発明者らは、このよう
な課題を解決すべく、鋭意検討した結果、後述のような
構成にすると、上記課題を解決することができるとの知
見を見出し、本発明に到達した。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies in order to solve such a problem, and as a result, have found that it is possible to solve the above problem by adopting a configuration as described below. Reached the present invention.

【0009】すなわち、本発明の要旨は、第1に、水分
率5重量%以下、不揮発分70〜95重量%であり、5
0℃において液状の自己硬化性フェノール樹脂であるこ
とを特徴とする成形用フェノール樹脂であり、第2に、
ノボラック樹脂、フェノール類及びアルデヒド類を塩基
性触媒の存在下で反応させた後、反応系に存在する水分
を水分率5重量%以下まで留去することを特徴とする成
形用フェノール樹脂の製造方法であり、この製造方法に
おいて、特にノボラック樹脂100重量部に対しフェノ
ール類の量を40〜250重量部とし、アルデヒド類を
フェノール類の1.5〜2.5モル倍とすることが好ま
しい。第3に、前記成形用フェノール樹脂から得られる
フェノール樹脂成形体である。
That is, the gist of the present invention is that first, the water content is 5% by weight or less, and the nonvolatile content is 70 to 95% by weight.
A phenolic resin for molding characterized by being a self-curable phenolic resin which is liquid at 0 ° C.
A method for producing a phenolic resin for molding, comprising reacting a novolak resin, a phenol and an aldehyde in the presence of a basic catalyst, and then distilling water present in the reaction system to a water content of 5% by weight or less. In this production method, it is particularly preferable that the amount of the phenol is 40 to 250 parts by weight and the amount of the aldehyde is 1.5 to 2.5 times the phenol relative to 100 parts by weight of the novolak resin. Thirdly, there is a phenolic resin molded article obtained from the phenolic resin for molding.

【0010】[0010]

【発明の実施の形態】以下本発明を詳細に説明する。本
発明の成形用フェノール樹脂は、水分率5重量%以下、
不揮発分70〜95重量%であり、50℃において液状
の自己硬化性フェノール樹脂である。成形用フェノール
樹脂の水分率が5重量%を超えると成形時の加熱による
水蒸気の発生が多く、成形物に気泡が残留し、透明性の
高いフェノール樹脂成形体を得るのが困難である。さら
に水分率は3重量%以下であることがより好ましい。水
分率は次のようにして判断する。すなわち、50℃で液
体の自己硬化性フェノール樹脂:メタノール=1:10
(重量比)の溶液を調製し、三菱化学株式会社製CA−
07型微量水分測定装置(電量滴定方式自動水分測定装
置)を用いて、水分率を試料当たり2点測定し、それら
の値の平均値を求め、得られた値を50℃で液体の自己
硬化性フェノール樹脂の水分率とした。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The phenolic resin for molding of the present invention has a moisture content of 5% by weight or less,
It is a self-curable phenol resin having a nonvolatile content of 70 to 95% by weight and being liquid at 50 ° C. If the moisture content of the phenolic resin for molding exceeds 5% by weight, steam is often generated due to heating during molding, bubbles remain in the molded product, and it is difficult to obtain a highly transparent phenolic resin molded product. Further, the moisture content is more preferably 3% by weight or less. The moisture percentage is determined as follows. That is, a self-hardening phenol resin liquid at 50 ° C.:methanol=1:10
(Weight ratio) of a solution prepared by Mitsubishi Chemical Corporation CA-
The moisture content was measured at two points per sample using a type 07 trace moisture analyzer (coulometric titration automatic moisture analyzer), the average of those values was determined, and the obtained value was self-cured at 50 ° C. The water content of the phenolic resin was determined.

【0011】また、本発明の成形用フェノール樹脂は不
揮発分70〜95%である。不揮発分が70%未満の場
合には樹脂の硬化に長時間を要する。また、95%を超
える樹脂は製造する際にゲル化及び樹脂の析出が起こ
り、製造が困難である。不揮発分は次のようにして判断
する。すなわち、本発明の成形用フェノール樹脂を、J
IS K6909−1995「液状フェノール樹脂試験
法方」によって測定した値を50℃で液状の自己硬化性
フェノール樹脂の不揮発分とした。
The phenolic resin for molding of the present invention has a nonvolatile content of 70 to 95%. When the nonvolatile content is less than 70%, it takes a long time to cure the resin. On the other hand, when the resin content exceeds 95%, gelation and precipitation of the resin occur during the production, and the production is difficult. Non-volatile components are determined as follows. That is, the phenolic resin for molding of the present invention is
The value measured according to IS K6909-1995 "Liquid phenolic resin test method" was taken as the non-volatile content of the liquid self-curable phenolic resin at 50C.

【0012】本発明において、自己硬化性とは、加熱に
より分子内及び/又は分子間での縮合反応により三次元
的に架橋して不溶、不融樹脂に変わる性質を有すること
をいい、50℃で液状とは50℃で粘稠な液体をいう。
In the present invention, the term "self-curing" means that the resin has a property of being three-dimensionally crosslinked by an intramolecular and / or intermolecular condensation reaction upon heating to change into an insoluble or infusible resin. The term "liquid" means a viscous liquid at 50 ° C.

【0013】本発明の成形用フェノール樹脂は、例え
ば、ノボラック樹脂、フェノール類及びアルデヒド類を
塩基性触媒の存在下で反応させた後、反応時に用いた水
分及び反応時に生成した水分を水分率5重量%以下まで
留去して製造される。ノボラック樹脂は、フェノール類
又は変性フェノール類(P)とアルデヒド(F)とをF
/P≦1(モル比)に配合し、シュウ酸、塩酸、硫酸等
の酸性触媒下で反応させてから、加熱して、脱水・脱フ
ェノール化して得られる固形状の熱可塑性樹脂であり、
融点(還球法による)が70〜100℃で、下記の式
(1)に示すような化学構造を有するものであり、これ
らのノボラック樹脂は一般市販品として容易に入手可能
である。
The phenolic resin for molding of the present invention is obtained, for example, by reacting a novolak resin, phenols and aldehydes in the presence of a basic catalyst, and then converting the water used in the reaction and the water generated during the reaction to a water content of 5%. It is manufactured by distilling it down to less than% by weight. Novolak resin is obtained by converting phenols or modified phenols (P) and aldehydes (F) into F
/ P ≦ 1 (molar ratio), reacted under an acidic catalyst such as oxalic acid, hydrochloric acid, sulfuric acid, etc., and then heated, dehydrated and dephenolized to obtain a solid thermoplastic resin,
It has a melting point of 70 to 100 ° C. (based on the free ball method) and a chemical structure represented by the following formula (1), and these novolak resins are easily available as general commercial products.

【0014】[0014]

【化1】 Embedded image

【0015】フェノール類としてはフェノール及びフェ
ノール誘導体が挙げられる。このフェノール誘導体とし
ては、例えば炭素数1〜9のアルキル基で置換されたm
−アルキルフェノール、o−アルキルフェノール、p−
アルキルフェノールが挙げられ、具体的にはm−クレゾ
ール、p−tert−ブチルフェノール、o−プロピル
フェノール、レゾルシノール、ビスフェノールA及びこ
れらのベンゼン核又はアルキル基の水素原子の一部又は
全部が塩素又は臭素で置換されたハロゲン化フェノール
誘導体などが挙げられ、これらの1種又は2種以上が用
いられる。これらのフェノール類は、一般市販品として
容易に入手可能である。フェノール類の添加量は、ノボ
ラック樹脂100重量部に対して40〜250重量部、
特には60〜150であることが好ましい。この範囲外
では不揮発分が70を超えるものが得られなかったり、
反応中にゲル化など、樹脂の析出が起こり、樹脂溶液が
得られないことがある。そして、固形状又は、粉末状の
ノボラック樹脂はフェノール類に溶解して用いることが
好ましい。
The phenols include phenol and phenol derivatives. Examples of the phenol derivative include m substituted with an alkyl group having 1 to 9 carbon atoms.
-Alkylphenol, o-alkylphenol, p-
Alkyl phenols, specifically, m-cresol, p-tert-butylphenol, o-propylphenol, resorcinol, bisphenol A and their benzene nuclei or part or all of the hydrogen atoms of the alkyl group are substituted with chlorine or bromine Halogenated phenol derivatives, and one or more of these are used. These phenols are easily available as general commercial products. The addition amount of the phenol is 40 to 250 parts by weight based on 100 parts by weight of the novolak resin,
In particular, it is preferably from 60 to 150. Outside of this range, non-volatile components exceeding 70 cannot be obtained,
During the reaction, resin precipitation such as gelation may occur, and a resin solution may not be obtained. The solid or powdered novolak resin is preferably used by dissolving it in phenols.

【0016】また、アルデヒド類としては、例えばホル
ムアルデヒド又はパラホルムアルデヒド、フルフラール
等が挙げられる。アルデヒド類の添加量は、フェノール
類に対するモル比で1.5〜2.5、好ましくは1.8
〜2.2である。この範囲外では反応が不安定となり、
均一な樹脂溶液が得られないことがある。アルデヒド類
は水溶液として用いることが好ましい。
The aldehydes include, for example, formaldehyde or paraformaldehyde, furfural and the like. The amount of the aldehyde to be added is 1.5 to 2.5, preferably 1.8 in molar ratio to the phenol.
~ 2.2. Outside this range, the reaction becomes unstable,
A uniform resin solution may not be obtained. The aldehydes are preferably used as an aqueous solution.

【0017】本発明で使用される塩基性触媒としては、
通常のレゾール樹脂の製造に用いられる塩基性触媒が使
用され、例えば、苛性ソーダ、水酸化カリウム、アンモ
ニア水、ヘキサメチレンテトラミン及びジメチルアミ
ン、ジエチレントリアミン、ポリエチレンイミン等のア
ルキルアミンが挙げられる。これらの塩基性触媒の添加
量はフェノール類に対してモル比は0.01〜0.2が
好ましく、特に好ましくは0.01〜0.05である。
また、塩基性触媒は水溶液として用いることが好まし
い。
The basic catalyst used in the present invention includes:
Basic catalysts used in the production of ordinary resol resins are used, and examples thereof include caustic soda, potassium hydroxide, aqueous ammonia, hexamethylenetetramine, and alkylamines such as dimethylamine, diethylenetriamine, and polyethyleneimine. The amount of the basic catalyst to be added is preferably 0.01 to 0.2, more preferably 0.01 to 0.05, in terms of a molar ratio with respect to the phenol.
The basic catalyst is preferably used as an aqueous solution.

【0018】ノボラック樹脂、フェノール類及びアルデ
ヒド類の反応は、例えば撹拌下で行われ、反応温度は7
0〜90℃で行うことが好ましく、75〜80℃で行う
ことがより好ましい。また、この温度での反応時間は
1.5〜3時間、特に2時間が好ましい。反応後におい
ては、反応時に用いた水分や反応時に生成した水分を水
分率5重量%以下まで留去する。その方法としては、通
常の方法で行うことができ、減圧下で加熱して濃縮する
ことが好ましく、減圧度は30〜100mmHg、温度
は60〜70℃で行うことが好ましい。このようにして
得られる成形用フェノール樹脂は、通常の液状レゾール
樹脂と比較すると遊離フェノール類及び遊離アルデヒド
類が少ないので、常温において保存安定性に優れてい
る。
The reaction of the novolak resin, phenols and aldehydes is carried out, for example, with stirring, and the reaction temperature is 7
It is preferably performed at 0 to 90 ° C, more preferably at 75 to 80 ° C. The reaction time at this temperature is preferably 1.5 to 3 hours, particularly preferably 2 hours. After the reaction, the water used during the reaction and the water generated during the reaction are distilled off to a water content of 5% by weight or less. The method can be carried out by a usual method, and it is preferable to heat and concentrate under reduced pressure, and it is preferable that the degree of reduced pressure is 30 to 100 mmHg and the temperature is 60 to 70 ° C. The phenolic resin for molding obtained in this way has less free phenols and free aldehydes than ordinary liquid resol resins, and thus has excellent storage stability at room temperature.

【0019】また、本発明の成形用フェノール樹脂は、
通常の方法で成形することができ、成形方法としては、
注型成形、移送成形などが好適に用いられ、特に注型成
形が好ましく、例えば、注型成形によりフェノール樹脂
成形体を得るには、成形用フェノール樹脂を所定の型に
注入し、70〜180℃で2〜5時間加熱硬化させて、
フェノール樹脂成形体を得る。
Further, the phenolic resin for molding of the present invention comprises:
It can be molded by a usual method, and as a molding method,
Cast molding, transfer molding, and the like are suitably used, and cast molding is particularly preferred. For example, in order to obtain a phenolic resin molded article by casting, a phenolic resin for molding is poured into a predetermined mold, and 70 to 180 At 2 ° C for 2-5 hours,
A phenolic resin molded article is obtained.

【0020】フェノール樹脂成形体の透明性は、ヘーズ
(曇価)測定法JIS−K7105(1981)に準じ
て以下の方法により判定することができる。成形用フェ
ノール樹脂を100mm×100mm×10mmtのガ
ラス製の型に注入し、循環式熱風乾燥機で90℃で1時
間、90℃から145℃までを昇温速度1℃/分で昇温
し、更に1時間145℃に保持して熱硬化を行い、板厚
3mmのフェノール樹脂成形体を成形する。得られた試
料について、日本電色工業株式会社製Z−Σ90型色差
計を用いて拡散透過率及び全光線透過率を1試料当たり
3点測定し、平均値を求める。得られた拡散透過率と全
光線透過率の測定値から、ヘーズ(曇価)を次式から算
出する。 ヘーズ(曇価)=拡散透過率(%)/全光線透過率
(%)×100 ヘーズ値が20%以下の場合を透明であると判断する。
フェノール樹脂成形体の透明性は、それが高純度のもの
でもキノイド系副反応生成物等の分子性光吸収物が存在
するので、ヘーズ値を3%未満とするのは困難である。
ヘーズ値が3%を超える場合には、3%を越えた分の値
はフェノール樹脂以外の微小な夾雑不純物や微細気孔等
による光の吸収、散乱等に起因するものであり、この値
が20%を超える場合にはフェノール樹脂成形体の特性
に大きな欠陥として現れる。ヘーズ値は特に10%以下
が好ましい。
The transparency of the phenolic resin molded article can be determined by the following method according to the haze (haze value) measuring method JIS-K7105 (1981). The phenol resin for molding is poured into a glass mold of 100 mm × 100 mm × 10 mmt, and the temperature is raised from 90 ° C. to 145 ° C. at a rate of 1 ° C./minute from 90 ° C. for 1 hour by a circulating hot air drier. Further, the composition is thermoset at 145 ° C. for 1 hour to form a phenolic resin molded product having a thickness of 3 mm. With respect to the obtained sample, the diffuse transmittance and the total light transmittance are measured at three points per sample using a Z- # 90 type color difference meter manufactured by Nippon Denshoku Industries Co., Ltd., and the average value is obtained. Haze (cloudiness value) is calculated from the following equation from the measured values of the obtained diffuse transmittance and total light transmittance. Haze (cloudiness value) = diffuse transmittance (%) / total light transmittance (%) × 100 When the haze value is 20% or less, it is determined to be transparent.
Regarding the transparency of the phenolic resin molded product, it is difficult to reduce the haze value to less than 3% even if the phenolic resin molded product is of high purity because a molecular light absorbing material such as a quinoid side reaction product is present.
When the haze value exceeds 3%, the value exceeding 3% is due to light absorption and scattering by minute contaminant impurities other than the phenol resin, fine pores, and the like. %, It appears as a large defect in the properties of the phenolic resin molded article. The haze value is particularly preferably 10% or less.

【0021】上記のように本発明の成形用フェノール樹
脂からは、高純度で気孔を含まず透明性の高いフェノー
ル樹脂成形体が得られ、これは均質な組織構造を有する
ため、気体不透過性や耐薬品性や破壊強度等の特性に優
れており、電子、化学、光学をはじめ多くの工業分野で
望まれている。
As described above, from the phenolic resin for molding of the present invention, a phenolic resin molded body having high purity and containing no pores and having high transparency can be obtained. It is excellent in properties such as chemical resistance and breaking strength, and is desired in many industrial fields including electronics, chemistry, and optics.

【0022】[0022]

【実施例】以下、本発明を実施例を用いて具体的に説明
する。 実施例1 2Lのガラス製フラスコにノボラック樹脂(三井東圧
(株)製 #600、融点75〜85℃、遊離フェノー
ル1.5重量%)200重量部、フェノール300重量
部を仕込み、撹拌しながら50〜70℃で内容物を溶解
した。次いで37%ホルマリン水溶液517.5重量部
を加えた後、これに別に苛性ソーダ1.5重量部を水1
5重量部に溶解した液を加え撹拌しながら70〜75℃
で2時間保持し、反応を行った。次に内容物を30℃以
下の温度に低下せしめ、1Lナス型フラスコに内容物6
00重量部を採り、水道に連結したアスピレーターを用
いて、約30〜100mmHgの減圧下、温度60〜6
5℃で水198重量部を留去し、液状の成形用フェノー
ル樹脂を得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to embodiments. Example 1 A 2 L glass flask was charged with 200 parts by weight of novolak resin (# 600, manufactured by Mitsui Toatsu Co., Ltd., melting point: 75 to 85 ° C., 1.5% by weight of free phenol) and 300 parts by weight of phenol, and stirred. The contents were dissolved at 50-70 ° C. Then, 517.5 parts by weight of a 37% formalin aqueous solution was added, and 1.5 parts by weight of caustic soda was further added to water 1 part.
Add a solution dissolved in 5 parts by weight and stir at 70-75 ° C
For 2 hours to carry out the reaction. Next, the content was lowered to a temperature of 30 ° C. or less, and the content 6 was placed in a 1-L eggplant type flask.
100 parts by weight, using an aspirator connected to a water supply, under a reduced pressure of about 30 to 100 mmHg, at a temperature of 60 to 6
198 parts by weight of water was distilled off at 5 ° C. to obtain a liquid phenol resin for molding.

【0023】得られた樹脂液について、水分率、不揮発
分を測定した。その結果を表1に示す。また、次のよう
な方法にて50℃における粘度、145℃におけるゲル
化時間の測定を行い、得られた測定結果を表1に示す。
50℃における粘度及び145℃におけるゲル化時間は
JIS M8812−1977「液状フェノール樹脂試
験方法」に準じた次のような方法によって、それぞれ測
定した。すなわち、粘度測定はB型回転粘度計を用い、
樹脂温度50℃において行った。また、ゲル化時間は樹
脂30gに対して150rpmの撹拌を加えながら、1
45℃において目視によりゲル化が確認されるまでの時
間を計測した。
The water content and the nonvolatile content of the obtained resin liquid were measured. Table 1 shows the results. Further, the viscosity at 50 ° C. and the gel time at 145 ° C. were measured by the following method, and the obtained measurement results are shown in Table 1.
The viscosity at 50 ° C. and the gelation time at 145 ° C. were measured by the following methods according to JIS M8812-1977 “Testing method for liquid phenolic resin”. That is, the viscosity measurement uses a B-type rotational viscometer,
The test was performed at a resin temperature of 50 ° C. The gelation time was 1 hour while stirring at 150 rpm with 30 g of the resin.
The time until gelation was visually confirmed at 45 ° C. was measured.

【0024】次に得られた樹脂液30gを100mm×
100mm×10mmの平板状型に注入し、循環式熱風
乾燥機で90℃で1時間、90℃から145℃までを昇
温速度1℃/分で昇温し、さらに145℃で1時間に保
持して熱硬化を行い、板厚3mmのフェノール樹脂成形
体を得た。得られたフェノール樹脂成形体のヘーズ値を
前述の手段に従って測定し、気孔数をNikon UF
X−DX顕微鏡を用い、倍率100倍で1cm2 当たり
の孔径10μm以上の気孔数を数えた。それらの結果を
表1に示す。気孔数が少ないほど、組織が均一であるこ
とを示す。表1から、本実施例で得られたフェノール樹
脂成形体の透明性、均質性いずれにおいても極めて優れ
ていることがわかる。
Next, 30 g of the obtained resin liquid was weighed at 100 mm ×
Injected into a 100 mm x 10 mm flat mold, heated with a circulating hot air dryer at 90 ° C for 1 hour, from 90 ° C to 145 ° C at a rate of 1 ° C / min, and kept at 145 ° C for 1 hour. Then, thermosetting was performed to obtain a phenol resin molded body having a thickness of 3 mm. The haze value of the obtained phenolic resin molded body was measured according to the above-mentioned means, and the number of pores was determined by Nikon UF.
Using an X-DX microscope, the number of pores having a pore diameter of 10 μm or more per 1 cm 2 at a magnification of 100 was counted. Table 1 shows the results. The smaller the number of pores, the more uniform the structure. Table 1 shows that the phenolic resin molded product obtained in this example is extremely excellent in both transparency and homogeneity.

【0025】実施例2 樹脂液の水分率を5重量%に変えた以外は実施例1と同
様にして、不揮発分、粘度(50℃)、ゲル化時間(1
45℃)、ヘーズ値、気孔数を測定した結果を表1に示
す。表1から、本実施例で得られたフェノール樹脂成形
体は透明性、均質性いずれにおいても優れていることが
わかる。
Example 2 The same procedure as in Example 1 was carried out except that the water content of the resin solution was changed to 5% by weight, and the nonvolatile content, viscosity (50 ° C.), and gel time (1
45 ° C.), the haze value and the number of pores are shown in Table 1. Table 1 shows that the phenolic resin molded product obtained in this example is excellent in both transparency and homogeneity.

【0026】実施例3 ノボラック樹脂100重量部に対するフェノール樹脂の
仕込み量を42重量部に変えた以外は実施例1と同様に
して、成形用フェノール樹脂を得、実施例1と同様にし
て、不揮発分、粘度(50℃)、ゲル化時間、ヘーズ
値、気孔数を測定した結果を表1に示す。表1から、本
実施例で得られたフェノール樹脂成形体は透明性、均質
性いずれにおいても優れていることがわかる。
Example 3 A phenolic resin for molding was obtained in the same manner as in Example 1 except that the amount of the phenolic resin per 100 parts by weight of the novolak resin was changed to 42 parts by weight. Table 1 shows the results obtained by measuring the minutes, the viscosity (50 ° C.), the gel time, the haze value, and the number of pores. Table 1 shows that the phenolic resin molded product obtained in this example is excellent in both transparency and homogeneity.

【0027】比較例1 水分率を10%に変えた以外は実施例1と同様にして、
成形用フェノール樹脂を得、実施例1と同様にして、不
揮発分、粘度(50℃)、ゲル化時間、ヘーズ値、気孔
数を測定した結果を表1に示す。表1から、透明性、均
質性いずれにおいても、本実施例で得られたフェノール
樹脂成形体よりも劣っていることがわかる。
Comparative Example 1 The procedure of Example 1 was repeated except that the water content was changed to 10%.
A phenol resin for molding was obtained, and the results of measuring the nonvolatile content, viscosity (50 ° C.), gel time, haze value, and number of pores in the same manner as in Example 1 are shown in Table 1. Table 1 shows that both the transparency and the homogeneity are inferior to the phenolic resin molded product obtained in the present example.

【0028】比較例2 ノボラック樹脂100重量部に対するフェノール樹脂の
仕込み量を300重量部に変えた以外は実施例1と同様
にして、成形用フェノール樹脂を得、実施例1と同様に
して、不揮発分、粘度(50℃)、ゲル化時間、ヘーズ
値、気孔数を測定した結果を表1に示す。
Comparative Example 2 A phenolic resin for molding was obtained in the same manner as in Example 1 except that the amount of the phenolic resin per 100 parts by weight of the novolak resin was changed to 300 parts by weight. Table 1 shows the results obtained by measuring the minutes, the viscosity (50 ° C.), the gel time, the haze value, and the number of pores.

【0029】表1から、透明性、均質性いずれにおいて
も、本実施例で得られた成形用フェノール樹脂の成形体
よりも劣っていることがわかる。
From Table 1, it can be seen that both the transparency and the homogeneity are inferior to the molded article of the phenolic resin for molding obtained in this example.

【0030】[0030]

【表1】 [Table 1]

【0031】[0031]

【発明の効果】本発明は以上のように構成されているの
で、本発明の成形用フェノール樹脂は、常温での反応性
が低く保存安定性に優れており、50℃で液状で成形性
特に注型成形性に優れている。また、本発明の成形用フ
ェノール樹脂の製造方法によればこのような成形用フェ
ノール樹脂が容易に得ることができる。さらにまた、本
発明の成形用フェノール樹脂からは、気孔を含まず透明
性の高いフェノール樹脂成形体が得られ、これは均質な
組織構造を有するため、気体不透過性や耐薬品性や破壊
強度等の特性に優れており、電子、化学、光学をはじめ
多くの工業分野で好適に使用することができる。
Since the present invention is constituted as described above, the phenolic resin for molding of the present invention has low reactivity at room temperature and excellent storage stability, and is liquid at 50 ° C., and has excellent moldability. Excellent moldability. According to the method for producing a phenolic resin for molding of the present invention, such a phenolic resin for molding can be easily obtained. Furthermore, from the phenolic resin for molding of the present invention, a highly transparent phenolic resin molded article containing no pores is obtained, which has a homogeneous structure structure, and thus has gas impermeability, chemical resistance, and breaking strength. It is excellent in such properties as, and can be suitably used in many industrial fields including electronics, chemistry, and optics.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 水分率5重量%以下、不揮発分70〜9
5重量%であり、50℃において液状の自己硬化性フェ
ノール樹脂であることを特徴とする成形用フェノール樹
脂。
1. A water content of 5% by weight or less, and a nonvolatile content of 70 to 9
A phenol resin for molding, which is 5% by weight and is a self-curable phenol resin which is liquid at 50 ° C.
【請求項2】 ノボラック樹脂、フェノール類及びアル
デヒド類を塩基性触媒の存在下で反応させた後、反応系
に存在する水分を水分率5重量%以下まで留去すること
を特徴とする請求項1記載の成形用フェノール樹脂の製
造方法。
2. The method according to claim 1, wherein after reacting the novolak resin, phenols and aldehydes in the presence of a basic catalyst, water present in the reaction system is distilled off to a water content of 5% by weight or less. 2. A method for producing the phenolic resin for molding according to 1.
【請求項3】 ノボラック樹脂100重量部に対しフェ
ノール類の量を40〜250重量部とし、アルデヒド類
をフェノール類の1.5〜2.5モル倍とすることを特
徴とする請求項2記載の成形用フェノール樹脂の製造方
法。
3. The method according to claim 2, wherein the amount of the phenol is 40 to 250 parts by weight based on 100 parts by weight of the novolak resin, and the amount of the aldehyde is 1.5 to 2.5 times the amount of the phenol. Production method of phenolic resin for molding.
【請求項4】 請求項1記載の成形用フェノール樹脂か
ら得られるフェノール樹脂成形体。
4. A phenolic resin molded product obtained from the phenolic resin for molding according to claim 1.
JP11183114A 1999-06-29 1999-06-29 Phenolic resin for molding, its production and phenolic resin molded article obtained from the same resin Pending JP2001011145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11183114A JP2001011145A (en) 1999-06-29 1999-06-29 Phenolic resin for molding, its production and phenolic resin molded article obtained from the same resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11183114A JP2001011145A (en) 1999-06-29 1999-06-29 Phenolic resin for molding, its production and phenolic resin molded article obtained from the same resin

Publications (1)

Publication Number Publication Date
JP2001011145A true JP2001011145A (en) 2001-01-16

Family

ID=16130033

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2001011145A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107353377A (en) * 2017-08-09 2017-11-17 山东圣泉新材料股份有限公司 A kind of phenolic resin and preparation method thereof
CN109111557A (en) * 2018-07-30 2019-01-01 兰州理工大学 The preparation method of agent for improving oilfield recovery low solubility phenolic resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107353377A (en) * 2017-08-09 2017-11-17 山东圣泉新材料股份有限公司 A kind of phenolic resin and preparation method thereof
CN109111557A (en) * 2018-07-30 2019-01-01 兰州理工大学 The preparation method of agent for improving oilfield recovery low solubility phenolic resin
CN109111557B (en) * 2018-07-30 2021-06-22 兰州理工大学 Preparation method of low-solubility phenolic resin for improving recovery ratio of oil field

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