JP2001007530A5 - - Google Patents
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- Publication number
- JP2001007530A5 JP2001007530A5 JP1999179766A JP17976699A JP2001007530A5 JP 2001007530 A5 JP2001007530 A5 JP 2001007530A5 JP 1999179766 A JP1999179766 A JP 1999179766A JP 17976699 A JP17976699 A JP 17976699A JP 2001007530 A5 JP2001007530 A5 JP 2001007530A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating layer
- wiring layers
- section
- circular cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11179766A JP2001007530A (ja) | 1999-06-25 | 1999-06-25 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11179766A JP2001007530A (ja) | 1999-06-25 | 1999-06-25 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001007530A JP2001007530A (ja) | 2001-01-12 |
| JP2001007530A5 true JP2001007530A5 (https=) | 2006-08-10 |
Family
ID=16071522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11179766A Withdrawn JP2001007530A (ja) | 1999-06-25 | 1999-06-25 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001007530A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251780A (ja) * | 2004-03-01 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 半導体回路部品およびその製造方法 |
| US20060042832A1 (en) | 2004-08-27 | 2006-03-02 | Kiyoshi Sato | Multilayer circuit board and method of producing the same |
| WO2007052396A1 (ja) * | 2005-10-31 | 2007-05-10 | Sharp Kabushiki Kaisha | 多層配線基板及び多層配線基板の製造方法 |
| JP2012009849A (ja) * | 2010-05-25 | 2012-01-12 | Canon Inc | 配線基板の製造方法および配線基板 |
| JP5518624B2 (ja) * | 2010-08-10 | 2014-06-11 | 日本メクトロン株式会社 | プリント配線板及びその製造方法 |
| JP5693339B2 (ja) * | 2011-04-06 | 2015-04-01 | 日本メクトロン株式会社 | 多層プリント配線板およびその製造方法 |
| US8816218B2 (en) * | 2012-05-29 | 2014-08-26 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with vias having different dimensions |
| US9615447B2 (en) * | 2012-07-23 | 2017-04-04 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic support structure with integral constructional elements |
| CN210124037U (zh) | 2017-08-01 | 2020-03-03 | 株式会社村田制作所 | 多层基板 |
| JP7576976B2 (ja) * | 2020-12-25 | 2024-11-01 | 田中貴金属工業株式会社 | インターポーザ基板及び該インターポーザ基板を用いたデバイスの製造方法 |
-
1999
- 1999-06-25 JP JP11179766A patent/JP2001007530A/ja not_active Withdrawn
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