JP2001003020A - Manufacture of cover-lay film having an excellent dimensional stability - Google Patents
Manufacture of cover-lay film having an excellent dimensional stabilityInfo
- Publication number
- JP2001003020A JP2001003020A JP11176870A JP17687099A JP2001003020A JP 2001003020 A JP2001003020 A JP 2001003020A JP 11176870 A JP11176870 A JP 11176870A JP 17687099 A JP17687099 A JP 17687099A JP 2001003020 A JP2001003020 A JP 2001003020A
- Authority
- JP
- Japan
- Prior art keywords
- film
- release material
- insulating film
- tension
- kgf
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は寸法安定性に優れた
カバーレイフィルムの製造方法に関する。The present invention relates to a method for producing a coverlay film having excellent dimensional stability.
【０００２】[0002]
【従来の技術】近年、エレクトロニクス分野の進展が目
覚しく、特に通信用、民生用の電子機器の小型化、軽量
化、高密度化が進み、これらの性能に対する要求がます
ます高度なものとなっている。このような要求に対し
て、フレキシブル印刷配線板は可撓性を有し、繰り返し
屈曲に耐えることが可能であるため、狭い空間に立体的
高密度の実装が可能であり、電子機器への配線、ケーブ
ル、あるいはコネクター機能を付与する複合部品として
の用途が拡大しつつある。特に最近では基板の高密度化
が進んでおり、それに伴って、フレキシブル印刷配線板
にＩＣ等の部品を実装する場合が多くなってきており、
使用目的によってはこのＩＣ等の部品を保護する目的で
カバーレイフィルムを貼り合わせる場合もある。このカ
バーレイフィルムは、電気絶縁性フィルムの片面に耐熱
性接着剤を塗布し、半硬化状態とし、その塗布面と離型
材とを貼り合わせたもので、主にフレキシブル印刷配線
板の回路を保護する目的で使用されている。2. Description of the Related Art In recent years, the electronics field has been remarkably advanced, and in particular, electronic devices for communication and consumer use have been reduced in size, weight, and density, and requirements for these performances have become increasingly sophisticated. I have. In response to such demands, flexible printed wiring boards have flexibility and can withstand repeated bending, so that they can be mounted three-dimensionally and with high density in a narrow space, and can be connected to electronic devices. The use as a composite component for providing a cable, a connector, or a connector function is expanding. In recent years, in particular, the density of substrates has been increasing recently, and accordingly, there are many cases where components such as ICs are mounted on flexible printed wiring boards.
Depending on the purpose of use, a coverlay film may be attached for the purpose of protecting components such as ICs. This coverlay film is made by applying a heat-resistant adhesive to one side of an electrically insulating film, making it semi-cured, and bonding the applied surface to a release material to protect mainly the circuit of the flexible printed wiring board. Used for the purpose.
【０００３】[0003]
【発明が解決しようとする課題】このようにフレキシブ
ル印刷配線板の回路を保護するためにカバーレイフィル
ムを使用するのであるが、このカバーレイフィルムをフ
レキシブル印刷配線板に貼り合わせる（実装する）際
は、離型材を剥がして用いるが、この離型材を剥がした
ときから、実装段階までの僅かな時間に、電気絶縁性フ
ィルムと半硬化状態の耐熱性接着剤からなる積層体（即
ちカバーレイフィルムから離型材を剥がしたもの）が収
縮するため、積層体を実装する際にパターンを調整しな
ければならず、この収縮が大きかったり（即ち寸法精度
が悪かったり）、バラツキが大きいと、パターンの微調
整が難しく、生産性が低下し、製品自体の歩留まりを大
きく低下させるので問題となっている。The coverlay film is used to protect the circuit of the flexible printed wiring board. When the coverlay film is bonded (mounted) to the flexible printed wiring board. Is used after peeling off the release material, but in a short time from the time when the release material is peeled off to the mounting stage, a laminate made of an electrically insulating film and a semi-cured heat-resistant adhesive (that is, a coverlay film) The pattern must be adjusted when mounting the laminate. If the contraction is large (that is, the dimensional accuracy is poor) or the variation is large, the pattern Fine adjustment is difficult, productivity is reduced, and the yield of the product itself is greatly reduced, which is a problem.
【０００４】[0004]
【課題を解決するための手段】発明者等はこのような問
題を解決するために、鋭意検討した結果、電気絶縁性フ
ィルム及び離型材の有する弾性率、カバーレイフィルム
製造時の電気絶縁性フィルム、離型材の張力に着目して
本発明を完成した。即ち、本発明は離型材／耐熱性接着
剤／電気絶縁性フィルムからなるカバーレイフィルムに
おいて、弾性率Ｆ[kgf/mm2] が 100≦Ｆ≦1,000 である
電気絶縁性フィルム及び弾性率Ｒ[kgf/mm2] が50≦Ｒ≦
500 である離型材を用い、耐熱性接着剤付電気絶縁性フ
ィルムと離型材とを貼り合わせる際の電気絶縁性フィル
ムの張力Ｔｆ[kgf/mm2] 及び離型材の張力Ｔｒ[kgf/m
m2] が 0.1≦Ｔｆ，Ｔｒ≦2.0 であり、かつ弾性率Ｆ，
Ｒ及び張力Ｔｆ，Ｔｒとの間に下記の関係式が成立する
ことを特徴とする寸法安定性に優れたカバーレイフィル
ムの製造方法である。 0.5≦Ｔｒ・Ｆ／（Ｔｆ・Ｒ）≦3.0Means for Solving the Problems The inventors of the present invention have conducted intensive studies in order to solve such problems, and as a result, have found that the elasticity of the electrically insulating film and the release material, the electrically insulating film at the time of producing the coverlay film, and the like. The present invention was completed by focusing on the tension of the release material. That is, the present invention relates to a coverlay film composed of a release material / a heat-resistant adhesive / an electrically insulating film, an electrically insulating film having an elastic modulus F [kgf / mm 2 ] of 100 ≦ F ≦ 1,000 and an elastic modulus R [ kgf / mm 2 ] is 50 ≦ R ≦
Using a release material of 500, the electric insulation film tension Tf [kgf / mm 2 ] and the release material tension Tr [kgf / m) when the electric insulation film with heat-resistant adhesive and the release material are bonded together.
m 2 ] is 0.1 ≦ Tf, Tr ≦ 2.0, and the elastic modulus F,
This is a method for producing a coverlay film excellent in dimensional stability, characterized in that the following relational expression is established between R and tensions Tf and Tr. 0.5 ≦ Tr · F / (Tf · R) ≦ 3.0
【０００５】[0005]
【発明の実施の形態】以下、本発明を詳細に説明する。
本発明において使用される離型材としては、シリコーン
離型剤付ポリエチレンフィルム及びポリプロピレンフィ
ルムまたは種々の離型剤を塗布した、ポリエチレンフィ
ルム、ポリピロピレンフィルム、ＴＰＸフィルムまたは
ポリエチレン樹脂コート紙、ポリプロピレン樹脂コート
紙及びＴＰＸ樹脂コート紙等の樹脂コート紙が挙げら
れ、好ましくは、樹脂コート紙等の離型紙が用いられ
る。離型材の厚さは、フィルムベースのもので13〜75μ
ｍ、紙ベースのもので50〜 200μｍが好ましいが、必要
に応じて適宜の厚さのものが使用される。また、離型材
が有する弾性率は 50kgf/mm2以上、500kgf/mm2以下が好
ましく、50kgf/mm2 未満であると離型材の伸びをコント
ロールすることが難しく且つカバーレイフィルムを加工
する際に打ち抜き性が悪く、作業性に問題を抱えること
になり、500kgf/mm2を超えると離型材を伸ばすための張
力が高くなりすぎるため実用性が低い。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
As the release material used in the present invention, a polyethylene film and a polypropylene film with a silicone release agent or a polyethylene film, a polypropylene film, a TPX film or a polyethylene resin coated paper, a polypropylene resin coat coated with various release agents, Examples thereof include paper and resin-coated paper such as TPX resin-coated paper. Preferably, release paper such as resin-coated paper is used. Release material thickness is 13-75μ with film base
m, a paper-based material having a thickness of 50 to 200 μm is preferable, but a material having an appropriate thickness is used as necessary. The elastic modulus having a releasing material 50 kgf / mm 2 or more, preferably 500 kgf / mm 2 or less, when processing difficult and coverlay films is possible to control the elongation of a the releasing agent is less than 50 kgf / mm 2 Punching properties are poor and workability is problematic. If it exceeds 500 kgf / mm 2 , the tension for stretching the release material becomes too high, and the practicality is low.
【０００６】本発明において使用される電気絶縁性フィ
ルムとしては、ポリイミドフィルム、ＰＥＴ（ポリエチ
レンテレフタレート）フィルム、ポリエステルフィル
ム、ポリパラバン酸フィルム、ポリエーテルケトンフィ
ルム、ポリフェニレンスルファイドフィルム、アラミド
フィルム等が挙げられ、特に耐熱性、寸法安定性等の面
からポリイミドフィルムが好ましい。フィルムは通常の
厚さ12.5〜75μｍが一般的であり、必要に応じて適宜の
厚さのものを使用すればよい。また、電気絶縁性フィル
ムの有する弾性率は100kgf/mm2以上、1,000kgf/mm2以下
が好ましく、100kgf/mm2未満であると少量の張力でフィ
ルムが伸び、寸法特性に悪い影響を及ぼしやすく、1,00
0kgf/mm2を超えるとフィルムの柔軟性に欠けてしまう。
また、必要に応じてこれらのフィルムの片面もしくは両
面に低温プラズマ処理、コロナ放電処理、サンドブラス
ト処理等を施してもよい。Examples of the electrically insulating film used in the present invention include a polyimide film, a PET (polyethylene terephthalate) film, a polyester film, a polyparabanic acid film, a polyetherketone film, a polyphenylene sulfide film, and an aramid film. In particular, a polyimide film is preferable in terms of heat resistance, dimensional stability, and the like. The film generally has a normal thickness of 12.5 to 75 μm, and an appropriate thickness may be used as needed. The elastic modulus having electrically insulating film is 100 kgf / mm 2 or more, preferably 1,000 kgf / mm 2 or less, the film is stretched with a small amount of tension is less than 100 kgf / mm 2, easily exerts bad influence on the dimensional characteristics , 1,00
If it exceeds 0 kgf / mm 2 , the film lacks flexibility.
If necessary, one or both surfaces of these films may be subjected to a low-temperature plasma treatment, a corona discharge treatment, a sand blast treatment or the like.
【０００７】本発明において電気絶縁性フィルムに塗布
される耐熱性接着剤としては、接着性、耐熱性等の面を
考慮し、ナイロン／エポキシ系樹脂、ポリエステル／エ
ポキシ系樹脂、ＮＢＲ／エポキシ系樹脂、アクリル／エ
ポキシ系樹脂、ＮＢＲ／フェノール系樹脂、アクリル／
フェノール系樹脂等が例示され、特にＮＢＲ／エポキシ
系樹脂が好ましい。接着剤層の厚さとしては、15〜50μ
ｍが好ましいが、使用状況により適宜決められる。In the present invention, the heat-resistant adhesive applied to the electrically insulating film is preferably a nylon / epoxy resin, a polyester / epoxy resin, an NBR / epoxy resin in consideration of adhesiveness, heat resistance and the like. , Acrylic / epoxy resin, NBR / phenolic resin, acrylic /
Phenolic resins are exemplified, and NBR / epoxy resins are particularly preferred. Adhesive layer thickness is 15 ~ 50μ
Although m is preferable, it is appropriately determined according to the use situation.
【０００８】次に、本発明の寸法安定性に優れたカバー
レイフィルムの製造方法について説明する。予め調製さ
れた耐熱性接着剤溶液をリバースロールコーター、コン
マコーター、ダイヘッドコーター等を用いて電気絶縁性
フィルムに乾燥状態における厚さが15〜50μｍになるよ
うに塗布し、これをインラインドライヤーに40〜160 ℃
で１〜20分間通して溶剤を乾燥、除去し接着剤を半硬化
状態とする。このとき電気絶縁性フィルムにかかる張力
を0.1kgf/mm2以上2.0kgf/mm2以下に制御する。0.1kgf/m
m2未満であると張力が弱く、フィルムが蛇行するなど作
業性が悪くなり、2.0kgf/mm2を超えるとフィルムに張力
がかかり過ぎるため寸法安定性が悪くなる。次いで、半
硬化状態の接着剤層を有した電気絶縁性フィルムの接着
剤塗布面と離型材とが貼り合わされるように加熱ロール
で温度40〜 120℃、線圧 0.2〜20kg/cm 、速度１〜20m/
min で圧着することによりカバーレイフィルムが得られ
る。このとき、貼り合わせる前の離型材の張力を0.1kgf
/mm2以上 2.0kgf/mm 2以下に制御する。0.1kgf/mm2未満
であると張力が弱く、離型材の伸びが小さいため本発明
の効果が十分に得られない。2.0kgf/mm2を超えると張力
の超過により離型材がカールし、さらに張力をかける
と、離型材が破れてしまい、作業性、生産性の点で実用
的でない。Next, a method for producing a coverlay film having excellent dimensional stability according to the present invention will be described. The prepared heat-resistant adhesive solution is applied to an electrically insulating film using a reverse roll coater, a comma coater, a die head coater, or the like so that the thickness in a dry state is 15 to 50 μm, and this is applied to an in-line dryer. ~ 160 ° C
For 1 to 20 minutes to dry and remove the solvent to make the adhesive semi-cured. At this time to control the tension applied to the electrically insulating film to 0.1 kgf / mm 2 or more 2.0 kgf / mm 2 or less. 0.1kgf / m
If it is less than m 2 , the tension is weak and the workability such as meandering of the film deteriorates, and if it exceeds 2.0 kgf / mm 2 , the film is over-tensioned and the dimensional stability deteriorates. Next, a heating roll is used at a temperature of 40 to 120 ° C., a linear pressure of 0.2 to 20 kg / cm 2, and a speed of 1 so that the adhesive applied surface of the electrically insulating film having the adhesive layer in a semi-cured state and the release material are bonded to each other. ~ 20m /
A coverlay film can be obtained by pressure bonding at min. At this time, the tension of the release material before bonding is 0.1kgf
/ mm 2 or more 2.0 kgf / mm 2 controls below. If it is less than 0.1 kgf / mm 2 , the effect of the present invention cannot be sufficiently obtained because the tension is weak and the elongation of the release material is small. If it exceeds 2.0 kgf / mm 2 , the release material will curl due to excessive tension, and if further tension is applied, the release material will be broken, which is not practical in terms of workability and productivity.
【０００９】また、本発明の方法においては電気絶縁性
フィルムと離型材の有する弾性率Ｆ、Ｒ及び耐熱性接着
剤付電気絶縁性フィルムと離型材を貼り合わせる際の張
力Ｔｆ，Ｔｒとの間に、0.5 ≦Ｔｒ・Ｆ／（Ｔｆ・Ｒ）
≦3.0 、より好ましくは、0.8≦Ｔｒ・Ｆ／（Ｔｆ・
Ｒ）≦1.5 の関係式の成立することが必要でである。0.
5未満及び3.0 を超えると寸法安定性が悪くなる。Further, in the method of the present invention, the elastic modulus F, R of the electric insulating film and the release material, and the tension Tf, Tr between the electric insulating film with the heat-resistant adhesive and the release material when they are bonded together. And 0.5 ≦ Tr · F / (Tf · R)
≦ 3.0, more preferably 0.8 ≦ Tr · F / (Tf ·
R) ≦ 1.5 must be satisfied. 0.
If it is less than 5 or more than 3.0, the dimensional stability will be poor.
【００１０】上記張力Ｔｆ，Ｔｒを求める方法につい
て、カバーレイフィルムの製造工程略図（図１）に従っ
て説明する。耐熱性接着剤が塗布された電気絶縁性フィ
ルムは、（図１）のインラインドライヤー（11）中で溶
剤が乾燥除去されて、半硬化状態耐熱性接着剤付電気絶
縁性フィルムとなって、ラミネーターロール（12）へ移
送されるが、それに先立ち、テンションロール（15）
上を通過する。テンションロール（15）にはフィルム
の張力検出測定器が備えられており、半硬化状態耐熱性
接着剤付電気絶縁性フィルムがテンションロール（1
5）上を通過するときにテンションロール（15）にか
かる荷重からこの半硬化状態耐熱性接着剤付電気絶縁性
フィルムの張力を検出し、測定する。耐熱性接着剤付電
気絶縁性フィルムの張力Ｔf は下記式（１）から求めら
れる。 半硬化状態耐熱性接着剤付電気絶縁性フィルム張力 Ｔf ＝ ・・・(1) 電気絶縁性フィルムの断面積A method for obtaining the tensions Tf and Tr will be described with reference to a schematic diagram of a cover lay film manufacturing process (FIG. 1). The solvent is dried and removed in the in-line dryer (11) of FIG. 1 (FIG. 1) to form a semi-cured electrical insulating film with a heat-resistant adhesive. Before being transferred to the roll (12), the tension roll (15)
Pass over. The tension roll (15) is equipped with a film tension detecting and measuring device, and the semi-cured electrically insulating film with heat-resistant adhesive is used for the tension roll (1).
5) From the load applied to the tension roll (15) when passing above, the tension of the electrically insulating film with the semi-cured heat-resistant adhesive is detected and measured. The tension Tf of the electrically insulating film with a heat-resistant adhesive is obtained from the following equation (1). Semi-cured state Tension of electrical insulating film with heat-resistant adhesive Tf = ... (1) Cross-sectional area of electrical insulating film
【００１１】離型材は離型材巻出機（13）から巻出され
て、ラミネーターロール（12）へ移送されるが、それに
先立ち、テンションロール（16）上を通過する。テン
ションロール（16）には前記と同様にフィルムの張力
検出測定器が備えられており、半硬化状態耐熱性接着剤
付電気絶縁性フィルムと同様にして離型材の張力が測定
される。離型材の張力Ｔr は下記式（２）から求められ
る。 離型材の張力 Ｔr = ・・・(2) 離型材の断面積The release material is unwound from the release material unwinding machine (13) and transported to the laminator roll (12), but before passing through the tension roll (16). The tension roll (16) is provided with a film tension detecting and measuring device in the same manner as described above, and the tension of the release material is measured in the same manner as in the semi-cured heat-resistant adhesive-attached electrically insulating film. The tension Tr of the release material is obtained from the following equation (2). Release material tension Tr =… (2) Cross-sectional area of release material
【００１２】[0012]
【実施例】以下で、本発明を実施例を挙げて具体的に説
明するが、本発明はこれらに限定されるものではない。EXAMPLES Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.
【００１３】（実施例１）ポリイミドフィルム（厚さ25
μｍ、幅514mm 、商品名カプトン、東レ・デュポン社
製）のロール巻き原反からポリイミドフィルムを繰り出
しながら、ポリイミドフィルム上に、予め調製された耐
熱性接着剤を乾燥後の厚さが25μｍになるようにダイヘ
ッドコーターで塗布し、これを 120℃のインラインドラ
イヤーで10分間加熱して溶剤を除去し、接着剤を半硬化
状態とした。次いでこの半硬化状態の接着剤付きポリイ
ミドフィルムの接着剤塗布面に厚さ 120μｍ、幅520mm
、秤量値110g/cm2の、両面に樹脂コートされたポリエ
チレンコート紙のロール巻き原反より繰り出されたポリ
エチレンコート紙を、下記（表１）に示した張力条件で
加熱ロールで温度70℃、線圧2.0kg/cm、速度 10.0m/min
で圧着し、ロール状に巻き取りカバーレイフィルムを作
製した。半硬化状態の接着剤付ポリイミドフィルムの接
着剤塗布面にポリエチレンコート紙を貼り合わせる際の
半硬化状態の接着剤付きポリイミドフィルムの張力は T
f=0.3kgf/mm2、ポリエチレンコート紙の張力はTr=0.2kg
f/mm2であった。なお、貼り合わせに使用されたポリイ
ミドフィルム及びポリエチレンコート紙の弾性率を（表
１）に示した。得られたカバーレイフィルムについて、
寸法安定性、剥離強度、半田耐熱性の評価及び外観検査
を下記の方法で行い、その結果を（表１）に示した。(Example 1) Polyimide film (thickness 25
μm, width 514 mm, trade name: Kapton, manufactured by Dupont Toray Co., Ltd.) While the polyimide film is being unwound from the roll, the thickness of the prepared heat-resistant adhesive on the polyimide film after drying is 25 μm. It was applied by a die head coater as described above, and heated with an in-line dryer at 120 ° C. for 10 minutes to remove the solvent, and the adhesive was in a semi-cured state. Then, on the adhesive-coated surface of this semi-cured polyimide film with adhesive, a thickness of 120 μm and a width of 520 mm
A polyethylene-coated paper with a weighing value of 110 g / cm 2 , which was unwound from a roll of polyethylene-coated paper resin-coated on both sides, was heated at a temperature of 70 ° C. with a heating roll under tension conditions shown in Table 1 below. Linear pressure 2.0kg / cm, speed 10.0m / min
, And wound up in a roll to form a coverlay film. The tension of the polyimide film with adhesive in the semi-cured state when bonding the polyethylene coated paper to the adhesive-coated surface of the semi-cured polyimide film with adhesive is T
f = 0.3kgf / mm 2 , tension of polyethylene coated paper is Tr = 0.2kg
f / mm 2 . The elastic modulus of the polyimide film and the polyethylene coated paper used for bonding are shown in (Table 1). About the obtained coverlay film,
The dimensional stability, peel strength, solder heat resistance evaluation and appearance inspection were performed by the following methods, and the results are shown in Table 1.
【００１４】（実施例２）カバーレイフィルムの作製に
使用された半硬化状態の接着剤付ポリイミドフィルム及
びポリエチレンコート紙の弾性率が（表１）に示すよう
に異なるものを用いた以外は実施例１と同様の方法で行
った。Example 2 A semi-cured polyimide film with an adhesive and a polyethylene-coated paper used in the production of the coverlay film were manufactured except that the elastic modulus was different as shown in (Table 1). Performed in the same manner as in Example 1.
【００１５】（実施例３〜６）（表１）に記載したよう
な弾性率を有する半硬化状態の接着剤付ポリイミドフィ
ルム及びポリエチレンコート紙を使用し、（表１）に記
載したようなポリイミドフィルム及びポリエチレンコー
ト紙の張力条件でカバーレイフィルムを作製した以外は
実施例１と同様の方法で行った。(Examples 3 to 6) Using a semi-cured polyimide film with an adhesive and a polyethylene-coated paper having an elastic modulus as shown in Table 1 and a polyimide as shown in Table 1 The procedure was performed in the same manner as in Example 1 except that a coverlay film was produced under the tension conditions of the film and the polyethylene-coated paper.
【００１６】（比較例１）（表１）に示すような弾性率
を有するを半硬化状態の接着剤付ポリイミドフィルム及
びポリエチレンコート紙を使用し、（表１）に示すよう
な張力Ｔｆ及び張力Ｔｒの条件とした以外は実施例１と
同様の方法で行った。(Comparative Example 1) Using a polyimide film with an adhesive and a polyethylene-coated paper in a semi-cured state having an elastic modulus as shown in Table 1 and a tension Tf and a tension as shown in Table 1 The procedure was performed in the same manner as in Example 1 except that the condition of Tr was used.
【００１７】（比較例２〜３）（表１）に記載したよう
な弾性率を有する半硬化状態の接着剤付ポリイミドフィ
ルム及びポリエチレンコート紙を使用し、（表１）に示
すような張力Ｔｆ及び張力Ｔｒの条件とした以外は比較
例１と同様の方法でカバーレイフィルムを作製した。(Comparative Examples 2-3) A semi-cured polyimide film with an adhesive and a polyethylene-coated paper having an elastic modulus as described in Table 1 were used, and a tension Tf as shown in Table 1 was used. A coverlay film was produced in the same manner as in Comparative Example 1 except that the conditions of the tension and the tension Tr were used.
【００１８】〔各物性の評価用サンプルの作製方法〕 （寸法安定性評価用サンプルの作製）カバーレイフィル
ムの四隅にパンチで５mmφの穴をあけたものを用いた。 （カール性評価用サンプルの作製）巻き取ったロール状
のカバーレイフィルムから25cm四方のサンプルを切り取
ったものを用いた。 （剥離強度、半田耐熱性評価用サンプルの作製）カバー
レイフィルムの離型材を剥がし、接着剤塗布面とＪＴＣ
箔（ジャパンエナジー社製電解銅箔商品名）の光沢面と
を 160℃×50kg/cm2の条件で30分間加熱圧着し、得られ
る電気絶縁性フィルム、耐熱性接着剤層、電解銅箔から
なる積層体を用いた。[Preparation of Samples for Evaluation of Physical Properties] (Preparation of Samples for Evaluation of Dimensional Stability) A coverlay film having punched holes of 5 mmφ at four corners was used. (Preparation of curl property evaluation sample) A 25 cm square sample cut from a rolled cover lay film was used. (Preparation of Samples for Evaluation of Peeling Strength and Solder Heat Resistance) The release material of the coverlay film was peeled off, and the adhesive-coated surface and JTC
The hot surface of the foil (product name of electrolytic copper foil manufactured by Japan Energy Co., Ltd.) is heated and pressed at 160 ° C x 50 kg / cm 2 for 30 minutes. Was used.
【００１９】〔各物性の評価方法〕ここで、（表１）に
記されているポリイミドフィルム及びポリエチレンコー
ト紙の弾性率の測定方法は20℃湿度60%ARHの環境下でAS
TM D 882に準拠して測定されたものである。 （寸法安定性［％］）IPC FC 241 に準拠し、カバーレ
イフィルムの離型材を剥がす前後の寸法を測定し、下記
式により寸法安定性を測定した。 寸法安定性［％］＝｛（離型材剥離後の寸法−離型材剥
離前の寸法）／離型材剥離前の寸法｝×100 （−
％：収縮、＋％：伸び） （剥離強度[kg/cm] ）JIS C 6471 に準拠し10mm幅にカ
ットしたサンプルを90度方向に50mm/minの速度で銅箔側
から引剥がしその強度を測定した。 （半田耐熱性［℃］）JIS C 6481 に準拠し、20℃、60
％RHの雰囲気で24時間保存したサンプルを25mm角にカッ
トし、これを半田浴上に30秒間浮かべた後、外観を目視
で検査し、フクレ・ハガレ等が生じない最高温度を測定
した。 （外観検査） 《カールの発生》カバーレイフィルムのサンプルの４隅
の４点のカール（平面上に置いたときの高さ）を測定
し、４点の高さの平均値を算出し以下の基準で評価し
た。 ○：４点の平均値が０mm以上５mm以下 △：４点の平均値が５mmを超え10mm以下 ×：４点の平均値が10mmを超えたもの 《シワの発生》カバーレイフィルムを作製する際の電気
絶縁性フィルム、離型材、カバーレイフィルムの表面を
目視により観察してシワの発生の有無を調べた。 ○：シワの発生なし ×：シワの発生あり[Evaluation method of each physical property] Here, the method of measuring the elastic modulus of the polyimide film and the polyethylene-coated paper described in (Table 1) was measured at 20 ° C. and 60% ARH under an environment of 60% ARH.
It is measured according to TM D882. (Dimensional stability [%]) According to IPC FC241, the dimensions before and after the release material of the coverlay film was peeled off were measured, and the dimensional stability was measured by the following formula. Dimensional stability [%] = {(dimension after release material release-dimension before release material release) / dimension before release material release} x 100 (-
%: Shrinkage, +%: elongation) (Peel strength [kg / cm]) A sample cut to a width of 10 mm in accordance with JIS C 6471 is peeled off from the copper foil side at a speed of 50 mm / min in the direction of 90 degrees and the strength is measured. It was measured. (Solder heat resistance [℃]) Conforms to JIS C 6481, 20 ℃, 60 ℃
A sample stored for 24 hours in an atmosphere of% RH was cut into a 25 mm square, and the sample was floated on a solder bath for 30 seconds. Then, the appearance was visually inspected, and the maximum temperature at which blistering and peeling did not occur was measured. (Appearance Inspection) << Occurrence of Curl >> The curl (height when placed on a plane) at the four corners of the coverlay film sample was measured, and the average of the heights of the four points was calculated. Evaluation was based on criteria. ：: The average value of 4 points is 0 mm or more and 5 mm or less △: The average value of 4 points is more than 5 mm and 10 mm or less ×: The average value of 4 points is more than 10 mm << Wrinkling >> When producing a coverlay film The surfaces of the electrically insulating film, release material and cover lay film were visually inspected for wrinkles. ○: No wrinkles were generated ×: Wrinkles were generated
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【発明の効果】本発明によって良好な接着性、耐熱性を
有し且つ、優れた寸法安定性を有するカバーレイフィル
ムを製造することができる。このカバーレイフィルムを
フレキシブル印刷配線板に実装する際、離型材を電気絶
縁性フィルムから剥したとき、電気絶縁性フィルムが収
縮しないので、実装の作業性が良好となり、フレキシブ
ル印刷配線板の生産性、歩留まりが向上するので、本発
明の実用上の利用価値は極めて高い。According to the present invention, a coverlay film having good adhesiveness and heat resistance and excellent dimensional stability can be produced. When the coverlay film is mounted on a flexible printed wiring board, when the release material is peeled off from the electrically insulating film, the electric insulating film does not shrink, so that the mounting workability is improved and the productivity of the flexible printed wiring board is improved. Since the yield is improved, the practical use value of the present invention is extremely high.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明のカバーレイフィルムの製造方法を説明
する工程の一例の略図である。FIG. 1 is a schematic view of an example of a process for explaining a method for producing a coverlay film of the present invention.
（11）インラインドライヤー、 （12）ラミネーターロール、 （13）離型材巻出機、 （14）カバーレイフィルム巻取機、 （15）テンションロール（15）、 （16）テンションロール（16）、 （17）半硬化状態耐熱性接着剤付電気絶縁性フィルム、 （18）離型材、 （19）カバーレイフィルム。 (11) Inline dryer, (12) Laminator roll, (13) Release material unwinder, (14) Coverlay film winder, (15) Tension roll (15), (16) Tension roll (16), ( 17) Semi-cured heat insulating film with heat-resistant adhesive, (18) Release material, (19) Coverlay film.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 栄口 吉次 茨城県鹿島郡神栖町大字東和田１番地 信 越化学工業株式会社塩ビ技術研究所内 Ｆターム(参考） 4J004 AA05 AA10 AA12 AA13 AA15 AA16 CA06 CC02 DA02 DA04 DB02 FA04 FA05 5E314 AA36 CC15 FF06 GG24 5G333 AA03 AB13 AB21 BA03 CB08 CB20 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yoshiji Sakaguchi 1-family Towada, Kamisu-cho, Kashima-gun, Ibaraki Pref. CC02 DA02 DA04 DB02 FA04 FA05 5E314 AA36 CC15 FF06 GG24 5G333 AA03 AB13 AB21 BA03 CB08 CB20
Claims (1)
ルムからなるカバーレイフィルムにおいて、弾性率Ｆ[k
gf/mm2] が 100≦Ｆ≦1,000 である電気絶縁性フィルム
及び弾性率Ｒ[kgf/mm2] が50≦Ｒ≦500 である離型材を
用い、耐熱性接着剤付電気絶縁性フィルムと離型材とを
貼り合わせる際の電気絶縁性フィルムの張力Ｔｆ[kgf/m
m2] 及び離型材の張力Ｔｒ[kgf/mm2] が、 0.1≦Ｔｆ，
Ｔｒ≦2.0であり且つ弾性率Ｆ，Ｒ及び張力Ｔｆ，Ｔｒ
との間に下記の関係式が成立することを特徴とする寸法
安定性に優れたカバーレイフィルムの製造方法。 0.5≦Ｔｒ・Ｆ／（Ｔｆ・Ｒ）≦3.01. A coverlay film composed of a release material / a heat-resistant adhesive / an electrically insulating film, wherein an elastic modulus F [k
gf / mm 2 ] of 100 ≦ F ≦ 1,000 and a release material having an elastic modulus R [kgf / mm 2 ] of 50 ≦ R ≦ 500, using an electrically insulating film with a heat-resistant adhesive. The tension Tf [kgf / m of the electrically insulating film when bonding with the release material
m 2 ] and the tension Tr [kgf / mm 2 ] of the release material are 0.1 ≦ Tf,
Tr ≦ 2.0 and elastic moduli F, R and tensions Tf, Tr
And a method for producing a coverlay film having excellent dimensional stability, wherein the following relational expression is satisfied. 0.5 ≦ Tr · F / (Tf · R) ≦ 3.0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17687099A JP3776259B2 (en) | 1999-06-23 | 1999-06-23 | Method for producing coverlay film with excellent dimensional stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17687099A JP3776259B2 (en) | 1999-06-23 | 1999-06-23 | Method for producing coverlay film with excellent dimensional stability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001003020A true JP2001003020A (en) | 2001-01-09 |
| JP3776259B2 JP3776259B2 (en) | 2006-05-17 |
Family
ID=16021245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17687099A Expired - Fee Related JP3776259B2 (en) | 1999-06-23 | 1999-06-23 | Method for producing coverlay film with excellent dimensional stability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3776259B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010522354A (en) * | 2007-03-19 | 2010-07-01 | ホワイト エレクトロニック デザインズ コーポレイション | Enhancement liquid crystal display system and method |
| JP2012212011A (en) * | 2011-03-31 | 2012-11-01 | Dainippon Printing Co Ltd | Method for manufacturing optical sheet |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101032208B1 (en) | 2011-02-17 | 2011-05-02 | 손경춘 | Multi layer film for forming cover layer using carrier film and method of forming cover layer on printed circuit board using the multi layer film |
-
1999
- 1999-06-23 JP JP17687099A patent/JP3776259B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010522354A (en) * | 2007-03-19 | 2010-07-01 | ホワイト エレクトロニック デザインズ コーポレイション | Enhancement liquid crystal display system and method |
| US9348167B2 (en) | 2007-03-19 | 2016-05-24 | Via Optronics Gmbh | Enhanced liquid crystal display system and methods |
| JP2012212011A (en) * | 2011-03-31 | 2012-11-01 | Dainippon Printing Co Ltd | Method for manufacturing optical sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3776259B2 (en) | 2006-05-17 |
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