JP2001000931A - Method and system for supplying chemical liquid and apparatus for cleaning substrate - Google Patents

Method and system for supplying chemical liquid and apparatus for cleaning substrate

Info

Publication number
JP2001000931A
JP2001000931A JP11177434A JP17743499A JP2001000931A JP 2001000931 A JP2001000931 A JP 2001000931A JP 11177434 A JP11177434 A JP 11177434A JP 17743499 A JP17743499 A JP 17743499A JP 2001000931 A JP2001000931 A JP 2001000931A
Authority
JP
Japan
Prior art keywords
solution
chemical
liquid
supply
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11177434A
Other languages
Japanese (ja)
Inventor
Yoshiaki Yamaguchi
嘉昭 山口
Takehisa Nitta
雄久 新田
Masahiro Miki
正博 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UCT Corp
Original Assignee
UCT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UCT Corp filed Critical UCT Corp
Priority to JP11177434A priority Critical patent/JP2001000931A/en
Publication of JP2001000931A publication Critical patent/JP2001000931A/en
Pending legal-status Critical Current

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Landscapes

  • Details Of Reciprocating Pumps (AREA)
  • Reciprocating Pumps (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To formulate a supply liquid (cleaning liquid) of an exact chemical liquid concentration, especially an extremely low concentration, simply and promptly as required and to supply the liquid. SOLUTION: A chemical liquid supply system 2 is composed of a dilute solution supply part 2a which has a chemical liquid storage tank in which a chemical liquid for cleaning is stored in a raw liquid state and a liquid supply pump, supplies the chemical liquid positively, and produces a dilute solution of a concentration of an intermediate stage and a cleaning liquid supply part 2b which has a dilute solution storage tank for storing the dilute solution supplied from the part 2a and a liquid supply pump 31b, supplies the dilute solution positively, produces a cleaning liquid of an extremely low concentration (ppm ordor) of a final stage, and supplies it to a wafer 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、薬液を所望量だけ
正確に供給する薬液供給システム及び方法に関し、特に
半導体ウェハ等を洗浄する基板洗浄装置に適用して好適
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical solution supply system and method for accurately supplying a desired amount of a chemical solution, and is particularly suitable for use in a substrate cleaning apparatus for cleaning semiconductor wafers and the like.

【0002】[0002]

【従来の技術】従来、半導体ウエットプロセスにおいて
は、超純水や薬液からなる洗浄液により洗浄等の処理を
行う基板洗浄装置が用いられる。このような基板洗浄装
置としては、基板毎に装着し、当該基板を円周方向に回
転させながら洗浄液を供給する基板枚葉スピン洗浄装置
が注目されている。
2. Description of the Related Art Conventionally, in a semiconductor wet process, a substrate cleaning apparatus for performing processing such as cleaning with a cleaning liquid composed of ultrapure water or a chemical solution is used. As such a substrate cleaning apparatus, a single-substrate spin cleaning apparatus which is attached to each substrate and supplies a cleaning liquid while rotating the substrate in a circumferential direction has attracted attention.

【0003】[0003]

【発明が解決しようとする課題】従来の基板洗浄装置で
は、洗浄に必要な各種薬液を所望の濃度で用意しておく
ための複数の大型の洗浄液貯蔵タンクを設けることが必
須とされていた。従ってこの場合、装置全体としては必
然的に極めて大規模且つ複雑なものとなる。
In the conventional substrate cleaning apparatus, it is essential to provide a plurality of large-sized cleaning liquid storage tanks for preparing various chemical solutions required for cleaning at desired concentrations. Therefore, in this case, the whole apparatus is necessarily extremely large-scale and complicated.

【0004】また、洗浄液としても、各種濃度のものが
必要であり、特に極低濃度の希釈洗浄液が必須とされて
いる。このような極低濃度から低濃度までの値、例えば
ppmから0.1%までの低濃度の洗浄液を正確に生成
して供給するには、低濃度となるほど薬液(原液)を極
めて正確に秤量することが不可欠となり、濃度管理が困
難となる。このためには、必然的に極めて大規模且つ複
雑な装置が必須となるとともに、薬液を所望の極低濃度
に希釈するために極めて精緻且つ煩雑な作業が要求され
る。
[0004] Further, various concentrations of cleaning liquids are required, and a dilute cleaning liquid having an extremely low concentration is particularly indispensable. In order to accurately generate and supply such a cleaning solution having a low concentration from a very low concentration to a low concentration, for example, a low concentration from ppm to 0.1%, the lower the concentration, the more accurately the chemical solution (stock solution) is weighed. It is indispensable to perform the concentration control. To this end, an extremely large-scale and complicated device is inevitably required, and extremely elaborate and complicated work is required to dilute the chemical solution to a desired extremely low concentration.

【0005】このように現在のところ、基板洗浄装置の
装置全体の大規模化や複雑化を避けることは困難であ
り、洗浄液へのパーティクル混入の防止や容易且つ正確
な極低濃度の希釈洗浄液の生成を可能とする技術の確立
が強く望まれている現況にある。
As described above, at present, it is difficult to avoid an increase in the size and complexity of the entire substrate cleaning apparatus, to prevent particles from being mixed into the cleaning liquid, and to easily and accurately use a very low-concentration diluted cleaning liquid. There is a strong demand for the establishment of a technology that enables generation.

【0006】そこで本発明の目的は、薬液等の貯蔵槽を
含む洗浄液供給系の大幅な小型化・簡易化を図るととも
に、必要なときに正確な薬液濃度、特に極低濃度の供給
液(洗浄液)を簡易且つ迅速に調合し供給することを可
能とする薬液供給システム及び方法、並びに基板洗浄装
置を提供することにある。
Accordingly, an object of the present invention is to significantly reduce the size and simplification of a cleaning liquid supply system including a storage tank for a chemical liquid or the like, and to provide a correct concentration of a chemical liquid when necessary, particularly, a supply liquid having a very low concentration (cleaning liquid). It is an object of the present invention to provide a chemical solution supply system and method, and a substrate cleaning apparatus, which enable simple and quick preparation and supply of a chemical solution.

【0007】[0007]

【課題を解決するための手段】本発明の薬液供給システ
ムは、少なくとも1種の薬液が溶媒に混合希釈され、最
終的な所定の薬液濃度に調節された供給液を供給する薬
液供給システムであって、高濃度の前記薬液が貯蔵され
る第1の貯蔵槽と、所定量の前記薬液を前記第1の貯蔵
槽から吸引して送出する第1の供給手段と、前記第1の
供給手段が連結された前記溶媒の流路を形成し、前記薬
液が前記溶媒に混合希釈されて前記供給液より高い所定
の薬液濃度に調節されてなる希釈溶液を吐出する第1の
吐出部を有する第1の配管系と、前記希釈溶液が貯蔵さ
れる第2の貯蔵槽と、所定量の前記希釈溶液を前記第2
の貯蔵槽から吸引して送出する第2の供給手段と、前記
第2の供給手段が連結された前記溶媒の流路を形成し、
前記希釈溶液が前記溶媒に更に混合希釈され濃度調節さ
れた前記供給液を吐出する第2の吐出部を有する第2の
配管系とを備え、前記第1の供給手段の駆動により必要
量の前記薬液を前記第1の配管系内を流動する前記溶媒
に混合させて前記希釈溶液を生成して、前記希釈溶液を
前記第1の吐出部から吐出して前記第2の貯蔵槽に貯蔵
しておき、前記第2の供給手段の駆動により必要量の前
記希釈溶液を前記第2の配管系内を流動する前記溶媒に
混合させて所望濃度の前記供給液を生成して前記第2の
吐出部から供給する。
A chemical solution supply system according to the present invention is a chemical solution supply system for mixing and diluting at least one kind of chemical solution with a solvent and supplying a final adjusted solution concentration to a predetermined chemical solution. A first storage tank in which the high-concentration chemical solution is stored, a first supply unit that suctions and sends a predetermined amount of the chemical solution from the first storage tank, and the first supply unit. A first discharge unit that forms a connected flow path of the solvent, and has a first discharge unit that discharges a diluted solution obtained by mixing and diluting the chemical solution with the solvent and adjusting the concentration to a predetermined chemical solution concentration higher than the supply liquid; A second storage tank in which the diluted solution is stored, and a predetermined amount of the diluted solution stored in the second storage tank.
A second supply means for sucking and sending out from the storage tank, and forming a flow path of the solvent to which the second supply means is connected,
A second piping system having a second discharge unit that discharges the supply liquid whose concentration is adjusted by further mixing and diluting the diluting solution with the solvent, and driving the first supply unit to supply a required amount of the second liquid. A chemical solution is mixed with the solvent flowing in the first piping system to generate the diluted solution, and the diluted solution is discharged from the first discharge unit and stored in the second storage tank. And a required amount of the diluting solution is mixed with the solvent flowing in the second piping system by driving the second supply means to generate the supply liquid having a desired concentration, and the second discharge unit Supplied from

【0008】本発明の薬液供給システムは、少なくとも
1種の薬液が溶媒に混合希釈され、最終的な所定の薬液
濃度に調節された供給液を供給する薬液供給システムで
あって、高濃度の前記薬液が貯蔵される第1の貯蔵漕
と、所定量の前記薬液を前記第1の貯蔵漕から吸引して
送出する第1の供給手段と、前記第1の供給手段から送
出された前記薬液を前記溶媒で混合希釈して前記供給液
より高い所定の薬液濃度に調節されてなる希釈溶液が貯
蔵される第2の貯蔵漕と、所定量の前記希釈溶液を前記
第2の貯蔵漕から吸引して送出する第2の供給手段と、
前記第2の供給手段が連結された前記溶媒の流路を形成
し、前記希釈溶液が前記溶媒に更に混合希釈され濃度調
節された前記供給液を端部から吐出する配管系とを備
え、前記第1及び第2の供給手段の駆動により、前記第
1及び第2の貯蔵槽を用いて前記薬液の段階的な希釈を
行って生成した所定濃度の前記供給液を供給する。
[0008] A chemical solution supply system of the present invention is a chemical solution supply system for mixing and diluting at least one kind of chemical solution with a solvent to supply a supply solution adjusted to a final predetermined chemical solution concentration. A first storage tank in which a drug solution is stored, a first supply unit that sucks a predetermined amount of the drug solution from the first storage tank and sends out the solution, and a drug solution that is sent from the first supply unit. A second storage tank in which a diluted solution prepared by mixing and diluting with the solvent and adjusting to a predetermined chemical solution concentration higher than the supply liquid is stored, and a predetermined amount of the diluted solution is sucked from the second storage tank. Second supply means for transmitting
A pipe system configured to form a flow path of the solvent to which the second supply means is connected, and to discharge the supply liquid whose concentration is adjusted by further mixing and diluting the diluted solution with the solvent from an end portion, By driving the first and second supply means, the supply liquid having a predetermined concentration generated by performing stepwise dilution of the chemical liquid using the first and second storage tanks is supplied.

【0009】本発明の薬液供給システムの一態様は、前
記第1の供給手段が連結された前記溶媒の流路を形成
し、前記流路内で前記溶媒と混合希釈した前記希釈溶液
を前記第2の貯蔵槽に吐出する他の配管系を備える。
In one embodiment of the chemical solution supply system according to the present invention, a flow path of the solvent connected to the first supply means is formed, and the diluted solution mixed and diluted with the solvent in the flow path is supplied to the first solution. 2 is provided with another piping system for discharging to the storage tank.

【0010】本発明の薬液供給システムの一態様は、前
記溶媒の流路を形成し、前記溶媒を前記第2の貯蔵槽に
吐出する他の配管系を備え、前記第2の貯蔵槽内で前記
薬液を前記溶媒で混合希釈し、前記希釈溶液を生成す
る。
[0010] One embodiment of the chemical solution supply system of the present invention is provided with another piping system for forming the flow path of the solvent and discharging the solvent to the second storage tank. The chemical solution is mixed and diluted with the solvent to generate the diluted solution.

【0011】本発明の薬液供給システムの一態様におい
て、前記第1及び第2の供給手段は、前記希釈溶液及び
前記薬液を通過させる流路が形成され、前記流路の流入
口に前記希釈溶液及び前記薬液の圧力上昇により閉じる
吸引弁が、前記流路の流出口に前記希釈溶液及び前記薬
液の圧力下降により閉じる吐出弁がそれぞれ設けられて
なる液供給ポンプであって、前記流路における接液面の
少なくとも一部が前記薬液に対する不透過性且つ高耐蝕
性の緻密部材からなるとともに、前記緻密部材の一部が
可動壁とされており、前記可動壁と連結する加振器を備
え、前記加振器の駆動により前記可動壁をその壁面とほ
ぼ直交する方向に振動させて前記流路の体積を周期的に
変化させるものである。
In one embodiment of the chemical liquid supply system according to the present invention, the first and second supply means are provided with a flow path for passing the dilute solution and the chemical liquid, and the diluent solution is provided at an inlet of the flow path. A liquid supply pump in which a suction valve that closes due to a rise in the pressure of the chemical solution is provided with a discharge valve that closes due to a decrease in the pressure of the diluting solution and the chemical solution at an outlet of the flow path, At least a part of the liquid surface is made of a dense member that is impervious to the chemical solution and has high corrosion resistance, and a part of the dense member is a movable wall, including a vibrator connected to the movable wall, By driving the vibrator, the movable wall is vibrated in a direction substantially orthogonal to the wall surface to periodically change the volume of the flow path.

【0012】本発明の薬液供給システムの一態様は、前
記各配管系と前記各供給手段とを連結する各連結流路を
備え、前記各連結流路内に前記各配管系と直接連結し、
前記薬液又は前記希釈溶液の前記溶媒への吐出部位とな
る細管部材が設けられている。
One embodiment of the chemical liquid supply system according to the present invention includes connection paths for connecting the respective piping systems and the respective supply means, and is directly connected to the respective piping systems in the respective connection paths.
A thin tube member is provided as a discharge site of the chemical solution or the diluted solution to the solvent.

【0013】本発明の薬液供給システムの一態様は、供
給する前記供給液を調節するための制御系を備える。
One embodiment of the chemical solution supply system of the present invention includes a control system for adjusting the supply solution to be supplied.

【0014】本発明の薬液供給システムの一態様は、前
記第1の貯蔵槽に設けられ、前記薬液の貯蔵量を測定し
て前記第2の貯蔵槽の前記希釈溶液の薬液濃度を算出す
る第1の濃度測定手段と、前記第2の貯蔵槽に設けら
れ、前記希釈溶液の貯蔵量を測定して前記供給液の薬液
濃度を算出する第2の濃度測定手段とを備える。
[0014] One embodiment of the chemical solution supply system according to the present invention is provided in the first storage tank, wherein the storage amount of the chemical solution is measured to calculate the chemical concentration of the diluted solution in the second storage tank. And a second concentration measuring means provided in the second storage tank and measuring a storage amount of the diluted solution to calculate a chemical concentration of the supply liquid.

【0015】本発明の薬液供給システムの一態様は、前
記第1の貯蔵槽に設けられ、前記薬液の貯蔵量を測定し
て前記第2の貯蔵槽の前記希釈溶液の薬液濃度を算出す
る第1の濃度測定手段と、前記第2の貯蔵槽に設けら
れ、前記希釈溶液の貯蔵量を測定して前記供給液の薬液
濃度を算出する第2の濃度測定手段とを備え、前記制御
系は、前記第1の濃度測定手段による前記希釈溶液の薬
液濃度の算出値及び前記第2の濃度測定手段による前記
供給液の薬液濃度の算出値を参照して前記第2の供給手
段を駆動制御し、前記第2の供給手段からの前記希釈溶
液の吐出量及び吐出速度を調節して前記供給液の薬液濃
度を目的値に制御する。
One embodiment of the chemical solution supply system of the present invention is provided in the first storage tank, wherein the storage amount of the chemical solution is measured to calculate the chemical concentration of the diluted solution in the second storage tank. A second concentration measuring means provided in the second storage tank and measuring a storage amount of the diluted solution to calculate a chemical concentration of the supply liquid; Controlling the drive of the second supply means with reference to the calculated value of the chemical concentration of the diluted solution by the first concentration measuring means and the calculated value of the chemical concentration of the supply liquid by the second concentration measuring means. The discharge amount and discharge speed of the diluted solution from the second supply means are adjusted to control the chemical concentration of the supply liquid to a target value.

【0016】本発明の薬液供給システムの一態様におい
て、前記第1及び第2の濃度測定手段は、導電性部材、
或いはフッ素樹脂などにより絶縁被覆された部材からな
る一対の棒状センサを有し、前記棒状センサの前記薬液
内及び前記希釈溶液内への浸漬部位の電気容量及びその
時間変化を測定することにより、前記薬液及び前記希釈
溶液の液面高さ及びその変化速度を得て、前記薬液濃度
を算出する液位計である。
In one embodiment of the chemical solution supply system according to the present invention, the first and second concentration measuring means include a conductive member,
Alternatively, it has a pair of rod-shaped sensors made of a member that is insulated and coated with a fluororesin or the like, and by measuring the electric capacity of the immersion part in the chemical solution and the diluting solution of the rod-shaped sensor and its time change, This is a liquid level meter that obtains the liquid surface heights of a chemical solution and the dilute solution and the rate of change thereof to calculate the chemical solution concentration.

【0017】本発明の薬液供給システムの一態様におい
て、前記第1及び第2の濃度測定手段は、前記薬液及び
前記希釈溶液の重量及びその変化を測定し、前記薬液濃
度を算出する重量計である。
In one embodiment of the chemical solution supply system of the present invention, the first and second concentration measuring means measure the weights of the chemical solution and the dilute solution and changes thereof, and calculate the concentration of the chemical solution by a weighing scale. is there.

【0018】本発明の基板洗浄装置は、設置された基板
に洗浄液を供給して洗浄する基板洗浄装置であって、前
記薬液供給システムを備え、前記供給液を前記洗浄液と
して用いる。
A substrate cleaning apparatus according to the present invention is a substrate cleaning apparatus for supplying a cleaning liquid to an installed substrate and cleaning the substrate, comprising the chemical liquid supply system, and using the supply liquid as the cleaning liquid.

【0019】本発明の薬液供給方法は、少なくとも1種
の薬液が溶媒に混合希釈され、最終的な所定の薬液濃度
に調節された供給液を供給する薬液供給方法であって、
第1の供給手段の駆動により前記薬液が貯蔵された第1
の貯蔵槽から必要量の前記薬液を第1の配管系内を流動
する前記溶媒に混合希釈し、前記供給液より高い所定の
薬液濃度に調節されてなる希釈溶液を生成して、前記希
釈溶液を第2の貯蔵槽に貯蔵しておき、第2の供給手段
の駆動により前記第2の貯蔵槽から必要量の前記希釈溶
液を第2の配管系内を流動する前記溶媒に更に混合希釈
し、所定の薬液濃度の前記供給液を生成して供給する。
The chemical solution supply method of the present invention is a chemical solution supply method for mixing and diluting at least one kind of chemical solution with a solvent and supplying a supply solution adjusted to a final predetermined chemical solution concentration,
By driving the first supply means, the first liquid in which the chemical is stored
Mixing and diluting a required amount of the chemical solution from the storage tank with the solvent flowing in the first piping system to generate a dilute solution adjusted to a predetermined chemical solution concentration higher than the supply liquid; Is stored in a second storage tank, and a required amount of the diluting solution is further mixed and diluted from the second storage tank with the solvent flowing in a second piping system by driving a second supply unit. Then, the supply liquid having a predetermined chemical concentration is generated and supplied.

【0020】本発明の薬液供給方法の一態様において、
前記第1及び第2の供給手段は、前記希釈溶液及び前記
薬液を通過させる流路が形成され、前記流路の流入口に
前記希釈溶液及び前記薬液の圧力上昇により閉じる吸引
弁が、前記流路の流出口に前記希釈溶液及び前記薬液の
圧力下降により閉じる吐出弁がそれぞれ設けられてなる
液供給ポンプであって、前記流路における接液面の少な
くとも一部が前記薬液に対する不透過性且つ高耐蝕性の
緻密部材からなるとともに、前記緻密部材の一部が可動
壁とされており、前記可動壁と連結する加振器を備え、
前記加振器の駆動により前記可動壁をその壁面とほぼ直
交する方向に振動させて前記流路の体積を周期的に変化
させるものである。
In one embodiment of the method for supplying a chemical solution according to the present invention,
The first and second supply means are formed with a flow path through which the diluted solution and the chemical solution pass, and a suction valve that closes at an inlet of the flow path due to an increase in the pressure of the diluted solution and the chemical solution, the suction valve closes the flow path. A liquid supply pump in which a discharge valve that is closed by a pressure drop of the diluting solution and the chemical solution is provided at an outlet of a path, wherein at least a part of a liquid contact surface in the flow path is impermeable to the chemical solution and A high-corrosion dense member is provided, and a part of the dense member is a movable wall, and includes a vibrator connected to the movable wall,
By driving the vibrator, the movable wall is vibrated in a direction substantially orthogonal to the wall surface to periodically change the volume of the flow path.

【0021】[0021]

【作用】本発明の薬液供給システムにおいては、第1及
び第2の供給手段の駆動により供給流路を通過する超純
水を代表とする溶媒に例えば細管部材から薬液を混合す
るものであり、種々の濃度の供給液を必要に応じて容易
に調合することができる。ここで、薬液の吐出方向が前
記溶媒の流動方向とほぼ直交する方向である場合には、
細管部材から吐出する薬液の線速度が供給流路を通過す
る溶媒の線速度より望ましくは大きくなるような押圧を
薬液に与えることにより、薬液が溶媒内で均一な所望濃
度の供給液が容易に調合されることになる。
In the chemical liquid supply system according to the present invention, the chemical liquid is mixed, for example, from a thin tube member into a solvent typified by ultrapure water passing through the supply flow path by driving the first and second supply means. Feed solutions of various concentrations can be easily prepared as needed. Here, when the discharge direction of the chemical solution is a direction substantially orthogonal to the flow direction of the solvent,
By applying a pressure to the chemical liquid such that the linear velocity of the chemical liquid discharged from the thin tube member is desirably greater than the linear velocity of the solvent passing through the supply channel, the supply liquid having a uniform desired concentration in the solvent can be easily formed. Will be compounded.

【0022】最終的に必要な薬液濃度が極低濃度から低
濃度までの値(例えばppmから0.1%までの低濃
度)である場合、先ず第1の供給手段の駆動により必要
量の薬液を第1の貯蔵槽から吸引して第1の配管系内を
通過する溶媒に送出する。ここで薬液が第1段階の所定
濃度に希釈され、中間濃度の希釈溶液となって第2の貯
蔵槽に蓄えられる。続いて、第2の供給手段の駆動によ
り必要量の希釈溶液を第2の貯蔵槽から吸引して第2の
配管系内を通過する溶媒に送出する。ここで希釈溶液が
第2段階(最終段階)の所定濃度に希釈され、例えば基
板に洗浄液として供給される。このように、各段階の薬
液濃度調整がそれぞれ各供給手段の正確な駆動により高
精度にきめ細かく行なわれるため、最終的に必要な供給
液(洗浄液)が極低濃度であっても正確に生成すること
が可能となる。
When the finally required concentration of the chemical solution is a value from an extremely low concentration to a low concentration (for example, a low concentration from ppm to 0.1%), the required amount of the chemical solution is first driven by driving the first supply means. Is sucked from the first storage tank and delivered to the solvent passing through the first piping system. Here, the chemical solution is diluted to a predetermined concentration in the first stage, and is stored in the second storage tank as a dilute solution having an intermediate concentration. Subsequently, a required amount of the diluted solution is sucked from the second storage tank by the driving of the second supply means, and is sent to the solvent passing through the second piping system. Here, the diluted solution is diluted to a predetermined concentration in the second stage (final stage) and supplied to, for example, a substrate as a cleaning liquid. As described above, the chemical solution concentration adjustment at each stage is performed precisely and precisely by the precise driving of each supply unit, so that even if the finally required supply solution (cleaning solution) has an extremely low concentration, it is accurately generated. It becomes possible.

【0023】第1及び第2の供給手段としては液供給ポ
ンプが好適である。この液供給ポンプは、加振器により
可動壁を駆動制御して振動させ、その押圧により薬液を
吐出するものであり、所望量の薬液を正確に吐出供給す
ることができる。ここで、接液面の少なくとも一部が薬
液に対する不透過性且つ高耐蝕性の緻密部材、好ましく
はアモルファスカーボンを用いる。このアモルファスカ
ーボンは、その気孔率の制御が容易な材料であり、気孔
率をほぼ0のものは極めて優れた不透過性且つ高耐蝕性
を示す。従って、このアモルファスカーボンを接液面の
重要部分に設けることにより、薬液の供給量制御がより
正確となり、しかもパーティクル等の薬液内への混入が
抑止される。また、アモルファスカーボンの代わりにフ
ッ素樹脂材料を用いても薬液の種類によっては、十分実
用に供することができる。
As the first and second supply means, a liquid supply pump is suitable. The liquid supply pump drives and vibrates the movable wall by a vibrator, and discharges a chemical liquid by pressing the movable wall. The liquid supply pump can discharge and supply a desired amount of the chemical liquid accurately. Here, at least a part of the liquid contact surface is made of a dense member that is impermeable to the chemical solution and has high corrosion resistance, preferably amorphous carbon. This amorphous carbon is a material whose porosity can be easily controlled, and those having a porosity of almost 0 exhibit extremely excellent impermeability and high corrosion resistance. Therefore, by providing this amorphous carbon in an important part of the liquid contact surface, the supply amount control of the chemical solution becomes more accurate, and the mixing of particles and the like into the chemical solution is suppressed. Further, even if a fluorine resin material is used instead of amorphous carbon, it can be practically used depending on the type of the chemical.

【0024】また、この薬液供給システムでは、上述の
ように必要に応じた所望濃度の供給液の生成が可能であ
るため、原液である薬液の第1の貯蔵槽や希釈溶液の第
2の貯蔵槽は共に移動容易な小型のもので足りる。即
ち、従来のように薬液濃度や種類の異なる極めて大型の
供給液の貯蔵槽を用意する必要がなく、所望の極低濃度
の供給液生成が容易となり、供給液へのパーティクル混
入等を抑止できるのみならず、システム全体の規模の大
幅な縮小化・簡易化が実現される。従って、この薬液供
給システムを例えば基板洗浄装置に適用することによ
り、濃度や種類の異なる種々の清浄な洗浄液を迅速且つ
容易に供給することが可能となる。
Further, in this chemical supply system, a supply liquid having a desired concentration can be generated as required as described above, so that the first storage tank for the chemical liquid as a stock solution and the second storage for the diluted solution are prepared. Both tanks need to be small and easy to move. That is, it is not necessary to prepare a storage tank for a very large supply liquid having a different concentration or type of chemical solution as in the related art, and it becomes easy to generate a supply liquid of a desired extremely low concentration, and it is possible to prevent particles from being mixed into the supply liquid. Not only that, the scale of the entire system can be significantly reduced and simplified. Therefore, by applying this chemical liquid supply system to, for example, a substrate cleaning apparatus, it becomes possible to quickly and easily supply various clean cleaning liquids having different concentrations and types.

【0025】[0025]

【発明の実施の形態】以下、本発明の基板洗浄装置の具
体的な実施形態について図面を参照しながら詳細に説明
する。本実施形態の基板洗浄装置は、ウェハ毎に装着
し、当該ウェハを円周方向に回転させながら洗浄液を供
給するものであり、半導体ウェハ等のウェット洗浄プロ
セスにおいて広範囲の機能を実現できるウェハ枚葉スピ
ン洗浄装置である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a specific embodiment of the substrate cleaning apparatus of the present invention will be described in detail with reference to the drawings. The substrate cleaning apparatus according to the present embodiment is mounted on each wafer, and supplies a cleaning liquid while rotating the wafer in a circumferential direction, and is capable of realizing a wide range of functions in a wet cleaning process of a semiconductor wafer or the like. It is a spin cleaning device.

【0026】図1は、本実施形態の基板洗浄装置の全体
構成を示す概略図である。この基板洗浄装置は、基板
(ウェハ)11が設置されて洗浄が行なわれる洗浄チャ
ンバー1と、所望の薬液濃度の洗浄液を生成して供給す
る薬液供給システム2とを備えて構成されている。
FIG. 1 is a schematic diagram showing the overall configuration of a substrate cleaning apparatus according to the present embodiment. The substrate cleaning apparatus is provided with a cleaning chamber 1 in which a substrate (wafer) 11 is installed and cleaning is performed, and a chemical solution supply system 2 that generates and supplies a cleaning solution having a desired chemical solution concentration.

【0027】洗浄チャンバー1は、図2に示すように、
洗浄するウェハ11が収められる閉空間を形成してお
り、ウェハ11の搬出入部位となるゲートバルブ12を
備えている。この洗浄チャンバー1は、ウェハ11を側
面から保持するウェハ保持ピン13を有し、固定された
ウェハ11を図2中矢印の方向に回転させる回転駆動モ
ータを備えたウェハ設置手段14と、ウェハ設置手段1
4を側方から包囲するように設けられた洗浄液衝突緩衝
板15とを備えて構成されている。ここで、洗浄液衝突
緩衝板15は必ずしも必要とは限らず、洗浄チャンバー
の形状に多少の曲面を持たせることにより、洗浄液衝突
緩衝板15の役割を代替せしめることも可能である。
[0027] As shown in FIG.
A closed space for accommodating the wafer 11 to be cleaned is formed, and a gate valve 12 serving as a portion for carrying in / out the wafer 11 is provided. The cleaning chamber 1 has wafer holding pins 13 for holding the wafer 11 from the side, a wafer setting means 14 having a rotation drive motor for rotating the fixed wafer 11 in the direction of the arrow in FIG. Means 1
The cleaning liquid collision buffer plate 15 is provided so as to surround the cleaning liquid 4 from the side. Here, the cleaning liquid collision buffer plate 15 is not always necessary, and the role of the cleaning liquid collision buffer plate 15 can be replaced by providing the cleaning chamber with a slightly curved surface.

【0028】なお、洗浄チャンバー1内には、N2 ガス
又は不活性ガス等を供給するためのノズル(不図示)が
設けられており、洗浄後にウェハ11を乾燥させる際に
ウェハ11の表面、または表裏面同時にN2 ガス等を吹
き付けながら高速回転することによってウェハ11を乾
燥させたり、洗浄チャンバー1内を高濃度のN2 ガス又
は不活性ガス等で置換した状態でウェハ11の洗浄を行
なうことなどができる。
The cleaning chamber 1 is provided with a nozzle (not shown) for supplying an N 2 gas or an inert gas, and the like. Alternatively, the wafer 11 is dried by rotating at a high speed while simultaneously spraying N 2 gas or the like on the front and back surfaces, or the wafer 11 is washed while the inside of the washing chamber 1 is replaced with a high concentration of N 2 gas or an inert gas. You can do things.

【0029】薬液供給システム2は、原液(薬液)を希
釈して第1段階(中間段階)の濃度調整を行なう希釈溶
液供給部2aと、ここで生成された希釈溶液を更に希釈
して第2段階(最終段階)の濃度調整を行なう洗浄液供
給部2bとから構成されている。
A chemical solution supply system 2 dilutes a stock solution (chemical solution) and adjusts the concentration in a first stage (intermediate stage), and further dilutes the diluted solution produced here to a second solution. And a cleaning liquid supply unit 2b for performing a concentration adjustment at the stage (final stage).

【0030】希釈溶液供給部2aは、図3に示すよう
に、洗浄用の薬液が原液の状態で貯蔵される薬液貯蔵タ
ンク(第1の貯蔵槽)121と、薬液貯蔵タンク121
と連結され、薬液供給を能動的に行なう薬液供給装置1
22と、薬液供給装置122と連結され、薬液が混合す
る超純水の通路となる供給流路を形成する配管系(第1
の配管系)123とを備えて構成されている。
As shown in FIG. 3, the diluting solution supply unit 2a includes a chemical storage tank (first storage tank) 121 in which a cleaning chemical is stored in the form of a stock solution, and a chemical storage tank 121.
Liquid supply device 1 that is connected to
22 is connected to the chemical solution supply device 122 to form a supply channel that serves as a passage for ultrapure water into which the chemical solution is mixed (first piping system).
And a piping system 123).

【0031】洗浄液供給部2bは、配管系123の吐出
部123cから供給された希釈溶液が貯蔵される希釈溶
液貯蔵タンク(第2の貯蔵槽)21と、希釈溶液貯蔵タ
ンク21と連結され、希釈溶液の供給を能動的に行なう
希釈溶液供給装置22と、希釈溶液供給装置22と連結
され、希釈溶液が混合する超純水の通路となる供給流路
を形成する配管系(第2の配管系)23と、洗浄チャン
バー1内で設置されるウェハ11の各表面と対向するよ
うに配管系23の端部に設けられ、前記各表面に洗浄液
を供給する一対の吐出ノズル24,25と、希釈溶液供
給部2aにおける濃度調整をはじめ、吐出ノズル24,
25から供給する洗浄液の濃度や流量等の各種状態を調
節するための制御系26とを備えて構成されている。
The cleaning liquid supply unit 2b is connected to a diluting solution storage tank (second storage tank) 21 for storing the diluting solution supplied from the discharge unit 123c of the piping system 123, and to the diluting solution storage tank 21 for dilution. A diluting solution supply device 22 that actively supplies a solution, and a piping system (second piping system) that is connected to the diluting solution supply device 22 and forms a supply flow path that serves as a passage for ultrapure water into which the diluting solution is mixed. And 23) a pair of discharge nozzles 24 and 25 provided at an end of the piping system 23 to face each surface of the wafer 11 installed in the cleaning chamber 1 and supplying a cleaning liquid to each surface. In addition to adjusting the concentration in the solution supply unit 2a,
And a control system 26 for adjusting various states such as the concentration and the flow rate of the cleaning liquid supplied from the control unit 25.

【0032】薬液貯蔵タンク121は、高濃度の原液状
態の薬液、ここでは例えばフッ化水素酸(HF)又は水
酸化アンモニウム(NH4 OH)等が貯蔵されており、
搬入・搬出等の移動容易な小型サイズのものである。こ
の薬液貯蔵タンク121は、薬液の種類等に応じて複数
設けられる場合もある。
The chemical solution storage tank 121 stores a high-concentration chemical solution in the form of a stock solution, for example, hydrofluoric acid (HF) or ammonium hydroxide (NH 4 OH).
It is a small size that is easy to move in and out. A plurality of chemical storage tanks 121 may be provided depending on the type of the chemical and the like.

【0033】希釈溶液貯蔵タンク21は、各薬液貯蔵タ
ンク121と対応して設けられており、所望濃度に希釈
された第1段階(中間段階)の濃度に希釈調整された希
釈溶液が蓄えられるものである。この希釈溶液貯蔵タン
ク21もまた搬入・搬出等の移動容易な小型サイズのも
のであるが、薬液貯蔵タンク121及び希釈溶液貯蔵タ
ンク21共に据え付け型のものとしてもよい。
The diluted solution storage tank 21 is provided corresponding to each of the chemical solution storage tanks 121 and stores a diluted solution diluted to a first concentration (intermediate stage) diluted to a desired concentration. It is. The dilute solution storage tank 21 is also of a small size that can be easily moved in and out, but may be of an installation type for both the chemical solution storage tank 121 and the dilute solution storage tank 21.

【0034】薬液貯蔵タンク121及び希釈溶液貯蔵タ
ンク21には、供給された薬液及び希釈溶液の液面高さ
を測定して液量を制御する液位計49がそれぞれ設けら
れている。この液位計49は、図4に示すように、例え
ばカーボンからなる一対の棒状センサであり、以下に説
明するように各棒状センサ49a,49b間における洗
浄液の静電容量を測定することで液面高さを得るもので
ある。
The chemical storage tank 121 and the diluent storage tank 21 are provided with liquid level gauges 49 for measuring the level of the supplied chemical and diluent solutions to control the liquid levels. As shown in FIG. 4, the liquid level meter 49 is a pair of rod-shaped sensors made of, for example, carbon. As described below, the liquid level is measured by measuring the capacitance of the cleaning liquid between the rod-shaped sensors 49a and 49b. This is to obtain the surface height.

【0035】ここで、液位計49による液面高さ測定の
原理について説明する。洗浄液の液面から棒状センサの
下端までの距離をL、各棒状センサ間の離間距離をDと
し、r1,r2,a,d,δを図5に示すように定義す
る。この場合、 δ/a=a/d=r1/r2 が成立するので、円1(一方の棒状センサの横断面)に
+Q、円2(他方の棒状センサの横断面)に−Qの電荷
があれば、一方の棒状センサの全ての点について、 (Q/L)2πε0 (ln(r1)−ln(r2))=
(Q/L)2πε0 ln(r1/r2)=(Q/L)2
πε0 ln(a/d) が成立する。直線1−2上に分布する電荷Qは棒状セン
サの外側では棒状センサのの表面に同じ量の電荷が存在
する場合と同じ電場が生じるので、2つの棒状センサの
ポテンシャル差は (Q/L)πε0 ln(a/d) に等しく、容量Cは、 C=πε0 L/ln(a/d) ・・・(1) となる。
Here, the principle of measuring the liquid level by the liquid level meter 49 will be described. Assuming that the distance from the liquid level of the cleaning liquid to the lower end of the rod-shaped sensor is L and the distance between the rod-shaped sensors is D, r1, r2, a, d, and δ are defined as shown in FIG. In this case, δ / a = a / d = r1 / r2 holds, so that + Q is charged in circle 1 (cross section of one bar sensor) and −Q is charged in circle 2 (cross section of the other bar sensor). If there is, for all points of one bar sensor, (Q / L) 2πε 0 (ln (r1) −ln (r2)) =
(Q / L) 2πε 0 ln (r1 / r2) = (Q / L) 2
πε 0 ln (a / d) holds. The electric charge Q distributed on the straight line 1-2 generates the same electric field outside the rod-shaped sensor as when the same amount of electric charge exists on the surface of the rod-shaped sensor. Therefore, the potential difference between the two rod-shaped sensors is (Q / L) The capacitance C is equal to πε 0 ln (a / d), and the capacitance C is as follows: C = πε 0 L / ln (a / d) (1)

【0036】(1)式にa/d=exp(πε0 L/
C)を代入すると、 D/a=exp(πε0 L/C)+exp(−πε0
/C)=2cosh(πε0 L/C) となり、 C=πε0 L/(cosh-1D/2a) ・・・(2) が成立する。この(2)式から、Cの値を測定すること
により、Lの値を得ることができる。
In the equation (1), a / d = exp (πε 0 L /
C), D / a = exp (πε 0 L / C) + exp (−πε 0 L
/ C) = 2 cosh (πε 0 L / C), and C = πε 0 L / (cosh −1 D / 2a) (2) holds. From the equation (2), the value of L can be obtained by measuring the value of C.

【0037】このように、液位計49によれば、棒状セ
ンサ49a,49bの薬液及び希釈溶液内への浸漬部位
の電気容量及びその時間変化を測定することにより、液
面高さ及びその変化速度を得ることができる。即ち、液
面高さをパラメータとすることにより、例えば当該液面
高さ所期値からのズレを測定して所期値に調節すること
ができ、液面高さの変化速度をパラメータとすることに
より、前記変化速度の増大化を測定する。従って、この
液位計49により、効率よく確実に薬液及び希釈溶液の
液面高さ及びその変化速度を測定し、その結果から当該
液位計49が薬液貯蔵槽121に設けられた場合には薬
液の貯蔵量を測定して希釈溶液貯蔵槽21の希釈溶液の
薬液濃度を算出し、希釈溶液貯蔵槽21に設けられた場
合には希釈溶液の貯蔵量を測定して洗浄液の薬液濃度を
算出することが可能となる。これにより、必要に応じた
薬液及び希釈溶液の供給や、薬液及び希釈溶液供給に伴
う種々の不都合の発生を確実に検出すること等が実現さ
れる。
As described above, according to the liquid level meter 49, the liquid level and its change are measured by measuring the electric capacitance of the rod-shaped sensors 49a and 49b at the immersion site in the chemical solution and the diluting solution and its time change. You can get speed. In other words, by using the liquid level as a parameter, it is possible to adjust the liquid level to a desired value by measuring a deviation from the desired value, for example, and to use the rate of change of the liquid level as a parameter. This measures the increase in the rate of change. Accordingly, the liquid level gauge 49 efficiently and reliably measures the liquid level of the chemical solution and the dilute solution and the rate of change thereof. From the result, when the liquid level meter 49 is provided in the chemical solution storage tank 121, The storage amount of the chemical solution is measured to calculate the chemical concentration of the diluted solution in the diluted solution storage tank 21, and when provided in the diluted solution storage tank 21, the storage amount of the diluted solution is measured to calculate the chemical concentration of the cleaning solution. It is possible to do. As a result, the supply of the chemical solution and the diluent solution as needed, and the occurrence of various inconveniences associated with the supply of the chemical solution and the diluent solution can be reliably detected.

【0038】実際に、薬液の液面高さと容量との関係を
調べた結果を図6に示す。この図6は(2)式による計
算値と実測値との関係を示す。ここで、実測値はε0
7.17×10-10 F/m、棒状センサの半径=2m
m、離間距離=10mm、棒状センサの長さ=31.0
mmとして測定し、同様の条件で計算値を算出した。こ
の特性図において、横軸が薬液の液面高さ(満タンで0
mm)を、縦軸が容量(nF)を表す。このように、計
算値と実測値はほぼ一致し、CとLは比例関係にあるこ
とが分かる。
FIG. 6 shows the result of actually examining the relationship between the liquid level and the volume of the chemical solution. FIG. 6 shows the relationship between the value calculated by equation (2) and the actually measured value. Here, the actual measured value is ε 0 =
7.17 × 10 −10 F / m, radius of rod-shaped sensor = 2 m
m, separation distance = 10 mm, length of rod-shaped sensor = 31.0
mm, and the calculated value was calculated under the same conditions. In this characteristic diagram, the horizontal axis represents the liquid level of the chemical (0 when full).
mm) and the vertical axis represents the capacitance (nF). As described above, the calculated value and the measured value substantially match, and it is understood that C and L are in a proportional relationship.

【0039】薬液供給装置122は、圧電効果を利用し
て薬液貯蔵タンク121から薬液を振動的に送り出す動
作を行なうダイヤフラムポンプである液供給ポンプ31
aと、配管系123と液供給ポンプ31aとを連結して
連結流路を形成する連結管132と、連結管132内に
配管系123の供給流路と直接連結する細管部材(キャ
ピラリー)33とを備えて構成されている。
The chemical solution supply device 122 is a liquid supply pump 31 which is a diaphragm pump for performing an operation of vibratingly sending a chemical solution from the chemical solution storage tank 121 by utilizing a piezoelectric effect.
a, a connecting pipe 132 that connects the piping system 123 and the liquid supply pump 31a to form a connecting flow path, and a thin tube member (capillary) 33 that is directly connected to the supply flow path of the piping system 123 in the connecting pipe 132. It is provided with.

【0040】希釈溶液供給装置22も同様に、希釈溶液
貯蔵タンク21から希釈溶液を送出する液供給ポンプ3
1bと、配管系23と液供給ポンプ31bとを連結して
連結流路を形成する連結管32と、連結管32内に配管
系23の供給流路と直接連結するキャピラリー33とを
備えて構成されている。
Similarly, the diluting solution supply device 22 supplies the diluting solution from the diluting solution storage tank 21 to the liquid supply pump 3.
1b, a connection pipe 32 connecting the piping system 23 and the liquid supply pump 31b to form a connection flow path, and a capillary 33 directly connected to the supply flow path of the piping system 23 in the connection pipe 32. Have been.

【0041】液供給ポンプ31a,31bは、図7〜図
9に示すように、薬液を通過させる流路41が形成さ
れ、この流路41の流入口に薬液の圧力上昇により閉じ
る吸引弁42が、流路41の流出口に薬液の圧力下降に
より閉じる吐出弁43がそれぞれ設けられてなるもので
ある。ここで、流路41における接液面の一部を構成す
る一対の対向する側壁44,45が薬液に対する不透過
性且つ高耐蝕性の緻密部材、ここでは導電性部材である
アモルファスカーボンを主材料としてなり、側壁44が
可動壁とされている。
As shown in FIGS. 7 to 9, the liquid supply pumps 31a and 31b are formed with a flow path 41 through which a chemical solution passes. A discharge valve 43 is provided at the outlet of the flow path 41 and closed by the pressure drop of the chemical solution. Here, a pair of opposing side walls 44 and 45 that constitute a part of the liquid contact surface in the flow path 41 are made of a dense member that is impermeable to a chemical solution and has high corrosion resistance. And the side wall 44 is a movable wall.

【0042】そして、この液供給ポンプ31a,31b
は、この側壁(可動壁)44と連結し、当該可動壁44
をその壁面とほぼ直交する方向に振動させて流路41の
体積を周期的に変化させる加振器である圧電振動子46
と、可動壁44と圧電振動子46との間に設けられ、圧
電振動子46からの振動を可動壁44へ伝達する駆動伝
達手段47と、圧電振動子46が縮み方向には圧力を発
生できないことを考慮した手段であり、駆動伝達手段4
7を弾発付勢するスプリング48とを備えて構成されて
いる。
Then, the liquid supply pumps 31a, 31b
Is connected to the side wall (movable wall) 44 and the movable wall 44
Is vibrated in a direction substantially perpendicular to the wall surface, and the volume of the flow path 41 is periodically changed.
And a drive transmitting means 47 provided between the movable wall 44 and the piezoelectric vibrator 46 for transmitting the vibration from the piezoelectric vibrator 46 to the movable wall 44, and the piezoelectric vibrator 46 cannot generate pressure in the contraction direction. The drive transmission means 4
And a spring 48 for resiliently biasing the spring 7.

【0043】側壁44,45の主材料であるアモルファ
スカーボンは、上記の如く不透過性且つ高耐蝕性を有し
ており、ウェハ11の洗浄に用いられる薬液、特にフッ
化水素酸や過酸化水素水、オゾン等の酸化剤に対して全
く汚染を受けない性質を持つ。ここで用いるアモルファ
スカーボンとしては、均質アモルファスカーボンや繊維
状アモルファスカーボン、または両者の複合材料が好ま
しい。均質アモルファスカーボンは、気孔のない緻密な
等方性組織を有し、ガスバリヤー性及び液体遮断性に優
れた材料であり、用途に応じて気孔率の制御も可能であ
る。繊維状アモルファスカーボンは、3次元の骨格組織
を有する炭素多孔体であり、気孔の均一性を持ったポー
ラスカーボンである。
Amorphous carbon, which is the main material of the side walls 44 and 45, has impermeability and high corrosion resistance as described above, and is a chemical solution used for cleaning the wafer 11, especially hydrofluoric acid or hydrogen peroxide. It has the property of not being polluted by oxidizing agents such as water and ozone. The amorphous carbon used here is preferably a homogeneous amorphous carbon, a fibrous amorphous carbon, or a composite material of both. Homogeneous amorphous carbon has a dense isotropic structure without porosity, is a material excellent in gas barrier properties and liquid barrier properties, and can control porosity according to the application. The fibrous amorphous carbon is a porous carbon having a three-dimensional skeletal structure, and is a porous carbon having uniform pores.

【0044】フッ素樹脂で構築される従来の薬液供給シ
ステムは、フッ素樹脂中のHF分子の拡散が避けられな
いため、長期的には微量HF拡散を抑止できないという
欠陥があった。本実施形態のように、アモルファスカー
ボンを接液部に適用することにより、この問題を解決す
ることができる。
The conventional chemical liquid supply system constructed of a fluororesin has a defect that diffusion of a small amount of HF cannot be suppressed in a long term because diffusion of HF molecules in the fluororesin cannot be avoided. This problem can be solved by applying amorphous carbon to the liquid contact part as in the present embodiment.

【0045】この液供給ポンプ31a,31bの動作は
以下の通りである。ダイヤフラムである可動壁44が図
9中右側へ移動したときには、流路41は負圧となって
吐出弁43が閉止状態となり、図10のように左側へ移
動したときには、流路41は正圧となって吸引弁42が
閉止状態となると共に吐出弁43が開放状態となって薬
液が吐出される。ここで、圧電振動子46の駆動による
可動壁44の振動数は例えば20Hz程度に制御するこ
とが好ましく、薬液の吐出圧力は例えば1.5kg/c
2 以上とすることが好適である。
The operation of the liquid supply pumps 31a and 31b is as follows. When the movable wall 44, which is a diaphragm, moves to the right in FIG. 9, the flow path 41 becomes negative pressure and the discharge valve 43 is closed, and when it moves to the left as shown in FIG. As a result, the suction valve 42 is closed and the discharge valve 43 is opened to discharge the chemical. Here, it is preferable to control the frequency of the movable wall 44 by driving the piezoelectric vibrator 46 to, for example, about 20 Hz, and the discharge pressure of the chemical solution is, for example, 1.5 kg / c.
m 2 or more is preferable.

【0046】細管部材であるキャピラリー33は、側壁
44,45と同様のアモルファスカーボンを主材料とし
てなり、管径が例えばφ0.2mm程度、吐出量が例え
ば0.3cc/秒とされている。液供給ポンプ31の振
動駆動により、このキャピラリー33から配管系23内
の超純水中へ薬液が吐出される。
The capillary 33, which is a thin tube member, is mainly made of the same amorphous carbon as the side walls 44 and 45, and has a tube diameter of, for example, about 0.2 mm and a discharge rate of, for example, 0.3 cc / sec. The chemical liquid is discharged from the capillary 33 into the ultrapure water in the piping system 23 by the vibration drive of the liquid supply pump 31.

【0047】配管系123は、上記の如き超純水の供給
流路を形成しており、管径が例えばφ5mm程度、流量
が例えば1.0リットル/分程度とされている。配管系
23も同様に、上記の如き超純水の供給流路を形成して
おり、管径が例えばφ5mm程度、流量が例えば2リッ
トル/分程度とされている。これら配管系123,23
には、及び配管系123,23のキャピラリー33との
連結部位に配され、洗浄液に回転流を生ぜしめて攪拌
し、当該洗浄液を均一化させる混合手段36が設けられ
ている。
The piping system 123 forms a supply flow path of ultrapure water as described above, and has a pipe diameter of, for example, about 5 mm and a flow rate of, for example, about 1.0 liter / minute. Similarly, the piping system 23 also forms a supply flow path of ultrapure water as described above, and has a pipe diameter of, for example, about 5 mm, and a flow rate of, for example, about 2 liters / minute. These piping systems 123, 23
And a mixing means 36 arranged at a connection portion of the piping systems 123 and 23 with the capillary 33, for generating a rotating flow in the cleaning liquid and agitating the same to make the cleaning liquid uniform.

【0048】制御系26は、各々の液供給ポンプ31の
薬液の超純水への供給量及び希釈溶液の超純水への供給
量をそれぞれ調節する薬液供給制御手段37を備えてお
り、液位計49や重量計200の測定・算出結果が薬液
供給制御手段37にフィードバックされて液供給ポンプ
31a,31bを制御し、薬液及び希釈溶液の供給量が
調節される。
The control system 26 includes chemical liquid supply control means 37 for adjusting the supply amount of the chemical liquid to the ultrapure water and the supply amount of the diluting solution to the ultrapure water of each liquid supply pump 31. The measurement / calculation results of the scale 49 and the weighing scale 200 are fed back to the chemical liquid supply control means 37 to control the liquid supply pumps 31a and 31b, and the supply amounts of the chemical liquid and the dilute solution are adjusted.

【0049】以下、本実施形態の基板洗浄装置の具体的
動作について説明する。本実施形態では、制御系26
が、薬液貯蔵タンク121に設けられた液位系49によ
る希釈溶液の薬液濃度の算出値及び希釈溶液貯蔵タンク
21に設けられた液位系49による洗浄液の薬液濃度の
算出値を参照して液供給ポンプ31bを駆動制御し、液
供給ポンプ31bからの希釈溶液の吐出量及び吐出速度
を調節して洗浄液の薬液濃度を目的値に制御する。ここ
では、希釈溶液の薬液濃度の目的値を90ppm、最終
的な洗浄液の薬液濃度の目的値を0.8ppmとする場
合について例示する。
Hereinafter, a specific operation of the substrate cleaning apparatus of the present embodiment will be described. In the present embodiment, the control system 26
Is determined by referring to the calculated value of the chemical concentration of the diluted solution by the liquid level system 49 provided in the chemical storage tank 121 and the calculated value of the chemical concentration of the cleaning liquid by the liquid level system 49 provided in the diluted solution storage tank 21. The supply pump 31b is driven and controlled, and the discharge amount and discharge speed of the diluting solution from the liquid supply pump 31b are adjusted to control the chemical concentration of the cleaning liquid to a target value. Here, a case where the target value of the chemical concentration of the diluted solution is 90 ppm and the target value of the chemical concentration of the final cleaning liquid is 0.8 ppm will be exemplified.

【0050】先ず、例えば水酸化アンモニウム(NH4
OH)を30%含む薬液が貯蔵された薬液貯蔵タンク1
21を設置し、配管系123のバルブ123a,123
bを順次開ける。次に、制御系26により液供給ポンプ
31aを駆動し、1回で0.015ccのショットを4
回(合計0.06cc)行ない、各ショット毎にキャピ
ラリー33から配管系123内を通過する超純水に送出
し、混合手段36により混合する。このとき、配管系1
23内の超純水は前記4ショットを含む所定時間流動
し、吐出部123cから希釈溶液貯蔵タンク21に吐出
した後にバルブ123bを閉じる。ここでは、前記所定
時間で200ccの超純水を吐出するように制御されて
おり、従って希釈溶液貯蔵タンク21には200.06
ccで濃度90ppmのNH4 OHの希釈溶液が蓄えら
れる。
First, for example, ammonium hydroxide (NH 4
Chemical storage tank 1 storing a chemical containing 30% OH)
21 and the valves 123a, 123 of the piping system 123.
b is sequentially opened. Next, the liquid supply pump 31a is driven by the control system 26, and four shots of 0.015 cc are taken at one time.
(0.06 cc in total), and each shot is sent from the capillary 33 to ultrapure water passing through the piping system 123 and mixed by the mixing means 36. At this time, the piping system 1
The ultrapure water in 23 flows for a predetermined time including the four shots, and is discharged from the discharge part 123c to the diluted solution storage tank 21, and then the valve 123b is closed. Here, the control is performed so that 200 cc of ultrapure water is discharged in the predetermined time.
A dilute solution of 90 ppm NH 4 OH in cc is stored.

【0051】ここで、薬液貯蔵タンク121からの薬液
送出量は薬液貯蔵タンク121に設けられた液位計49
により測定され、当該測定値から希釈溶液貯蔵タンク2
1内の薬液量が判る。
Here, the delivery amount of the chemical from the chemical storage tank 121 is determined by the liquid level meter 49 provided in the chemical storage tank 121.
And the diluted solution storage tank 2
The amount of the chemical in 1 is known.

【0052】続いて、制御系26により液供給ポンプ3
1bを駆動し、キャピラリー33から希釈溶液を配管系
23内を通過する超純水に送出し、混合手段36により
混合する。このとき、配管系23内を通過する超純水の
流量は流量調節手段34により2リットル/分に調節さ
れており、これに対応して液供給ポンプ31bの希釈溶
液の送出速度を0.3cc/秒(20Hz)に調節す
る。これにより、配管系23内で濃度0.8ppmのN
4 OHの極低濃度に正確に調節された洗浄液が生成さ
れ、吐出ノズル24,25から吐出してウェハ11表面
に供給される。
Subsequently, the liquid supply pump 3 is controlled by the control system 26.
By driving 1b, the diluted solution is sent from the capillary 33 to ultrapure water passing through the piping system 23, and mixed by the mixing means 36. At this time, the flow rate of the ultrapure water passing through the piping system 23 is adjusted to 2 liters / minute by the flow rate adjusting means 34, and the sending speed of the diluted solution of the liquid supply pump 31b is set to 0.3 cc in response to this. / Sec (20 Hz). As a result, 0.8 ppm of N
A cleaning liquid precisely adjusted to an extremely low concentration of H 4 OH is generated, discharged from the discharge nozzles 24 and 25, and supplied to the surface of the wafer 11.

【0053】ここで、希釈溶液貯蔵タンク21からの希
釈溶液送出量は希釈溶液貯蔵タンク21に設けられた液
位計49により測定されることになる。
Here, the delivery amount of the dilute solution from the dilute solution storage tank 21 is measured by the liquid level meter 49 provided in the dilute solution storage tank 21.

【0054】仮に例えば、希釈溶液貯蔵タンク21にお
ける希釈溶液の薬液濃度について、薬液貯蔵タンク12
1に設置された液位計49による算出値が目的値と異な
る場合でも、制御系26の液供給ポンプ31bの駆動制
御により、最終的な洗浄液の薬液濃度を目的値に調節す
ることが可能である。
For example, assuming that the concentration of the diluted solution in the diluted solution storage tank 21 is
Even when the value calculated by the liquid level meter 49 installed in 1 is different from the target value, it is possible to adjust the final chemical concentration of the cleaning liquid to the target value by controlling the driving of the liquid supply pump 31b of the control system 26. is there.

【0055】具体的に、図11に示すように、前記算出
値が80ppm(目的値は90ppm)となった場合、
洗浄液の薬液濃度の目的値(0.8ppm)を達成する
ため、制御系26の制御により液供給ポンプ31bの可
動壁(ダイヤフラム)44の振幅を変え、液供給ポンプ
31bにおける希釈溶液の送出速度が0.34cc/秒
(20Hz)となるように微調節する。これにより、前
記算出値の目的値からのずれが補間され、濃度0.8p
pmのNH4 OHの極低濃度に正確に調節された洗浄液
が生成・供給されることになる。
Specifically, as shown in FIG. 11, when the calculated value is 80 ppm (the target value is 90 ppm),
In order to achieve the target value (0.8 ppm) of the chemical concentration of the cleaning liquid, the amplitude of the movable wall (diaphragm) 44 of the liquid supply pump 31b is changed by the control of the control system 26, and the sending speed of the diluted solution in the liquid supply pump 31b is reduced. Fine adjustment is made to be 0.34 cc / sec (20 Hz). Thereby, the deviation of the calculated value from the target value is interpolated, and the density 0.8 p
A cleaning liquid precisely adjusted to an extremely low concentration of NH 4 OH of pm will be generated and supplied.

【0056】このように、本実施形態の基板洗浄装置に
おいては、先ず液供給ポンプ31a,31bにより、圧
電振動子46が可動壁44を駆動制御して振動させ、そ
の押圧により薬液及び希釈溶液を吐出するものであり、
所望量の薬液及び希釈溶液を正確に吐出供給することが
できる。ここで、接液面の少なくとも一部が薬液に対す
る不透過性且つ高耐蝕性の緻密部材、好ましくはアモル
ファスカーボンを用いる。このアモルファスカーボン
は、その気孔率の制御が容易な材料であり、気孔率をほ
ぼ0のものは極めて優れた不透過性且つ高耐蝕性を示
す。従って、このアモルファスカーボンを接液面の重要
部分に設けることにより、薬液の供給量制御がより正確
となり、しかもパーティクル等の薬液内への混入が抑止
される。
As described above, in the substrate cleaning apparatus of the present embodiment, first, the piezoelectric vibrator 46 drives and vibrates the movable wall 44 by the liquid supply pumps 31a and 31b, and presses the liquid crystal and the diluting solution by the pressure. To discharge,
It is possible to accurately discharge and supply a desired amount of a chemical solution and a diluted solution. Here, at least a part of the liquid contact surface is made of a dense member that is impermeable to the chemical solution and has high corrosion resistance, preferably amorphous carbon. This amorphous carbon is a material whose porosity can be easily controlled, and those having a porosity of almost 0 exhibit extremely excellent impermeability and high corrosion resistance. Therefore, by providing this amorphous carbon in an important part of the liquid contact surface, the supply amount control of the chemical solution becomes more accurate, and the mixing of particles and the like into the chemical solution is suppressed.

【0057】本実施形態では、この液供給ポンプ31
a,31bを構成要素とする薬液供給システムを提供す
る。この薬液供給システムにおいては、液供給ポンプ3
1a,31bの駆動により、種々の濃度の洗浄液を必要
に応じて容易に調合することができる。ここで、薬液及
び希釈溶液の吐出方向が超純水の流動方向とほぼ直交す
る方向である場合には、キャピラリー33から吐出する
薬液及び希釈溶液の線速度が供給流路を通過する超純水
の線速度より望ましくは大きくなるような押圧を薬液及
び希釈溶液に与えることにより、均一な所望濃度の洗浄
液が容易に調合されることになる。
In this embodiment, the liquid supply pump 31
Provided is a chemical liquid supply system including a and 31b as constituent elements. In this chemical supply system, the liquid supply pump 3
By driving 1a and 31b, cleaning solutions of various concentrations can be easily prepared as needed. Here, when the discharge direction of the chemical solution and the dilute solution is a direction substantially orthogonal to the flow direction of the ultrapure water, the linear velocity of the chemical solution and the dilute solution discharged from the capillary 33 is changed to the ultrapure water flowing through the supply flow path. By applying a pressure that is desirably greater than the linear velocity to the chemical solution and the diluting solution, a uniform desired concentration of the cleaning liquid can be easily prepared.

【0058】最終的に必要な薬液濃度が極低濃度から低
濃度までの値(例えばppmから0.1%までの低濃
度)である場合、先ず液供給ポンプ31aの駆動により
必要量の薬液を薬液貯蔵槽121から吸引して配管系1
21内を通過する超純水に送出する。ここで薬液が第1
段階の所定濃度に希釈され、中間濃度の希釈溶液となっ
て希釈溶液貯蔵槽21に蓄えられる。続いて、液供給ポ
ンプ31bの駆動により必要量の希釈溶液を希釈溶液貯
蔵槽21から吸引して配管系21内を通過する超純水に
送出する。ここで希釈溶液が第2段階(最終段階)の所
定濃度に希釈され、ウェハ11に洗浄液として供給され
る。このように、各段階の薬液濃度調整がそれぞれ各液
供給ポンプ31a,31bの正確な駆動により高精度に
きめ細かく行なわれるため、最終的に必要な洗浄液が極
低濃度であっても正確に生成することが可能となる。
When the finally required concentration of the chemical solution is a value from an extremely low concentration to a low concentration (for example, a low concentration from ppm to 0.1%), the required amount of the chemical solution is first driven by driving the liquid supply pump 31a. Suction from chemical solution storage tank 121 and piping system 1
It is sent to ultrapure water passing through 21. Here the chemical is the first
The diluted solution is diluted to a predetermined concentration in the step, and is stored in the diluted solution storage tank 21 as a diluted solution having an intermediate concentration. Subsequently, the required amount of the dilute solution is sucked from the dilute solution storage tank 21 by driving the liquid supply pump 31b, and is sent to the ultrapure water passing through the piping system 21. Here, the diluted solution is diluted to a predetermined concentration in the second stage (final stage) and supplied to the wafer 11 as a cleaning liquid. As described above, the chemical solution concentration adjustment at each stage is performed precisely and precisely by the precise driving of each of the liquid supply pumps 31a and 31b, so that even if the finally required cleaning solution has an extremely low concentration, it is accurately generated. It becomes possible.

【0059】また、この薬液供給システムでは、上述の
ように必要に応じた所望濃度の洗浄液の生成が可能であ
るため、原液である薬液の薬液貯蔵槽121や希釈溶液
貯蔵槽21は共に移動容易な小型のもので足りる。即
ち、従来のように薬液濃度や種類の異なる極めて大型の
貯蔵槽を用意する必要がなく、所望の極低濃度の洗浄液
生成が容易となり、洗浄液へのパーティクル混入等を抑
止できるのみならず、システム全体の規模の大幅な縮小
化・簡易化が実現され、濃度や種類の異なる種々の清浄
な洗浄液を迅速且つ容易に供給することが可能となる。
Further, in this chemical supply system, since the cleaning liquid having a desired concentration can be generated as required as described above, both the chemical storage tank 121 and the diluent storage tank 21 for the undiluted chemical are easily movable. A small thing is enough. That is, it is not necessary to prepare a very large storage tank having a different chemical solution concentration or type as in the conventional case, and it is easy to generate a cleaning liquid having a desired extremely low concentration. The overall scale is greatly reduced and simplified, and it becomes possible to quickly and easily supply various clean cleaning liquids having different concentrations and types.

【0060】−変形例− ここで、本実施形態の基板洗浄装置の変形例について説
明する。この変形例では、本実施形態とほぼ同様に構成
された基板洗浄装置を例示するが、薬液貯蔵タンク12
1及び希釈溶液貯蔵タンク21の貯蔵量の測定態様が若
干異なる点で相違する。
-Modification- Here, a modification of the substrate cleaning apparatus of the present embodiment will be described. In this modification, a substrate cleaning apparatus having substantially the same configuration as that of the present embodiment will be described.
1 and the dilute solution storage tank 21 are different in that the storage modes are slightly different.

【0061】即ち本変形例では、図12に示すように、
液位計49の代わりに重量計200を設け、各貯蔵タン
ク121,21の重量を測定することにより薬液貯蔵タ
ンク121からの薬液送出量及び希釈溶液貯蔵タンク2
1からの希釈溶液送出量が測定され、液位計49を設け
た場合と同様に希釈溶液及び洗浄液の薬液濃度が算出さ
れることになる。
That is, in this modification, as shown in FIG.
A weigh scale 200 is provided in place of the liquid level meter 49, and the weight of each of the storage tanks 121 and 21 is measured so that the amount of the chemical solution delivered from the chemical solution storage tank 121 and the dilution solution storage tank 2 are measured.
The diluted solution delivery amount from 1 is measured, and the chemical concentrations of the diluted solution and the cleaning solution are calculated as in the case where the liquid level meter 49 is provided.

【0062】ここで、各重量計200は薬液(又は希釈
溶液)の蒸気に晒されることから、腐食防止のためにそ
の表面にフッ素樹脂などの高耐蝕性部材が被覆される。
Here, since each weighing scale 200 is exposed to the vapor of a chemical solution (or a diluting solution), its surface is coated with a highly corrosion-resistant member such as a fluororesin to prevent corrosion.

【0063】また、図示は省略するが、希釈溶液供給部
2aにおいて、液供給ポンプ31aから配管系123を
介さずに、所定量の薬液を希釈溶液貯蔵タンク21に供
給するとともに、配管系123から所定量の超純水を供
給して混合希釈し、希釈溶液貯蔵タンク21で希釈溶液
を生成するように構成してもよい。この場合も、希釈溶
液及び洗浄液の各濃度を測定するには液位計49又は重
量計200を用いればよい。
Although not shown in the figure, in the diluting solution supply section 2a, a predetermined amount of the chemical is supplied from the liquid supply pump 31a to the diluting solution storage tank 21 without passing through the piping system 123, and from the piping system 123. A predetermined amount of ultrapure water may be supplied and mixed and diluted, and a diluted solution may be generated in the diluted solution storage tank 21. Also in this case, the liquid level meter 49 or the weighing scale 200 may be used to measure the respective concentrations of the diluted solution and the cleaning solution.

【0064】なお、本発明はこの実施形態に限定される
ものではない。例えば、薬液供給システムは基板洗浄装
置のみならず、種々の種類や濃度の大量の薬液が必要な
他のあらゆる装置に適用可能である。
The present invention is not limited to this embodiment. For example, the chemical solution supply system is applicable not only to a substrate cleaning device but also to any other device requiring a large amount of various types and concentrations of chemical solutions.

【0065】[0065]

【発明の効果】本発明によれば、薬液等の貯蔵槽を含む
洗浄液供給系の大幅な小型化・簡易化を図るとともに、
必要なときに正確な薬液濃度、特に極低濃度の供給液
(洗浄液)を簡易且つ迅速に調合し供給することが可能
となる。
According to the present invention, the cleaning liquid supply system including the storage tank for chemicals and the like can be significantly reduced in size and simplified, and
When necessary, it is possible to easily and quickly prepare and supply a supply liquid (cleaning liquid) having an accurate chemical solution concentration, particularly an extremely low concentration.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本実施形態に係る薬液供給システムを含むウェ
ハ枚葉スピン洗浄装置の一例を示す模式図である。
FIG. 1 is a schematic view illustrating an example of a single wafer spin cleaning apparatus including a chemical solution supply system according to an embodiment.

【図2】本実施形態に係るウェハ枚葉スピン洗浄装置の
構成要素である洗浄チャンバーの一例を示す概略断面図
である。
FIG. 2 is a schematic sectional view showing an example of a cleaning chamber which is a component of the single wafer spin cleaning apparatus according to the present embodiment.

【図3】薬液供給システムの構成要素である希釈溶液供
給部の一例を示す模式図である。
FIG. 3 is a schematic diagram illustrating an example of a diluting solution supply unit that is a component of the chemical solution supply system.

【図4】液面調節手段を示す模式図である。FIG. 4 is a schematic view showing a liquid level adjusting unit.

【図5】液面調節手段の動作原理を説明するための模式
図である。
FIG. 5 is a schematic diagram for explaining the operation principle of the liquid level adjusting means.

【図6】洗浄液の液面高さと容量との関係を示す特性図
である。
FIG. 6 is a characteristic diagram showing a relationship between a liquid level and a capacity of a cleaning liquid.

【図7】薬液供給システムの構成要素である液供給ポン
プを示す概略断面図である。
FIG. 7 is a schematic sectional view showing a liquid supply pump which is a component of the chemical liquid supply system.

【図8】薬液供給システムの構成要素である液供給ポン
プを示す他の概略断面図である。
FIG. 8 is another schematic sectional view showing a liquid supply pump which is a component of the chemical liquid supply system.

【図9】薬液供給システムの構成要素である液供給ポン
プの流路近傍を示す概略断面図である。
FIG. 9 is a schematic cross-sectional view showing the vicinity of a flow path of a liquid supply pump which is a component of the chemical liquid supply system.

【図10】液供給ポンプが駆動する際の流路近傍を示す
概略断面図である。
FIG. 10 is a schematic sectional view showing the vicinity of a flow path when a liquid supply pump is driven.

【図11】制御系による液供給ポンプの吐出量調整の様
子を示す模式図である。
FIG. 11 is a schematic diagram showing how a control system adjusts a discharge amount of a liquid supply pump.

【図12】薬液供給システムの構成要素である希釈溶液
供給部の他の例を示す模式図である。
FIG. 12 is a schematic diagram illustrating another example of a diluting solution supply unit that is a component of the chemical solution supply system.

【符号の説明】[Explanation of symbols]

1 洗浄チャンバー 2 薬液供給システム 11 ウェハ 12 ゲートバルブ 13 ウェハ保持ピン 14 ウェハ設置手段 15 洗浄液衝突緩衝板 21 希釈溶液貯蔵タンク 22 希釈溶液供給装置 23,123 配管系 24,25 吐出ノズル 26 制御系 31,31a,31b 液供給ポンプ 32,52,102,132 連結管 33,40 キャピラリー 36 混合手段 37 薬液供給制御手段 39 混入防止機構 41 流路 42 吸引弁 43 吐出弁 44,45 側壁 46 圧電振動子 47 駆動伝達手段 48 スプリング 49 液面計 121 薬液貯蔵タンク 122 薬液供給装置 200 重量計 DESCRIPTION OF SYMBOLS 1 Cleaning chamber 2 Chemical supply system 11 Wafer 12 Gate valve 13 Wafer holding pin 14 Wafer installation means 15 Cleaning liquid collision buffer 21 Dilute solution storage tank 22 Dilute solution supply device 23,123 Piping system 24,25 Discharge nozzle 26 Control system 31, 31a, 31b Liquid supply pump 32, 52, 102, 132 Connecting pipe 33, 40 Capillary 36 Mixing means 37 Chemical liquid supply control means 39 Mixing prevention mechanism 41 Flow path 42 Suction valve 43 Discharge valve 44, 45 Side wall 46 Piezoelectric vibrator 47 Drive Transmission means 48 Spring 49 Level gauge 121 Chemical storage tank 122 Chemical supply device 200 Weight scale

───────────────────────────────────────────────────── フロントページの続き (72)発明者 三木 正博 東京都文京区本郷4丁目1番4号 株式会 社ウルトラクリーンテクノロジー開発研究 所内 Fターム(参考) 3B201 AA03 AB03 AB34 AB42 BB05 BB24 BB92 BB93 BB96 CB01 CC12 CC13 CD42 CD43 3H071 AA01 BB01 CC33 CC34 DD04 DD12 DD13 DD31 DD72 3H075 AA09 BB04 CC34 CC35 DA05 DA09 DA22 DB02 4G068 AA02 AB15 AC05 AC16 AD04 AD21  ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masahiro Miki 4-1-1 Hongo, Bunkyo-ku, Tokyo Ultra Clean Technology Development Laboratory F-term (reference) 3B201 AA03 AB03 AB34 AB42 BB05 BB24 BB92 BB93 BB96 CB01 CC12 CC13 CD42 CD43 3H071 AA01 BB01 CC33 CC34 DD04 DD12 DD13 DD31 DD72 3H075 AA09 BB04 CC34 CC35 DA05 DA09 DA22 DB02 4G068 AA02 AB15 AC05 AC16 AD04 AD21

Claims (14)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも1種の薬液が溶媒に混合希釈
され、最終的な所定の薬液濃度に調節された供給液を供
給する薬液供給システムであって、 高濃度の前記薬液が貯蔵される第1の貯蔵槽と、 所定量の前記薬液を前記第1の貯蔵槽から吸引して送出
する第1の供給手段と、 前記第1の供給手段が連結された前記溶媒の流路を形成
し、前記薬液が前記溶媒に混合希釈されて前記供給液よ
り高い所定の薬液濃度に調節されてなる希釈溶液を吐出
する第1の吐出部を有する第1の配管系と、 前記希釈溶液が貯蔵される第2の貯蔵槽と、 所定量の前記希釈溶液を前記第2の貯蔵槽から吸引して
送出する第2の供給手段と、 前記第2の供給手段が連結された前記溶媒の流路を形成
し、前記希釈溶液が前記溶媒に更に混合希釈され濃度調
節された前記供給液を吐出する第2の吐出部を有する第
2の配管系とを備え、 前記第1の供給手段の駆動により必要量の前記薬液を前
記第1の配管系内を流動する前記溶媒に混合させて前記
希釈溶液を生成して、前記希釈溶液を前記第1の吐出部
から吐出して前記第2の貯蔵槽に貯蔵しておき、 前記第2の供給手段の駆動により必要量の前記希釈溶液
を前記第2の配管系内を流動する前記溶媒に混合させて
所望濃度の前記供給液を生成して前記第2の吐出部から
供給することを特徴とする薬液供給システム。
1. A chemical liquid supply system for mixing and diluting at least one chemical liquid with a solvent and supplying a final supply liquid adjusted to a predetermined chemical liquid concentration, wherein a high concentration of the chemical liquid is stored. A first storage tank, a first supply means for sucking out a predetermined amount of the chemical solution from the first storage tank and sending out, and forming a flow path of the solvent to which the first supply means is connected, A first piping system having a first discharge unit that discharges a diluted solution in which the chemical solution is mixed and diluted with the solvent and adjusted to a predetermined chemical solution concentration higher than the supply liquid; and the diluted solution is stored. A second storage tank, a second supply means for sucking out a predetermined amount of the diluting solution from the second storage tank and sending the diluted solution, and forming a flow path of the solvent to which the second supply means is connected. Before the diluted solution is further mixed and diluted with the solvent and the concentration is adjusted. And a second piping system having a second discharge unit for discharging the supply liquid, wherein a required amount of the chemical liquid is supplied to the solvent flowing through the first piping system by driving the first supply unit. The diluted solution is mixed to generate the diluted solution, the diluted solution is discharged from the first discharge unit and stored in the second storage tank, and a required amount of the diluted solution is driven by driving the second supply unit. A chemical liquid supply system, wherein a diluted solution is mixed with the solvent flowing in the second piping system to generate the supply liquid having a desired concentration, and the supply liquid is supplied from the second discharge unit.
【請求項2】 少なくとも1種の薬液が溶媒に混合希釈
され、最終的な所定の薬液濃度に調節された供給液を供
給する薬液供給システムであって、 高濃度の前記薬液が貯蔵される第1の貯蔵漕と、 所定量の前記薬液を前記第1の貯蔵漕から吸引して送出
する第1の供給手段と、 前記第1の供給手段から送出された前記薬液を前記溶媒
で混合希釈して前記供給液より高い所定の薬液濃度に調
節されてなる希釈溶液が貯蔵される第2の貯蔵漕と、 所定量の前記希釈溶液を前記第2の貯蔵漕から吸引して
送出する第2の供給手段と、 前記第2の供給手段が連結された前記溶媒の流路を形成
し、前記希釈溶液が前記溶媒に更に混合希釈され濃度調
節された前記供給液を端部から吐出する配管系とを備
え、 前記第1及び第2の供給手段の駆動により、前記第1及
び第2の貯蔵槽を用いて前記薬液の段階的な希釈を行っ
て生成した所定濃度の前記供給液を供給することを特徴
とする薬液供給システム。
2. A chemical liquid supply system for mixing and diluting at least one chemical liquid with a solvent and supplying a final supply liquid adjusted to a predetermined chemical liquid concentration, wherein a high concentration of the chemical liquid is stored. A storage tank, a first supply unit for sucking a predetermined amount of the chemical solution from the first storage tank and sending the solution, and mixing and diluting the chemical solution sent from the first supply unit with the solvent. A second storage tank in which a diluted solution adjusted to a predetermined chemical solution concentration higher than the supply liquid is stored, and a second pumping out and sucking out a predetermined amount of the diluted solution from the second storage tank. A supply system, and a piping system that forms a flow path of the solvent to which the second supply unit is connected, and discharges the supply liquid whose concentration is adjusted by further mixing and diluting the dilute solution with the solvent from an end. By driving the first and second supply means, A chemical liquid supply system, wherein the supply liquid having a predetermined concentration generated by performing stepwise dilution of the chemical liquid using the first and second storage tanks is supplied.
【請求項3】 前記第1の供給手段が連結された前記溶
媒の流路を形成し、前記流路内で前記溶媒と混合希釈し
た前記希釈溶液を前記第2の貯蔵槽に吐出する他の配管
系を備えることを特徴とする請求項2に記載の薬液供給
システム。
3. The method according to claim 1, further comprising: forming a flow path of the solvent to which the first supply unit is connected, and discharging the diluted solution mixed and diluted with the solvent to the second storage tank in the flow path. The chemical supply system according to claim 2, further comprising a piping system.
【請求項4】 前記溶媒の流路を形成し、前記溶媒を前
記第2の貯蔵槽に吐出する他の配管系を備え、 前記第2の貯蔵槽内で前記薬液を前記溶媒で混合希釈
し、前記希釈溶液を生成することを特徴とする請求項2
に記載の薬液供給システム。
4. A flow path for the solvent is formed, and another piping system for discharging the solvent to the second storage tank is provided. The chemical solution is mixed and diluted with the solvent in the second storage tank. Producing said diluted solution.
3. The chemical solution supply system according to item 1.
【請求項5】 前記第1及び第2の供給手段は、前記希
釈溶液及び前記薬液を通過させる流路が形成され、前記
流路の流入口に前記希釈溶液及び前記薬液の圧力上昇に
より閉じる吸引弁が、前記流路の流出口に前記希釈溶液
及び前記薬液の圧力下降により閉じる吐出弁がそれぞれ
設けられてなる液供給ポンプであって、 前記流路における接液面の少なくとも一部が前記薬液に
対する不透過性且つ高耐蝕性の緻密部材からなるととも
に、前記緻密部材の一部が可動壁とされており、 前記可動壁と連結する加振器を備え、前記加振器の駆動
により前記可動壁をその壁面とほぼ直交する方向に振動
させて前記流路の体積を周期的に変化させるものである
ことを特徴とする請求項1〜4のいずれか1項に記載の
薬液供給システム。
5. The first and second supply means are provided with a flow path through which the dilute solution and the chemical solution pass, and suction is closed at an inlet of the flow path due to a rise in pressure of the dilute solution and the chemical solution. A valve is a liquid supply pump in which a discharge valve is provided at an outlet of the flow path, the discharge valve being closed by a decrease in pressure of the diluting solution and the chemical liquid, and at least a part of a liquid contact surface in the flow path has the chemical liquid. A dense member that is impermeable and highly resistant to corrosion, a part of the dense member is a movable wall, and a vibrator connected to the movable wall is provided. The movable member is driven by driving the vibrator. The chemical solution supply system according to any one of claims 1 to 4, wherein the wall is vibrated in a direction substantially orthogonal to the wall surface to periodically change the volume of the flow path.
【請求項6】 前記各配管系と前記各供給手段とを連結
する各連結流路を備え、 前記各連結流路内に前記各配管系と直接連結し、前記薬
液又は前記希釈溶液の前記溶媒への吐出部位となる細管
部材が設けられていることを特徴とする請求項1〜5の
いずれか1項に記載の薬液供給システム。
6. A connection path for connecting each of the piping systems and each of the supply means, wherein each of the connection paths is directly connected to each of the piping systems, and the solvent of the chemical solution or the diluted solution is provided. The chemical solution supply system according to any one of claims 1 to 5, further comprising a thin tube member serving as a discharge portion to the liquid supply device.
【請求項7】 供給する前記供給液量及びその薬液濃度
を調節するための制御系を備えることを特徴とする請求
項1〜6のいずれか1項に記載の薬液供給システム。
7. The chemical liquid supply system according to claim 1, further comprising a control system for adjusting the amount of the supplied liquid and the concentration of the chemical liquid.
【請求項8】 前記第1の貯蔵槽に設けられ、前記薬液
の貯蔵量を測定して前記第2の貯蔵槽の前記希釈溶液の
薬液濃度を算出する第1の濃度測定手段と、 前記第2の貯蔵槽に設けられ、前記希釈溶液の貯蔵量を
測定して前記供給液の薬液濃度を算出する第2の濃度測
定手段とを備えることを特徴とする請求項1〜7のいず
れか1項に記載の薬液供給システム。
8. A first concentration measuring means provided in the first storage tank for measuring a storage amount of the chemical solution to calculate a chemical solution concentration of the diluted solution in the second storage tank, And a second concentration measuring means provided in the second storage tank and measuring a storage amount of the diluting solution to calculate a chemical concentration of the supply liquid. The chemical solution supply system according to the above section.
【請求項9】 前記第1の貯蔵槽に設けられ、前記薬液
の貯蔵量を測定して前記第2の貯蔵槽の前記希釈溶液の
薬液濃度を算出する第1の濃度測定手段と、 前記第2の貯蔵槽に設けられ、前記希釈溶液の貯蔵量を
測定して前記供給液の薬液濃度を算出する第2の濃度測
定手段とを備え、 前記制御系は、前記第1の濃度測定手段による前記希釈
溶液の薬液濃度の算出値及び前記第2の濃度測定手段に
よる前記供給液の薬液濃度の算出値を参照して前記第2
の供給手段を駆動制御し、前記第2の供給手段からの前
記希釈溶液の吐出量及び吐出速度を調節して前記供給液
の薬液濃度を目的値に制御することを特徴とする請求項
7に記載の薬液供給システム。
9. A first concentration measuring means provided in the first storage tank for measuring a storage amount of the chemical solution to calculate a chemical solution concentration of the diluted solution in the second storage tank; And a second concentration measuring means provided in the second storage tank and measuring a storage amount of the diluting solution to calculate a chemical concentration of the supply liquid, wherein the control system is provided by the first concentration measuring means. Referring to the calculated value of the chemical concentration of the diluted solution and the calculated value of the chemical concentration of the supply liquid by the second concentration measuring means, the second
8. The method according to claim 7, wherein the control unit controls the supply of the diluted solution by adjusting the discharge amount and the discharge speed of the diluted solution from the second supply unit to control the chemical concentration of the supply liquid to a target value. The chemical solution supply system according to the above.
【請求項10】 前記第1及び第2の濃度測定手段は、
導電性部材からなる一対の棒状センサを有し、前記棒状
センサの前記薬液内及び前記希釈溶液内への浸漬部位の
電気容量及びその時間変化を測定することにより、前記
薬液及び前記希釈溶液の液面高さ及びその変化速度を得
て、前記薬液濃度を算出する液位計であることを特徴と
する請求項8又は9に記載の薬液供給システム。
10. The first and second concentration measuring means,
It has a pair of rod-shaped sensors made of a conductive member, and measures the electric capacity of the immersion part of the rod-shaped sensor in the chemical solution and the diluting solution and its time change, thereby obtaining a liquid of the chemical solution and the diluting solution. The chemical solution supply system according to claim 8, wherein the chemical solution supply system is a liquid level meter that calculates the chemical solution concentration by obtaining a surface height and a change speed thereof.
【請求項11】 前記第1及び第2の濃度測定手段は、
前記薬液及び前記希釈溶液の重量及びその変化を測定
し、前記薬液濃度を算出する重量計であることを特徴と
する請求項8又は9に記載の薬液供給システム。
11. The first and second concentration measuring means,
The chemical solution supply system according to claim 8 or 9, wherein the weight solution is a weighing scale that measures the weight of the chemical solution and the diluted solution and changes thereof, and calculates the chemical solution concentration.
【請求項12】 設置された基板に洗浄液を供給して洗
浄する基板洗浄装置であって、 請求項1〜11のいずれか1項に記載の薬液供給システ
ムを備え、前記供給液を前記洗浄液として用いることを
特徴とする基板洗浄装置。
12. A substrate cleaning apparatus for supplying a cleaning liquid to an installed substrate and cleaning the substrate, comprising the chemical liquid supply system according to claim 1, wherein the supply liquid is used as the cleaning liquid. A substrate cleaning apparatus characterized by being used.
【請求項13】 少なくとも1種の薬液が溶媒に混合希
釈され、最終的な所定の薬液濃度に調節された供給液を
供給する薬液供給方法であって、 第1の供給手段の駆動により前記薬液が貯蔵された第1
の貯蔵槽から必要量の前記薬液を第1の配管系内を流動
する前記溶媒に混合希釈し、前記供給液より高い所定の
薬液濃度に調節されてなる希釈溶液を生成して、前記希
釈溶液を第2の貯蔵槽に貯蔵しておき、 第2の供給手段の駆動により前記第2の貯蔵槽から必要
量の前記希釈溶液を第2の配管系内を流動する前記溶媒
に更に混合希釈し、所定の薬液濃度の前記供給液を生成
して供給する薬液供給方法。
13. A chemical liquid supply method for mixing and diluting at least one chemical liquid with a solvent and supplying a final supply liquid adjusted to a predetermined chemical liquid concentration, wherein the first liquid supply means drives the liquid chemical. The first where was stored
Mixing and diluting a required amount of the chemical solution from the storage tank with the solvent flowing in the first piping system to generate a dilute solution adjusted to a predetermined chemical solution concentration higher than the supply liquid, Is stored in a second storage tank, and a required amount of the diluting solution is further mixed and diluted from the second storage tank with the solvent flowing in a second piping system by driving a second supply unit. And a chemical supply method for generating and supplying the supply liquid having a predetermined chemical concentration.
【請求項14】 前記第1及び第2の供給手段は、前記
希釈溶液及び前記薬液を通過させる流路が形成され、前
記流路の流入口に前記希釈溶液及び前記薬液の圧力上昇
により閉じる吸引弁が、前記流路の流出口に前記希釈溶
液及び前記薬液の圧力下降により閉じる吐出弁がそれぞ
れ設けられてなる液供給ポンプであって、 前記流路における接液面の少なくとも一部が前記薬液に
対する不透過性且つ高耐蝕性の緻密部材からなるととも
に、前記緻密部材の一部が可動壁とされており、 前記可動壁と連結する加振器を備え、前記加振器の駆動
により前記可動壁をその壁面とほぼ直交する方向に振動
させて前記流路の体積を周期的に変化させるものである
ことを特徴とする請求項13に記載の薬液供給方法。
14. The first and second supply means are formed with a flow path through which the dilute solution and the chemical solution pass, and the suction is closed at an inlet of the flow path due to a rise in pressure of the dilute solution and the chemical solution. A valve is a liquid supply pump in which a discharge valve is provided at an outlet of the flow path, the discharge valve being closed by a decrease in pressure of the diluting solution and the chemical liquid, and at least a part of a liquid contact surface in the flow path has the chemical liquid. A dense member that is impermeable and highly resistant to corrosion, a part of the dense member is a movable wall, and a vibrator connected to the movable wall is provided. The movable member is driven by driving the vibrator. 14. The method according to claim 13, wherein the wall is vibrated in a direction substantially perpendicular to the wall surface to periodically change the volume of the channel.
JP11177434A 1999-06-23 1999-06-23 Method and system for supplying chemical liquid and apparatus for cleaning substrate Pending JP2001000931A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11177434A JP2001000931A (en) 1999-06-23 1999-06-23 Method and system for supplying chemical liquid and apparatus for cleaning substrate

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Family Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008086242A (en) * 2006-09-29 2008-04-17 Fujitsu Ltd Discharged quantity control method, discharge pressure control method, injection device, method for producing micro-body, discharged quantity control device and discharged quantity control program
JP2008251680A (en) * 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd Substrate treatment device
CN110660708A (en) * 2018-06-29 2020-01-07 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008086242A (en) * 2006-09-29 2008-04-17 Fujitsu Ltd Discharged quantity control method, discharge pressure control method, injection device, method for producing micro-body, discharged quantity control device and discharged quantity control program
US8124031B2 (en) 2006-09-29 2012-02-28 Fujitsu Limited Discharge volume control method, discharge pressure control method, and microbody forming method
US8241590B2 (en) 2006-09-29 2012-08-14 Fujitsu Limited Discharge volume control method, discharge pressure control method, and microbody forming method
JP2008251680A (en) * 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd Substrate treatment device
CN110660708A (en) * 2018-06-29 2020-01-07 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method
CN110660708B (en) * 2018-06-29 2024-05-03 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method

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