JP2001000928A - Cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning apparatus which can reduce the number of buffer tanks. SOLUTION: The treatment apparatus is provided with cleaning tanks 35 for cleaning an object W, a buffer tank 42 which is connected to each cleaning tank 35 through a valve 41, stores a cleaning solution L temporarily, and discharges the solution L outside after cooling it to a prescribed temperature, a level detecting means 43 for detecting the level of the solution L in the buffer tank 42, and a control means 44 which judges whether all the solution L in a prescribed cleaning tank 35 can be accepted in the buffer tank 42 or not from the information of the level detecting means 43 and closes the valve 41 connected to the prescribed cleaning tank 35 when the acceptance is possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus configured to discharge a cleaning liquid used for cleaning an object to be processed, after the cleaning liquid is cooled to a predetermined temperature and then discharged. More specifically, the present invention relates to a cleaning apparatus capable of reducing the number of buffer tanks temporarily stored when discharging a cleaning liquid.

[0002]

2. Description of the Related Art A cleaning apparatus of this type includes a plurality of cleaning tanks for cleaning an object to be processed, for example, an LCD glass substrate or a semiconductor wafer (hereinafter referred to as a "wafer"). It is known to provide a number of buffer tanks corresponding to the tank. Each cleaning tank stores a different chemical (cleaning liquid) depending on the purpose of cleaning. These chemicals are maintained at a relatively high temperature, for example, 80 ° C. in order to enhance the cleaning effect.

Further, in order to prevent the cleaning effect from lowering, the chemical is replaced with a new one at a predetermined time or at a predetermined number of times of cleaning. The chemical liquid discharged at the time of replacement is cooled to a predetermined temperature via a buffer tank connected to each cleaning tank, and then discharged to the outside. However, the harmful chemical solution is discharged to the outside after being subjected to a treatment for further detoxification. One buffer tank is provided for each cleaning tank, and has a capacity enough to store all the chemicals in each cleaning tank.

[0004]

However, in the conventional cleaning apparatus, since a buffer tank having substantially the same capacity as the cleaning tank is provided for each cleaning tank, the apparatus becomes large. was there.

The present invention has been made in view of the above circumstances, and has as its object to provide a cleaning apparatus capable of reducing the number of buffer tanks.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 includes a plurality of cleaning tanks for cleaning an object to be processed, and an opening / closing valve for each of these cleaning tanks. A buffer tank that is connected via a buffer and temporarily stores the cleaning liquid used in each of the cleaning processing tanks and discharges the liquid after cooling to a predetermined temperature, and a liquid level detection that detects a liquid level position of the cleaning liquid in the buffer tank. Means for determining whether or not all the cleaning liquid in the predetermined cleaning processing tank can be received in the buffer tank from the information of the liquid level detecting means, and opening and closing the predetermined cleaning processing tank if possible. Control means for issuing a signal for opening the valve.

[0007] In the invention configured as described above, the cleaning liquid flows out of the predetermined cleaning tank to the buffer tank only when the buffer tank can receive the cleaning liquid. Therefore, if at least one buffer tank is provided for a plurality of cleaning tanks, the cleaning liquid can be lowered to a predetermined temperature and discharged to the outside.

[0008] Further, when the discharge times of the cleaning liquid in some cleaning processing tanks overlap and a waiting time for discharging the cleaning liquid occurs, two or more buffer tanks are provided to improve the cleaning efficiency due to the waiting time. The drop can be prevented. Also in this case, the number of buffer tanks can be reduced with respect to the number of cleaning tanks.

Since the number of buffer tanks can be reduced as described above, the size of the cleaning apparatus can be reduced, and the maintenance area of the cleaning apparatus can be widened.

According to a second aspect of the present invention, there are provided a plurality of cleaning tanks for cleaning an object to be processed, and a cleaning liquid connected to each of the cleaning tanks via an on-off valve and used in each of the cleaning tanks. A buffer tank for temporarily storing and then discharging
Liquid level detecting means for detecting a liquid level position of the cleaning liquid in the buffer tank; and information on the liquid level detecting means for determining whether or not all the cleaning liquid in a predetermined cleaning tank can be received in the buffer tank. Judgment, if possible, control means for issuing a signal for opening an on-off valve communicating with the predetermined cleaning treatment tank, and an external discharge pipe for discharging the cleaning liquid from the buffer tank, and through this external discharge pipe And an aspirator for supplying a diluting liquid to the external discharge pipe so that the cleaning liquid discharged by the cooling is lowered to a predetermined temperature.

According to the invention having the above-described structure, the cleaning liquid can be cooled to a predetermined temperature while discharging the cleaning liquid from the buffer tank. Therefore, the cleaning liquid is discharged from the cleaning tank to the outside via the buffer tank. The time until discharging can be shortened. That is, since the time during which the cleaning liquid stays in the cleaning processing tank is shortened, the probability that the discharge times of the cleaning liquid in some cleaning processing tanks overlap is reduced, and the waiting time due to the overlapping of the discharge timings can be reduced. it can. Therefore, the number of buffer tanks can be reduced, and the cleaning efficiency can be improved.

According to a third aspect of the present invention, a plurality of cleaning tanks for cleaning an object to be processed, and a cleaning liquid connected to each of the cleaning tanks via an on-off valve and used in each of the cleaning tanks. Buffer tank which temporarily stores the liquid and discharges the liquid after cooling to a predetermined temperature, a liquid level detecting means for detecting a liquid level position of the cleaning liquid in the buffer tank, and a predetermined cleaning based on information of the liquid level detecting means. A control means for determining whether or not all the cleaning liquid in the processing tank can be received in the buffer tank, and if possible, issuing a signal for opening an on-off valve communicating with the predetermined cleaning processing tank; and An aspirator connected to an external discharge pipe for discharging the cleaning liquid from the apparatus, and supplying a diluting liquid to the external discharge pipe so that the cleaning liquid discharged through the external discharge pipe drops to a predetermined temperature. Characterized in that it comprises a.

[0013] In the invention configured as described above, the cleaning liquid can be discharged to the outside without using an aspirator when the temperature of the cleaning liquid is sufficiently lowered to the outside in the buffer tank. Further, when the cleaning liquid can be sufficiently lowered to a temperature at which the cleaning liquid can be discharged to the outside only by the aspirator, the cleaning liquid can be discharged to the outside without cooling in the buffer tank. Further, by using the cooling by the buffer tank and the aspirator together, the cooling time of the cleaning liquid can be shortened, and the time until the cleaning liquid is discharged to the outside can be shortened. Therefore, the most suitable cooling means can be selected according to the type and temperature of the cleaning liquid and the diluting liquid, or the cooling cost and the cooling time. Also, cooling with a buffer tank,
By using the cooling with the aspirator together, the cooling time of the cleaning liquid can be shortened, so that the number of buffer tanks can be further reduced with respect to the number of cleaning processing tanks, and the cleaning efficiency is improved. Can be.

According to a fourth aspect of the present invention, in the first or third aspect, a cooling means for cooling the cleaning liquid in the buffer tank and a temperature detecting means for detecting the temperature of the cleaning liquid in the buffer tank are provided. The control means determines whether or not the temperature of the cleaning liquid has dropped to a predetermined temperature from the information of the temperature detection means.If the temperature has fallen, the control means issues a signal to stop cooling by the cooling means, A signal for discharging the cleaning liquid is issued.

[0015] In the invention thus configured, for example, in the case of winter, the amount of heat to be cooled in the path discharged from the buffer tank to the outside is taken into consideration, and becomes a reference when the cleaning liquid is discharged from the buffer tank. The temperature can be set higher by a predetermined amount. Therefore, the energy required for cooling can be reduced. Claim 3
In the combination with the described invention, the flow rate of the diluent can be adjusted according to the temperature of the cleaning liquid in the buffer tank, and the buffer tank can be adjusted according to the temperature of the diluent and the flow rate that can be supplied. It is possible to determine whether or not the cleaning liquid should be cooled, and if so, how many times to cool the cleaning liquid. This determination can be made by the control means. Therefore, depending on the type and temperature of the cleaning liquid and the diluting liquid, or the cooling cost and the cooling time,
The most suitable means can be selected.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. The cleaning processing apparatus shown in this embodiment is applied to a first processing unit 31 in a semiconductor wafer cleaning processing system.

First Embodiment First, a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, a first processing unit 31 as a cleaning processing apparatus according to the first embodiment includes a semiconductor wafer (hereinafter, referred to as a “wafer”) as an object to be processed.
A plurality (two in this embodiment) of cleaning processing tanks 35 for cleaning W, and an opening / closing valve 4
1, a buffer tank 42 for temporarily storing the cleaning liquid L used in each cleaning processing tank 35, discharging the cleaning liquid L to the outside after cooling to a predetermined temperature, and a cleaning liquid L in the buffer tank 42. A liquid level detecting means 43 for detecting a liquid level position, and, based on information from the liquid level detecting means 43, a predetermined cleaning processing tank 35, that is, receiving all the cleaning liquid L in one cleaning processing tank 35 into the buffer tank 42. The control means 44 determines whether or not the cleaning process is possible, and if possible, issues a signal for opening the on-off valve 41 communicating with the predetermined cleaning tank 35.

Hereinafter, the above configuration will be described in more detail. First, a semiconductor wafer cleaning processing system including the first processing unit 31 will be described. As shown in FIG. 2, the semiconductor wafer cleaning processing system includes a loading / unloading unit 2 for loading / unloading a container, for example, a carrier 1, for storing a wafer W in a horizontal state, and a chemical solution, a rinsing solution, etc. A processing unit 3 that performs a cleaning process and a drying process with a cleaning liquid of the type described above, and a wafer W that is positioned between the loading / unloading unit 2 and the processing unit 3 and that performs transfer of the wafer W, position adjustment, attitude conversion, interval adjustment, and the like. It mainly comprises a delivery unit, for example, an interface unit 4.

The carry-in / carry-out section 2 is located at one end of the semiconductor wafer cleaning system, and is provided with a carrier carry-in section 5.
a and a carrier carrying-out section 5b, and a wafer carrying-in / out section 6. A transport mechanism (not shown) is provided between the carrier loading section 5a and the wafer loading / unloading section 6, and the transport mechanism transports the carrier 1 from the carrier loading section 5a to the wafer loading / unloading section 6. Have been.

A carrier lifter (not shown) is disposed in each of the carrier carrying-out section 5b and the wafer carrying-in / out section 6, and a carrier provided by the carrier lifter above the carrying-in / out section 2 for empty carriers 1. It is configured to be able to perform delivery to a standby unit (not shown) and reception from the carrier standby unit.

The wafer loading / unloading section 6 is open to the interface section 4, and a lid opening / closing device 7 is provided in the opening. The lid (not shown) of the carrier 1 is opened or closed by the lid opening / closing device 7. Accordingly, the lid of the carrier 1 for storing the unprocessed wafers W transferred to the wafer loading / unloading section 6 is removed by the lid opening / closing device 7 so that the wafers W in the carrier 1 can be unloaded, and all the wafers W are unloaded. Thereafter, the lid can be closed again by the lid opening / closing device 7. Also,
The lid of the empty carrier 1 transported from the carrier standby section to the wafer loading / unloading section 6 is removed by the lid opening / closing device 7 so that the wafers W can be loaded into the carrier 1 and all the wafers W
After the is loaded, the lid can be closed again by the lid opening / closing device 7. A mapping sensor 9 for detecting the number of wafers W stored in the carrier 1 is provided near the opening of the wafer loading / unloading section 6.

The interface unit 4 holds a plurality of wafers W, for example, 25 wafers in a horizontal state, and transfers the wafers W between the carrier 1 of the wafer loading / unloading unit 6 in a horizontal state. And a plurality of, for example
Interval adjusting means for holding the two wafers W vertically at a predetermined interval, for example, a pitch changer (not shown);
An attitude conversion device 10 positioned between the wafer transfer arm 8 and the pitch changer for converting a plurality of wafers W, for example, 26 wafers, between a horizontal state and a vertical state, and provided on the wafer W whose attitude has been changed to a vertical state. Position detecting means, for example, a notch aligner 11 for detecting the notch (not shown) is provided. The interface unit 4 includes a processing unit 3
Is provided, and the transfer path 21
A transfer means, for example, a wafer transfer chuck 20 is movably provided.

In this case, the wafer transfer arm 8 takes out and transfers a plurality of wafers W from the carrier 1 of the wafer loading / unloading section 6 and also has two holding sections for accommodating the plurality of wafers W in the carrier 1, for example. Arm body 8a, 8b
It is attached. The arms 8 a and 8 b are formed so as to be movable in the horizontal direction (X and Y directions), the vertical direction (Z direction) and the rotation direction (θ direction), and the carrier 1 mounted on the wafer loading / unloading section 6. The transfer of the wafer W is performed between the apparatus and the attitude conversion device 10. Therefore, an unprocessed wafer W can be held by one arm body 8a, and a processed wafer W can be held by the other arm body 8b.

On the other hand, the processing unit 3 includes a first processing unit 31 for removing particles and organic contaminants adhering to the wafer W, a second processing unit 32 for removing metal contaminants adhering to the wafer W, A cleaning / drying processing unit 33 and a chuck cleaning unit 34 for removing and drying a chemical oxide film adhered to the wafer W are linearly arranged, and are provided at positions opposed to these units 31 to 34. A wafer transfer chuck 20 that is movable in the X, Y directions (horizontal direction), the Z direction (vertical direction), and the θ direction (rotation direction) is provided in the path 21. Note that the chuck cleaning unit 34 does not necessarily need to be disposed between the cleaning / drying processing unit 33 and the interface unit 4. For example, the chuck cleaning unit 34 is disposed between the second processing unit 32 and the cleaning / drying processing unit 33. Alternatively, it may be disposed adjacent to the first processing unit 31.

The first to third processing units 31 to 33 include a cleaning tank 35 for storing a cleaning liquid L such as a predetermined chemical solution and pure water, and a wafer W in each cleaning tank 35.
A moving means for moving (loading / unloading), for example, a wafer boat 36, is provided. Opening / closing means for opening and closing an opening provided in a processing chamber 37 accommodating each cleaning processing tank 35 is provided between each cleaning processing tank 35 disposed in the first and second processing units 31 and 32. For example, a shutter 38 is provided.

Next, the first processing unit 31 as the cleaning apparatus of the first embodiment will be described in more detail. The first processing unit 31 is provided with two cleaning processing tanks 35 as shown in FIG. One cleaning processing tank 35 stores a cleaning liquid L as a chemical for removing particles and organic substances contaminating the wafer W, and the other cleaning processing tank 35 for removing the chemical attached to the wafer W. A cleaning liquid L as a rinse liquid using pure water or the like is stored.

Each cleaning tank 35 includes an inner tank 35a for storing a cleaning liquid L for cleaning the wafer W, and an inner tank 35a.
Outer tank 35b formed to surround the periphery of the upper edge opening
It is configured to have: The bottom of the outer tank 35b and the bottom of the inner tank 35a are connected via a circulation pipe 35c.
Pump 35d, temperature controller 35e, filter 35 from the side
f is provided. With such a configuration, the cleaning liquid L in each of the cleaning tanks 35 is always kept clean, for example, at a temperature of 80 ° C. However, a completely new cleaning liquid L that is not evaporated and that is newly supplied at the time of replacement is supplied from a supply source 35 g.

The inner tank 35 in each cleaning tank 35
a and the bottom of the outer tank 35b are connected to a central discharge line 45b through a tributary discharge line 45a.
b is connected to the ceiling of the buffer tank 42. Each branch discharge line 45a is provided with an opening / closing valve 41 which is opened and closed by an electric signal, for example, an electromagnetic valve.

On the other hand, the buffer tank 42 is provided with a buffer plate 42b provided diagonally at a position immediately below the opening 42a communicating with the central discharge pipe 45b. The buffer plate 42b prevents the cleaning liquid L from waving by vigorously flowing the cleaning liquid L, thereby preventing the detection accuracy of the liquid level detection unit 43 described later from lowering. Further, the buffer tank 42 is provided with a liquid level detecting means 43 for detecting the liquid level of the cleaning liquid L.

The liquid level detecting means 43 transmits at least one of the upper cleaning position 43a of the liquid surface in the buffer tank 42, the lower limit position 43b of the same liquid surface, and one of the cleaning tanks 35 to the buffer tank 42. It is possible to detect the position of the liquid surface that can be received inside, that is, the acceptable position 43c. Further, the buffer tank 42 is provided with a temperature sensor (temperature detecting means) 46 for measuring the temperature of the cleaning liquid L. In the buffer tank 42, the capacity of the upper part from the lower limit position 43b is about 1.5 times the capacity of each cleaning tank 35,
Even if all the cleaning liquid L flows in from one of the cleaning processing tanks 35, it does not overflow.

The temperature sensor 46 is constituted by a thermocouple, a thermistor, or the like, and is arranged at a position below the receivable position 43c. The buffer tank 42 is provided with a cooler (cooling means) 47 for cooling the cleaning liquid L. The cooler 47 includes a heat exchanger 47a provided so as to be immersed in the cleaning liquid L in the buffer tank 42, and an adjuster 47b for adjusting the temperature and amount of a cooling medium such as water sent to the heat exchanger 47a. Have.

Further, at the bottom of the buffer tank 42,
An external discharge line 48a is connected, and an open / close valve 48b formed of, for example, a solenoid valve, which is opened and closed by an electric signal, is provided in the external discharge line 48a. Further, the external discharge pipe 48a is connected to the sewer pipe 49.

The opening and closing of the on-off valves 41 and 48b is controlled by a control means 44. The control means 44 has a central processing unit (CPU) and various input devices, output devices, memories, etc., and is programmable. The input device of the control device 44 is connected to the liquid level detecting means 43, the temperature sensor 46, and the like.
48b are connected.

Then, the controller 44 controls the liquid level detecting means 4
At least the upper limit position 43a, the lower limit position 43b, and the receivable position 43c are ascertained from the information from No. 3, and when the cleaning liquid L is discharged from the predetermined cleaning processing tank 35, the liquid level of the buffer tank 42 is received. If the position is equal to or less than the possible position 43c, a signal for opening the on-off valve 41 corresponding to the predetermined cleaning processing tank 35 is issued, and control to send the cleaning liquid L to the buffer tank 42 is enabled. Further, the control device 44 issues a signal to close the on-off valve 41 when the cleaning liquid L in the cleaning processing tank 35 runs out. When the cleaning liquid L reaches the upper limit position 43a, the opening / closing valve 41 is closed in order to prevent the cleaning liquid L from overflowing from the buffer tank 42.

The control device 44 controls the buffer tank 4
The temperature of the cleaning liquid L flowing into the inside 2 is grasped via the temperature sensor 46, and if the temperature of the cleaning liquid L exceeds a predetermined temperature that can be discharged to the outside, the controller 47b of the cooler 47 performs cooling. And the cleaning liquid L is cooled. Further, when the temperature of the cleaning liquid L falls below a predetermined temperature at which the cleaning liquid L can be discharged to the outside, the control device 44 issues a signal to stop cooling to the adjuster 47b and discharges the cleaning liquid L in the buffer tank 42. Valve 48b
A signal is issued to open the on-off valve 48b when the liquid level reaches the lower limit position 43b. The set value of the temperature at which the cleaning liquid L can be discharged to the outside can be changed by an input device such as a keyboard.

In the first processing unit 31 as the cleaning apparatus configured as described above, for example, when the cleaning liquid L in one of the cleaning tanks 35 reaches the replacement time, the replacement time is controlled. Means 44 will make the determination. In this case, the control unit 44 determines, for example, whether the usage time of the cleaning liquid L has reached a specified time, and when the specified time has been reached during cleaning, the cleaning liquid L is removed after the current cleaning is completed. A signal to exchange will be issued.

If it is clear that the specified time will be reached at the next cleaning, a signal for replacing the cleaning liquid L may be issued after the cleaning immediately before the specified time is reached. Further, the control unit 44 may determine when the number of times of cleaning of the wafer W reaches the specified number of times, and issue a signal for replacing the cleaning liquid L.

As described above, when the signal for replacing the cleaning liquid L is issued, first, based on the signal from the liquid level detecting means 43, the liquid level of the buffer tank 42 is set at the acceptable position 4.
3c or less and the on-off valve 48b is in the closed state (YE
It is determined whether S) or not (NO). If YES, a signal for opening the two on-off valves 41 corresponding to the one cleaning processing tank 35 is issued. At this time, the on-off valve 48
When b is not in the closed state (NO), a signal for opening the on-off valve 41 is issued after a signal for closing the on-off valve 48b is issued. As a result, the high-temperature cleaning liquid L maintained at a predetermined temperature, for example, 80 ° C., flows out from the one cleaning processing tank 35 to the buffer tank 42. Therefore, the inside of one of the cleaning tanks 35 becomes empty, and after detecting this empty state with a predetermined sensor (not shown),
A close signal is issued to the on-off valve 41, and the on-off valve 41 is closed. Then, a new cleaning liquid L is supplied from the supply source 35 g into the empty cleaning processing tank 35.

In the buffer tank 42, a temperature sensor 46
Temperature of the cleaning liquid L measured by
ES) or not (NO), and if NO,
A signal for cooling is issued to the cooler 47, and the cooling medium flows from the regulator 47b to the heat exchanger 47a. As a result, the cleaning liquid L is rapidly cooled. Then, when the temperature of the cleaning liquid L becomes equal to or lower than the specified temperature (YES), a signal for stopping the cooler 47 is issued, and the flow of the cooling medium is stopped.
Further, a signal for opening the on-off valve 48b is generated. As a result, the opening / closing valve 48b is opened, and the cleaning liquid L having a temperature equal to or lower than the dischargeable temperature is discharged to the drain pipe 49 via the external discharge pipe 48a.
Will be leaked.

As described above, by providing only one buffer tank 42 for the two cleaning tanks 35, the cleaning liquid L can be lowered to a predetermined temperature and discharged to the outside. Therefore, as compared with the conventional case in which one buffer tank is provided for each cleaning tank, the size of the cleaning apparatus can be reduced, and the maintenance area of the cleaning apparatus can be widened. . Even when the cleaning liquid L is discharged from each cleaning tank 35 at the same time, if the liquid level in the buffer tank 42 does not become lower than the acceptable position 43c, the other cleaning tank 3
Since the cleaning liquid L does not flow out of the buffer tank 5, it is possible to prevent the cleaning liquid L from overflowing from the buffer tank 42.

Further, a specified temperature serving as a criterion for discharging the cleaning liquid L from the buffer tank 42 can be freely input to the control device 44 via the keyboard. Therefore, for example, in the winter season, the amount of heat to be cooled in the path discharged from the buffer tank 42 to the outside increases,
The specified temperature can be increased. For this reason, it is effective also in energy saving.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. However, constituent elements common to the first embodiment are denoted by the same reference numerals, and description thereof will be simplified. The difference between the second embodiment and the first embodiment is that the buffer tank 42
In the process, the cleaning liquid L is not cooled to a predetermined temperature, but is discharged through the aspirator 53.
Is reduced to a predetermined temperature.

That is, two discharge pipes 52 are connected to the side wall of the buffer tank 42 near the bottom thereof, and each discharge pipe 52 is connected to the suction port of the aspirator 53. Note that each discharge pipe 52 may be connected to the bottom of the buffer tank 42.

Each aspirator 53 has an inlet connected to each supply source 51 a in the diluent supply device 51, and an outlet connected to a sewage pipe 49 via an external discharge pipe 54. The aspirator 53 sucks the cleaning liquid L from the discharge pipe 52 connected to the suction port according to the flow rate of the diluting liquid supplied from the supply source 51a, and defines the cleaning liquid L by mixing the cleaning liquid L and the diluting liquid. After the temperature is lowered to the temperature, the mixed liquid is discharged to a sewer pipe 49.

As the diluent, water such as ordinary tap water or groundwater is used. Further, the diluent supply device 51 can adjust the flow rate of the diluent flowing out of each supply source 51 a by a signal from the control device 44. Then, the control device 44 detects the temperature of the mixed liquid of the cleaning liquid L and the diluting liquid with a temperature sensor (not shown) provided in each of the external discharge pipes 54, and adjusts the temperature to a specified temperature. The flow rate of the diluent flowing out of the supply source 51a is controlled. Although not shown, each supply source 5
The temperature of the diluent flowing out of 1a is also measured, and this temperature information is also input to the controller 44. Although the buffer tank 42 is not provided with a temperature sensor, it is preferable that the buffer tank 42 be provided with a temperature sensor 46 as described in the first embodiment.

In the first processing unit 31 as the cleaning apparatus configured as described above, the cleaning liquid L in the buffer tank 42 can be cooled to the specified temperature while discharging the cleaning liquid L from the buffer tank 42. The time until the cleaning liquid L is discharged from the cleaning tank 35 to the outside can be reduced. In addition, since the time during which the cleaning liquid L stays in the buffer tank 42 is shortened, the probability that the discharge timing of the cleaning liquid L in each cleaning tank 35 overlaps is reduced.
Further, even if the discharge times overlap, the waiting time due to the overlap of the discharge times can be reduced. Therefore,
The cleaning efficiency can be improved.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. However, the same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and description thereof will be simplified. The third embodiment has a configuration in which the first embodiment and the second embodiment are combined.

That is, components such as the diluent supply device 51, supply source 51a, discharge line 52, aspirator 53, and external discharge line 54 shown in the second embodiment are added to the first embodiment. It has a configuration.

In the first processing unit 31 as a cleaning apparatus configured as described above, if necessary,
The cleaning liquid L can be cooled using one or both of the cooler 47 and the aspirator 53. For example,
When the diluent is not sufficiently obtained, or when the temperature of the diluent is high and the temperature of the cleaning liquid L cannot be sufficiently lowered to the specified temperature, the cooler 47 is used to obtain a sufficiently low-temperature diluent. The aspirator 53 can be used in place of the cooler 47. Moreover, by using both the cooler 47 and the aspirator 53, the cooling time of the cleaning liquid L can be reduced. Therefore, the cleaning liquid L to be cooled
The most suitable means can be selected according to the type and temperature of the diluent and the diluent, or the cooling cost and cooling time.

Further, the cleaning liquid L in the buffer tank 42
The flow rate of the diluting liquid can be adjusted according to the temperature of the diluting liquid, and whether the cleaning liquid L should be cooled in the buffer tank 42 depends on the temperature of the diluting liquid and the flow rate that can be supplied. It can be determined in detail whether cooling should be performed.

In each of the above embodiments, an example in which the cleaning apparatus is applied to the first processing unit 31 has been described. However, the second processing unit 32 and the first and second processing units 31 and 32 have been described. May be applied to both. In that case, one buffer tank 42 can be provided for three or more cleaning processing tanks 35. When the number of the cleaning processing tanks 35 is n, at least n-
With one buffer tank 42, the wafer W
Can be washed.

In each of the above embodiments, one of the cleaning tanks 35 is configured to be filled with the rinsing liquid (the cleaning liquid L). However, since the rinsing liquid is often discharged as it is while overflowing from the cleaning processing tank 35, the cleaning processing tank 35 for storing the chemical solution (the cleaning liquid L) in the first processing unit 31 is used as one and the other cleaning processing tank 35. 35 and a cleaning treatment tank 35 for storing a chemical solution (cleaning liquid L) in the second processing unit 32.

Further, although an example in which the wafer W is used as the object to be processed has been described, it goes without saying that an LCD glass substrate or the like may be used.

[0054]

As described above, according to the present invention, because of the above-described configuration, the following excellent effects can be obtained.

(1) According to the first aspect of the present invention, the cleaning liquid flows out of the predetermined cleaning tank to the buffer tank only when the buffer tank can receive the cleaning liquid. Therefore, if at least one buffer tank is provided for a plurality of cleaning tanks, the cleaning liquid can be lowered to a predetermined temperature and discharged to the outside.

In the case where the discharge times of the cleaning liquids in some cleaning tanks overlap and a waiting time for discharging the cleaning liquids occurs, two or more buffer tanks are provided to improve the cleaning efficiency due to the waiting time. The drop can be prevented. Also in this case, the number of buffer tanks can be reduced with respect to the number of cleaning tanks.

Since the number of buffer tanks can be reduced as described above, the size of the cleaning apparatus can be reduced, and the maintenance area of the cleaning apparatus can be widened.

(2) According to the second aspect of the present invention, the cleaning liquid can be cooled to a predetermined temperature while discharging the cleaning liquid from the buffer tank, so that the cleaning liquid is transferred from the cleaning tank through the buffer tank. The time required to discharge to the outside. That is, since the time during which the cleaning liquid stays in the cleaning processing tank is shortened, the probability that the discharge times of the cleaning liquid in some cleaning processing tanks overlap is reduced, and the waiting time due to the overlapping of the discharge timings can be reduced. it can. Therefore, the number of buffer tanks can be reduced, and the cleaning efficiency can be improved.

(3) According to the third aspect of the present invention, when the temperature of the cleaning liquid drops sufficiently to the outside in the buffer tank, the cleaning liquid can be discharged to the outside without using an aspirator. . Further, when the cleaning liquid can be sufficiently lowered to a temperature at which the cleaning liquid can be discharged to the outside only by the aspirator, the cleaning liquid can be discharged to the outside without cooling in the buffer tank. further,
By using the cooling by the buffer tank and the aspirator together, the cooling time of the cleaning liquid can be shortened, and the time until the cleaning liquid is discharged to the outside can be shortened. Therefore, the most suitable cooling means can be selected according to the type and temperature of the cleaning liquid and the diluting liquid, or the cooling cost and the cooling time. Also, by using both the cooling by the buffer tank and the cooling by the aspirator together, the cooling time of the cleaning liquid can be shortened, so that the number of buffer tanks can be further reduced and the cleaning efficiency is improved. Can be.

(4) According to the fourth aspect of the present invention, in the case of winter, for example, in consideration of the amount of heat to be cooled in the path discharged from the buffer tank to the outside, the cleaning liquid is discharged from the buffer tank. The reference temperature can be set higher by a predetermined amount. Therefore, the energy required for cooling can be reduced. Further, according to the present invention, the flow rate of the diluting liquid can be adjusted according to the temperature of the cleaning liquid in the buffer tank, and the temperature of the diluting liquid and the flow rate that can be supplied can be adjusted. Whether the cleaning solution should be cooled in the buffer tank,
In the case of cooling, it is possible to determine in detail how many times the cooling should be performed. This determination can be made by the control means. Therefore, the most suitable means can be selected according to the type and temperature of the cleaning liquid and the diluting liquid, or the cooling cost and the cooling time.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a first processing unit as a cleaning apparatus shown as a first embodiment of the present invention.

FIG. 2 is a schematic plan view of a semiconductor wafer cleaning processing system having the first processing unit.

FIG. 3 is a schematic cross-sectional view showing a first processing unit as a cleaning processing apparatus shown as a second embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing a first processing unit as a cleaning processing apparatus shown as a third embodiment of the present invention.

[Explanation of symbols]

 31 First processing unit 35 Cleaning treatment tank 41 Open / close valve 42 Buffer tank 43 Liquid level detecting means 44 Control means 46 Temperature sensor (temperature detecting means) 53 Aspirator 54 External discharge pipeline L Cleaning liquid W Semiconductor wafer (workpiece)

Claims (4)

[Claims] 1. A plurality of cleaning tanks for cleaning an object to be processed, and a plurality of cleaning tanks connected to the respective cleaning processing tanks via an on-off valve to temporarily store a cleaning liquid used in each of the cleaning processing tanks. A buffer tank for discharging after cooling to a predetermined temperature, a liquid level detecting means for detecting a liquid level position of the cleaning liquid in the buffer tank, and all the liquids in the predetermined cleaning tank based on the information of the liquid level detecting means. Control means for judging whether or not the washing liquid can be received in the buffer tank and, if possible, issuing a signal for opening an open / close valve communicating with the predetermined washing tank. apparatus. 2. A plurality of cleaning tanks for cleaning an object to be processed, and a plurality of cleaning tanks connected to each of these cleaning processing tanks via an on-off valve to temporarily store a cleaning liquid used in each of the cleaning processing tanks. A buffer tank to be discharged later, a liquid level detecting means for detecting a liquid level position of the cleaning liquid in the buffer tank, and all the cleaning liquid in a predetermined cleaning tank is received in the buffer tank based on information of the liquid level detecting means. It is determined whether or not it is possible, and if possible, a control means for issuing a signal for opening an open / close valve communicating with the predetermined cleaning treatment tank, and connected to an external discharge pipe for discharging the cleaning liquid from the buffer tank, An aspirator for supplying a diluting liquid to the external discharge pipe so that the cleaning liquid discharged through the external discharge pipe drops to a predetermined temperature. 3. A plurality of cleaning tanks for cleaning an object to be processed, and a plurality of cleaning tanks connected to the respective cleaning processing tanks via an on-off valve for temporarily storing a cleaning liquid used in each of the cleaning processing tanks. A buffer tank for discharging after cooling to a predetermined temperature, a liquid level detecting means for detecting a liquid level position of the cleaning liquid in the buffer tank, and all the liquids in the predetermined cleaning tank based on the information of the liquid level detecting means. A control means for determining whether or not the cleaning liquid can be received in the buffer tank and, if possible, issuing a signal for opening an open / close valve communicating with the predetermined cleaning processing tank; and an external means for discharging the cleaning liquid from the buffer tank. An aspirator connected to the discharge line and supplying a diluting liquid to the external discharge line so that the cleaning liquid discharged through the external discharge line drops to a predetermined temperature. Cleaning apparatus according to symptoms. A cooling means for cooling the cleaning liquid in the buffer tank; and a temperature detecting means for detecting a temperature of the cleaning liquid in the buffer tank, wherein the control means determines the cleaning liquid based on the information from the temperature detecting means. It is determined whether or not the temperature has decreased, and if it has decreased, a signal to stop cooling by the cooling means is issued, and
4. The cleaning apparatus according to claim 1, wherein a signal for discharging the cleaning liquid from the buffer tank is issued.