JP2000349133A - Alignment of carrying device and substrate treater - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the alignment method of a substrate carrying device, which can perform an alignment of the substrate carrying device in a short time and automatically, and a substrate treater. SOLUTION: This alignment method is the alignment method of a substrate carrying device, wherein when a wafer W is delivered to a coating treatment unit (COT) by the carrying device 46, the device 46 is aligned with a spin chuck 52 of the unit (COT) so that forcepses 48 of the device 46 carry the substrate in the prescribed delivery position of the substrate on the spin chuck 52. At this time, the wafer W is carried in the spin chuck 52 of the unit (COT) by the forcepses 48, the amount of the positional diviation of the wafer W from the deliverty position of the wafer W on the chuck 52 is detected by a detecting means 163, the amount of the positional deviation of the forcepses 48 from the delivery position of the wafer on the chuck 52 is calculated on the basis of this detected value and the forcepses 48 correct the position to deliver the substrate on the basis of the amount of the positional deviation of the forcepses 48.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method of aligning a transfer device and a substrate processing apparatus provided with various processing units for performing various processes on a substrate such as a semiconductor wafer.

[0002]

2. Description of the Related Art For example, in a coating and developing processing system in a semiconductor device manufacturing process, a photoresist liquid is applied to a semiconductor wafer (hereinafter, referred to as a wafer), and a circuit pattern or the like is reduced by using a photolithography technique to form a photoresist. The film has been exposed and developed.

In this coating and developing system, a cassette station for loading a cassette containing wafers and unloading the wafers one by one and various processing units for performing various processes for coating and developing the wafers are provided. A processing station arranged in multiple stages, an exposure apparatus arranged adjacent to the processing station for exposing a wafer, and an interface unit for transferring a wafer between the processing station and the exposure apparatus are integrally formed. It has a connected configuration.

In such a coating and developing system, wafers are taken out of the cassette one by one in a cassette station and transferred to the processing station. After the wafer is cleaned in the cleaning unit, the wafer is subjected to hydrophobic treatment in the adhesion processing unit, cooled in the cooling processing unit, and then coated with a photoresist film in the resist coating unit. Next, the wafer is heated and baked in a heat treatment unit.

Thereafter, the wafer is transported from the processing station to the exposure apparatus via the interface unit, where a predetermined pattern is exposed by the exposure apparatus. After the exposure, the wafer is returned to the processing station via the interface unit. Conveyed. The exposed wafer is subjected to a baking process (post-baking) after a developing unit is applied with a developing solution to form a predetermined pattern. After this series of processing is completed, the wafer is transferred to a cassette station and stored in a wafer cassette.

[0006]

By the way, in such a series of coating and developing processes, a plurality of processing units for performing various processes such as a cleaning process, a coating process, a developing process, and a heating process in the processing station. A wafer transfer device for transferring a wafer to and from the device is provided to be vertically movable.

This wafer transfer device has tweezers movable in the horizontal direction.
It can move up and down in the vertical direction (Z direction) and can rotate in the θ direction. Accordingly, the wafer transfer device receives or transfers the wafer from each processing unit using tweezers, and the wafer transfer device itself moves up and down in the vertical direction (Z direction) and rotates in the θ direction to rotate the various processing units. Is to be accessed.

When the wafer transfer device mounts the wafer on the tweezers and transfers the wafer to the mounting table in the various processing units, the wafer is accurately mounted on the mounting table.
It is necessary to perform positioning (centering) for adjusting the position of the tweezers at a predetermined timing. That is, it is necessary to adjust the position where the tweezers move while placing the wafer and the tweezers finally deliver the wafer to the mounting table.

Such alignment of the wafer transfer device is performed for each processing unit at the time of initial setting of the coating / developing processing system.
Although the alignment of the transport device is performed regularly or irregularly, such alignment can be performed with as little time as possible.
In addition, there is a demand for automatic execution.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of aligning a transfer apparatus and a substrate processing apparatus capable of automatically performing the alignment of the transfer apparatus in a short time. Aim.

[0011]

According to a first aspect of the present invention, there is provided a processing unit for performing a predetermined process on a substrate mounted on a mounting table, and the processing unit includes: In a substrate processing apparatus having a transfer device for loading and unloading a substrate with respect to a transfer device, the transfer device aligns the transfer device so that the transfer device loads the substrate to a predetermined delivery position on the mounting table. A carrying-in step of carrying the substrate into the mounting table of the processing unit by the transfer device; a detecting step of detecting a positional deviation amount of the substrate with respect to the delivery position on the mounting table by the detecting means; A calculating step of calculating a displacement amount of the transfer device based on the detected value of the amount, and a correction step of correcting a position at which the transfer device transfers the substrate based on the calculated shift amount of the transfer device. You Alignment method of conveying apparatus, characterized in that there is provided.

As described above, the substrate is carried into the mounting table of the processing unit by the transfer device, and the displacement of the substrate with respect to the delivery position on the mounting table is detected by the detecting means.
Based on the detected value of the displacement amount of the substrate, the transfer device calculates the position displacement amount of the position at which the transfer device transfers the substrate, and based on the calculated position shift amount of the transfer device, the position at which the transfer device transfers the substrate. Is corrected, the position can be automatically adjusted without bothering the operator. For example, when the processing unit is initially set, the position of the transfer device can be quickly adjusted. This method is particularly effective for a processing apparatus in which the mounting table can rotate.

According to a second aspect of the present invention, there is provided a processing plate having a plurality of lift pins, the substrate being moved between a mounting position and a transfer position by the lift pins,
In a substrate processing apparatus having a processing unit for performing a predetermined process on a substrate at a mounting position and a transport device for loading and unloading the substrate into and out of the processing unit, the transport device includes a plurality of raised processing units disposed at a center position of a processing plate and raised A method of positioning a transfer device for positioning a transfer device so as to transfer a substrate to a predetermined delivery position defined by an upper end position of a lift pin, wherein a detecting unit is provided above the processing plate, A detecting step of detecting the center position of the processing plate and the upper end positions of the plurality of lift pins raised by the detecting means while moving the means above the processing plate by the transfer device; and detecting the center position and the upper end position. Based on the position of the transfer device and the transfer device. There alignment method of conveying apparatus characterized by comprising a correction step of correcting a position to pass a substrate is provided.

Thus, while the detecting means is moved above the processing plate by the transport device, the detecting means
Detecting the center position of the processing plate and the upper end position of the plurality of lift pins that have risen, and then, based on the detected values of the center position and the upper end position, grasps the positional deviation amount of the position where the transfer device transfers the substrate, Since the position at which the transfer device transfers the substrate is corrected based on the amount of displacement of the transfer device,
Positioning can be performed automatically without bothering the operator, and particularly, positioning can be quickly performed at the time of initial setting of a thermal processing unit or the like.

Further, according to a third aspect of the present invention, there is provided a processing apparatus having a plurality of processing units for performing a predetermined processing on a substrate, and a transfer device for loading and unloading the substrate from and to these processing units. A method of positioning a transfer device for positioning a transfer device so that the transfer device transfers a substrate to a predetermined delivery position of each processing unit, wherein the transfer device transfers a substrate in each processing unit. A step of performing positioning in advance and storing the positioning data in the storage means, and at a predetermined timing, within one processing unit, grasping a positional deviation amount of a position where the transfer device transfers the substrate, A first correction step of correcting a position at which the transfer device transfers the substrate based on the first correction step;
At this time, the correction data is input to the storage means, and based on the correction data, a replacement step of replacing the alignment data of each processing unit already stored in the storage means with predetermined correction data; and And a second correction step of correcting a position at which the transfer device transfers the substrate in another processing unit based on the correction data.

As described above, at a predetermined timing, within one processing unit, the amount of displacement of the position at which the transfer device transfers the substrate is grasped, and based on this, the position at which the transfer device transfers the substrate is corrected. Then, the correction data at this time is input to the storage means, and based on the correction data, the alignment data of each processing unit already stored in the storage means is replaced with predetermined correction data, and the corrected correction data is replaced. Based on the data, the position where the transfer device transfers the substrate in another processing unit is corrected, so if the correction data for one processing unit is obtained, the other processing unit already stores the correction data based on the correction data. It is only necessary to correct the alignment data that has been performed. Therefore, it is possible to perform the positioning of the transfer device of the plurality of processing units in an extremely short time.

According to a fourth aspect of the present invention, at least one first processing unit for performing a predetermined processing on a substrate mounted on a rotatable mounting table, and a processing plate having a plurality of lift pins are provided. At least one second processing unit that moves the substrate between the mounting position and the transfer position by the lift pins and performs a predetermined process on the substrate at the mounting position; and the first and second processing units. In a processing apparatus having a transfer device for loading and unloading a substrate to and from a unit, a transfer device positioning method for positioning the transfer device such that the transfer device loads a substrate to a predetermined delivery position of each processing unit. In the first processing unit and the second processing unit, the transfer device transfers the substrate by a method different from each other, and the position of the transfer unit is adjusted in advance. A step of storing the alignment data in the storage means, and a relation between the alignment data in the first processing unit and the alignment data in the second processing unit previously grasped and stored in the storage means. And, at a predetermined timing, in any one of the first processing unit and the second processing unit, the positional deviation amount of the position where the transfer device transfers the substrate is grasped. A first correction step of correcting the position at which the transfer device delivers the substrate based on the correction data, and inputting the correction data at this time to storage means, and correcting the correction data and the alignment data in the first processing unit. On the basis of the relationship between the data and the positioning data in the second processing unit. Replacing the data with predetermined correction data, and a second correction for correcting the transfer position of the transfer device in the other processing unit based on the corrected data of the other processing unit. And a method for aligning the transfer device.

In this way, at a predetermined timing, within one of the first processing unit and the second processing unit, the positional deviation amount of the position where the transfer device transfers the substrate is grasped. Based on this, the transfer device corrects the position at which the substrate is transferred, and inputs the correction data at this time to the storage means. The correction data, the alignment data in the first processing unit, and the second Based on the relationship with the alignment data in the processing unit, the alignment data of another processing unit stored in advance in this storage unit is replaced with predetermined correction data, and the corrected data of the other processing unit is replaced. Is corrected based on the position of the transfer device in another processing unit, so that the first processing unit and the second processing unit are different. In even in the case of performing the alignment, if you get a corrected data for one processing unit,
Other processing units only need to correct the alignment data already stored based on the correction data. Therefore, it is possible to perform the positioning of the transfer device of the plurality of processing units in an extremely short time.

According to a fifth aspect of the present invention, a processing section in which a plurality of processing units for performing a predetermined process on a substrate are vertically stacked, and a substrate is mounted on the stacked processing units. Transport device to carry in and out,
In the processing apparatus, wherein the plurality of processing units are arranged so that the plane positions of the respective delivery positions coincide with each other, the transport apparatus is configured such that the transport apparatus carries the substrate to a predetermined delivery position of each processing unit. A method of positioning a transfer device for performing positioning, in which a position of a transfer device in each processing unit where a transfer device transfers a substrate is previously performed, and the positioning data is stored in a storage unit. At a timing, within one processing unit, a first correction step of ascertaining a positional shift amount of a position at which the transfer device transfers the substrate, and correcting the position at which the transfer device transfers the substrate, based on the amount, The correction data at that time is input to the storage means, and the alignment data in the horizontal plane of the other processing units already stored in the storage device is replaced with the horizontal plane of the correction data. A replacement step of replacing the data, on the basis of the correction data after the replacement, the second of the other processing unit in the conveying apparatus to correct the position of receiving and transferring the substrates
And a correcting step for the transfer device.

As described above, a plurality of processing units are stacked vertically to form a processing unit, and the delivery positions of the plurality of processing units forming one processing unit differ only in height and are the same in a horizontal plane. If it is adjusted to be, at a predetermined timing, one processing unit grasps the positional deviation amount, and based on this, corrects the position at which the transfer device transfers the substrate to this processing unit, The correction data at this time is input to the storage means, and based on the correction data, the alignment data of each processing unit forming the same processing unit is replaced with predetermined correction data, and based on the replaced correction data, By correcting the position at which the transfer device transfers the substrate to each processing unit forming the same processing unit, the correction data for one processing unit belongs to the same processing unit. The other possible alignment processing unit that can perform positioning of the conveying device a very short time.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising: a plurality of processing units for performing a predetermined process on the substrate; A transfer device for transferring the substrate to a predetermined delivery position,
In each processing unit, the transfer device obtains correction data for correcting a position at which the transfer device transfers the substrate, and based on the correction data, includes a positioning unit for correcting the transfer position at which the transfer device transfers the substrate. The alignment means, storage means in which alignment data for each processing unit is stored, and within one processing unit, grasp the amount of positional deviation of the position where the transfer device transfers the substrate, based on this, The transfer device corrects the transfer position of the substrate, and inputs the correction data at this time to the storage means. Based on the correction data, the positioning data of each processing unit already stored in the storage means is determined. And control means for correcting the position at which the transfer device transfers the substrate in another processing unit based on the corrected correction data. Management apparatus is provided.

According to a seventh aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising at least one substrate for performing a predetermined process on a substrate mounted on a rotatable mounting table. A first processing unit and a processing plate having a plurality of lift pins, wherein the lift pins move the substrate between a mounting position and a transport position, and perform at least one predetermined process on the substrate at the mounting position. Two second processing units, a transfer device for loading and unloading the substrate to and from a predetermined transfer position in the first and second processing units, and correcting a position where the transfer device transfers the substrate in each processing unit. And a position adjusting means for correcting a transfer position at which the transfer device transfers the substrate, based on the obtained correction data. For the second processing unit,
Alignment data obtained by performing the alignment of the position where the transfer device transfers the substrate by different methods, and a relationship between the alignment data in the first processing unit and the alignment data in the second processing unit are stored. Storage means, and in any one of the first processing unit and the second processing unit,
Ascertain the amount of displacement of the position where the transfer device transfers the substrate,
Based on this, the transfer device corrects the position at which the substrate is transferred, and inputs the correction data at this time to storage means, and outputs the correction data and the first processing unit stored in the storage means. The alignment data and the second
Based on the relationship with the alignment data in the processing unit, the alignment data of each processing unit stored in the storage unit is replaced with predetermined correction data, and other processing is performed based on the corrected correction data. And a control unit for correcting a position at which the transfer device transfers the substrate in the unit.

In the sixth and seventh aspects of the present invention, similarly to the third and fourth aspects, if correction data for one processing unit is obtained,
The other processing units only need to correct the alignment data already stored based on the correction data, so that the alignment of the transport device of the plurality of processing units can be performed in a very short time.

[0024]

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. FIG. 1 is a schematic plan view showing a resist coating / developing processing system used for carrying out the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a rear view thereof.

This processing system includes a cassette station 10 as a transfer station, a processing station 11 having a plurality of processing units, and a processing station 1.
1 and an exposure unit (not shown) provided adjacent thereto and an interface unit 12 for transferring a wafer W.

The cassette station 10 includes a semiconductor wafer W (hereinafter simply referred to as a wafer) as an object to be processed.
In a state where a plurality of wafers are loaded in the wafer cassette CR in units of, for example, 25 wafers, the wafer W is loaded into or out of this system from another system, or the wafer W is transferred between the wafer cassette CR and the processing station 11.
Is to be transported.

In the cassette station 10, as shown in FIG. 1, a plurality of (four in the figure) positioning projections 20a are formed on the wafer cassette mounting table 20 along the X direction in the figure. At the position 20a, the wafer cassettes CR can be placed in a line with the respective wafer entrances facing the processing station 11 side. In the wafer cassette CR, the wafers W are arranged in a vertical direction (Z direction). In addition, cassette station 1
0 is the wafer cassette mounting table 20 and the processing station 1
1 is provided between the wafer transfer mechanism 21 and the wafer transfer mechanism 21.
The wafer transfer mechanism 21 has a wafer transfer arm 21a that is movable in the cassette arrangement direction (X direction) and the wafer arrangement direction of the wafers W therein (Z direction). Of the wafer cassette CR can be selectively accessed.
Further, the wafer transfer arm 21a is configured to be rotatable in the θ direction, and an alignment unit (AL) belonging to a _third processing unit G3 on the processing station 11 side described later.
IM) and an extension unit (EXT).

The processing station 11 is provided with a plurality of processing units for performing a series of steps for performing a coating / phenomenon on the semiconductor wafer W, and these are arranged at predetermined positions in multiple stages. The semiconductor wafer W
Are processed one by one. This processing station 11
As shown in FIG. 1, a transfer path 22a is provided at the center, and a main wafer transfer mechanism 22 is provided therein.
All processing units are arranged around 2a. The plurality of processing units are divided into a plurality of processing units, and each processing unit includes a plurality of processing units arranged in multiple stages along the vertical direction.

As shown in FIG. 3, the main wafer transfer mechanism 22 is provided with a wafer transfer device 46 inside a tubular support 49 so as to be able to move up and down in the vertical direction (Z direction). The cylindrical support 49 is rotatable by the rotational driving force of a motor (not shown), and accordingly, the wafer transfer device 4
6 is also rotatable integrally.

The wafer transfer device 46 includes a plurality of holding members 48 movable in the front-rear direction of the transfer base 47, and the transfer of the wafer W between the processing units is realized by these holding members 48. .

Further, as shown in FIG.
, Four processing units G₁, G ₂, G₃, G₄But
It is actually arranged around the EHA transport path 22a,
Part G ₅Can be arranged as needed.

Of these, the first and second processing units G
₁ and G ₂ are arranged in parallel on the front side of the system (front side in FIG. 1), the third processing unit G ₃ is arranged adjacent to the cassette station 10, and the fourth processing unit G ₄ is connected to the interface unit 12. They are located adjacent to each other. In addition, the fifth
The processing unit G ₅ of which is capable disposed on the rear portion.

[0033] In this case, as shown in FIG. 2, the first processing unit G _1, 2 single spinner by placing the wafer W on the spin chuck (not shown) performs a predetermined process in a cup CP In the present embodiment, a resist coating unit (COT) for applying a resist to the wafer W and a developing unit (DEV) for developing a resist pattern are arranged in two stages from the bottom in this embodiment. Is overlaid. Similarly, the second processing section G _2, a resist coating unit as two spinner-type processing units (CO
T) and the developing unit (DEV) are stacked in two stages from the bottom.

As described above, the resist coating unit (CO
The reason for disposing T) and the like on the lower side is that the waste liquid of the resist solution is inherently more complicated than the waste liquid of the developer both mechanically and in terms of maintenance, and thus the coating unit (COT)
This is because the complexity is alleviated by arranging the elements in the lower stage. However, if necessary, a resist coating unit (COT) and the like can be arranged in the upper stage.

[0035] In the third processing unit G ₃ are, as shown in FIG. 3, the oven-type processing units of the wafer W is placed on a mounting table SP performs predetermined processing are multi-tiered.
That is, a cooling unit (CO
L), an adhesion unit (AD) for performing a so-called hydrophobizing process for improving the fixability of the resist, an alignment unit (ALIM) for positioning, and a wafer W
Extension unit (EXT) for loading and unloading
Four hot plate units (HP) for performing a heating process on the wafer W before and after the exposure process and after the development process are stacked in eight stages from the bottom. In addition,
A cooling unit (COL) is provided instead of the alignment unit (ALIM), and the cooling unit (C
OL) may have an alignment function.

The fourth processing section G ₄ also, the oven-type processing units are multi-tiered. That is, a cooling unit (COL), an extension cooling unit (EXTCOL) which is a wafer loading / unloading section provided with a cooling plate, and an extension unit (EX
T), a cooling unit (COL), and four hot plate units (HP) are stacked in eight stages from the bottom.

[0037] As described above, can be provided a fifth processing unit G ₅ on the rear side of the main wafer transfer mechanism 22, in the case of providing a processing unit G ₅ of the fifth example guide rails 2
5, and can be moved to the side as viewed from the main wafer transfer mechanism 22. Thus, the fifth processing unit _{G 5}
Is provided, a space is secured by sliding the guide rail 25 along the guide rail 25, so that maintenance work can be easily performed from behind the main wafer transfer mechanism 22. In this case, the space is not limited to such a linear movement, and a space can be similarly secured by rotating the rotation. The fifth processing unit G
₅ basically includes third and fourth processing units G ₃ , G
Similarly to ₄ , a unit having a structure in which oven-type processing units are stacked in multiple stages can be used.

The interface section 12 has the same length as the processing station 11 in the depth direction (X direction). As shown in FIGS. 1 and 2, a portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages at the front of the interface section 12, and a peripheral exposure device 23 is arranged at the rear. A wafer carrier 24 is provided at the center. The wafer carrier 24 moves in the X direction and the Z direction and can access the cassettes CR and BR and the peripheral exposure device 23. Further, the wafer transfer member 24 is rotatable in θ direction, the extension unit included in the fourth processing unit G ₄ of the processing station 11 (EXT) and,
Further, a wafer transfer table (not shown) on the adjacent exposure apparatus side can be accessed.

In such a resist coating and developing system, first, in the cassette station 10, the wafer transfer arm 21 a of the wafer transfer mechanism 21 has a wafer cassette in which an unprocessed wafer W on the cassette mounting table 20 is stored. Access the CR and access the cassette C
Taking out one wafer W from R, it is transported to the third processing section _{G 3} of the extension unit (EXT).

The wafer W is loaded from the extension unit (EXT) into the processing station 11 by the wafer transfer device 46 of the main wafer transfer mechanism 22.
Then, the alignment unit (A) of the _third processing unit G3
After alignment by LIM), the wafer is transported to an adhesion processing unit (AD), where a hydrophobizing process (HMDS process) for improving the fixability of the resist is performed. Since this process involves heating, the wafer W is then
The cooling unit (CO)
L) and cooled.

After the adhesion processing is completed, the cooling
The wafer W cooled by the unit (COL) is continuously
A resist coating unit (CO
T), where a coating film is formed. Coating treatment
After the completion, the processing unit G ₃, G₄One of the hot
Pre-baked in the plate unit (HP)
Then cool in one of the cooling units (COL)
Be rejected.

The cooled wafer W is supplied to the third processing unit G ₃
Is conveyed to the alignment unit (ALIM), where it is aligned, it is conveyed to the interface section 12 via the fourth processing unit group G ₄ of the extension units (EXT).

In the interface section 12, after peripheral exposure for removing excess resist is performed by the peripheral exposure apparatus 23, a predetermined pattern is formed by an exposure apparatus (not shown) provided adjacent to the interface section 12. Exposure is performed on the resist film of the wafer W according to

The wafer W after the exposure is again returned to the interface unit 12, by the wafer transfer body 24, an extension unit included in the fourth processing unit _{G 4} (EXT)
Transported to Then, the wafer W is transferred to the wafer transfer device 4
6, any hot plate unit (HP)
And subjected to a post-exposure bake treatment, and then cooled by a cooling unit (COL).

Thereafter, the wafer W is transferred to the developing unit (DE).
V), where the exposure pattern is developed. After the development is completed, the wafer W is transferred to one of the hot plate units (HP) and subjected to post-baking, and then cooled by the cooling unit (COL). After such a series of processing is completed, the third processing unit group G ₃ of the extension unit (EXT)
And is returned to the cassette station 10 via one of the wafer cassettes CR.

Next, a transfer system of the wafer W will be described with reference to FIGS. FIG. 4 is a schematic perspective view of the inside of the processing station, and FIG. 5 is a block diagram of a coating and developing processing system mainly including a transport system. The X direction is the front-back direction of each station as shown in FIG. 1, the Z direction is the up-down direction in each station as shown in FIG. 4, and the θ direction is the rotation of the transfer device. Direction.

As shown in FIG. 4, the wafer transfer device 46 in the processing station 11 has tweezers 48 which can be moved in the horizontal direction, and the wafer transfer device 46 itself is vertically moved (Z direction). It can be moved up and down freely, and θ
It is rotatable in the direction.

As a result, the wafer transfer device 46 can receive or transfer the wafer W from each processing unit by the tweezers 48, and can move up and down in the vertical direction (Z direction) to perform the same processing. Within the group (for example, the third processing unit G ₃ ), various processing units (for example, HP,... COL) can be accessed, and furthermore, they can be moved up and down in the vertical direction (Z direction) and in the θ direction. To one of the processing units (for example, COT) of one of the processing units (for example, the second processing unit G ₂ ).
Can access any one of the processing units (for example, the HP) of the other processing unit (for example, the third processing unit G ₃ ).

Further, as shown in FIG. 5, a system controller 150 for controlling the entire coating and developing system.
The controller of each processing unit, for example, a coating processing unit controller 151, a hot plate unit controller 152, a wafer transfer device controller 153, and the like are connected to the system controller 150. In addition, an intermediate block controller that manages each processing unit group may be provided between the controller of each processing unit and the system controller 150, for example.

Tweezers 48 are attached to the wafer transfer device 46.
An X-axis motor 154 for moving the transfer device, a θ-axis motor 155 for rotating the transfer device itself, and a Z-axis motor 156 for moving the transfer device itself in the vertical direction are provided. It is controlled by the controller 153. Also, the X-axis motor 154, θ
The axis motor 155 and the Z-axis motor 156 feed back the rotation amount of each motor (that is, the movement amount of the tweezers 48 and the rotation amount and movement amount of the transfer device 46 itself) to the system controller 150 via the transfer device controller 153. For example, an X-axis encoder 157, a θ-axis encoder 158, and a Z-axis encoder 159 are provided.

The wafer transfer device controller 153
As described later, a hot plate unit (H
In P), the X-direction sensor 16 of a transmission type photoelectric sensor used for alignment (centering) of the transfer device 46
The detection signals of the 0 and θ direction sensors 161 are input. Further, the system controller 15
0 is connected to a data memory 162 for storing position correction data and the like during alignment (centering), as described later. Further, the coating processing unit controller 151 has a coating processing unit (C
OT), a detection signal of the reflection type photoelectric sensor 163 used for alignment (centering) of the transport device 46,
The position data signal of the encoder 164 of the nozzle arm is input. In addition, data memory 1
62 may be built in the system controller 150.

Next, the resist coating unit (COT) in this embodiment will be described. 6 and 7 are a schematic cross-sectional view and a schematic plan view showing the entire configuration of the resist coating unit (COT).

This resist coating unit (COT)
An annular cup CP is arranged at the center of the
The spin chuck 52 is arranged inside the. The spin chuck 52 is rotationally driven by a drive motor 54 in a state where the wafer W is fixedly held by vacuum suction. The drive motor 54 is connected to the opening 5 provided in the unit bottom plate 50.
0a, and is coupled to a lifting drive means 60 and a lifting guide means 62, for example, an air cylinder, via a cap-like flange member 58 made of, for example, aluminum. A cylindrical cooling jacket 64 made of, for example, stainless steel (SUS) is attached to a side surface of the drive motor 54.
The cooling jacket 64 is attached so as to cover the upper half.

At the time of resist application, the lower end 58a of the flange member 58 is in close contact with the unit bottom plate 50 near the outer periphery of the opening 50a, thereby sealing the inside of the unit. Spin chuck 52 and holding member 48 of main wafer transfer mechanism 22
When the transfer of the wafer W is performed, the lower end of the flange member 58 floats from the unit bottom plate 50 by the lifting drive means 60 lifting the drive motor 54 or the spin chuck 52 upward.

A resist nozzle 86 for discharging a resist solution onto the surface of the wafer W is detachably attached to the tip of a resist nozzle scan arm 92 via a nozzle holder 100. The resist nozzle scan arm 92 is attached to the upper end of a vertical support member 96 that can move horizontally on a guide rail 94 laid in one direction (Y direction) on the unit bottom plate 50, and is not shown in the Y direction. The drive mechanism moves in the Y direction integrally with the vertical support member 96.

On the side surface of the nozzle holder 100 of the resist nozzle scan arm 92, a reflection type photoelectric sensor 1 used for alignment (centering) of a transfer device to be described later.
63 can be attached.

The resist nozzle scan arm 92
Can also be moved in the X direction perpendicular to the Y direction in order to selectively attach the resist nozzle 86 in the resist nozzle standby section 90, and is also moved in the X direction by an X direction driving mechanism (not shown). .

Further, in the resist nozzle standby section 90, the discharge port of the resist nozzle 86 is inserted into the port 90a of the solvent atmosphere chamber and exposed to the solvent atmosphere so that the resist liquid at the nozzle tip does not solidify or deteriorate. It has become. Further, a plurality of resist nozzles 86 are provided, and these nozzles can be selectively used depending on, for example, the type of the resist liquid.

Further, a thinner for discharging a solvent, for example, a thinner, for wetting the wafer surface onto the wafer surface prior to the discharge of the resist solution onto the wafer surface is provided at the tip (nozzle holder 100) of the resist nozzle scan arm 92. The nozzle 101 is attached. The thinner nozzle 101 and the resist nozzle 86 are mounted such that each discharge port is located on a straight line along the Y movement direction of the resist nozzle scan arm 92.

Further, on the guide rail 94, not only the vertical support member 86 supporting the resist nozzle scan arm 92 but also the rinse nozzle scan arm 120
And a vertical support member 122 which supports the vertical direction and is movable in the Y direction. A rinsing nozzle 124 for side rinsing is attached to the tip of the rinsing nozzle scan arm 120. The rinsing nozzle scan arm 120 and the rinsing nozzle 124 are moved by the Y-direction drive mechanism (not shown) to the rinsing nozzle standby position (the position indicated by the solid line) set on the side of the cup CP and the wafer W installed on the spin chuck 52. It is configured to translate or linearly move between a rinsing liquid discharge position (a position indicated by a dotted line) set immediately above the peripheral portion.

Next, the operation of applying the resist liquid in the resist coating apparatus unit (COT) configured as described above will be described. Cup C in the resist coating unit (COT) by the holding member 48 of the main wafer transfer mechanism 22
When the wafer W is transported right above P, the wafer W
Is sucked in vacuum by the spin chuck 52 which has been lifted by the lift drive means 60 and lift guide means 62, for example, which are air cylinders. Main wafer transfer mechanism 2
After the wafer W is vacuum-sucked on the spin chuck 52, the holding member 48 is moved to the resist coating unit (CO).
T) Pull back from inside, resist coating unit (CO
The delivery of the wafer W to T) is completed.

Then, the spin chuck 52 moves the wafer W down to a fixed position in the cup CP, and the drive motor 54 starts rotating the spin chuck 52. After that, the nozzle holder 10 from the resist nozzle standby unit 90
The movement of 0 is started. The movement of the nozzle holder 100 is performed along the Y direction.

When the discharge port of the thinner nozzle 101 reaches the center of the spin chuck 52 (the center of the wafer W), the thinner is supplied to the surface of the rotating wafer W.
The thinner supplied to the surface of the wafer W is uniformly spread from the center of the wafer W to the entire area around the thinner by centrifugal force.

Subsequently, the nozzle holder 100 moves Y until the discharge port of the resist nozzle 86 reaches the center of the wafer W.
The resist liquid is dropped from the discharge port of the resist nozzle 86 to the center of the surface of the rotating wafer W in a state where the wafer W is rotated at a predetermined rotation speed, and the wafer W is rotated from the center of the wafer W by centrifugal force. The resist is diffused toward the periphery to form a resist film on the wafer W. At this time, from the viewpoint of reducing the resist consumption, a relatively high speed, for example,
It is rotated at 3000 rpm or more.

After the completion of the dropping of the resist solution, if necessary, the rotation speed of the wafer W is reduced by a predetermined time to adjust the film pressure, and then the rotation speed of the wafer W is accelerated to shake off the remaining resist solution. And a resist film having a predetermined thickness is formed.

Thereafter, the nozzle holder 100 is returned to the home position, and the wafer W is
Is back-rinsed, and if necessary, side edges of the wafer W are side-rinsed by cleaning means (not shown). Thereafter, the rotation speed of the wafer W is accelerated,
The rinsing liquid of the back rinsing and the side rinsing is shaken off and discarded, and thereafter, the rotation of the wafer W is stopped, and the coating process ends.

Next, referring to FIG. 5, FIG. 8 and FIG.
The alignment (centering) of the wafer transfer device with respect to the coating processing unit (COT) will be described. FIG.
FIG. 9 is a partial plan view of the resist coating unit (COT), and FIG. 9 is a flowchart for alignment (centering) of the wafer transfer apparatus with respect to the coating unit (COT).

As shown in FIG. 8, the tweezers 48 of the wafer transfer device 46 move above the spin chuck 52 while placing the wafer W, and then descend, and
When the gap (Z-axis gap) between the wafer W and the spin chuck 52 reaches a specified value, the wafer W is vacuum-sucked by the spin chuck 52.

As described above, on the side surface of the nozzle holder 100 of the resist nozzle scan arm 92 (hereinafter, referred to as the nozzle arm 92), the reflection type photoelectric sensor 16 is provided.
The photoelectric sensor 163 is horizontally moved on the dummy wafer DW by the nozzle arm 92 to detect an edge of the dummy wafer DW. A detection signal of this edge is transmitted to the coating unit controller 151.
Is input to

The nozzle arm 92 is configured to move in a horizontal direction on the dummy wafer DW by a moving mechanism (not shown). The encoder 164 provided in the moving mechanism (not shown) of the nozzle arm 92 is used. The position data of the nozzle arm 92 is input to the coating unit controller 151.

Therefore, when the photoelectric sensor 163 is moved on the dummy wafer DW by the nozzle arm 92 to detect one edge of the dummy wafer DW, an edge detection signal (ON signal) is transmitted from the photoelectric sensor 163 to the coating unit controller 151. The position data of the nozzle arm 92 at the time of this detection is input from the encoder 164 to the coating unit controller 15.
1 is input.

When the detection of one edge of the dummy wafer DW is completed, the dummy wafer DW is moved as shown in FIG.
Rotated by 90 °, edges are detected by the photoelectric sensor 163, and as a result, 0 °, 90 °, 180 °, 2
A total of four edges at 70 ° are detected.

When the detection signals of these four edges and the position data of the nozzle arm 92 at each detection point are input to the coating unit controller 151, the system controller 150 generates the spin chuck 52 based on these signals. The positional deviation width (X-axis, Y-axis) of the dummy wafer DW with respect to the above delivery position is calculated, and then the correction data (X-axis, θ-axis) of the tweezers 48 is calculated.

Next, the alignment (centering) step of the wafer transfer device in the coating processing unit (COT) will be described with reference to the flowchart of FIG. First, the dummy wafer DW is mounted by the tweezers 48 of the wafer transfer device 46 and is carried in above the spin chuck 52, and is then lowered, so that the gap (Z-axis gap) between the dummy wafer DW and the spin chuck 52 becomes a specified value. At this point, the dummy wafer DW is vacuum-sucked by the spin chuck 52 (step 101).

Next, the nozzle arm 92 is moved horizontally above the dummy wafer DW (step 102).
Then, the reflective photoelectric sensor 163 attached to the nozzle arm 92 detects the edge of the dummy wafer DW and
If N, the edge detection signal and the position data of the nozzle arm 92 at the time of this detection are input to the coating processing unit controller 151 (step 103).

When detection of one edge of the dummy wafer DW is completed, as shown in FIG.
Rotated 90 °. The 90 °, 180 °, and 270 ° edges are similarly detected, and the detection signal of each edge and the position data of the nozzle arm 92 at each detection time are input to the coating processing unit controller 151 (step 10).
4).

Subsequently, it is determined whether or not the detection of a total of four edges has been completed (step 105). If the detection has been completed, the system controller 150 inputs a detection signal (ON) for each of the inputted edges. Signal) and the position data of the nozzle arm 92 at each detection time, the dummy wafer DW with respect to the delivery position on the spin chuck 52.
(X, Y) is calculated (step 10).
6).

The position shift amount (X,
Y) Based on the data, the system controller 150
, The displacement amount (X, θ) of the tweezers 48 is calculated.

If the initial data exists in the system controller 150, the displacement (X, θ) of the tweezers 48 is compared with the initial data, and the displacement is within the allowable range of the initial data. It is determined whether or not the tweezers are delivered (step 108). When the tweezers 48 are out of the allowable range, the position at which the tweezers 48 are transferred is corrected based on the positional deviation amount (X, θ) (step 109).
As a result, the wafer W is accurately placed at the delivery position on the spin chuck 52 by the tweezers 48. In addition,
If there is no initial data (at the time of initial setting), it is determined whether or not the positional deviation amount (X, θ) of the tweezers 48 is within the allowable range of the design value. Is corrected based on the positional deviation amount (X, θ) so that the position at the time of delivery of the tweezers 48 becomes a predetermined position. If the positional deviation is not within the allowable range, the system is reset.

As described above, the alignment (centering) can be performed automatically without bothering the operator, and the positioning of the coating unit (COT) can be performed quickly.

The alignment data (X, θ) at the time of the initial setting is stored in the data memory 162 connected to (or incorporated in) the system controller 150, and can be used later. .

Next, the hot plate unit (HP) will be described with reference to FIG. FIG. 10 is a schematic sectional view of the heat treatment unit (HP). The hot plate unit (HP) has a cover 171 that can be moved up and down. A heating plate 172 for heating the wafer W is disposed below the cover 171 with its surface horizontal. A heater (not shown) is mounted in the heating plate 172 so that a desired temperature can be set.

A plurality of fixing pins (proximity pins) 173 are provided on the surface of the heating plate 172, and the heating plate 1 is fixed by these fixing pins 173.
The wafer W is held at a very small distance from the wafer W. That is, the proximity method is adopted,
Avoid direct contact between the heating plate 172 and the wafer W,
The radiant heat from the heating plate 172 heats the wafer W.

A plurality of (three) lift pins 174 are provided so as to be able to move up and down by passing a plurality of holes of the heating plate 172, and a lifting mechanism (not shown) is provided below these lift pins 174. I have. Three lift pins 17
4 receives the wafer W from the tweezers 48 of the wafer transfer device 46 in the raised state, and then descends to place the wafer W on the fixing pins 173.

The hot plate unit (H
In P), the wafer W coated with the resist solution is subjected to a pre-baking process at a predetermined temperature, or the exposed wafer W
Is subjected to post-exposure bake processing, and the wafer W after development is subjected to post-bake processing.

Next, the alignment (centering) of the wafer transfer device with respect to the hot plate unit (HP) will be described with reference to FIGS.
FIG. 11 is a partial plan view of a hot plate unit (HP) and tweezers of the wafer transfer device, and FIG.
FIG. 12A is a schematic diagram when a center pin on a hot plate unit (HP) is detected by a photoelectric sensor, and FIG. 12B is a diagram illustrating the hot plate unit (HP).
FIG. 13 is a schematic diagram when the upper end of the upper lift pin is detected by the photoelectric sensor, and FIG. 13 is a flowchart for alignment (centering) of the wafer transfer device with respect to the hot plate unit (HP).

As shown in FIG. 11, at the time of positioning,
A positioning jig composed of an outer ring 181 and an inner ring 182 is attached to a wafer mounting position of the tweezers 48 of the wafer transfer device 46 by an attaching member 183. On the inner ring 182, a light-transmitting-side X-direction sensor 160a and a light-receiving-side X-direction sensor 160b of a transmission-type photoelectric sensor are attached at 180 ° apart from each other so as to face each other.
18 so that the light emitting side θ direction sensor 161a and the light receiving side θ direction sensor 161b of the transmission type photoelectric sensor face each other.
Mounted 0 ° apart.

Further, a center hole (not shown) is provided at the center of the heating plate, and a center pin 184 for positioning is inserted upright into the center hole (not shown). Further, the tweezers 48 deliver the wafer W to the upper ends of the three lift pins 174 that have risen. More specifically, the position at which the tweezers 48 finally delivers the wafer W is a heating plate. This is a position (transfer position) defined by the center position of 172 and the upper end positions of the three lift pins 174 that have risen.

Further, as described above, the X-axis motor 154, the θ-axis motor 155,
The axis motor 156 includes an X-axis encoder 157 and a θ-axis encoder 158 for feeding back the rotation amount of each motor (that is, the movement amount of the tweezers 48, the rotation amount and the movement amount of the transfer device 46) to the transfer device controller 153. , And a Z-axis encoder 159 are provided.

Therefore, as shown in FIG.
When the light emitting side X direction sensor 160a scans in the X direction while emitting light to the light receiving side X direction sensor 160b and detects the center pin 184, a detection signal (ON signal)
From the X-direction sensor 160 to the transport device controller 15
3 and the X of the tweezers 48 at this time.
The position data in the direction is input from the X-axis encoder 157 to the transport device controller 153.

Although not shown, the light emitting side θ direction sensor 161a scans in the θ direction while emitting light to the light receiving side θ direction sensor 161b, and the center pin 18
4, a detection signal (ON signal) is input from the θ-direction sensor 161 to the system controller 150 via the transfer device controller 153, and the position data of the tweezers 48 in the θ-direction at this time is output from the θ-axis encoder 158. The data is input to the system controller 150 via the transfer device controller 153.

Further, as shown in FIG. 12B, a dummy wafer DW is mounted on the upper ends of the three lift pins 174, and the light projecting side X direction sensor 160a (or the θ direction sensor 161a) is moved to the light receiving side X direction. While projecting light onto the sensor 160b (or the θ-direction sensor 161b),
When scanning is performed in the direction and the lower surface of the dummy wafer DW (that is, the upper end of the lift pin) is detected, a detection signal (ON
Signal) is input to the system controller 150, and the position data of the tweezers 48 in the Z direction at this time is transmitted from the Z-axis encoder 157 to the transport device controller 153.
Through the system controller 150.

Next, according to the flowchart of FIG.
The alignment (centering) step of the wafer transfer device in the hot plate unit (HP) will be described. FIG.
As shown in (a), the light emitting side X direction sensor 160a scans in the X direction while emitting light to the light receiving side X direction sensor 160b (step 201).

The X direction sensor 160 is connected to the center pin 18
4 (step 202), a detection signal (ON signal) is input from the X-direction sensor 160 to the transport device controller 153, and the tweezers 48 at this time are input.
Is input from the X-axis encoder 157 to the transfer device controller 153 (step 20).
3).

Next, the light emitting side θ direction sensor 161a scans in the θ direction while emitting light to the light receiving side θ direction sensor 161b (step 204). When the θ-direction sensor 161 detects the center pin 184 (step 205), a detection signal (ON signal) is input from the θ-direction sensor 161 to the transport device controller 153, and the position of the tweezers 48 in the θ-direction at this time. The data is transferred from the θ-axis encoder 158 to the transfer device controller 15.
3 (step 206).

Thereafter, as shown in FIG. 12B, a dummy wafer DW is mounted on the upper ends of the three lift pins 174, and the light projecting side X direction sensor 160a (or the θ direction sensor 161a) is moved to the light receiving side X direction. While projecting light onto the sensor 160b (or the θ-direction sensor 161b),
Scan in the direction (step 207).

As a result, when the lower surface of the dummy wafer DW (ie, the upper end of the lift pin) is detected (step 2).
08), the detection signal (ON signal) is input to the transport device controller 153, and the tweezers 48 at this time are input.
Is input from the Z-axis encoder 157 to the transfer device controller 153 (step 20).
9).

Then, in the transfer device controller 153, the amount of positional deviation is grasped from the position data in the X, θ and Z directions of the tweezers 48 when the center pin 184 and the lower surface of the dummy wafer DW are detected (step). 210).

When the initial data exists in the system controller 150, the displacement (X, θ) of the tweezers 48 is compared with the initial data, and the displacement is within the allowable range of the initial data. It is determined whether or not the wafer W is out of the allowable range (Step 211). If the tweezers 48 are out of the allowable range, the position at the time of delivery of the tweezers 48 is corrected based on the positional deviation amount (Step 212). By virtue of 48, the plate is accurately placed at the delivery position defined by the center position of the heating plate 172 and the upper end positions of the three lift pins 174 that have risen. If the initial data does not exist (in the case of the initial setting), it is determined whether or not the positional deviation amount (X, θ) of the tweezers 48 falls within the allowable range of the design value, and falls within the allowable range. When the tweezers 48 are delivered, the position is corrected based on the positional deviation amount (X, θ) so that the position at the time of delivery of the tweezers 48 becomes a predetermined position. If the positional deviation is not within the allowable range, the system is reset.

As described above, the positioning (centering) can be performed automatically without bothering the operator, and the positioning of the hot plate unit (HP) can be performed quickly.

The alignment data (X, θ, Z) at the time of initial setting is stored in a data memory 162 connected to (or incorporated in) the system controller 150, and is used later. Can be.

Next, with reference to FIG. 14, another example of the method of aligning the wafer transfer device with the hot plate unit (HP) will be described. FIG. 14 is a partial plan view of a hot plate (HP) and tweezers of the wafer transfer device for explaining another example of the alignment method of the wafer transfer device.

In this example, unlike the above-mentioned example, the transmission type photoelectric sensor is directly attached to the tweezers 48 of the wafer transfer device 46 without using a positioning jig. That is, the transmitting X-direction sensor 160a and the receiving X-direction sensor 160b of the transmission photoelectric sensor are attached to the wafer mounting position of the tweezers 48 of the wafer transfer device 46 so as to be 180 ° apart from each other so as to face each other. The light-transmitting-side θ-direction sensor 161a and the light-receiving-side θ-direction sensor 161b of the transmission-type photoelectric sensor are mounted so as to be 180 ° apart from each other.

In this case, similarly to the above-described embodiment, the center pin is formed by the light emitting side X direction sensor 160a, the light receiving side X direction sensor 160b, the light emitting side θ direction sensor 161a, and the light receiving side θ direction sensor 161b. 18
4 and the lower surface of the dummy wafer DW are detected, and position data of the tweezers 48 in the X direction, the θ direction, and the Z direction at the time of the detection are calculated, and based on these, the tweezers 48
Is calculated, and the position of the tweezers 48 at the time of substrate transfer is corrected. Note that the tweezers to which the above-described photoelectric sensor is attached are used as tweezers 48 for carrying the wafer W.
May be provided separately from the wafer transfer device 46.

Next, with reference to FIG. 15, another example of the method of aligning the wafer transfer device with the hot plate unit (HP) will be described. (A) of FIG.
FIG. 7B is a partial plan view of a hot plate (HP) and tweezers of the wafer transfer device for explaining still another example of the alignment method of the wafer transfer device, and FIG.
It is a partial side view showing a CD camera part.

In this example, a CCD camera is used instead of the transmission type photoelectric sensor. That is, the support member 1 extending from the base end side of the wafer mounting position of the tweezers 48
A CCD camera 190 is provided at 91 so as to be able to swing up and down by 90 ° so that it can be turned horizontally and downward.

When the CCD camera 190 is pointed downward, the center pin 184 (or the heating plate 1)
72 is picked up from above, and the X-θ plane is processed as image data.
4, the position data in the X direction and the θ direction are calculated.

When the CCD camera 190 is turned in the horizontal direction, the lower surface of the dummy wafer DW on the three raised lift pins 174 is imaged from the side, and the θ-Z plane is processed as image data. Lift pin 17
The position data in the Z direction of the lower surface of the dummy wafer DW on 4 is calculated.

Based on the position data of the center pins 184 in the X and θ directions and the position data of the lower surface of the dummy wafer DW on the lift pins 174, the tweezers 4
8 are calculated, and the position of the tweezers 48 at the time of substrate transfer is corrected. Note that the tweezers to which the above-described CCD camera is attached are tweezers 48 for carrying the wafer W.
May be provided separately from the wafer transfer device 46.

Next, with reference to FIGS. 5 and 16, a description will be given of a case where the wafer transfer device is positioned (centered) during the processing steps of the coating and developing processing system.
FIG. 16 is a flowchart in the case of confirming the alignment (centering) of the wafer transfer device during the processing process of the coating and developing processing system. The following flow is controlled by the system controller 150.

As shown in FIG. 5, a data memory 162 is connected to the system controller 150. In the data memory 162, for example, alignment data of the wafer transfer device 46 with respect to the coating processing unit (COT) is stored. The hot plate unit (H
Positioning data of the wafer transfer device 46 for P) is stored. Further, as described above, the coating processing unit (COT) in which the wafer W is fixed to the spin chuck
Since the positioning method is different between the hot plate unit (HP) fixed to the non-rotating heating plate and the hot plate unit (HP), and the positioning data is different from each other, the relationship between these positioning data is stored in the position data memory 162. ing.

In each processing unit, after the alignment (centering) of the wafer transfer device 46 at the time of initial setting is completed, the position of the wafer transfer device 46 with respect to each processing unit (during the processing process of the coating / developing processing system) ( The case where (centering) is performed regularly or irregularly will be described with reference to the flowchart in FIG.

First, the processing process of the coating / developing processing system is started (step 301), and it is determined whether or not to perform the alignment (centering) of the wafer transfer device 46 with respect to each processing unit at a predetermined timing during the processing process. A decision is made (step 302). When confirming the alignment, the position deviation amount of the position where the tweezers 48 transfers the wafer W in one processing unit, for example, the coating processing unit (COT), is grasped as described above, and based on this, The position of the tweezers 48 when transferring the wafer W is corrected (step 303).

That is, during the processing step, the tweezers 48
Is obtained (X, θ), and this position shift amount (X, θ) is obtained.
Based on θ), it is possible to confirm and correct the positional deviation when the tweezers 48 transfers the wafer W.

Next, the correction data (X, θ) at this time is input to the position data memory 162, and the alignment data of the tweezers 48 of each processing unit stored in the position data memory 162 in advance is stored in the predetermined position. (X, θ) (step 304). Here, in the case of a unit that performs a different alignment from the unit that the other processing unit performs the alignment, for example, the processing unit that performs the alignment is a coating processing unit (CO
In T), the other processing units are hot plate units (H
In the case of P), as described above, the relationship between these alignment data is stored in the position data memory 162, so that the alignment data can be similarly corrected.

Next, the position correction data (X,
θ) is output from the position data memory 162, and based on this, the position where the tweezers 48 transfers the substrate in another processing unit, for example, a hot plate unit (HP) is corrected (step 305).

As described above, if the correction data for one processing unit is obtained not only between units having the same alignment detection method but also between processing units having different alignment detection methods, the other processing units will not be affected. It is only necessary to correct the alignment data already stored based on the correction data. Therefore, if the positioning is performed on one processing unit, the positioning can be performed on the other processing units in the same manner, and the tweezers 48 of the transfer device 46 of the plurality of processing units can be used. Can be performed in a very short time.

In the above example, the correction of the hot plate unit (HP) was performed based on the correction data obtained by the alignment in the coating processing unit (COT). The correction may be performed by the coating processing unit (COT) based on the correction data obtained by the alignment in ()). Further, the correction operation may be performed by passing correction data between processing units of the same type.

Further, a step may be provided for the user to determine whether or not to perform positioning in another processing unit based on the correction data obtained in one processing unit. Hereinafter, the positioning operation in this case will be described with reference to FIG.
Will be described along the flowchart of FIG.

First, the processing process of the coating / developing processing system is started (step 401), and at a predetermined timing during the processing process, it is determined whether or not the position (centering) of the wafer transfer device 46 with respect to one processing unit is to be performed. Is determined (step 402). When confirming the alignment, the position deviation amount of the position where the tweezers 48 transfers the wafer W in this processing unit, for example, the coating processing unit (COT), is grasped as described above, and based on this, the wafer displacement is determined. The position of the tweezers 48 when W is transferred is corrected (step 403).

Next, based on the correction data (X, θ) at this time, the wafer transfer device 46 for another processing unit is used.
The user determines whether or not to perform the positioning (step 404). When performing the alignment of another processing unit, the correction data (X, θ) is input to the position data memory 162, and the tweezers 4 for each processing unit stored in the position data memory 162 in advance.
8 to the predetermined correction data (X, θ)
(Step 405). At this time, as described above, the relationship between the alignment data for the coating processing unit (COT) and the like and the alignment data for the hot plate unit (HP) and the like is stored in the position data memory 162. The alignment data for the other processing unit can be corrected based on the correction data obtained by one of the processing units.

Next, the position correction data (X,
θ) is output from the position data memory 162, and based on this, the position where the tweezers 48 transfers the substrate to another processing unit is corrected (step 406).

As described above, the user determines whether or not to perform the alignment in another processing unit based on the correction data for the alignment in one processing unit. It is clear that the problem is unique to the processing unit that has performed the alignment, and if it is not appropriate to perform the alignment of another processing unit based on the correction data, the user may use another processing unit. By making a determination not to perform the positioning, it is possible to avoid unnecessary positioning of other processing units.

Further, as shown in FIG. 3, the resist coating / developing processing system includes processing units G ₁ , G ₂ , G ₃ , which are formed by stacking a plurality of processing units in the vertical direction.
Has a G _4, the processing unit which forms these processing units can be planar position of the respective transfer position is arranged to coincide. When the processing units are arranged in this manner, the transport system 4 is further operated by another operation.
6 can be performed. Hereinafter, in the third processing section G _3, the position adjustment performed by the different operation will be described with reference to FIG. 18.

Third processing unit G₃Is as shown in FIG.
, Cooling unit (COL), adhesion unit
Knit (AD), alignment unit (ALIM),
Extension unit (EXT) and four
Hot plate units (HP) are stacked in order from the bottom
It has been done. Here, these processing units
So that the plane position of each delivery position matches
And the third processing unit G ₃In one processing unit
Based on the alignment data, other
Align the processing unit.

[0126] First, to start the treatment process in the coating and developing system (step 501), at a predetermined timing during the processing steps, the alignment of the wafer transfer apparatus 46 for the processing unit included in the third processing section G ₃ ( It is determined whether or not to perform (centering) (step 502). When confirming the alignment, one of the processing units belonging to the _third processing unit G3, for example, the cooling unit (C
The position shift amount of the position where the tweezers 48 transfers the wafer W within the OL) is grasped as described above, and the position of the tweezers 48 when the wafer W is transferred is corrected based on this amount (step 503).

Next, based on the correction data (X, θ) at this time, the other processing units of the _third processing unit G3 are aligned. That is, the correction data (X, theta) to input the position data memory 162, are stored in advance in the position data memory 162, the third processing section G ₃
The alignment data in the horizontal plane of the tweezers 48 with respect to the other processing units belonging to the correction data (X,
θ) (step 504).

Next, the position correction data (X,
θ) is output from the position data memory 162, and based on this, the position where the tweezers 48 transfers the substrate to another processing unit is corrected (step 506). As described above, each of the transfer position of the processing unit of the processing unit G _3, because the plane position is arranged to coincide, the position correction data in the horizontal plane for one of the processing units (X, theta) Accordingly, it is possible to appropriately perform positioning in a horizontal plane with respect to another processing unit.
Therefore, by performing alignment with respect to one processing unit, alignment of the tweezers 48 of the transport device 46 with respect to another processing unit of the same processing unit can be performed in an extremely short time. Here, has been described alignment of the third processing section G _3, also in the processing unit _{G 1, G 2, G 4} , are arranged such the planar placement of the delivery position of the processing unit matches With this operation, the alignment can be performed by this operation.

Further, in the above-described embodiment, a case has been described in which the alignment (centering) of the wafer transfer device with respect to each processing unit is performed periodically or irregularly during the processing steps of the coating and developing processing system. This irregular positioning can be performed, for example, by the user setting the coating and developing processing system to a positioning mode at an arbitrary time. Further, when a transport error is detected in the coating and developing system, the system controller 150 may automatically set the coating and developing system to the alignment mode.

[0130] The detection of the transport error can be performed by regarding that a transport error has occurred, for example, when an abnormal load occurs in the drive system in the coating current transport processing system. In such a case, it is considered that the wafer W falls and is clogged somewhere in the drive system where an abnormal load has occurred due to the transfer error.

Further, the detection of the transfer error can be performed, for example, by regarding the case where the wafer W does not exist on the tweezers 48 at the time when it should be held on the tweezers 48 of the wafer transfer device 46 as a transfer error. .
In such a case, it is considered that the wafer W has dropped from above the tweezers 48 due to a transfer error. In order to detect the transfer error in this manner, for example, as shown in FIG. 19, a sensor for detecting the wafer W, for example, a reflective photoelectric sensor 48a is disposed in front of the upper portion of the tweezers 48 of the wafer transfer device 46. Then, at a predetermined timing, of the tweezers 48 arranged in three stages, the one used for holding the wafer W is projected forward, and the presence or absence of the wafer W is confirmed by the photoelectric sensor 48a. Although FIG. 19 shows a case where the presence / absence of the wafer W in the upper tweezers 48 is confirmed, the presence / absence of the wafer W can be similarly confirmed in the middle and lower tweezers 48.

In the case where a sensor is provided in the wafer transfer device as shown in FIG. 19, it is possible to detect the positional deviation of the wafer W by the sensor, and the positional deviation detected here is allowable. If the range is exceeded, the system controller 150 may set the coating / developing processing system to the alignment mode.

Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above-described embodiment, a coating unit (COT) is used as a processing unit having a rotating stage, and a hot plate unit (HP) is used as a processing unit having a fixed stage. However, the present invention is not limited to this. A developing unit (DEV), which is another spinner unit, is used as a processing unit having a rotating stage, and a cooling unit (COL) is used as a processing unit having a fixed stage.
Other thermal processing units such as an adhesion unit (AD) may be used. Further, in the above embodiment, the case where the present invention is applied to the semiconductor wafer coating / developing processing system is described. It is applicable if it is mounted. Also, the substrate may be a substrate to be processed other than the semiconductor wafer, for example, an LCD substrate.

[0134]

As described above, according to the present invention,
The substrate is carried into the mounting table of the processing unit by the transfer device,
The detecting means detects the amount of displacement of the substrate relative to the transfer position on the mounting table, and then calculates the amount of displacement of the position at which the transfer device delivers the substrate based on the detected value of the amount of displacement of the substrate. Based on the calculated amount of displacement of the transfer device, the position at which the transfer device transfers the substrate is corrected, so that the position can be automatically adjusted without bothering the operator. During the initial setup of
Positioning of the transfer device can be performed quickly.

Further, according to the present invention, while the detecting device is moved above the processing plate by the transfer device, the detecting device detects the center position of the processing plate and the upper end positions of the plurality of lift pins that have risen. Based on the detected values of the center position and the upper end position, the amount of displacement of the position at which the transfer device transfers the substrate is determined, and the position at which the transfer device transfers the substrate is determined based on the position shift amount of the transfer device. Since the correction is performed, the alignment can be automatically performed without bothering the operator, and particularly, the alignment can be quickly performed at the time of initial setting of the thermal processing unit and the like.

Further, according to the present invention, at a predetermined timing, within one processing unit, the amount of displacement of the position at which the transfer device transfers the substrate is grasped, and based on this, the transfer device receives the substrate. Correct the transfer position, input the correction data at this time to the storage means, and based on the correction data,
The alignment data of each processing unit already stored in the storage unit is replaced with predetermined correction data, and the transfer position of the transfer device in another processing unit is transferred based on the corrected correction data. Therefore, if the correction data for one processing unit is obtained, the other processing units only need to correct the alignment data already stored based on the correction data. Therefore, it is possible to perform the positioning of the transfer device of the plurality of processing units in an extremely short time. Further, by grasping the relationship between the alignment data in the first processing unit and the alignment data in the second processing unit, the first
When the correction data for one processing unit is obtained, the other processing units already store the correction data based on this correction data even when the position alignment is performed in a different manner between the processing unit and the second processing unit. It is only necessary to correct the alignment data that has been performed. Further, in the above embodiment, the dummy is used as the substrate, but an actual substrate may be used.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of a semiconductor wafer coating and developing system according to an embodiment of the present invention.

FIG. 2 is a front view showing the coating and developing system shown in FIG.

FIG. 3 is a rear view showing the coating and developing system shown in FIG. 1;

FIG. 4 is a perspective view schematically showing the inside of a processing station.

FIG. 5 is a block diagram of a coating and developing system mainly including a transport system.

FIG. 6 is a schematic cross-sectional view showing the overall configuration of a resist coating unit (COT).

FIG. 7 is a schematic plan view showing the overall configuration of a resist coating unit (COT).

FIG. 8 is a partial plan view of a resist coating unit (COT).

FIG. 9 is a flowchart for alignment (centering) of the wafer transfer device with respect to the coating processing unit (COT).

FIG. 10 is a schematic sectional view of a hot plate unit (HP).

FIG. 11 is a partial plan view of a hot plate unit (HP) and tweezers of the wafer transfer device.

FIG. 12 is a schematic diagram when a center pin on the hot plate unit (HP) is detected by a photoelectric sensor, and a schematic diagram when a lift pin upper end on the hot plate unit (HP) is detected by a photoelectric sensor.

FIG. 13 is a flowchart for alignment (centering) of the wafer transfer device with respect to the hot plate unit (HP).

FIG. 14 is a partial plan view of a hot plate (HP) and tweezers of the wafer transfer device for explaining another example of the alignment method of the wafer transfer device.

FIG. 15 is a partial plan view and a partial side view of a hot plate (HP) and tweezers of the wafer transfer device for explaining still another example of the alignment method of the wafer transfer device.

FIG. 16 is a flowchart in a case where alignment (centering) of a wafer transfer device is performed during a processing step of the coating and developing processing system.

FIG. 17 is another flowchart in the case where alignment (centering) of the wafer transfer device is performed during a processing step of the coating and developing processing system.

[18] Yet another flowchart for performing alignment of the wafer transfer device in the processing unit G ₃ of the resist coating and developing processing system shown in FIG. 1 (centering).

FIG. 19 is a partial cross-sectional view for explaining another example of the wafer transfer device.

[Explanation of symbols]

 46; wafer transfer device (transfer device) 48; tweezers (substrate support member) 52; spin chuck (mounting table) 92; nozzle arm (moving means) 153; wafer transfer device controller (control means) 160; X-direction sensor (detection) Detector, detecting means) 161; θ-direction sensor (detector, detecting means) 162; position data memory (storage means) 163; photoelectric sensor (detector, detecting means) 172; heating plate (thermally processing plate) 174; Lift pin 181; Outer ring (jig) 182; Inner ring (jig) 184; Center pin (center of processing plate) 190; CCD camera (imaging means, detecting means) HP; Hot plate unit COT; Coating processing unit DW; Dummy wafer W; Semiconductor wafer

Claims (19)

[Claims] 1. A substrate processing apparatus comprising: a processing unit for performing a predetermined process on a substrate mounted on a mounting table; and a transfer apparatus for loading and unloading the substrate from and to the processing unit, wherein the transfer apparatus includes a mounting table. A transfer device for positioning the transfer device so as to transfer the substrate to a predetermined delivery position above, comprising: a transfer step of transferring the substrate to a mounting table of the processing unit by the transfer device; Means for detecting a displacement amount of the substrate with respect to the delivery position on the mounting table, and a calculating step of calculating the displacement amount of the transfer device based on the detected value of the displacement amount of the substrate. And correcting the transfer position of the transfer device on the basis of the position shift amount of the transfer device. 2. The method according to claim 1, wherein the mounting table is rotatably provided. 3. The transfer device according to claim 2, wherein the detection unit includes a detector attached to a moving member that moves across the substrate on the mounting table to detect an edge of the substrate. Alignment method. 4. The detecting step comprises detecting an edge of a substrate by a detector while moving the detector in a horizontal direction by a moving member, and rotating the substrate by a predetermined angle by a mounting table after the detection. Detecting the edges of other portions of the substrate by a detector, and thereafter repeating the rotation of the substrate and the detection of the edges of the substrate to detect the edges of a plurality of portions of the substrate; and 4. The method according to claim 3, further comprising the step of obtaining position data of the moving member at the time of detecting the edge of the location, and grasping a positional shift amount of the substrate based on the position data of the moving member. How to align the transfer device. 5. A processing unit having a processing plate having a plurality of lift pins, moving a substrate between a mounting position and a transfer position by the lift pins, and performing a predetermined process on the substrate at the mounting position. In a substrate processing apparatus having a transfer device for loading and unloading a substrate from and to a processing unit, the transfer device transfers the substrate to a predetermined delivery position defined by a center position of a processing plate and upper end positions of a plurality of lift pins that have risen. What is claimed is: 1. A method for positioning a transfer device, comprising: positioning a transfer device so that a transfer device is carried in; detecting means provided above the processing plate; and detecting the detection means while moving the detection means above the processing plate by the transfer device. Means for detecting the center position of the processing plate and the upper end positions of the plurality of lift pins that have risen; Based on the output value, a step of grasping a position shift amount of a position at which the transfer device transfers the substrate, and a correction step of correcting a position at which the transfer device transfers the substrate based on the position shift amount of the transfer device. A method for aligning a transfer device, comprising: 6. A detector which is attached directly or via a jig to a substrate support member of a transfer device, and detects a center position of a processing plate and upper end positions of a plurality of lift pins that have risen. 6. The method according to claim 5, further comprising: 7. The detecting step calculates a center position data by detecting a center position of the processing plate by a detecting unit while moving the detector in a horizontal direction above the processing plate by the substrate supporting member of the transfer device. And a step of calculating upper end position data by detecting upper end positions of the plurality of lift pins lifted by the detecting means while moving the detector vertically above the processing plate by the substrate support member. 7. The method for positioning a transfer device according to claim 6, wherein: 8. The imaging means for imaging the center position of the processing plate and the upper end positions of the plurality of lift pins, which is attached directly or via a jig to the substrate support member of the transfer device. The detecting step comprises: detecting the center position of the processing plate by the imaging means and calculating the center position data while moving the imaging means in the horizontal direction above the processing plate by the substrate support member of the transfer device; Detecting the upper end positions of the plurality of lift pins lifted by the imaging means and calculating upper end position data while moving the imaging means in the vertical direction above the processing plate by the substrate support member. The method for positioning a transfer device according to claim 5. 9. A processing apparatus comprising: a plurality of processing units for performing predetermined processing on a substrate; and a transfer device for loading and unloading the substrate from and to the processing units, wherein the transfer device includes a predetermined processing unit for each processing unit. A transfer device positioning method for positioning a transfer device so that a substrate is carried into a delivery position, wherein the transfer device in each processing unit performs positioning of a transfer position of a substrate in advance, and the positioning data is obtained. In a storage unit, at a predetermined timing, the amount of positional deviation of a position where the transfer device transfers the substrate within one processing unit, and the transfer device receives the substrate based on the amount. A first correction step of correcting the transfer position; and inputting the correction data at this time to the storage means, and based on the correction data, each processing unit already stored in the storage means. A replacement step of replacing the alignment data of the unit with predetermined correction data, and a second correction step of correcting a position where the transfer device transfers the substrate in another processing unit based on the corrected correction data. A method for aligning a transfer device, comprising: And a processing plate having at least one first processing unit for performing predetermined processing on a substrate mounted on a rotatable mounting table, and a processing plate having a plurality of lift pins.
The lift pins move the substrate between the mounting position and the transfer position, and at least one second processing unit that performs a predetermined process on the substrate at the mounting position, and the first and second processing units. A transfer device for loading and unloading a substrate, wherein the transfer device aligns the transfer device such that the transfer device loads the substrate to a predetermined delivery position of each processing unit. A step of pre-registering the first processing unit and the second processing unit at a position at which a transfer device transfers a substrate by a different method, and storing the positioning data in a storage unit; Before grasping the relationship between the alignment data in the first processing unit and the alignment data in the second processing unit in advance, A step of storing the data in a storage means, and at a predetermined timing, within one of the first processing unit and the second processing unit, a displacement amount of a position where the transfer device transfers the substrate. A first correction step of correcting the position at which the transfer device transfers the substrate, based on the first correction step, and inputting the correction data at this time to the storage means to store the correction data and the first processing A replacement step of replacing the alignment data of another processing unit stored in advance in the storage unit with predetermined correction data based on a relationship between the alignment data in the unit and the alignment data in the second processing unit. A second correction step of correcting a position at which the transfer device transfers a substrate in another processing unit based on the correction data after replacement of the other processing units. And a method for aligning the transfer device. 11. A processing unit comprising a plurality of processing units for vertically performing a predetermined processing on a substrate, and a transfer device for loading and unloading the substrate to and from the stacked processing units. A processing apparatus in which the plurality of processing units are arranged such that the plane positions of the respective delivery positions coincide with each other, such that the transport apparatus carries the substrate into a predetermined delivery position of each processing unit; A method of positioning a transfer device for transferring a substrate in each processing unit in advance, and storing the positioning data in a storage unit. At a timing, within one processing unit, the transfer device transfers the substrate based on the displacement amount of the position where the transfer device transfers the substrate. A first correction step of correcting the position, and inputting the correction data at this time to the storage means, and aligning the horizontal alignment data of another processing unit already stored in the storage device with the correction data, And a second correction step of correcting a position at which the transfer device transfers the substrate in the other processing unit based on the corrected correction data. A method of positioning a transfer device, which is a feature of the present invention. 12. Further, between the first correction step and the replacement step, a position at which the transfer device transfers a substrate to another processing unit is corrected based on correction data in the first correction step. The method according to claim 9, further comprising a step of selecting whether to perform correction or not. 13. The transfer apparatus according to claim 9, wherein the first correction step is performed when a transfer error is detected during the processing of the substrate. Alignment method. 14. The method according to claim 13, wherein the detection of the transport error is performed by monitoring a load of each drive system in the processing apparatus. 15. The method according to claim 13, wherein the detection of the transfer error is performed by detecting the presence and position of a wafer by a sensor provided in the transfer unit. . 16. The method according to claim 1, wherein the position of the substrate is detected by a sensor provided in the transporting means, and the first correction step is performed when the displacement of the substrate in the substrate transporting means exceeds a predetermined value. Claim 9 to Claim 12
The method for aligning a transfer device according to any one of claims 1 to 4. 17. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a plurality of processing units for performing a predetermined process on the substrate; and loading the substrate into a predetermined delivery position in each processing unit. A transfer device and, in each processing unit, correction data for correcting a position at which the transfer device transfers the substrate, and alignment means for correcting a transfer position at which the transfer device transfers the substrate based on the correction data The alignment means comprises: storage means for storing alignment data for each processing unit; and, within one processing unit, the amount of positional deviation of the position at which the transfer device transfers the substrate. The transfer device corrects the transfer position of the substrate based on the correction data, and inputs the correction data at this time to the storage means. Based on the correction data, each processing unit already stored in the storage means is corrected. Control means for replacing the alignment data of the knit with predetermined correction data, and correcting a position at which the transfer device transfers the substrate in another processing unit based on the corrected correction data. Substrate processing equipment. 18. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: at least one first processing unit for performing a predetermined process on a substrate mounted on a rotatable mounting table; At least one second processing unit for moving a substrate between a mounting position and a transport position by the lift pins and performing predetermined processing on the substrate at the mounting position; A transfer device for loading and unloading the substrate to and from a predetermined transfer position in the first and second processing units; and a correction data for correcting a position where the transfer device transfers the substrate in each processing unit; And a positioning unit for correcting a delivery position at which the transfer device transfers the substrate based on the first processing unit and the second processing unit. And the relationship between the alignment data obtained by performing the alignment of the position where the transfer device transfers the substrate by different methods, and the alignment data in the first processing unit and the alignment data in the second processing unit. And a storage unit in which a transfer unit transfers and transfers a substrate in any one of the first processing unit and the second processing unit. hand,
The transfer device corrects the position at which the substrate is transferred, and inputs the correction data at this time to storage means. The correction data and the alignment data in the first processing unit stored in the storage means Based on the relationship with the alignment data in the second processing unit, the alignment data of each processing unit stored in the storage unit is replaced with predetermined correction data, and based on the corrected correction data, Control means for correcting the position at which the transfer device transfers the substrate in the processing unit of (1). 19. The method according to claim 19, wherein the first processing unit is a coating processing unit that applies a coating liquid to the substrate, and the second processing unit is a thermal processing unit that performs thermal processing on the substrate. The substrate processing apparatus according to claim 18, wherein: