JP2000349028A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor substrate processor which can satisfactorily keep airtightness, even when arranging a transparent quartz container, an opaque quartz part, and a flange part horizontally. SOLUTION: This semiconductor substrate processor 10 has a transparent quartz container 11, which performs substrate processing in the inside, an opaque quartz part 12 whose one end face is welded to at least a part of the open end face of the transparent quartz container 11, a transparent quartz part 13 whose one end face is welded to at least a part of the other end face of the opaque quartz part 12 and whose other end face is processed into a plane, and a flange part 14 which puts the inside of the transparent quartz container 11 in airtight condition, by so pressing a member 15 for sealing as to catch the member between itself and the said other end face of the transparent quartz part 13, and this processor performs the treatment of the semiconductor substrate within the inside in airtight condition. The opaque quartz part 12 breaks the conduction of the heat from the transparent quartz container 11, but since it does not participate in sealing for airtightening the inside, it can satisfactorily keep airtightness without generating minute leakages, either.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus, and more particularly to a semiconductor substrate processing apparatus for processing a semiconductor substrate in a transparent quartz container.

[0002]

2. Description of the Related Art FIG. 3 is a longitudinal sectional view showing a configuration of a semiconductor substrate processing apparatus as a conventional example of this type of substrate processing apparatus. The semiconductor substrate processing apparatus 50 includes a transparent quartz container 51 made of transparent quartz and acting as a reaction tube, and an opaque quartz portion 52 welded to a lower portion of the transparent quartz container 51.
To seal the transparent quartz container 51 and the opaque quartz portion 52 and to seal the inside surrounded by the flange portion 54 supported from below and the transparent quartz container 51, the opaque quartz portion 52, and the flange portion 54. , Opaque quartz part 52
An O-ring 55 disposed between the
A heater 56 is provided around the transparent quartz container 51 in order to execute a predetermined process inside. In this case, the opaque quartz portion 52 is provided to reduce the thermal effect on the O-ring 55, and fine bubbles are generated inside to block the heat conducted from the transparent quartz container 51 to the O-ring 55. It is manufactured after undergoing a sintering process.

[0003]

The opaque quartz portion of the above-mentioned semiconductor substrate processing apparatus has a problem that fine bubbles are generated inside the opaque quartz portion in order to block heat conducted from the transparent quartz container.
It is manufactured through a sintering process. Since the opaque quartz portion is manufactured through such a process, the surface of the opaque quartz portion facing the flange portion has a large roughness, and the airtightness is impaired despite the use of the O-ring between the opaque quartz portion and the flange portion. There is. In the above-described example, the transparent quartz container, the opaque quartz portion, and the flange portion are arranged vertically, but this problem is further exacerbated when the transparent quartz container, the opaque quartz portion, and the flange portion must be arranged horizontally.

[0004] In view of the above problems, the present invention provides a substrate processing apparatus that can maintain good airtightness even when the transparent quartz container, the opaque quartz portion, and the flange portion must be arranged horizontally. With the goal.

[0005]

In order to solve the above-mentioned problems, the present invention provides a substrate processing apparatus for processing a substrate in a transparent quartz container. An opaque quartz part welded to a part, one end face is welded to at least a part of the other end face of the opaque quartz part, and the other end face is a transparent quartz part whose plane is processed, and one end face is the transparent quartz part. And a flange portion which presses each other so as to sandwich the sealing member between the other flat end surface of the quartz portion and makes the inside of the transparent quartz container airtight.

In the embodiment of the present invention, in a semiconductor substrate processing apparatus 10 for processing a semiconductor substrate in a transparent quartz container 11, one end face is the transparent quartz container 1.
An opaque quartz part 12 welded to the open end face of the opaque quartz part 12, and one end face is welded to the other end face of the opaque quartz part 12;
The transparent quartz portion 13 whose other end surface is flattened, and the transparent quartz portion 13 are pressed against each other so that the sealing member 15 is sandwiched between the other end surface whose one end surface is flattened. Flange part 14 for making the inside of container 11 airtight
And

According to this structure, the opaque quartz portion blocks the conduction of heat from the transparent quartz container to maintain high thermal efficiency as in the conventional case, and hermetically seals the inside of the transparent quartz container. Since the transparent quartz portion, the flange portion, and the sealing member are used to perform the sealing, the opaque quartz portion does not participate in the sealing, and a small leak does not occur in the sealed portion.

[0008]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Embodiment 1 FIG. FIG. 1 is a configuration diagram showing an example of a semiconductor substrate processing apparatus as an embodiment of a substrate processing apparatus according to the present invention. The semiconductor substrate processing apparatus 10 differs from the conventional example of FIG. 3 in that a transparent quartz container, an opaque quartz portion, and a flange portion are horizontally arranged. This semiconductor substrate processing apparatus 10
Is a transparent quartz container 11 composed of transparent quartz and acting as a reaction tube, and an opaque quartz portion 12 welded to the open end surfaces of both the transparent quartz container 11 and a transparent quartz portion welded to the open end surface of the opaque quartz portion 12. Quartz part 13 and transparent quartz part 1
And a flange portion 14 that seals a portion surrounded by the transparent quartz container 11 and the opaque quartz portion 12 so as to be airtight, with an O-ring 15 serving as a sealing member interposed between the flange portion 14 and the open end surface of the flange 3. It is composed of

In the above-described example, in order to form the transparent quartz portion 13, the transparent quartz portion is welded to the open end face of the opaque quartz portion 12 by overlay welding (preferably 1 mm to 2 mm), flattened by polishing, and burned. Finished with baking. Therefore, the heat supplied by the heating of the heater 16 operated for processing is transmitted through the transparent quartz container 11 to the O-ring 1.
In the five directions, the heat conduction is performed by the opaque quartz portion 12.
Cut off by Regarding the airtightness of the inside of the transparent quartz container 11, the joint with the flange portion 14 is sealed by the flange portion 14, the transparent quartz portion 13, and the O-ring 15, so that the opaque quartz portion is sealed by this sealing. Not involved,
Good airtightness can be secured. In particular, a small leak after the wet cleaning of the transparent quartz container 11 was reduced.

Embodiment 2 FIG. 2 is a configuration diagram showing another example of the embodiment of the substrate processing apparatus according to the present invention. In the semiconductor substrate processing apparatus 20, unlike the example of FIG. 1, a transparent quartz portion 23 is welded to a part of an opaque quartz portion 22 welded to a transparent quartz container 21, and the transparent quartz portion 23 and the flange portion 24 are joined together. An O-ring 25 is disposed therebetween to keep the inside of the transparent quartz container 21 airtight. The reason why the structure is deformed in this way is that opaque quartz is inferior in strength to transparent quartz.

[0011]

As described in detail above, the substrate processing apparatus according to the present invention has one end face welded to the open end face of the transparent quartz container in order to process the substrate in the transparent quartz container. An opaque quartz portion, a transparent quartz portion in which one end surface is welded to the other end surface of the opaque quartz portion and the other end surface is planarized, and the other end surface in which one end surface is planarized in the transparent quartz portion And a flange portion that presses each other so as to sandwich the sealing member between them and makes the inside of the transparent quartz container airtight, so that heat escaping from the transparent quartz container by conduction is blocked by the opaque quartz portion. While keeping the thermal efficiency high, the inside of the transparent quartz container is hermetically sealed by the transparent quartz part, the flange part, and the sealing member, so that the opaque quartz part may be involved in the sealing. Not Without generating a minute leak stop portion, it can be kept good airtightness.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an example of an embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a configuration diagram showing another example of the embodiment of the substrate processing apparatus according to the present invention.

FIG. 3 is a diagram showing a conventional example.

[Explanation of symbols]

 10,20 Semiconductor substrate processing apparatus 11,21 Transparent quartz container 12,22 Opaque quartz part 13,23 Transparent quartz part 14,24 Flange part

Claims (1)

[Claims] 1. A substrate processing apparatus for processing a substrate in a transparent quartz container, wherein an opaque quartz portion having one end face welded to at least a part of an open end face of the transparent quartz container; For sealing between a transparent quartz part welded to at least a part of the other end face of the quartz part and the other end face is flattened, and one other end face of the transparent quartz part flattened. A substrate processing apparatus comprising: a flange portion that presses each other so as to sandwich the member to make the inside of the transparent quartz container airtight.