JP2000348583A - Alloy temperature fuse - Google Patents

Alloy temperature fuse

Info

Publication number
JP2000348583A
JP2000348583A JP11160060A JP16006099A JP2000348583A JP 2000348583 A JP2000348583 A JP 2000348583A JP 11160060 A JP11160060 A JP 11160060A JP 16006099 A JP16006099 A JP 16006099A JP 2000348583 A JP2000348583 A JP 2000348583A
Authority
JP
Japan
Prior art keywords
melting point
low melting
alloy
point fusible
fusible alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11160060A
Other languages
Japanese (ja)
Other versions
JP4209549B2 (en
Inventor
Mitsuaki Uemura
充明 植村
Tomokuni Mitsui
朋晋 三井
Toshiaki Kawanishi
俊朗 川西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP16006099A priority Critical patent/JP4209549B2/en
Publication of JP2000348583A publication Critical patent/JP2000348583A/en
Application granted granted Critical
Publication of JP4209549B2 publication Critical patent/JP4209549B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To reduce resistance value of a welding interface, prevent self-heating, and appropriately actuate at a prescribed temperature by polishing and removing heterogeneous thin film of an electrode, welding a low melting point fusible alloy piece, and using a specific lead wire. SOLUTION: Opposite electrodes 2 are formed by baking conductive paste having metal grains as conductive components on an insulating plate such as ceramic, a belt nickel lead conductor 3 of identical quality with the can body of a secondary battery is connected to the respective electrodes, and a low- melting point fusible alloy piece 4 is welded between the both electrodes. In this case, the surface of the electrode 2 is polished to remove a heterogeneous thin film and welded, so that the temperature rise due to the high resistance value of the heterogeneous thin film can be eliminated. Then, the low melting point fusible alloy piece 4 is coated with flux 5 and seals the insulating plate 1 as covering thereover. The ratio of the metal grains occupied on the polished surfaces of the electrodes is set to 80% or more, the Vickers hardness and the thickness of the lead wire are set to 100-280 and 50-850 μm, and the rated current value is set to 0.1-15 A.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は合金型温度ヒュ−ズ
に関し、リチウムイオン二次電池等の異常昇温の未然防
止に有用なものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alloy type temperature fuse, which is useful for preventing abnormal temperature rise of a lithium ion secondary battery or the like.

【0002】[0002]

【従来の技術】近来、携帯電話、PHS、携帯型のパ−
ソナルコンピュ−タ等の携帯型電子機器の電源として、
繰返し充放電が可能な電池、すなわち二次電池が使用さ
れている。この二次電池としては、リチウムイオン二次
電池が高いエネルギ−密度、長いライフサイクル、高い
作動電圧等のために注目されている。このリチウムイオ
ン二次電池等においては、何らかの原因でエネルギ−が
一挙に放出されると、電池が異常高温になって爆裂する
畏れがある。そこで、温度ヒュ−ズをリチウムイオン二
次電池等の缶体に密接させ、かつ当該電池の+極と−極
との間に直列に挿入するようにして取付け、当該電池が
所定の上限温度に達したときに電池回路を電気的に遮断
することが提案されている。
2. Description of the Related Art In recent years, portable telephones, PHSs and portable parsers have been developed.
As a power source for portable electronic devices such as sonal computers,
A battery that can be repeatedly charged and discharged, that is, a secondary battery is used. As this secondary battery, a lithium ion secondary battery has been receiving attention because of its high energy density, long life cycle, high operating voltage, and the like. In this lithium ion secondary battery or the like, if energy is released at once for any reason, the battery may be exploded due to an abnormally high temperature. Therefore, the temperature fuse is closely attached to a can body of a lithium ion secondary battery or the like, and is mounted so as to be inserted in series between the positive electrode and the negative electrode of the battery, so that the battery reaches a predetermined upper limit temperature. It has been proposed to electrically shut off the battery circuit when it reaches.

【0003】この二次電池用温度ヒュ−ズに要求される
一の条件は、薄型・小型であり、かかる薄型・小型温度
ヒュ−ズとして、図6に示す合金型温度ヒュ−ズが公知
である。図6の(イ)に示す合金型温度ヒュ−ズにおい
ては、導電ペ−ストの印刷・焼付けによりセラミックス
板1’等の絶縁基板に対向電極2’,2’が設けられ、
各電極2’にリ−ド導体3’が接合され、両電極2’,
2’間に低融点可溶合金片4’が接続され、低融点可溶
合金片4’にフラックス5’が塗布され、フラックス塗
布低融点可溶合金片が樹脂層6’で封止されいる。
One of the requirements for the temperature fuse for a secondary battery is that it is thin and small. As such a thin and small temperature fuse, an alloy type temperature fuse shown in FIG. 6 is known. is there. In the alloy type temperature fuse shown in FIG. 6A, opposed electrodes 2 ', 2' are provided on an insulating substrate such as a ceramic plate 1 'by printing and baking a conductive paste.
A lead conductor 3 'is joined to each electrode 2', and both electrodes 2 ',
A low-melting-point fusible alloy piece 4 'is connected between 2', a flux 5 'is applied to the low-melting-point fusible alloy piece 4', and the flux-coated low-melting-point fusible alloy piece is sealed with a resin layer 6 '. .

【0004】図6の(ロ)に示す合金型温度ヒュ−ズに
おいては、一対の帯状リ−ド導体3’,3’の先端部が
プラスチックベ−スフィルム11’の表面に熱融着さ
れ、その導体先端部間に低融点可溶合金片4’が接続さ
れ、この低融点可溶合金片4’にフラックス5’が塗布
され、フラックス塗布低融点可溶合金片がプラスチック
カバ−フィルム12’で封止されている。
In the alloy type temperature fuse shown in FIG. 6B, the tips of a pair of strip-shaped lead conductors 3 ', 3' are thermally fused to the surface of a plastic base film 11 '. A low-melting-point fusible alloy piece 4 'is connected between the ends of the conductors, a flux 5' is applied to the low-melting-point fusible alloy piece 4 ', and the flux-coated low-melting-point fusible alloy piece is applied to the plastic cover film 12. 'Is sealed.

【0005】図6の(ハ)に示す合金型温度ヒュ−ズに
おいては、一対の帯状リ−ド導体3’,3’の先端部が
プラスチックベ−スフィルム11’の裏面より表面に水
密に現出され、かつリ−ド導体3’とプラスチックベ−
スフィルム11’との間が熱融着され、現出導体3
1’,31’間に低融点可溶合金片4’が接続され、こ
の低融点可溶合金片4’にフラックス5’が塗布され、
フラックス塗布低融点可溶合金片がプラスチックカバ−
フィルム12’で封止されている。
In the alloy type temperature fuse shown in FIG. 6 (c), the tips of a pair of strip-shaped lead conductors 3 ', 3' are watertight from the back surface of the plastic base film 11 'to the surface. Appeared and lead conductor 3 'and plastic base
And the exposed conductor 3
A low melting point fusible alloy piece 4 'is connected between 1' and 31 ', and a flux 5' is applied to this low melting point fusible alloy piece 4 '.
Flux coated low melting point fusible alloy piece is plastic cover
It is sealed with a film 12 '.

【0006】更に、二次電池用温度ヒュ−ズに要求され
る他の条件は、リ−ド導体が二次電池の缶体に容易に溶
接できるようにその缶体と同材質とすること、例えばニ
ッケルとすることが挙げられる。しかしながら、ニツケ
ルははんだ接合が困難な金属であり、図6の(イ)に示
す合金型温度ヒュ−ズにおいて、リ−ド導体3’をニッ
ケル導体とするとリ−ド導体3’と導電ペ−スト焼付け
電極2’とのはんだ接合が困難となる。また、図6の
(ロ)や図6の(ハ)に示す合金型温度ヒュ−ズにおい
ては、ニッケルリ−ド導体の先端部での低融点可溶合金
片端の溶着が困難となる。
Further, another condition required for the temperature fuse for the secondary battery is that the lead conductor is made of the same material as the can so that the lead conductor can be easily welded to the can of the secondary battery. For example, nickel may be used. However, nickel is a metal which is difficult to be solder-bonded. In the alloy type temperature fuse shown in FIG. 6A, when the lead conductor 3 'is a nickel conductor, the lead conductor 3' and the conductive pad are used. Solder bonding with the strike-baked electrode 2 'becomes difficult. Further, in the alloy type temperature fuse shown in FIGS. 6B and 6C, it is difficult to weld one end of the low melting point fusible alloy at the tip of the nickel lead conductor.

【0007】そこで、図6の(イ)に示す合金型温度ヒ
ュ−ズに対しては、ニッケルリ−ド導体3’の先端部を
錫めっきし、この錫めっき面と導電ペ−スト焼付け電極
2’とを接合することが提案されている。また、図6の
(ロ)や図6の(ハ)に示す合金型温度ヒュ−ズに対し
ては、ニッケルリ−ド導体の先端部表面に銅箔のクラッ
ド、銅めっき等によって銅導体を設け、この銅導体に低
融点可溶合金片端を溶着することが提案されている(特
開平11−40026号)。
Therefore, for the alloy type temperature fuse shown in FIG. 6A, the tip of the nickel lead conductor 3 'is tin-plated, and the tin-plated surface and the conductive paste baked electrode 2 are used. It has been proposed to join with. For the alloy type temperature fuses shown in FIGS. 6B and 6C, a copper conductor is provided on the surface of the tip of the nickel lead conductor by cladding of copper foil, copper plating or the like. It has been proposed to weld one end of a low-melting-point fusible alloy to this copper conductor (JP-A-11-40026).

【0008】[0008]

【発明が解決しようとする課題】上記リチウムイオン二
次電池等においては、その高いエネルギ−密度のために
定格電流を高く設定することが可能である。しかしなが
ら、本発明者等の図6の(イ)の合金型温度ヒュ−ズの
検討結果によれば、電極表面に焼付け時に雰囲気ガスと
の反応で生成された異質薄膜(厚み10nm程度)が存
在するために導電ペ−スト焼付け電極と低融点可溶合金
片との溶着界面が高抵抗となり、この高抵抗部位の平常
時電流による発熱が原因で温度ヒュ−ズの動作誤差の惹
起が避けられない。すなわち、この平常時電流による発
熱に基づく低融点可溶合金片の温度上昇をΔTとする
と、前記の上限温度(Tx)より低い温度(Tx−ΔT)
で合金型温度ヒュ−ズが作動してしまい、合金型温度ヒ
ュ−ズの作動精度の低下が避けられない
In the above-mentioned lithium ion secondary battery or the like, it is possible to set a high rated current because of its high energy density. However, according to the results of examination of the alloy type temperature fuse shown in FIG. 6A by the present inventors, a heterogeneous thin film (about 10 nm in thickness) generated by a reaction with an atmospheric gas at the time of baking exists on the electrode surface. Therefore, the welding interface between the conductive paste-baked electrode and the low melting point fusible alloy piece has a high resistance, and the occurrence of temperature fuse operation errors due to the heat generated by the normal current in this high resistance portion can be avoided. Absent. That is, assuming that the temperature rise of the low melting point fusible alloy piece based on the heat generated by the normal current is ΔT, the temperature (Tx−ΔT) lower than the above upper limit temperature (Tx)
Causes the alloy type temperature fuse to operate, which inevitably reduces the operating accuracy of the alloy type temperature fuse.

【0009】また、リ−ド導体の先端部をプラスチック
ベ−スフィルムに加熱融着している図6の(ロ)や図6
の(ハ)に示す合金型温度ヒュ−ズにおいても、リ−ド
導体先端部の銅導体表面の酸化が加熱のために促進され
たり、プラスチックベ−スフィルムから加熱により発生
する気化物の附着が生じるため、それだけ銅導体表面と
低融点可溶合金片との溶着界面の抵抗値が高くなる結
果、前記導電ペ−スト焼付け電極の場合より軽度であっ
ても、その高抵抗部位の平常時電流による発熱が原因し
ての動作誤差は無視し難い。
6 (b) and 6 (b) in which the leading end of the lead conductor is heated and fused to a plastic base film.
Also in the alloy type temperature fuse shown in (c), oxidation of the copper conductor surface at the tip of the lead conductor is promoted due to heating, and vaporized substances generated by heating from the plastic base film are attached. As a result, the resistance value of the welding interface between the copper conductor surface and the low melting point fusible alloy piece becomes higher. An operation error due to heat generation due to current is not negligible.

【0010】従って、図6示す薄型・小型の合金型温度
ヒュ−ズにおいて、リ−ド導体を二次電池の缶体と同材
質にして溶接取付けの容易化を図り、そのリ−ド導体の
先端部に易はんだ付け導体を設けてリ−ド導体と導電ペ
−スト焼付け電極とのはんだ接合やリ−ド導体と低融点
可溶合金片との溶着の容易化を図っただけでは、リチウ
ムイオン二次電池の高エネルギ−密度に基づく高い定格
電流のもとで、その二次電池の異常発熱の適確な未然防
止を保証することは困難である。
Therefore, in the thin and small alloy type temperature fuse shown in FIG. 6, the lead conductor is made of the same material as that of the can of the secondary battery, thereby facilitating welding attachment. Lithium cannot be obtained simply by providing an easily solderable conductor at the tip to facilitate solder joining between the lead conductor and the conductive paste baking electrode and welding between the lead conductor and the low melting point fusible alloy piece. Under a high rated current based on the high energy density of the ion secondary battery, it is difficult to guarantee proper prevention of abnormal heat generation of the secondary battery.

【0011】本発明の目的は、リチウムイオン二次電池
のような高エネルギ−密度の二次電池の異常昇温の未然
防止に好適に使用できる合金型温度ヒュ−ズを提供する
ことにある。より詳しくは、リ−ド導体を二次電池の缶
体と同材質にして二次電池への溶接取付けを容易に行い
得、定格電流を二次電池の高エネルギ−密度に応じて高
く設定しても高精度で作動させ得る薄型・小型の合金型
温度ヒュ−ズを提供することにある。
An object of the present invention is to provide an alloy type temperature fuse which can be suitably used for preventing abnormal temperature rise of a high energy density secondary battery such as a lithium ion secondary battery. More specifically, the lead conductor is made of the same material as that of the rechargeable battery can, so that it can be easily welded to the rechargeable battery and the rated current is set high according to the high energy density of the rechargeable battery. Another object of the present invention is to provide a thin and small alloy type temperature fuse which can be operated with high accuracy.

【0012】[0012]

【課題を解決するための手段】本発明に係る一の合金型
温度ヒュ−ズは、金属粒体を導電性成分とする導電ペ−
ストの焼付けにより絶縁基板に対向電極が設けられ、各
電極にリ−ド導体が接合され、両電極間に低融点可溶合
金片が接続され、低融点可溶合金片にフラックスが塗布
され、フラックス塗布低融点可溶合金片が封止されてな
る温度ヒュ−ズであり、電極表面が研磨されその研磨面
に低融点可溶合金片端が溶着され、リ−ド導体がニッケ
ル導体とされていることを特徴とする構成であり、フラ
ックス塗布低融点可溶合金片の封止を絶縁基板を包囲す
るプラスチックフィルムにより行なうこと、電極の研磨
表面における金属粒体の占める割合を80%以上とする
こと、ニッケルリ−ド導体を帯状としでそのビッカ−ス
硬度を100〜280、厚みを50〜850μmとする
こと、定格電流値を0.1A〜15A、好ましくは1.
5A〜15Aとすること、リ−ド導体を電池の缶体に溶
接して使用すること、ニッケルリ−ド導体に代え、ステ
ンレスリ−ド導体、アルミリ−ド導体または鉄リ−ド導
体の何れかを使用することが可能である。
According to one aspect of the present invention, there is provided an alloy-type temperature fuse comprising a conductive paste comprising metal particles as a conductive component.
A counter electrode is provided on the insulating substrate by baking the strike, a lead conductor is joined to each electrode, a low melting point fusible alloy piece is connected between both electrodes, and a flux is applied to the low melting point fusible alloy piece, A temperature fuse in which the flux-coated low-melting-point fusible alloy piece is sealed, the electrode surface is polished, the low-melting-point fusible alloy piece is welded to the polished surface, and the lead conductor is made of nickel. Wherein the flux-coated low-melting-point fusible alloy piece is sealed with a plastic film surrounding the insulating substrate, and the proportion of metal particles on the polished surface of the electrode is 80% or more. The nickel lead conductor is formed in a strip shape, the Vickers hardness is 100 to 280, the thickness is 50 to 850 μm, and the rated current value is 0.1 A to 15 A, preferably 1.
5A to 15A, a lead conductor is welded to a battery can, and used. Instead of a nickel lead conductor, any one of a stainless steel lead conductor, an aluminum lead conductor, and an iron lead conductor is used. It is possible to use

【0013】本発明に係る他の合金型温度ヒュ−ズは、
一対の帯状リ−ド導体の先端部がプラスチックベ−スフ
ィルムの裏面より表面に水密に現出され、かつリ−ド導
体とプラスチックベ−スフィルムとの間が融着され、現
出導体間に低融点可溶合金片が接続され、低融点可溶合
金片にフラックスが塗布され、フラックス塗布低融点可
溶合金片が封止されてなる温度ヒュ−ズであり、帯状リ
−ド導体が先端部表面が銅または銀または金導体とされ
ニッケル導体であり、その銅または銀または金導体表面
が研磨され該研磨面に低融点可溶合金片端が溶着されて
いることを特徴とする構成であり、本発明に係る他の別
の合金型温度ヒュ−ズは、一対の帯状リ−ド導体の先端
部がプラスチックベ−スフィルムの表面に融着され、そ
の先端部間に低融点可溶合金片が接続され、低融点可溶
合金片にフラックスが塗布され、フラックス塗布低融点
可溶合金片が封止されてなる温度ヒュ−ズであり、帯状
リ−ド導体が先端部表面が銅または銀または金導体とさ
れニッケル導体であり、その銅または銀導体表面が研磨
され該研磨面に低融点可溶合金片端が溶着されているこ
とを特徴とする構成であり、何れの構成においても、ニ
ッケル帯状リ−ド導体のビッカ−ス硬度を100〜28
0、厚みを50〜850μmとすること、定格電流値を
0.1A〜15A好ましくは1.5A〜15Aとするこ
と、帯状リ−ド導体を電池の缶体に溶接して使用するこ
と、ニッケル帯状リ−ド導体に代え、ステンレス帯状リ
−ド導体、アルミ帯状リ−ド導体または鉄帯状リ−ド導
体の何れかを使用することが可能である。
[0013] Another alloy type temperature fuse according to the present invention is:
The leading ends of the pair of strip-shaped lead conductors are exposed water-tightly from the back surface of the plastic base film to the surface, and the lead conductor and the plastic base film are fused to each other. Is a temperature fuse in which a low melting point fusible alloy piece is connected, a flux is applied to the low melting point fusible alloy piece, and the flux coated low melting point fusible alloy piece is sealed. The tip surface is a copper conductor or silver or gold conductor and a nickel conductor, and the copper, silver or gold conductor surface is polished and one end of a low melting point fusible alloy is welded to the polished surface. In another alloy type temperature fuse according to the present invention, the tips of a pair of strip-shaped lead conductors are fused to the surface of a plastic base film, and a low melting point is melted between the tips. The alloy flakes are connected, and the low melting point fusible alloy flakes Is a temperature fuse in which a flux-coated low melting point fusible alloy piece is sealed. Alternatively, the surface of the silver conductor is polished and one end of a low-melting-point fusible alloy is welded to the polished surface. In each case, the Vickers hardness of the nickel strip-shaped lead conductor is 100%. ~ 28
0, the thickness is 50 to 850 μm, the rated current value is 0.1 A to 15 A, preferably 1.5 A to 15 A, the strip-shaped lead conductor is welded to the battery can, and nickel is used. Instead of the strip-shaped lead conductor, any one of a stainless steel strip-shaped lead conductor, an aluminum strip-shaped lead conductor and an iron strip-shaped lead conductor can be used.

【0014】[0014]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1の(イ)は本発明に
係る合金型温度ヒュ−ズの一例を示す図面、図1の
(ロ)は図1の(イ)におけるロ−ロ断面図である。図
1において、1は耐熱性及び良熱伝導性の絶縁板、例え
ばセラミックス板である。2,2は絶縁板1上に設けた
導電ペ−ストの焼付け電極、3,3は各電極2,2に接
続したニッケル帯状リ−ド導体、4は電極2,2間に接
続した低融点可溶合金片であり、各電極2の表面を研磨
したうえで各電極2とリ−ド導体3との接続、電極2,
2間への低融点可溶合金片4の接続を行っている。5は
低融点可溶合金片4上に塗布したフラツクス、6はフラ
ックス塗布低融点可溶合金片を封止した樹脂層である。
この樹脂層6の表面に機械的強度の大なる補強板を固着
して封止層全体の厚みを薄くすることもできる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a drawing showing an example of an alloy-type temperature fuse according to the present invention, and FIG. 1B is a cross-sectional view taken along a line in FIG. In FIG. 1, reference numeral 1 denotes an insulating plate having heat resistance and good thermal conductivity, for example, a ceramic plate. Reference numerals 2, 2 denote burned electrodes of a conductive paste provided on the insulating plate 1, reference numerals 3, 3 denote nickel strip-shaped lead conductors connected to the electrodes 2, 2, and reference numeral 4, a low melting point connected between the electrodes 2, 2. A fusible alloy piece which is polished on the surface of each electrode 2 and then connected to each electrode 2 and a lead conductor 3;
The low melting point fusible alloy piece 4 is connected between the two. Reference numeral 5 denotes a flux applied on the low melting point fusible alloy piece 4, and 6 denotes a resin layer in which the flux applied low melting point fusible alloy piece is sealed.
A reinforcing plate having high mechanical strength can be fixed to the surface of the resin layer 6 to reduce the thickness of the entire sealing layer.

【0015】図2の(イ)は本発明に係る合金型温度ヒ
ュ−ズの別例を示す図面、図2の(ロ)は図2の(イ)
におけるロ−ロ断面図である。図2において、1は耐熱
性及び良熱伝導性の絶縁板、例えばセラミックス板であ
る。2,2は絶縁板1上に設けた導電ペ−ストの焼付け
電極、3,3は各電極2,2に接続したニッケル帯状リ
−ド導体、4は電極2,2間に接続した低融点可溶合金
片であり、各電極2の表面を研磨したうえで各電極2と
リ−ド導体3との接続、電極2,2間への低融点可溶合
金片4の接続を行っている。5は低融点可溶合金片上に
塗布したフラツクスである。61はフラックス塗布低融
点可溶合金片を封止したプラスチックフィルムであり、
絶縁基板1を挾み周辺部をヒ−トシ−ル等により封止し
てある。これらのプラスチックフィルムの使用に代え、
熱収縮性のプラチチックチュ−ブを絶縁板に挿通し、こ
れを熱収縮させることもできる。また、フラックス塗布
低融点可溶合金片を樹脂塗布層で覆ったうえで、プラス
チックフィルムまたは熱収縮性プラチチックチュ−ブに
よる最終的な封止を行うことも可能である。
FIG. 2A is a drawing showing another example of the alloy type temperature fuse according to the present invention, and FIG. 2B is a drawing showing FIG.
FIG. In FIG. 2, reference numeral 1 denotes an insulating plate having heat resistance and good thermal conductivity, for example, a ceramic plate. Reference numerals 2, 2 denote burned electrodes of a conductive paste provided on the insulating plate 1, reference numerals 3, 3 denote nickel strip-shaped lead conductors connected to the electrodes 2, 2, and reference numeral 4, a low melting point connected between the electrodes 2, 2. After the surface of each electrode 2 is polished, the connection between each electrode 2 and the lead conductor 3 and the connection of the low melting point fusible alloy piece 4 between the electrodes 2 and 2 are performed. . 5 is a flux applied on the low melting point fusible alloy piece. 61 is a plastic film in which a flux-coated low melting point fusible alloy piece is sealed,
The periphery of the insulating substrate 1 is sealed with a heat seal or the like. Instead of using these plastic films,
It is also possible to insert a heat-shrinkable plastic tube through the insulating plate and heat-shrink it. Further, it is also possible to cover the flux-applied low-melting-point fusible alloy piece with a resin-applied layer and then perform final sealing with a plastic film or a heat-shrinkable plastic tube.

【0016】上記電極2への低融点可溶合金片4の端部
の溶着には、接合箇所とこの箇所から隔たった電極部分
とにピン電極を当接しパルス電流を流して溶接する抵抗
溶接法、接合箇所を加熱ピンで加圧する熱圧着法、接合
箇所にホ−ンチップを当接する超音波加熱法等を使用で
きる。上記導電ペ−ストには導電性金属粉末(粒径は通
常0.4〜6μm)とガラス粉末と金属酸化物粉末との
混合物を溶媒(例えばエチルセルロ−ス)でペ−スト状
にしたものが使用される。例えば、導電性金属粉末とし
てAg、Ag−Pd、Ag−Ptを用いたAg系ぺ−ス
ト、Cu系ペ−スト、Au系ぺ−スト等を用いることが
できる。上記電極は導電ペ−ストをセラミックス板に印
刷・焼付けることにより設け、焼付けは通常空気雰囲気
中で行うが、窒素等の不活性ガス雰囲気中で行うことも
できる。この電極の厚みは5μm〜100μmとされ、
その焼付けにおいては、雰囲気ガスと印刷導電ペ−スト
表面との反応やバインダ−の分解生成物の析出等により
電極表面に厚み数10nmの高電気抵抗の異質薄膜が形
成される。
The welding of the end of the low melting point fusible alloy piece 4 to the electrode 2 is performed by a resistance welding method in which a pin electrode is brought into contact with a joint portion and an electrode portion separated from the joint portion, and a pulse current is applied to perform welding. A thermocompression method in which the joint is pressed with a heating pin, an ultrasonic heating method in which a horn chip is brought into contact with the joint, and the like can be used. The above-mentioned conductive paste is obtained by forming a mixture of a conductive metal powder (having a particle diameter of usually 0.4 to 6 μm), a glass powder and a metal oxide powder in a paste form with a solvent (for example, ethyl cellulose). used. For example, Ag-based paste using Ag, Ag-Pd, Ag-Pt as the conductive metal powder, Cu-based paste, Au-based paste, or the like can be used. The electrodes are provided by printing and baking a conductive paste on a ceramics plate. Baking is usually performed in an air atmosphere, but may be performed in an inert gas atmosphere such as nitrogen. The thickness of this electrode is 5 μm to 100 μm,
In the baking, a heterogeneous thin film having a high electrical resistance of several tens nm in thickness is formed on the surface of the electrode due to a reaction between the atmosphere gas and the surface of the printed conductive paste and a deposition of a decomposition product of the binder.

【0017】しかしながら、本発明に係る合金型温度ヒ
ュ−ズにおいては、異質薄膜を研削除去して(研磨代は
1μm程度で充分である)電極に低融点可溶合金片の端
部を溶着しているから、低融点可溶合金片と電極との溶
着界面の抵抗値を充分に低くでき、また、溶着性の向上
により界面溶着強度を高くでき、低融点可溶合金片の断
面積を安定に維持できる。従って、溶着部を含めた低融
点可溶合金片の抵抗値を充分に低くでき、定格電流値を
大きく設定しても、低融点可溶合金片の自己発熱を防止
して所定の温度で適確に作動させ得る。また、樹脂層等
による封止とフラックス塗布との二重の酸化防止機構に
より、電極の研磨表面の後発的酸化がよく防止されるか
ら、溶融した低融点可溶合金の電極表面への濡れをよく
保証でき、温度ヒュ−ズの作動時、溶融した低融点可溶
合金が溶融フラックスとの共存下で電極によく濡れて迅
速に分断され得る。
However, in the alloy type temperature fuse according to the present invention, the extraneous thin film is ground and removed (the polishing allowance is about 1 μm is sufficient), and the end of the low melting point fusible alloy piece is welded to the electrode. As a result, the resistance value of the welding interface between the low melting point fusible alloy piece and the electrode can be sufficiently reduced, and the interfacial welding strength can be increased by improving the weldability, stabilizing the cross-sectional area of the low melting point fusible alloy piece. Can be maintained. Therefore, the resistance value of the low melting point fusible alloy piece including the welded portion can be sufficiently reduced, and even if the rated current value is set to a large value, self-heating of the low melting point fusible alloy piece is prevented and the appropriate temperature is maintained at a predetermined temperature. Can work reliably. In addition, the double oxidation prevention mechanism of sealing with a resin layer and the like and flux application prevent late oxidation of the polished surface of the electrode well, so that wetting of the molten low melting point fusible alloy on the electrode surface can be prevented. When the temperature fuse is operated, the molten low melting point fusible alloy is well wetted by the electrode in the presence of the molten flux and can be quickly separated.

【0018】上記電極表面の研磨は全面にわたり行うこ
とが望ましいが、低融点可溶合金片の溶着箇所のみを研
磨するようにしてもよい。
The electrode surface is preferably polished over the entire surface, but it is also possible to polish only the welded portion of the low melting point fusible alloy piece.

【0019】本発明に係る合金型温度ヒュ−ズにおい
て、電極とニッケル帯状リ−ド導体との接合は、抵抗溶
接、レザ−溶接等により行うが、電極表面から前記の異
質薄膜を除去してあるから、溶接部への異質物質の巻き
込みを排除でき、電極とニッケル帯状リ−ド導体との接
合も低抵抗値、優れた機械的強度で行うことができる。
上記電極の研磨表面における金属粒体が占める割合α
(膜電極試料の面積をS、その面中金属粒体によって占
められる面積をS’とすれば、α=S’/S×100%
で与えられる)は、電極と低融点可溶合金片との接合部
及び電極とニッケルリ−ド導体との接合部の機械的強度
や電気導通性を高めるために80%以上、好ましくは9
0%以上とすることが望ましい。この割合αは電子顕微
鏡による観測や蛍光X線分析法によって測定でき、例え
ばαが80%の膜電極試料を作成し、この膜電極試料の
表面に白色Xを照射したときのその金属粒体の金属の固
有X線強度をzとすれば、固有X線強度がz以上の膜電
極であれば、膜電極表面における金属粒体が占める割合
を80%以上と判定できる。
In the alloy type temperature fuse according to the present invention, the electrode and the nickel strip lead conductor are joined by resistance welding, laser welding, or the like. As a result, entrapment of foreign substances into the welded portion can be eliminated, and the connection between the electrode and the nickel strip lead conductor can be performed with a low resistance value and excellent mechanical strength.
Ratio α occupied by metal particles on the polished surface of the electrode
(If the area of the membrane electrode sample is S and the area occupied by the metal particles in the plane is S ′, α = S ′ / S × 100%
) Is 80% or more, preferably 9%, in order to increase the mechanical strength and electrical conductivity of the joint between the electrode and the low melting point fusible alloy piece and the joint between the electrode and the nickel lead conductor.
Desirably, it is 0% or more. The ratio α can be measured by observation with an electron microscope or by X-ray fluorescence analysis. For example, a membrane electrode sample having α of 80% is prepared, and when the surface of the membrane electrode sample is irradiated with white X, the metal particle Assuming that the intrinsic X-ray intensity of the metal is z, if the membrane electrode has an intrinsic X-ray intensity of z or more, it can be determined that the ratio of the metal particles on the surface of the membrane electrode is 80% or more.

【0020】上記ニッケル帯状リ−ド導体には、ビッカ
−ス硬度100〜280好ましくは130〜220、厚
み50〜300μm好ましくは80〜160μmのもの
を使用することが望ましい。而して、ビッカ−ス硬度1
00以上であるために、厚み50μmという薄い厚みの
もとでもニッケル帯状リ−ド導体に充分な剛直性を付与
でき、低融点可溶合金片の接合時や機器への溶接接合時
にリ−ド導体を安定に保持してそれらの溶接を容易に行
うことができ、またビッカ−ス硬度280以下であるた
めに、300μmという比較的厚いリ−ド導体を溶接上
折り曲げても、その折り曲げ部位でのクラック発生を排
除して容易に溶接できる。かかるビッカ−ス硬度、厚み
のリ−ド導体では、その端部の中央部に孔を開けたり一
部切り欠いて機器への溶接接合することも可能である。
It is desirable to use a nickel strip-shaped lead conductor having a Vickers hardness of 100 to 280, preferably 130 to 220, and a thickness of 50 to 300 μm, preferably 80 to 160 μm. Thus, Vickers hardness 1
Since it is not less than 00, sufficient rigidity can be imparted to the nickel strip-shaped lead conductor even at a thin thickness of 50 μm, and the lead is used for joining a low melting point fusible alloy piece or welding to equipment. Since the conductors can be stably held and welded easily, and the Vickers hardness is 280 or less, even if a relatively thick lead conductor having a thickness of 300 μm is bent by welding, the bent portion is formed at the bent portion. Can be easily welded by eliminating the occurrence of cracks. With such a Vickers hardness and thickness lead conductor, it is also possible to form a hole in the center of the end or cut out a part of the lead and weld it to equipment.

【0021】本発明に係る合金型温度ヒュ−ズは二次電
池、特にリチウムイオン二次電池の異常発熱の防止に好
適に使用できる。図3は、図2に示した合金型温度ヒュ
−ズの使用状態の一例を示し、cは正極であるキャツプ
aに対して部位bで絶縁分離された負極のでニッケル缶
体を示し、この缶体c上の絶縁膜iを局部的に剥離し、
その露出缶体面に合金型温度ヒュ−ズの本体Aと一方の
ニッケルリ−ド導体31を接触させ、そのリ−ド導体3
1と缶体cとを抵抗溶接等で接合し、キャツプaの正極
端子と合金型温度ヒュ−ズの他方のリ−ド導体32とを
二端子として携帯機器の負荷に電気的に接続する構成で
あり、一方のリ−ド導体31と缶体bとの溶接がニッケ
ル同士の溶接であるために容易であり、大なる定格電流
で使用しても前記した通り低融点可溶合金片の融点で規
制された正確な温度で作動させ得、温度ヒュ−ズの薄型
・小型のために温度ヒュ−ズ装着電池の外形寸法もほぼ
元のままに維持でき、リチウムイオン二次電池の異常発
熱の防止に好適である。この使用形態では、二次電池の
内部短絡などにより異常電流が流れると、その異常電流
による低融点可溶合金片のジュ−ル発熱・溶断で通電を
遮断させること、すなわち電流温度ヒュ−ズとしても機
能させることができる。
The alloy type temperature fuse according to the present invention can be suitably used for preventing abnormal heat generation of a secondary battery, particularly a lithium ion secondary battery. FIG. 3 shows an example of a use state of the alloy type temperature fuse shown in FIG. 2, and c shows a nickel can body which is a negative electrode insulated and separated at a portion b with respect to a positive electrode cap a. The insulating film i on the body c is locally peeled off,
The main body A of the alloy type temperature fuse and one nickel lead conductor 31 are brought into contact with the exposed can body surface, and the lead conductor 3
1 and the can c are joined by resistance welding or the like, and the positive terminal of the cap a and the other lead conductor 32 of the alloy type temperature fuse are electrically connected to the load of a portable device as two terminals. The welding of one of the lead conductors 31 to the can body b is easy because of the welding of nickel and the melting point of the low melting point fusible alloy piece as described above even when used at a large rated current. The battery can be operated at the exact temperature regulated by the temperature fuse, and because the temperature fuse is thin and small, the external dimensions of the battery fitted with the temperature fuse can be kept almost unchanged, and abnormal heat generation of the lithium ion secondary battery can be prevented. Suitable for prevention. In this use mode, when an abnormal current flows due to an internal short-circuit of the secondary battery or the like, the current is cut off by the heat generation and the melting of the low melting point fusible alloy piece due to the abnormal current, that is, as a current temperature fuse. Can also function.

【0022】上記定格電流は、0.1A〜15Aに設定
され、この場合、低融点可溶合金片には抵抗値45mΩ
以下、好ましくは15mΩ以下、特に好ましくは2mΩ
以下のものが使用され、上記電極表面の研磨のために、
低融点可溶合金片の断面寸法(丸線の場合は直径、リボ
ンの場合は厚み)50μm〜800μmのもとでリ−ド
導体と電極及び低融点可溶合金片を経る抵抗値を充分に
低くでき(低融点可溶合金片の抵抗値45mΩ以下に対
しては20mΩ以下、低融点可溶合金片の抵抗値15m
Ω以下に対しては20mΩ以下、低融点可溶合金片の抵
抗値2mΩ以下に対しては12mΩ以下)、低融点可溶
合金片の自己発熱をよく防止して合金型温度ヒュ−ズを
低融点可溶合金片の融点で規制された正確な温度で作動
させ得る。また、低融点可溶合金片の断面寸法(丸線の
場合は直径、リボンの場合は厚み)を350μm以下に
して合金型温度ヒュ−ズの一層の薄厚化を図ることも可
能となる。
The rated current is set to 0.1 A to 15 A. In this case, the low melting point fusible alloy piece has a resistance value of 45 mΩ.
Or less, preferably 15 mΩ or less, particularly preferably 2 mΩ.
The following are used, for polishing the electrode surface,
Under the cross-sectional dimensions of the low melting point fusible alloy piece (diameter for round wire, thickness for ribbon) 50 to 800 µm, the resistance value passing through the lead conductor and electrode and the low melting point fusible alloy piece should be sufficient. 20mΩ or less for the low melting point fusible alloy piece of 45mΩ or less, and 15m for the low melting point fusible alloy piece.
20 mΩ or less for Ω or less, and 12 mΩ or less for resistance value of low melting point fusible alloy piece of 2 mΩ or less), and self-heating of low melting point fusible alloy piece is well prevented to lower the alloy type temperature fuse. It can be operated at a precise temperature controlled by the melting point of the fusible alloy piece. Further, it is possible to further reduce the thickness of the alloy-type temperature fuse by setting the cross-sectional dimension (diameter in the case of a round wire, thickness in the case of a ribbon) of the low melting point fusible alloy piece to 350 μm or less.

【0023】上記低融点可溶合金片には、固相線温度が
80℃〜120℃、固相線温度が80℃〜120℃であ
る合金、例えばIn30〜75重量%、Sn5〜50重
量%、Cd0.5〜25重量%の合金、更にこの合金組
成にAu、Ag、Cu、Al、Biのうちの1種または
2種以上を合計0.1〜5重量%添加した合金、Bi4
8〜53重量%、Pb28〜33重量%、Sn13〜1
9重量%の合金、In0.5〜4重量%、Bi50〜5
4重量%、Pb30〜34重量%、Sn14〜18重量
%の合金等を使用できる。
The low melting point fusible alloy piece contains an alloy having a solidus temperature of 80 ° C. to 120 ° C. and a solidus temperature of 80 ° C. to 120 ° C., for example, 30 to 75% by weight of In and 5 to 50% by weight of Sn. , Cd 0.5 to 25% by weight, and an alloy in which one or more of Au, Ag, Cu, Al and Bi are added to the alloy composition in a total amount of 0.1 to 5% by weight, Bi4
8 to 53% by weight, Pb 28 to 33% by weight, Sn 13 to 1
9% by weight of alloy, In 0.5-4% by weight, Bi 50-5
An alloy of 4% by weight, 30 to 34% by weight of Pb, and 14 to 18% by weight of Sn can be used.

【0024】上記低融点可溶合金片に塗布するフラック
スは、研磨した電極表面を無酸化状態に保持して溶融し
た低融点可溶合金片の電極への濡れを促しつつ球状化分
断を促進する作用を呈し、天然ロジン、変性ロジン(水
添ロジン、不均化ロジン、重合ロジン等)及びこれらの
精製ロジンにジエチルアミンの塩酸塩、ジエチルアミン
の臭化水素酸塩等を添加したものを使用できる。
The flux applied to the low melting point fusible alloy piece promotes spheroidization and separation while maintaining the polished electrode surface in a non-oxidized state to promote the wetting of the molten low melting point fusible alloy piece to the electrode. Natural rosin, modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, etc.) and those obtained by adding a hydrochloride of diethylamine, a hydrobromide of diethylamine, etc. to these purified rosins can be used.

【0025】上記絶縁板には、例えば、厚さ100μm
〜1000μmのアルミナセラミックス板や窒化アルミ
ニウム基板等のセラミックス板、ガラス板、ガラスエポ
キシ板、紙フェノ−ル板等を使用できる。また、未焼成
のセラミックスシ−ト(グリ−ンシ−ト)に導電ペ−ス
トを電極パタ−ンに印刷し、セラミックスシ−トと導電
ペ−スト電極パタ−ンとを加熱して一挙に焼成すること
もできる。
The insulating plate has a thickness of, for example, 100 μm
A ceramic plate such as an alumina ceramic plate or an aluminum nitride substrate of up to 1000 μm, a glass plate, a glass epoxy plate, a paper phenol plate and the like can be used. Further, a conductive paste is printed on an electrode pattern on an unfired ceramic sheet (green sheet), and the ceramic sheet and the conductive paste electrode pattern are heated at a time. It can also be fired.

【0026】上記の塗布タイプの封止用樹脂塗料には、
粘度50,000〜600,000cpsの硬化性樹脂
液を使用できる。例えば、ビスフェノ−ルAとエピクロ
ロヒドリンとから得られるビスフェノ−ル系エポキシ樹
脂、ノボラック形エポキシ樹脂、脂環式エポキシ樹脂、
多価アルコ−ル等にエピクロロヒドリンを反応させてエ
ポキシ基を導入したエポキシ樹脂等に硬化剤(ジアミ
ン、ポリアミン、ポリアミド、無水有機酸、ビニルフェ
ノ−ル等)を混合し、アルミナ、炭酸カルシウム等のフ
ィラ−を添加したものを使用できる。その外、不飽和ポ
リエステル、ジアリルフタレ−ト樹脂、シリコ−ン、ポ
リウレタンを硬化性樹脂とする硬化性樹脂液を使用する
こともできる。
The above-mentioned coating type sealing resin paints include:
A curable resin liquid having a viscosity of 50,000 to 600,000 cps can be used. For example, bisphenol-based epoxy resins obtained from bisphenol A and epichlorohydrin, novolak-type epoxy resins, alicyclic epoxy resins,
A curing agent (diamine, polyamine, polyamide, organic acid, vinylphenol, etc.) is mixed with an epoxy resin or the like in which an epoxy group is introduced by reacting polychloroalcohol with epichlorohydrin, and alumina, calcium carbonate, etc. And the like, to which a filler such as those described above can be added. In addition, a curable resin liquid containing an unsaturated polyester, diallyl phthalate resin, silicone, or polyurethane as a curable resin can also be used.

【0027】上記プラスチックフィルムには、厚み5μ
m〜260μm好ましくは160μm〜210μmの熱
可塑性樹脂フィルムを使用できる。例えば、ポリエチレ
ンテレフタレ−ト、ポリアミド、ポリイミド、ポリブチ
レンテレフタレ−ト、ポリフェニレンオキシド、ポリエ
チレンサルファイド、ポリサルホン等のエンジニアリン
グプラスチック、ホリアセタ−ル、ポリカ−ボネ−ト、
ポリフェニレンスルフィド、ポリオキシベンゾイル、ポ
リエ−テルエ−テルレトン、ポリエ−テルイミド等のエ
ンジニアリングプラスチックやポリ塩化ビニル、ポリ酢
酸ビニル、ポリメチルメタクリレ−ト、ポリ塩化ビニリ
デン、ポリテトラフルオロエチレン、エチレンポリテト
ラフルオロエチレン共重合体、エチレン酢酸ビニル共重
合体(EVA、AS樹脂、ABS樹脂、アイオノマ−、
AAS樹脂、ACS樹脂等)の中から選択される。
The plastic film has a thickness of 5 μm.
A thermoplastic resin film of m to 260 μm, preferably 160 μm to 210 μm can be used. For example, engineering plastics such as polyethylene terephthalate, polyamide, polyimide, polybutylene terephthalate, polyphenylene oxide, polyethylene sulfide, and polysulfone, holiacetal, polycarbonate,
Engineering plastics such as polyphenylene sulfide, polyoxybenzoyl, polyether terletone, polyetherimide, polyvinyl chloride, polyvinyl acetate, polymethyl methacrylate, polyvinylidene chloride, polytetrafluoroethylene, ethylene polytetrafluoroethylene Copolymer, ethylene vinyl acetate copolymer (EVA, AS resin, ABS resin, ionomer,
AAS resin, ACS resin, etc.).

【0028】上記実施例においては、リ−ド導体にニッ
ケルを使用しているがリ−ド導体の溶接接合される金属
面がステンレス、アルミまたは鉄の場合は、ステンレス
リ−ド導体、アルミリ−ド導体または鉄リ−ド導体が使
用される。これらのリ−ド導体の場合も、低融点可溶合
金片の接合時や機器への溶接接合時にリ−ド導体を安定
に保持してそれらの溶接を容易に行うことができるよう
に、またリ−ド導体を溶接上折り曲げても、その折り曲
げ部位でのクラック発生を排除して容易に溶接できるよ
うに厚みが設定され、例えばステンレスリ−ド導体の場
合、50μm〜300μmに設定される。
In the above embodiment, nickel is used for the lead conductor. However, when the metal surface of the lead conductor to be welded and joined is stainless steel, aluminum or iron, a stainless steel lead conductor or aluminum lead is used. Lead conductors or iron lead conductors are used. Also in the case of these lead conductors, the lead conductors are stably held at the time of joining the low melting point fusible alloy pieces or at the time of welding and joining to equipment, so that they can be easily welded. The thickness is set so that even if the lead conductor is bent by welding, cracks are not generated at the bent portion and welding can be easily performed. For example, in the case of a stainless steel lead conductor, the thickness is set to 50 μm to 300 μm.

【0029】上記何れの実施例においても、絶縁板に抵
抗体を取付け、温度以外の異常例えば二次電池過充電時
の電圧上昇を検知して抵抗体を通電発熱させ、この通電
発熱で低融点可溶合金片を溶断させること、すなわち異
常昇温とこれ以外の異常との双方で温度ヒュ−ズを作動
させることもできる。
In any of the above embodiments, a resistor is mounted on the insulating plate, and an abnormality other than temperature is detected, for example, a voltage rise during overcharge of the secondary battery is detected, and the resistor is energized to generate heat. The melting of the fusible alloy pieces, that is, the operation of the temperature fuse at both abnormal temperature rise and other abnormalities, can be performed.

【0030】上記何れの実施例に係る合金型温度ヒュ−
ズを製造するには、通常、導電ペ−ストの焼付け電極を
研磨したのち、リ−ド導体の接合及び低融点可溶合金片
の溶着を行うが、研磨前に導電ペ−ストの焼付け電極に
リ−ド導体を接合し、而るのち、電極表面を研磨し、該
研磨面に低融点可溶合金片を溶着することもできる。
The alloy type temperature hue according to any of the above embodiments.
In order to manufacture a conductor, usually, after the burned electrode of the conductive paste is polished, the lead conductor is joined and the low melting point fusible alloy piece is welded. Then, a lead conductor may be bonded to the electrode, and thereafter, the electrode surface may be polished, and a low melting point fusible alloy piece may be welded to the polished surface.

【0031】図4の(イ)は本発明に係る合金型温度ヒ
ュ−ズの他の別例を示す図面、図4の(ロ)は図4の
(イ)におけるロ−ロ断面図である。図4において、1
1はプラスチックベ−スフィルムである。3,3はニッ
ケル帯状リ−ド導体であり、先端部を銅箔(銅合金箔も
含まれる)のクラッドまたは銅めっきにより銅導体と
し、その先端部裏面をプラスチックベ−スフィルム11
の上面に熱プレスで融着してある。4は低融点可溶合金
片であり、リ−ド導体先端部の銅導体表面を研磨しその
研磨銅導体表面に低融点可溶合金片端を溶着してある。
5は低融点可溶合金片に塗布したフラックス、12はプ
ラスチックベ−スフィルム11の表面上に配したプラス
チックカバ−フィルムであり、プラスチックカバ−フィ
ルムの周辺のフィルム間及びプラスチックカバ−フィル
ムと帯状リ−ド導体との間を熱プレスや超音波融着或い
は接着剤等で封止してある。
FIG. 4 (A) is a drawing showing another example of the alloy type temperature fuse according to the present invention, and FIG. 4 (B) is a cross-sectional view of FIG. 4 (A). . In FIG. 4, 1
1 is a plastic base film. Reference numerals 3 and 3 denote nickel strip-shaped lead conductors, the tip of which is a copper conductor formed by cladding or copper plating of copper foil (including copper alloy foil), and the back of the tip is a plastic base film 11.
Is fused by a hot press. Reference numeral 4 denotes a low-melting-point fusible alloy piece in which the surface of the copper conductor at the tip of the lead conductor is polished and one end of the low-melting-point fusible alloy is welded to the polished copper conductor surface.
Reference numeral 5 denotes a flux applied to the low-melting-point fusible alloy piece, and 12 denotes a plastic cover film disposed on the surface of the plastic base film 11, between the films around the plastic cover film and between the plastic cover film and the strip. The space between the lead conductor and the lead conductor is sealed with a hot press, ultrasonic fusion, an adhesive or the like.

【0032】図5の(イ)は、本発明に係る温度ヒュ−
ズの上記とは別の例を示す図面、図5の(ロ)は図5の
(イ)におけるロ−ロ断面図であり、ニッケル帯状リ−
ド導体3,3の先端部を銅箔(銅合金箔も含まれる)の
クラッドまたは銅めっきにより銅導体とし、その先端部
を熱プレス等でプラスチックベ−スフィルム11にその
裏面側から表面側に表出させて融着し、次いで、これら
の帯状リ−ド導体先端部の表出部(銅面)31,31を
研磨し、その研磨銅導体面に低融点可溶合金片4を溶着
し、低融点可溶合金片4にフラックス5を塗布し、プラ
スチックカバ−フィルム12でフラックス塗布低融点可
溶合金片を封止してある。
FIG. 5A shows a temperature hue according to the present invention.
FIG. 5 (b) is a cross-sectional view taken along the line (b) of FIG.
The leading ends of the conductors 3 and 3 are made of copper conductors by cladding or copper plating of copper foil (including copper alloy foil), and the leading ends are placed on the plastic base film 11 by hot pressing or the like from the back side to the front side. Then, the exposed portions (copper surfaces) 31, 31 at the tips of these strip-shaped lead conductors are polished, and a low melting point fusible alloy piece 4 is welded to the polished copper conductor surfaces. Then, the flux 5 is applied to the low melting point fusible alloy piece 4 and the flux applied low melting point fusible alloy piece is sealed with the plastic cover film 12.

【0033】上記何れの実施例においても、研磨範囲は
低融点可溶合金片の被溶着箇所を完全に含む領域であ
る。また、ニッケル帯状リ−ド導体3,3の先端部を銀
めっきまたは金めっきにより銀導体または金導体とする
こともできる。
In any of the above embodiments, the polishing range is a region that completely includes the portion where the low melting point fusible alloy piece is to be welded. Further, the tip portions of the nickel strip-shaped lead conductors 3 and 3 may be silver or gold conductors by silver plating or gold plating.

【0034】図4及び図5に示す実施例においては、ニ
ッケルリ−ド導体の先端部表面をリ−ド導体の材質であ
るニッケルよりもはんだ付け性に優れた銅または銀また
は金導体にしてあるが、その先端部をプラスチックベ−
スフィルム11に融着する際の加熱で銅または銀または
金導体表面に形成される酸化膜や加熱によってプラスチ
ックベ−スフィルムから発生する気化物の附着を残存さ
せると、折角付与された良はんだつけ性が毀損されるこ
とになる。
In the embodiment shown in FIGS. 4 and 5, the tip surface of the nickel lead conductor is made of a copper, silver or gold conductor which is more excellent in solderability than nickel, which is a material of the lead conductor. However, the tip of the plastic base
If an oxide film formed on the surface of the copper, silver or gold conductor by the heating at the time of fusing to the base film 11 or the attachment of the vaporized substance generated from the plastic base film by the heating are left, a good solder having a good angle is provided. Wearability will be impaired.

【0035】しかしながら、本発明に係る合金型温度ヒ
ュ−ズにおいては、銅または銀または金導体表面を研磨
したうえでその研磨面に低融点可溶合金片端を溶着して
いるから、低融点可溶合金片の溶着界面の抵抗値を充分
に低くでき、また、溶着性の向上により界面溶着強度を
高くでき、低融点可溶合金片の断面積を安定に維持でき
る。従って、溶着部を含めた低融点可溶合金片の抵抗値
を充分に低くでき、定格電流値を大きく設定しても、低
融点可溶合金片の自己発熱を防止して所定の温度で適確
に作動させ得る。また、封止とフラックス塗布との二重
の酸化防止機構により、銅または銀または金導体の研磨
表面の後発的酸化をよく防止できるから、溶融した低融
点可溶合金の銅または銀導体表面への濡れをよく保証で
き、温度ヒュ−ズの作動時、溶融した低融点可溶合金が
溶融フラックスとの共存下で銅または銀または金導体表
面によく濡れて迅速に分断され得る。従って、図4や図
5に示す実施例において、定格電流値を高く設定して
も、低融点可溶合金片の自己発熱をよく抑えて低融点可
溶合金片の融点で規制された温度で適確に作動させるこ
とができる。
However, in the alloy type temperature fuse according to the present invention, the surface of the copper, silver or gold conductor is polished, and one end of the low melting point fusible alloy is welded to the polished surface. The resistance value of the weld interface of the molten alloy piece can be sufficiently reduced, the interfacial welding strength can be increased by improving the weldability, and the cross-sectional area of the low melting point fusible alloy piece can be stably maintained. Therefore, the resistance value of the low melting point fusible alloy piece including the welded portion can be sufficiently reduced, and even if the rated current value is set to a large value, self-heating of the low melting point fusible alloy piece is prevented and the appropriate temperature is maintained at a predetermined temperature. Can work reliably. In addition, due to the double oxidation prevention mechanism of sealing and flux application, the late oxidation of the polished surface of copper or silver or gold conductor can be well prevented, so that the molten low melting point fusible alloy copper or silver conductor surface Can be assured well, and when the temperature fuse is operated, the molten low melting point fusible alloy can wet the copper or silver or gold conductor surface in the coexistence with the molten flux and be quickly separated. Therefore, in the embodiment shown in FIGS. 4 and 5, even if the rated current value is set high, the self-heating of the low melting point fusible alloy piece is suppressed well, and the temperature is controlled by the melting point of the low melting point fusible alloy piece. It can be operated properly.

【0036】これらの実施例においても、低融点可溶合
金片やフラックスには前記実施例と同じものを使用でき
る。また、前記実施例と同様に、ニッケル帯状リ−ド導
体のビッカ−ス硬度を100〜280、厚みを50〜8
50μmにすることが好ましい。また、前記実施例と同
様に、二次電池の缶体に一方のリ−ド導体を溶接して使
用でき、リ−ド導体が溶接接合される金属面がステンレ
ス、アルミまたは鉄の場合は、ステンレスリ−ド導体、
アルミリ−ド導体または鉄リ−ド導体を使用できる。こ
れらのリ−ド導体の場合も、低融点可溶合金片の接合時
や機器への溶接接合時にリ−ド導体を安定に保持してそ
れらの溶接を容易に行うことができるように、またリ−
ド導体を溶接上折り曲げても、その折り曲げ部位でのク
ラック発生を排除して容易に溶接できるように厚みが設
定され、例えばステンレスリ−ド導体の場合、50μm
〜300μmに設定される。さらに、上記プラスチック
ベ−スフィルムやプラスチックカバ−フィルムには前記
実施例において使用したプラスチックフィルムを使用す
ることができる。
In these embodiments, the same low melting point fusible alloy pieces and fluxes as those in the above embodiments can be used. In the same manner as in the above embodiment, the nickel strip-shaped lead conductor has a Vickers hardness of 100 to 280 and a thickness of 50 to 8.
Preferably it is 50 μm. Further, similarly to the above embodiment, one of the lead conductors can be used by welding to the can body of the secondary battery, and when the metal surface to which the lead conductor is welded and joined is stainless steel, aluminum or iron, Stainless steel lead conductor,
An aluminum conductor or an iron lead conductor can be used. Also in the case of these lead conductors, the lead conductors are stably held at the time of joining the low melting point fusible alloy pieces or at the time of welding and joining to equipment, so that they can be easily welded. Lee
The thickness is set so that even if the lead conductor is bent by welding, cracks are not generated at the bent portion and welding can be easily performed. For example, in the case of a stainless steel lead conductor, 50 μm
300300 μm. Further, the plastic film used in the above embodiment can be used as the plastic base film or the plastic cover film.

【0037】[0037]

【実施例】〔実施例1〕図1に示す構成の合金型温度ヒ
ュ−ズであり、導電ペ−ストには銀ペ−ストで銀/バイ
ンダ−の重量比が100/20であり、銀粒体の平均粒
子径がほぼ10μm、バインダ−用粒体の平均粒子径が
ほぼ5μmのものを使用した。この導電ペ−ストをスク
リ−ンメツシュとスキ−ジを用いて厚み500μm×巾
5.0mm×長さ80mmのアルミナセラミックス板上
に電極形状に印刷し、さらに温度120℃×15分で乾
燥し、次いでピ−ク温度850℃×10分、60分サイ
クルで焼成し、その電極表面を砥石車で研磨し、各電極
にニッケル帯状リ−ド導体を抵抗溶接により接合し、更
に、電極間にに直径0.5mm、共晶点温度94℃の低
融点可溶合金線を溶接した。低融点可溶合金線を溶接し
たのちの電極間の抵抗値を測定したところ2mΩであっ
た。更に、低融点可溶合金線にフラックスを塗布し、エ
ポキシ樹脂で封止を行って本発明に係る合金型温度ヒュ
−ズを得た。この合金型温度ヒュ−ズにつき(試料数2
0箇)、2Aの電流を流しつつオイル浴に浸漬し、オイ
ルを加熱速度1℃/分で昇温したところ、オイル温度9
3℃(20個の平均値)で溶断作動した。
Embodiment 1 An alloy-type temperature fuse having the structure shown in FIG. 1 was used. The conductive paste had a silver paste with a silver / binder weight ratio of 100/20. Granules having an average particle diameter of about 10 μm and binder particles having an average particle diameter of about 5 μm were used. This conductive paste was printed in the form of an electrode on an alumina ceramic plate having a thickness of 500 μm, a width of 5.0 mm, and a length of 80 mm using a screen mesh and a squeegee, and further dried at a temperature of 120 ° C. for 15 minutes. Next, firing is performed at a peak temperature of 850 ° C. for 10 minutes and a cycle of 60 minutes, the electrode surface is polished with a grinding wheel, and a nickel strip lead conductor is joined to each electrode by resistance welding. A low melting point fusible alloy wire having a diameter of 0.5 mm and a eutectic point temperature of 94 ° C. was welded. The resistance value between the electrodes after welding the low melting point fusible alloy wire was 2 mΩ. Further, a flux was applied to the low melting point soluble alloy wire and sealed with an epoxy resin to obtain an alloy mold temperature fuse according to the present invention. This alloy type temperature fuse (number of samples 2
0), immersed in an oil bath while applying a current of 2 A, and heated the oil at a heating rate of 1 ° C./min.
The fusing operation was performed at 3 ° C. (average value of 20 pieces).

【0038】〔比較例1〕電極表面の研磨を省略した以
外、実施例1に同じとした。実施例1と同様に2A通電
下での溶断試験を行ったところ、オイル温度91.5℃
(20個の平均値)で溶断作動した。この溶断作動温度
は実施例1の場合に較べ1.5℃低く、低融点可溶合金
線の自己発熱による作動誤差が認められた。
Comparative Example 1 The procedure was the same as in Example 1 except that the polishing of the electrode surface was omitted. When a fusing test was conducted under a current of 2 A in the same manner as in Example 1, the oil temperature was 91.5 ° C.
(Average value of 20 pieces). The fusing operation temperature was 1.5 ° C. lower than that in Example 1, and an operation error due to self-heating of the low melting point fusible alloy wire was observed.

【0039】〔実施例2〕図5に示す構成であり、プラ
スチックベ−スフィルム及びプラスチックカバ−フィル
ムに厚み150μm、平面寸法5mm×11mmのポリ
エチレンテレフタレ−トフィルムを使用し、帯状リ−ド
導体には厚み100μm、ビッカ−ス硬度190(ビッ
カ−ス硬度は島津製作所製合金型温度ヒュ−ズMV−2
000で測定した)、巾3.5mm、長さ13mmのニ
ッケル帯状体の先端部に銅箔をクラッドしたものを使用
した。プラスチックベ−スフィルムに裏面より表面にリ
−ド導体の先端部を加熱プレスに現出させ、その現出銅
箔面を砥石車で研磨のうえ、直径0.3mm、共晶点温
度94℃の低融点可溶合金線を溶接した。低融点可溶合
金線を溶接したのちの現出銅箔面間の抵抗値を測定した
ところ10mΩであった。更に、低融点可溶合金線にフ
ラックスを塗布し、プラスチックカバ−フィルムの周辺
をヒ−トシ−ルにより封止して本発明に係る合金型温度
ヒュ−ズを得た。この合金型温度ヒュ−ズにつき(試料
数20箇)、3Aの電流を流しつつオイル浴に浸漬し、
オイルを加熱速度0.5℃/分で昇温したところ、オイ
ル温度93.4℃(20個の平均値)で溶断作動した。
[Embodiment 2] A belt-shaped lead conductor having the structure shown in FIG. 5 was formed by using a polyethylene terephthalate film having a thickness of 150 μm and a plane size of 5 mm × 11 mm for a plastic base film and a plastic cover film. Has a thickness of 100 μm and a Vickers hardness of 190 (Vickers hardness is an alloy type temperature fuse MV-2 manufactured by Shimadzu Corporation).
000), a nickel strip having a width of 3.5 mm and a length of 13 mm, which was clad with a copper foil at the tip. The leading end of the lead conductor is exposed to the plastic base film from the back surface to the front surface by a heating press, and the exposed copper foil surface is polished with a grinding wheel, then has a diameter of 0.3 mm and a eutectic point temperature of 94 ° C. Was welded. The resistance value between the exposed copper foil surfaces after welding the low melting point fusible alloy wire was 10 mΩ. Further, a flux was applied to the low melting point soluble alloy wire, and the periphery of the plastic cover film was sealed with a heat seal to obtain an alloy-type temperature fuse according to the present invention. The alloy type temperature fuse (20 samples) was immersed in an oil bath while applying a current of 3 A.
When the oil was heated at a heating rate of 0.5 ° C./min, the fusing operation was performed at an oil temperature of 93.4 ° C. (average value of 20 oils).

【0040】〔比較例2〕現出銅箔面の研磨を省略した
以外、実施例2に同じとした。実施例2と同様に2 通
電下での溶断試験を行ったところ、オイル温度91.1
℃(20個の平均値)で溶断作動した。この溶断作動温
度は実施例1の場合に較べ2.3℃低く、低融点可溶合
金線の自己発熱による作動誤差が認められた。
Comparative Example 2 The same operation as in Example 2 was carried out except that the polishing of the exposed copper foil surface was omitted. When a fusing test was conducted under the condition of 2 energization in the same manner as in Example 2, the oil temperature was 91.1.
The fusing operation was performed at ℃ (average value of 20 pieces). The fusing operation temperature was 2.3 ° C. lower than that in Example 1, and an operation error due to self-heating of the low melting point fusible alloy wire was recognized.

【0041】[0041]

【発明の効果】本発明に係る合金型温度ヒュ−ズは、二
次電池、特にリチウムイオン二次電池の異常昇温防止用
プロテクタ−として使用するにあたり、薄型・小型を施
用し、リ−ド導体を電池缶体との溶接性に優れた材質と
するにとどまらず、その二次電池の高いエネルギ−密度
にみあう高い定格電流のもとでも上記二次電池の異常昇
温防止を適確に行い得る構成としてあり、二次電池、特
にリチウムイオン二次電池の異常昇温防止に極めて有用
である。
The alloy type temperature fuse according to the present invention is used as a protector for preventing abnormal rise in temperature of a secondary battery, especially a lithium ion secondary battery, and has a thin and small size. Not only is the conductor made of a material with excellent weldability to the battery can, but it is also possible to prevent abnormal temperature rise of the above secondary battery even at a high rated current that meets the high energy density of the secondary battery. This is extremely useful for preventing abnormal temperature rise of a secondary battery, particularly a lithium ion secondary battery.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る合金型温度ヒュ−ズの一実施例を
示す図面である。
FIG. 1 is a view showing an embodiment of an alloy-type temperature fuse according to the present invention.

【図2】本発明に係る合金型温度ヒュ−ズの上記とは異
なる実施例を示す図面である。
FIG. 2 is a view showing another embodiment of the alloy type temperature fuse according to the present invention.

【図3】図2に示す合金型温度ヒュ−ズの使用状態の一
例を示す図面である。
FIG. 3 is a view showing an example of a use state of the alloy-type temperature fuse shown in FIG. 2;

【図4】本発明に係る合金型温度ヒュ−ズの上記とは異
なる実施例を示す図面である。
FIG. 4 is a view showing another embodiment of the alloy type temperature fuse according to the present invention.

【図5】本発明に係る合金型温度ヒュ−ズの上記とは異
なる実施例を示す図面である。
FIG. 5 is a view showing another embodiment of the alloy type temperature fuse according to the present invention.

【図6】異なる従来例を示す図面である。FIG. 6 is a drawing showing a different conventional example.

【符号の説明】[Explanation of symbols]

1 絶縁板 11 プラスチックベ−スフィルム 2 導電ペ−スト焼付け電極 3 ニツケルリ−ド導体 4 低融点可溶合金片 5 フラックス 6 樹脂層 12 プラスチックカバ−フィルム DESCRIPTION OF SYMBOLS 1 Insulating plate 11 Plastic base film 2 Conductive paste baking electrode 3 Nickel lead conductor 4 Low melting point fusible alloy piece 5 Flux 6 Resin layer 12 Plastic cover film

───────────────────────────────────────────────────── フロントページの続き (72)発明者 川西 俊朗 大阪市中央区島之内1丁目11番28号 内橋 エステック株式会社内 Fターム(参考) 5G502 AA02 BA03 BB10 BB13 BC02 BC08 CC01 FF08 5H022 AA09 BB11 CC09 CC12 EE03 EE04 KK01  ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiro Kawanishi 1-11-28 Shimanouchi, Chuo-ku, Osaka-shi Uchibashi S-Tech Co., Ltd. F-term (reference) 5G502 AA02 BA03 BB10 BB13 BC02 BC08 CC01 FF08 5H022 AA09 BB11 CC09 CC12 EE03 EE04 KK01

Claims (14)

【特許請求の範囲】[Claims] 【請求項1】金属粒体を導電性成分とする導電ペ−スト
の焼付けにより形成された対向電極を有し、各電極にリ
−ド導体が接合され、両電極間に低融点可溶合金片が接
続され、低融点可溶合金片にフラックスが塗布され、フ
ラックス塗布低融点可溶合金片が封止されてなる温度ヒ
ュ−ズであり、電極表面が研磨されその研磨面に低融点
可溶合金片端が溶着され、リ−ド導体がニッケル導体と
されていることを特徴とする合金型温度ヒュ−ズ。
1. An electrode having a counter electrode formed by baking a conductive paste containing metal particles as a conductive component, a lead conductor is joined to each electrode, and a low melting point fusible alloy is provided between both electrodes. Is a temperature fuse in which the flux is applied to the low melting point fusible alloy piece and the flux coated low melting point fusible alloy piece is sealed.The electrode surface is polished and the polished surface has a low melting point. An alloy-type temperature fuse, wherein one end of a molten alloy is welded and a lead conductor is a nickel conductor.
【請求項2】金属粒体を導電性成分とする導電ペ−スト
の焼付けにより絶縁基板に対向電極が設けられ、各電極
にリ−ド導体が接合され、両電極間に低融点可溶合金片
が接続され、低融点可溶合金片にフラックスが塗布さ
れ、フラックス塗布低融点可溶合金片が封止されてなる
温度ヒュ−ズであり、電極表面が研磨されその研磨面に
低融点可溶合金片端が溶着され、リ−ド導体がニッケル
導体とされていることを特徴とする合金型温度ヒュ−
ズ。
2. An opposite electrode is provided on an insulating substrate by baking a conductive paste containing metal particles as a conductive component, a lead conductor is joined to each electrode, and a low melting point fusible alloy is provided between both electrodes. Is a temperature fuse in which the flux is applied to the low melting point fusible alloy piece and the flux coated low melting point fusible alloy piece is sealed.The electrode surface is polished and the polished surface has a low melting point. An alloy-type temperature hue characterized in that one end of a molten alloy is welded and a lead conductor is a nickel conductor.
Z.
【請求項3】フラックス塗布低融点可溶合金片の封止
が、絶縁基板を包囲するプラスチックフィルムにより行
われている請求項2記載の合金型温度ヒュ−ズ。
3. The alloy-type temperature fuse according to claim 2, wherein the sealing of the flux-coated low-melting-point fusible alloy piece is performed by a plastic film surrounding the insulating substrate.
【請求項4】電極の研磨表面における金属粒体の占める
割合が80%以上である請求項1〜3何れか記載の合金
型温度ヒュ−ズ。
4. The alloy-type temperature fuse according to claim 1, wherein the proportion of the metal particles on the polished surface of the electrode is 80% or more.
【請求項5】ニッケルリ−ド導体が帯状であり、そのビ
ッカ−ス硬度が100〜280、厚みが50〜850μ
mである請求項1〜4何れか記載の合金型温度ヒュ−
ズ。
5. The nickel lead conductor is in the form of a strip, and has a Vickers hardness of 100 to 280 and a thickness of 50 to 850 μm.
5. The alloy mold temperature hue according to claim 1, wherein
Z.
【請求項6】定格電流値が0.1A〜15Aである請求
項1〜5何れか記載の合金型温度ヒュ−ズ。
6. The alloy type temperature fuse according to claim 1, wherein the rated current value is 0.1 A to 15 A.
【請求項7】リ−ド導体が電池の缶体に溶接される請求
項1〜6何れか記載の合金型温度ヒュ−ズ。
7. An alloy-type temperature fuse according to claim 1, wherein the lead conductor is welded to a battery can.
【請求項8】ニッケルリ−ド導体に代え、ステンレスリ
−ド導体、アルミリ−ド導体または鉄リ−ド導体の何れ
かが使用されている請求項1〜7何れか記載の合金型温
度ヒュ−ズ。
8. The alloy type temperature hue according to claim 1, wherein any one of a stainless steel lead conductor, an aluminum lead conductor and an iron lead conductor is used in place of the nickel lead conductor. Z.
【請求項9】一対の帯状リ−ド導体の先端部がプラスチ
ックベ−スフィルムの裏面より表面に水密に現出され、
かつリ−ド導体とプラスチックベ−スフィルムとの間が
融着され、現出導体間に低融点可溶合金片が接続され、
低融点可溶合金片にフラックスが塗布され、フラックス
塗布低融点可溶合金片が封止されてなる温度ヒュ−ズで
あり、帯状リ−ド導体が先端部表面が銅または銀または
金導体とされたニッケル導体であり、その銅または銀ま
たは金導体表面が研磨され該研磨面に低融点可溶合金片
端が溶着されていることを特徴とする合金型温度ヒュ−
ズ。
9. The front ends of a pair of strip-shaped lead conductors are exposed from the back surface of the plastic base film to the front surface in a watertight manner.
And the lead conductor and the plastic base film are fused, a low melting point fusible alloy piece is connected between the exposed conductors,
This is a temperature fuse in which flux is applied to the low melting point fusible alloy piece and the flux coated low melting point fusible alloy piece is sealed. Characterized in that the surface of the copper, silver or gold conductor is polished and one end of a low melting point fusible alloy is welded to the polished surface.
Z.
【請求項10】一対の帯状リ−ド導体の先端部がプラス
チックベ−スフィルムの表面に融着され、その先端部間
に低融点可溶合金片が接続され、低融点可溶合金片にフ
ラックスが塗布され、フラックス塗布低融点可溶合金片
が封止されてなる温度ヒュ−ズであり、帯状リ−ド導体
が先端部表面が銅または銀または金導体とされたニッケ
ル導体であり、その銅または銀または金導体表面が研磨
され該研磨面に低融点可溶合金片端が溶着されているこ
とを特徴とする合金型温度ヒュ−ズ。
10. A tip of a pair of strip-shaped lead conductors is fused to the surface of a plastic base film, and a low melting point fusible alloy piece is connected between the tip ends. A temperature fuse in which a flux is applied and the flux-applied low-melting-point fusible alloy piece is sealed, and the strip-shaped lead conductor is a nickel conductor having a distal end surface made of copper or silver or gold conductor; An alloy-type temperature fuse characterized in that the surface of the copper, silver or gold conductor is polished and one end of a low melting point fusible alloy is welded to the polished surface.
【請求項11】ニッケル帯状リ−ド導体のビッカ−ス硬
度が100〜280、厚みが50〜850μmである請
求項9または10記載の合金型温度ヒュ−ズ。
11. The alloy-type temperature fuse according to claim 9, wherein the nickel strip-shaped lead conductor has a Vickers hardness of 100 to 280 and a thickness of 50 to 850 μm.
【請求項12】定格電流値が0.1A〜15Aである請
求項9〜11何れか記載の合金型温度ヒュ−ズ。
12. The alloy-type temperature fuse according to claim 9, wherein a rated current value is 0.1 A to 15 A.
【請求項13】帯状リ−ド導体が電池の缶体に溶接され
る請求項9〜12何れか記載の合金型温度ヒュ−ズ。
13. An alloy-type temperature fuse according to claim 9, wherein the strip-shaped lead conductor is welded to a battery can.
【請求項14】ニッケル帯状リ−ド導体に代え、ステン
レス帯状リ−ド導体、アルミ帯状リ−ド導体または鉄帯
状リ−ド導体の何れかが使用されている請求項9〜13
何れか記載の合金型温度ヒュ−ズ。
14. A stainless steel strip lead, an aluminum strip lead, or an iron strip lead is used in place of the nickel strip lead.
The alloy type temperature fuse according to any of the above.
JP16006099A 1999-06-07 1999-06-07 Alloy type temperature fuse Expired - Fee Related JP4209549B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16006099A JP4209549B2 (en) 1999-06-07 1999-06-07 Alloy type temperature fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16006099A JP4209549B2 (en) 1999-06-07 1999-06-07 Alloy type temperature fuse

Publications (2)

Publication Number Publication Date
JP2000348583A true JP2000348583A (en) 2000-12-15
JP4209549B2 JP4209549B2 (en) 2009-01-14

Family

ID=15707046

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Publication number Priority date Publication date Assignee Title
WO2002067282A1 (en) * 2001-02-20 2002-08-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse
JP2003045306A (en) * 2001-07-30 2003-02-14 Uchihashi Estec Co Ltd Thin fuse
KR100420146B1 (en) * 2001-10-18 2004-03-02 삼성에스디아이 주식회사 Secondary battery mounting thermal protector
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067282A1 (en) * 2001-02-20 2002-08-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse
US7068141B2 (en) 2001-02-20 2006-06-27 Matsushita Electric Industrial Co., Ltd. Thermal fuse
JP2003045306A (en) * 2001-07-30 2003-02-14 Uchihashi Estec Co Ltd Thin fuse
JP4610807B2 (en) * 2001-07-30 2011-01-12 内橋エステック株式会社 Thin fuse
KR100420146B1 (en) * 2001-10-18 2004-03-02 삼성에스디아이 주식회사 Secondary battery mounting thermal protector
JP2015002030A (en) * 2013-06-13 2015-01-05 デクセリアルズ株式会社 Protection element, mounting body mounting protection element
WO2014199911A1 (en) * 2013-06-13 2014-12-18 デクセリアルズ株式会社 Protection element and package in which protection element is mounted
CN105324829A (en) * 2013-06-13 2016-02-10 迪睿合株式会社 Protection element and package in which protection element is mounted
KR20160019086A (en) * 2013-06-13 2016-02-18 데쿠세리아루즈 가부시키가이샤 Protection element and package in which protection element is mounted
TWI629701B (en) * 2013-06-13 2018-07-11 迪睿合股份有限公司 Protective element and structure body with protective element
KR102217413B1 (en) * 2013-06-13 2021-02-18 데쿠세리아루즈 가부시키가이샤 Protection element and package in which protection element is mounted
WO2021210536A1 (en) * 2020-04-13 2021-10-21 ショット日本株式会社 Protective element
JP2021168272A (en) * 2020-04-13 2021-10-21 ショット日本株式会社 Protection element
JP7349954B2 (en) 2020-04-13 2023-09-25 ショット日本株式会社 protection element

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