JP2000343143A - Device and method of manufacturing metallic base plate for circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a circuit pattern base plate of large thickness by pressing an upper stage set being arranged oppositely to a bottom stage set, on which a lead frame is to be mounted, for moving it in the bottom stage direction and by pressure fastening the lead frame so as to cut its unnecessary portion. SOLUTION: A bottom stage 4 is moved from a position directly below the upper stage 2 and a working element is mounted on the bottom stage 4 with an usage of position matching pins 6. The working element is absorbed from a vacuum absorption hole 5 of a bottom cutting blade 3 and is fastened. The bottom stage 4 is moved to a position directly below the upper stage with a rail 11 for pressing and fastening the working element on the bottom cutting blade 3 by lowering the upper stage 2. An upper cutting blade 1 of the upper stage 4 is further lowered for engaging with the bottom cutting blade 3 so that the working element on the bottom cutting blade 3 and the working element on the bottom stage 4 are cut/separated. The bottom stage 4 is pulled out by rising the upper stage 2 so that the necessary circuit pattern alone is left remained on the bottom cutting blade 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic devices such as semiconductor devices.
The present invention relates to an apparatus for manufacturing a circuit metal substrate used by mounting electric components, and a method for manufacturing a circuit metal substrate using the apparatus.

[0002]

2. Description of the Related Art In electronic devices such as inverters, converters, and servos, in consideration of the high heat generation of power semiconductor elements such as diodes, transistors, IGBTs, and MOSFETs that are usually mounted, a high heat conductive insulating material is provided on a metal plate. Generally, a metal substrate provided with a layer is used as a circuit substrate. The material of the insulating layer is selected according to the heat value of the mounted component. Alumina ceramics, aluminum nitride ceramics, and the like are mainly used as insulating layers in large- and medium-capacity products having a large calorific value. However, those with small capacities generally use a resin insulating layer.

A circuit metal substrate using a resin insulating layer is usually manufactured by the following apparatus and method. Apply a liquid high thermal conductive resin, which is highly filled with an inorganic filler, to a metal plate with a screen printing device, or apply a film-like high thermal conductive resin with a heating / pressing device or roller device. A foil is placed on the resin layer, and these are integrated using a heating / pressing press device or a roller device to obtain a metal plate / high heat conductive resin layer / conductive metal foil laminated structure. Then, a resist film having a predetermined pattern is formed on the conductive metal foil by using a photoresist coating device, a photoresist exposure device, a developing device, and the like, and a circuit metal substrate having a predetermined circuit pattern is obtained by using etching equipment. Can be

In a circuit metal substrate manufactured by the above-described method, a circuit pattern is formed by etching. Therefore, the thickness of the circuit pattern is generally about 100 μm. For this reason, when mounting a power semiconductor element such as a diode, a transistor, an IGBT, or a MOSFET on the circuit metal substrate, in many cases, the heat generated by the element is effectively dissipated. And a heat diffusion plate made of copper, molybdenum, or the like.

The elimination of the heat diffusion plate has a great effect on cost reduction since the number of steps and the number of parts are reduced. For this purpose, it is effective to make the thickness of the circuit pattern of the circuit metal substrate thicker than about 0.5 mm. However, there has been a great difficulty in increasing the thickness of the circuit pattern by the above etching in practical terms.

On the other hand, as an effective means for increasing the thickness of a circuit pattern without relying on etching of a metal foil, Japanese Unexamined Patent Publication No.
Japanese Patent Application Laid-Open No. 29822/1998 and Japanese Patent Application Laid-Open No. H10-125826 use a lead frame having a thick film as a circuit pattern.
FIG. 8 shows an example of a semiconductor device manufacturing process according to this method. The lead frame is placed on the adhesive insulating layer formed on the aluminum plate, and the lead frame and the aluminum plate are integrated by the heat and pressure treatment via the insulating layer to obtain a circuit metal substrate (1). . Then, various components are mounted on a lead frame (2), and a resin-encapsulated semiconductor device is obtained by transfer molding (3).

[0007]

In a semiconductor device using the above-mentioned lead frame, since the resin sealing is performed by transfer molding, the lead frame is fixed by sandwiching the lead frame between upper and lower dies. It has a structure protruding from the side. With this structure, in some cases, a sufficient insulation distance between the metal plate forming the bottom of the semiconductor device and the lead frame may not be secured.

The use of a lead frame facilitates the formation of a thick-film circuit pattern and is an effective method for improving the heat dissipation of a mounted element. However, the use of a lead frame is limited to a structure peculiar to the mold sealing method. Instead, it was formed by the conventional etching method.
If the peripheral insulating layer on the metal plate can be applied to the circuit pattern of the circuit metal substrate where the entire back surface of the circuit pattern is adhered to the insulating layer on the metal plate while leaving the predetermined width as it is,
A versatile metal substrate for a high heat conductive circuit which is not limited to the resin sealing method can be realized.

A major problem in realizing a circuit metal substrate having such a structure using a lead frame is to cut and remove a peripheral portion of the lead frame for supporting and fixing a plurality of circuit patterns. Apparatus and method. When a lead frame is bonded to an insulating layer of about 100 μm on a metal substrate and then cut, the impact at this time tends to cause defects such as cracks in the insulating layer, which is the reliability of insulation of the circuit metal substrate itself. Will have an adverse effect. To avoid this problem, it is necessary to cut the lead frame away from the insulating layer. In this case, since the plurality of circuit patterns become independent at the same time as the cutting, the realization of an apparatus and a method capable of cutting while maintaining these plural patterns in a predetermined arrangement after the cutting (after cutting) is large. Will be an issue.

An object of the present invention is to provide a circuit metal substrate having a circuit pattern with a large thickness, which retains the structural characteristics of a circuit metal substrate formed by a conventional etching method. And a method of manufacturing a circuit metal substrate using the apparatus.

[0011]

A first aspect of the present invention.
The circuit metal substrate manufacturing apparatus according to the lower stage set on which a lead frame having a predetermined pattern is mounted,
An upper stage set is provided opposite to the lower stage set. The upper stage set is pressurized and moved in the lower stage setting direction, and the lead frame is fixed by crimping. The portion can be cut, and is characterized by the following (a) to (e). (A) The upper stage set
An upper stage set comprising a central upper stage and an upper cutting blade disposed around the upper stage as main components, wherein the upper cutting blade is slidably mounted around the upper stage; ( b) The lower stage set mainly includes a lower cutting edge at a central portion and a lower stage disposed around the lower cutting edge, and the lower stage is slidably mounted around the lower cutting edge. (C) a plurality of vacuum suction holes arranged in a predetermined portion of the lower cutting blade so that a predetermined pattern portion of the lead frame placed on the lower cutting blade can be suctioned by vacuum; )
A positioning pin provided on the lower stage for positioning the lower stage and the lower cutting blade on the mounting object; (e) moving the upper stage set in the lower stage setting direction;
(D) a positioning pin escape hole provided in the upper cutting blade for releasing the positioning pin.

According to a second aspect of the present invention, there is provided an apparatus for manufacturing a metal substrate for a circuit according to the first aspect of the present invention, in which the following change is made. That is, claim 1
In place of the vacuum suction hole described in (c), the lower cutting blade and the lower stage upper surface are engraved in a predetermined pattern less than the thickness of the lead frame mounted on this surface,
The lower cutting blade and the lead frame placed on the upper surface of the lower stage are supported by being dropped into the engraved portion.

According to a third aspect of the present invention, there is provided an apparatus for manufacturing a metal substrate for a circuit according to the present invention, in which the following change is made to the apparatus for manufacturing a metal substrate for a circuit according to the first aspect. That is, claim 1
Instead of the vacuum suction hole described in (c), an adhesive resin layer is formed on the upper surface of the lower cutting blade, and the lead frame placed on this surface is supported by being adhered to the adhesive resin layer. Features.

According to a fourth aspect of the present invention, there is provided an apparatus for manufacturing a metal substrate for a circuit according to the first aspect of the present invention, in which the following change is made. That is, the configuration of the upper stage set and the lower stage set has a configuration opposite to the configuration of the first aspect. That is, the upper stage set is mainly composed of an upper cutting blade having a vacuum suction hole at the center and an upper stage having an alignment pin relief hole slidably mounted around the upper cutting blade. The lower stage set is characterized by comprising a lower part of a central part and a lower cutting blade having an alignment pin slidably mounted around the lower stage as main parts.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a metal substrate for a circuit, comprising the following steps (a) to (d). (A) Lead frame punching step: A region having a predetermined pattern used as a circuit pattern of a lead frame is supported and fixed, and a portion having a plurality of positioning holes is pressure-fixed to each of the circuit patterns and vacuum suction. Alternatively, while supporting and fixing by dropping into the engraved part, cut with the upper and lower cutting blades,
(B) transferring the circuit pattern of the lead frame onto the metal plate provided with the adhesive insulating layer / metal having a plurality of alignment holes After applying an insulating resin to the board or bonding the insulating resin film, and then applying a liquid adhesive resin on the resin, a metal plate with an adhesive insulating layer, or applying or bonding an adhesive insulating resin to the metal plate After preparing a metal plate with an adhesive insulating layer to which a conductive insulating resin film is adhered, the above-mentioned metal plate with an adhesive insulating layer is left uncut in (a) by alignment using the alignment holes of the metal plate. On the pattern, the adhesive insulating layer is placed so as to cover the adhesive insulating layer, and the circuit pattern is transferred onto the adhesive insulating layer, or by positioning using the positioning holes of the metal plate, (C) transferring the circuit pattern onto the adhesive insulating layer by dropping the circuit pattern left uncut in (a) on the adhesive insulating layer on the metal plate with the adhesive insulating layer disposed thereon; An organic printed circuit board disposing step / a step of placing an organic printed circuit board on the exposed adhesive insulating layer formed in (b) by positioning using the positioning holes of the metal plate. If it is not necessary to mount the organic printed circuit board, the present step is skipped and the step (b) is shifted to the next step (d); By subjecting the fabricated metal plate with the adhesive insulating layer on which the circuit pattern and the organic printed circuit board are placed to heat and pressure,
A step of completing the adhesive fixation of the article.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a circuit metal substrate, comprising the following steps (a) to (d). (A) Lead frame punching step / A region used as a circuit pattern of a lead frame having a predetermined pattern is supported and fixed, and a portion having a plurality of alignment holes is pressure-fixed to each of the above circuit patterns, and is adhered. A step of cutting with an upper and lower cutting blade while supporting and fixing by sticking or temporarily adhering with a resin, and leaving a region used as a circuit pattern while retaining the arrangement of each pattern; (b) on a metal plate with an adhesive insulating layer Of transferring the circuit pattern of the lead frame to the metal plate / Applying an insulating resin to a metal plate having a plurality of positioning holes or bonding an insulating resin film, and then applying a liquid adhesive resin on the resin A metal plate with an adhesive insulating layer, or a metal plate with an adhesive insulating layer, in which an adhesive insulating resin is applied to the metal plate or an adhesive insulating resin film is adhered. After that, the metal plate with the adhesive insulating layer is arranged so as to cover the circuit pattern left uncut in (a) with the adhesive insulating layer facing down by alignment using the alignment holes of the metal plate. (C) forming the circuit pattern on the adhesive insulating layer; (c) forming an alignment hole of the metal plate on the exposed adhesive insulating layer formed in the organic printed circuit board arranging step / (b). A step of placing an organic printed circuit board by the used alignment. If it is not necessary to mount the organic printed circuit board, the present step is skipped and the step (b) is shifted to the next step (d);
A step of applying heat and pressure to the metal plate provided with the adhesive insulating layer on which the circuit pattern and the organic printed circuit board are mounted, which is produced in the above step, to complete the adhesion and fixing of the above-mentioned article.

Another feature of the present invention is that it comprises a lower stage set on which a lead frame having a predetermined pattern is placed, and an upper stage set arranged opposite to the lower stage set. There is provided an apparatus for manufacturing a metal substrate for a circuit having a fixing device for applying a pressure to move in the lower stage setting direction and vacuum-sucking the lead frame.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The contents of the present invention will be described in more detail with reference to examples.

Embodiment 1 <1-1. Configuration of Circuit Metal Board Manufacturing Apparatus> The configuration of an embodiment of a circuit metal board manufacturing apparatus according to the present invention will be described with reference to FIG.

The upper stage set of this apparatus is composed of an upper cutting blade 1
And the upper stage 2 as a main component. The upper cutting blade 1 is provided so as to be able to slide around the upper stage 2.

The upper stage set can be moved up and down by a press drive source 9 via a press cylinder 8.

The lower stage set includes the lower cutting blade 3 and the lower stage 4 as main components. The lower stage 4 is provided so as to be able to slide around the lower cutting edge 3. A workpiece such as a lead frame is placed on the upper surface of the lower stage set. A positioning pin 6 is provided on the upper surface of the lower stage 4 for positioning the mounted article. Further, the lower cutting edge 3 is provided with a vacuum suction hole 5 for supporting and fixing the workpiece.

When the upper stage set is moved in the direction of the lower stage set, the upper cutting blade is provided with a positioning pin escape hole 7 in order to allow the positioning pin 6 to escape.

The lower stage set is movable on the rail 11 in the horizontal direction. When the lower stage set is moved in the lateral direction, the vacuum suction of the vacuum suction hole 5 of the lower cutting blade 3 can be continuously performed.

<1-2. Operation of Circuit Metal Substrate Manufacturing Apparatus> The operation of one embodiment of the circuit metal substrate manufacturing apparatus according to the present invention will be described with reference to FIG.

(1) Lead frame set; Workpiece (lead frame in the figure) with the lower stage set moved to a position removed from immediately below the upper stage set
Is placed on the upper surface of the lower stage set while performing positioning using the positioning pins 6. Then, the vacuum suction of the vacuum suction hole 5 of the lower cutting edge 3 is operated to fix the mounted lead frame by vacuum suction. As shown in the drawing, the vacuum suction holes are arranged so that each pattern of the lead frame is effectively suctioned by vacuum. The vacuum suction operation is continued during the operation of the present apparatus described below.

(2) Lower stage set movement: The lower stage set is moved on the rail 11 immediately below the upper stage set while the lead frame is being vacuum-sucked.

(3) Lead frame press fixing: The upper stage set is moved in the lower stage setting direction, and the upper stage presses and fixes the lead frame on the lower cutting blade 3. At this time, the positioning pin 6 of the lower stage escapes into the positioning pin escape hole 7 of the upper cutting blade 1.

(4) Lead frame punching: The upper cutting edge 1 of the upper stage set is further lowered, and the lead mounted on the lower cutting edge 3 is engaged with the lower cutting edge 3 on which the lead frame is mounted. Frame part and lower stage 4
The lead frame portion placed on top is cut and separated.

(5) Press release: The upper stage set is moved upward. Each pattern of the lead frame is formed into a plurality of pieces by cutting the lead frame, and each piece holds a position before cutting by vacuum suction.

(6) Movement of lower stage set / removal of unnecessary part of lead frame;
Move to the position of (1). Although the lead frame pattern on the lower cutting blade 3 is fixed by vacuum suction, the lead frame portion on the lower stage 4 is not fixed by vacuum suction and can be easily removed. Thus, only the necessary lead frame circuit pattern can be left on the lower cutting edge 3.

According to the apparatus for manufacturing a metal substrate for a circuit of this embodiment, it is possible to punch out and take out only a circuit pattern required for a thick lead frame while maintaining a required pattern arrangement. A thick circuit pattern having excellent heat dissipation was formed. [Embodiment 2] The configuration of another embodiment of a circuit metal substrate manufacturing apparatus according to the present invention will be described with reference to FIG.

In the apparatus for manufacturing a metal substrate for a circuit according to the present embodiment, the lead frame falls on the upper surfaces of the lower cutting edge 3 and the lower stage 4 instead of the vacuum suction holes 5 provided in the lower cutting edge 3 of the first embodiment. The engraved portion 12 having a thickness smaller than the thickness of the lead frame to be mounted is provided in a predetermined shape so as to be fixed by the above.

The operation of this apparatus is the same as that of the first embodiment except that the fixing of the lead frame is performed by dropping into the engraved portion instead of vacuum suction, so that the detailed description is omitted.

According to the apparatus for manufacturing a metal substrate for a circuit of this embodiment, it is possible to punch out and take out only the circuit pattern required for a thick lead frame while maintaining the required pattern arrangement. Further, since the circuit pattern is supported and fixed by dropping it into the engraved portion, it is possible to prevent the occurrence of positional displacement of the punched circuit pattern at the time of punching the lead frame.

[Embodiment 3] Another embodiment of the apparatus for manufacturing a metal substrate for circuit according to the present invention will be described with reference to FIG.

In the apparatus for manufacturing a metal substrate for a circuit according to this embodiment, an adhesive resin layer 13 is formed on the upper surface of the lower cutting edge 3 instead of the vacuum suction hole 5 provided in the lower cutting edge 3 of the first embodiment. The lead frame is fixed to the lower cutting edge 3 by sticking to the lead frame placed on this surface.

The adhesive fixation by the adhesive resin layer 13 is required at a predetermined step such as punching of a lead frame and transfer of a punched circuit pattern. After these steps, the mounted article is easily peeled off. It must be able to be taken out. Any resin that satisfies these conditions can be used as a resin for forming the adhesive resin layer 13. For example, a silicone resin or a thermoplastic elastomer resin can be used, but the present invention is not limited to these resins.

The operation of this apparatus is the same as that of the first embodiment, except that the fixing of the lead frame is performed by using an adhesive resin layer instead of vacuum suction, and therefore detailed description is omitted.

According to the apparatus for manufacturing a circuit metal substrate of this embodiment, it is possible to punch out and take out only a circuit pattern required for a thick lead frame while maintaining a required pattern arrangement. Further, the present invention can be applied to punching a circuit pattern having a different shape without changing the apparatus itself.

[Embodiment 4] <4-1. Configuration of Circuit Metal Board Manufacturing Apparatus> FIG. 5 shows a configuration of another embodiment of a circuit metal board manufacturing apparatus according to the present invention.
This will be described using (1).

The apparatus for manufacturing a metal substrate for a circuit according to the present invention comprises:
The configuration of the upper stage set and the lower stage set is reversed as compared with the device configuration of the first embodiment.
That is, the upper stage set is mainly composed of an upper cutting edge 1 having a central vacuum suction hole 5 and an upper stage 2 having an alignment pin escape hole 7 slidably mounted around the upper cutting edge 1. . The lower stage set mainly includes a lower cutting edge 3 having a central lower stage 4 and an alignment pin 6 slidably mounted around the lower stage 4.

The other structure is basically the same as that of the first embodiment.

<4-2. Operation of Circuit Metal Substrate Manufacturing Apparatus> The operation of the circuit metal substrate manufacturing apparatus according to the present invention is shown in FIG.
This will be described with reference to FIG.

(1) Lead frame set; Workpiece (lead frame in the figure) with the lower stage set moved to a position removed from immediately below the upper stage set
Is placed on the upper surface of the lower stage set while performing positioning using the positioning pins 6.

(2) Lower stage set movement: The lower stage set is moved on the rail 11 immediately below the upper stage set.

(3) Lead frame press fixing: The upper stage set is moved in the lower stage setting direction, and the upper cutting blade 1 presses and fixes the lead frame on the lower stage 4. At this time, the positioning pin 6 of the lower cutting blade 3 escapes into the positioning pin escape hole 7 of the upper stage 2.
Then, the vacuum suction of the vacuum suction hole 5 of the upper cutting blade 1 is operated, and the held lead frame is fixed by vacuum suction. The vacuum suction operation is continued during the operation of the present apparatus described below.

(4) Lead frame punching: The upper cutting edge 1 of the upper stage set is further lowered, and the lead frame mounted on the lower stage 4 is engaged with the lower cutting edge 3 on which the lead frame is mounted. Part and lower cutting edge 3
The lead frame portion placed on top is cut and separated.

(5) Press release: The upper stage set is moved upward. Since each pattern of the lead frame becomes a plurality of pieces by cutting the lead frame, these pieces stick to the upper cutting blade 1 by vacuum suction and move upward while maintaining the arrangement before cutting.

(6) Movement of lower stage set / removal of unnecessary part of lead frame;
Move to the position of (1). Since the lead frame portion left on the lower cutting blade 3 is not fixed by vacuum suction, it can be easily removed. Thus, the upper cutting edge 1
Only the necessary lead frame circuit pattern can be left on the top.

According to the apparatus for manufacturing a circuit metal substrate of this embodiment, it is possible to punch out and take out only a circuit pattern required for a thick lead frame while maintaining a required pattern arrangement. Further, after the punching, the punched circuit pattern and the unnecessary punched portion were separated vertically, so that only a thick circuit pattern having excellent heat dissipation and a large thickness could be independently taken out.

Embodiment 5 A method for manufacturing a circuit metal substrate according to the present invention will be described with reference to FIG.

A circuit metal substrate according to the present invention was manufactured by the following procedure.

(1) Circuit pattern punching; FIG.
Is a state corresponding to <1-2> (6) of the first embodiment. According to the operation method described in <1-2> of the first embodiment,
Only the circuit pattern of the nickel-plated copper lead frame having a thickness of 1.2 mm was left on the lower cutting edge 3 while maintaining the predetermined arrangement of each circuit pattern.

(2) Temporary adhesion of metal plate with adhesive insulating layer;
A metal plate with an adhesive insulating layer was produced by the following method. On an aluminum plate having a thickness of 2 mm, a varnish prepared by adding cyclohexanone as a solvent to an epoxy resin composition containing alumina filler was applied by screen printing to form a resin coating film. Then on a hot plate at 80 ° C / 30
A heat treatment was performed for 1 minute + 160 ° C./1 hour to produce an aluminum plate with a resin insulating layer. Next, a liquid epoxy resin was applied on the resin insulating layer in a predetermined pattern by screen printing to form a new adhesive resin layer. Thus, a metal plate with an adhesive insulating layer was produced.

The metal plate provided with the adhesive insulating layer is provided with a through hole so that the positioning pin 6 provided on the lower stage 4 of the circuit metal substrate manufacturing apparatus according to the present invention fits into the metal plate. This hole also functions as a mounting hole for an electronic / electric device manufactured using the metal substrate. The metal plate with the adhesive insulating layer is placed on the circuit pattern left on the lower cutting edge of (1) while the metal plate with the adhesive insulating layer is placed downward with the alignment pins being used for alignment, and then the circuit pattern is vacuum-sucked. After release, the circuit pattern was transferred (temporarily bonded).

(3) Temporary adhesion of organic printed circuit board: The metal plate to which the circuit pattern was temporarily adhered was removed from the above apparatus and placed with the liquid resin application surface up. Next, using a jig utilizing the through hole of the metal plate, an organic printed circuit board having no through hole in a portion where the applied liquid resin is exposed, while performing positioning based on the through hole. Was placed.

(4) Thermocompression bonding: A metal plate with an insulating layer, to which the circuit pattern and the organic printed circuit board produced by the above method were temporarily bonded, was heated at 170 ° C. using a heating and pressing molding apparatus.
The liquid resin for bonding the circuit pattern and the organic printed circuit board was cured by applying a heat and pressure treatment under the conditions of 1.5 kgf / cm ² and 20 minutes.

According to the method of manufacturing a circuit metal substrate of this embodiment, the entire back surface of the thick circuit pattern is placed on the entire surface of the circuit pattern on the insulating layer of the metal plate on which the insulating layer is formed. It was possible to adhere and fix the layer so that the layer was exposed, and it was possible to manufacture a circuit metal substrate having a large thickness circuit pattern having excellent peripheral insulation reliability and excellent heat dissipation.

[Embodiment 6] Another embodiment of the method of manufacturing a circuit metal substrate according to the present invention will be described.

A circuit metal substrate according to the present invention was manufactured by the following procedure. This manufacturing method is the same as that of Example 5 except that the heat treatment method for the resin insulating layer and the application area of the liquid resin are different.
Is the same as

(1) Circuit pattern punching: According to the operation method described in <1-2> of the first embodiment, only a circuit pattern of a nickel-plated copper lead frame having a thickness of 1.2 mm is replaced with a predetermined pattern of each circuit pattern. The arrangement was retained and left on the lower cutting edge.

(2) Temporary adhesion of metal plate with adhesive insulating layer;
A metal plate with an adhesive insulating layer was produced by the following method. On an aluminum plate having a thickness of 2 mm, a varnish prepared by adding cyclohexanone as a solvent to an epoxy resin composition containing alumina filler was applied by screen printing to form a resin coating film. Then on a hot plate at 80 ° C / 30
A heat treatment was performed for 5 minutes to prepare a temporarily dried aluminum plate with a resin insulating layer. Next, on the resin insulating layer, a liquid epoxy resin was applied by screen printing only to an area where the circuit pattern was bonded. Thus, a metal plate with an adhesive insulating layer was produced. While aligning using the alignment pins, the metal plate with the adhesive insulating layer with the adhesive layer down,
After covering the circuit pattern left on the lower cutting edge of (1), the vacuum suction of the circuit pattern was released, and the circuit pattern was transferred (temporarily bonded).

(3) Temporary adhesion of organic printed circuit board: The metal plate to which the circuit pattern was temporarily adhered was removed from the above apparatus, and placed with the circuit pattern facing upward. Next, an organic printed circuit board with through-holes was placed on the temporarily dried resin insulating layer while using a jig utilizing the through-holes of the metal plate to perform positioning with reference to the through-holes.

(4) Thermocompression bonding: A metal plate with an insulating layer, on which the circuit pattern and the organic printed circuit board produced by the above method are arranged, is heated at 170.degree.
The circuit pattern and the organic printed circuit board were adhered by applying a heat and pressure treatment under the conditions of 5 kgf / cm ² and 20 minutes.

According to the method of manufacturing a circuit metal substrate of the present embodiment, the entire back surface of the thick circuit pattern is formed on the entire surface of the circuit pattern on the insulating layer of the metal plate on which the insulating layer is formed. It was possible to adhere and fix the layer so that the layer was exposed, and it was possible to manufacture a circuit metal substrate having a large thickness circuit pattern having excellent peripheral insulation reliability and excellent heat dissipation. Further, the present invention is a method of manufacturing a printed circuit board having a through-hole which causes contamination of the substrate surface due to the suction of the liquid resin, without causing the surface contamination of the substrate due to the suction of the liquid resin.

[Embodiment 7] Another embodiment of the method for manufacturing a circuit metal substrate according to the present invention will be described with reference to FIGS.

A circuit metal substrate according to the present invention was manufactured by the following procedure.

(1) Circuit pattern punching; Embodiment 3 <3
According to the operation method described in <-2>, only the circuit pattern of the nickel-plated copper lead frame having a thickness of 1.2 mm was left on the upper cutting edge 1 while maintaining the predetermined arrangement of each circuit pattern (6). ).

(2) Arrangement of Metal Plate with Adhesive Insulating Layer; First, a metal plate with an adhesive insulating layer was prepared by the following method. On an aluminum plate having a thickness of 2 mm, a varnish prepared by adding cyclohexanone as a solvent to an epoxy resin composition containing alumina filler was applied by screen printing to form a resin coating film. Then, a heat treatment was performed on a hot plate at 80 ° C./30 minutes + 160 ° C./1 hour to produce an aluminum plate with a resin insulating layer. Next, a liquid epoxy resin was applied on the resin insulating layer in a predetermined pattern by screen printing to form a new adhesive resin layer. Thus, a metal plate with an adhesive insulating layer was produced.

The metal plate provided with the adhesive insulating layer is provided with a through hole so that the positioning pin 6 provided on the lower cutting edge 3 of the apparatus for manufacturing a circuit metal substrate according to the present invention fits into the metal plate. This hole also functions as a mounting hole for an electronic / electric device manufactured using the metal substrate. The metal plate with the adhesive insulating layer was placed on the lower stage set with the adhesive layer facing upward while performing alignment using alignment pins (7).

(3) Movement of the metal plate with the adhesive insulating layer: The lower stage set on which the metal plate with the adhesive insulating layer was placed was moved immediately below the upper stage set (8).

(4) Temporary adhesion of metal plate with adhesive insulating layer: The upper stage set is lowered, and the circuit pattern vacuum-sucked on the upper cutting blade 1 is pressed against the liquid resin coated surface of the metal plate with adhesive insulating layer. Then, the vacuum suction of the circuit pattern was released (9).

(5) Movement of metal plate with temporary adhesive bonding insulation layer: After raising the upper stage set, the lower stage set was moved to the position of (2) (10).

The procedure after this is basically the same as the procedure after Example 4 (3).

(6) Temporary bonding of organic printed circuit board: A jig utilizing a through hole of the metal plate is used to judge the position of the through hole in the metal plate while positioning the circuit pattern on the metal plate. An organic printed circuit board having no through-hole was placed on the portion where the liquid resin was applied.

(7) Thermocompression bonding: A metal plate with an insulating layer, to which the circuit pattern and the organic printed circuit board produced by the above method were temporarily bonded, was heated at 170 ° C. using a heating and pressing molding apparatus.
The liquid resin for bonding the circuit pattern and the organic printed circuit board was cured by applying a heat and pressure treatment under the conditions of 1.5 kgf / cm ² and 20 minutes.

According to the method for manufacturing a circuit metal substrate of this embodiment, the entire back surface of the thick circuit pattern is placed on the entire surface of the circuit pattern on the insulating layer of the metal plate on which the insulating layer is formed. It was possible to adhere and fix the layer so that the layer was exposed, and it was possible to manufacture a circuit metal substrate having a large thickness circuit pattern having excellent peripheral insulation reliability and excellent heat dissipation. Furthermore, since the operation can be performed without inverting the members to be handled, the manufacturing method is excellent in workability.

[Embodiment 8] Another embodiment of the method for manufacturing a circuit metal substrate according to the present invention will be described with reference to FIGS. 7 (1) to (12).

A circuit metal substrate according to the present invention was manufactured by the following procedure.

(1) Circuit pattern punching: Example 1 <1-2 except that the fixing of the lead frame is performed by using an adhesive resin layer 13 formed by using an ethylene / vinyl acetate copolymer instead of the vacuum suction hole. In the same manner as in the operation method described above, only the circuit pattern of the nickel-plated copper lead frame having a thickness of 1.2 mm is left on the lower cutting edge 3 while maintaining the predetermined arrangement of each circuit pattern ( 6).

(2) Arrangement of Metal Plate with Adhesive Insulating Layer; First, a metal plate with an adhesive insulating layer was prepared by the following method. On an aluminum plate having a thickness of 2 mm, a varnish prepared by adding cyclohexanone as a solvent to an epoxy resin composition containing alumina filler was applied by screen printing to form a resin coating film. Then, a heat treatment was performed on a hot plate at 80 ° C./30 minutes + 160 ° C./1 hour to produce an aluminum plate with a resin insulating layer. Next, a liquid epoxy resin was applied on the resin insulating layer in a predetermined pattern by screen printing to form a new adhesive resin layer. Thus, a metal plate with an adhesive insulating layer was produced.

The metal plate with the adhesive insulating layer is provided with a through hole so that the positioning pin 6 provided on the lower stage 4 of the apparatus for manufacturing a circuit metal substrate according to the present invention fits into the metal plate. This hole also functions as a mounting hole for an electronic / electric device manufactured using the metal substrate. The metal plate with the adhesive insulating layer was placed on the lower stage set with the adhesive layer facing downward while performing alignment using alignment pins (7).

At this time, when an organic printed circuit board is also mounted, the organic printed circuit board is arranged in the same manner as in the fifth and sixth embodiments.

(3) Movement of the metal plate with the adhesive insulating layer: The lower stage set on which the metal plate with the adhesive insulating layer was placed was moved to immediately below the upper stage set (8).

(4) Heat-pressing press of a metal plate with an adhesive insulating layer: The upper stage set was lowered, and the upper stage 2 was pressed against the metal plate placed on the lower stage set at a pressure of 1.5 kgf / cm ² . . At this time, the cutting operation by the upper and lower cutting blades was stopped. In the apparatus used in this embodiment, the heating devices 14 and 15 are provided inside the upper stage 2 and the lower cutting blade 3, respectively.
And a configuration in which heating and pressing can be performed.

While pressing the above-mentioned metal plate, the upper stage heating device 14 and the lower cutting edge heating device 15 were used at 170 ° C.
And held for 20 minutes to complete the adhesion between the metal plate and the circuit pattern (9).

(5) Take-out of a metal plate with a circuit pattern;
After releasing the press (10), the lower stage set was moved to the position of (7) (11), and the metal plate with the circuit pattern was peeled off from the adhesive resin layer 13 of the lower cutting edge and taken out. The adhesive resin layer 13 was softened by the residual heat of the lower cutting blade, and could be easily peeled off. The adhesive resin layer 13 was left on the lower cutting blade, and could be used repeatedly.

According to the method for manufacturing a circuit metal substrate of this embodiment, the entire back surface of the thick circuit pattern is formed on the entire surface of the circuit pattern on the insulating layer of the metal plate on which the insulating layer is formed. It is possible to adhere and fix the layer so that the layer is exposed, and it is possible to easily manufacture a circuit metal substrate having a large-thickness circuit pattern having excellent peripheral insulation reliability and excellent heat dissipation. Was. Further, a circuit metal substrate having a circuit pattern of a different shape could be manufactured without changing the apparatus itself.

[0090]

As described above, in the circuit metal substrate manufacturing apparatus according to the present invention, only the circuit pattern required for a thick lead frame can be punched out while maintaining the required pattern arrangement. It is possible to easily form a large-thick circuit pattern having excellent heat dissipation. In the method for manufacturing a metal substrate for a circuit according to the present invention, on the insulating layer of the metal plate on which the insulating layer is formed, the entire back surface of the thick circuit pattern is exposed to the entire periphery of the circuit pattern. Thus, it is possible to manufacture a circuit metal substrate having a circuit pattern with a large thickness and excellent peripheral insulation reliability and excellent heat dissipation.

[Brief description of the drawings]

FIG. 1 is a schematic view of a circuit metal substrate manufacturing apparatus according to the present invention.

FIG. 2 is a schematic diagram illustrating an operation state of the circuit metal substrate manufacturing apparatus according to the present invention.

FIG. 3 is a partial schematic view of a circuit metal substrate manufacturing apparatus according to the present invention.

FIG. 4 is a schematic view of a circuit metal substrate manufacturing apparatus according to the present invention.

FIG. 5 is a schematic view of a manufacturing process of a circuit metal substrate according to the present invention.

FIG. 6 is a schematic view of a manufacturing process of a circuit metal substrate according to the present invention.

FIG. 7 is a schematic view of a manufacturing process of a circuit metal substrate according to the present invention.

FIG. 8 is a schematic diagram of a manufacturing process of a conventional semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Upper cutting blade, 2 ... Upper stage, 3 ... Lower cutting blade, 4 ... Lower stage, 5 ... Vacuum suction hole, 6 ... Positioning pin, 7 ...
Positioning pin relief hole, 8 ... Press cylinder, 9 ... Press drive source, 10 ... Device support member, 11 ... Rail, 12 ...
Engraved part, 13: adhesive resin layer, 14: upper stage heating device, 15: lower cutting blade heating device.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Rikuo Kamoshida 7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture Within Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Tsuyoshi Hirai 3-chome, Sachimachi, Hitachi City, Ibaraki Prefecture # 1 Inside Hitachi, Ltd.Hitachi Plant (72) Inventor Mitsufumi Iwanaka 3-1-1, Sachimachi, Hitachi, Ibaraki Prefecture Inside Hitachi, Ltd.Hitachi Plant (72) Inventor Toshiyuki Kobayashi Hitachi, Ibaraki 7-1-1, Omika-cho, Hitachi, Ltd.Hitachi, Ltd.Hitachi Research Laboratories Co., Ltd. (72) Inventor Naoto Saito 502, Kunitachi-cho, Tsuchiura-shi, Ibaraki Pref. 502, Kandate-cho, Tokyo F-term (in reference) 4E048 AB01

Claims (7)

[Claims] 1. A lower stage set on which a lead frame having a predetermined pattern is mounted, and an upper stage set disposed opposite to the lower stage set, wherein the lower stage set is pressurized to press the lower stage set. An apparatus for manufacturing a circuit metal substrate for cutting an unnecessary portion of the lead frame after moving the lead frame in a setting direction by press-fitting and fixing the lead frame, comprising the following steps (a) to (e): apparatus. (A) The upper stage set includes a central upper stage and an upper cutting edge arranged around the upper stage as main components, and the upper cutting edge is slidably mounted around the upper stage. The upper stage set. (B) The lower stage set includes a central lower cutting edge and a lower stage disposed around the lower cutting edge as main components, and the lower stage is slidable around the lower cutting edge. Lower stage set installed. (C) A plurality of vacuum suction holes arranged in a predetermined portion of the lower cutting blade so that a predetermined pattern portion of the lead frame placed on the lower cutting blade can be suctioned by vacuum. (D) Positioning pins provided on the lower stage for positioning the lower stage and the lower cutting blade on the mounting object. (E) Alignment pin escape holes provided on the upper cutting blade to escape the alignment pins of (d) when the upper stage set is moved in the direction of the lower stage set. 2. A lower stage set on which a lead frame having a predetermined pattern is mounted, and an upper stage set disposed opposite to the lower stage set, wherein the upper stage set is pressurized to An apparatus for manufacturing a circuit metal substrate for cutting an unnecessary portion of the lead frame after moving the lead frame in a setting direction by press-fitting and fixing the lead frame, comprising the following steps (a) to (e): apparatus. (A) The upper stage set includes a central upper stage and an upper cutting edge arranged around the upper stage as main components, and the upper cutting edge is slidably mounted around the upper stage. The upper stage set. (B) The lower stage set includes a central lower cutting edge and a lower stage disposed around the lower cutting edge as main components, and the lower stage is slidable around the lower cutting edge. Lower stage set installed. (C) Leads mounted on the lower cutting blade and the upper surface of the lower stage in a predetermined pattern so that the lead frames mounted on the lower cutting blade and the upper surface of the lower stage are supported by being dropped. Engraved part less than the thickness of the frame. (D) Positioning pins provided on the lower stage for positioning the lower stage and the lower cutting blade on the mounting object. (E) Alignment pin escape holes provided on the upper cutting blade to escape the alignment pins of (d) when the upper stage set is moved in the direction of the lower stage set. 3. A lower stage set on which a lead frame having a predetermined pattern is mounted, and an upper stage set disposed opposite to the lower stage set, wherein the upper stage set is pressed to An apparatus for manufacturing a circuit metal substrate for cutting an unnecessary portion of the lead frame after moving the lead frame in a setting direction by press-fitting and fixing the lead frame, comprising the following steps (a) to (e): apparatus. (A) The upper stage set includes a central upper stage and an upper cutting edge arranged around the upper stage as main components, and the upper cutting edge is slidably mounted around the upper stage. The upper stage set. (B) The lower stage set includes a central lower cutting edge and a lower stage disposed around the lower cutting edge as main components, and the lower stage is slidable around the lower cutting edge. Lower stage set installed. (C) An adhesive resin layer formed on the upper surface of the lower cutting blade so that the lead frame is supported by being adhered to the lead frame mounted on the lower cutting blade. (D) Positioning pins provided on the lower stage for positioning the lower stage and the lower cutting blade on the mounting object. (E) Alignment pin escape holes provided on the upper cutting blade to escape the alignment pins of (d) when the upper stage set is moved in the direction of the lower stage set. 4. A lower stage set on which a lead frame having a predetermined pattern is mounted, and an upper stage set disposed opposite to the lower stage set, wherein the lower stage is pressurized to press the upper stage set. An apparatus for manufacturing a circuit metal substrate for cutting an unnecessary portion of the lead frame after moving the lead frame in a setting direction by press-fitting and fixing the lead frame, comprising the following steps (a) to (e): apparatus. (A) The upper stage set mainly includes an upper cutting blade at a central portion and an upper stage disposed around the upper cutting blade, and the upper stage is slidable around the upper cutting blade. Upper stage set installed. (B) The lower stage set includes a central lower stage and a lower cutting edge disposed around the lower stage as main components, and the lower cutting edge is slidably mounted around the lower stage. Lower stage set. (C) A plurality of vacuum suction holes arranged in a predetermined portion of the upper cutting blade so that a predetermined pattern portion of the lead frame placed on the lower stage can be suctioned by vacuum. (D) Positioning pins provided on the lower cutting blade for positioning the lower stage and the lower cutting blade. (E) Positioning pin escape holes provided on the upper stage to allow the positioning pins of (d) to escape when the upper stage set is moved in the lower stage setting direction. 5. A method for manufacturing a circuit metal substrate comprising the following steps (a) to (d). (A) Lead frame punching step: A region having a predetermined pattern used as a circuit pattern of a lead frame is supported and fixed, and a portion having a plurality of positioning holes is pressurized and fixed to each of the circuit patterns, and a vacuum is formed. A step of cutting with upper and lower cutting blades while supporting and fixing by suction or dropping into a carved portion, and leaving a region to be used as a circuit pattern while retaining the arrangement of each pattern. (B) transferring the circuit pattern of the lead frame onto the metal plate with the adhesive insulating layer; applying an insulating resin or bonding an insulating resin film to the metal plate having a plurality of positioning holes, After preparing a metal plate with an adhesive insulating layer obtained by applying a liquid adhesive resin on the resin, or applying an adhesive insulating resin to the metal plate, or preparing a metal plate with an adhesive insulating layer having an adhesive insulating resin film adhered thereto, The metal plate with the adhesive insulating layer is positioned by using the positioning holes of the metal plate so as to cover the circuit pattern left uncut in (a) with the adhesive insulating layer facing down. The pattern is transferred onto the adhesive insulating layer, or the metal plate with the adhesive insulating layer is placed on the metal plate with the adhesive insulating layer facing upward by positioning using the positioning holes of the metal plate, and cut by (a). Before the left circuit pattern Step of taking transferring said circuit pattern on the adhesive insulating layer by dropping the adhesive insulating layer. (C) an organic printed circuit board arranging step; a step of placing the organic printed circuit board on the exposed adhesive insulating layer formed in (b) by alignment using the alignment holes of the metal plate. . If it is not necessary to mount the organic printed circuit board, the process skips this step and moves from the step (b) to the next step (d). (D) Heating and pressurizing step: The metal plate with the adhesive insulating layer on which the circuit pattern and the organic printed circuit board are mounted, which is manufactured in the above-mentioned step, is subjected to a heat and pressure treatment to fix and fix the above-mentioned article. Steps to complete. 6. A method for manufacturing a circuit metal substrate comprising the following steps (a) to (d). (A) Lead frame punching step: A region having a predetermined pattern used as a circuit pattern of a lead frame is supported and fixed, and a portion having a plurality of positioning holes is pressure-fixed to each of the above circuit patterns, and is adhered. A step of cutting with upper and lower cutting blades while supporting and fixing by sticking or temporarily adhering with a resin, and leaving a region to be used as a circuit pattern while keeping the arrangement of each pattern. (B) transferring the circuit pattern of the lead frame onto the metal plate with the adhesive insulating layer; applying an insulating resin or bonding an insulating resin film to the metal plate having a plurality of positioning holes, After preparing a metal plate with an adhesive insulating layer obtained by applying a liquid adhesive resin on the resin, or applying an adhesive insulating resin to the metal plate, or preparing a metal plate with an adhesive insulating layer having an adhesive insulating resin film adhered thereto, The metal plate with the adhesive insulating layer is positioned by using the positioning holes of the metal plate so as to cover the circuit pattern left uncut in (a) with the adhesive insulating layer facing down. Transferring a pattern onto the adhesive insulating layer. (C) an organic printed circuit board arranging step; a step of placing the organic printed circuit board on the exposed adhesive insulating layer formed in (b) by alignment using the alignment holes of the metal plate. . If it is not necessary to mount the organic printed circuit board, the process skips this step and moves from the step (b) to the next step (d). (D) Heating and pressurizing step: The metal plate with the adhesive insulating layer on which the circuit pattern and the organic printed circuit board are mounted, which is manufactured in the above-mentioned step, is subjected to a heat and pressure treatment to fix and fix the above-mentioned article. Steps to complete. 7. A lower stage set on which a lead frame having a predetermined pattern is mounted, and an upper stage set disposed opposite to the lower stage set, wherein the upper stage set is pressed to An apparatus for manufacturing a metal substrate for a circuit, comprising: a fixing device that is moved in a setting direction and vacuum-adsorbs the lead frame.