JP2000340625A - Pattern inspection device, method for controlling the same and image pickup device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern inspection device which can realize a high pattern inspecting speed and a high throughput. SOLUTION: A pattern inspection device 1 is provided with a plurality of inspecting sections 10, each being composed of an image pick-up section 11 which takes the surface image of a semiconductor wafer 50 placed on a stage 14 and outputs data D about the image picked-up results and a data processing section 12 which receives the data D and executes prescribed processing on the data obtained, as a result of a visual inspection or pattern inspection performed on the surface of the wafer 50. Each inspecting section 10a or 10b is also provided with a moving mechanism (including its control section) 13, which controls the movement of the image picking-up section 11 and can move independently and simultaneously with the other inspecting section 10b or 10a. Since each of the inspection sections 10 is provided with the data processing section 12, the data processing time of the pattern inspection device 1 can be shortened, as compared with the conventional inspection device. In addition, since the inspection sections 10 can move independently and simultaneously, the scanning time of the device 1 can also be shortened, as compared with the conventional device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern inspection apparatus (hereinafter referred to as a "pattern inspection apparatus") for detecting a defect in the shape of a pattern (circuit or wiring pattern) formed on the surface of a semiconductor wafer (hereinafter, also simply referred to as "wafer"). , Simply "inspection equipment"
).

[0002]

2. Description of the Related Art FIG. 6 is a schematic diagram showing the entire structure of a conventional pattern inspection apparatus 1P, and FIG. 7 is an enlarged view of a main part in FIG. FIG. 8 shows a flowchart of the basic operation of the pattern inspection method in the conventional inspection apparatus 1P.
The basic operation of the conventional inspection apparatus 1P will be described with reference to FIGS.

First, one of the wafers 50 stored in the cassette 41 is transferred by the transfer mechanism 42 and transferred onto the stage 14.

After that, an image pickup unit 11P including an optical system 110P including an objective lens 113P and a detector 111P is controlled by a moving mechanism (not shown) to
Scanning is performed with a predetermined scan width from one end to the other end along the X direction of 0 (step ST11P). In this step ST11P, when the imaging unit 11P reaches the other end of the wafer 50, the imaging unit 11P performs the scan in the X direction after shifting in the Y direction by the scan width. In step ST11P, the imaging unit 11P moves pitch by a predetermined pitch unit, and the detector 111P captures (takes an image of) the surface of the wafer 50 at each pitch movement and transmits it to the data processing unit 12P. (Step ST12P).

[0005] The data processing unit 12P executes the following data processing based on the received image data to execute a pattern inspection (step ST13P). That is, the wafer 5
Using a predetermined repetition amount of a pattern repetitively existing on the surface of 0 as a unit, difference data from the same repetition pattern existing in another part or a previously recognized reference pattern is obtained. Then, a pattern in which the difference data is equal to or larger than a predetermined threshold value is determined and detected as an inconvenient pattern.

By repeating such a series of operations, the entire surface of the wafer 50 is scanned (step ST1).
4P), a pattern inspection is performed. Thereafter, the inspection result is displayed on the display unit 22 (step ST15P).

Next, as shown in FIG. 9, the inspection operation of the conventional inspection apparatus 1P on the wafer 50 on the surface of which chips 50C composed of two areas 50C1 and 50C2 are regularly arranged is shown in FIG. This will be described with reference to a flowchart. It should be noted that a pattern that is regularly repeated is formed in the area 50C1.
It is assumed that the pattern No. 2 does not have a pattern that is regularly repeated for each chip.

First, an area where a repetitive pattern is formed (hereinafter also referred to as a "repeated pattern area")
For 50C1, steps ST11P to ST1 described above are performed.
Execute 4P. That is, the imaging unit 11P scans the surface of the wafer 50 (step ST21P), while
Detector 111P fetches the image data of repetitive pattern area 50C1 and transmits it to data processing unit 12P (step ST22P). And the data processing unit 12P
Performs the pattern inspection by performing the same data processing as in step ST12P (step ST23P).

Subsequent to the end of the pattern inspection for the repetitive pattern area 50C1 (see step ST24P), an area 50 where a non-repeated pattern is formed (hereinafter also referred to as a "non-repeated pattern area").
A pattern inspection is performed on C2 by the same steps. That is, the imaging unit 11P scans the surface of the wafer 50 (step ST25P), while the detector 11P
1P captures the image data of the non-repeated pattern area 50C2 and transmits it to the data processing unit 12P (step ST26P). Then, the data processing unit 12P performs the same data processing as in step ST12P to execute a pattern inspection (step ST27P). In addition, the inspection device 1
In P, teaching / selection of an inspection area (here, the repetitive pattern area 50C1 or the non-repeated pattern area 50C2) can be performed.

Then, the non-repeated pattern area 50C
2 is completed (step ST28).
P), and both areas 50C1,
Each test result of 50C2 is displayed (step ST29)
P).

[0011]

As described above, the conventional pattern inspection apparatus has the following features. The area in which the repetitive pattern is formed and the area in which the non-repeated pattern is formed cannot be simultaneously scanned to capture the image data of both patterns. That is, for a wafer having both areas, it is not possible to perform pattern inspection on all areas on the wafer by one scanning operation. For this reason,
In order to inspect the entire surface of the wafer, the optical system must scan the wafer twice. That is, the wafer must be scanned a number of times corresponding to the number of types of patterns formed on the wafer.

For this reason, the scanning time or the time spent for imaging increases as the types of the patterns increase. Further, as described above, since the data processing for the captured image data is performed for each single scan, the time required for the data processing increases as the number of wafer scans increases. As described above, in the conventional pattern inspection apparatus, the scan time (the number of scans) and the data processing time (they may be collectively referred to as an inspection time) increase as the types of patterns in the chip increase. ,
There is a problem that the throughput is low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and can realize a high throughput of the pattern inspection by reducing the data processing time related to the pattern inspection as compared with the conventional pattern inspection apparatus. A first object is to provide a pattern inspection apparatus and a control method of the pattern inspection apparatus.

Further, a second object of the present invention is to provide a pattern inspection apparatus and a pattern inspection apparatus capable of realizing a high throughput of the pattern inspection by reducing the time spent for imaging one whole sample as compared with the conventional pattern inspection apparatus. An object of the present invention is to provide a control method of a device.

[0015] In addition, a third object of the present invention is to provide a pattern inspection apparatus and an image pickup device for the pattern inspection apparatus capable of performing an accurate appearance inspection with an optimum detection sensitivity according to the definition of each pattern. Is to do.

[0016]

According to a first aspect of the present invention, there is provided a pattern inspection apparatus for inspecting the appearance of a pattern formed on a surface of a sample. A plurality of inspection units each including an imaging unit that captures an image with the detection sensitivity and outputs data related to the imaging result, and a data processing unit that receives the data related to the imaging result and executes predetermined data processing related to the appearance inspection. It is characterized by having.

(2) The pattern inspection apparatus according to the second aspect of the present invention is the pattern inspection apparatus according to the first aspect, wherein each of the inspection sections can operate independently and simultaneously. I do.

(3) A pattern inspection apparatus according to a third aspect of the present invention is the pattern inspection apparatus according to the first or second aspect, wherein at least one of the plurality of inspection units includes another inspection unit. The image pickup unit having the detection sensitivity different from that of the inspection unit is provided.

(4) A pattern inspection apparatus according to a fourth aspect of the present invention is the pattern inspection apparatus according to any one of the first to third aspects, wherein the detection sensitivity is variable. .

(5) According to a fifth aspect of the present invention, in the control method of the pattern inspection apparatus, the imaging unit for imaging the surface of the sample with a predetermined detection sensitivity and outputting data relating to the imaging result; A data processing unit for receiving data on the result and performing a predetermined data processing for the appearance inspection of the pattern formed on the surface, a control method for a pattern inspection apparatus comprising a plurality of inspection units, When a plurality of types of the patterns are formed, the appearance inspection is performed by a different inspection unit for each of the different types of the patterns.

(6) In the control method of the pattern inspection apparatus according to the invention described in claim 6, the image pickup section for picking up an image of the surface of the sample with a predetermined detection sensitivity and outputting data relating to the image pick-up result; A data processing unit for receiving data relating to the result and performing a predetermined data processing relating to the visual inspection of the pattern formed on the surface. At least two of the inspection units simultaneously inspect the same type of the pattern.

(7) An image pickup device for a pattern inspection device according to a seventh aspect of the present invention is an image pickup device for a pattern inspection device, comprising an optical system including a light source and a detector. A plurality of at least one of the detectors is provided, and the plurality of light sources or detectors have different characteristics.

[0023]

<First Embodiment> A. First Embodiment Configuration of Pattern Inspection Apparatus FIG. 1 is a schematic block diagram for explaining a configuration of a pattern inspection apparatus 1 according to the first embodiment. As shown in FIG. 1, the inspection apparatus 1 includes a stage (or sample stage) 14
An imaging unit 11 that images the surface of a semiconductor wafer (sample) 50 mounted thereon with a predetermined detection sensitivity and outputs image data or optical data (data) D relating to the imaging result.
And a data processing unit (for example, a microcomputer) 12 that receives data D on the imaging result and executes predetermined data processing (described later) on the surface appearance inspection or the pattern inspection (to be described later). Prepare. If necessary, alphabets a, b,... Are appended to the reference numeral 10 to distinguish each of the plurality of inspection units 10 and to which the constituent elements of the inspection unit 10 belong. Each of the inspection units 10a, 10b,.

In particular, each inspection unit 10 (10a, 10b,...)
..) is a moving mechanism (including the control unit) 13 (13) for controlling the movement of the imaging unit 11 (11a, 11b,...).
a, 13b,...), and the imaging units 11 can move independently and simultaneously. The moving mechanism 13
Can be applied to various mechanisms capable of realizing linear movement along each of the X direction and the Y direction which are perpendicular to each other, and a moving mechanism in a conventional inspection apparatus may be used. Each moving mechanism 13 is controlled by a control unit (for example, a microcomputer or the like) 23. That is, the operator operates the input unit (for example, keyboard, touch panel, mouse, etc.)
The control unit 23 controls each movement mechanism 13 based on a movement instruction (teaching) input through the control unit 24 or based on a predetermined signal output from each data processing unit 12 to the control unit 23. . In addition to such control, it is also possible to apply a configuration in which the data processing unit 12 controls the moving mechanism 13 based on the processing result in the data processing unit 12 (12a, 12b,...). (See the wavy arrow in FIG. 1). According to such a configuration, for example, the data processing unit 12 controls the moving mechanism 13 by transmitting a predetermined signal to the control unit of the moving mechanism 13 after receiving the data D (Da, Db,...). , Control unit 2
The pitch movement of the imaging unit 11 can be performed without the intervention of the third unit.

The inspection apparatus 1 is provided with a display section 22. The display section 22 displays, for example, data processing results in the data processing section 12, operation status of the inspection apparatus 1, input contents of the operator, and the like. Various display devices such as a liquid crystal display and a light emitting diode (LED) display are applicable as the display unit 22. Note that a display unit may be provided for each data processing unit 12 (or for each imaging unit 11).

Next, an example of a specific configuration of the imaging section 11 will be described with reference to FIG. As shown in FIG. 2, the imaging unit 11 according to the first embodiment includes a light source 112 such as a Xe lamp, an Hg-Xe lamp, and an Ar laser. The output light of the light source 112 is, for example, two variable light sources. The light is irradiated onto the surface of the wafer 50 via a stop 115 such as a density ND filter, a beam splitter 114 and an objective lens 113. Then, the illuminated area is detected by a detector (for example, C) through the objective lens 113 and the beam splitter 114.
An image is captured by an image sensor (eg, CD) 111.
At this time, the size and the like of the area input to the detector 111 are adjusted by the magnification changer 116 and the zoom mechanism 117 disposed between the objective lens 113 and the detector 111. Then, data D relating to the imaging result of the detector 111 is output to the data processing unit 12.

In the image pickup section 11 shown in FIG. 2, a mirror (half mirror) 11
At 8, the light beam incident on the detector 111 is divided into two, one of which is incident on the detector 111 and the other is a color camera 119.
Is incident. The image data captured by the color camera 119 is used for, for example, means for identifying the cause of a pattern defect after the pattern inspection, and the color camera 119 and the mirror 118 are particularly essential components for the pattern inspection itself. Not an element. here,
A component of the imaging unit 11 other than the detector 111 for irradiating an inspection region of the sample 50 and guiding an image of the region to the detector 111 will be referred to as an “optical system”. I do. That is, the imaging unit includes such an optical system and a detector. In addition, as shown in FIG.
13 (113a, 113b,...) And a light beam entering and exiting the objective lens 113, the optical system 110 (110
a, 110b,...) are illustrated for convenience. Note that FIG. 3 and FIG. 4 to be described later illustrate a case where there are two imaging units 11 or two inspection units 10.

As shown in the schematic overall configuration of FIG. 4, the inspection apparatus 1 further includes a transport mechanism 42. The transport mechanism 42 transports one of the wafers 50 placed in a predetermined position of the inspection apparatus 1 or the wafer 50 stored in the cassette 41 onto the stage 14 and places it thereon.
Alternatively, the wafer 50 placed on the stage 14 is transported and stored in the cassette 41. 4 does not show the control unit 23, the input unit 24, and the moving mechanism 13 in FIG. 1 described above in order to avoid complication of the drawing.

B. Operation of Pattern Inspection Apparatus Next, an operation or an inspection method of the inspection apparatus 1 will be described with reference to FIGS. In the following description, in the case where the number of the inspection units 10 is two, that is, the inspection device 1
a and 10b will be described. As shown in FIG. 9 described above, a plurality of chips (or dies) 50C are regularly arranged on the surface of the wafer 50, and the chips 50C are arranged in a regular manner like a memory cell region in a DRAM, for example. It comprises a repetitive pattern area 50C1 formed of a pattern which is repeatedly present and a non-repeated pattern area 50C2 which is not formed with a pattern which is regularly repeated in a chip such as a peripheral circuit in a DRAM. Shall be.

First, the transfer mechanism 42 is connected to the wafer cassette 5
Only one wafer housed in 3 is extracted and transferred onto the stage 51.

In particular, in the inspection apparatus 1, as shown in the flowchart of FIG. 5, the inspection unit 10a repeatedly performs the pattern inspection of the pattern area 50C1 (step ST1).
a to ST4a), the inspection unit 10b executes a pattern inspection of the non-repeated pattern area 50C2 (step ST).
1b to ST4b). Moreover, in the inspection apparatus 1, the inspection units 10a and 10b execute pattern inspection independently and simultaneously. At this time, in the inspection apparatus 1, the operator inputs (teaching) information on basic operation of each inspection unit 10 such as a measurement start position and an end position and a scanning method in advance from the input unit 24 before starting the inspection. By doing so, the control unit 23 that has received such information from the input unit 24 uses the moving mechanism 1 of each inspection unit 10 based on the information.
3 is controlled. Furthermore, based on a predetermined signal output from each data processing unit 12 (for example, output when the imaging unit 12 receives data such as the data reaching the edge of the wafer 50 or being separated from the edge) ( The movement mechanism 13 can be controlled (via the control unit 23 or directly) to perform appropriate movement. Further, similarly to the conventional inspection apparatus 1P (see FIG. 6),
In the inspection apparatus 1, selection / designation of an area (here, the repeated pattern area 50 </ b> C <b> 1 or the non-repeated pattern area 50 </ b> C <b> 2) to be inspected by each inspection unit 10 can be performed. Such teaching can be performed simultaneously with the input of the information on the basic operation described above. The operation of each inspection unit 10 (including the movement of the imaging unit 11 and the later-described data processing in the data processing unit 12) will be described below with reference to the flowchart of FIG.

First, the inspection unit 10a scans the repetitive pattern area 50C1 with a predetermined scan width from the one end in the X direction to the other end under the control of the moving mechanism 13a. At this time, the detector 111
The inspection unit 10a moves in predetermined pitch units based on the area range on the wafer 50 that can be detected by the inspection unit 10a (step ST).
1a). Then, for each pitch movement, the detector 111a captures an image of the area and transmits it as image data Da to the data processing unit 12a (step ST2a).

Data processing unit 12a receiving data Da
Detects a defective pattern by a so-called “adjacent cell comparison method” (step ST3a). That is,
Using a predetermined repeating pattern as a unit (also referred to as “cell”), adjacent repeating patterns (cells) are compared to obtain difference data. At this time, the value of the difference data is 0 when two cells having no defect in the pattern are compared, and the value of the difference is not 0 when at least one of the adjacent patterns has a pattern defect. Note that the difference may not become 0 due to a tolerance of a manufacturing process or the like, and therefore, when the difference data is equal to or larger than a predetermined threshold value, it is actually determined that there is a pattern defect. Instead of the above-described adjacent cell comparison method, the data processing unit 12a may previously recognize the reference pattern data, obtain difference data from the reference pattern, and execute the above-described determination processing. good.

When reaching the other end, the inspection unit 10a shifts in the Y direction by the scan width, and
The pattern inspection is performed along the X direction toward the one end. When the pattern inspection for all the repetitive pattern areas 50C1 on the wafer 50 is completed by repeating this operation (see step ST4a), the data processing unit 12a displays the inspection result on the display unit 22 (step ST5).

At the same time (in parallel) with the above-described pattern inspection by the inspection unit 10a, the inspection unit 10b performs a pattern inspection on the non-repeated pattern area 50C2.
Note that the inspection units 10a and 10b may be moved while being adjacent to each other, or may be moved in opposite directions along the scanning direction.

As shown in FIG. 5, the above step ST1a
After steps ST1b to ST2b similar to steps ST2a to ST2a, the data processing unit 12b detects a defective pattern by a so-called “adjacent chip (die) comparison method” (step ST3b). That is, the two non-repeated pattern areas 50C2 of two adjacent chips 50C2 are compared with each other, and the difference between them is obtained. Then, as in step ST3a, when the difference data is equal to or larger than a predetermined threshold value, it is determined that there is a pattern defect. Instead of the above-described adjacent chip comparison method, the data processing unit 12b may previously recognize the reference pattern data, obtain the difference data from the reference pattern, and execute the above-described determination processing. good.

After that, when the pattern inspection for all the non-repeated pattern areas 50C2 on the wafer 50 is completed (see step ST4b corresponding to the step ST4a), the inspection unit 10b displays the inspection result on the display unit. 22 (step ST5). At the time of the display operation in step ST5, the inspection result is stored in a storage unit (not shown) for each inspection in steps ST3a and ST3b.
This is read out and displayed at T5. Note that the display of the inspection result may be displayed for each inspection in steps ST3a and ST3b.

The above-described series of operation steps ST1a to ST1
In 4a, ST1b to ST4b, ST5, it has been described that the imaging operation and the data processing of the predetermined area are performed simultaneously (in parallel), but first, the imaging units 10a, 10b cause the inspection target area 50C1, After acquiring all the image data of 50C2, each data processing unit 12a,
12b (independently of each other)
T3a and ST3b may be executed.

It should be noted that the same repeated pattern area 51C1 (or non-repeated pattern area 51C2) can be inspected simultaneously by both the inspection units 10a and 10b. At this time, both inspection units 10a, 10b
In view of the fact that they can operate independently of each other, both inspection units 10a and 10b may perform pattern inspection on the same chip 50C or may perform pattern inspection on different chips 50C.

As described above, in the inspection apparatus 1, the inspection units 10a and 10b which can operate independently and simultaneously have the data processing units 12a and 12b, respectively.
Data processing (steps ST3a and ST3b) relating to pattern inspection is executed simultaneously (in parallel) for each of a and 10b. Therefore, the data processing time can be shortened or reduced as compared with the conventional pattern inspection apparatus 1P (see FIG. 6) in which the data processing is executed by one data processing unit.

Further, the imaging operation and data processing in each of the inspection units 10a and 10b are performed independently and simultaneously for each of the inspection units 10a and 10b. Therefore, compared to a conventional pattern inspection apparatus having only one imaging unit, the time spent for imaging one entire wafer can be reduced. Therefore, according to the inspection apparatus 1, both the data processing time and the scan time can be reduced, and the pattern inspection can be speeded up. As a result, high throughput can be obtained.

In the above description of the operation, the case where there are two inspection units has been described. However, the same operation description is applied to the case where three or more inspection units are provided. In such cases,
Higher-speed pattern inspection can be performed according to the number of inspection units. Further, according to the inspection apparatus 1, for example, it is applicable to a chip (die) having a plurality of different repeating pattern areas instead of or in addition to the non-repeating pattern area 50C2. In such a case, the above effects can be reliably obtained by providing the inspection units 10 in a number corresponding to the types of patterns in the chip.

In particular, it goes without saying that the scan direction of the inspection unit 10 may be executed by exchanging the X direction and the Y direction in the above description. Further, the scanning operation may be performed while the inspection unit 10 is spirally rotated with respect to the center of the wafer 50. Further, when the stage 14 is movable in the X direction and the Y direction or is rotatable, the inspection unit 10 is fixed, or both the inspection unit 10 and the stage 14 are controlled to perform each of the scans described above. The operation may be performed.

<Second Embodiment> When the above-described chip 50C of FIG. 9 is, for example, a DRAM, the definition of the pattern of the memory cell area corresponding to the repetitive pattern area 50C1 corresponds to the non-repeated pattern area 50C2. Higher than that of the peripheral circuit. In view of this point, in the above-described inspection apparatus 1, the detection sensitivity or the detection resolution of each of the inspection units 10a and 10b may be different. That is, the detection sensitivity of the inspection unit 10 (10a) that performs pattern inspection on the repetitive pattern area 50C1 is higher than that of the inspection unit 10 (10b) that performs pattern inspection on the non-repeated pattern area 50C2. Such setting is performed by, for example, an imaging unit (imaging device)
This can be implemented by making the lens resolution (characteristics) of the objective lens 113a (see FIG. 2) of 11a or the like higher than that of the imaging unit 11b. Alternatively, by increasing the resolution (characteristics) of the detector 111 of the inspection unit 10a,
Alternatively, it may be implemented by making the wavelength (characteristics) of the output light of the light source 112 shorter. Further, it is also possible to change the detection sensitivity of the inspection unit 11 by variously combining these.

As described above, since the pattern inspection apparatus includes the inspection units having different detection sensitivities, an accurate pattern inspection can be performed by the inspection unit having the optimum detection sensitivity according to the definition of the pattern. . At this time, since the data processing time in the data processing unit 12 is correlated with the amount of data to be processed, an excessive processing load on the data processing unit 12 can be reduced by the image data captured with the optimum detection sensitivity. .

Further, if the detection sensitivity of the inspection unit 10 is made variable by, for example, providing a plurality of objective lenses 113 and switching or combining them, it is possible to prepare such a number of inspection units 10 without preparing the inspection unit 10. An accurate pattern inspection can be performed flexibly corresponding to the definition of the pattern. As another example of the means for making the detection sensitivity of the inspection unit 10 variable, for example, when the objective lens 113 is a detachable component, there is a means for changing the objective lens 113 attached to the imaging unit 11. In addition, by providing a plurality of detectors 111 or light sources 112, or by making them detachable parts,
The detection sensitivity may be variable similarly to the above-described method. Of course, these may be configured to be variously combined.

In the above description, the case where the appearance inspection is performed on the pattern formed on the surface of the semiconductor wafer has been described, but the inspection object of the pattern inspection apparatus according to the present invention is not limited to this. For example, the present invention can be applied to the appearance inspection of a pattern formed on the surface of various samples such as a substrate (glass substrate) of a liquid crystal panel or a plasma display panel.

[0048]

(1) According to the first aspect of the present invention, since each inspection unit has a data processing unit, data processing relating to appearance inspection can be executed for each inspection unit. Accordingly, the data processing is performed simultaneously (in parallel) in each data processing unit, thereby reducing the data processing time as compared with the conventional pattern inspection apparatus in which the data processing is performed by one data processing unit. be able to.
Therefore, the pattern inspection can be speeded up and a high throughput can be obtained.

(2) According to the second aspect of the present invention, since each inspection unit can operate independently and simultaneously, the imaging operation and the data processing can be performed independently and simultaneously. For this reason, in addition to the effect of the above (1), the time spent for imaging the entire sample can be reduced as compared with the conventional pattern inspection apparatus having only one imaging unit. Therefore, the pattern inspection can be speeded up and a high throughput can be obtained.

(3) According to the third aspect of the invention, at least one of the plurality of inspection units includes an imaging unit having a different detection sensitivity from other inspection units. For this reason, when patterns having different degrees of definition exist on the surface of the sample, an accurate appearance inspection can be performed by using an inspection unit having an optimum detection sensitivity according to the degree of definition of each pattern. At this time, an excessive processing load on the data processing unit can be reduced.

(4) According to the fourth aspect of the present invention, since the detection sensitivity of the imaging unit is variable, an accurate appearance inspection can be performed flexibly in accordance with the definition of the pattern to be inspected. Can be. At this time, an excessive processing load on the data processing unit can be reduced.

(5) According to the fifth aspect of the present invention, the pattern inspecting apparatus having a plurality of inspecting units is capable of detecting different types of patterns when a plurality of types of patterns are formed on the surface of the sample. Then, an appearance inspection is performed by different inspection units. For this reason, in the control method in the conventional pattern inspection apparatus having only one imaging unit and one data processing unit, the same pattern inspection must be performed as many times as the number of patterns (the number of types). for,
By operating a plurality of inspection units simultaneously in the control method of the pattern inspection apparatus, the time spent for imaging the entire sample and the data processing time can be reduced.
Therefore, pattern inspection can be performed at high speed or with high throughput.

(6) According to the invention of claim 6, since at least two of the plurality of inspection units each including the inspection unit and the data processing unit inspect the same type of pattern at the same time, The time spent for imaging the entire sample and the data processing time can be reduced as compared with a conventional pattern inspection apparatus control method having only one imaging unit and one data processing unit. Therefore, pattern inspection can be performed at high speed or with high throughput.

(7) According to the seventh aspect of the invention, since at least one of the light source and the detector is provided in plural and the plurality of light sources or detectors have different characteristics from each other, the plurality of light sources or detectors are provided. The detection sensitivity of the image pickup device can be made variable by switching or combining. Therefore, according to the pattern inspection apparatus provided with the image pickup device, the effect (4) can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic block diagram for explaining a configuration of a pattern inspection apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating an example of a configuration of an imaging unit in the pattern inspection apparatus according to the first embodiment.

FIG. 3 is a schematic diagram for explaining a configuration of an imaging unit in the pattern inspection apparatus according to the first embodiment.

FIG. 4 is a schematic diagram for explaining a configuration of the pattern inspection apparatus according to the first embodiment.

FIG. 5 is a flowchart illustrating an operation of the pattern inspection apparatus according to the first embodiment;

FIG. 6 is a schematic diagram for explaining a configuration of a conventional pattern inspection apparatus.

FIG. 7 is an enlarged view of a main part of a conventional pattern inspection apparatus.

FIG. 8 is a flowchart for explaining an inspection method in a conventional pattern inspection apparatus.

FIG. 9 is a schematic top view for explaining a pattern on the surface of a semiconductor wafer.

FIG. 10 is a flowchart for explaining another inspection method in the conventional pattern inspection apparatus.

[Explanation of symbols]

1 pattern inspection apparatus, 10, 10a, 10b inspection unit, 11, 11a, 11b imaging unit, 12, 12a, 1
2b data processing unit, 13, 13a, 13b driving unit,
14 stage, 22 display unit, 23 control unit, 24
Input unit, 41 cassette, 42 transfer mechanism, 50 semiconductor wafer (sample), 110, 110a, 110b optical system, 111, 111a, 111b detector, 112 light source, 113 objective lens, 114 beam splitter, 1
15 aperture, 116 magnification changer, 117 zoom mechanism, 118 mirror, 119 color camera, D, D
a, Db data, ST1a to ST4a, ST1b to S
T4b, ST5 Operation steps.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G051 AA51 AB20 BA00 CA03 CA04 CA07 CD04 DA01 DA07 EA08 EA16 EB01 EB02 FA10 4M106 AA01 BA04 BA05 CA39 DB01 DB04 DB07 DB08 DB11 DB13 DB21 DJ01 DJ04 DJ11 DJ23

Claims (7)

[Claims] 1. A pattern inspection apparatus for inspecting the appearance of a pattern formed on a surface of a sample, comprising: an imaging unit configured to image the surface with a predetermined detection sensitivity and output data relating to an imaging result; A pattern inspection apparatus, comprising: a plurality of inspection units each including a data processing unit that receives data regarding an imaging result and executes predetermined data processing regarding the appearance inspection. 2. The pattern inspection apparatus according to claim 1, wherein the inspection units can operate independently and simultaneously. 3. The pattern inspection apparatus according to claim 1, wherein at least one of the plurality of inspection units includes the imaging unit having the detection sensitivity different from other inspection units. A pattern inspection apparatus, comprising: 4. The pattern inspection apparatus according to claim 1, wherein the detection sensitivity is variable. 5. An imaging unit for imaging a surface of a sample with a predetermined detection sensitivity and outputting data relating to an imaging result, and receiving an image relating to the imaging result and inspecting an appearance of a pattern formed on the surface. A method for controlling a pattern inspection apparatus including a plurality of inspection units each including a data processing unit that performs predetermined data processing, wherein a plurality of types of the patterns are formed on the surface, A method of controlling the pattern inspection apparatus, wherein the appearance inspection is performed by different inspection units. 6. An imaging section for imaging a surface of a sample with a predetermined detection sensitivity and outputting data relating to an imaging result, and receiving data relating to the imaging result and inspecting an appearance of a pattern formed on the surface. A method of controlling a pattern inspection apparatus including a plurality of inspection units each including a data processing unit that performs predetermined data processing, wherein at least two of the plurality of inspection units inspect the same type of the pattern simultaneously. A method for controlling a pattern inspection apparatus. 7. An optical system including a light source and a detector,
An image pickup device for a pattern inspection device, comprising: at least one of the light source and the detector, wherein the plurality of light sources or the detectors have different characteristics from each other. Imager.