JP2000334406A - Cleaning device for printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device for printed circuit boards wherein, in an automatic production line of printed circuit boards, both upper and rear surfaces of the printed circuit board fed from a printed circuit board feeder are cleaned at the same time and also, after required parts are mounted on the upper surface thereof, it is fed again, turned over is transferred to the next process without being applying stress to a packaging component. SOLUTION: In a cleaning device provided with a cleaning mechanism constituted of a set of upper and lower adhesive rollers 21 for being closely adhered to both upper and rear surfaces of a printed circuit board S horizontally fed to convey the board S and also sticking dust stuck on both surfaces of the board S to the surface thereof to remove it, when the board S is carried-in with parts being mounted on one surface thereof, the cleaning mechanism is retracted from a conveying route of the board S to pass the board S toward the next process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board cleaning apparatus used for removing dust adhering to the surface of a printed circuit board in an automatic manufacturing process.

[0002]

2. Description of the Related Art At present, in the printed circuit board manufacturing industry, in order to prevent the ozone layer destruction by freon,
There has been a demand for the elimination of Freon cleaning, which has conventionally been used for removing dirt on the substrate surface in the process of manufacturing a printed circuit board, and to adopt a dry type printed circuit board cleaning apparatus. This dry-type printed circuit board cleaning apparatus is, for example, denoted by a symbol B in FIG.
As shown by, it is installed to remove dust adhered to the front and back surfaces of the substrate supplied from the substrate supply device A, and when the substrate after cleaning is carried into the solder printing device C, the substrate is mounted by the same device. The cream solder is printed on the component mounting position on the upper surface, and after this printing is completed, the component is mounted on the portion where the cream solder is printed by the chip component mounting device D, and then the component mounted on the board by the reflow soldering device E Are soldered and positioned and fixed, and the mounting of components on the board is completed. Thereafter, the substrate having the components mounted thereon is transported to the substrate reversing device F, where the substrate is turned over and transported to the substrate supply device A again.

[0003]

The dry printed board cleaning apparatus B described above comprises a pair of upper and lower adhesive rollers which transport the substrate in close contact with the front and back surfaces of the substrate supplied in a horizontal state. Since a pair of upper and lower transfer rollers is provided to adhere to and remove dust adhering to each adhesive roller on the surface thereof, the components mounted on the upper surface are transferred to the substrate reversing device F. When it is turned over and supplied to the substrate supply device A, and is carried into the above-mentioned printed circuit board cleaning device B from the supply device A, the components mounted on the substrate may be compressed by the adhesive roller and may be stressed and damaged. There is. Therefore, when the above-mentioned printed board cleaning apparatus B is installed in the next process of the board supply apparatus A,
A transport device for bypassing the printed board cleaning device B and transporting it to the solder printing device C is required, and the installation of the transport device complicates the production line.

[0004]

SUMMARY OF THE INVENTION The main object of the present invention is to provide:
To cope with the above problem, a set of upper and lower units that transports the substrate in close contact with the upper and lower surfaces of the substrate supplied in a horizontal state, and removes dust adhering to the front and back surfaces of the substrate by adhering to the surface. In a cleaning device for a printed circuit board provided with a cleaning mechanism constituted by an adhesive roller, a retracting mechanism for retracting the cleaning mechanism from a transport path of the substrate when the substrate is loaded with components mounted on one side thereof, A printed circuit board provided with a transfer mechanism for transferring the substrate to the next step by mounting the substrate on its upper surface when the cleaning mechanism is retracted from the transport path of the substrate by the retract mechanism. Another object of the present invention is to provide a cleaning device.

Further, in order to solve the above-mentioned problem, the present invention provides a pair of upper and lower adhesive rollers for transporting the substrate in close contact with the upper and lower surfaces of the substrate supplied in a horizontal state, In a cleaning device for a printed circuit board provided with a cleaning mechanism composed of a pair of upper and lower transfer rollers that adhere and remove dust adhering to the adhesive roller on the surface thereof, the substrate has components mounted on one side thereof. A retracting mechanism for retracting the cleaning mechanism from the transport path of the substrate when loaded in a state, and mounting the substrate on its upper surface when the cleaning mechanism is retracted from the transport path of the substrate by the retracting mechanism. An object of the present invention is to provide a dry cleaning apparatus for a printed circuit board, comprising a transfer mechanism for transfer for transferring to a next step.

In practicing the present invention, the retracting mechanism includes a driving mechanism for moving a support frame around which the adhesive roller and the transfer roller of the cleaning mechanism are mounted, and the transport mechanism is disposed immediately below the cleaning mechanism. When the substrate mounted on the support frame is loaded with its components mounted on one side thereof and turned inside out, the substrate is mounted on the upper surface thereof, and the substrate is provided with a transport unit that transports the substrate toward the next process. It is desirable to configure. Preferably, the support frame is supported by a guide shaft movably supported on a base of the apparatus so as to be vertically movable, and the drive mechanism is preferably constituted by a fluid pressure cylinder vertically mounted on the base.

[0007]

Advantages of the printed circuit board cleaning apparatus according to the present invention.
Or, in the printed circuit board cleaning apparatus according to claim 2, when a board having components mounted thereon is carried in a state where the board is turned over by the board reversing apparatus F shown in FIG.
The retracting mechanism causes the cleaning mechanism to retreat from the transport path of the substrate, and the transport mechanism transports the substrate to the solder printing apparatus C in the next step in a state where the substrate is released from the adhesive roller of the cleaning mechanism. The board with the components mounted on one side without applying any stress to the components mounted on top is mounted on the solder printing apparatus C in the next process.
Can be transported. For this reason, if the printed board cleaning apparatus according to the present invention is adopted, an automatic printed circuit board production line can be installed with a simple configuration. Further, in the printed circuit board cleaning apparatus according to the third aspect, the support frame on which the adhesive roller and the transfer roller of the cleaning mechanism are mounted is moved upward to retract the adhesive roller and the transfer roller from the transport path of the substrate. Then, the substrate is transferred to the next step by the transfer means for transfer mounted on the support frame, so that the retreat mechanism and the transfer means can be provided with a simple structure.

[0008]

FIG. 2 shows a dry printed circuit board cleaning apparatus 10 according to the present invention, which is installed in the next process of the substrate supply apparatus A in the automatic printed circuit board production line shown in FIG.
1 shows the front of one embodiment. The dry printed circuit board cleaning apparatus 10 includes a support frame 14 which is vertically moved by an air cylinder 13 vertically mounted on a base 11, a pair of adhesive rollers 21 vertically supported on the support frame 14 by a horizontal axis. And a pair of upper and lower transfer rollers 22 that rotate in close contact with the upper and lower surfaces of each of the adhesive rollers 21.
The support frame 14 is guided and supported by two guide shafts 12 supported on the left and right sides of the base 11 so as to be movable in the vertical direction.

The adhesive rollers 21 are disposed in parallel with each other,
As shown in FIG. 3, both ends are rotatably mounted on a pair of left and right side wall plates 14a and 14b constituting the support frame 14, and the three upper adhesive rollers 21a are connected to the three lower adhesive rollers 21a. It is in close contact with the side adhesive roller 21b. The output shaft of an electric motor M mounted on one side of the support frame 14 is connected to the outer end of the support shaft of the adhesive roller 21b located at the center of the lower adhesive roller 21b. Drive gears Ga and Gb are fixed to one end of each support shaft of the upper adhesive roller 21a and the lower adhesive roller 21b so as to be integrally rotatable with each support shaft, and these drive gears Ga and Gb are meshed with each other. The upper adhesive roller 21a and the lower adhesive roller 21b are rotationally driven in directions opposite to each other by the driving force applied from the electric motor M.

The transfer roller 22 includes an upper adhesive roller 21a.
And two upper transfer rollers 22a, which are arranged in parallel with each other and are driven to rotate in close contact with the respective upper adhesive rollers 21a, and each lower adhesive roller 21b, which is arranged in parallel with the lower adhesive roller 21b.
Lower transfer rollers 22b that are rotated and driven in close contact with
It consists of. The upper transfer roller 22a and the lower transfer roller 22b are connected to the adhesive rollers 21a,
Similarly to 1b, both ends of each support shaft are rotatably and detachably mounted on side wall plates 14a and 14b of the support frame 14.

As shown in FIG. 1, a substrate S supplied from a substrate supply device A is placed on the upper and lower sides of a pair of the upper and lower adhesive rollers 21 and the transfer roller 22 as described above, and FIG. 3 shows a pair of right and left conveyor belts 31 which are fed between the pair of adhesive rollers 21 and carry out the substrate S after cleaning completed sent out from the same adhesive roller 21 toward the solder printing apparatus C in the next process. As described above, the support frame 14 is axially spaced from the front and rear portions of the support frame 14. A transport belt 32 for transport is provided immediately below the pair of upper and lower adhesive rollers 21 and the transfer roller 22, as shown in FIG.
4 is mounted on the front part and the rear part thereof so as to be axially separated from each other.

As shown in FIG. 3, a pair of right and left conveyor belts 31 provided at the front of the support frame 14 are connected to four pulleys 41 to 41 which are pivotally supported by side wall plates 14a located at the front of the support frame 14. Conveying belt 31a on the left side of the figure stretched over 44
And a transport belt 31b on the right side in the figure stretched over four pulleys 51 to 54 pivotally supported on a side wall plate 14a located at the front of the support frame 14. Similarly, a pair of right and left conveyor belts 3 provided at the rear of the support frame 14 is provided.
Reference numeral 1 denotes four pulleys 41 to 44 pivotally supported by the side wall plate 14b located at the rear part of the support frame 14 as shown in FIG.
Conveyor belt 31a and support frame 14 on the left
And a right conveyor belt 31b stretched over four pulleys 51 to 54 pivotally supported by the side wall plate 14b located at the rear of the vehicle.

As shown in FIG. 3, a transport belt 32 for transfer provided immediately below the pair of upper and lower adhesive rollers 21 and the transfer roller 22 at the front of the support frame 14 is provided at the front of the support frame 14. The two small-diameter pulleys 61 to 66 pivotally supported by the located side wall plate 14a and the large-diameter drive pulley 67 provided between the small-diameter pulleys 61 and 66 located below and are horizontally arranged. I have. Similarly, a transfer conveyor belt 32 provided immediately below the adhesive roller 21 and the transfer roller 22 at the rear of the support frame 14 is pivotally mounted on a side wall plate 14b located at the rear of the support frame 14 as shown in FIG. 6 supported
The two small-diameter pulleys 61 to 66 and the large-diameter drive pulley 67 corresponding to the large-diameter drive pulley are stretched and arranged horizontally.

As shown in FIG. 3, a pair of front and rear drive pulleys 67, 67 provided on the front and rear portions of the support frame 14, respectively, have both ends pivotally supported on the front and rear side wall plates 14a and 14c of the support frame 14. It is fixed to the drive shaft 71 at a position separated in the axial direction. A driven gear 72 fixed to the outer end of the drive shaft 71 is provided with a drive gear 73 supported on the side wall plate 14c.
And a pulley 74 fixed to the support shaft of the drive gear 73
Is connected to a pulley 76 fixed to the output shaft of the electric motor M by a belt 75. Further, the support frame 14
Left and right pulleys 41 and 5 disposed at the front and rear of the
Reference numeral 1 denotes a drive pulley 67 via a transport belt 32 for transfer.
The pulleys 63 and 64 are driven by timing belts 33 and 34, respectively.

In the substrate transfer apparatus described above, the upper surfaces of the pair of left and right transfer belts 31a and 31b disposed at the front and rear portions of the support frame 14
1b, the substrate S supplied from the substrate supply device A shown in FIG. 1 is horizontally supported on the conveyor belt 31a positioned in front and behind the support frame 14 at both side ends. The dust is fed between the upper and lower sets of adhesive rollers 21 and adheres to the surfaces of the upper adhesive roller 21a and the lower adhesive roller 21b after the dust attached to the front and back surfaces of the substrate S is removed. It is carried out by the belt 31b. Note that dust adhering to the adhesive rollers 21a and 21b adheres and accumulates on the transfer rollers 22a and 22b. For this reason, the transfer rollers 22a and 22b are removed in a timely manner, and the dust accumulated on the surfaces thereof is removed by the solvent.

In the apparatus for cleaning a printed circuit board according to the present invention configured as described above, the printed circuit board on which the required components are mounted on the automatic production line of the printed circuit board shown in FIG. When the support frame 14 is retracted upward by activating the air cylinder 13 when the substrate is supplied again from the substrate supply apparatus A in a state where the support frame 14 is turned upside down, the transfer conveyance disposed at the front and rear portions of the support frame 14 is performed. The belt 32 rises to a position corresponding to the pair of left and right transport belts 31a and 31b located above.
Thus, the upper surface of the transport belt 32 is
When the air cylinder 13 coincides with the upper surface of b, the air cylinder 13 is stopped and positioned and fixed. As a result, the printed board supplied from the board supply device A is transferred to the transport belt 3 for transfer.
2 and passes below the cleaning mechanism constituted by the adhesive roller 21 and the transfer roller 22, is transferred to the solder printing apparatus C in the next step, and required components are also mounted on the back surface of the printed circuit board S.

Therefore, if the apparatus for cleaning a printed circuit board according to the present invention is employed, it is possible to clean both the front and back surfaces of the board at the same time and mount the required components on both sides of the cleaned board without applying any stress. It is possible to install the automatic production line of printed circuit boards with a simple configuration without providing a detour path.

In the above embodiment, the present invention is applied to a pair of upper and lower adhesive rollers which transport the substrate in close contact with the upper and lower surfaces of a substrate supplied in a horizontal state, and The present invention is applied to a printed circuit board cleaning apparatus having a cleaning mechanism constituted by a pair of upper and lower transfer rollers for attaching and removing dust adhered to the surface of the roller. Without providing, the present invention can be applied to a printed circuit board cleaning apparatus in which the above-mentioned cleaning mechanism is constituted only by a pair of upper and lower adhesive rollers. In this case, dust accumulated on the adhesive roller may be removed by an appropriate means.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an automatic production line for printed circuit boards.

FIG. 2 is a front view of a printed circuit board cleaning apparatus according to the present invention.

FIG. 3 is a side view of the printed circuit board cleaning apparatus shown in FIG. 2;

[Explanation of symbols]

S: substrate, 21: adhesive roller, 22: transfer roller, 12
... a guide shaft, 13 ... an air cylinder, 14 ... a support frame, 31 ... a pair of right and left transport belts, 32 ... a transport belt for transfer.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 FA17 FA21 FA30 MA20 3B116 AA02 AB14 AB27 BC07 CD23 5E343 AA02 EE01 FF23

Claims (6)

[Claims] 1. A set of upper and lower adhesive rollers for transporting a substrate in close contact with upper and lower surfaces of a substrate supplied in a horizontal state, and removing dust adhering to both surfaces of the substrate by adhering to the surface thereof. And a retreat mechanism for retreating the cleaning mechanism from a transport path of the substrate when the substrate is carried in a state where components are mounted on one surface of the substrate, and the retreat mechanism. And a transfer mechanism for transferring the substrate to the next step by mounting the substrate on the upper surface thereof when the cleaning mechanism is retracted from the transfer path of the substrate. . 2. A pair of upper and lower adhesive rollers for transporting the substrate in close contact with the upper and lower surfaces of a substrate supplied in a horizontal state, and dust adhering to each of the adhesive rollers and adhering to the adhesive roller. In a printed circuit board cleaning apparatus provided with a cleaning mechanism composed of a pair of upper and lower transfer rollers for attaching to and removing from the surface, when the substrate is loaded with components mounted on one side thereof, the transfer path of the substrate is changed. A retracting mechanism for retracting the cleaning mechanism, and a transport mechanism for transporting the substrate on its upper surface and transporting the substrate to the next process when the cleaning mechanism is retracted from the transport path of the substrate by the retracting mechanism. A cleaning device for printed circuit boards, comprising: 3. A retraction mechanism comprising a drive mechanism for moving a support frame, on which an adhesive roller and a transfer roller of the cleaning mechanism are mounted, on the support frame, wherein the transport mechanism is mounted on the support frame immediately below the cleaning mechanism. 3. The printed circuit board cleaning device according to claim 2, further comprising a transporting means for mounting the component on one side thereof and loading the substrate onto the upper surface thereof and transporting the substrate toward the next step when the substrate is loaded. apparatus. 4. An apparatus for cleaning a printed circuit board, comprising a transport belt driven by an electric motor having the transport means according to claim 3 mounted on the support frame. 5. The fluid pressure as set forth in claim 3, wherein said support frame is supported by a guide shaft movably supported in a vertical direction on a base of said apparatus, and said drive mechanism is vertically mounted on said base. A cleaning device for printed circuit boards composed of cylinders. 6. The apparatus for cleaning a printed circuit board according to claim 5, wherein said fluid pressure cylinder is an air cylinder.