JP2000332868A - Mobile phone - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mobile phone in which leakage of a high frequency signal from a space containing a SIM holder is reduced by decreasing the contact resistance between a rear case and a board. SOLUTION: An opening is formed on a rear case 150 to expose a board 300, a rib 180a is provided in press contact with the board 300 and extended along the circumference of the opening to form a container space that is surrounded by the rib 180a and the board 300, and a SIM holder 200 is placed in the container space. A U-shaped notch 185 is formed on a part of the rib 180a adjacent to the SIM holder 200 and a leaf spring 400 providing electrical contact between the rib 180a and the board 300 is inserted to the notch 185.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable telephone device, and more particularly to a portable telephone device containing a SIM holder. The mobile phone device used for the GSM system standardized mainly in mobile communications in the European region is SI
M (Subscriber Identity Module)
It is operated in a state where a module called a mobile phone device which is detachable from the mobile phone device is mounted in the terminal device. This SIM
Is filled with an IMSI (International Mobile Station Identity: subscriber number), and a SIM without a valid IMSI cannot receive GSM service. In the SIM, network data such as a subscriber password, LAI (location area information) and service-related data such as billing information are written in order to prevent unauthorized use by others.

There are two types of SIMs, one is a card-sized one called ID-1SIM, and the other is smaller in size than ID-1SIM, 15 mm.
This is a plug-in SIM (P
LUG-IN SIM). GSM like this
In the portable telephone device for use, the terminal device itself does not operate unless the SIM is inserted into the device and mounted. All telephone numbers and other subscriber information are stored in the SIM. That is, if only the SIM is removed from the device and carried, the GSM service can be received by borrowing a GSM terminal device owned by another person and inserting this SIM.

FIG. 6 is a block diagram showing the configuration of a portable telephone device used in such a GSM system. An RF unit 20 coupled to the antenna 10, a DSP 30 for performing digital signal processing, a CPU 50, an RF unit 20,
A clock supply unit 40 for supplying a reference (reference) clock signal to the DSP 30 and the CPU 50;
0. RF unit 20, DSP30, C
The PU 50 and the clock supply unit 40 are mounted on a board (not shown) so as to be housed in the housing 100. An opening is provided in a part of the housing 100, and the SIM
200 is detachably mounted on the substrate. CPU50 and DS
The P30, the CPU 50 and the SIM 200 are connected by a bus to exchange signals. All operations are performed in synchronization with the clock signal from the reference clock supply unit 40, and these clocks are transmitted to the RF unit 20, the DSP 3
0, which is supplied to the CPU 50.

[0004] The DSP 30 processes a voice signal or a data signal, modulates the signal into an I / Q signal, and sends it to the RF unit 20 to transmit the signal to the antenna 1.
Transmit from 0. Normally, the reference clock is 13M
Hz, this is supplied to the DSP 30 and the CPU 50, and when the operation is performed, the harmonic noise 50 of the basic reference clock frequency of 13 MHz is generated by the DSP 30 and the CP 50.
Generated from U50. Although these harmonic noises 50 are blocked by the casing 100 and do not normally leak out, if they leak out of the opening provided in the casing 100 to mount the SIM 200, this 10 may be superimposed and transmitted, causing a communication error. Therefore, when installing the SIM 200, it is necessary to provide high-frequency insulation so that harmonic noise does not leak out of the housing 100 to the outside.

FIG. 4 is a view showing a conventional SIM mounting structure. Usually, an opening 170 is provided in a part of the rear case 150 from which the battery of the mobile phone device is removed, and the SIM mounted on the SIM holder 200 is mounted here. The SIM holder 200 is detachably attached to the substrate 300 exposed in the opening 170. Here, the SIM holder 2 shown in FIG.
Various types of structures of the opening 170 for mounting 00 are considered.

FIG. 5A shows a structure in which an opening is simply provided in the rear case 150. FIG.
(B) After the opening, the substrate 30 is formed along the periphery of the opening.
It has a structure in which ribs 180 extending on the four sides are provided so as to abut on the four sides, a storage area surrounded by the ribs 180 and the substrate 300 is formed, and the SIM holder 200 is mounted in the storage area. I have. FIG. 5 (c) shows the rib 1
A conductive rubber 190 or the like is applied to a gap between the substrate 80 and the substrate 300 to fill the gap.
It has a structure that keeps the contact resistance to low. That is, the ground region provided on the substrate 300 and the conductive rib 1
80 are adhered by a conductive rubber 190 to completely block leakage of high frequency noise from inside the housing.

[0007]

In the structure shown in FIG. 5A, a space a is formed between the substrate 300 and the rear case 150, and dust and impurities enter the inside of the housing from the space a. May adversely affect the components inside the housing. In addition, high-frequency noise as described with reference to FIG. 6 may leak to the outside via the space a and go around the antenna, thereby deteriorating the receiving sensitivity or emitting unnecessary spurious. In the structure shown in FIG. 5B, generation of dust and leakage of high-frequency noise can be reduced. However, if the contact between the rib 180 on the rear case 150 side and the substrate 300 is insufficient, the structure shown in FIG. Leakage of high frequency noise and spurious emission. FIG. 5 (c)
In the structure of the above, leakage of high frequency noise and spurious radiation can be prevented, but the conductive rubber 190 itself is expensive,
In addition, there is a problem that the cost for attaching the conductive rubber 190 to the rear case 150 also increases. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and is free from external dust and impurities, and can effectively prevent high frequency noise leakage and spurious radiation.
It is an object of the present invention to provide a mobile phone device in which is mounted.

[0008]

According to the present invention, in order to achieve the above object, an opening is provided in a rear case to expose a substrate, and a rib extending along the periphery of the opening so as to contact the substrate is provided. And a storage area surrounded by the rib and the substrate is formed, and a SIM holder is stored in the storage area. In the mobile phone device, a U-shaped cut is formed in a part of the rib adjacent to the SIM holder. A notch is provided, and a leaf spring for providing electrical contact between the substrate and the rib is provided in the notch. The leaf spring may be formed in a rectangular shape, one side of which is soldered to a ground area of the substrate, and the other side of which is in contact with a horizontal ridge of the notch. Further, the leaf spring is formed in a rectangular shape having a claw on one side, the claw is engaged with a horizontal ridge of the notch, and the other side is configured to abut on a ground area of the substrate. You can also.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of the present invention. A U-shaped notch 18 is formed in a part of the rib 180a having a structure as shown in FIG.
5 is provided, and a leaf spring 400 is interposed in the notch 185. That is, in a state where the substrate 300 is exposed from the opening provided in the rear case 150, the ribs 18 are arranged so as to contact the substrate 300 along the periphery of the opening.
0a extends.

Therefore, a storage area surrounded by the rib 180a and the substrate 300 is formed, and S
The IM holder 200 is detachably mounted. Rib 1
Notch 185 provided in a part of 80 a is provided in a part adjacent to SIM holder 200. And leaf spring 4
00 is inserted into this notch 185,
It is configured to make electrical contact between 80a and substrate 300.

FIG. 2 is a plan view of a part of the substrate 300 having the structure shown in FIG.
0 is mounted. The storage area for mounting the SIM holder 200 is surrounded by the ground area 310 on the substrate 300. The lower end of the rib 180a is configured to contact the ground area. And this rib 180a
The leaf spring 400 is inserted into a U-shaped notch 185 provided in the
Is installed, but one end of the leaf spring 400 is connected to the ground area 310.
Is bonded by a method such as soldering.

The leaf spring 400 is formed in a rectangular shape, and one end is soldered to the ground region 310. Therefore, the other end of the leaf spring 400 comes into contact with the horizontal ridge of the notch 185 as a spring. Usually, since the rib 180a is formed of a conductive member, the metal plate spring 400 makes electrical contact between the rib 180a and the ground region 310 of the substrate 300. Therefore, since the storage area of the SIM holder 200 is surrounded by the rib 180a and is completely shielded from the inside of the housing, high-frequency noise does not leak out. If the notch 185 is formed too large, it is shielded in terms of high frequency and there is no leakage of high frequency noise. It is desirable to do.

3 (a), 3 (b) and 3 (c) are diagrams showing another embodiment of the present invention, in which one end of a leaf spring 400a formed in a V-shape is formed on a ridge line of a notch 185. It is configured so as to be engaged, and the other end is in contact with the ground area of the substrate 300. FIGS. 3B and 3C are views showing the details of the attachment of the leaf spring 400a and the rib 180a to the notch 185 used in this embodiment.

In the present embodiment, a pawl 450 is formed on one side of the leaf spring 400a, and this pawl 450 engages with a horizontal ridgeline 186 of the notch 185. That is, the ridge line 186 is attached so as to be sandwiched from both sides by the claws 450. Thereby, the leaf spring 400
a and the rib 180a make an electrical contact. The lower end of the leaf spring 400a is a free end, and the free end abuts on the ground region 310 formed on the substrate 300, whereby the rib 180a and the substrate 300 are electrically connected via the leaf spring 400a. Thus, a high-frequency shield structure is completed. In this embodiment, the notch 1
It is preferable that the size of 85 is set to a minimum necessary size and not formed so large.

[0015]

As described above in detail based on the embodiment, in the present invention, a U-shaped notch is provided in a part of a rib forming a storage area for mounting a SIM holder, and Since a leaf spring for making electrical contact between the rear case and the substrate is interposed, the contact resistance between the rear case and the substrate is reduced and the shielding effect is higher than a case where a rib is simply provided to surround the SIM holder. Also, by minimizing the cross-sectional area of the notch, it is possible to reduce the deterioration of the receiving sensitivity due to the internal noise sneaking into the antenna,
In addition, unnecessary spurious radiation can be reduced. Further, since the leaf spring is a surface mount component, there is an advantage that the mounting cost is low.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a detailed configuration of FIG. 1;

FIG. 3 is a configuration diagram showing a second embodiment of the present invention.

FIG. 4 is a diagram showing a conventional configuration.

FIG. 5 is a diagram showing a detailed configuration of FIG. 4;

FIG. 6 is a block diagram showing a configuration of a GSM mobile phone device.

[Explanation of symbols]

 150: rear case 180, 180a: rib 185: notch 186: ridge 400, 400a: leaf spring 450: claw 300: board 310: grounding area of board

Claims (3)

[Claims] An opening is provided in a rear case to expose a substrate, and a rib extending along the periphery of the opening so as to contact the substrate is provided, and a storage area surrounded by the rib and the substrate is provided. In the mobile phone device formed and containing a SIM holder in the storage area, a U-shaped notch is provided in a part of the rib adjacent to the SIM holder, and the notch is formed between the substrate and the rib. A mobile phone device comprising a leaf spring for providing electrical contact. 2. The mobile phone device according to claim 1, wherein the leaf spring is formed in a rectangular shape, one side of which is soldered to a ground area of the substrate, and the other side of which is in a horizontal ridge line of the notch. A mobile phone device which is in contact with the mobile phone device. 3. The mobile phone device according to claim 1, wherein the leaf spring is formed in a rectangular shape having a claw on one side, and the claw is engaged with a horizontal ridge line of the notch, and the other side has a claw. A mobile phone device contacting a ground area of the substrate.